Curved transparent piece cutting method, electronic device, laser cutting device, and medium

Abstract

The application discloses a curved surface transparent piece cutting method, an electronic device, a laser cutting device and a medium. The curved surface transparent piece cutting method is applied to a laser cutting machine. The laser cutting machine comprises a laser emission assembly and a driving device. The curved surface transparent piece cutting method comprises the following steps: the laser cutting device comprises the laser emission assembly and the driving device; the laser emission assembly is controlled to be turned on, so that the laser emission assembly generates focused laser which irradiates the curved surface transparent piece along a first axis; driving parameters of the driving device are determined according to parameters of the curved surface transparent piece and cutting requirements; and the driving device is controlled to drive the curved surface transparent piece to move along at least a second axis, a third axis and a fourth axis according to the predetermined driving parameters, wherein the first axis, the second axis and the third axis are perpendicular to each other, and the fourth axis is a rotation axis with the second axis as an axial direction. The application can realize the effect of guaranteeing the best incident range in the laser cutting process of the curved surface transparent piece.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, and particularly to methods for cutting curved transparent parts, electronic devices, laser cutting equipment, and media. Background Technology

[0002] With the development of laser technology, laser cutting has been widely used in various industries. In the glass cutting industry, practical laser cutting has become an industry trend. In particular, ultrafast lasers, due to their short pulse width and high peak power, can be used to shape the laser beam before cutting through the glass and then cleaving the glass to obtain high-quality edge effects.

[0003] However, laser cutting requires more than just cutting within the focal length range to achieve the required quality. It also necessitates ensuring the laser beam is within the optimal incident range when it strikes the glass surface, significantly increasing the cost of the laser. Furthermore, the curved surface of a curved transparent component causes the incident light to not be incident along the normal direction. Additionally, the asymmetry of incident light rays outside the incident center prevents the beam from effectively focusing inside the glass, resulting in poor laser cutting performance.

[0004] Therefore, there is an urgent need for a method that can effectively solve the problem of not being able to guarantee the optimal incident range in laser cutting of curved transparent parts. Summary of the Invention

[0005] The main objective of this invention is to provide a method for cutting curved transparent parts, an electronic device, a laser cutting device, and a medium, aiming to solve the problem that the optimal incident range cannot be guaranteed during the laser cutting process of curved transparent parts.

[0006] To achieve the above objectives, this invention proposes a method for cutting curved transparent parts. This method is applied to a laser cutting device, which includes a laser emitting assembly and a driving device. The method for cutting curved transparent parts includes: The laser emitting component is turned on, so that the laser emitting component generates a focused laser that irradiates the curved transparent part along the first axis; Based on the parameters and cutting requirements of the curved transparent part, determine the driving parameters of the driving device; According to predetermined driving parameters, the driving device is controlled to drive the curved transparent part to move at least along the second axis, the third axis and the fourth axis, wherein the first axis, the second axis and the third axis are perpendicular to each other, and the fourth axis is a rotation axis with the second axis as the axis.

[0007] In some embodiments, the step of determining the driving parameters of the driving device based on the parameters of the curved transparent part and the cutting requirements includes: Based on the parameters and cutting requirements of the curved transparent part, determine the starting point and ending point of the curved transparent part, as well as each cutting point on the motion path from the starting point to the ending point; Obtain the spatial position of the starting point and the spatial position of the cutting point on the movement path, and determine the spatial position difference between all adjacent points; The driving parameters of the driving device are determined based on the spatial position difference.

[0008] In some embodiments, the step of controlling the driving device to drive the curved transparent component to move at least along the second axis, the third axis, and the fourth axis includes: The driving device is controlled to drive the curved transparent component to move along the second axis, the third axis, the fourth axis and the fifth axis, wherein the fifth axis is a rotation axis with the third axis as the axis.

[0009] In some embodiments, the step of controlling the driving device to drive the curved transparent component to move at least along the second axis, the third axis, and the fourth axis further includes: The driving device is controlled to drive the curved transparent component to move along the second axis and rotate around the second axis, and the driving device is controlled to drive the curved transparent component to move along the third axis and rotate around the third axis.

[0010] In some embodiments, the step of determining the driving parameters of the driving device based on the parameters of the curved transparent part and the cutting requirements further includes: According to predetermined driving parameters, the driving device is controlled to drive the laser emitting assembly to move along the first axis.

[0011] The present invention further proposes an electronic device, the electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the computer program is executed by the processor, it implements the steps of the curved transparent part cutting method as described in any of the above technical solutions.

[0012] The present invention further proposes a laser cutting device, including a laser emitting component, a clamping component, a driving device, and an electronic device as described in the above technical solution. The electronic device is communicatively connected to the laser emitting component and the driving device. The laser emitting component is used to emit laser light. The clamping component is configured corresponding to the focusing component and is used to fix the curved transparent part. The driving device is connected to the clamping component and is used to drive the clamping component to move and rotate.

[0013] In some embodiments, the laser cutting equipment further includes a focusing component disposed between the laser emitting component and the clamping component, the focusing component being used to adjust the focal length of the laser.

[0014] In some embodiments, the laser emitting assembly includes a laser, a beam expander, and a reflector. The laser emits laser light to form a first emitted light. The beam expander is disposed along the emission direction of the first optical path and is used to expand and amplify the first emitted light to obtain expanded light. The reflector is disposed between the expanded light and the focusing assembly and is used to adjust the path of the expanded light.

[0015] The present invention further proposes a storage medium storing a computer program, which, when executed by a processor, implements the steps of the curved transparent part cutting method as described in any of the above technical solutions.

[0016] This invention provides a method, apparatus, and storage medium for cutting curved transparent parts. It is understood that this invention is applicable to glass and other curved transparent materials. By employing a four-axis movable clamping assembly, this invention ensures that the normal of the curved surface of the transparent part always coincides with the incident angle of the cutting laser. Furthermore, by using a focusing assembly with a first axis (z-axis) adjustment, the transparent part is always cut by the laser within the effective incident area of ​​the laser focal point. In other words, this invention uses a differential compensation system composed of five movable axes to ensure that the focal length does not need to be excessively increased to meet the cutting requirements during laser cutting, thus ensuring the optimal incident range and improving the cutting quality. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating the first embodiment of the method for cutting curved transparent parts according to the present invention; Figure 2 This is a flowchart illustrating the second embodiment of the method for cutting curved transparent parts according to the present invention; Figure 3 This is a flowchart illustrating the third embodiment of the method for cutting curved transparent parts according to the present invention; Figure 4 This is a flowchart illustrating the fourth embodiment of the method for cutting curved transparent parts according to the present invention; Figure 5 This is a schematic diagram of the curved transparent component along the second axis in one embodiment of the present invention; Figure 6 This is a schematic diagram of the curved transparent component along the third axis in one embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the electronic device according to an embodiment of the present invention.

[0018] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0021] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0022] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0023] This invention proposes a method for cutting curved transparent parts. This method is applied to laser cutting equipment, which includes a laser emitting assembly and a driving device. The curved transparent part can be curved glass, curved resin, or other transparent materials.

[0024] Specifically, in one embodiment of the present invention, the laser cutting equipment further includes a clamping assembly, which is fixed to the curved transparent part and connected to a driving device. The driving device drives the clamping assembly to move and / or rotate along the second axis, the third axis, the fourth axis and the fifth axis.

[0025] Reference Figure 1 In this embodiment, the method for cutting curved transparent parts includes: Step S10: Control the laser emitting component to turn on, so that the laser emitting component generates a focused laser to irradiate the curved transparent part along the first axis; In detail, the operator obtains the shape information of the curved transparent part and the cutting path to be cut in advance, then fixes the curved transparent part on the clamping assembly, moves the clamping assembly directly below the laser emitting assembly, and turns on the power of the laser emitting assembly to start the laser emitting assembly.

[0026] Step S20: Determine the driving parameters of the driving device based on the parameters of the curved transparent part and the cutting requirements; Reference Figure 2 In some embodiments, the following step is included after step S20: Step S21: Based on the parameters and cutting requirements of the curved transparent part, determine the starting point and ending point of the curved transparent part, as well as each cutting point on the motion path from the starting point to the ending point. Step S22: Obtain the spatial position of the starting point and the spatial position of the cutting point on the motion path, and determine the spatial position difference between all adjacent points; Step S23: Determine the driving parameters of the driving device based on the spatial position difference.

[0027] Among them, reference Figure 3 Step S23 further includes the following steps: Step S23a: Determine the first motion path of the drive device along the second and third axes based on the planar position difference between two adjacent cutting points; Step S23b: Determine the second motion path of the drive device along the fourth and fifth axes based on the first axis position difference between two adjacent cutting points; Step S23c: Determine the third motion path of the laser emitting component along the first axis based on the first axis position difference between two adjacent cutting points; Step S23d: Based on the thickness of the curved transparent part, determine the dwell time of the laser emitting component at a cutting point and the moving speed to the next cutting point.

[0028] Among them, the motion relationship of the driving device determined according to the spatial position difference includes the moving speed of the driving device along the second and third axes, the rotation speed along the fourth and fifth axes, and the rotation angle can be determined based on the rotation speed and rotation time along the fourth and fifth axes.

[0029] In some embodiments, refer to Figure 2 After step S20, the following steps are also included: Step S24: Control the laser emitting component to move along the first axis according to the predetermined motion parameters.

[0030] Specifically, it is understood that the thickness of curved transparent parts varies depending on the production requirements. Therefore, the laser cutting equipment needs to reserve sufficient space for laser cutting. During the laser cutting process, in order to avoid excessive or insufficient cutting energy, the distance between the laser emitting component and the curved transparent part needs to be adjusted according to the thickness of the curved transparent part. Therefore, the laser emitting component needs to move up and down along the first axis (z-axis). In this embodiment, the laser cutting equipment also includes a first axis driving device, which is connected to the laser emitting component. The first axis driving device drives the laser emitting component to move up and down along the first axis.

[0031] In this embodiment, the driving device determines the position difference on the horizontal plane between the two cutting points based on the obtained thickness and shape information of the curved transparent part, determines the displacement distance that the driving device needs to make along the second and third axes, and determines the rotation angle and rotation rate along the fourth and fifth axes based on the position difference of the first axis between the two adjacent cutting points and the curved shape of the curved transparent part. Finally, the distance between the laser emitting component and the curved transparent part is determined based on the thickness of the curved transparent part.

[0032] In this embodiment, refer to Figure 5 and Figure 6 The laser emitting component is positioned directly above the curved transparent part, and the laser emitting component has a moving component that allows the laser emitting component to move up and down along the first axis (z-axis) to adjust the distance between the laser emission port of the laser emitting component and the curved transparent part. By adjusting the distance between the laser emitting component and the curved transparent part, the focal length of the laser can be moved away from or closer to the curved transparent part, so as to make adaptive adjustments for curved transparent parts of different thicknesses or different thicknesses of the same curved transparent part, avoiding incomplete cutting due to insufficient laser energy or energy waste caused by excessive laser energy during cutting.

[0033] The kinematic equations of the drive device during laser engraving can be: Assuming the curvature of the curved transparent part is The arc length of the curve to be cut is The distance that the drive device moves the clamp assembly along the second axis is given by the following relationship: The angle of rotation of the fifth axis is The real-time coordinates of the second axis relative to the defined origin are: The relationship between the rotation angle of the fifth axis and the origin as the coordinates of the second axis change is as follows: Assuming the curvature of the transparent curved part The arc length of the curve to be cut is The distance that the drive unit moves the clamp assembly along the third axis is: The angle of rotation of the fourth axis is The real-time coordinates of the third axis relative to the defined origin are: The relationship between the rotation angle of the fourth axis and the origin as the coordinates of the third axis change is as follows: The coordinate relationship of the z-axis as it moves along the second, third, fourth, and fifth axes is as follows: Among them, the above This is the correlation coefficient, and the specific value is determined based on actual production needs.

[0034] In some embodiments, step S30 involves controlling the driving device to drive the curved transparent component to move at least along the second axis, the third axis, and the fourth axis according to predetermined driving parameters. Among them, the first axis, the second axis, and the third axis are perpendicular to each other, and the fourth axis is a rotation axis with the second axis as its axis; In some embodiments, refer to Figure 4 Step S30 further includes the following steps: Step S31: Control the drive device to drive the curved transparent part to move along the second axis, the third axis, the fourth axis and the fifth axis, wherein the fifth axis is a rotation axis with the third axis as the axis.

[0035] Step S32: Control the driving device to drive the curved transparent component to move along the second axis and rotate around the second axis at the same time, and control the driving device to drive the curved transparent component to move along the third axis and rotate around the third axis at the same time.

[0036] In some embodiments, when the curved transparent part is a spherical curved surface, the drive device needs to rotate along two axes, the fourth axis and the fifth axis, to rotate. When the curved transparent part is a cylindrical curved surface, it only needs to rotate along one of the fourth axis or the fifth axis.

[0037] The dwell time of the laser emitting component at a point can be determined based on the thickness of the curved transparent part. This dwell time is the time for the laser emitting component to emit laser light. By determining the shortest dwell time between two adjacent cutting points, the required operating speed of the drive device when the laser emitting component cuts along the cutting path can be determined. Determining the operating speed can avoid energy waste.

[0038] In summary, this invention provides a method for cutting curved transparent parts. It is understood that this invention is applicable to glass and other curved transparent materials. By employing a four-axis movable clamping assembly, this invention ensures that the normal of the curved surface of the transparent part always coincides with the incident angle of the cutting laser. Furthermore, by using a focusing assembly with z-axis adjustment, the transparent part is always cut by the laser within the effective incident area of ​​the laser focal point. In other words, this invention uses a differential compensation system composed of five movable axes to ensure that the focal length does not need to be excessively increased to meet the cutting requirements during laser cutting, thereby reducing energy consumption, lowering production costs, and improving cutting quality.

[0039] The present invention also proposes an electronic device, see reference. Figure 7 , Figure 7 This is a schematic diagram of the structure of an electronic device in the hardware operating environment involved in the embodiments of the present invention.

[0040] The electronic device in this embodiment of the invention can be a desktop computer, laptop, handheld computer, server, or other computing device. Figure 7 As shown, the electronic device may include: a processor 1001 (e.g., a CPU), a network interface 1004, a user interface 1003, a memory 1005, and a communication bus 1002. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen and an input unit, such as a keyboard; optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wi-Fi interface). The memory 1005 may be high-speed RAM or non-volatile memory, such as a disk drive. Optionally, the memory 1005 may also be a storage device independent of the aforementioned processor 1001.

[0041] Those skilled in the art will understand that Figure 7 The electronic device structure shown does not constitute a limitation on the electronic device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0042] like Figure 7 As shown, the memory 1005, which serves as a computer storage medium, may include an operating system, a network communication module, a user interface module, and computer programs.

[0043] exist Figure 7In the electronic device shown, the network interface 1004 is mainly used to connect to the backend server and communicate with the backend server; the user interface 1003 is mainly used to connect to the client (user terminal) and communicate with the client; and the processor 1001 can be used to call the computer program stored in the memory 1005. When the computer program is called and executed by the processor 1001, it implements the steps of the above-mentioned curved transparent part cutting method.

[0044] Based on the computer program proposed in the foregoing embodiments, the present invention also proposes a storage medium storing a computer program, which, when executed by a controller, implements the curved transparent part cutting method described in the foregoing embodiments.

[0045] The present invention further proposes a laser cutting device, including a laser emitting component, a clamping component, a driving device, and an electronic device as described above. The electronic device is communicatively connected to the laser emitting component and the driving device. The laser emitting component is used to emit laser light. The clamping component is configured to correspond to the laser emitting component and is used to fix the curved transparent part. The driving device is connected to the clamping component and is used to drive the clamping component to move and rotate.

[0046] In some embodiments, the laser cutting equipment further includes a focusing component disposed between the laser emitting component and the fixture component, the focusing component being used to adjust the focal length of the laser.

[0047] In some embodiments, the laser cutting equipment further includes a sensor disposed on the focusing assembly, the sensor being used to sense the positional relationship between the focusing assembly and the curved transparent part, as well as the thickness of the curved transparent part, and to transmit the positional relationship to the clamping assembly and the focusing assembly.

[0048] In some embodiments, the sensor is an infrared sensor, which is positioned at the distance between the cutting device and the curved transparent part and at the thickness of the curved transparent part. The infrared sensor performs infrared ranging in the direction of the curved transparent part and sends the distance information to the focusing component and the clamping component, so that the focusing component can be displaced along the z-axis to adjust the focal length and / or the clamping component can be displaced along the second axis, the third axis, the fourth axis, and the fifth axis to adjust the angle between the curved surface normal of the curved transparent part and the laser irradiation.

[0049] In some embodiments, the laser emitting assembly includes a laser, a beam expander, and a reflector. The laser emits a laser beam to form a first emitted light. The beam expander is disposed along the emission direction of the first emitted light and is used to expand and amplify the first emitted light to obtain expanded light. The reflector is disposed between the expanded light and the focusing assembly and is used to adjust the path of the expanded light.

[0050] In some embodiments, the laser is an ultrafast laser with a pulse width range of 100 fs to 100 ps and a wavelength range of 300 nm to 1500 nm.

[0051] Ultrafast lasers refer to mode-locked lasers that emit ultrashort pulses, such as pulses with durations of femtoseconds or picoseconds. A more accurate term would be ultrashort pulse lasers.

[0052] In this embodiment, the pulse width of the laser is between 100fs and 100ps, where fs (femto second) is femtosecond and picosecond (picosecond) is picosecond, and the wavelength of the laser is between 300nm and 1500nm.

[0053] In other embodiments, the pulse width and wavelength range of the laser can be adaptively adjusted according to the different materials used in the application.

[0054] Specifically, in this embodiment, a beam expander is disposed between the laser and the focusing component. The laser beam enters the beam expander along the first optical path. The beam expander increases the diameter of the laser beam and changes its divergence angle, making the laser beam a parallel beam. A reflector is disposed between the beam expander and the focusing component. The number of reflectors can be adjusted according to actual production needs. The reflector is used to change the path of the laser beam. The optical path between the beam expander and the reflector is the beam expanding optical path, and the optical path between the reflector and the focusing component is the reflection optical path. The laser beam enters the focusing component along the reflection optical path. By adjusting the focusing component, the focal length of the laser beam is placed within the optimal incident range of the upper surface of the curved transparent component. The optical path between the focusing component and the curved transparent component is the second optical path.

[0055] Specifically, in this embodiment, the beam expander is disposed on the first outgoing optical path. In actual production, the laser beam emitted by the laser has a certain divergence angle. It is necessary to use the beam expander to make the laser beam collimated (parallel) so that a small high-power density light spot can be obtained by focusing. The reflector is disposed between the diffuser and the focusing component. The reflector can reflect the laser beam in a mirror manner. The number of reflectors can be set according to the actual production needs. Through reflection between multiple reflectors and forming a complete optical path with the focusing component, the reflector can reduce the space occupied by the cutting device.

[0056] More specifically, the focusing components can be used in long focal depth focusing systems such as Bessel focusing, diffraction multifocal focusing, and laser filamentation.

[0057] The electronic device, laser cutting device, and storage medium of the present invention can all implement the steps of the above-described curved transparent part cutting method, and therefore have at least all the beneficial effects brought about by the technical solutions of the above-described curved transparent part cutting method embodiments, which will not be repeated here.

[0058] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, or indirect coupling or communication connection between devices or modules, and may be electrical, mechanical, or other forms.

[0059] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network modules. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0060] Furthermore, the functional modules in the various embodiments of the present invention can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The integrated modules described above can be implemented in hardware or as software functional modules.

[0061] If the integrated module is implemented as a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0062] Without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples.

[0063] The above description is only a part or preferred embodiment of the present invention. Neither the text nor the drawings should limit the scope of protection of the present invention. All equivalent structural transformations made using the content of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A method for cutting curved transparent parts, applied to laser cutting equipment, characterized in that, The laser cutting equipment includes a laser emitting assembly and a driving device. The laser emitting assembly includes a laser, a beam expander, and a reflector. The laser is used to emit laser light to form a first emitted light. The laser is an ultrafast laser with a pulse width range of 100 fs to 100 ps and a wavelength range of 300 nm to 1500 nm. The beam expander is positioned along the emission direction of the first emitted light and is used to expand and amplify the first emitted light to obtain expanded beam light. The reflector is disposed between the beam expander and the focusing component, and the reflector is used to adjust the path of the beam expander. The method for cutting the curved transparent part includes: The laser emitting component is turned on, so that the laser emitting component generates a focused laser that irradiates the curved transparent part along the first axis; Based on the parameters and cutting requirements of the curved transparent part, determine the driving parameters of the driving device; According to predetermined driving parameters, the driving device is controlled to drive the curved transparent part to move at least along the second axis, the third axis and the fourth axis, wherein the first axis, the second axis and the third axis are perpendicular to each other, and the fourth axis is a rotation axis with the second axis as the axis. The step of determining the driving parameters of the driving device based on the parameters and cutting requirements of the curved transparent part includes: Based on the parameters and cutting requirements of the curved transparent part, determine the starting point and ending point of the curved transparent part, as well as each cutting point on the motion path from the starting point to the ending point; Obtain the spatial position of the starting point and the spatial position of the cutting point on the movement path, and determine the spatial position difference between all adjacent points; The driving parameters of the driving device are determined based on the spatial position difference. The step of determining the driving parameters of the driving device based on the spatial position difference includes: determining a first motion path of the driving device along the second and third axes based on the planar position difference between two adjacent cutting points; determining a second motion path of the driving device along the fourth and fifth axes based on the first axis position difference between two adjacent cutting points, wherein the fifth axis is a rotation axis with the third axis as its axis; determining a third motion path of the laser emitting component along the first axis based on the first axis position difference between two adjacent cutting points; and determining the dwell time of the laser emitting component at a cutting point and the moving speed to the next cutting point based on the thickness of the curved transparent part.

2. The method for cutting curved transparent parts according to claim 1, characterized in that, The step of controlling the driving device to drive the curved transparent component to move at least along the second axis, the third axis, and the fourth axis includes: The drive device is controlled to drive the curved transparent component to move along the second axis, the third axis, the fourth axis, and the fifth axis.

3. The method for cutting curved transparent parts according to claim 2, characterized in that, The step of controlling the driving device to drive the curved transparent component to move along the second axis, the third axis, the fourth axis, and the fifth axis includes: The driving device is controlled to drive the curved transparent component to move along the second axis and rotate around the second axis, and the driving device is controlled to drive the curved transparent component to move along the third axis and rotate around the third axis.

4. The method for cutting curved transparent parts according to claim 1, characterized in that, After determining the driving parameters of the driving device based on the parameters and cutting requirements of the curved transparent part, the method further includes: According to predetermined driving parameters, the driving device is controlled to drive the laser emitting assembly to move along the first axis.

5. An electronic device, characterized in that, The electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the method for cutting curved transparent parts as described in any one of claims 1 to 4.

6. A laser cutting device, characterized in that, The device includes a laser emitting assembly, a clamping assembly, a driving device, and the electronic device as described in claim 5. The electronic device is communicatively connected to the laser emitting assembly and the driving device. The laser emitting assembly is used to emit laser light. The clamping assembly is configured to fix the curved transparent part. The driving device is connected to the clamping assembly and is used to drive the clamping assembly to move and rotate.

7. The laser cutting equipment according to claim 6, characterized in that, The laser cutting equipment also includes a focusing component, which is disposed between the laser emitting component and the clamping component, and is used to adjust the focal length of the laser.

8. The laser cutting equipment according to claim 7, characterized in that, The laser emitting assembly includes a laser, a beam expander, and a reflector. The laser emits a laser beam to form a first emitted beam. The beam expander is positioned along the emission direction of the first emitted beam and is used to expand and amplify the first emitted beam to obtain expanded beam light. The reflector is positioned between the expanded beam light and the focusing assembly and is used to adjust the path of the expanded beam light.

9. A storage medium, characterized in that, The storage medium stores a computer program, which, when executed by a processor, implements the steps of the method for cutting curved transparent parts as described in any one of claims 1 to 4.

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