Wafer polishing assembly, device and method

Abstract

The present application relates to the field of wafer polishing technology, and specifically discloses a wafer polishing assembly, equipment, and method. The wafer polishing assembly includes: a tooling mechanism, a grinding shaft mechanism, and a flipping mechanism. The tooling mechanism includes: a clamp and a tooling driver. The clamp is used to clamp the wafer. The tooling driver is used to drive the clamp to move. The grinding shaft mechanism includes: a grinding shaft and a grinding shaft driver. The grinding shaft driver is used to drive the grinding shaft to move. The flipping mechanism is used for the wafer. The tooling mechanism can clamp the wafer and drive the wafer to slide. The flipping mechanism can flip the wafer to adjust the polishing surface of the wafer. The cooperation of the tooling mechanism, the grinding mechanism, and the flipping mechanism can automatically complete the polishing of the end edge of the wafer. Compared with the method in which the staff holds the wafer by hand, the method can effectively improve work efficiency and ensure the consistency of polishing of different wafers, effectively solving the problem of poor polishing consistency and low production efficiency of the existing wafer edge grinding method.

Description

Technical Field

[0001] The present application relates to the field of wafer polishing technology, and in particular to a wafer polishing component and method. Background Art

[0002] When processing square semiconductor wafers, the edges of the wafers need to be polished. Existing methods for polishing wafers typically involve workers hand-grinding the wafers. This method is prone to variations in polishing results between wafers due to operator deviations, and it also cannot be performed in batches, resulting in low production efficiency. Summary of the Invention

[0003] In view of this, the purpose of the present application is to provide a wafer grinding assembly, equipment and method for solving the problems of poor grinding consistency and low production efficiency of existing wafer edge grinding methods.

[0004] To achieve the above technical objectives, the present application provides a wafer grinding assembly in a first aspect, comprising: a tooling mechanism, a grinding shaft mechanism, and a flipping mechanism;

[0005] The tooling mechanism includes: a horizontal module, a fixture and a tooling drive component;

[0006] The horizontal module is provided with: loading and unloading stations, a first end surface station, a second end surface station and a flipping station;

[0007] The clamp is used to clamp the wafer and is arranged on the horizontal module;

[0008] The tool drive is connected to the fixture and is used to drive the fixture to switch positions among the loading and unloading station, the first end surface station, the second end surface station and the flipping station;

[0009] The shaft grinding mechanism includes: a linear module, a shaft grinding and a shaft grinding drive member;

[0010] The linear module is provided with: an avoidance station and a grinding station;

[0011] The grinding shaft is arranged on the linear module;

[0012] The grinding shaft driving member is connected to the grinding shaft and is used to drive the grinding shaft to switch between the avoidance station and the grinding station;

[0013] The grinding station is arranged between the first end surface station and the second end surface station, so that the grinding spindle located at the grinding station can grind the wafer on the first end surface station or the wafer on the second end surface station;

[0014] The flipping mechanism is arranged beside the flipping station and is used for flipping the wafer located at the flipping station.

[0015] Furthermore, the linear module is arranged vertically;

[0016] The clamp is slidably arranged on the horizontal module along the horizontal direction;

[0017] The grinding shaft is slidably arranged on the linear module along the vertical direction;

[0018] The avoidance station is located above the grinding station.

[0019] Furthermore, the flip mechanism includes: an adsorption member and a flip motor;

[0020] The adsorbent is used to adsorb the wafer;

[0021] The flip motor is in driving connection with the adsorption member and is used for driving the adsorption member to rotate along a horizontal plane by a preset angle.

[0022] Furthermore, the flipping mechanism further comprises: a lifting cylinder and a support platform;

[0023] The adsorption member and the flip motor are both arranged on the support platform;

[0024] The output end of the lifting cylinder is connected to the support platform and is used to drive the support platform to move up and down.

[0025] Furthermore, it also includes a cooling mechanism;

[0026] The cooling mechanism includes: a grinding fluid spray pipe;

[0027] The grinding fluid spray pipe is arranged beside the grinding shaft and is used for spraying grinding fluid onto the grinding shaft.

[0028] Furthermore, the cooling mechanism further comprises: a grinding fluid collection pipe and a centrifugal filter;

[0029] The liquid inlet end of the grinding fluid collecting pipe is arranged below the grinding shaft and is used to collect the sprayed grinding fluid;

[0030] The centrifugal filter is connected to the liquid outlet end of the grinding fluid collecting pipe.

[0031] Furthermore, the horizontal module, the linear module and the flip mechanism are all provided with waterproof covers.

[0032] Furthermore, it also includes: a dust removal pipe;

[0033] The dust removal pipe is arranged beside the grinding shaft and is used to absorb dust generated during the grinding process.

[0034] A second aspect of the present application provides a wafer polishing device, comprising: a frame, an electric control component, and the wafer polishing component described in any one of the above items;

[0035] The electronic control component and the wafer polishing component are both arranged on the frame;

[0036] The electric control component is electrically connected to the tooling driving component, the grinding shaft driving component and the turning mechanism in the wafer grinding component.

[0037] A third aspect of the present application provides a wafer polishing method, which is applied to the wafer polishing assembly described in any one of the above items;

[0038] The method comprises the following steps:

[0039] S1, clamping the wafer by a fixture;

[0040] S2, controlling the fixture to move to the first end surface station;

[0041] S3, moving the grinding shaft to the grinding station to grind an end edge to be polished on the top surface of the wafer, and moving the grinding shaft to the avoidance station after the grinding is completed;

[0042] S4, controlling the fixture to move to the second end surface station;

[0043] S5, grinding the other end edge to be ground of the top surface of the wafer by a grinding spindle located at a grinding station;

[0044] S6, controlling the fixture to move to the flipping station, and flipping the wafer horizontally at a preset angle through the flipping mechanism;

[0045] S7, repeating steps S2 to S6 until the eight edges to be polished of the wafer are polished.

[0046] As can be seen from the above technical solutions, the present application provides a wafer grinding assembly, equipment and method, which includes: a tooling mechanism, a grinding shaft mechanism and a flipping mechanism; the tooling mechanism includes: a horizontal module, a fixture and a tooling drive; the horizontal module is provided with: a loading and unloading station, a first end surface station, a second end surface station and a flipping station; the fixture is used to clamp the wafer and is provided on the horizontal module; the tooling drive is connected to the fixture, and is used to drive the fixture to switch positions among the loading and unloading station, the first end surface station, the second end surface station and the flipping station; the grinding shaft mechanism includes: A linear module, a grinding shaft and a grinding shaft driving member; the linear module is provided with: an avoidance station and a grinding station; the grinding shaft is arranged on the linear module; the grinding shaft driving member is connected to the grinding shaft, and is used to drive the grinding shaft to switch positions between the avoidance station and the grinding station; the grinding station is arranged between the first end face station and the second end face station, so that the grinding shaft located at the grinding station can grind the wafer on the first end face station or the wafer on the second end face station; the flipping mechanism is arranged next to the flipping station, and is used to flip the wafer located at the flipping station.

[0047] The tooling mechanism can clamp the wafer and drive the wafer to slide; the flipping mechanism can flip the wafer on the flipping station to automatically adjust the polishing surface of the wafer, so that the end edge polishing of the wafer can be automatically completed through the cooperation of the tooling mechanism, the polishing mechanism and the flipping mechanism. Compared with the method of staff holding the wafer, it can effectively improve work efficiency and ensure the consistency of polishing of different wafers, and effectively solve the problems of poor polishing consistency and low production efficiency of the existing wafer edge grinding method. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0049] Figure 1 A schematic diagram of the overall structure of a wafer polishing assembly provided in an embodiment of the present application;

[0050] Figure 2 A three-dimensional perspective view of a wafer before and after polishing in a wafer polishing assembly provided in an embodiment of the present application;

[0051] Figure 3 A front view of a wafer before and after polishing in a wafer polishing assembly provided in an embodiment of the present application;

[0052] Figure 4 A schematic diagram of a tooling mechanism in a wafer polishing assembly provided in an embodiment of the present application;

[0053] Figure 5 A front view of the overall structure of a wafer polishing assembly provided in an embodiment of the present application when the fixture is located at a loading and unloading station or a flipping station;

[0054] Figure 6 A front view of the overall structure of a wafer polishing assembly provided in an embodiment of the present application when the fixture is located at the first end surface station or the second end surface station;

[0055] Figure 7 A schematic diagram of a grinding shaft mechanism in a wafer grinding assembly provided in an embodiment of the present application;

[0056] Figure 8 A schematic diagram of a grinding shaft and wafer grinding of a wafer grinding assembly provided in an embodiment of the present application;

[0057] Figure 9 A schematic diagram of a flipping mechanism in a wafer polishing assembly provided in an embodiment of the present application;

[0058] Figure 10 A schematic diagram of the overall structure of a wafer polishing device provided in an embodiment of the present application;

[0059] In the picture:

[0060] 10. Tooling mechanism; 11. Horizontal module; 12. Fixture; 13. Tooling drive component; 14. Slide; 15. Pressing plate;

[0061] 20. Grinding shaft mechanism; 21. Linear module; 22. Grinding shaft; 23. Grinding shaft drive; 24. Grinding shaft motor; 25. Synchronous belt;

[0062] 30. Turning mechanism; 31. Adsorption element; 32. Turning motor; 33. Lifting cylinder; 34. Support platform; 35. Vacuum valve assembly;

[0063] 40. Wafer; 41. Edge to be polished; 42. Unpolished edge; 43. First end surface; 44. Second end surface;

[0064] 50. Cooling mechanism; 51. Grinding fluid spray pipe; 52. Grinding fluid collection pipe; 53. Centrifugal filter;

[0065] 60. Waterproof cover; 61. External waterproof cover; 62. Motor protective cover;

[0066] 70. Dust removal pipe;

[0067] 100, rack; 101, rack base; 102, closed housing;

[0068] 200, electronic control components; 201, control panel;

[0069] A, loading and unloading station; B, first end face station; C, second end face station; D, flipping station; E, avoidance station; F, grinding station; M, first side; N, second side; θ, chamfer angle. DETAILED DESCRIPTION

[0070] The following will clearly and completely describe the technical solutions of the embodiments of this application in conjunction with the accompanying drawings. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection requested by this application.

[0071] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, they should not be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0072] In the description of the embodiments of the present application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, replaceable connections, or integral connections. They can also refer to mechanical connections or electrical connections. They can also refer to direct connections or indirect connections through an intermediate medium. They can also refer to internal connections between two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0073] See also Figures 1 to 3 In a first aspect, an embodiment of the present application provides a wafer grinding assembly, comprising: a tooling mechanism 10, a grinding shaft mechanism 20, and a flipping mechanism 30. The tooling mechanism 10, the grinding shaft mechanism 20, and the flipping mechanism 30 can all be disposed on a frame bottom plate 101.

[0074] The wafer polishing assembly provided in this embodiment is used to polish a wafer 40. The polishing object may be an end face or an end edge of the wafer 40. In the embodiment of the present application, the polishing object is described as the end edge of the wafer 40.

[0075] Specifically, in this embodiment, the wafer 40 is a rectangular block having eight edges 41 to be polished and four edges 42 not to be polished. The eight edges 41 to be polished are located on the first end face 43 and the second end face 44 of the wafer 40. The schematic diagram of the effect of the wafer 40 before and after polishing can be referred to Figure 2 and Figure 3 .

[0076] After the end edge 41 of the wafer 40 to be polished is polished, the first side M, the second side N and the chamfer angle ∠θ of the chamfer can be adjusted according to the actual processing technology required.

[0077] See also Figures 4 to 6 The tooling mechanism 10 includes: a horizontal module 11, a fixture 12 and a tooling drive 13; the horizontal module 11 is provided with: an unloading and loading station A, a first end surface station B, a second end surface station C and a flipping station D; the fixture 12 is used to clamp the chip 40 and is provided on the horizontal module 11; the tooling drive 13 is connected to the fixture 12, and is used to drive the fixture 12 to switch positions among the unloading and loading station A, the first end surface station B, the second end surface station C and the flipping station D.

[0078] The clamp 12 can be a contoured clamp adapted to the shape of the wafer 40 to better grip the wafer. Furthermore, the clamping surface of the clamp 12 can be provided with a soft layer of silicone to prevent damage to the surface of the wafer 40. It should be noted that the clamp 12 is also provided with a clamp driver for controlling the opening and closing of the clamp 12.

[0079] Please refer to 5 to Figure 7 The grinding shaft mechanism 20 includes: a linear module 21, a grinding shaft 22 and a grinding shaft driving member 23; the linear module 21 is provided with: an avoidance station E and a grinding station F; the grinding shaft 22 is arranged on the linear module 21; the grinding shaft driving member 23 is connected to the grinding shaft 22, and is used to drive the grinding shaft 22 to switch positions between the avoidance station E and the grinding station F; the grinding station F is arranged between the first end surface station B and the second end surface station C, so that the grinding shaft 22 located at the grinding station F can grind the wafer 40 on the first end surface station B or the wafer 40 on the second end surface station C.

[0080] When the grinding shaft 22 is located at the avoidance station E, the fixture 12 can move from the first end surface station B to the second end surface station C. That is, the avoidance station E allows the grinding shaft 22 to avoid the moving trajectory of the fixture 12.

[0081] It should be noted that the grinding mechanism 20 may further include a grinding motor 24 and a synchronous belt 25. The output end of the grinding motor 24 is synchronously connected to the grinding shaft 22 via the synchronous belt 25 to drive the grinding shaft 22 to rotate and grind the wafer 40.

[0082] Specifically, when the fixture 12 is located at the loading and unloading station A, loading and unloading operations can be performed; loading refers to clamping an unpolished wafer 40 onto the fixture 12; unloading refers to removing a polished wafer 40 from the fixture 12. After the fixture 12 performs the loading operation and clamps the wafer 40, the tooling drive plate 13 drives the fixture 12 to move to the first end surface station B.

[0083] Because the grinding station F is located between the first end surface station B and the second end surface station C, when the fixture 12 is located at the first end surface station B and the second end surface station C, the end surface of the wafer 40 close to the grinding shaft 22 is a different end surface. For example, when the fixture 12 is located at the first end surface station B, the first end surface 43 of the wafer 40 is the end surface close to the grinding shaft 22; when the fixture 12 is located at the second end surface station C, the second end surface 44 of the wafer 40 is the end surface close to the grinding shaft 22. Therefore, without turning the wafer 40 over, the tooling mechanism 10 and the grinding shaft mechanism 20 cooperate to grind the end edges on two different end surfaces of the wafer 40.

[0084] The flipping mechanism 30 is disposed beside the flipping station D and is used to flip the wafer 40 located at the flipping station D.

[0085] The process of flipping the wafer 40 by the flipping mechanism 30 may be: the tooling driving component 13 drives the clamp 12 to move to the flipping station D; then the clamp 12 releases the clamping of the wafer 40, and then the flipping mechanism 30 drives the wafer 40 to flip.

[0086] Through the cooperation of the tooling mechanism 10, the grinding axis mechanism 20 and the flipping mechanism 30, the position and placement angle of the chip 40 can be automatically adjusted to achieve grinding of each end edge 41 to be ground on the chip 40. Compared with the existing method of grinding the chip by hand, the grinding efficiency can be effectively improved; at the same time, the fixture 12 can clamp multiple chips 40 at the same time to achieve simultaneous grinding of multiple chips 40, which can further improve the grinding efficiency while ensuring the grinding consistency of different chips 40.

[0087] As an implementation, see Figure 8 The clamp 12 can cooperate with the clamping plate 15 to clamp the wafer 40, and then the grinding shaft 22 grinds the end edge of the top surface of the wafer 40; the top surface of the wafer 40 can be changed by the flipping mechanism 30, so that the grinding shaft 22 can grind each end edge 41 to be polished of the wafer 40.

[0088] In a more specific embodiment, the linear module 21 is vertically arranged; the clamp 12 is slidably arranged on the horizontal module 11 along the horizontal direction; the grinding shaft 22 is slidably arranged on the linear module 21 along the vertical direction; and the avoidance station E is located above the grinding station F.

[0089] Specifically, the length of the horizontal module 11 is the X-axis, and the length of the linear module 21 is the Z-axis. When the grinding spindle 22 is located at the avoidance station E, the grinding spindle 22 is located above the fixture 12, allowing the fixture 12 and the wafer 40 to slide under the grinding spindle 22.

[0090] It should be noted that, in this embodiment, the end edge of the wafer 40 can be polished into different shapes such as C-shaped chamfers and arc chamfers by cooperating with the clamp 12 that can slide along the X-axis direction and the grinding shaft 22 that slides along the Z-axis direction.

[0091] The core material of the grinding shaft 22 can be tungsten steel with diamond grit sintered on the surface; the hard and fine diamond grit particles are firmly combined with the core through a high-temperature sintering process, and finally a grinding process is used to ensure the full runout tolerance of the entire grinding shaft 22.

[0092] As an implementation, see Figure 4 The tooling mechanism 10 may further include a slide 14; the fixture 12 may be detachably mounted on the slide 14 by means of pins or the like; and the slide 14 may be slidably mounted on the horizontal module 11. Thus, different types of fixtures 12 may be selected when handling wafers 10 of different sizes and types.

[0093] In one embodiment, see Figure 9 The flip mechanism 30 includes: an adsorption member 31 and a flip motor 32; the adsorption member 31 is used to adsorb the wafer 40; the flip motor 32 is connected to the adsorption member 31, and is used to drive the adsorption member 31 to rotate a preset angle along the horizontal plane.

[0094] Specifically, the suction member 31 may be a vacuum suction cup; correspondingly, the flip mechanism 30 further includes a vacuum valve assembly 35, which provides suction force to the suction member 31. The flip motor 32 is used to drive the suction member 31 to flip horizontally. The flip angle, or the preset angle, can be set according to actual needs. For example, in this embodiment, if the wafer 40 is in the shape of a block, the preset angle may be 90°; if the wafer 40 is in the shape of a hexagonal prism, the preset angle may be 60°; if the polishing object is the end face of the wafer 40, the preset angle may also be 180°.

[0095] It should be noted that the adsorption component 31 rotates along the horizontal plane means that the rotation axis and the rotation plane of the adsorption component 31 are both located on the horizontal plane, that is, located on the plane formed by the X-axis and the Y-axis.

[0096] The flipping process of the flipping mechanism 30 can be: the suction part 31 sucks the chip 40 on the flipping station D, and then the clamp 12 releases the chip 40; after the flipping motor 32 drives the suction part 31 and the chip 40 to flip 90°, the clamp 12 re-clamps the chip 40.

[0097] Similarly, there may be multiple adsorption members 31 to simultaneously process multiple wafers 40. Correspondingly, there may be multiple flip motors 32, or the flip motor 32 may be connected to multiple adsorption members 31 via a synchronous belt.

[0098] Furthermore, the flip mechanism 30 also includes: a lifting cylinder 33 and a support platform 34; the adsorption component 31 and the flip motor 32 are both arranged on the support platform 34; the output end of the lifting cylinder 33 is connected to the support platform 34, used to drive the support platform 34 to rise and fall.

[0099] Specifically, the lifting cylinder 33 is used to drive the support platform 34 to move up and down, thereby driving the suction member 31 and the flip motor 32 to move up and down, so as to prevent the suction member 31 and the flipping of the wafer 40 from interfering with the clamp 12 .

[0100] In one embodiment, a cooling mechanism 50 is further included; the cooling mechanism 50 includes: a grinding fluid spraying pipe 51; the grinding fluid spraying pipe 51 is arranged beside the grinding shaft 22, and is used to spray grinding fluid to the grinding shaft 22.

[0101] By providing the grinding fluid spray pipe 51 , the temperature of the wafer 40 can be reduced during the grinding process of the grinding shaft 22 and the smoothness of the wafer 40 after grinding can be increased, thereby improving the grinding quality.

[0102] In another embodiment, the cooling mechanism 50 further includes: a grinding fluid collecting pipe 52 ( Figure 10 ) and centrifugal filter 53 ( Figure 10 the liquid inlet end of the grinding fluid collecting pipe 52 is provided below the grinding shaft 22 for collecting the sprayed grinding fluid; the centrifugal filter 53 is connected to the liquid outlet end of the grinding fluid collecting pipe 52.

[0103] Specifically, after the grinding fluid is sprayed onto the grinding spindle 22 and wafer 40, it carries the worn material from the wafer 40 into the grinding fluid collection tube 52, then flows out of the liquid outlet and into the centrifugal filter 53. The centrifugal filter 53 rotates at high speed to filter the grinding fluid and collect the rare material dust particles lost during grinding.

[0104] In one embodiment, a waterproof cover 60 is disposed on the horizontal module 11 , the linear module 21 and the flip mechanism 30 .

[0105] The waterproof cover 60 is used to block the grinding fluid and prevent the grinding fluid from entering the device. The waterproof cover 60 on the horizontal module 11 can be an accordion cover structure, so that it can slide with the clamp 12 during the sliding process of the clamp 12, playing a role of sliding waterproof.

[0106] See also Figure 1A peripheral waterproof cover 61 may be provided on the frame bottom plate 101; the tooling mechanism 10, the grinding shaft mechanism 20, and the flip mechanism 30 are all provided within the peripheral waterproof cover 61 to prevent the grinding fluid from flowing out of the peripheral waterproof cover 61. A motor protective cover 62 may be provided around the grinding shaft drive member 23.

[0107] In one embodiment, it further includes: a dust removal pipe 70 ( Figure 10 dust removal pipe 70 is provided beside the grinding shaft 22 for absorbing dust generated during the grinding process.

[0108] The dust generated by grinding can be purified through the dust removal pipe 70 to avoid environmental pollution.

[0109] The second aspect of the present application provides a wafer polishing device, see Figure 10 , including: a frame 100, an electronic control component 200 and any of the above-mentioned wafer polishing components; the electronic control component 200 and the wafer polishing component are both arranged on the frame 100; the electronic control component 200 is electrically connected to the tooling drive 13, the grinding shaft drive 23 and the flip mechanism 30 in the wafer polishing component.

[0110] Specifically, a closed housing 102 is provided on the frame 100. Both the wafer polishing assembly and the electronic control assembly 200 are housed within this closed housing 102, ensuring fully enclosed operation. Dust generated during operation is removed through a dust removal duct 70. The electronic control assembly 200 controls the start and stop of the tooling drive 13 and the grinding shaft drive 23, as well as the rotation of the tilting mechanism 30. It is also electrically connected to the centrifugal filter 53 to control its start and stop.

[0111] It should be noted that the electric control component 200 can be connected to a control panel 201, and the control panel 201 is set on the frame 100 to facilitate operation by the staff.

[0112] A third aspect of the present application provides a wafer polishing method, which is applied to any of the above-mentioned wafer polishing assemblies;

[0113] The method comprises the following steps:

[0114] S1 . Clamp the wafer 40 with the clamp 12 .

[0115] Before step S1 , the following may be included: step S0 , controlling the fixture 12 to move to the loading and unloading station A.

[0116] S2. Control the fixture 12 to move to the first end surface station B.

[0117] S3, moving the grinding shaft 22 to the grinding station F to grind an end edge 41 to be ground on the top surface of the wafer 40, and moving the grinding shaft 22 to the avoidance station E after the grinding is completed.

[0118] S4. Control the fixture 12 to move to the second end surface station C.

[0119] S5, grinding the other end to be ground of the top surface of the wafer 40 by the grinding spindle 22 located at the grinding station F;

[0120] S6. After controlling the fixture 12 to move to the flipping station D, the wafer 40 is flipped horizontally at a preset angle by the flipping mechanism 30; the preset angle may be 90°.

[0121] S7 , repeating steps S2 to S6 until the eight edges 41 to be polished of the wafer 40 are all polished.

[0122] After step S7 , the following may be included: step S8 , controlling the fixture 12 to move to the loading and unloading station A to unload the wafer 40 .

[0123] In this embodiment, the eight edges 41 to be polished of the wafer 40 can be as follows: Figure 2 shown.

[0124] Through the chip polishing method provided in the embodiment of the present application, the chip 40 can be automatically loaded and unloaded, automatically slid and automatically flipped, and the automatic polishing of the chip 40 can be finally completed, which can effectively reduce the work intensity of the staff and ensure the consistency of the polishing quality and polishing degree of the chip 40.

[0125] The above are only preferred embodiments of the present application and are not intended to limit the present invention. Although the present application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the aforementioned examples or make equivalent replacements for some of the technical features therein. However, any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A wafer polishing assembly, characterized in that: include: A tooling mechanism (10), a shaft grinding mechanism (20), and a turning mechanism (30); The tooling mechanism (10) comprises: a horizontal module (11), a clamp (12) and a tooling drive component (13); The horizontal module (11) is provided with: a loading and unloading station (A), a first end surface station (B), a second end surface station (C) and a flipping station (D); The clamp (12) is used to clamp the chip (40) and is arranged on the horizontal module (11); The tool drive member (13) is connected to the fixture (12) and is used to drive the fixture (12) to switch positions among the loading and unloading station (A), the first end surface station (B), the second end surface station (C) and the flipping station (D); The shaft grinding mechanism (20) comprises: a linear module (21), a shaft grinding (22) and a shaft grinding drive member (23); The linear module (21) is provided with: an avoidance station (E) and a grinding station (F); The grinding shaft (22) is arranged on the linear module (21); The grinding shaft driving member (23) is connected to the grinding shaft (22) and is used to drive the grinding shaft (22) to switch positions between the avoidance station (E) and the grinding station (F); The grinding station (F) is arranged between the first end surface station (B) and the second end surface station (C), so that the grinding shaft (22) located at the grinding station (F) can grind the wafer (40) on the first end surface station (B) or the wafer (40) on the second end surface station (C); The flipping mechanism (30) is arranged beside the flipping station (D) and is used to flip the wafer (40) located at the flipping station (D); The linear module (21) is arranged vertically; The clamp (12) is slidably arranged on the horizontal module (11) along a horizontal direction; The grinding shaft (22) is slidably arranged on the linear module (21) along the vertical direction; The avoidance station (E) is located above the grinding station (F).

2. The wafer polishing assembly according to claim 1, wherein: The flipping mechanism (30) comprises: an adsorption member (31) and a flipping motor (32); The adsorption member (31) is used to adsorb the wafer (40); The flip motor (32) is in transmission connection with the adsorption member (31) and is used to drive the adsorption member (31) to rotate along a horizontal plane at a preset angle.

3. The wafer polishing assembly according to claim 2, wherein: The turning mechanism (30) further includes: a lifting cylinder (33) and a support platform (34); The adsorption member (31) and the flip motor (32) are both arranged on the support platform (34); The output end of the lifting cylinder (33) is connected to the support platform (34) and is used to drive the support platform (34) to move up and down.

4. The wafer polishing assembly according to claim 1, wherein: Also included is a cooling mechanism (50); The cooling mechanism (50) comprises: a grinding fluid spray pipe (51); The grinding fluid spray pipe (51) is arranged beside the grinding shaft (22) and is used for spraying grinding fluid onto the grinding shaft (22).

5. The wafer polishing assembly according to claim 4, wherein: The cooling mechanism (50) further includes: a grinding fluid collection pipe (52) and a centrifugal filter (53); The liquid inlet end of the grinding fluid collecting pipe (52) is arranged below the grinding shaft (22) and is used to collect the sprayed grinding fluid; The centrifugal filter (53) is connected to the liquid outlet end of the grinding liquid collection pipe (52).

6. The wafer polishing assembly according to claim 4, wherein: The horizontal module (11), the linear module (21) and the turning mechanism (30) are all provided with a waterproof cover (60).

7. The wafer polishing assembly according to claim 1, wherein: Also includes: Dust removal pipe (70); The dust removal pipe (70) is arranged beside the grinding shaft (22) and is used to absorb dust generated during the grinding process.

8. A wafer polishing device, characterized in that: include: A frame (100), an electric control component (200), and a wafer polishing component according to any one of claims 1 to 7; The electric control component (200) and the wafer polishing component are both arranged on the frame (100); The electric control component (200) is electrically connected to the tooling drive component (13), the grinding shaft drive component (23) and the turning mechanism (30) in the wafer grinding component.

9. A wafer polishing method, characterized in that: A wafer polishing assembly as claimed in any one of claims 1 to 7; The method comprises the following steps: S1, clamping the wafer (40) by the clamp (12); S2, controlling the clamp (12) to move to the first end surface position (B); S3, moving the grinding shaft (22) to the grinding station (F) to grind an end edge (41) to be ground on the top surface of the wafer (40), and after the grinding is completed, moving the grinding shaft (22) to the avoidance station (E); S4, controlling the clamp (12) to move to the second end surface position (C); S5, grinding the other end edge (41) to be ground of the top surface of the wafer (40) by means of a grinding shaft (22) located at a grinding station (F); S6, after controlling the clamp (12) to move to the flipping station (D), the wafer (40) is flipped horizontally at a preset angle by the flipping mechanism (30); S7, repeating steps S2 to S6 until all eight edges (41) to be polished of the wafer (40) are polished.

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