Chip testing apparatus and method

Abstract

The application provides a chip testing device and method, which comprises a chip testing board, a processor and a chip fixing seat for assembling a chip to be tested, and the chip to be tested assembled to the chip fixing seat is electrically connected with the processor through the chip fixing seat; a first fixing assembly; a second fixing assembly arranged above the preset position and comprising a fixing plate, a first telescopic device, a second telescopic device, a first heating device, a second heating device and a driving device; a control circuit board for controlling the driving device to drive the first telescopic device to press down the first pressing plate to the upper surface of the processor, drive the second telescopic device to press down the second pressing plate to the upper surface of the chip to be tested, and control the first heating device and the second heating device to heat to a first preset temperature. The application can simulate a more real application environment of the chip to be tested, so that more real performance parameters of the chip to be tested are obtained.

Description

Technical Field

[0001] This invention relates to the field of chip testing, and more specifically, to a chip testing device and method. Background Technology

[0002] With the development of semiconductor technology, chip testing, especially three-temperature testing (referring to functional testing at high, normal, and low temperatures), has received increasing attention. More and more chip design, manufacturing, and user companies are investing more and more in chip testing.

[0003] Chip testing equipment is used to perform batch testing on a large number of chips. When performing three-temperature testing on chips, the chip testing equipment simulates the operation of the chips in different temperature environments and obtains the corresponding performance data.

[0004] When the chip under test is used in a specific terminal device, the processor and other components in the device generate heat, causing changes in the ambient temperature of the chip under test. However, existing chip testing equipment only performs three-temperature tests on the chip under test itself, which makes it impossible to effectively obtain the performance of the chip under test in a real working environment during the testing process. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a new chip testing device and method to address the issue that the above-mentioned chip testing equipment cannot obtain the performance of the chip under test in a real working environment.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is to provide a chip testing device, comprising:

[0007] A chip test board includes a processor and a chip holder for mounting a chip under test. The processor and the chip holder are integrated on the upper surface of the chip test board, and the chip under test mounted on the chip holder is electrically connected to the processor via the chip holder.

[0008] The first fixing component includes a limiting device for fixing the chip test board at a preset position and a limiting detection device for detecting the limiting state of the chip test board.

[0009] The second fixing component is located above the preset position and includes a fixing plate, a first telescopic device, a second telescopic device, a first heating device, a second heating device, and a driving device; one end of the first telescopic device and the second telescopic device are respectively fixed on the fixing plate, the other end of the first telescopic device has a first pressure plate, the other end of the second telescopic device has a second pressure plate, the first heating device is disposed on the first pressure plate, and the second heating device is disposed on the second pressure plate.

[0010] The control circuit board is electrically connected to the limiting device, the limiting detection device, the first heating device, the second heating device, and the driving device, respectively. The limiting device is limited under the control of the control circuit board. The limiting detection device sends a limiting success command to the control circuit board when the chip test board is limited to a preset position. The driving device drives the first telescopic device to press the first pressure plate down onto the upper surface of the processor and drives the second telescopic device to press the second pressure plate down onto the upper surface of the chip under test, respectively, under the control of the control circuit board. The first heating device and the second heating device heat the first pressure plate and the second pressure plate to a first preset temperature, respectively, under the control of the control circuit board.

[0011] As a further improvement of the present invention, the second fixing component further includes a third telescopic device, a fourth telescopic device, and a displacement device; one end of the third telescopic device and the fourth telescopic device are respectively fixed on the fixing plate, and the other end of the third telescopic device has a third pressure plate, the other end of the fourth telescopic device has a fourth pressure plate, a first cooling device is provided on the third pressure plate, and a second cooling device is provided on the fourth pressure plate.

[0012] The control circuit board is electrically connected to the first cooling device, the second cooling device, and the shifting device, respectively. Under the control of the control circuit board, the shifting device positions the first telescopic device and the second telescopic device above the chip test board, or positions the third telescopic device and the fourth telescopic device above the chip test board. Under the control of the control circuit board, the driving device drives the third telescopic device located above the chip test board to press the third pressure plate down onto the upper surface of the processor, and drives the fourth telescopic device to press the fourth pressure plate down onto the upper surface of the chip under test. Under the control of the control circuit board, the first cooling device and the second cooling device respectively keep the pressure plates of the third telescopic device and the fourth telescopic device at a second preset temperature.

[0013] As a further improvement of the present invention, the shifting device drives the fixed plate to shift, so that the first telescopic device and the second telescopic device are located above the chip test board, or so that the third telescopic device and the third telescopic device are located above the chip test board.

[0014] As a further improvement of the present invention, the shifting device drives the first fixing component to shift, so that the chip test board is located below the first telescopic device and the second telescopic device, or the chip test board is located below the third telescopic device and the fourth telescopic device.

[0015] As a further improvement of the present invention, the first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device each include a linear piston cylinder.

[0016] The cylinder bodies of the linear piston cylinders of the first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device are respectively vertically fixed on the fixed plate. The first pressure plate, the second pressure plate, the third pressure plate, and the fourth pressure plate are respectively fixed on the piston rod of the corresponding linear piston cylinder at the end away from the fixed plate. The telescopic stroke of the linear piston cylinder is adapted to the height of the chip under test on the processor and chip mounting base.

[0017] The drive device includes an air source and solenoid valves for controlling the gas from the air source to enter and exit each linear piston cylinder.

[0018] As a further improvement of the present invention, the first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device each include a servo electric cylinder. The cylinder body of the servo electric cylinder of the first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device is vertically fixed on the fixed plate. The first pressure plate, the second pressure plate, the third pressure plate, and the fourth pressure plate are respectively fixed on the end of the lead screw of the corresponding servo electric cylinder away from the fixed plate.

[0019] The drive unit includes a drive module for driving the motors of each servo cylinder.

[0020] As a further improvement of the present invention, pressure sensors are respectively provided on the first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device. The pressure sensors are electrically connected to the control circuit board. When the control circuit board controls the first telescopic device, the second telescopic device, the third telescopic device, or the fourth telescopic device to press down, if the detection signal of the pressure sensor reaches a preset value, it controls the motor of the corresponding servo cylinder to stop running.

[0021] As a further improvement of the present invention, the first pressure plate and the second pressure plate are respectively provided with a first temperature sensor electrically connected to the control circuit board, and when the first temperature sensor reaches a first preset temperature and a preset time, the control circuit board sends a start signal to the processor on the chip test board, so that the processor and the chip under test on the chip holder run a preset program.

[0022] The third and fourth pressure plates are respectively provided with a second temperature sensor electrically connected to the control circuit board. When the second temperature sensor reaches a second preset temperature and a preset time, the control circuit board sends a start signal to the processor on the chip test board, so that the processor and the chip under test on the chip holder run a preset program.

[0023] As a further improvement of the present invention, a first heat insulation cover and a second heat insulation cover are provided below the fixing plate; the first pressure plate and the second pressure plate are respectively located inside the first heat insulation cover, and the first heat insulation cover follows the first pressure plate and the second pressure plate downward and covers the chip test board; the third pressure plate and the fourth pressure plate are respectively located inside the second heat insulation cover, and the second heat insulation cover follows the third pressure plate and the fourth pressure plate downward and covers the chip test board.

[0024] The present invention also provides a method for performing chip testing using the chip testing equipment described above, comprising:

[0025] The first fixing component is controlled to fix the chip test board in a preset position. The chip test board includes a processor and a chip mounting base for mounting the chip under test. The processor and the chip mounting base are integrated on the upper surface of the chip test board, and the chip under test mounted on the chip mounting base is electrically connected to the processor through the chip mounting base.

[0026] When the first telescopic device and the second telescopic device are above the preset position, the control drive device drives the first telescopic device to press the first pressure plate down onto the upper surface of the processor and drives the second telescopic device to press the second pressure plate down onto the upper surface of the chip under test. One end of the first telescopic device and the second telescopic device are respectively fixed on the fixed plate, the first pressure plate is located at the other end of the first telescopic device, and the second pressure plate is located at the other end of the second telescopic device.

[0027] The first heating device and the second heating device are controlled to heat the first pressure plate and the second pressure plate to a first preset temperature, and a start signal is sent to the processor on the chip test board to make the processor and the chip under test on the chip holder run a preset program. The first heating device and the second heating device are respectively set on the first pressure plate and the second pressure plate.

[0028] The present invention has the following beneficial effects: the first heating device on the first pressure plate of the first telescopic device and the second heating device on the second pressure plate of the second telescopic device provide the ambient temperature, and the chip test board simulates the real operating environment of the chip under test, which can simulate a more realistic application environment of the chip under test, thereby obtaining more realistic performance parameters of the chip under test. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the chip testing equipment provided in an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram showing the connection relationship between the control circuit board and the first fixing component and the second fixing component in the chip testing equipment provided in this embodiment of the invention;

[0031] Figure 3 This is a schematic diagram of a chip testing device provided in another embodiment of the present invention;

[0032] Figure 4 This is a schematic diagram of a chip testing device provided in another embodiment of the present invention;

[0033] Figure 5 This is a schematic diagram of a chip testing device provided in another embodiment of the present invention;

[0034] Figure 6 This is a schematic flowchart of the chip testing method provided in an embodiment of the present invention;

[0035] Figure 7 This is a schematic flowchart of a chip testing method provided in another embodiment of the present invention. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0037] like Figures 1-2 The diagram shown is a schematic of a chip testing device provided in an embodiment of the present invention. This chip testing device can be used to perform three-temperature (high temperature, room temperature, and low temperature) tests on chips (such as SRAM chips, DRAM chips, FLASH chips, DDR chips, LPDDR chips, etc.) that have been packaged but not assembled into terminal devices. The chip testing device in this embodiment includes a chip testing board 10, a first fixing component 30, a second fixing component, and a control circuit board 40. The first fixing component 30, the second fixing component, and the control circuit board 40 can be integrated on a rack or in a cabinet, and the chip testing board 10 can be fixed by the first fixing component 30.

[0038] The main body of the aforementioned chip test board 10 can be constructed from a printed circuit board (PCB). The chip test board 10 (i.e., the PCB) also integrates a processor 12 and a chip mounting bracket 13, both integrated on the upper surface of the chip test board 10. Both the processor 12 and the chip mounting bracket 13 can be soldered to the surface of the PCB (e.g., via SMD process). The chip mounting bracket 13 is used to mount the chip under test (DUT), and the DUT mounted on the chip mounting bracket 13 is electrically connected to the processor 12 via the chip mounting bracket 13. The structure of the chip mounting bracket 13 can correspond to the pin structure of the DUT; for example, the upper surface of the chip mounting bracket 13 can have multiple protruding spring pins, which are electrically connected to the pads of the DUT via these spring pins. The aforementioned chip test board 10, processor 12, chip mount 13, and the chip under test mounted on the chip mount 13 together constitute a terminal-like module that can simulate terminal operation. Specifically, the processor 12 and the chip under test on the chip mount 13 can jointly run a preset program (e.g., a performance test program) and obtain the performance parameters of the chip under test. For example, when the chip under test is a FLASH chip, its performance parameters include data read speed and data write speed. The specific structure of the aforementioned chip test board 10 can employ conventional techniques in the field and will not be elaborated upon here.

[0039] The first fixing component 30 includes a limiting device and a limiting detection device, both electrically connected to the control circuit board 40. The limiting device fixes the chip test board 10 in a preset position, and the limiting detection device detects the limiting status of the chip test board. The limiting detection device sends a limiting success command to the control circuit board 40 when the limiting device fixes the chip test board in the preset position. For example, the limiting device can consist of an operating platform and multiple clamping blocks protruding from the surface of the operating platform. These clamping blocks can be driven by a motor or cylinder to move on the surface of the operating platform, thereby clamping and fixing the chip test board 10 placed on the operating platform, thus achieving horizontal fixing of the processor 12 and the chip under test. The limiting detection device can specifically include sensors (such as image sensors, infrared sensors, etc.) for status detection and send a limiting success command to the control circuit board 40. Of course, in practical applications, the first fixing component 30 can also use any other device that can fix the chip test board 10 in a preset position, which will not be elaborated here.

[0040] The second fixing component is positioned above a preset position, specifically above the chip test board 10 at the preset position. This second fixing component includes a fixing plate 21, a first telescopic device 22, a second telescopic device 23, a first heating device 241, a second heating device 242, and a driving device 26. The fixing plate 21 can be formed by a plate-shaped support parallel to the operating plane (e.g., fixed to the frame of the chip testing equipment). The first telescopic device 22 and the second telescopic device 23 are respectively fixed below the fixing plate 21. The first telescopic device 22 has a first pressure plate 221 at its end away from the fixing plate 21, and the second telescopic device 23 has a second pressure plate 231 at its end away from the fixing plate 21. The relative positions of the first pressure plate 221 and the second pressure plate 231 on the fixing plate 21 correspond to the relative positions of the processor 12 and the chip holder 13 on the chip test board 10. That is, when the chip test board 10 is in the preset position, the first pressure plate 221 is directly above the processor 12, and the second pressure plate 231 is directly above the chip under test on the chip holder 13. A first heating device 241 is disposed on a first pressure plate 221, and a second heating device 242 is disposed on a second pressure plate 231. The first heating device 241 and the second heating device 242 heat the processor 12 and the chip under test through heat conduction (via the first pressure plate 221 and the second pressure plate 231). The first heating device 241 and the second heating device 242 can be composed of electric heating elements, such as electric heating alloys, electric heating cores, mica heating sheets, ceramic heating sheets, electric heating wires, electromagnetic elements, etc., and are respectively attached to the surfaces of the first pressure plate 221 and the second pressure plate 231 facing the fixing plate 21.

[0041] The main body of the control circuit board 40 can be composed of a printed circuit board (PCB). The control circuit board 40 integrates a main control chip, which controls the operation of various parts of the chip testing equipment to achieve three-temperature testing of the chip under test. The control circuit board 40 is electrically connected to the first heating device 241, the second heating device 242, and the drive device 26, respectively. Thus, the main control chip on the control circuit board 40 can control the operation of the first heating device 241, the second heating device 242, and the drive device 26. The drive device 26 is connected to the first telescopic device 22 and the second telescopic device 23 (including mechanical connection, electrical connection, etc.). Specifically, when the fixing plate 21 is located above the chip test board 10, the driving device 26, under the control of the control circuit board 40, drives the first telescopic device 22 to press the first pressure plate 221 down onto the upper surface of the processor 12 (i.e., the lower surface of the first pressure plate 221 is in contact with the upper surface of the processor 12), and drives the second telescopic device 23 to press the second pressure plate 231 down onto the upper surface of the chip under test (i.e., the lower surface of the second pressure plate 231 is in contact with the upper surface of the chip under test), thus achieving vertical fixation of the processor 12 and the chip under test. At the same time, the first heating device 241 and the second heating device 242 heat up under the control of the control circuit board 40, and heat the first pressure plate 221 and the second pressure plate 231 to a first preset temperature, which is higher than the room temperature (e.g., room temperature). Alternatively, the control circuit board 40 first controls the first heating device 241 and the second heating device 242 to preheat under the control of the control circuit board 40, and then the driving device 26 drives the first telescopic device 22 and the second telescopic device 23 to press down.

[0042] Since the first pressure plate 221 and the second pressure plate 231 are respectively attached to the surface of the processor 12 and the chip under test under the drive of the drive device 26, the first heating device 241 and the second heating device 242 can conduct heat to the processor 12 and the chip under test. Thus, after the first pressure plate 221 and the second pressure plate 231 reach the first preset temperature and reach the preset time, the control circuit board 40 sends a start signal to the processor 12 on the chip test board 10, so that the processor 12 and the chip under test on the chip holder 13 run a preset program to obtain the performance parameters of the chip under test at the first preset temperature.

[0043] The aforementioned chip testing equipment provides a first preset temperature through the first heating device 241 on the first pressure plate 221 of the first telescopic device 22 and the second heating device 242 on the second pressure plate 231 of the second telescopic device 23. This allows the chip testing board 10 to simulate the real operating environment of the chip under test, enabling high-temperature testing by simulating the real-world scenario of the chip under test in a terminal device. Specifically, the performance parameters obtained are determined by the combined effect of the first preset temperature provided by the first heating device 241 and the second heating device 242, and the temperature generated by the processor 12 (and other electronic components on the chip testing board 10). This results in performance parameters that are closer to the application environment of the chip under test, thus improving the reference value of the performance parameters.

[0044] Combination Figure 3 As shown, in one embodiment of the present invention, the second fixing component includes, in addition to the first telescopic device 22, the second telescopic device 23, the first heating device 241, the second heating device 242, and the driving device 26, a third telescopic device 27, a fourth telescopic device 28, a first cooling device 243, a second cooling device 244, and a shifting device (not shown in the figure). The third telescopic device 27 has a third pressure plate 271 at its end away from the fixing plate 21, and the fourth telescopic device 28 has a fourth pressure plate 281 at its end away from the fixing plate 21. The relative positions of the third pressure plate 271 of the third telescopic device 27 and the fourth pressure plate 281 of the fourth telescopic device 28 on the fixing plate 21 correspond to the relative positions of the processor 12 and the chip holder 13 on the chip test board 10. Thus, when the third telescopic device 27 and the fourth telescopic device 28 are directly above the chip test board 10, the third pressure plate 271 is directly above the processor 12, and the fourth pressure plate 281 is directly above the chip under test on the chip holder 13. The first refrigeration device 243 is mounted on the third pressure plate 271, and the second refrigeration device 244 is mounted on the fourth pressure plate 281. Both the first refrigeration device 243 and the second refrigeration device 244 can be semiconductor cooling chips, with their cooling surfaces respectively attached to the surfaces of the third pressure plate 271 and the fourth pressure plate 281 facing the fixing plate 21. In practical applications, the first refrigeration device 243 and the second refrigeration device 244 can also achieve cooling using other methods, such as liquid nitrogen cooling.

[0045] In addition to being electrically connected to the first fixing component 30, the driving device 26, the first heating device 241, and the second heating device 242, the control circuit board 40 is also electrically connected to the first cooling device 243, the second cooling device 244, and the shifting device, respectively. Under the control of the control circuit board 40, the shifting device positions the first telescopic device 22 and the second telescopic device 23 above the chip test board 10, or positions the third telescopic device 27 and the fourth telescopic device 28 above the chip test board 10. When the third telescopic device 27 and the fourth telescopic device 28 are located above the chip test board 10, the driving device 26, under the control of the control circuit board 40, drives the third telescopic device 27 to press the third pressure plate 271 down onto the upper surface of the processor 12 (i.e., the lower surface of the third pressure plate 271 is in contact with the upper surface of the processor 12), and drives the fourth telescopic device 28 to press the fourth pressure plate 281 down onto the upper surface of the chip under test (i.e., the lower surface of the fourth pressure plate 281 is in contact with the upper surface of the chip under test). The first cooling device 243 and the second cooling device 244 are cooled under the control of the control circuit board 40, thereby bringing the third pressure plate 271 and the fourth pressure plate 281 to a second preset temperature, which is lower than the room temperature (e.g., room temperature). Alternatively, the control circuit board 40 first controls the first cooling device 243 and the second cooling device 244 to pre-cool under the control of the control circuit board 40, and then the driving device 26 drives the third telescopic device 27 and the fourth telescopic device 28 to press down. The second preset temperature is provided by the first cooling device 243 on the third pressure plate 271 of the third telescopic device 27 and the second cooling device 244 on the fourth pressure plate 281 of the fourth telescopic device 28. The chip test board 10 simulates the real operating environment of the chip under test, which can simulate the real scenario of the chip under test in the terminal device to achieve low temperature testing. That is, the performance parameters are obtained under the combined effect of the second preset temperature provided by the first cooling device 243 and the second cooling device 244 and the temperature generated by the processor 12 (and other electronic components on the chip test board 10). This makes the obtained performance parameters closer to the application environment of the chip under test and improves the reference value of the performance parameters.

[0046] The chip testing equipment provides a high-temperature testing environment through the first telescopic device 22, the second telescopic device 23, the first heating device 241, and the second heating device 242, and a low-temperature testing environment through the third telescopic device 27, the fourth telescopic device 28, the first cooling device 243, and the second cooling device 244. This allows for simultaneous testing at three temperatures. Furthermore, since the low-temperature and high-temperature testing environments are provided by two separate sets of devices, for batch testing, it avoids the long high-low temperature transition time and relatively high energy consumption caused by using the same set of devices to simultaneously provide both environments. It also prevents condensation during the alternating heating and cooling process, thus avoiding damage to the chip test board due to water droplets (e.g., short circuits).

[0047] In one embodiment of the present invention, the shifting device can move horizontally by driving the fixing plate 21, so that the first telescopic device 22 and the second telescopic device 23 are positioned above the chip test board 10, or the third telescopic device 27 and the fourth telescopic device 28 are positioned above the chip test board 10. That is, the first telescopic device 22 and the second telescopic device 23 are used to... Figure 3 After the chip test board 10 undergoes high-temperature testing, the fixed plate 21 can be moved to the left by the shifting device, so that the third telescopic device 27 and the fourth telescopic device 28 are positioned above the chip test board 10, and the chip test board 10 is then subjected to high-temperature testing. Figure 3 The chip test board 10 in the middle is subjected to low temperature testing.

[0048] In practical applications, a production line can also be used, where multiple chip test boards 10 are fixed and arranged in a row by multiple first fixing components. A shifting device drives a fixing plate 21 to move above the queue formed by the multiple chip test boards 10. When the fixing plate 21 moves to... Figure 3 When the device is positioned as shown, the drive device 26 drives the first telescopic device 22 and the second telescopic device 23 to press down the first pressure plate 221 and the second pressure plate 231 to perform a high-temperature test on the chip test board 10 under the first telescopic device 22 and the second telescopic device 23. At the same time, the drive device 26 drives the third telescopic device 27 and the fourth telescopic device 28 to press down the third pressure plate 271 and the fourth pressure plate 281 to perform a low-temperature test on the chip test board 10 below the third telescopic device 27 and the fourth telescopic device 28. After the test is completed, the drive fixing plate 21 is moved to the left, and the third telescopic device 27 and the fourth telescopic device 28 are used to perform a low-temperature test on the chip test board 10 below it. At the same time, the first telescopic device 22 and the second telescopic device 23 are used to perform a high-temperature test on another chip test board.

[0049] Specifically, the shifting device can adopt the structure of a linear slide rail and slider in existing mechanical equipment. That is, the fixed plate 21 moves along the linear slide rail in a manner similar to a slider, and correspondingly, multiple chip test boards 10 are arranged in a row below the linear slide rail. In addition, the above-mentioned shifting device can also be set on the upper surface of the fixed plate 21 in the form of a ring motor slide rail. The fixed plate 21 is controlled to slide along the ring motor slide rail by the control circuit board 40 to achieve shifting, so that each pressure plate can press the chip under test of the chip test board 10 processor 12 and chip holder 13 each time it shifts. Alternatively, the fixed plate 21 can be clamped by a robotic arm, and the fixed plate 21 can be moved in a ring by the mechanical axis of the robotic arm, so that each pressure plate can press the chip under test of the chip test board 10 processor 12 and chip holder 13 each time it shifts. Of course, any other device that can shift the fixed plate 21 can also be used, which will not be described in detail here. In this way, after the chip under test on the chip test board 10 has completed the performance test at one temperature, the control circuit board 40 controls the displacement device to move, so that the chip under test on the same chip test board 10 can be quickly tested at another temperature, which greatly improves the chip testing efficiency.

[0050] In another embodiment of the present invention, the shifting device can also shift the first fixing component to position the chip test board 10 below the first telescopic device 22 and the second telescopic device 23, or to position the chip test board 10 below the third telescopic device 27 and the fourth telescopic device 28. In practical applications, multiple first fixing components are arranged in a row, and the shifting device moves multiple chip test boards 10 sequentially to below the fixing plate 21 in a manner similar to a conveyor belt. High-temperature and low-temperature tests are simultaneously performed on the two chip test boards directly below the fixing plate 21, thereby improving chip testing efficiency. This method is simple to set up and saves steps. The conveyor belt forms a displacement device, and after the chip test board 10 is tested, it can be quickly conveyed to the next process.

[0051] Combination Figure 4 As shown, in one embodiment of the present invention, a rotating shaft 25 can also be provided above the fixed plate 21, and the switching between high and low temperature tests can be achieved by rotating the fixed plate 21 around the rotating shaft 25.

[0052] In one embodiment of the present invention, the first telescopic device 22, the second telescopic device 23, the third telescopic device 27, and the fourth telescopic device 28 each include a linear piston cylinder. The cylinder bodies of the linear piston cylinders of the first telescopic device 22, the second telescopic device 23, the third telescopic device 27, and the fourth telescopic device 28 are respectively vertically fixed on the fixing plate 21 (or a structure fixedly connected to the fixing plate 21), and the first pressure plate 221, the second pressure plate 231, the third pressure plate 271, and the fourth pressure plate 281 are respectively fixed on the piston rod of the corresponding linear piston cylinder at the end away from the fixing plate 21. Furthermore, the extension and retraction strokes of the aforementioned linear piston cylinders are respectively adapted to the height of the processor 12 and the height of the chip under test on the chip mounting base 13. That is, at the maximum stroke position of the linear piston cylinders of the first extension device 22 and the third extension device 27, the lower surfaces of the first pressure plate 221 and the third pressure plate 271 are just attached to the lower surface of the processor 12; at the maximum stroke position of the linear piston cylinders of the second extension device 23 and the fourth extension device 28, the lower surfaces of the second pressure plate 231 and the fourth pressure plate 281 are just attached to the lower surface of the chip under test.

[0053] Accordingly, the drive device 26 includes an air source and solenoid valves for controlling the flow of gas into and out of each linear piston cylinder. By supplying air to the linear piston cylinders, the first pressure plate 221, the second pressure plate 231, the third pressure plate 271, and the fourth pressure plate 281 can be pressed down onto the surface of the corresponding chip; by releasing air from the linear piston cylinders, the first pressure plate 221, the second pressure plate 231, the third pressure plate 271, and the fourth pressure plate 281 can be moved upward. The linear piston cylinders and the corresponding drive devices are conventional technologies in the art and will not be described in detail here.

[0054] The linear telescopic cylinder and its corresponding drive device described above can realize the rapid extension and retraction of the first telescopic device 22, the second telescopic device 23, the third telescopic device 27, and the fourth telescopic device 28. The structure is simple and easy to maintain.

[0055] In another embodiment of the present invention, the first telescopic device 22, the second telescopic device 23, the third telescopic device 27, and the fourth telescopic device 28 each include a servo electric cylinder. The cylinder body of the servo electric cylinder of the first telescopic device 22, the second telescopic device 23, the third telescopic device 27, and the fourth telescopic device 28 is vertically fixed on the fixed plate 21 (or a structure fixedly connected to the fixed plate 21). The first pressure plate 221, the second pressure plate 231, the third pressure plate 271, and the fourth pressure plate 281 are respectively fixed on the lead screw of the corresponding servo electric cylinder at the end away from the fixed plate 21.

[0056] Accordingly, the drive unit 26 includes a drive module (e.g., an inverter circuit) for driving the motors of each servo electric cylinder. Servo electric cylinders and their corresponding drive modules are conventional technologies in the art and will not be described in detail here. Compared to solutions using linear piston cylinders, servo electric cylinder solutions offer more flexible control.

[0057] Specifically, when the first telescopic device 22, the second telescopic device 23, the third telescopic device 27, and the fourth telescopic device 28 each include a servo electric cylinder, pressure sensors are respectively installed on the first telescopic device 22, the second telescopic device 23, the third telescopic device 27, and the fourth telescopic device 28. For example, the pressure sensors can be installed on the corresponding pressure plates. These pressure sensors are electrically connected to the control circuit board 40, and when the control circuit board 40 controls the servo electric cylinder to press down, if the detection signal of the corresponding pressure sensor reaches a preset value (at which point the corresponding pressure plate has been pressed down to the surface of the chip), it controls the motor of the corresponding servo electric cylinder to stop running. This structure can prevent the processor 12 or the chip under test from being damaged.

[0058] In one embodiment of the present invention, the first pressure plate 221 and the second pressure plate 231 are respectively provided with a first temperature sensor electrically connected to the control circuit board 40. When the first temperature sensor reaches a first preset temperature and a preset time is reached (after the preset time, the processor 12 and the chip under test have reached the first preset temperature), the control circuit board 40 sends a start signal to the processor 12 on the chip test board 10, causing the processor 12 and the chip under test on the chip mounting bracket 13 to run a preset program to obtain the performance parameters of the chip under test at the first preset temperature. Since the processor 12 and the chip under test are located on the same chip test board 10, the temperature generated by the processor 12 during operation will also affect the ambient temperature of the chip under test, thereby making the obtained performance parameters of the chip under test closer to the performance parameters in real use scenarios.

[0059] Similarly, the third pressure plate 271 and the fourth pressure plate 281 are respectively provided with a second temperature sensor electrically connected to the control circuit board 40. When the second temperature sensor reaches the second preset temperature and reaches the preset time (after the preset time, the processor 12 and the chip under test have reached the second preset temperature), the control circuit board 40 sends a start signal to the processor 12 on the chip test board 10, so that the processor 12 and the chip under test on the chip holder 13 run a preset program to obtain the performance parameters of the chip under test at the second preset temperature.

[0060] Combination Figure 5As shown, in one embodiment of the present invention, a first heat insulation cover 29 is provided below the fixed plate 21. The first pressure plate 221 of the first telescopic device 22 and the second pressure plate 231 of the second telescopic device 23 are respectively located inside the first heat insulation cover 29. When the first telescopic device 22 and the second telescopic device 23 move downwards, the first heat insulation cover 29 follows the first pressure plate 221 and the second pressure plate 231 downwards and covers the chip test board 10. Through this structure, the enclosed space of the terminal can be simulated more realistically, further improving the accuracy of performance parameters.

[0061] Similarly, a second heat shield is provided below the fixed plate 21. The third pressure plate 271 of the third telescopic device 27 and the fourth pressure plate 281 of the fourth telescopic device 28 are located inside the second heat shield. When the third telescopic device 27 and the fourth telescopic device 28 move downward, the second heat shield moves downward with the third pressure plate 271 and the fourth pressure plate 281 and covers the chip test board 10.

[0062] like Figure 6 As shown in the figure, this embodiment of the invention also provides a chip testing method, which tests the chip through the following... Figures 1-5 The chip testing equipment shown tests the chip under test. The method specifically includes the following steps:

[0063] Step S61: Control the first fixing component to fix the chip test board in a preset position. The chip test board includes a processor and a chip holder for mounting the chip under test. The processor and the chip holder are integrated on the upper surface of the chip test board, and the chip under test mounted on the chip holder is electrically connected to the processor through the chip holder.

[0064] Step S62: When the first telescopic device and the second telescopic device are above the preset position, the control drive device drives the first telescopic device to press the first pressure plate down to the upper surface of the processor and drives the second telescopic device to press the second pressure plate down to the upper surface of the chip under test. One end of the first telescopic device and the second telescopic device are respectively fixed on the fixed plate, the first pressure plate is located at the other end of the first telescopic device, and the second pressure plate is located at the other end of the second telescopic device.

[0065] Step S63: Control the first heating device and the second heating device to heat the first pressure plate and the second pressure plate to the first preset temperature respectively. The first heating device and the second heating device are respectively installed on the first pressure plate and the second pressure plate.

[0066] Preferably, in addition to steps S61-S63, the above method further includes:

[0067] Step S64: Control the shifting device to position the first telescopic device and the second telescopic device above the chip test board, or to position the third telescopic device and the fourth telescopic device above the chip test board. One end of the third telescopic device and the fourth telescopic device are respectively fixed on the fixed plate, and the other end of the third telescopic device has a third pressure plate, and the other end of the fourth telescopic device has a fourth pressure plate.

[0068] Step S65: When the third telescopic device and the fourth telescopic device are above the chip test board, the control drive device drives the third telescopic device to press the third pressure plate down to the upper surface of the processor, and drives the fourth pressure plate to press down to the upper surface of the chip under test.

[0069] Step S66: Control the first and second cooling devices to cool the third and fourth pressure plates to the second preset temperature respectively, and send a start signal to the processor on the chip test board to make the processor and the chip under test on the chip holder run the preset program. The first cooling device is set on the third pressure plate and the second cooling device is set on the fourth pressure plate.

[0070] Preferably, a first temperature sensor is provided on the first pressure plate and the second pressure plate, and a second temperature sensor is provided on the third pressure plate and the fourth pressure plate.

[0071] Accordingly, step S63 includes: when the first temperature sensor reaches the first preset temperature and reaches the preset time, sending a start signal to the processor on the chip test board, so that the processor and the chip under test on the chip holder run a preset program.

[0072] Step S66 above includes: when the second temperature sensor reaches the second preset temperature and reaches the preset time, sending a start signal to the processor on the chip test board, so that the processor and the chip under test on the chip holder run a preset program.

[0073] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0074] The chip testing method in this embodiment is the same as... Figures 1-5 The chip testing equipment in the embodiments belongs to the same concept, and its specific implementation process can be found in the corresponding equipment embodiments. The technical features described in the equipment embodiments are all applicable to this equipment embodiment, and will not be repeated here.

[0075] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0076] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A chip testing device, characterized in that, include: A chip test board includes a processor and a chip holder for mounting a chip under test. The processor and the chip holder are integrated on the upper surface of the chip test board, and the chip under test mounted on the chip holder is electrically connected to the processor via the chip holder. The first fixing component includes a limiting device for fixing the chip test board in a preset position and a limiting detection device for detecting the limiting state of the chip test board. The second fixing component is located above the preset position and includes a fixing plate, a first telescopic device, a second telescopic device, a first heating device, a second heating device, and a driving device; one end of the first telescopic device and the second telescopic device are respectively fixed on the fixing plate, the other end of the first telescopic device has a first pressure plate, the other end of the second telescopic device has a second pressure plate, the first heating device is disposed on the first pressure plate, and the second heating device is disposed on the second pressure plate. The control circuit board is electrically connected to the limiting device, the limiting detection device, the first heating device, the second heating device, and the driving device, respectively. The limiting device is limited under the control of the control circuit board. The limiting detection device sends a limiting success command to the control circuit board when the chip test board is limited to a preset position. The driving device drives the first telescopic device to press the first pressure plate down onto the upper surface of the processor and drives the second telescopic device to press the second pressure plate down onto the upper surface of the chip under test, respectively, under the control of the control circuit board. The first heating device and the second heating device heat the first pressure plate and the second pressure plate to a first preset temperature, respectively, under the control of the control circuit board. The second fixing component also includes a third telescopic device, a fourth telescopic device, and a displacement device; one end of the third telescopic device and the fourth telescopic device are respectively fixed to the fixing plate, and the other end of the third telescopic device has a third pressure plate, and the other end of the fourth telescopic device has a fourth pressure plate. A first cooling device is provided on the third pressure plate, and a second cooling device is provided on the fourth pressure plate. The control circuit board is electrically connected to the first cooling device, the second cooling device, and the shifting device, respectively. Under the control of the control circuit board, the shifting device positions the first telescopic device and the second telescopic device above the chip test board, or positions the third telescopic device and the fourth telescopic device above the chip test board. Under the control of the control circuit board, the driving device drives the third telescopic device located above the chip test board to press the third pressure plate down onto the upper surface of the processor, and drives the fourth telescopic device to press the fourth pressure plate down onto the upper surface of the chip under test. Under the control of the control circuit board, the first cooling device and the second cooling device respectively keep the pressure plates of the third telescopic device and the fourth telescopic device at a second preset temperature.

2. The chip testing equipment according to claim 1, characterized in that, The shifting device drives the fixed plate to shift, so that the first telescopic device and the second telescopic device are located above the chip test board, or so that the third telescopic device and the third telescopic device are located above the chip test board.

3. The chip testing equipment according to claim 1, characterized in that, The shifting device drives the first fixing component to shift, so that the chip test board is located below the first telescopic device and the second telescopic device, or the chip test board is located below the third telescopic device and the fourth telescopic device.

4. The chip testing equipment according to any one of claims 1-3, characterized in that, The first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device each include a linear piston cylinder; The cylinder bodies of the linear piston cylinders of the first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device are respectively vertically fixed on the fixed plate. The first pressure plate, the second pressure plate, the third pressure plate, and the fourth pressure plate are respectively fixed on the piston rod of the corresponding linear piston cylinder at the end away from the fixed plate. The telescopic stroke of the linear piston cylinder is adapted to the height of the chip under test on the processor and chip mounting base. The drive device includes an air source and solenoid valves for controlling the gas from the air source to enter and exit each linear piston cylinder.

5. The chip testing equipment according to any one of claims 1-3, characterized in that, The first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device each include a servo electric cylinder. The cylinder body of the servo electric cylinder of the first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device is vertically fixed on the fixed plate. The first pressure plate, the second pressure plate, the third pressure plate, and the fourth pressure plate are respectively fixed on the end of the lead screw of the corresponding servo electric cylinder away from the fixed plate. The drive unit includes a drive module for driving the motors of each servo cylinder.

6. The chip testing equipment according to claim 5, characterized in that, Pressure sensors are respectively installed on the first telescopic device, the second telescopic device, the third telescopic device, and the fourth telescopic device. The pressure sensors are electrically connected to the control circuit board. When the control circuit board controls the first telescopic device, the second telescopic device, the third telescopic device, or the fourth telescopic device to press down, if the detection signal of the pressure sensor reaches a preset value, it controls the motor of the corresponding servo electric cylinder to stop running.

7. The chip testing equipment according to any one of claims 1-3, characterized in that, The first pressure plate and the second pressure plate are respectively provided with a first temperature sensor electrically connected to the control circuit board. When the first temperature sensor reaches a first preset temperature and a preset time, the control circuit board sends a start signal to the processor on the chip test board, so that the processor and the chip under test on the chip holder run a preset program. The third and fourth pressure plates are respectively provided with a second temperature sensor electrically connected to the control circuit board. When the second temperature sensor reaches a second preset temperature and a preset time, the control circuit board sends a start signal to the processor on the chip test board, so that the processor and the chip under test on the chip holder run a preset program.

8. The chip testing equipment according to any one of claims 1-3, characterized in that, The fixed plate is provided with a first heat insulation cover and a second heat insulation cover below it; the first pressure plate and the second pressure plate are respectively located inside the first heat insulation cover, and the first heat insulation cover follows the first pressure plate and the second pressure plate downwards and covers the chip test board; the third pressure plate and the fourth pressure plate are respectively located inside the second heat insulation cover, and the second heat insulation cover follows the third pressure plate and the fourth pressure plate downwards and covers the chip test board.

9. A method for chip testing using the chip testing equipment as described in any one of claims 1-8, characterized in that, include: The first fixing component is controlled to fix the chip test board in a preset position. The chip test board includes a processor and a chip mounting base for mounting the chip under test. The processor and the chip mounting base are integrated on the upper surface of the chip test board, and the chip under test mounted on the chip mounting base is electrically connected to the processor through the chip mounting base. Control the shifting device to position the first telescopic device and the second telescopic device above the chip test board, or to position the third telescopic device and the fourth telescopic device above the chip test board. When the first telescopic device and the second telescopic device are located above the chip test board, the control drive device drives the first telescopic device to press the first pressure plate down onto the upper surface of the processor and drives the second telescopic device to press the second pressure plate down onto the upper surface of the chip under test. One end of the first telescopic device and the second telescopic device are respectively fixed on the fixed plate, the first pressure plate is located at the other end of the first telescopic device, and the second pressure plate is located at the other end of the second telescopic device. The first heating device and the second heating device are controlled to heat the first pressure plate and the second pressure plate to a first preset temperature, and a start signal is sent to the processor on the chip test board to make the processor and the chip under test on the chip holder run a preset program. The first heating device and the second heating device are respectively set on the first pressure plate and the second pressure plate. When the third telescopic device and the fourth telescopic device are located above the chip test board, the control drive device drives the third telescopic device to press the third pressure plate down to the upper surface of the processor and drives the fourth pressure plate to press down to the upper surface of the chip under test; one end of the third telescopic device and the fourth telescopic device are respectively fixed on the fixed plate, and the other end of the third telescopic device has a third pressure plate, and the other end of the fourth telescopic device has a fourth pressure plate. The first and second refrigeration devices are controlled to cool the third and fourth pressure plates to a second preset temperature, and a start signal is sent to the processor on the chip test board to enable the processor and the chip under test on the chip holder to run a preset program. The first refrigeration device is set on the third pressure plate, and the second refrigeration device is set on the fourth pressure plate.

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