Wafer carrying mechanism

Abstract

This invention relates to the field of semiconductor equipment technology, and in particular to a wafer carrier mechanism, comprising an isolation component base and a carrier component; the isolation component base includes an outer frame and a swing arm, an inner connecting plate is mounted on the upper end of the swing arm, the inner connecting plate is fixed to the lower end of a rotating shaft lever, and the upper end of the rotating shaft lever extends from the center of the top surface of the outer frame; a motor assembly is mounted at the bottom of the outer frame, the motor assembly is connected to a rotating rotor located below the outer frame, the rotating rotor is provided with a transmission component, and the transmission component forms a transmission connection with the lower end of the swing arm; a photoelectric switch mounting block is also provided at the bottom of the outer frame, and a photoelectric switch is mounted on its upper part; the carrier component includes an isolation component mounting plate, on which an isolation component mounting head is fixed; an isolation component is fixed on the top of the isolation component mounting head, a guide rail mounting plate is fixed on the lower front side of the isolation component mounting plate, and a linear guide rail is mounted on the guide rail mounting plate; the upper rear side of the isolation component mounting plate is connected to the upper part of the rotating shaft lever through a connector.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment technology, and in particular to a wafer carrier mechanism. Background Technology

[0002] With economic development and social progress, people's demand for precision electronic instruments is increasing day by day, and the development of integrated circuits is particularly rapid. As a basic material for integrated circuits, wafers are playing an increasingly important role in modern production.

[0003] SOI wafers (Silicon On Insulator, referring to a structure where silicon single crystals are formed on an insulator) are a newly developed chip manufacturing method that has received increasing attention from chip manufacturers both domestically and internationally in recent years. Research on SOI wafer bonding equipment can effectively improve the product quality of SOI wafers and at the same time compensate for the lack of domestically produced equipment.

[0004] Spacers, as a crucial component of the alignment / bonding unit in SOI wafer bonding equipment, directly influence the alignment and bonding process and have a significant impact on wafer bonding quality. The primary function of spacers is to transport and support the upper and lower wafers during the SOI wafer bonding process. Furthermore, by controlling the sequential movement of spacers during wafer bonding, accurate wafer positioning is ultimately achieved.

[0005] CN1485883 discloses a semiconductor manufacturing machine, comprising multiple stations divided into general areas and isolated areas, a first wafer carrier container for transporting wafers in the isolated areas, a second wafer carrier container for transporting wafers in the general areas, and a wafer exchange mechanism; each station in the isolated areas is provided with a first receiving port for receiving wafers entering the first wafer carrier container of that station; each station in the general areas is provided with a second receiving port for receiving wafers entering the second wafer carrier container of that station; the first and second wafer carrier containers each include a top cover with several engagement holes and a base with several engagement components and engagement grooves corresponding to the engagement holes on the top cover; the top surfaces of the first and second receiving ports are respectively provided with two first and two pins, each containing a first and a second rotation mechanism for rotating the first and second pins; the rotation direction of the first rotation mechanism in the first receiving port is opposite to the rotation direction of the second rotation mechanism in the second receiving port; the starting point of the rotation of the engagement groove on the base of the first wafer carrier container is opposite to the starting point of the rotation of the engagement groove on the second wafer carrier container. The chassis of the first and second wafer carrier containers each include a main body that movably houses several engaging components and a rotating component rotatably disposed on the main body; two engaging grooves are formed on the rotating component to drive the engaging components to move within the main body as it rotates. Two first linkages and two second linkages are movably disposed on the chassis of the first and second wafer carrier containers, abutting against the rotating components; the second linkages are connected to the first linkages and the engaging components. The rotating component has a protrusion; the first linkages have a recess corresponding to the protrusion of the rotating component.

[0006] Currently available machines on the market often use complex shafts and connectors, resulting in a large overall structural space and numerous control components, which can easily lead to instability in the motion process. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide a wafer carrier mechanism.

[0008] To address the aforementioned technical problems, this application provides the following technical solution:

[0009] A wafer carrier mechanism includes an isolation component base and a carrier component;

[0010] The isolation component base includes an outer frame and a vertical swing rod that passes through the bottom surface of the outer frame. An inner connecting plate is installed on the top of the upper end of the swing rod. The upper surface of the inner connecting plate is fixed to the lower end of the rotating shaft lever. The upper end of the rotating shaft lever protrudes from the center of the top surface of the outer frame.

[0011] A motor unit is installed on the bottom upper surface of the outer frame. The motor unit is connected to a rotating rotor located below the outer frame. A transmission component is provided on the rotating rotor. The transmission component forms a transmission connection with the lower end of the swing arm.

[0012] The bottom upper surface of the outer frame is also provided with a photoelectric switch mounting block, and a photoelectric switch is mounted on the top of the photoelectric switch mounting block;

[0013] The supporting component includes an isolation component mounting plate, an isolation component mounting head is fixed to the upper part of the isolation component mounting plate; an isolation component is fixed to the top of the isolation component mounting head; a guide rail mounting plate is fixed to the lower front side of the isolation component mounting plate, and a linear guide rail is mounted on the guide rail mounting plate.

[0014] The upper rear side of the isolation component mounting plate is connected to the upper part of the rotating shaft lever via a connector.

[0015] Furthermore, the upper surface of the inner connecting plate is fixed to one end of the vacuum-sealed bellows, and the other end of the vacuum-sealed bellows is fixed to the top surface of the outer frame. A rotating shaft lever is provided inside the vacuum-sealed bellows.

[0016] Furthermore, the connection between the pivot lever and the top surface of the outer frame is provided with a sealing O-ring.

[0017] Furthermore, a first rotating bearing is mounted on one side of the outer frame, and the first rotating bearing is fixed by a first bearing pin.

[0018] Furthermore, the swing arm is in the shape of an "I".

[0019] Furthermore, the transmission component and the lower end of the swing rod are connected by friction transmission or gear transmission.

[0020] Furthermore, the transmission component is a friction O-ring, and a locking screw is installed between the rotating rotor and the bottom lower surface of the outer frame; the side of the friction O-ring contacts one side of the lower end of the swing rod.

[0021] The other side of the lower end of the swing arm is in contact with the second rotating bearing. The second rotating bearing is fixed to the lower surface of the mounting base plate by the bearing clamping block and is fixed by the second bearing pin.

[0022] Furthermore, the upper rear side of the isolation component mounting plate is fixed to one end of the connector with screws, and the other end of the connector is fixed to the upper part of the rotating shaft lever with a rubber ring.

[0023] Furthermore, the outer frame is a rectangular frame, which is formed by the mounting base plate, two component support plates located on both sides of the upper surface of the mounting base plate, and two "L"-shaped mounting and fixing plates located above the component support plates, which are connected to each other.

[0024] Furthermore, the isolation component adopts a pin-type structure, with one end being conical and the upper surface being a smooth, arc-shaped bearing surface.

[0025] Compared with the prior art, the present invention has at least the following beneficial effects:

[0026] The photoelectric switch of the wafer carrier mechanism of this invention can control and monitor the position of the isolation component. The motor group, rotating rotor, rotating parts, connecting parts and rotating shaft adopt multi-stage transmission, with no direct contact parts, so it will not cause damage to the wafer itself.

[0027] The motor unit used in the wafer carrier mechanism of this invention is a DC micro-motor with relatively low torque. Through the configuration of the motor unit and photoelectric switch, it can stop at a precise position. Even if the thrust generated by the motor unit during operation is large, it can be compensated for by slippage during O-ring friction. During the return stroke, the isolation component moves in the return direction together with the motor unit via a flexible connector. The stop is achieved when the baffle on the swing arm blocks the photoelectric switch.

[0028] Compared with commonly used machines, the wafer carrier mechanism of the present invention eliminates its complex rotating shafts and connectors, resulting in a smaller overall structural space occupation, better integration into the bottom of a unit, and a reduction in the number of motion control components, making it more stable during operation.

[0029] The wafer carrier mechanism of the present invention will be further described below with reference to the accompanying drawings. Attached Figure Description

[0030] Figure 1 This is a schematic diagram showing the distribution of the wafer carrier mechanism on the wafer carrier chuck of the present invention;

[0031] Figure 2 A schematic diagram of the slot positioning device;

[0032] Figure 3 This is a schematic diagram of the structure of the isolation component base of the wafer carrier mechanism of the present invention;

[0033] Figure 4 This is a schematic diagram of the structure of the support component of the wafer support mechanism of the present invention;

[0034] Figure 5 This is a schematic diagram showing the connection relationship between the isolation component base and the supporting component;

[0035] Figure 6 A schematic diagram (top view) showing the connection relationship between the isolation component base and the supporting component;

[0036] Figure 7 This is a schematic diagram of the isolation component.

[0037] Among them, 100-wafer carrier mechanism; 101-slot positioning device; 102-cylindrical core; 103-isolation component base; 104-carrying component; 105-connector; 106-rubber ring;

[0038] 1-Mounting plate; 2-First rotating bearing; 3-First bearing pin; 4-Inner connecting plate; 5-Component support plate; 6-Swing rod; 7-Mounting base plate; 8-Bearing clamping block; 9-Second rotating bearing; 10-Second bearing pin; 11-Rotating rotor; 12-Friction O-ring; 13-Locking set screw; 14-Photoelectric switch mounting block; 15-Photoelectric switch; 16-Motor assembly; 17-Vacuum sealing bellows; 18-Sealing O-ring; 19-Rotating shaft lever; 20-Isolation component; 21-Isolation component mounting head; 22-Isolation component mounting plate; 23-Guide rail mounting plate; 24-Linear guide rail. Detailed Implementation

[0039] like Figure 1 and Figure 5-6 As shown, a wafer carrier mechanism 100 includes an isolation component base 103 and a carrier component 104.

[0040] like Figure 3 As shown, the isolation component base 103 includes a rectangular outer frame, which is an overall external frame formed by the mounting base plate 7, two component support plates 5 located on both sides of the upper surface of the mounting base plate 7, and two "L"-shaped mounting fixing plates 1 located above the component support plates 5.

[0041] The swing rod 6 is I-shaped, with its vertical section passing through the bottom surface of the rectangular outer frame. An inner connecting plate 4 is mounted on the top of the swing rod 6. The upper surface of the inner connecting plate 4 is fixed to one end of the vacuum-sealed bellows 17, and the other end of the vacuum-sealed bellows 17 is fixed to the top surface of the rectangular outer frame. A rotating shaft lever 19 is located inside the vacuum-sealed bellows 17. The lower end of the rotating shaft lever 19 is fixed to the inner connecting plate 4, and the upper end of the rotating shaft lever 19 protrudes from the center of the top surface of the rectangular outer frame. A sealing O-ring 18 is provided at the connection between the rotating shaft lever 19 and the top surface of the rectangular outer frame. The vacuum-sealed bellows 17 can be compressed for vacuum sealing of the interior of the chamber.

[0042] The upper surface of the inner connecting plate 4 is provided with an integrally formed upright plate. The upright plate of the inner connecting plate 4 is pinned to the inner side of the mounting and fixing plate 1 by the first bearing pin 3. A first rotating bearing 2 is provided between the upright plate of the inner connecting plate 4 and the first bearing pin 3, which allows the inner connecting plate 4 to rotate within a small range around the first bearing pin 3.

[0043] A motor assembly 16 is mounted on the upper surface of the mounting base plate 7. The motor assembly 16 is connected to a rotating rotor 11 located on the lower surface of the mounting base plate 7. A friction O-ring 12 is fitted onto the rotating rotor 11 (the friction O-ring 12 is installed in the mounting groove of the rotating rotor 11). A locking screw 13 is installed between the rotating rotor 11 and the lower surface of the mounting base plate 7. The side of the friction O-ring 12 contacts one side of the lower end of the swing rod 6. The other side of the lower end of the swing rod 6 contacts the second rotating bearing 9. The second rotating bearing 9 is fixed to the lower surface of the mounting base plate 7 by a bearing clamping block 8 and a second bearing pin 10. The main function of the second rotating bearing 9 is to fix the swing rod 6 in the center position to prevent deviation and smoothly realize the swing process during the motion of the motor assembly 16 driving the friction O-ring 12 to rotate. The motor assembly 16 is a DC micro motor.

[0044] The upper surface of the mounting base plate 7 is also provided with a photoelectric switch mounting block 14. An L-shaped photoelectric switch 15 is installed above the photoelectric switch mounting block 14. The photoelectric switch 15 transmits a stop signal after being blocked by a baffle (the baffle is located in the middle part of the swing rod 6, that is, below the photoelectric switch 15, and can move into the U-shaped groove of the photoelectric switch during the swing to block the transmission of the signal and thus stop the action). Its function is to control the insertion and withdrawal position of the isolation component 20 by limiting the forward and backward swing position of the swing rod 6.

[0045] like Figure 4 As shown, the supporting component 104 includes an isolation component mounting plate 22. An isolation component mounting head 21 is fixed to the upper part of the isolation component mounting plate 22 by screws. The fixing position of the isolation component mounting head 21 can be adjusted by adjusting the position of the screws. An isolation component 20 is fixed to the top of the isolation component mounting head 21. A guide rail mounting plate 23 is fixed to the lower front side of the isolation component mounting plate 22, and a linear guide rail 24 is mounted on the guide rail mounting plate 23. The height of the isolation component 20 can be adjusted by the fixing position of the isolation component mounting head 21.

[0046] like Figure 5-6 As shown, the upper rear side of the isolation component mounting plate 22 is fixed to one end of the connector 105 by screws, and the other end of the connector 105 is fixed to the upper part of the rotating shaft lever 19 by a rubber ring 106.

[0047] like Figure 7 As shown, the isolation component 20 adopts a pin-type structure, with one end being a conical structure and the upper surface being a smooth arc-shaped bearing surface, which facilitates the retraction of the isolation component 20 after bearing is completed. At the same time, the material of the isolation component 20 can be PEEK material (semi-crystalline aromatic plastic engineering plastic), which does not damage the wafer.

[0048] The working method of this wafer carrier mechanism:

[0049] The motor unit 16 rotates, driving the friction O-ring 12 to rotate. The friction O-ring 12 drives the swing rod 6 forward or backward through friction. The swing rod 6 then drives the rotating shaft lever 19 forward or backward, thereby controlling the insertion and withdrawal of the isolation component 20 by driving the connecting piece 105. During this process, the amplitude and distance of the swing rod 6's forward and backward swing are controlled by a photoelectric switch, ultimately achieving precise position control. When the isolation component 20 is withdrawn, the bearing component 104 can be driven by the spring inside the linear guide 24 to push back along the linear guide 24.

[0050] When the baffle on the swing arm 6 blocks the signal from the photoelectric switch 15, the motor assembly 16 stops rotating. Under the frictional force of the friction O-ring 12, the mechanism will remain stationary. Through the rotation of the motor assembly 16 and the position monitoring of the photoelectric switch 15, the extension and retraction of the isolation component 20 is ultimately achieved.

[0051] During the return journey, the isolation assembly moves in the return direction together with the motor assembly 16 via the flexible connector 105, stopping upon contacting the photoelectric switch. Specifically, the motor assembly 16 rotates, causing the friction O-ring 12 to rub against the swing rod 6 in the opposite direction. The swing rod 6 stops after the baffle on the swing rod 6 blocks the photoelectric switch. Simultaneously, the isolation assembly is driven back to its original position by the flexible connector 105 (connected by the rubber ring 106).

[0052] This mechanism primarily utilizes oscillation to transmit motion. The reason for not using a direct connection method is that if the motor directly drives the components, the motor assembly cannot provide feedback in special circumstances, which could cause the moving parts to scratch the wafer. By using the multi-stage transmission of this mechanism, all connections are set as soft connections through the transmission of a series of components such as bearings and O-rings, thereby effectively avoiding direct damage to the wafer.

[0053] In other advantageous embodiments, the transmission method between the friction O-ring 12 and the swing rod 6 can also be adjusted to gear transmission. For example, the friction O-ring 12 can be replaced with a gear, and a toothed groove can be formed on the side of the swing rod 6 at the corresponding position, thus becoming gear transmission. The application of this wafer carrier mechanism is as follows: Figure 1-2 As shown, in the process chamber, the isolation of a single wafer is achieved through the wafer carrier mechanism 100, specifically as follows:

[0054] After cleaning, the single wafer is supported and isolated by three sets of wafer carrier mechanisms 100 to prevent two cleaned SOI wafers from contacting each other before the alignment process is completed. The isolation components in the three wafer carrier mechanisms 100 are simultaneously inserted into the wafer carrier by a motor unit, and the wafers are sequentially pulled out according to the process settings to control their descent. This is coordinated with the two clamping components integrated on the wafer carrier chuck (located in...). Figure 1 The two wafer carrier mechanisms 100 on the right side of the middle section are used to align and position the two wafers respectively, and the guide and slot positioning device 101 (located next to the two wafer carrier mechanisms 100 on the right side of the middle section) is ... Figure 1 (Next to the wafer support mechanism 100 on the left side) to reduce the offset of the wafer during gravity fall. For example... Figure 2 As shown, the slot positioning device 101 is provided with a cylindrical core 102 for positioning and guiding.

[0055] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A wafer carrier mechanism, characterized in that: It includes an isolation component base (103) and a bearing component (104); The isolation component base (103) includes an outer frame and a swing rod (6) vertically passing through the bottom surface of the outer frame. An inner connecting plate (4) is installed at the top of the upper end of the swing rod (6). The upper surface of the inner connecting plate (4) is fixed to the lower end of a rotating shaft lever (19), and the upper end of the rotating shaft lever (19) passes through the center of the top surface of the outer frame; On the upper surface of the bottom of the outer frame, a motor group (16) is installed. The motor group (16) is connected to a rotating rotor (11) located below the outer frame. A transmission member is provided on the rotating rotor (11), and the transmission member is in transmission connection with the lower end of the swing rod (6); On the upper surface of the bottom of the outer frame, there is also an optoelectronic switch mounting block (14), and an optoelectronic switch (15) is installed above the optoelectronic switch mounting block (14); The bearing component (104) includes an isolation component mounting plate (22). An isolation component mounting head (21) is fixed to the upper part of the isolation component mounting plate (22); An isolation component (20) is fixed to the top of the isolation component mounting head (21). A guide rail mounting plate (23) is fixed to the front side of the lower part of the isolation component mounting plate (22), and a linear guide rail (24) is installed on the guide rail mounting plate (23); The rear side of the upper part of the isolation component mounting plate (22) is connected to the upper part of the rotating shaft lever (19) through a connecting member; Through the rotation of the motor group (16) and the position monitoring of the optoelectronic switch (15), the telescopic action of the isolation component (20) is finally realized.

2. The wafer carrier mechanism according to claim 1, characterized in that: The upper surface of the inner connecting plate (4) is fixed to one end of a vacuum sealing bellows (17). The other end of the vacuum sealing bellows (17) is fixed to the top surface of the outer frame. The rotating shaft lever (19) is provided inside the vacuum sealing bellows (17).

3. The wafer carrier mechanism according to claim 2, characterized in that: A sealing O-ring (18) is provided at the connection part between the rotating shaft lever (19) and the top surface of the outer frame.

4. The wafer carrier mechanism according to claim 3, characterized in that: A first rotating bearing (2) is installed on one side surface of the outer frame, and the first rotating bearing (2) is fixed through a first bearing pin shaft (3).

5. The wafer carrier mechanism according to claim 4, characterized in that: The swing rod (6) is in an "I" shape.

6. The wafer carrier mechanism according to claim 5, characterized in that: The transmission between the transmission member and the lower end of the swing rod (6) is friction transmission or gear transmission.

7. The wafer carrier mechanism according to claim 6, characterized in that: The transmission member is a friction O-ring (12). A locking set screw (13) is installed between the rotating rotor (11) and the lower surface of the bottom of the outer frame; The side surface of the friction O-ring (12) is in contact with one side surface of the lower end of the swing rod (6); The other side surface of the lower end of the swing rod (6) is in contact with a second rotating bearing (9). The second rotating bearing (9) is fixed to the lower surface of the mounting base plate (7) through a bearing pressing block (8), and the second rotating bearing (9) is fixed through a second bearing pin shaft (10).

8. The wafer carrier mechanism according to claim 7, characterized in that: The rear side of the upper part of the isolation component mounting plate (22) is fixed to one end of a connecting member (105) through a screw, and the other end of the connecting member (105) is fixed to the upper part of the rotating shaft lever (19) through a rubber ring (106).

9. The wafer carrier mechanism according to claim 8, characterized in that: The outer frame is a rectangular outer frame, which is formed by enclosing and connecting an installation base plate (7), two component support plates (5) located on both sides of the upper surface of the installation base plate (7), and two "L"-shaped installation fixing plates (1) located above the component support plates (5).

10. The wafer carrier mechanism according to claim 9, characterized in that: The isolation component (20) adopts a pin-type structure, with one end being conical and the upper surface being a smooth arc-shaped bearing surface.

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