Wafer pin lifting mechanism and anti-falling control method

Abstract

The present application relates to wafer PIN lifting technical field, especially in a kind of wafer PIN lifting mechanism and anti-falling control method.The wafer PIN lifting mechanism of the present application includes: support assembly, lifting assembly, PIN assembly and anti-falling assembly, lifting assembly and anti-falling assembly are all set on support assembly, lifting assembly includes lifting drive part and slide rail, slide rail is used to set PIN assembly, to drive PIN assembly to lift;Wherein, slide rail includes: first limit position and second limit position, when slide rail is driven to its first limit position by lifting drive part, anti-falling assembly is pressed to slide rail, to prevent slide rail from driving PIN assembly to fall off;When slide rail is driven to move from first limit position to second limit position by lifting drive part, anti-falling assembly releases slide rail, to make slide rail can drive PIN assembly to descend.In the present application, by setting anti-falling assembly, the stability and security of wafer PIN lifting mechanism are improved.

Description

Technical Field

[0001] This invention relates to the field of wafer PIN lifting technology, and in particular to a wafer PIN lifting mechanism and an anti-drop control method. Background Technology

[0002] The integrated circuit industry is developing rapidly, and the requirements for the yield of chip products are increasing. As a mechanism for lifting and lowering the wafer in the wafer alignment process, the wafer PIN lifting mechanism plays a vital role in wafer alignment.

[0003] Existing wafer PIN lifting mechanisms include an electric cylinder and a PIN assembly. The PIN assembly is mounted on a slide rail of the electric cylinder, which moves the PIN assembly up and down via the slide rail. The PIN assembly is then used to pick up the wafer via a vacuum suction cup. However, existing wafer PIN lifting mechanisms rely solely on the electric cylinder to lift the PIN assembly, resulting in insufficient lifting force and poor lifting stability. Furthermore, in abnormal situations, such as power outages, the electric cylinder may malfunction, potentially causing the PIN assembly and wafer to fall, posing a safety risk. Summary of the Invention

[0004] This invention provides a wafer PIN lifting mechanism and an anti-drop control method to solve at least one of the above-mentioned technical problems.

[0005] This invention provides a wafer PIN lifting mechanism, comprising: a support component, a lifting component, a PIN component, and an anti-detachment component, wherein the lifting component and the anti-detachment component are both disposed on the support component.

[0006] The lifting assembly includes a lifting drive and a slide rail. The slide rail is used to mount the PIN assembly so as to drive the PIN assembly to move up and down.

[0007] The slide rail includes: a first extreme position and a second extreme position.

[0008] When the slide rail is driven to its first limit position by the lifting drive component, the anti-drop component presses against the slide rail to prevent the slide rail from causing the PIN component to fall off.

[0009] When the slide rail is driven by the lifting drive to move from the first extreme position to the second extreme position, the anti-drop component releases the slide rail so that the slide rail can drive the PIN component to descend.

[0010] In one embodiment, the anti-detachment component includes an anti-detachment cylinder and a blocking block. The anti-detachment cylinder is disposed on the support component, and the blocking block is disposed at the end of the telescopic rod of the anti-detachment cylinder.

[0011] When the slide rail is driven to its first limit position by the lifting drive, the anti-drop cylinder drives its telescopic rod to extend so that the blocking block presses against the slide rail, thereby preventing the slide rail from causing the PIN component to fall.

[0012] When the slide rail is driven by the lifting drive to move from the first extreme position to the second extreme position, the blocking block releases the slide rail so that the slide rail can drive the PIN component to descend.

[0013] In one embodiment, the blocking block is made of rubber material.

[0014] In one embodiment, the system further includes an elastic component, the extension direction of which is parallel to the movement direction of the slide rail, one end of which is connected to the support component, and the other end of which is connected to the slide rail.

[0015] Wherein, the slide rail is located at its second limit position, and the elastic component is in a stretched state;

[0016] When the slide rail is at its first extreme position, the elastic component is in a free state or a stretched state.

[0017] In one embodiment, the elastic component includes a first elastic element and a second elastic element, the first elastic element and the second elastic element being respectively disposed on both sides of the slide rail.

[0018] The two ends of the first elastic element and the two ends of the second elastic element are respectively connected to the support assembly and the corresponding side of the slide rail.

[0019] In one embodiment, the support assembly includes a column with a first hanging plate on it, a second hanging plate on the top of the slide rail, and third hanging plates extending vertically from both ends of the second hanging plate.

[0020] The first hanging plate has a first connecting post at each end, and the lower parts of the two third hanging plates have a second connecting post.

[0021] The two ends of the first elastic element and the two ends of the second elastic element are respectively connected to the first connecting post and the second connecting post on the same side.

[0022] In one embodiment, the support assembly further includes a base and a support plate, the support plate being adjustablely connected to the base.

[0023] Both the lifting assembly and the column are mounted on the support plate, and the anti-falling assembly is mounted on the column.

[0024] In one embodiment, a photoelectric sensor is provided on the housing of the lifting drive component, and a light-shielding plate that cooperates with the photoelectric sensor is provided on the slide rail.

[0025] When the slide rail moves to the second limit position, the light-shielding plate moves with the slide rail to a position corresponding to the photoelectric sensor, so that the photoelectric sensor can detect the photoelectric change.

[0026] In one embodiment, the lifting assembly further includes a fixed rail, which is disposed on the support assembly, and the slide rail is slidably connected to the fixed rail.

[0027] The present invention also provides an anti-detachment control method, applied to the above-mentioned wafer PIN lifting mechanism, comprising the following steps:

[0028] Air is supplied to the anti-detachment cylinder, causing the extension rod of the anti-detachment cylinder to retract the blocking block.

[0029] When the slide rail is driven to its first limit position by the lifting drive, the air supply to the anti-drop cylinder is stopped, causing the extension rod of the anti-drop cylinder to drive the blocking block to extend and press the slide rail, thereby preventing the slide rail from causing the PIN assembly to fall off.

[0030] Compared with the prior art, the advantages of the present invention are as follows: In the present invention, by setting an anti-drop component to press the slide rail in the air-cut state, it can prevent the lifting drive component from driving the slide rail and PIN component to rise to the upper limit position (first limit position) due to abnormal conditions (such as power failure) and thus improve the stability and safety of the wafer PIN lifting mechanism. Attached Figure Description

[0031] The invention will now be described in more detail with reference to embodiments and the accompanying drawings.

[0032] Figure 1 This is a schematic diagram of the wafer PIN lifting mechanism of the present invention. Figure 1 ;

[0033] Figure 2 This is a schematic diagram of the wafer PIN lifting mechanism of the present invention. Figure 2 ;

[0034] Figure 3 This is a schematic diagram of the anti-fall-off component and the lifting component of the present invention;

[0035] Figure 4 This is a schematic cross-sectional view of the mounting structure of the wafer PIN lifting mechanism of the present invention, including the support plate and the base.

[0036] Figure 5 This is a flowchart of the anti-detachment control method of the present invention.

[0037] Figure label:

[0038] 1-Lifting drive component; 2-Slide rail; 3-Blocking block; 4-Anti-fall cylinder;

[0039] 5-PIN assembly; 6-First elastic element; 7-Second elastic element; 8-Post;

[0040] 9-Base; 10-Panel; 11-First hanging plate; 12-Second hanging plate;

[0041] 13-Third mounting plate; 14-Photoelectric sensor; 15-Light shield;

[0042] 51-PIN stent; 52-PIN body; 53-main airway; 54-bronchus;

[0043] 91-Base plate; 92-Mounting plate; 93-Bearing stop; 94-Adjusting support;

[0044] 95-Fixing block; 96-Knob; 97-Shaft; 98-Bearing. Detailed Implementation

[0045] The invention will now be further described with reference to the accompanying drawings.

[0046] like Figure 1-4 As shown, the present invention provides a wafer PIN lifting mechanism to solve the problems of low lifting force and poor lifting stability during the lifting process of the wafer PIN lifting mechanism.

[0047] The wafer PIN lifting mechanism includes a support assembly, a lifting assembly, a PIN assembly 5, and an anti-drop assembly. Both the lifting assembly and the anti-drop assembly are mounted on the support assembly. The lifting assembly includes a lifting drive 1 and a slide rail 2. The slide rail 2 is used to mount the PIN assembly 5, thereby driving the PIN assembly 5 to lift and lower.

[0048] The slide rail 2 includes a first limit position and a second limit position. When the slide rail 2 is driven to its first limit position by the lifting drive 1, the anti-drop component presses the slide rail 2 to prevent the slide rail 2 from causing the PIN component 5 to fall off. When the slide rail 2 is driven to move from the first limit position to the second limit position by the lifting drive 1, the anti-drop component releases the slide rail 2 so that the slide rail 2 can cause the PIN component 5 to descend.

[0049] It should be noted that the first limit position of slide rail 2 is its upper limit position, and the second limit position of slide rail 2 is its lower limit position. In other words, in practical applications, the lifting drive component 1 drives slide rail 2 to move up and down in the vertical direction, thereby driving PIN component 5 to rise and fall.

[0050] In this invention, by setting an anti-drop component to press the slide rail 2 in the air-off state, it can prevent the lifting drive component 1 from lifting the slide rail 2 and PIN component 5 to the upper limit position (first limit position) due to abnormal conditions (such as power failure) and thus improve the stability and safety of the wafer PIN lifting mechanism.

[0051] In one embodiment, the anti-drop component includes an anti-drop cylinder 4 and a blocking block 3. The anti-drop cylinder 4 is mounted on the support assembly, and the blocking block 3 is mounted at the end of the telescopic rod of the anti-drop cylinder 4. When the slide rail 2 is driven to its first limit position by the lifting drive 1, the anti-drop cylinder 4 drives the blocking block 3 to press against the slide rail 2, preventing the slide rail 2 from causing the PIN assembly 5 to fall.

[0052] It should be noted that when air is supplied to the anti-drop cylinder 4, the telescopic rod of the anti-drop cylinder 4 retracts. After the air supply is cut off, the telescopic rod of the anti-drop cylinder 4 extends and remains extended. In its non-working state, the blocking block 3 presses against the slide rail 2, preventing the PIN assembly 5 from falling due to gravity when the lifting drive 1 is de-energized, thereby improving the stability and safety of the wafer PIN lifting mechanism.

[0053] Meanwhile, by using the anti-fall cylinder 4 as the driving component of the blocking block 3, the situation where the anti-fall component cannot operate normally under abnormal conditions such as power failure can be prevented.

[0054] Preferably, the blocking block 3 is made of rubber material to increase the friction between the blocking block 3 and the slide rail 2, thereby further improving the stability of preventing it from falling off.

[0055] In one embodiment, the wafer PIN lifting mechanism further includes an elastic component. The extension direction of the elastic component is parallel to the movement direction of the slide rail 2, one end of the elastic component is connected to the support component, and the other end of the elastic component is connected to the slide rail 2. When the slide rail 2 is at its second limit position, the elastic component is in a stretched state; when the slide rail 2 is at its first limit position, the elastic component is in a free state or a stretched state.

[0056] It should be noted that the free state of an elastic component refers to the state of the elastic component when no external force is applied.

[0057] In this embodiment, the elastic component functions as an energy storage device, increasing the lifting force and stability of the wafer PIN lifting mechanism. Specifically, during the lifting process (from its second limit position to its first limit position), the elastic component is in a stretched state, generating an upward pulling force on the slide rail 2 and the PIN component 5, thereby increasing the overall lifting force of the mechanism and improving stability during the lifting process. Simultaneously, when the slide rail 2 is at its upper limit position, the elastic component exerts no force on the slide rail 2 or still provides an upward pulling force, thus helping to prevent the PIN component 5 from falling due to gravity in the event of a power outage to the lifting drive 1.

[0058] Preferably, the elastic component includes a first elastic element 6 and a second elastic element 7, which are respectively disposed on both sides of the slide rail 2. The two ends of the first elastic element 6 are respectively connected to the support component and the corresponding side of the slide rail 2, and the two ends of the second elastic element 7 are respectively connected to the support component and the corresponding side of the slide rail 2. By providing two elastic elements, the lifting force of the wafer PIN lifting mechanism can be further improved, and the force on the slide rail 2 can be made more uniform.

[0059] Specifically, the support assembly includes a column 8, a first hanging plate 11 is provided on the column 8, a second hanging plate 12 is provided on the top of the slide rail 2, and a third hanging plate 13 extending vertically is provided at both ends of the second hanging plate 12. A first connecting column is provided at both ends of the first hanging plate 11, and a second connecting column is provided at the bottom of each of the third hanging plates 13. The two ends of the first elastic member 6 are respectively connected to the first connecting column and the second connecting column on the same side, and the two ends of the second elastic member 7 are respectively connected to the first connecting column and the second connecting column on the same side.

[0060] Specifically, the installation positions for the upper ends of the first elastic element 6 and the second elastic element 7 are provided by setting up a column 8 and a first hanging plate 11 on top of the column 8; the installation positions for the upper ends of the first elastic element 6 and the lower ends of the second elastic element 7 are provided by setting up a second hanging plate 12 on top of the slide rail 2 and a third hanging plate 13 on the left and right sides of the slide rail 2. First connecting posts are respectively set at both ends of the first hanging plate 11 and a second connecting post is set at the lower part of the third hanging plate 13 to facilitate connection with the elastic elements.

[0061] Furthermore, the first connecting post is detachably connected (e.g., threaded) to the corresponding end of the first mounting plate 11. Similarly, the second connecting post is detachably connected (e.g., threaded) to the lower part of the corresponding third mounting plate 13.

[0062] Both the first elastic element 6 and the second elastic element 7 mentioned above can be springs.

[0063] In one embodiment, a photoelectric sensor 14 is provided on the housing of the lifting drive component 1, and a light-shielding plate 15 that cooperates with the photoelectric sensor 14 is provided on the slide rail 2. When the slide rail 2 moves to the second limit position, the light-shielding plate 15 moves with the slide rail 2 to the position corresponding to the photoelectric sensor 14, so that the photoelectric sensor 14 detects the photoelectric change and determines that the PIN component 5 has descended into place and can adsorb the wafer.

[0064] In one embodiment, the lifting drive 1 is a lifting electric cylinder, and the telescopic rod of the lifting electric cylinder is connected to the slide rail 2 to drive the slide rail 2 to reciprocate between its first limit position and its second limit position.

[0065] The lifting assembly also includes a fixed rail, which is mounted on the support assembly, and the slide rail 2 is slidably connected to the fixed rail. The fixed rail serves to guide and support the slide rail 2, making its movement more stable.

[0066] In one embodiment, the support assembly further includes a base 9 and a support plate 10, the support plate 10 being angle-adjustably connected to the base 9, a lifting assembly and a column 8 being disposed on the support plate 10, and an anti-fall cylinder 4 being disposed on the column 8.

[0067] The base 9 includes a base plate 91 and two mounting plates 92 vertically mounted on the base plate 91. A support plate 10 is angularly adjustable to the two mounting plates 92 via a pivot 97. Each mounting plate 92 has a fixing block 95 for positioning the support plate 10, and each fixing block 95 has a knob 96 for adjusting the angle of the support plate 10. The upper parts of the two mounting plates 92 each have pivot mounting holes for mounting the pivot 97. A bearing 98 is installed between the pivot 97 and the support plate 10, and a bearing stop 93 is installed on the outer side of the bearing 98. An adjusting support column 94 is also provided on the base plate 91, fixed to the base plate 91 by a pressure block. Its upper end is connected to the bottom of the support plate 10 to adjust the level of the support plate 10.

[0068] In one embodiment, the PIN assembly 5 includes a PIN holder 51 and three PIN bodies 52 extending vertically. The PIN holder 51 is Y-shaped, and the three PIN bodies 52 are respectively disposed at the three ends of the PIN holder 51. Vacuum chucks are provided at the lower ends of the three PIN bodies 52 to adsorb the wafer, thereby enabling the wafer PIN lifting mechanism to lift the wafer.

[0069] The PIN assembly 5 also includes a main air pipe 53 and three branch air pipes 54. The three branch air pipes 54 are arranged in a "Y" shape on the top surface of the PIN support 51. One end of each of the three branch air pipes 54 is connected to the main air pipe 53, and the other end of each is connected to the PIN body 52 through a pipe connector. An external vacuum device is connected to a vacuum chuck through the main air pipe 53 and the branch air pipes 54 to provide suction force to adsorb the wafer.

[0070] like Figure 5 As shown, the present invention also provides an anti-detachment control method applied to the above-mentioned wafer PIN lifting mechanism, comprising the following steps:

[0071] Step 1: Supply air to the anti-drop cylinder 4, causing the extension rod of the anti-drop cylinder 4 to retract the blocking block 3.

[0072] Step 2: When the slide rail 2 is driven to its first limit position by the lifting drive 1, the air supply to the anti-drop cylinder 4 is stopped, so that the extension rod of the anti-drop cylinder 4 drives the blocking block 3 to extend and press the slide rail 2, thereby preventing the slide rail 2 from driving the PIN assembly 5 to fall.

[0073] In this invention, by setting an anti-drop component to press the slide rail 2 in the air-off state, it can prevent the lifting drive component 1 from lifting the slide rail 2 and PIN component 5 to the upper limit position (first limit position) due to abnormal conditions (such as power failure) and thus improve the stability and safety of the wafer PIN lifting mechanism.

[0074] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0075] In the description of this invention, it should be understood that the terms "upper," "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," or "third" may explicitly or implicitly include one or more of that feature.

[0076] Although the invention has been described with reference to preferred embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the invention. In particular, the technical features mentioned in the various embodiments can be combined in any manner as long as there is no structural conflict. The invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A wafer pin lifting mechanism, characterized in that, It includes: a support assembly, a lifting assembly, a pin assembly, and an anti-drop assembly, wherein the lifting assembly and the anti-drop assembly are both disposed on the support assembly. The lifting assembly includes a lifting drive and a slide rail. The slide rail is used to mount the PIN assembly so as to drive the PIN assembly to move up and down. The slide rail includes: a first extreme position and a second extreme position. When the slide rail is driven to its first limit position by the lifting drive component, the anti-drop component presses against the slide rail to prevent the slide rail from causing the PIN component to fall off. When the slide rail is driven by the lifting drive to move from the first extreme position to the second extreme position, the anti-drop component releases the slide rail so that the slide rail can drive the PIN component to descend.

2. The wafer PIN lifting mechanism according to claim 1, characterized in that, The anti-fall-off component includes an anti-fall-off cylinder and a blocking block. The anti-fall-off cylinder is mounted on the support component, and the blocking block is located at the end of the telescopic rod of the anti-fall-off cylinder. When the slide rail is driven to its first limit position by the lifting drive, the anti-drop cylinder drives its telescopic rod to extend so that the blocking block presses against the slide rail, thereby preventing the slide rail from causing the PIN component to fall. When the slide rail is driven by the lifting drive to move from the first extreme position to the second extreme position, the blocking block releases the slide rail so that the slide rail can drive the PIN component to descend.

3. The wafer PIN lifting mechanism according to claim 2, characterized in that, The blocking block is made of rubber material.

4. The wafer PIN lifting mechanism according to any one of claims 1-3, characterized in that, It also includes an elastic component, the extension direction of which is parallel to the movement direction of the slide rail, one end of which is connected to the support component, and the other end of which is connected to the slide rail. Wherein, the slide rail is located at its second limit position, and the elastic component is in a stretched state; When the slide rail is at its first extreme position, the elastic component is in a free state or a stretched state.

5. The wafer PIN lifting mechanism according to claim 4, characterized in that, The elastic component includes a first elastic element and a second elastic element, which are respectively disposed on both sides of the slide rail. The two ends of the first elastic element and the two ends of the second elastic element are respectively connected to the support assembly and the corresponding side of the slide rail.

6. The wafer PIN lifting mechanism according to claim 5, characterized in that, The support assembly includes a column, on which a first hanging plate is provided, and on the top of the slide rail is a second hanging plate. Third hanging plates extending vertically are respectively provided at both ends of the second hanging plate. The first hanging plate has a first connecting post at each end, and the lower parts of the two third hanging plates have a second connecting post. The two ends of the first elastic element and the two ends of the second elastic element are respectively connected to the first connecting post and the second connecting post on the same side.

7. The wafer PIN lifting mechanism according to claim 6, characterized in that, The support assembly also includes a base and a support plate, the support plate being adjustablely connected to the base. Both the lifting assembly and the column are mounted on the support plate, and the anti-falling assembly is mounted on the column.

8. The wafer PIN lifting mechanism according to any one of claims 1-3, characterized in that, A photoelectric sensor is installed on the housing of the lifting drive component, and a light-shielding plate that cooperates with the photoelectric sensor is installed on the slide rail. When the slide rail moves to the second limit position, the light-shielding plate moves with the slide rail to a position corresponding to the photoelectric sensor, so that the photoelectric sensor can detect the photoelectric change.

9. The wafer PIN lifting mechanism according to any one of claims 1-3, characterized in that, The lifting assembly also includes a fixed rail, which is disposed on the support assembly, and the slide rail is slidably connected to the fixed rail.

10. A method for preventing detachment control, applied to the wafer PIN lifting mechanism according to any one of claims 1-9, characterized in that, Includes the following steps: Air is supplied to the anti-detachment cylinder, causing the extension rod of the anti-detachment cylinder to retract the blocking block. When the slide rail is driven to its first limit position by the lifting drive, the air supply to the anti-drop cylinder is stopped, causing the extension rod of the anti-drop cylinder to drive the blocking block to extend and press the slide rail, thereby preventing the slide rail from causing the PIN assembly to fall off.

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