Thermal management device and electronic device

Abstract

The embodiment of the application provides a kind of heat management device and electronic equipment, heat management device includes substrate, the substrate includes first substrate and second substrate;Electrode layer, the electrode layer is set between the first substrate and the second substrate, the electrode layer includes first electrode and second electrode, the first electrode and the second electrode all include current collector layer and thermoelectric layer;Diaphragm layer, the diaphragm layer is set between the first electrode and the second electrode.Under the condition that voltage is applied on first electrode and second electrode, heat management device can realize the heat storage of heat management device while refrigerating heat source, guarantee the heat exchange effect of heat management device.

Description

Technical Field

[0001] This application belongs to the field of heat exchange technology, specifically relating to a thermal management device and electronic equipment. Background Technology

[0002] With the increasing integration and power consumption of electronic devices, the demand for thermal management of electronic devices is also growing.

[0003] In related technologies, taking mobile phones as an example, the thermal management devices in mobile phones are mainly implemented through air-cooling components and liquid-cooling components. However, the air-cooling components and liquid-cooling components are greatly affected by the flow rate and ambient temperature when cooling the heat source. In addition, the internal space of mobile phones is limited, which restricts the cooling capacity of the air-cooling components and liquid-cooling components, resulting in poor heat exchange effect of the thermal management devices in mobile phones. Summary of the Invention

[0004] This application aims to provide a thermal management device and electronic device that can solve the problem of poor heat exchange performance of thermal management devices in a limited space.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide a thermal management device, comprising:

[0007] A substrate, the substrate comprising a first substrate and a second substrate;

[0008] An electrode layer is disposed between the first substrate and the second substrate. The electrode layer includes a first electrode and a second electrode, and both the first electrode and the second electrode include a current collector layer and a thermoelectric layer.

[0009] A membrane layer is disposed between the first electrode and the second electrode;

[0010] When a voltage is applied to the first electrode and the second electrode, the thermal management device can store heat while cooling the heat source.

[0011] Secondly, embodiments of this application provide an electronic device including the thermal management device described in the first aspect.

[0012] This application provides a thermal management device, which includes a substrate comprising a first substrate and a second substrate; an electrode layer disposed between the first substrate and the second substrate, the electrode layer comprising a first electrode and a second electrode, both the first electrode and the second electrode comprising a current collector layer and a thermoelectric layer; and a diaphragm layer disposed between the first electrode and the second electrode. When a voltage is applied to the first electrode and the second electrode, the thermal management device can simultaneously cool a heat source and store heat, ensuring the heat exchange effect of the thermal management device.

[0013] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0014] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0015] Figure 1 This is an exploded view of a thermal management device according to an embodiment of this application;

[0016] Figure 2 This is a schematic diagram of a thermal management device according to an embodiment of this application;

[0017] Figure 3 yes Figure 2 Sectional view at point A in the middle;

[0018] Figure 4 yes Figure 3 A magnified view of point B, indicated by the center circle;

[0019] Figure 5 This is a charging schematic diagram of a thermal management device according to an embodiment of this application;

[0020] Figure 6 This is a schematic diagram of an electronic device according to an embodiment of this application.

[0021] Figure label:

[0022] 100. Thermal management device; 1. First electrode; 11. First current collector layer; 111. First protrusion; 12. P-type thermoelectric material layer; 13. First substrate; 2. Second electrode; 21. Second current collector layer; 211. Second protrusion; 22. N-type thermoelectric material layer; 23. Second substrate; 3. Electrolyte; 4. Diaphragm layer; 41. Diaphragm unit; 5. Sealing ring;

[0023] 200, screen; 300, processor; 400, circuit board; 500, heat spreader. Detailed Implementation

[0024] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0025] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0026] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] The following is combined with Figure 1 - Figure 6 This application describes a thermal management apparatus and an electronic device according to embodiments thereof.

[0029] like Figure 1 and Figure 2 As shown, a thermal management device is provided according to some embodiments of this application, the thermal management device comprising:

[0030] The substrate includes a first substrate 13 and a second substrate 23;

[0031] An electrode layer is disposed between the first substrate 13 and the second substrate 23. The electrode layer includes a first electrode 1 and a second electrode 2. Both the first electrode 1 and the second electrode 2 include a current collector layer and a thermoelectric layer.

[0032] A membrane layer 4 is disposed between the first electrode 1 and the second electrode 2;

[0033] When a voltage is applied to the first electrode 1 and the second electrode 2, the thermal management device can store heat while cooling the heat source.

[0034] See Figure 5 When a voltage is applied to the first electrode 1 and the second electrode 2, the first electrode 1 is connected to the positive terminal of the power supply and the second electrode 2 is connected to the negative terminal of the power supply. Since there is no current path inside the thermal management device, the charging process of the thermal management device can achieve energy storage by forming a double-layer capacitor through charge separation at the interface between the electrolyte and the electrolyte liquid by applying an external voltage.

[0035] The diaphragm layer 4 is arranged between the first electrode 1 and the second electrode 2. On the one hand, it can isolate the thermoelectric layer of the first electrode 1 and the thermoelectric layer of the second electrode 2 to prevent short circuit caused by contact between the first electrode 1 and the second electrode 2. On the other hand, it can conduct the electrolyte ion circulation channel in the electrolyte to ensure the rapid charging and discharging process of the thermal management device.

[0036] Furthermore, the thermal management device provided in this application embodiment is simple and compact, and compared to traditional active thermal management devices, it eliminates moving parts, enabling efficient cooling and heat storage through simple charging and discharging. Moreover, the operation of the thermal management device involves no chemical reactions, improving its reliability.

[0037] The thermal management device provided in this application includes a substrate, which includes a first substrate 13 and a second substrate 23; an electrode layer disposed between the first substrate 13 and the second substrate 23, the electrode layer including a first electrode 1 and a second electrode 2, both the first electrode 1 and the second electrode 2 including a current collector layer and a thermoelectric layer; and a membrane layer 4 disposed between the first electrode 1 and the second electrode 2. When a voltage is applied to the first electrode 1 and the second electrode 2, cooling capacity is generated at the interface between the current collector layer and the thermoelectric layer of the first electrode 1 and at the interface between the current collector layer and the thermoelectric layer of the second electrode 2, thereby ensuring the heat exchange effect of the thermal management device.

[0038] Optionally, see Figure 1 He Ru Figure 2 The first electrode 1 includes a current collector layer of a first current collector layer 11 and a thermoelectric layer of a P-type thermoelectric material layer 12, wherein the P-type thermoelectric material layer 12 is disposed on the side of the first current collector layer 11 facing the membrane layer 4.

[0039] The second electrode 2 includes a current collector layer of the second current collector layer 21 and a thermoelectric layer of N-type thermoelectric material layer 22. The N-type thermoelectric material layer 22 is disposed on the side of the second current collector layer 21 facing the membrane layer 4. An electrolyte 3 is disposed between the second electrode 2 and the first electrode. The electrolyte 3 can wet the membrane layer 4.

[0040] Specifically, the second electrode 2 is opposite to the first electrode 1, and a gap is formed between the P-type thermoelectric material layer 12 and the N-type thermoelectric material layer 22; the gap is used to place the electrolyte 3, the membrane layer 4 is disposed in the gap and separates the first electrode 1 and the second electrode 2, and the electrolyte 3 can wet the membrane layer 4 so as to conduct the electrolyte ion circulation channel in the electrolyte 3 through the membrane layer 4.

[0041] Specifically, the second electrode 2 and the first electrode 1 can form a two-electrode capacitor, and the P-type thermoelectric material layer 12 and the N-type thermoelectric material layer 22 form a gap facing each other; the electrolyte 3 fills the gap, and the gap can be sealed by the sealing ring 5 surrounding the second electrode 2 and the first electrode 1 to prevent the electrolyte 3 from leaking from the gap.

[0042] See Figure 2 and Figure 3The lower layer of the thermal management device is a first electrode 1, which includes a first current collector layer 11 with a P-type thermoelectric material deposited on its surface. The P-type thermoelectric material can be a Mg2Si-based thermoelectric material or an Ag-based coordination polymer, so as to form a complete P-type thermoelectric material layer 12 on one side of the first current collector layer 11. The middle layer is an electrolyte 3 and a membrane layer 4. The upper layer is a second electrode 2, which includes a second current collector layer 21 with an N-type thermoelectric material deposited on its surface. The N-type thermoelectric material can be a PbS thermoelectric material or an AgInSe2 thermoelectric material, so as to form a complete N-type thermoelectric material layer 22 on one side of the second current collector layer 21.

[0043] During the charging process of the thermal management device, charge carriers such as electrons and holes are transferred through the first current collector layer 11 and the second current collector layer 21 to the P-type thermoelectric material layer 12 and the N-type thermoelectric material layer 22 and stored there. A Peltier effect occurs at the interface between the first current collector layer 11 and the P-type thermoelectric material layer 12, and at the interface between the second current collector layer 21 and the N-type thermoelectric material layer 22, generating cooling through the first electrode 1 and the second electrode 2. The thermal management device combines thermoelectric cooling with a supercapacitor to form an active cooling capacitor, enabling heat exchange with the heat source. While cooling the heat source, heat is stored in the thermal management device.

[0044] When the device temperature is low, the thermal management device can discharge after the voltage is applied. Charge carriers flow out from the P-type thermoelectric material layer 12 and the N-type thermoelectric material layer 22, and heat is released at the interface between the first current collector layer 11 and the P-type thermoelectric material layer 12, and at the interface between the second current collector layer 21 and the N-type thermoelectric material layer 22, to heat the device at low temperature. This achieves low-temperature cold storage and high-temperature cooling without the need for phase change materials such as the P-type thermoelectric material layer 12 and the N-type thermoelectric material layer 22. While miniaturizing the thermal management device, the cooling capacity of the thermal management device is increased, and the heat exchange effect of the thermal management device is improved.

[0045] Specifically, the first substrate 13 can be a ceramic substrate or an aluminum carbide substrate. When the first substrate 13 is attached to the side of the first current collector layer 11 away from the P-type thermoelectric material layer 12, that is, when the first substrate 13 is located on the outermost side of the thermal management device, it can facilitate the connection between the thermal management device and external devices while protecting the first electrode 1.

[0046] Specifically, the second substrate 23 can be a ceramic substrate or an aluminum carbide substrate. When the second substrate 23 is attached to the side of the second current collector layer 21 away from the N-type thermoelectric material layer 22, that is, when the second substrate 23 is located on the outermost side of the thermal management device, it can facilitate the connection between the thermal management device and external devices while protecting the second electrode 2.

[0047] Optionally, see Figure 2 and Figure 3 The first current collector layer 11 includes a first planar portion and a plurality of first protrusions 111. The plurality of first protrusions 111 are arranged side by side on the side of the planar portion facing the membrane layer 4. The P-type thermoelectric material layer 12 is coated on the first planar portion and the first protrusions 111.

[0048] Specifically, the first protrusion 111 forms a protruding position on the surface of the first planar portion and a recessed position between adjacent first protrusions 111. When the P-type thermoelectric material layer 12 is coated on the first planar portion and the first protrusion 111, that is, the P-type thermoelectric material layer 12 is provided at both the protruding position and the recessed position formed by the first protrusion 111. On the one hand, it can increase the area of ​​the P-type thermoelectric material layer 12. On the other hand, it can quickly dissipate the cold or heat generated at the interface between the first current collector layer 11 and the P-type thermoelectric material layer 12, thereby improving the heat exchange efficiency of the thermal management device.

[0049] Optionally, see Figure 4 The second current collector layer 21 includes a second planar portion and a plurality of second protrusions 211. The plurality of second protrusions 211 are arranged side by side on the side of the second planar portion facing the membrane layer 4. The N-type thermoelectric material layer 22 is coated on the second planar portion and the second protrusions 211.

[0050] Specifically, the second protrusion 211 forms a protruding position where the second protrusion 211 is located and a recessed position between adjacent second protrusions 211 on the surface of the second planar portion. When the N-type thermoelectric material layer 22 is coated on the second planar portion and the second protrusion 211, that is, the N-type thermoelectric material layer 22 is provided at both the protruding position and the recessed position formed by the second protrusion 211. On the one hand, it can increase the area where the N-type thermoelectric material layer 22 is provided. On the other hand, it can quickly dissipate the cold or heat generated at the interface between the second current collector layer 21 and the N-type thermoelectric material layer 22, thereby improving the heat exchange efficiency of the thermal management device.

[0051] Optionally, see Figure 1 and Figure 3Both the first protrusion 111 and the second protrusion 211 are sheet-like structures, and the first protrusion 111 and the second protrusion 211 are arranged parallel to each other.

[0052] Specifically, the first protrusion 111 can be a sheet-like structure vertically disposed on the first flat portion and facing the second flat portion; while the second protrusion 211 can be a sheet-like structure vertically disposed on the second flat portion and facing the first flat portion; when the first protrusion 111 and the second protrusion 211 are parallel to each other, it is convenient for the first protrusion 111 and the second protrusion 211 to form a mutually embedded fit relationship, thereby increasing the relative area between the P-type thermoelectric material layer 12 and the N-type thermoelectric material layer 22 and ensuring the heat exchange efficiency of the thermal management device.

[0053] Optionally, see Figure 3 and Figure 4 The first flat portion has a plurality of first protrusions 111 arranged side by side, and the second flat portion has a plurality of second protrusions 211 arranged side by side, with one first protrusion 111 located between two adjacent second protrusions 211.

[0054] Specifically, when the second electrode 2 and the first electrode 1 are opposite each other, the first protrusion 111 faces the second protrusion 211, and the second protrusion 211 faces the first protrusion 111; the gap formed between adjacent first protrusions 111 can facilitate the insertion of the second protrusion 211, and the gap formed between adjacent second protrusions 211 can also facilitate the insertion of the first protrusion 111, so as to form a nested structure of the second electrode 2 and the first electrode 1, reduce the size of the thermal management device, and realize the miniaturization of the thermal management device.

[0055] Optionally, the surface of the first current collector layer 11 is planar, and the P-type thermoelectric material layer 12 is coated on the surface of the first current collector layer 11.

[0056] Specifically, by coating the P-type thermoelectric material layer 12 onto the surface of the first current collector layer 11 with the planar first current collector layer 11, a flat P-type thermoelectric material layer 12 can be formed. By simplifying the coating process of the P-type thermoelectric material layer 12, the thickness of the thermal management device can be reduced, thereby achieving miniaturization of the thermal management device.

[0057] Optionally, the surface of the second current collector layer 21 is planar, and the N-type thermoelectric material layer 22 is coated on the surface of the second current collector layer 21.

[0058] Specifically, based on the planar second current collector layer 21, coating the N-type thermoelectric material layer 22 onto the surface of the second current collector layer 21 can form a flat N-type thermoelectric material layer 22. Based on simplifying the coating process of the N-type thermoelectric material layer 22, the thermal management device can be further thinned by the cooperation of the two flat electrodes, the first electrode 1 and the second electrode 2.

[0059] Optionally, see Figure 3 and Figure 4 The membrane layer 4 includes a plurality of membrane units 41, each membrane unit 41 being located between two adjacent first protrusions 111 and second protrusions 211, and being parallel to the first protrusions 111 and second protrusions 211.

[0060] Specifically, when the first protrusion 111 and the second protrusion 211 are arranged parallel to each other, two adjacent first protrusions 111 and second protrusions 211 form a protrusion group. Multiple protrusion groups are arranged between the first flat portion and the second flat portion. Each protrusion group is provided with a diaphragm unit 41 to separate the first protrusion 111 and the second protrusion 211. At the same time, the electrolyte ion circulation channel in the electrolyte 3 is opened through the diaphragm unit 41.

[0061] In addition, when the diaphragm unit 41 is parallel to the first protrusion 111 or the second protrusion 211, the diaphragm unit 41 can completely separate the P-type thermoelectric material layer 12 on the first protrusion 111 and the N-type thermoelectric material layer 22 on the second protrusion 211, preventing the first electrode 1 and the second electrode 2 from contacting each other and causing a short circuit.

[0062] Optionally, the first current collector layer 11 is a porous carbon layer, and / or the second current collector layer 21 is a porous carbon layer.

[0063] Specifically, when the first current collector layer 11 is a porous carbon layer, the P-type thermoelectric material layer 12 is disposed on the surface of the first current collector layer 11 and can be embedded in the porous channels of the first current collector layer 11 to increase the surface area of ​​the P-type thermoelectric material layer 12; while when the second current collector layer 21 is a porous carbon layer, the N-type thermoelectric material layer 22 is disposed on the surface of the second current collector layer 21 and can be embedded in the porous channels of the second current collector layer 21 to increase the surface area of ​​the N-type thermoelectric material layer 22 and improve the cooling and heating efficiency of the thermal management device.

[0064] This application also provides an electronic device, which includes the thermal management device 100.

[0065] Specifically, the electronic device has a number of electronic components, and the thermal management device 100 can cool the electronic components when they are hot and heat them when they are cold, thereby improving the stability of the operation of the electronic device.

[0066] Optionally, see Figure 6 The electronic device includes a housing (not shown) and a screen 200 disposed on the housing, and the thermal management device 100 is located between the screen 200 and the housing.

[0067] Specifically, the number of thermal management devices 100 in the electronic device can be one or more. When multiple thermal management devices 100 are placed between the screen 200 and the housing, they can exchange heat for multiple electronic components in the electronic device, thereby ensuring the stability and lifespan of the multiple electronic components in the electronic device.

[0068] Optionally, see Figure 6 The electronic device includes a processor 300, which is disposed between the screen 200 and the housing;

[0069] The thermal management device 100 is in contact with the processor 300 and is used to cool the processor 300.

[0070] Specifically, the thermal management device 100 can be arranged around the processor (CPU) 300, for example, the thermal management device 100 can be arranged at the corner of the square processor 300.

[0071] The electronic device may be equipped with a sensor to monitor the temperature of the processor 300. When the sensor detects that the temperature of the processor 300 has reached a high temperature threshold, the thermal management device 100 can be activated by charging the battery. One side of the thermal management device 100 is close to the processor 300, and the other side is close to the screen 200. While charging, the thermal management device 100 can simultaneously cool the processor 300 and the screen. At the same time, the electronic device can transfer the cooling energy generated by the thermal management device 100 to the processor 300 and the surface of the electronic device through the metal casing and the screen 200, so as to control the temperature of the processor 300 and reduce the temperature of the surface of the electronic device.

[0072] When the electronic device is charging or the screen is off, the thermal management device 100 discharges and releases heat. Therefore, the thermal management device 100 can cool and store heat when the electronic device is at a high temperature, and release heat when the electronic device is at a low temperature or when it is not in handheld mode, effectively reducing the temperature of the electronic device in the usage scenario, and improving the user's handheld experience while ensuring the performance of the electronic device.

[0073] In addition, the electronic components of the electronic device may include a circuit board 400 in addition to the processor 300, and the thermal management device 100 may contact the circuit board 400 and cool the processor circuit board 400.

[0074] In addition, the electronic device also includes a heat spreader 500, which is connected to the thermal management device 100 to facilitate the rapid transfer of the cooling or heating capacity of the thermal management device 100.

[0075] When the electronic device is in a cooling and heat storage scenario, that is, when the sensor temperature inside the electronic device reaches the high temperature threshold, the thermal management device 100 is charged. Charge carriers flow into and accumulate at the interface between the first current collector layer 11 and the P-type thermoelectric material layer 12, and at the interface between the second current collector layer 21 and the N-type thermoelectric material layer 22 in the thermal management device 100, and the Peltier effect occurs to release cold energy, so as to cool the casing and the screen at the same time, and to control the temperature of the processor and the surface temperature of the electronic device.

[0076] When the electronic device is in a heat release and cold storage scenario, that is, when the electronic device is charging or in a screen-off state, the thermal management device 100 discharges. Charge carriers flow out at the interface between the first current collector layer 11 and the P-type thermoelectric material layer 12, and at the interface between the second current collector layer 21 and the N-type thermoelectric material layer 22. The thermal management device 100 releases heat and stores cold energy. Through the above-mentioned working mode of the thermal management device 100, which cools and stores heat at high temperatures and releases heat and stores cold energy at low temperatures, the heat generated by the electronic device at high temperatures can be transferred to the electronic device at low temperatures, realizing dynamic thermal management of the electronic device.

[0077] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0078] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A thermal management device, characterized in that, include: A substrate, the substrate comprising a first substrate and a second substrate; An electrode layer is disposed between the first substrate and the second substrate. The electrode layer includes a first electrode and a second electrode, and both the first electrode and the second electrode include a current collector layer and a thermoelectric layer. A membrane layer is disposed between the first electrode and the second electrode; When a voltage is applied to the first electrode and the second electrode, the thermal management device can store heat while cooling the heat source; The first electrode includes a first current collector layer and a P-type thermoelectric material layer, wherein the P-type thermoelectric material layer is disposed on the side of the first current collector layer facing the membrane layer; The second electrode includes a second current collector layer and an N-type thermoelectric material layer. The N-type thermoelectric material layer is disposed on the side of the second current collector layer facing the membrane layer. An electrolyte is disposed between the second electrode and the first electrode, and the electrolyte wets the membrane layer. The first current collector layer includes a first planar portion and a plurality of first protrusions, the plurality of first protrusions being arranged side by side on the side of the planar portion facing the membrane layer, and the P-type thermoelectric material layer being coated on the first planar portion and the first protrusions; The second current collector layer includes a second planar portion and a plurality of second protrusions, the plurality of second protrusions being arranged side by side on the side of the second planar portion facing the membrane layer, and the N-type thermoelectric material layer being coated on the second planar portion and the second protrusions.

2. The thermal management device according to claim 1, characterized in that, Both the first protrusion and the second protrusion are sheet-like structures, and the first protrusion and the second protrusion are arranged parallel to each other.

3. The thermal management device according to claim 1, characterized in that, One of the first protrusions is located between two adjacent second protrusions.

4. The thermal management device according to claim 2, characterized in that, The membrane layer includes a plurality of membrane units, each membrane unit being located between two adjacent first protrusions and second protrusions, and parallel to the first protrusion or the second protrusion.

5. The thermal management device according to claim 1, characterized in that, The first current collector layer is a porous carbon layer, and / or the second current collector layer is a porous carbon layer.

6. An electronic device, characterized in that, Includes the thermal management device according to any one of claims 1-5.

7. The electronic device according to claim 6, characterized in that, It includes a housing and a screen, the screen being disposed on the housing, and the thermal management device being located between the screen and the housing.

8. The electronic device according to claim 7, characterized in that, It also includes a processor disposed between the screen and the housing; The thermal management device contacts the processor and is used to cool the processor.

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