Camera assembly and electronic device

Abstract

A camera assembly and an electronic device are disclosed. The camera assembly includes a circuit board, a bracket on the circuit board and including an opening on a first surface of the bracket, a light emitter on the bracket configured to emit light toward an object, a lens assembly configured to transmit light reflected by the object through the opening of the bracket and a portion of the lens assembly is inside the bracket, wherein the light emitter is coaxial with the lens assembly.

Description

Technical Field

[0001] The disclosure involves camera components, and more specifically, time-of-flight (TOF) camera components. Background Technology

[0002] Time-of-flight (TOF) cameras are widely used in fields such as face recognition, gesture recognition, ranging, and 3D modeling because they can output 3D image information. In recent years, they have also been widely used in consumer electronics.

[0003] However, with the development of thinner and lighter consumer electronics products, the miniaturization of consumer electronics components has become a development trend. As an important component in consumer electronics products, the miniaturization of camera module packaging has attracted widespread attention in the industry. Summary of the Invention

[0004] A camera assembly with a reduced size and an increased effective field of view is disclosed.

[0005] According to one aspect of the disclosure, a camera assembly is provided, comprising: a circuit board; a bracket on the circuit board, the bracket including an opening on a first surface of the bracket; a light emitter on the bracket, the light emitter being configured to emit light toward an object and disposed thereon; and a lens assembly configured to transmit light reflected by the object through the opening of the bracket, a portion of the lens assembly being inside the bracket, wherein the light emitter is coaxial with the lens assembly.

[0006] Alternatively, the light emitter has a ring-shaped structure surrounding the lens assembly.

[0007] Optionally, the light emitter includes: an emitter body on a bracket, the emitter body including a light source for emitting light toward an object; an emitter interface on a circuit board, the emitter interface being configured to receive signals and power; and an emitter cable configured to electrically connect the emitter body to the emitter interface.

[0008] Optionally, the transmitter body is annular in shape, surrounding the lens assembly and matching the size of the lens assembly, and the transmitter body is disposed on the first surface of the bracket.

[0009] Alternatively, the transmitter interface is located on the circuit board outside the bracket.

[0010] Optionally, a first portion of the transmitter cable is on a first surface of the bracket, a second portion of the transmitter cable is on a second surface of the bracket adjacent to the first surface, and a third portion of the transmitter cable is on the circuit board outside the bracket.

[0011] Optionally, the lens assembly includes: a lens base inside the bracket; and a lens on the lens base, protruding from the lens base and passing through an opening in the bracket.

[0012] Optionally, the camera assembly further includes a light receiver located below the lens assembly, the light receiver being configured to receive light reflected by an object.

[0013] Alternatively, the surface of the light receiver is perpendicular to the optical axis of the lens assembly.

[0014] Optionally, the surface of the light receiver is perpendicular to the central axis of the light emitter.

[0015] Optionally, the optical receiver and optical transmitter share a circuit board and are electrically connected to the circuit board.

[0016] Optionally, the camera assembly further includes a connector electrically connected to the circuit board, the connector being configured to communicate with a device external to the camera assembly, wherein the light receiver and the light transmitter share the connector and are configured to communicate with the device external to the camera assembly via the connector.

[0017] Optionally, the camera assembly further includes: a filter between the lens assembly and the light receiver; and a base between the filter and the light receiver, the base supporting the filter and the lens assembly.

[0018] According to one aspect of the disclosure, an electronic device is provided, the electronic device having the aforementioned camera assembly.

[0019] The disclosure discloses a redesign of the light emitter and lens assembly of a Time-of-Flight (TOF) camera module, enabling a coaxial arrangement of the light emitter and lens. Therefore, the camera module according to the disclosed example embodiment not only has a reduced size, enabling miniaturized packaging of the camera module and saving raw materials to reduce costs, but also has an improved effective field of view. Attached Figure Description

[0020] The above and / or other aspects will become clearer and easier to understand through the following detailed description taken in conjunction with the accompanying drawings.

[0021] Figure 1 This is a diagram illustrating a time-of-flight (TOF) camera assembly according to the prior art.

[0022] Figure 2 This is a diagram illustrating a camera assembly according to a disclosed embodiment.

[0023] Figure 3 This is an exploded view showing a camera assembly according to a disclosed embodiment.

[0024] Figure 4This is a diagram illustrating the effective field of view of a TOF camera assembly according to the prior art.

[0025] Figure 5 This is a diagram illustrating the effective field of view of a camera assembly according to a disclosed embodiment.

[0026] Figure 6 This is a diagram illustrating an electronic device including a TOF camera according to a disclosed embodiment.

[0027] Throughout the accompanying drawings and detailed embodiments, unless otherwise described or provided, the same reference numerals will be understood to denote the same elements, features, and structures. The drawings may not be to scale, and for clarity, illustration, and convenience, the relative dimensions, scale, and depiction of elements in the drawings may be exaggerated. Detailed Implementation

[0028] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but may be changed as will become clear upon understanding this disclosure, except for operations that must occur in a specific order. Furthermore, for the sake of clarity and conciseness, descriptions of features known upon understanding this disclosure may be omitted.

[0029] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be clear upon understanding the disclosure of this application.

[0030] Throughout this specification, when a component is described as "connected to" or "attached to" another component, the component may be directly "connected to" or "attached to" the other component, or there may be one or more other components in between. Conversely, when an element is described as "directly connected to" or "directly attached to" another element, there may be no other elements in between. Similarly, similar expressions (e.g., "between" and "immediately between," and "adjacent to" and "closely adjacent to") should be interpreted in the same manner. As used herein, the term "and / or" includes any one of the relevant listed items or any combination of any two or more of the relevant listed items.

[0031] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first region, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0032] The terminology used herein is for the purpose of describing various examples only and is not intended to limit disclosure. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the features, quantities, operations, components, elements, and / or combinations thereof stated therein, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0033] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains, based on the understanding of the disclosure. Unless expressly defined herein, terms (such as those defined in a general dictionary) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and in the disclosure, and shall not be interpreted ideally or overly formally. The use of the term “may” in relation to examples or embodiments (e.g., regarding what an example or embodiment may include or implement) indicates the existence of at least one example or embodiment that includes or implements such a feature, while all example embodiments are not limited thereto.

[0034] It will be understood that when an element or layer is referred to as being "above," "on top," "above," "below," "below," "connected to," or "joined to" another element or layer, it can be directly above, above, above, below, below, connected to, or joined to the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly above," "above," "above," "below," "below," "below," "directly connected to," or "directly joined to" another element or layer, there are no intermediate elements or layers. The same label always indicates the same element.

[0035] For simplicity, spatial relative terms (such as "above", "on top of", "on", "above", "below", "below", "under", "below", "below", "below", etc.) are used herein to describe the relationship between one element or feature shown in the accompanying drawings and another element or feature. It will be understood that spatial relative terms are intended to encompass different orientations of the device in use or operation beyond those depicted in the accompanying drawings. For example, if the device in the accompanying drawings is flipped, an element described as "below" or "below" another element or feature will subsequently be "above" said other element or feature. Thus, for example, the term "below" can include both orientations of "above" and "below". The device may be otherwise positioned (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein will be interpreted accordingly.

[0036] For the sake of simplicity, conventional components of semiconductor devices may be described in detail or may not be described in detail for simplicity purposes.

[0037] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0038] Figure 1 This is a diagram illustrating a time-of-flight (TOF) camera assembly 200 according to the prior art.

[0039] Reference Figure 1 The TOF camera assembly 200 may include: a first circuit board 211, a second circuit board 212, a first bracket 221, a second bracket 222, a light emitter 230, and a lens assembly 240.

[0040] A first circuit board 211 supports a first bracket 221, a light emitter 230, and a lens assembly 240, and the first bracket 221 and lens assembly 240 can be mounted or disposed on the first circuit board 211. A second circuit board 212 supports a second bracket 222, and the second bracket 222 can be mounted or disposed on the second circuit board 212. The first bracket 221 can be disposed on the first circuit board 211 and may include an opening on a first surface of the first bracket 221. The second bracket 222 can be disposed on the side of the first bracket 221 (e.g., adjacent to the first bracket 221). The light emitter 230 can be disposed on the second bracket 222. That is, the light emitter 230 can be disposed on the side of the lens assembly 240. Furthermore, the shape of the light-emitting portion of the light emitter 230 can be rectangular. The lens assembly 240 can pass through the opening of the first bracket 221, and a portion of the lens assembly 240 is disposed inside the first bracket 221. In use, light emitted by the light emitter 230 to an object and reflected by the object can be received by a light receiver through the lens assembly 240. Therefore, the size of the TOF camera component 200 according to the prior art is relatively large, making it difficult to miniaturize and thin out electronic devices including the TOF camera component 200 according to the prior art.

[0041] Figure 2 This is a diagram illustrating a camera assembly according to a disclosed embodiment. Figure 3 This is an exploded view showing a camera assembly according to a disclosed embodiment.

[0042] According to the disclosed embodiments, the camera assembly 100 can be a TOF camera assembly (also known as a depth camera or depth camera) capable of outputting three-dimensional (3D) image information including depth information. In one example, refer to Figure 2 and Figure 3 The camera assembly 100 may include: a circuit board 110, a bracket 120, a light emitter 130, and a lens assembly 140.

[0043] Circuit board 110 can support various components of camera assembly 100. For example, circuit board 110 can support bracket 120, light emitter 130, and lens assembly 140. Bracket 120, light emitter 130, and lens assembly 140 can be mounted or disposed on circuit board 110. Circuit board 110 can provide circuitry for electrically connecting the various components it supports to each other. Circuit board 110 can be a printed circuit board (PCB). Furthermore, circuit board 110 can have any shape as needed.

[0044] The bracket 120 can support one or more of the various components mounted or disposed on the circuit board 110, and can also accommodate one or more of the various components mounted or disposed on the circuit board 110 to protect one or more of the various components mounted or disposed on the circuit board 110 from external impacts. The bracket 120 can be disposed on the circuit board 110 and may include an opening 121 disposed on a first surface F1 of the bracket 120. In one example, the first surface F1 of the bracket 120 may be parallel to the surface of the circuit board 110 on which the bracket 120 is mounted, and the opening 121 may be circular in shape. However, it should be understood that the disclosure is not limited thereto. For example, as needed, the first surface F1 of the bracket 120 may be any surface of the bracket 120, and the shape of the opening 121 may be arbitrary.

[0045] A light emitter 130 is used to emit light toward an object and is mounted on a bracket 120. Since infrared light has good penetrating power through clouds and fog, in one example, the light emitted by the light emitter 130 can be infrared or near-infrared light to improve measurement accuracy. Furthermore, with... Figure 1 Unlike the existing TOF camera assembly 200, according to the disclosed embodiments, the light emitter 130 may be coaxial with the lens assembly 140. For example, the light emitter 130 may have an annular shape surrounding the lens assembly 140, and the annular light emitter 130 may be coaxial with the lens assembly 140 and the opening 121. Therefore, the camera assembly 100 according to the disclosed embodiments may have a reduced size, enabling miniaturized packaging of the camera assembly 100 while saving raw materials and thus reducing costs.

[0046] In one example, such as Figure 2 and Figure 3As shown, the light emitter 130 may include an emitter body 131, an emitter interface 132, and an emitter cable 133. As a uniform surface light source, the emitter body 131 may be mounted on the bracket 120 and includes a light source for emitting light (e.g., infrared or near-infrared light) to an object. The emitter body 131 may be annular in shape, surrounding the lens assembly 140 and matching the size of the lens assembly 140, and may be mounted on a first surface F1 of the bracket 120. For example, the inner diameter of the annular shape of the emitter body 131 may match the size of the lens assembly 140 and the diameter of the opening 121. Therefore, the lens assembly can smoothly pass through the annular light emitter 130, and the annular shape of the emitter body 131 can serve as the light-emitting portion of the uniform surface light source. The emitter interface 132 can be used to receive signals and power and is mounted on the circuit board 110. The emitter interface 132 may be mounted on the circuit board 110 externally to the bracket 120. For example, the transmitter interface 132 may be located on a region of the circuit board 110 that is different from the region of the mounting bracket 120. The transmitter cable 133 may be used to electrically connect the transmitter body 131 and the transmitter interface 132. For example, a first portion 1331 of the transmitter cable 133 may be located on a first surface F1 of the bracket 120, a second portion 1332 of the transmitter cable 133 may be located on a second surface F2 of the bracket 120 adjacent to the first surface F1, and a third portion 1333 of the transmitter cable 133 may be located on the circuit board 110 outside the bracket 120.

[0047] Lens assembly 140 is used to transmit light reflected by an object through opening 121 in bracket 120, and a portion of lens assembly 140 is disposed inside bracket 120. In one example, such as Figure 3 As shown, the lens assembly 140 may include a lens base 141 and a lens 142. The lens base 141 may be disposed inside the bracket 120 and may support the lens 142. The lens 142 may be disposed on the lens base 141, protruding from the lens base 141 and passing through an opening 121 in the bracket 120. The lens 142 may be cylindrical, and the diameter of the lens 142 may match the diameter of the opening 121 in the bracket 120, allowing the lens 142 to pass through the opening 121. Furthermore, the diameter of the lens 142 may also match the diameter of the opening 121, which matches the annular inner diameter of the light emitter 130, allowing the lens 142 to smoothly pass through the opening 121 and the light emitter 130. Additionally, in one example, the lens 142 may be a stepped cylindrical shape, allowing the lens 142 to be easily positioned.

[0048] In one example, such as Figure 2As shown, the camera assembly 100 may further include a light receiver 150. The light receiver 150 is used to receive light reflected from an object and is positioned below the lens assembly 140. That is, the light receiver 150 is used to receive light emitted by the light emitter 130 to the object and reflected by the object. Figure 1 Unlike existing TOF camera components 200, according to disclosed embodiments, the light receiver 150 may be coaxial with the lens assembly 140, or the central axis of the light receiver 150 may be coaxial with the optical axis of the lens assembly 140, or the surface of the light receiver 150 may be perpendicular to the optical axis of the lens assembly 140. Furthermore, compared with... Figure 1 Unlike existing TOF camera components 200, according to the disclosed embodiments, the light receiver 150 may be coaxial with the light emitter 130, or the central axis of the light receiver 150 may be coaxial with the central axis of the light emitter 130, or the surface of the light receiver 150 may be perpendicular to the central axis of the light emitter 130. Therefore, the light receiver 150 can be positioned directly below the lens assembly 140, the opening 121, and the light emitter 130. That is, all of the light receiver 150, lens assembly 140, opening 121, and light emitter 130 can be coaxially arranged. The surface of the light receiver 150 may be parallel to the surface of the light emitter 130. The light receiver 150 and the light emitter 130 may share a circuit board 110 and be electrically connected to the circuit board 110. Therefore, the camera component 100 according to the disclosed embodiments can have a reduced size, enabling miniaturized packaging of the camera component 100 while saving raw materials and thus reducing costs.

[0049] In one example, such as Figure 3 As shown, the camera assembly 100 may further include a connector 160. The connector 160 is used to communicate with one or more devices external to the camera assembly 100 and is electrically connected to the circuit board 110. For example, the connector 160 can be used to communicate with other components in an electronic device that includes the camera assembly 100. The light receiver 150 and the light transmitter 130 share the connector 160 and communicate with one or more devices external to the camera assembly 100 via the connector 160.

[0050] In one example, such as Figure 3As shown, the camera assembly 100 may further include a filter 170 and a base 180. The filter 170 may be disposed between the lens assembly 140 and the light receiver 150, and may filter unwanted light. The base 180 may be disposed between the filter 170 and the light receiver 150, and may support the filter 170 and the lens assembly 140. In one example, the base 180 may have a rectangular opening, the filter 170 may be disposed on one surface of the base 180, and the light receiver 150 may be disposed on the other surface of the base 180, and light emitted by the light emitter 130 to the object and reflected by the object may be received by the light receiver 150 through the rectangular opening of the base 180.

[0051] In one example, such as Figure 3 As shown, the camera assembly 100 may also include a shielding cover 190. For example, the shielding cover 190 may cover the surface of the circuit board where the aforementioned assembly is not mounted, thereby shielding against external interference.

[0052] Although Figure 3 The embodiments shown depict a light receiver 150, a filter 170, and a base 180 included within the camera assembly 100; however, it should be understood that the disclosure is not limited thereto. For example, one or more of the light receiver 150, the filter 170, and the base 180 may be disposed outside the camera assembly 100.

[0053] Figure 4 This is a diagram illustrating the effective field of view of a TOF camera assembly 200 according to the prior art. Figure 5 This is a diagram illustrating the effective field of view of a camera assembly 100 according to a disclosed embodiment.

[0054] Reference Figure 4 In the existing TOF camera assembly 200, because the light emitter 230 and the light receiver 250 are not coaxial, the effective field of view of the TOF camera assembly 200, which is the overlapping field of view between the field of view of the light emitter 230 and the field of view of the light receiver 250, is relatively small. However, referring to... Figure 5 In the camera assembly 100 according to the disclosed embodiment, since the light emitter 130 and the light receiver 150 are coaxial, the effective field of view of the camera assembly 100, which is the overlapping field of view between the field of view of the light emitter 130 and the field of view of the light receiver 150, is large. Therefore, the camera assembly 100 according to the disclosed embodiment can not only have a reduced size, but also an increased effective field of view.

[0055] Figure 6 This is a diagram illustrating an electronic device 1000 including a TOF camera according to a disclosed embodiment.

[0056] Reference Figure 6An electronic device 1000 is disclosed. Specifically, the electronic device 1000 can be any of various types of computer system devices that are mobile or portable and perform wireless communication. Figure 6 (Only one form is shown as an example). Specifically, the electronic device 1000 can be a mobile phone or smartphone, a portable gaming device, a laptop, a PDA, a portable internet device, a music player, a data storage device, or other handheld devices. In addition, the electronic device 1000 can also be other wearable devices that require charging (e.g., smart bracelets, smart necklaces, head-mounted devices such as smart headphones (HMDs) or smartwatches).

[0057] Electronic device 1000 may also be any one of a plurality of electronic devices, including but not limited to cellular phones, smartphones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, other media recorders, radios, medical devices, vehicle transport instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbooks, personal digital assistants (PDAs), portable multimedia players (PMPs), Moving Image Experts Group (MPEG-1 or MPEG-2) audio layer 3 (MP3) players, portable medical devices, and digital cameras and combinations thereof.

[0058] In some cases, electronic device 1000 can perform multiple functions (e.g., playing music, displaying video, storing pictures, and receiving and sending telephone calls). If desired, electronic device 1000 can be such as a cellular phone, media player, other handheld device, wristwatch, pendant, handset, or other compact portable device.

[0059] Electronic device 1000 may include a camera assembly 2000 and a housing 3000, wherein the camera assembly 2000 is housed within the housing 3000 and partially exposed outside the housing 3000. The housing 3000 serves to protect the camera assembly 2000. For example, electronic device 1000 may be a mobile phone, and the camera assembly 2000 may be disposed on the housing 3000 (i.e., the back cover) of the mobile phone. Furthermore, the camera assembly 2000 may correspond to the aforementioned reference. Figure 2 and Figure 3 The camera component 100 is described.

[0060] This disclosure achieves a coaxial arrangement of the light emitter and light receiver in a TOF camera assembly by redesigning the light emitter and light receiver. Therefore, the camera assembly 100 according to an exemplary embodiment of this disclosure not only has a reduced size, enabling miniaturized packaging of the camera assembly 100 while saving raw materials and reducing costs, but also has an improved effective field of view.

[0061] Although the disclosure has been specifically shown and described with reference to its embodiments, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of the disclosure as defined by the claims.

Claims

1. A camera assembly, comprising: Circuit board; A bracket, on a circuit board, includes an opening on a first surface of the bracket; A light emitter, mounted on a support, is configured to emit light toward an object; The lens assembly is configured to transmit light reflected by the object through an opening in the support, and a portion of the lens assembly is inside the support. The light emitter is coaxial with the lens assembly. The light emitter includes: The transmitter body includes a contact bracket and a light source for emitting light toward an object. The transmitter interface contacts the circuit board and connects to the transmitter body. The transmitter interface is configured to receive signals and power.

2. The camera assembly as claimed in claim 1, wherein, The light emitter has a ring-shaped design that surrounds the lens assembly.

3. The camera assembly as claimed in claim 2, wherein, The light emitter also includes: The transmitter cable is configured to electrically connect the transmitter body to the transmitter interface.

4. The camera assembly as claimed in claim 3, wherein, The transmitter body is shaped like a ring surrounding the lens assembly and matching the size of the lens assembly. The transmitter body is located on the first surface of the support.

5. The camera assembly as claimed in claim 3, wherein, The transmitter interface is located on the circuit board outside the bracket.

6. The camera assembly as claimed in claim 3, wherein, The first part of the transmitter cable is on the first surface of the bracket, the second part of the transmitter cable is on the second surface of the bracket adjacent to the first surface, and the third part of the transmitter cable is on the circuit board outside the bracket.

7. The camera assembly as claimed in claim 1, wherein, The lens assembly includes: The lens mount is inside the bracket. The lens, on the lens base, protrudes from the lens base and passes through the opening in the bracket.

8. The camera assembly of claim 1, further comprising: A light receiver, located below the lens assembly, is configured to receive light reflected from an object.

9. The camera assembly as claimed in claim 8, wherein, The surface of the light receiver is perpendicular to the optical axis of the lens assembly.

10. The camera assembly of claim 8, wherein, The surface of the light receiver is perpendicular to the central axis of the light emitter.

11. The camera assembly of claim 8, wherein, The optical receiver and optical transmitter share a circuit board and are electrically connected to the circuit board.

12. The camera assembly of claim 8, further comprising: A connector, electrically connected to the circuit board, is configured to communicate with a device external to the camera assembly. The optical receiver and optical transmitter share a connector and are configured to communicate with devices outside the camera assembly via the connector.

13. The camera assembly of claim 8, further comprising: A light filter is located between the lens assembly and the light receiver. The base, located between the filter and the light receiver, supports the filter and lens assembly.

14. An electronic device having a camera assembly as described in any one of claims 1 to 13.

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