Acoustic resonator for a microphone

Abstract

This disclosure relates to "Acoustic Resonator for Microphone." Aspects of the subject technology relate to electronic devices with microphones. An electronic device can include a microphone and a resonator for the microphone. The resonator can be formed in a device structure that is spatially separated from the microphone. The resonator can be formed in an interior wall of a housing of the electronic device, or in a support structure within the housing of the electronic device. The resonator and / or one or more damping features can reduce a resonant effect of a resonant cavity within the housing of the electronic device and adjacent to the microphone on the microphone.

Description

Technical Field

[0001] This specification relates in general to aspects of audio transducers for electronic devices, including, for example, acoustic resonators for microphones in electronic devices. Background Technology

[0002] Electronic devices such as computers, media players, cellular phones, wearable devices, and headphones typically include speakers for generating audio output from the device and microphones for receiving audio input from the device. However, as devices are implemented with increasingly smaller form factors, integrating microphones into electronic devices, especially in compact devices such as portable electronic devices, can be challenging. Attached Figure Description

[0003] Some features of this subject matter are set forth in the appended claims. However, for illustrative purposes, several aspects of this subject matter are illustrated in the following figures.

[0004] Figure 1 A perspective view of an exemplary electronic device with a microphone, according to various aspects of the subject matter, is shown.

[0005] Figure 2 A cross-sectional side view of a portion of an exemplary electronic device having a microphone and a cavity open to the external environment, according to various aspects of the subject matter, is shown.

[0006] Figure 3 A cross-sectional side view of a portion of an exemplary electronic device having a microphone and a closed cavity, according to various aspects of the subject matter, is shown.

[0007] Figure 4 A schematic cross-sectional top view of a portion of an electronic device having a microphone and a cavity, according to various aspects of the subject matter, is shown.

[0008] Figure 5 A cross-sectional side view of a portion of an exemplary electronic device having a microphone and a cavity at least partially filled with damping material, according to various aspects of the subject matter, is shown.

[0009] Figure 6 A cross-sectional side view of a portion of an exemplary electronic device having a microphone and a cavity at least partially filled with another exemplary damping material, according to various aspects of the subject matter, is shown.

[0010] Figure 7 A cross-sectional side view of a portion of an exemplary electronic device having a microphone and a cavity at least partially filled with yet another exemplary damping material, according to various aspects of the subject matter, is shown.

[0011] Figure 8 A top view is shown of a portion of an electronic device having structural features for preventing the formation of a resonant cavity, according to various aspects of the subject matter.

[0012] Figure 9 A schematic diagram of an exemplary resonator, according to various aspects of the subject matter, is shown, which is coupled to a cavity of an electronic device to improve the performance of a microphone.

[0013] Figure 10 A cross-sectional side view of a portion of an exemplary electronic device having a microphone, a cavity, and a resonator for the microphone within a housing of the electronic device, according to various aspects of the subject matter, is shown.

[0014] Figure 11 A cross-sectional side view of a portion of an exemplary electronic device having a microphone, a cavity, and a resonator for the microphone in the internal structure of the electronic device, according to various aspects of the subject matter, is shown.

[0015] Figure 12 A schematic diagram is shown of multiple resonators coupled to cavities of electronic devices according to various aspects of the subject matter to improve microphone performance at multiple frequencies.

[0016] Figure 13 A schematic diagram is shown of multiple resonators coupled to cavities of electronic devices according to various aspects of the subject matter to provide microphone performance improvements in multiple modes of standing waves.

[0017] Figure 14 A schematic diagram is shown of a resonator connected to an electronic device in accordance with various aspects of the subject matter to provide improved microphone performance.

[0018] Figure 15 An electronic system that can be used to implement one or more specific embodiments of the technology of this subject is shown. Detailed Implementation

[0019] The specific embodiments shown below are intended to describe various configurations of the subject matter and are not intended to represent the only configuration in which the subject matter can be practiced. The accompanying drawings are incorporated herein and form part of the detailed description. The detailed description includes specific details intended to provide a thorough understanding of the subject matter. However, it will be clear and apparent to those skilled in the art that the subject matter is not limited to the specific details shown herein and can be practiced without such specific details. In some cases, well-known structures and components are shown in block diagram form in order to avoid obscuring the concepts of the subject matter.

[0020] Portable electronic devices (such as mobile phones, portable music players, tablet computers, and laptop computers) and wearable devices (such as smartwatches, headphones, earphones, and other wearable devices) typically include one or more audio transducers, such as microphones for receiving sound input or speakers for generating sound.

[0021] However, when attempting to implement audio transducer modules (e.g., microphones or microphone modules) in electronic devices, challenges may arise when constraints on spatial integration with other device components and / or other constraints compete with audio quality constraints. These challenges can be particularly difficult when attempting to implement a microphone in compact devices such as portable or wearable devices. For example, resonant effects within or near the microphone's resonant cavity inside the electronic device's housing can interrupt or suppress audio input to the microphone at one or more resonant frequencies of the cavity. For instance, a resonant cavity can be unintentionally formed when the gap between adjacent housing components of an electronic device becomes closed (e.g., due to displacement of one housing component toward another or due to debris accumulation in the gap).

[0022] According to the aspects disclosed in this subject matter, various features are provided that can improve the resonance effect of a resonant cavity of a microphone adjacent to the electronic device within the housing of the electronic device, thereby improving the microphone's performance. In one or more embodiments, the housing component may be provided with modified edges to prevent gap closure. In one or more embodiments, a portion of the resonant cavity may be at least partially filled with a damping material, such as: a protrusion or extension on the internal structure of the electronic device, an additive material (such as foam) within the cavity, or a thickening of the housing sidewall. In one or more embodiments, a resonator, such as a Helmholtz resonator, may be disposed in a device structure separate from the microphone. For example, a Helmholtz resonator may be formed in an internal plastic structure or in the housing sidewall. As discussed in further detail below, in some embodiments, multiple resonators may be disposed in the electronic device to improve resonance at multiple resonant frequencies and / or multiple resonant frequency modes.

[0023] Figure 1 The image shows an exemplary electronic device including a microphone. Figure 1 In the example, electronic device 100 has been implemented using a housing that is small enough to be portable and carried by the user (e.g., Figure 1 The electronic device 100 may be a handheld electronic device such as a tablet computer, cellular phone, or smartphone. Figure 1As shown, electronic device 100 includes a display, such as display 110 mounted on the front of housing 106. Electronic device 100 includes one or more input / output devices (such as a touchscreen integrated into display 110), buttons or switches (such as button 104), and / or other input / output components disposed above or behind display 110 or above or behind other portions of housing 106. Display 110 and / or housing 106 include one or more openings to accommodate button 104, a speaker, a light source, or a camera.

[0024] exist Figure 1 In the example, housing 106 includes two openings 108 on the bottom sidewall of housing 106. One or more of the openings 108 form ports for audio components. For example, one opening 108 may form a speaker port for a speaker disposed within housing 106, and the other opening 108 may form a microphone port for a microphone disposed within housing 106. The openings 108 may be open ports, or may be completely or partially covered by a permeable membrane or mesh structure that allows air and sound to pass through the opening. Although in Figure 1 Two openings 108 are shown, but this is merely illustrative. One, two, or more openings 108 may be provided on the bottom sidewall (as shown), on another sidewall (e.g., the top sidewall, left sidewall, or right sidewall), on the rear surface of housing 106, and / or on the front surface of housing 106 or display 110. In some embodiments, one or more sets of openings 108 in housing 106 may be aligned with a single port of an audio component within housing 106. Housing 106, sometimes referred to as a shell, may be formed of plastic, glass, ceramic, fiber composite material, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or any combination of two or more of these materials.

[0025] Figure 1 The configuration of the electronic device 100 is merely illustrative. In other embodiments, the electronic device 100 may be a computer, such as a computer integrated into a display (such as a computer monitor), a laptop computer, a wearable device (such as a smartwatch, a lanyard device, or other wearable or micro-device), a media player, a gaming device, a navigation device, a computer monitor, a television, headphones, earphones, or other electronic equipment.

[0026] In some embodiments, electronic device 100 may be provided in the form of a wearable device such as a smartwatch. In one or more embodiments, housing 106 may include one or more interfaces for mechanically attaching housing 106 to a strap or other structure for securing housing 106 to a wearer. Electronic device 100 may include one, two, three, or more than three audio components, each mounted adjacent to one or more openings in opening 108.

[0027] exist Figure 1 In the example, display 110 includes a transparent outer layer 112 (e.g., a glass layer or a transparent plastic layer) that, together with housing 106, forms the housing of electronic device 100. As shown, the transparent outer layer 112 may include one or more openings, such as opening 114. Opening 114 may form a port for audio components. For example, opening 114 may form a microphone port for microphone 116, which is disposed within the housing formed by housing 106 and transparent outer layer 112. Opening 114 may be an open port or may be completely or partially covered by a permeable membrane and / or mesh structure that allows air and sound to pass through opening 114.

[0028] exist Figure 1 In the example, microphone 116 is offset from opening 114. For example, microphone 116 may be acoustically coupled to opening 114 via an acoustic conduit extending within the housing of electronics 100 and between opening 114 and microphone 116. In one or more embodiments, the acoustic conduit, configured to allow sound generated outside electronics 100 to reach microphone 116, may also be acoustically coupled to one or more cavities within the housing formed by housing 106 and transparent outer layer 112. In one or more embodiments, electronics 100 may include a gap 118 between housing 106 and transparent outer layer 112. For example, gap 118 may have a gap width of less than one millimeter (mm), less than 0.5 mm, less than 0.2 mm, less than 0.1 mm, or between zero micrometers and one hundred micrometers. Figure 1 As shown, the housing formed by the outer shell 106 and the transparent outer layer 112 may include one or more straight portions (such as straight portion 120) and one or more curved portions (such as curved portion 122).

[0029] Figure 2 A cross-sectional side view of a portion of the electronic device 100 near a cavity within a housing formed by a housing 106 and a transparent outer layer 112 is shown. Figure 2 As shown, the cavity 208 within the housing formed by the outer shell 106 and the transparent outer layer 112 may be partially defined by a portion of the outer shell 106 (e.g., inner wall 214), a portion of the transparent outer layer 112, and a portion of the internal structure of the electronic device 100 (e.g., surface 216).

[0030] exist Figure 2 In one example, the internal structure of a portion of the defined cavity 208 includes components of the display module 200. As shown, the display module 200 may include a transparent outer layer 112, a display layer 202 (e.g., including display components such as display pixels and / or control circuitry for display pixels), a support structure 204 (e.g., a molded support structure such as a molded plastic support structure), and a support structure 206 (e.g., a metal support structure). In this example, the support structure 204 is overmolded onto the support structure 206. In other examples, the support structure 204 may be attached to the support structure 206 by other attachment mechanisms or methods (e.g., adhesives, screws, clamps, pressure fits, etc.). In one or more embodiments, the support structure 206 may form part of a ground layer for the display module, and in one or more embodiments, it may also form part of an antenna system of the electronic device 100.

[0031] exist Figure 2 In one example, cavity 208 may be partially defined by surface 216 of support structure 204 and partially by inner wall 214 of housing 106. In one or more embodiments, cavity 208 may be fluidly and / or acoustically coupled to... Figure 2 An acoustic conduit between opening 114 and microphone 116. Figure 2 In the example, gap 118 is an air gap between the edge 210 of the transparent outer layer 112 and the edge 212 of the outer shell 106. Figure 2 In the arrangement shown, in the case where sound that has entered the opening 114 and traveled through the acoustic duct to the microphone 116 leaks into the cavity 208, the leaked sound can leak back out of the cavity 208 through the gap 118. In this configuration, the operation of the microphone is not affected by the sound leakage in the cavity 208.

[0032] However, as Figure 3 As shown, in some specific implementations, one or more portions of gap 118 may be closed. For example, in some applications, the transparent outer layer 112 and / or display module 200 may slide toward the edge 212 of housing 106 (e.g., due to external pressure or force on the transparent outer layer, replacement or repair of display module 200, or in a drop event of the electronic device), thereby moving the edge 210 of the transparent outer layer 112 into contact with the edge 212 of housing 106. In another example, over time, material 300 such as debris from the external environment (e.g., oil, dust, dirt, etc.) may become stuck in gap 118, thereby closing gap 118, as... Figure 3 As in the example.

[0033] When the gap 118 is closed, the cavity 208 can become a resonant cavity within the housing 106 (e.g., within a shell formed by the housing 106 and the transparent outer layer 112). The resonant cavity formed by the closure of a portion of the cavity 208 may have resonant properties that negatively affect the operation of the microphone 116.

[0034] For example, Figure 4 It shows including Figure 3 A top view of a portion of an electronic device 100, wherein material 300 has closed a portion of a gap 118. In this example, the gap 118 includes a closed portion 403 and an open portion 404. Figure 3 In the example, the closed portion 403 of the gap 118 is caused by material 300, which has closed the closed portion 403 of the gap 118. However, it should also be understood that the closed portion 403 of the gap 118 may be formed by a portion of the transparent outer layer 112, which has moved to contact the housing 106 to close the closed portion 403 of the gap 118. In these examples, the open portion 404 of the gap 118 may be a portion of the gap 118 that is not yet filled with material 300 and / or not yet closed by contact between the edge 210 of the transparent outer layer 112 and the edge 212 of the housing 106. In this example, a portion of the cavity 208 closed by the closed portion 403 of the gap 118 may form a closed cavity (e.g., a truncated cavity and / or a resonant cavity) within the housing 106 (e.g., within a shell formed by the housing 106 and the transparent outer layer 112). In this example, another part of cavity 208 that is open to the external environment via the open portion 404 of gap 118 may be an open cavity within housing 106 (e.g., an open cavity extending from the distal end of a closed cavity).

[0035] like Figure 4 As illustrated in the example, microphone 116 may include a front volume 409 and a rear volume 411. The front volume may be fluidly and acoustically coupled (e.g., via acoustic conduit 406) to an opening 114 in a transparent outer layer 112 (e.g., a cover glass layer or cover glass). In one or more embodiments, acoustic conduit 406 may be formed by a microphone housing 400 of microphone module 401, in which microphone 116 is disposed. In one or more other embodiments, acoustic conduit 406 may be formed wholly or partially by one or more other device structures that guide sound through opening 114 to microphone 116. In one or more embodiments, cavity 208 may be fluidly and / or acoustically coupled to acoustic conduit 406.

[0036] like Figure 4 As shown, the closed portion of the cavity formed by the closed portion 403 of the gap 118 within the housing of the electronic device 100 (e.g., Figure 3The closed portion of cavity 208 may form a resonant cavity 402 within the housing 106 (e.g., within a housing formed by housing 106 and transparent outer layer 112). (For clarity, it is shown outside the electronic device 100 and...) Figure 3 (This is magnified in the text, and in various examples, it may also be referred to herein as a truncated cavity or standing wave tube). For example, the size and length of cavity 208 allow for the generation of standing waves with wavelength λ within it. Figure 4 As indicated, the wavelength λ of the standing wave can be twice the length of the resonant cavity 402. In other words, the resonant cavity 402 can have a length of λ / 2. The resonant cavity can also have, for example... f = c / (N The resonant frequency of λ / 2, where c is the speed of sound and N is an integer 1, 2, 3, etc. As discussed in further detail below, the resonant cavity 402 (e.g., formed by a portion of cavity 208, which is partially defined by the closed portion 403 of gap 118 and forms a standing wave tube) can generate a pressure zero at microphone 216, which can cause an undesirable drop in the frequency response of microphone 116. In one or more embodiments, the microphone module 401 mounted in the housing adjacent to the opening may include an actuable sound-emitting component 415 (e.g., a diaphragm) offset from the opening 114 in the transparent outer layer 112. Figures 2 to 4 As shown, in one or more specific embodiments, the resonant cavity 402 may extend along the inner wall 214 of the housing 106 from the proximal end 420 of the adjacent microphone module 401 to the distal end 422 in a direction away from the opening 114.

[0037] In one or more specific embodiments, the distal end 422 of the resonant cavity 402 may be defined by the open position of the gap 118, and sound can therefore leak from the cavity 208 to the external environment through the open portion 404 of the gap (e.g., as...). Figure 4 (as in the example). In some examples, the gap 118 may be open in a position where no debris is present in the opening. In other examples, the gap 118 may be open in a position where the outer shell 106 and / or the transparent outer layer 112 are bent away from the straight portion 120 of the housing where the outer shell 106 and the transparent outer layer 112 contact. In one or more embodiments, the distal end 422 may coincide with the position where the straight portion 120 and the bent portion 122 intersect.

[0038] In one or more embodiments, the microphone module 401 may be mounted adjacent to the straight portion 120 of the housing formed by the outer shell 106 and the transparent outer layer 112, and the resonant cavity 402 may extend along the inner wall 214 to the curved portion 122 of the housing formed by the outer shell 106 and the transparent outer layer 112. In one or more embodiments, the cavity 208 may include an open cavity (e.g., via...). Figure 4The open portion 404 is open to the external environment. This open cavity extends along the inner wall 214 of the bend 122 of the housing 106 and is fluidly connected to the resonant cavity 402 at a location within the housing (e.g., the portion fluidly connected to the cavity 208 is partially formed by...). Figure 4 The closed portion 403 is closed and fluidly connected to the external environment of the electronic device 100 via the gap 118 between the transparent outer layer 112 and the housing 106.

[0039] According to the aspects disclosed in this subject matter, electronic devices such as electronic device 100 may be provided with various features that can reduce or prevent the negative effects of a resonant cavity that may be formed within the housing of the electronic device on a microphone such as microphone 116. For example, in one or more embodiments, one or more damping features may be provided adjacent to at least a portion of the cavity and / or within at least a portion of the cavity to dampen the acoustic resonance of the cavity. In one or more embodiments, electronic device 100 may be provided with one or more structural features to prevent the formation of a resonant cavity within its housing. In one or more embodiments, one or more additional resonances may be introduced to improve the resonant effect of the resonant cavity on a microphone such as microphone 116.

[0040] For example, Figure 5 An exemplary embodiment in which the electronic device 100 is provided with a damping feature including damping material 500 within at least a portion of a cavity 208 is shown. For example, the damping material 500 may be an acoustic foam formed within a portion of the cavity. In one or more embodiments, the damping material 500 may reduce the width of the cavity 208 and provide broad damping for resonance of the cavity 208 by narrowing the cavity. In one or more embodiments, the damping material may be injected into the cavity 208 after the housing formed by the outer shell 106 and the transparent outer layer 112 has been assembled.

[0041] Figure 6 Another exemplary embodiment in which the electronic device 100 is provided with a damping feature includes damping material 600 within at least a portion of a cavity 208. Figure 6 In this example, the damping material 600 is formed from an extension member on an internal component of the electronic device 100 (e.g., support structure 204). In this example, the damping material 600 may be a plastic material integrally formed with or attached to the support structure 204 to form an extension member extending into the cavity 208. In this example, the extension member formed by the damping material 600 narrows the width of the cavity 208 and provides broadband damping of the resonant characteristics of the cavity 208.

[0042] Figure 7Another exemplary embodiment in which the electronic device 100 is provided with a damping feature includes damping material 700 within at least a portion of the cavity 208. Figure 7 In this example, the damping material 700 is formed from a thickened portion of the housing 106. In this example, the damping material 700 can be metal, plastic, glass, or other material common to the housing, and is integrally formed with and / or attached to the inner wall 214 of the housing 106. In this example, the thickened portion of the housing 106 formed of the damping material 700 narrows the width of the cavity 208 and provides broadband damping for the resonant characteristics of the cavity 208.

[0043] In one or more embodiments, as an alternative to or supplement to providing damping material within cavity 208, electronic device 100 may be provided with structural features that help prevent the gap 118 from closing and thus forming a resonant cavity within housing 106. For example... Figure 8 An exemplary embodiment of a patterned edge is shown, wherein the edge 210 of the transparent outer layer 112 is a patterned edge. Figure 8 In the example, the patterned edge of the transparent outer layer 112 is a curved edge comprising peaks 800 and valleys 802. In this example, if the transparent outer layer 112 moves toward the housing 106 (e.g., slides or loosens), the peaks 800 may contact the edge 212 of the housing 106, thereby keeping the remaining portion of the gap 118 adjacent to the valleys 802 open to allow sound to leak from the cavity 208 below (e.g., by keeping the cavity 208 fluidly connected to the external environment of the electronic device 100 via the gap between the valleys 802 and the edge 212 of the housing). This prevents the formation of a resonant cavity. Although in Figure 8 The diagram shows the smooth, curved, patterned edges of the transparent outer layer 112, but it should also be understood that in various specific embodiments, other patterns may be provided on the edges 210 of the transparent outer layer 112 and / or on the edges 210 of the housing 106 to prevent the closure of the gap 118.

[0044] In one or more specific embodiments, as a patterned edge (e.g., a damping material is disposed within the cavity 208 and / or a transparent outer layer 112 and / or a shell 106 is disposed) Figures 5 to 8 As an alternative or supplement to (as in the example), electronic device 100 may include a resonator for microphone 116. In this way, an additional resonance can be introduced that improves the resonance that may become part of the closed cavity 208.

[0045] For example, Figure 9 An example of a resonator 900 fluidly coupled to a resonant cavity 402 (e.g., and fluidly coupled to the front volume 409 of a microphone 116 via cavity 208) is shown. Figure 9As shown, resonant cavity 402 (e.g., formed by the closed portion of cavity 208) can generate a standing wave with a wavelength λ, which is twice the distance between the near end 420 and the far end 422 of the cavity, and this standing wave can cause a velocity peak and a pressure zero at the end of resonant cavity 402. In this example, resonator 900 is configured to modify the resonance of resonant cavity 402 at a target frequency corresponding to wavelength λ / 2 (e.g., by modifying and / or reducing the standing wave within the cavity), and resonator 900 is located at a quarter-wavelength position of the standing wave (e.g., at a distance λ / 4 from the near end 420). At this position (e.g., the peak pressure position), the pressure generated by the standing wave within resonant cavity 402 can have a maximum pressure, which can be modified and / or reduced by resonator 900 at this position.

[0046] exist Figure 9 In the example, resonator 900 is a Helmholtz resonator having an acoustically compliant portion 902 (e.g., a neck) and an acoustically compliant portion 904 (e.g., a chamber) connected between the acoustically compliant portion 902 and the resonant cavity 402. Figure 9 In one example, the electronic device 100 also includes an acoustic mesh 906 spanning an acoustic quality portion 904 of the resonator 900. In various embodiments, the acoustic mesh 906 may be located at one or both ends of the acoustic quality portion 904, or at a location between the ends of the acoustic quality portion 904, and may substantially span the cross-sectional area of ​​the acoustic quality portion 904. The acoustic mesh 906 may be a mesh exhibiting loss relative to velocity, and may be positioned across the acoustic quality portion 904 because velocity is highest in the acoustic quality of the Helmholtz resonator. In one or more embodiments, as a supplement to or alternative to the acoustic mesh 906, the resonator 900 may have a damping material in the acoustic compliance portion 902. For example, the damping material in the acoustic compliance portion 902 may provide damping in terms of pressure loss as a supplement to or alternative to the damping in terms of velocity loss caused by the acoustic mesh 906 (e.g., because at resonance, peak pressure may occur in the acoustic compliance portion 902 and peak velocity may occur in the acoustic quality portion 904).

[0047] In one or more embodiments, the resonator 900 for the microphone 116 is positioned spatially separate from the microphone 116. For example, the resonator 900 may be formed within the housing 106 or internal structure (e.g., support structure 204) of the electronic device 100. Figure 10An example is shown in which a resonator 900 is formed in a housing 106 (e.g., in an inner wall 214 of housing 106). In this example, the resonator 900 (e.g., including a sound quality portion 904 and a sound compliance portion 902) may be directly machined into the inner wall 214 of housing 106 or otherwise formed therein. In this example, the resonator 900 may be located within housing 106 at a spatially separated location from microphone module 401. For example, the resonator 900 may be located at a location between the proximal end 420 and the distal end 422 of resonant cavity 402 (e.g., a peak pressure location, such as a quarter-wavelength location). For example, the peak pressure location or quarter-wavelength location may be located at the midpoint of resonant cavity 402 (e.g., midway between the proximal end 420 and the distal end 422). It should also be understood that, when manufacturing electronic device 100, the resonator 900 in housing 106 may be fluidly coupled to cavity 208 at a location adjacent to the open portion 404 of gap 118. Thus, the resonator 900 can be positioned in the housing 106 to enable the future time-damped cavity 208 to resonate when the gap 118 or a portion thereof becomes closed and / or blocked.

[0048] Figure 11 Another exemplary embodiment in which a resonator 900 is formed in a support structure 204 of a display module 200 is shown. In this example, the resonator 900 (e.g., including an acoustic quality portion 904 and an acoustic compliance portion 902) may be formed, for example, by overmolding the support structure 204 with a sacrificial material having the shape of the resonator 900 and removing the sacrificial material to form the resonator 900. In this example, the resonator 900 may be disposed within the support structure 204 at a spatially separated location from the microphone module 401. For example, the resonator 900 may be disposed in the support structure 204 at a location between the proximal end 420 and the distal end 422 of the resonant cavity 402 (e.g., a peak pressure location such as a quarter-wavelength location). It should also be understood that, when manufacturing the electronic device 100, the resonator 900 in the support structure 204 may be fluidly coupled to the cavity 208 at a location adjacent to the open portion 404 of the gap 118. In this way, the resonator 900 can be positioned in the support structure 204 during manufacturing to dampen the resonance characteristics of the cavity 208 in the future time when the gap 118 or a portion thereof becomes closed and / or blocked.

[0049] As discussed herein with reference to various examples, in some applications, the closure of a portion of the gap 118 of the resonant cavity portion of cavity 208 may occur due to manufacturing variations between devices, or (after manufacturing) due to accidental dropping of electronic device 100, external pressure or force on electronic device 100, replacement or repair of components such as display module 200 or a portion thereof, and / or due to the accumulation of debris in the gap 118 over time. Therefore, the length of the resonant cavity within an electronic device such as electronic device 100 may vary between devices and / or may change over time. Consequently, the length and / or resonant characteristics of the resonant cavity portion of cavity 208 at any given time may be unknown at the time of manufacturing the electronic device. In one or more specific embodiments, electronic device such as electronic device 100 may include multiple resonators for microphone 116. For example, the size and arrangement of said multiple resonators may be designed to provide targeted modification and / or reduction of standing waves at various wavelengths / frequencies (e.g., in resonant cavities with various corresponding lengths).

[0050] For example, Figure 12 An example is shown in which the electronic device 100 includes a resonator 900 configured to modify and / or reduce the resonant characteristics of a resonant cavity 402 and an additional resonator 1200 configured to modify and / or reduce the resonant characteristics of a relatively long resonant cavity (such as resonant cavity 1203). For example, in an exemplary use case, a resonant cavity 402 can be formed when a portion of the transparent outer layer 112 slides to contact a portion of the housing 106 and closes a corresponding portion of the gap 118, the portion having a length defining the length of the resonant cavity 402. In this exemplary use case, over time, another portion of the gap 118 that was not closed when the portion of the transparent outer layer 112 slid to contact the portion of the housing 106 may become closed (e.g., by becoming filled with debris or due to further sliding of the transparent outer layer 112), thereby extending the resonant cavity (e.g., the closed portion of cavity 208) to form resonant cavity 1203. For example, the resonant cavity 1203 can be formed by extending the distal end of the closed portion of the cavity 208 to the distal end 1220 of the resonant cavity 1203.

[0051] As shown, a resonant cavity 402, at least partially defined by a device housing and extending from a proximal end 420 (adjacent to microphone 116) to a distal end 422 (spatially separated from microphone 116), may have a resonator 900 fluidly connected thereto at a quarter-wavelength position of the resonant cavity 402 (e.g., at the midpoint of the resonant cavity 402, such as at a distance A / 2 from the proximal end 420 of a resonant cavity having a length A, which may be half the wavelength λ of the standing wave in the resonant cavity 402). As shown, the resonant cavity 402 extends from the proximal end 420 through the resonator 900 to the distal end 422. However, if the resonant cavity 402 is extended to form a resonant cavity 1203 (e.g., having a length B), the resonator 900 may no longer effectively modify and / or reduce the resonant characteristics of the cavity. However, in this exemplary use case, the resonator 1200 for microphone 116 may be positioned at an additional location between the location of the resonator 900 and the distal end of the cavity. Because resonant cavity 1203 is longer than resonant cavity 402, resonant cavity 1203 can generate a standing wave (e.g., with a wavelength of 2B) that has a longer wavelength λ (e.g., 2Å) than that of resonant cavity 402. Figure 12 As shown, resonator 1200 may be located at a quarter-wavelength position of the standing wave in resonant cavity 1203 (e.g., at the midpoint of resonant cavity 1203, such as at a distance B / 2 from the near end 420). As shown, resonator 1200 may also be a Helmholtz resonator and may include an acoustic portion 1204 and an acoustically compliant portion 1202. As shown, resonator 1200 may also include an acoustic mesh 1206 disposed across the acoustic portion 1204 within or at its ends. In one or more embodiments, resonator 1200 may also, or alternatively, include damping material in the acoustically compliant portion 1202.

[0052] like Figure 12 As shown, resonator 1200 may have a compliant portion 1202 (e.g., a chamber) and a acoustic quality portion 1204 (e.g., a neck) extending from the resonant cavity 1203 to the compliant portion 1202. As shown, except that it is positioned further away from microphone module 401 (e.g., at proximal end 420), the acoustic quality portion 1204 of resonator 900 may be relatively longer than the acoustic quality portion 904 of resonator 900, and the compliant portion 1202 of resonator 1200 may be relatively larger in volume than the compliant portion 902 of resonator 900 (e.g., to tune resonator 1200 to wavelength 2B of resonant cavity 1203). Figure 12As shown, the resonator 1200 may be provided with an acoustic grid 1206 spanning the acoustic portion 1204. In various specific embodiments, the acoustic grid 1206 may be provided across the acoustic portion 1204 at the end of the acoustic portion 1204 where it intersects with the resonant cavity 1203, at the opposite end of the acoustic portion 1204 where it intersects with the acoustic compliance portion 1202, or at an intermediate position between the ends of the acoustic portion 1204.

[0053] exist Figure 12 In the example, electronic device 100 is provided with two resonators (resonator 900 and resonator 1200) to modify and / or reduce the resonant characteristics of two resonant cavities with different lengths. In other specific embodiments, more than two resonators may be provided along cavity 208 to provide modification and / or reduction of resonant effects for more than two different lengths of resonant cavities, and / or two or more resonators may be provided along the cavity to provide damping for multiple modes of a single resonant cavity (e.g., N=1, 2, 3, etc.).

[0054] For example, Figure 13 An example is shown in which two resonators 900 are coupled to resonant cavity 402 to modify and / or reduce the effects of multiple modes of a standing wave with wavelength λ. Figure 13 In one example, the electronic device 100 includes a resonator 900 at a first peak pressure location where the pressure in the resonant cavity 402 reaches its peak at a quarter-wavelength position, and an additional resonator 900 for a microphone at an additional peak pressure location between this location of the resonator and the distal end of the resonant cavity 402 (e.g., at a location where the pressure in the resonant cavity 402 is at maximum negative pressure). For example, the resonator 900 closest to the proximal end 420 may be configured to modify the resonance of a first mode of a standing wave having wavelength λ, and the resonator 900 may be located at a quarter-wavelength position of the standing wave (e.g., at a distance of a quarter-wavelength λ from the proximal end 420). Figure 13 In one example, the electronic device 100 also includes a second resonator 900 located at a three-quarter wavelength position of a standing wave having a wavelength λ (e.g., at a distance of three-quarter wavelength λ from the near end 420). In one or more embodiments, the resonator 900 at the three-quarter wavelength position may be disposed (e.g., within an internal component such as a support structure 204, or in a housing 106) in a bend 122 of the housing of the electronic device 100.

[0055] exist Figures 4 to 13In one example, resonant cavity 402 (and resonant cavity 1203) may have a length defined by a location along cavity 208, at which the closed portion 403 of gap 118 terminates, and gap 118 is open outside this location. In one or more other examples, the length of the resonant cavity formed by cavity 208 may be defined by a barrier (e.g., a physical barrier) at the distal end of the cavity. For example, Figure 14 An example is shown in which a resonant cavity 1402 (e.g., formed by a portion of cavity 208, with gap 118 closed along this portion) extends from a proximal end 1404 (e.g., adjacent to microphone 116) to a barrier 1400 (e.g., a physical barrier such as a wall) at a distal end 1406. In this example, barrier 1400 closes the resonant cavity 1402 at the distal end 1406. In this example, resonator 900 is configured to modify the resonance of a standing wave having a wavelength λ, which is four times the distance between the proximal end 1404 and the distal end 1406 of resonant cavity 1402. In this example, resonator 900 is positioned adjacent to barrier 1400 at a quarter-wavelength location of the standing wave (e.g., at a quarter-wavelength λ distance from the proximal end 1404).

[0056] According to one or more specific embodiments, a device such as electronic device 100 may include a microphone 116 having a front volume 409 and a rear volume 411, and a resonator 900 for the microphone 116, the resonator 900 being fluidly coupled to the front volume 409 of the microphone 116 (e.g., as incorporated herein by reference). Figure 4 As described herein, in one or more embodiments, resonator 900 may be a Helmholtz resonator (e.g., a Helmholtz resonator including a neck (e.g., acoustic quality portion 904) and a chamber (e.g., acoustic compliance portion 902)). As discussed herein, electronic device 100 may also include an acoustic grid 906 spanning the neck (e.g., acoustic quality portion 904) of the Helmholtz resonator. In one or more embodiments, electronic device 100 may include a cavity (e.g., cavity 208 and / or resonant cavity 402 formed by a portion of cavity 208) at least partially defined by a device housing (e.g., housing 106) of electronic device 100, which extends from a proximal end 420 adjacent to microphone 116 to a spatially separated distal end 422 from microphone 116. Resonator 900 may be fluidly coupled to this cavity. In one or more embodiments, electronic device 100 may also include a device housing (e.g., formed at least partially by housing 106 and a transparent outer layer 112) having an opening 114 for microphone 116. Microphone 116 may include a diaphragm (e.g., an actuable sound-generating component 415) laterally offset from an opening 114 in the device housing. Figure 4 (As shown).

[0057] According to one or more specific embodiments, a device such as electronic device 100 may include a device housing (e.g., formed at least partially by a housing 106 and a transparent outer layer 112), an acoustic component (e.g., a microphone 116) disposed within the device housing, and a resonator 900 for the acoustic component, the resonator being formed in the device housing at a spatially separated location from the acoustic component. For example, the acoustic component may include the microphone 116, which is configured to receive sound from the external environment of the device through an opening 114 in the device housing. In one or more specific embodiments described herein, the electronic device may also include a cavity (e.g., cavity 208 and / or a resonant cavity 402 formed by a portion of cavity 208) at least partially defined by the device housing and extending from a proximal end 420 adjacent to the microphone 116 to a spatially separated distal end 422 from the microphone 116, to which the resonator 900 is fluidly coupled. As incorporated herein by various examples (e.g., in conjunction with...) Figure 4 , Figure 9 , Figure 12 and / or Figure 13 As discussed, the cavity can extend from the proximal end 420 through the resonator 900 to the distal end 422. For example, in conjunction with... Figure 4 The cavity discussed may be a closed cavity, and the electronic device 100 may also include an open cavity extending from the distal end 422 of the closed cavity, the open cavity (e.g., via the open portion 404 of the gap 118) being fluidly connected to the external environment of the electronic device. As illustrated herein by example... Figure 12 In one or more embodiments discussed, the electronic device 100 may further include an additional resonator 1200 formed in the device housing (e.g., in housing 106) at a location adjacent to the resonator 900. As illustrated herein by example... Figure 14 The electronic device 100 discussed may also include a barrier 1400 at the distal end 1406 of the cavity, and the resonator 900 may be located adjacent to the barrier 1400.

[0058] According to one or more specific embodiments, a device such as electronic device 100 may include: a housing having an opening 114 (e.g., formed at least partially by a housing 106 and a transparent outer layer 112); a microphone module 401 mounted within the housing adjacent to the opening 114, the microphone module 401 having an actuable sound-emitting component 415 (e.g., a diaphragm) offset from the opening 114 in the housing; and a cavity 208 extending along the inner wall 214 of the housing from a proximal end 420 adjacent to the opening 114 to a distal end within the housing (e.g., a distal end 422 or another distal end such as a distal end coinciding with a physical barrier); and a resonator 900 for the microphone module 401, the resonator 900 being part of the structure of the electronic device (e.g., as...). Figure 11 The example of support structure 204 or such Figure 10In one or more embodiments, the cavity is formed in the housing 106 of the example at a location between the proximal end 420 and the distal end 422 of the cavity, which is spatially separated from the microphone module 401. In one or more embodiments, the cavity is at least partially defined by a glass housing member (e.g., a transparent outer layer 112) having an edge 210 adjacent to the housing 106. In one or more embodiments, the cavity 208 includes a first portion and a second portion, the first portion being closed by the housing 106 and the glass housing member and extending from the microphone module 401 along the inner wall 214 of the housing 106, the second portion extending from the first portion and fluidly coupled to the external environment of the electronic device through a gap 118 between the housing 106 and the glass housing member. In one or more embodiments, the housing includes a straight portion 120 and a curved portion 122, the first portion of the cavity 208 extending along the straight portion 120 of the housing, and the second portion of the cavity extending along the curved portion 122 of the housing. In one or more embodiments, the structure of the electronic device 100 in which the resonator 900 is formed includes a portion of the housing 106 (e.g., as shown in the example housing 106). Figure 10 (as in the example). In one or more other embodiments, the electronic device 100 includes a display module 200, which includes a cover glass layer (e.g., a transparent outer layer 112) defining a portion of a cavity and a support structure 204, and the structure of the electronic device 100 in which the resonator 900 is formed includes a portion of the support structure 204 of the display module 200 (e.g., as in the example). Figure 11 (as in the example).

[0059] Figure 15 An electronic system 1500 is shown that can be used to implement one or more specific embodiments of the subject matter technology. The electronic system 1500 may be... Figure 1 The electronic system 1500 may be one or more of the illustrated electronic devices 100, and / or may be part of them. The electronic system 1500 may include various types of computer-readable media and interfaces for various other types of computer-readable media. The electronic system 1500 includes a bus 1508, one or more processing units 1512, system memory 1504 (and / or buffers), ROM 1510, persistent storage device 1502, input device interface 1514, output device interface 1506, and one or more network interfaces 1516, or subsets and variations thereof.

[0060] Bus 1508 generally represents all system, peripheral, and chipset buses that communicatively connect numerous internal devices of electronic system 1500. In one or more embodiments, bus 1508 communicatively connects the one or more processing units 1512 to ROM 1510, system memory 1504, and permanent storage device 1502. The one or more processing units 1512 retrieve instructions to be executed and data to be processed from these various memory units in order to execute the procedures disclosed in this paper. In different embodiments, the one or more processing units 1512 may be a single processor or a multi-core processor.

[0061] ROM 1510 stores static data and instructions required by the one or more processing units 1512 and other modules of the electronic system 1500. On the other hand, persistent storage device 1502 can be a read-write memory device. Persistent storage device 1502 can be a non-volatile memory cell that stores instructions and data even when the electronic system 1500 is powered off. In one or more embodiments, mass storage devices (such as magnetic disks or optical disks and their corresponding disk drives) can be used as persistent storage device 1502.

[0062] In one or more embodiments, a removable storage device (such as a floppy disk, flash drive, and its corresponding disk drive) may be used as persistent storage device 1502. Like persistent storage device 1502, system memory 1504 may be a read-write memory device. However, unlike persistent storage device 1502, system memory 1504 may be volatile read-write memory, such as random access memory. System memory 1504 may store any instructions and data that one or more processing units 1512 may need during operation. In one or more embodiments, the processes disclosed in this subject matter are stored in system memory 1504, persistent storage device 1502, and / or ROM 1510. The one or more processing units 1512 retrieve instructions to be executed and data to be processed from these various memory units to execute the processes of one or more embodiments.

[0063] Bus 1508 is also connected to input device interface 1514 and output device interface 1506. Input device interface 1514 enables a user to transmit information and select commands to electronic system 1500. Input devices that can be used with input device interface 1514 may include, for example, a microphone, an alphanumeric keypad, and a pointing device (also known as a "cursor control device"). Output device interface 1506 enables, for example, the display of images generated by electronic system 1500. Output devices that can be used with output device interface 1506 may include, for example, printers and display devices such as liquid crystal displays (LCDs), light-emitting diode (LED) displays, organic light-emitting diode (OLED) displays, flexible displays, flat panel displays, solid-state displays, projectors, speakers or speaker modules, or any other device for outputting information. One or more embodiments may include devices that act as both input and output devices, such as touchscreens. In these embodiments, the feedback provided to the user can be any form of sensory feedback, such as visual feedback, auditory feedback, or tactile feedback; and input from the user can be received in any form, including acoustic, voice, or tactile input.

[0064] Finally, as Figure 15 As shown, bus 1508 also connects electronic system 1500 to one or more networks and / or one or more network nodes via the one or more network interfaces 1516. In this way, electronic system 1500 may be part of a computer network (such as a LAN, wide area network (“WAN”), or intranet), or may be part of a network of networks (such as the Internet). Any or all components of electronic system 1500 may be used in conjunction with the subject matter disclosed herein.

[0065] According to some aspects disclosed in this subject matter, an apparatus is provided comprising: a microphone having a front volume and a rear volume; and a resonator for the microphone, the resonator being fluidly coupled to the front volume of the microphone.

[0066] According to other aspects disclosed in this subject matter, an apparatus is provided comprising: an apparatus housing; an acoustic component disposed within the apparatus housing; and a resonator for the acoustic component, the resonator being formed in the outer casing of the apparatus housing at a spatially separated location from the acoustic component.

[0067] According to other aspects disclosed in this subject matter, an electronic device is provided, the electronic device comprising: a housing having an opening; a microphone module mounted within the housing adjacent to the opening, the microphone module having an actuable sound-generating component offset from the opening in the housing; a cavity extending along an inner wall of the housing from a proximal end adjacent to the microphone module to a distal end within the housing in a direction away from the opening; and a resonator for the microphone module, the resonator being formed in the structure of the electronic device at a location between the proximal end and the distal end of the cavity, the location being spatially separated from the microphone module.

[0068] According to other aspects disclosed in this subject matter, an electronic device is provided, the electronic device comprising: a housing having an opening; a microphone module mounted within the housing adjacent to the opening, the microphone module having an actuable sound-generating component offset from the opening in the housing; a cavity extending along an inner wall of the housing from a proximal end adjacent to the microphone module to a distal end in a direction away from the opening; and a damping feature within a portion of the cavity and configured to dampen acoustic resonances of the cavity.

[0069] According to other aspects disclosed in this subject matter, an electronic device is provided, the electronic device comprising: a housing having an opening and a cover layer; a microphone module mounted within the housing adjacent to the opening, the microphone module having an actuable sound-emitting component offset from the opening in the housing; and a cavity extending along an inner wall of the housing from a proximal end adjacent to the microphone module to a distal end in a direction away from the opening, wherein the cover layer partially defines the cavity and includes patterned edges.

[0070] According to other aspects disclosed in this subject matter, an electronic device is provided, the electronic device comprising: a housing; a cover layer mounted to the housing; a microphone within the housing; a resonant cavity within the housing, separate from and acoustically coupled to the microphone; and a material that at least partially fills a portion of the resonant cavity and is configured to improve the acoustic resonance of the resonant cavity.

[0071] The embodiments within the scope of this disclosure may be implemented in part or in whole using a tangible computer-readable storage medium (or multiple tangible computer-readable storage media of one or more types) on which one or more instructions are written. The tangible computer-readable storage medium may also be substantially non-transitory.

[0072] Computer-readable storage media can be any storage medium that can be read, written, or otherwise accessed by general-purpose or special-purpose computing devices, including any processing electronics and / or processing circuits capable of executing instructions. For example, without limitation, computer-readable media can include any volatile semiconductor memory, such as RAM, DRAM, SRAM, T-RAM, Z-RAM, and TTRAM. Computer-readable media can also include any non-volatile semiconductor memory, such as ROM, PROM, EPROM, EEPROM, NVRAM, flash memory, nvSRAM, FeRAM, FeTRAM, MRAM, PRAM, CBRAM, SONOS, RRAM, NRAM, track memory, FJG, and Millipede memory.

[0073] Furthermore, computer-readable storage media may include any non-semiconductor memory, such as optical disc storage devices, magnetic disk storage devices, magnetic tape, other magnetic storage devices, or any other medium capable of storing one or more instructions. In one or more embodiments, the tangible computer-readable storage medium may be directly coupled to a computing device, while in other embodiments, the tangible computer-readable storage medium may be indirectly coupled to a computing device, for example, via one or more wired connections, one or more wireless connections, or any combination thereof.

[0074] Instructions can be directly executable or can be used to develop executable instructions. For example, instructions can be implemented as executable or non-executable machine code, or as high-level language instructions that can be compiled to produce executable or non-executable machine code. Furthermore, instructions can also be implemented as data, or may include data. Computer executable instructions can also be organized in any format, including routines, subroutines, programs, data structures, objects, modules, applications, applets, functions, etc. As those skilled in the art will recognize, details including, but not limited to, the number, structure, sequence, and organization of instructions can vary significantly without altering the underlying logic, functionality, processing, and output.

[0075] While the above discussion primarily concerns microprocessors or multi-core processors that execute software, one or more specific implementations are executed by one or more integrated circuits such as ASICs or FPGAs. In one or more specific implementations, such integrated circuits execute instructions stored on the circuit itself.

[0076] The various functions described above can be implemented in digital electronic circuits, computer software, firmware, or hardware. This technology can be implemented using one or more computer program products. Programmable processors and computers can be included in or packaged as mobile devices. The process and logic flow can be executed by one or more programmable processors and one or more programmable logic circuits. General-purpose and special-purpose computing devices, as well as storage devices, can be interconnected via communication networks.

[0077] Some specific implementations include storing computer program instructions in machine-readable or computer-readable media (or computer-readable storage media, machine-readable media, or machine-readable storage media), such as microprocessors, storage devices, and memories. Examples of such computer-readable media include RAM, ROM, read-only optical discs (CD-ROM), recordable optical discs (CD-R), rewritable optical discs (CD-RW), read-only digital versatile optical discs (e.g., DVD-ROM, dual-layer DVD-ROM), various recordable / rewritable DVDs (e.g., DVD-RAM, DVD-RW, DVD+RW, etc.), flash memory (e.g., SD cards, mini-SD cards, micro-SD cards, etc.), magnetic and / or solid-state hard disk drives, high-density optical discs, any other optical or magnetic media, and floppy disks. Computer-readable media may store computer programs that can be executed by at least one processing unit and include a set of instructions for performing various operations. Examples of computer programs or computer code include machine code, such as machine code generated by a compiler, and files that include higher-level code that can be executed by a computer, electronic components, or microprocessor using an interpreter.

[0078] While the above discussion primarily concerns microprocessors or multi-core processors that execute software, some implementations are performed by one or more integrated circuits such as application-specific integrated circuits (ASICs) or field-programmable gate arrays (FPGAs). In some implementations, such integrated circuits execute instructions stored on the circuit itself.

[0079] As used in this specification and any claim of this patent application, the terms "computer," "processor," and "memory" refer to electronic or other technical devices. These terms exclude persons or groups of persons. For the purposes of this specification, the terms "display" or "being displayed" mean display on an electronic device. As used in this specification and any claim of this patent application, the terms "computer-readable medium" and "computer-readable media" are entirely limited to tangible, touchable objects that store information in a form readable by a computer. These terms do not include any wireless signals, wired download signals, or any other transient signals.

[0080] Many of the features and applications described above can be implemented as software processes that specify a set of instructions to be recorded on a computer-readable storage medium (also referred to as a computer-readable medium). When these instructions are executed by one or more processing units (e.g., one or more processors, processor cores, or other processing units), the instructions cause the one or more processing units to perform the actions indicated in the instructions. Examples of computer-readable media include, but are not limited to, CD-ROMs, flash drives, RAM chips, hard disk drives, EPROMs, etc. Computer-readable media do not include carrier waves and electrical signals transmitted wirelessly or via wired connections.

[0081] In this specification, the term "software" is intended to include firmware residing in read-only memory or applications stored in magnetic storage devices, which can be read into memory for processing by a processor. Similarly, in some embodiments, multiple software aspects disclosed herein may be implemented as sub-parts of a larger program while retaining the different software aspects disclosed herein. In some embodiments, multiple software aspects may also be implemented as independent programs. Finally, any combination of independent programs that collectively implement the software aspects described herein is within the scope of this disclosure. In some embodiments, when installed to run on one or more electronic systems, a software program defines one or more specific machine implementations that execute and perform the operations of the software program.

[0082] Computer programs (also known as programs, software, software applications, scripts, or code) can be written in any programming language, including compiled or interpreted languages, declarative or procedural languages, and can be deployed in any form, including as standalone programs or as modules, components, subroutines, objects, or other units suitable for use in a computing environment. Computer programs may, but do not necessarily, correspond to files in a file system. A program may be stored as a part of a file containing other programs or data (e.g., one or more scripts stored in a markup language document), in a single file dedicated to the program in its description, or in multiple coordinating files (e.g., a file storing one or more modules, subroutines, or code sections). Computer programs can be deployed to execute on a single computer or on multiple computers located at the same site or distributed across multiple sites and interconnected via a communication network.

[0083] It should be understood that the specific order or hierarchy of the boxes in the process disclosed in this invention is an example of an exemplary method. Based on design preferences, it should be understood that the specific order or hierarchy of the boxes in the process may be rearranged or all shown boxes may be executed. Some boxes within these boxes may be executed simultaneously. For example, in some cases, multitasking and parallel processing may be advantageous. Furthermore, the division of various system components in the above embodiments should not be construed as requiring such division in all embodiments, and it should be understood that program components and systems can generally be integrated together in a single software product or packaged into multiple software products.

[0084] The preceding descriptions are provided to enable those skilled in the art to practice the various aspects described herein. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects. Therefore, this claim is not intended to be limited to the aspects shown herein, but rather to be consistent with the language of the claim, wherein references to elements in singular values ​​are not intended to mean “one and only one,” but rather “one or more,” unless specifically indicated. Unless otherwise specifically stated, the term “some” means one or more. Male pronouns (e.g., his) include female and neutral (e.g., her and its), and vice versa. Titles and subtitles (if any) are used for convenience only and do not limit the disclosure of this subject matter.

[0085] The predicates “configured to,” “capable of operating,” and “programmed to” do not imply any specific tangible or intangible modification to a particular subject but are intended to be used interchangeably. For example, a component or a processor configured to monitor and control operations may also mean that the processor is programmed to monitor and control operations or that the processor is capable of operating to monitor and control operations. Similarly, a processor configured to execute code can be interpreted as either a processor programmed to execute code or a processor capable of operating to execute code.

[0086] The phrase "aspect" does not imply that this aspect is essential to the present subject matter or that this aspect applies to all configurations of the present subject matter. Disclosures relating to an aspect may apply to all configurations, or one or more configurations. The phrase "aspect" may refer to one or more aspects, and vice versa. The phrase "configuration" does not imply that this configuration is essential to the present subject matter or that this configuration applies to all configurations of the present subject matter. Disclosures relating to a configuration may apply to all configurations, or one or more configurations. The phrase "configuration" may refer to one or more configurations, and vice versa.

[0087] The word “example” is used in this document to mean “used as an example or illustration.” Any aspect or design described in this document as an “example” is not necessarily to be construed as superior or advantageous to any other aspect or design.

[0088] On one hand, the term "coupled" can refer to direct coupling. On the other hand, the term "connection" can refer to indirect connection.

[0089] Terms such as top, bottom, front, back, side, horizontal, and vertical refer to any frame of reference, not the usual gravitational frame of reference. Therefore, such terms can extend upward, downward, diagonally, or horizontally within a gravitational frame of reference.

[0090] All structural and functional equivalents of elements throughout the various aspects described herein that are known or later become apparent to those skilled in the art are expressly incorporated herein by reference and are intended to be covered by the claims. Furthermore, nothing disclosed herein is intended to be made public, regardless of whether such disclosure is expressly stated in the claims. No claim element should be interpreted in accordance with 35 U.S.SC §112(f) unless the element is expressly stated using the phrase “means for…” or, in the case of a method claim, using the phrase “steps for…”. Furthermore, terms such as “comprising,” “having,” etc., are used to a certain extent in the specification or claims, and such terms are intended to be included in a manner similar to how the term “comprising” is interpreted when used as a transitional word in a claim.

Claims

1. An electronic device, comprising: A housing having an opening and sidewalls; A microphone module is mounted within the housing adjacent to the opening, the microphone module having an actuable sound-emitting component offset from the opening in the housing; A cavity formed in the sidewall extends along the inner wall of the housing in a direction away from the opening; and A damping feature portion is located within a portion of the cavity.

2. The electronic device according to claim 1, wherein, The damping feature includes damping material within the portion of the cavity.

3. The electronic device according to claim 2, wherein, The damping material comprises foam within the portion of the cavity.

4. The electronic device according to claim 2, wherein, The damping material includes the thickened portion of the outer shell of the housing.

5. The electronic device according to claim 2, wherein, The damping material includes an extension member on the internal components of the electronic device.

6. The electronic device according to claim 2, wherein, The microphone module is mounted adjacent to the straight portion of the housing, and the cavity extends along the inner wall to the curved portion of the housing.

7. The electronic device according to claim 6, wherein, The housing includes an outer shell and a cover glass. The electronic device also includes an open cavity that extends along the inner wall of the bend in the housing and is fluidly connected to the cavity at a location within the housing and fluidly connected to the external environment of the electronic device via a gap between the cover glass and the outer shell.

8. An electronic device, comprising: Housing, the housing comprising: A shell that defines the opening; and A transparent outer layer, which is separated from the outer shell by a gap, and the transparent outer layer includes patterned edges; A microphone module, wherein the microphone module is mounted within the housing adjacent to the opening; and A cavity that extends along the inner wall of the housing in a direction away from the opening. The transparent outer layer partially defines the cavity, and partially defines the gap based on the patterned edges.

9. The electronic device according to claim 8, wherein, The housing also includes the outer casing of the electronic device, wherein the patterned edge of the transparent outer layer is adjacent to the edge of the outer casing.

10. The electronic device according to claim 9, wherein, The patterned edges of the transparent outer layer include at least one peak and at least one valley.

11. The electronic device according to claim 10, wherein, The at least one peak, when moved to contact the edge of the housing, prevents the at least one valley from contacting the edge of the housing, such that the gap at the location between the at least one valley and the edge of the housing fluidly connects the cavity to the external environment of the electronic device.

12. The electronic device according to claim 11, wherein, The transparent outer layer includes a cover glass layer.

13. The electronic device according to claim 8, wherein, The microphone module is mounted adjacent to the straight portion of the housing, and the cavity extends along the inner wall to the curved portion of the housing.

14. An electronic device comprising: shell; A cover layer, the cover layer being mounted to the housing; The display module includes the cover layer and the support structure; A microphone, which is located within the housing; A resonant cavity, located within the housing, is separate from and acoustically coupled to the microphone, wherein the resonant cavity is partially defined by the housing and the support structure; and A damping material that at least partially fills a portion of the resonant cavity.

15. The electronic device according to claim 14, wherein, The material includes foam in the portion of the resonant cavity.

16. The electronic device according to claim 14, wherein: The support structure includes a surface. The outer casing includes an inner wall, and The resonant cavity is further defined by the surface and the inner wall.

17. The electronic device according to claim 14, wherein, The material includes extension members on the internal components of the electronic device.

18. The electronic device according to claim 17, wherein, The internal components include the support structure for the display module.

19. The electronic device according to claim 14, wherein, The microphone is mounted adjacent to the straight portion of the housing, and the cavity extends along the inner wall of the housing to the curved portion of the housing.

20. The electronic device according to claim 19, wherein, The gap between the cover layer and the housing fluidly connects the resonant cavity to the external environment of the electronic device.

Images