An electronic device

Abstract

The present disclosure provides an electronic device, comprising a first electronic component connected to a circuit board, a first shielding structure is arranged on at least one side of the first electronic component close to a radio frequency interference source; along the radiation direction of the radio frequency interference source, the first shielding structure constitutes at least one shielding wall; the first shielding structure is configured to extend to the inner wall of the shell of the electronic device in the thickness direction of the electronic device; and the outer periphery of the first shielding structure is configured as a metal layer. The first shielding structure can shield the radio frequency interference signal in the thickness direction of the electronic device, thereby reducing the harmful effects of the radio frequency interference signal on the first electronic component.

Description

Technical Field

[0001] This disclosure relates to the field of electronic devices, and more particularly to an electronic device for shielding against the effects of radio frequency interference. Background Technology

[0002] With the continuous advancement of information technology, the application of electronic devices is accelerating people's information acquisition speed, and the safe application of electronic devices is receiving increasing attention from consumers. However, because electronic devices are composed of numerous electronic components, these components often generate radio frequency (RF) interference signals that affect each other. RF interference refers to the conduction or radiation of radio frequency energy, causing noise in electronic or electrical equipment, which often interferes with the function of adjacent devices. RF interference is a problem that degrades the performance of electronic and communication equipment. Each type of device responds differently to RF interference, which can lead to system and information loss, data and security vulnerabilities, and even device malfunctions. In the real world, RF interference is prevalent in electronic products and cannot be eliminated. The electronic components in a device's circuitry can emit radio frequency electromagnetic signals and are also susceptible to the effects of these signals.

[0003] Using radio frequency shielding is a measure to protect our electronic components from the harmful effects of radio frequency interference. However, existing shielding solutions are rather chaotic and unsuitable for the long-term use of electronic devices. Summary of the Invention

[0004] This disclosure provides an electronic device to at least solve the above-mentioned technical problems existing in the prior art.

[0005] According to a first aspect of this disclosure, an electronic device is provided, comprising: a first electronic component connected to a circuit board; a first shielding structure disposed on at least one side of the first electronic component near a radio frequency interference source; the first shielding structure forming at least one shielding wall along the radiation direction of the radio frequency interference source; the first shielding structure being configured to extend along the thickness direction of the electronic device to the inner wall of the electronic device's housing; and the first shielding structure having at least a metal layer on its outer periphery.

[0006] In one embodiment, the first shielding structure is formed on the inner wall of the housing of the electronic device.

[0007] In one embodiment, the first shielding structure is disposed between the circuit board and the inner wall of the electronic device housing.

[0008] In one embodiment, the first shielding structure is connected to the side of the circuit board for mounting the first electronic component.

[0009] In one embodiment, a gap is left between the first shielding structure and the circuit board in the thickness direction of the circuit board, and a plurality of second shielding structures are arranged in the space around the gap.

[0010] In one embodiment, the plurality of second shielding structures are respectively disposed on both sides of the first shielding structure.

[0011] In one embodiment, the plurality of second shielding structures are staggered on both sides of the first shielding structure.

[0012] In one embodiment, the projection height of the second shielding structure onto the first shielding structure is greater than the height of the gap.

[0013] In one embodiment, the second shielding structure is constructed as solder joints.

[0014] In one embodiment, the first shielding structure is configured to have a metal layer electroplated on the surface of an insulator.

[0015] The disclosed electronic device employs a first shielding structure extending along the thickness direction of the electronic device to the inner wall of the device housing. This structure can directly block radio frequency interference sources along the cross-sectional direction of the electronic device in their radiation path. The first shielding structure has at least a metal layer on its outer periphery, which utilizes the conductivity of the metal layer surface to conduct or reflect radiated radio frequency electromagnetic waves, thereby maximally cutting off the range of radio frequency interference sources radiating to the first electronic component. This reduces the radiation impact of radio frequency interference sources outside the first electronic component on it.

[0016] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0017] The above and other objects, features, and advantages of this disclosure will become readily apparent from the following detailed description of exemplary embodiments, taken in conjunction with the accompanying drawings. Several embodiments of this disclosure are illustrated in the drawings by way of example and not limitation, in which:

[0018] In the accompanying drawings, the same or corresponding reference numerals indicate the same or corresponding parts.

[0019] Figure 1 A schematic diagram of the lower structure of the lower housing of an electronic device according to an embodiment of the present disclosure is shown;

[0020] Figure 2 A schematic diagram of the upper structure of the lower housing of an electronic device according to an embodiment of the present disclosure is shown;

[0021] Figure 3 A schematic diagram of the structure of an electronic device according to an embodiment of this disclosure is shown. Figure 1 ;

[0022] Figure 4 A schematic diagram of the structure of an electronic device according to an embodiment of this disclosure is shown. Figure 2 ;

[0023] Figure 5 A schematic diagram of the structure of an electronic device according to an embodiment of this disclosure is shown. Figure 3 ;

[0024] Figure 6 A schematic diagram of the structure of an electronic device according to an embodiment of this disclosure is shown. Figure 4 ;

[0025] Figure 7 A schematic diagram of the structure of an electronic device according to an embodiment of this disclosure is shown. Figure 5 ;

[0026] Figure 8 A schematic diagram of the structure of an electronic device according to an embodiment of this disclosure is shown. Figure 6 .

[0027] Explanation of the labels in the diagram:

[0028] 10 - Lower structure; 20 - Upper structure; 30 - First electronic component; 40 - First shielding structure; 50 - Second shielding structure. Detailed Implementation

[0029] To make the objectives, features, and advantages of this disclosure more apparent and understandable, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0030] With the widespread use of electronic devices, the problem of radio frequency interference from various electronic components within these devices has gradually become apparent. These electronic devices can include desktop computers, laptops, tablets, or mobile phones.

[0031] For ease of explanation, this disclosure uses a laptop computer as an example to illustrate the solution. During laptop operation, the circuit boards within the laptop typically integrate various electronic components. Since these components can emit video electromagnetic signals, they are also susceptible to interference from these signals. This section describes a shielding scheme to address radio frequency interference affecting the electronic components within the laptop computer.

[0032] For example, the first electronic component may be a circuit board in a laptop, an antenna module mounted on the circuit board, a battery module, a CPU module, an SSD module, a RAM module, or a connector, etc., wherein the connector may be an I / O port.

[0033] For example, a laptop computer generally includes an external structure and an internal structure. The external structure generally includes a casing, a display screen, a keyboard, a touchpad, a power switch, and interfaces. The internal structure generally includes a motherboard, a processor, memory, a hard drive, a graphics card, a sound card, a network card, etc. The casing generally includes an upper shell and a lower shell. The upper shell includes a top shell structure that engages with the display screen, and the lower shell includes an upper shell structure and a lower shell structure that are mounted to the keyboard. The inner wall of the casing of the electronic device involved in this disclosure embodiment can be understood as the inner wall of the top shell structure, the inner wall of the upper shell structure, or the inner wall of the lower shell structure, depending on the situation.

[0034] The electronic device provided in this disclosure can mitigate interference from surrounding radio frequency radiation received by various electronic components located therein. Specifically, refer to... Figures 1-8 This disclosure provides an electronic device, including: a first electronic component connected to a circuit board; a first shielding structure disposed on at least one side of the first electronic component near a radio frequency interference source; the first shielding structure forming at least one shielding wall along the radiation direction of the radio frequency interference source; the first shielding structure being configured to extend along the thickness direction of the electronic device to the inner wall of the electronic device's housing; and the first shielding structure having at least a metal layer on its outer periphery.

[0035] For example, the first shielding structure may be a structure with a metal layer on the outer periphery.

[0036] For example, the metal layer can be copper, aluminum, or other metal layers with conductive properties.

[0037] The first shielding structure is not limited to having a metal layer only on the outer periphery; it can also have a metal structure used in the whole or in part, provided that there is an outer peripheral metal layer.

[0038] For example, the first shielding structure can be a single shielding wall structure, or it can be two, three or more shielding walls stacked along the radio frequency electromagnetic wave radiation direction.

[0039] For example, refer to Figure 3 and Figure 4 The first shielding structure can be constructed as an extension structure in a single direction, such as a straight plate structure.

[0040] Alternatively, for example, the first shielding structure can also be constructed as an extending structure in two directions, such as an L-shaped plate structure.

[0041] Or, for example, refer to Figure 5 , Figure 6 and Figure 8 The first shielding structure can also be constructed as an extension structure in four directions, such as a U-shaped plate structure, a square plate structure, or a square plate structure.

[0042] A first shielding structure extending along the thickness direction of the electronic device to the inner wall of the device housing can directly block the radiation path of radio frequency interference sources along the cross-sectional direction of the electronic device. This first shielding structure employs a metal layer at least on its outer periphery, utilizing the conductivity of the metal layer surface to conduct or reflect radiated radio frequency electromagnetic waves, thereby maximally cutting off the range of radio frequency interference sources radiating to the first electronic component. This further reduces the radiation impact of radio frequency interference sources outside the first electronic component on it.

[0043] For example, the first shielding structure is formed on the inner wall of the housing of the electronic device. This allows for rapid molding, saves production costs, and also facilitates installation.

[0044] For example, the first electronic component can be an antenna module, which can be mounted on either the upper housing or the lower housing. Correspondingly, refer to... Figure 3 When the antenna module is mounted on the upper housing, the first shielding structure can extend along the thickness direction of the upper housing of the laptop to the inner wall of the top housing structure. (Refer to...) Figure 4 When the antenna module is installed in the lower housing, the first shielding structure can extend along the thickness direction of the lower housing of the laptop to the inner wall of the upper housing structure and / or the inner wall of the lower housing structure.

[0045] Alternatively, the first electronic component can be a CPU module, an SSD module, or a RAM module. Since the CPU module, SSD module, and RAM module are all mounted on the circuit board, considering practical application scenarios, the first shielding structure can be formed in the lower structure of the lower housing. Further considering the potential radio frequency interference paths that the CPU module and SSD module may receive, shielding walls can be simultaneously set around the CPU module and SSD module. For example, further refer to... Figure 1 and Figure 8 At this time, the first shielding structure can be constructed as a mouth-shaped structure, or a first shielding structure can be set around the CPU module and the SSD module respectively, with the boundaries of each first shielding structure abutting each other, so as to block the radio frequency interference path between the lower housing and the circuit board.

[0046] Alternatively, the first electronic component can also be an I / O port. Considering the actual installation location of the I / O port, shielding walls can be set simultaneously in three directions outside the edge of the laptop on the circuit board. In this case, further reference... Figure 5 and Figure 6 The first shielding structure can be constructed as a C-shaped structure, or a first shielding structure can be provided on three sides of the I / O port, with the boundaries of each first shielding structure abutting each other, so as to block the radio frequency interference path between the lower housing and the circuit board.

[0047] Specifically, considering the installation location and function of each electronic component in a laptop, the first shielding structure can be positioned between the circuit board and the inner wall of the electronic device's casing. This allows for the addition of shielding wall locations based on actual application needs, making operation more flexible.

[0048] For example, the first shielding structure can be a single structure disposed between the circuit board and the inner wall of the electronic device's housing. In this case, the first shielding structure can be connected to the side of the circuit board used to mount the first electronic component. This facilitates disassembly, assembly, and subsequent maintenance.

[0049] Alternatively, for example, the first shielding structure may also be a structure integrally connected to the inner walls of each housing.

[0050] Alternatively, for example, the first shielding structure can also be a structure that is integrated with the circuit board.

[0051] Furthermore, considering that the first shielding structure may have manufacturing tolerances, resulting in a possible inability to achieve a tight fit between the first shielding structure and the circuit board, this disclosure provides another shielding solution, which can be further referred to... Figures 5-8 For example, a gap is left between the first shielding structure and the circuit board in the thickness direction of the circuit board, and a plurality of second shielding structures are arranged in the space around the gap. Since radio frequency interference electromagnetic waves generally radiate along the circumferential path of the first electronic component, the arrangement of the second shielding structures in the space around the gap, based on the fact that the second shielding structures have their own certain size and shape, can block at least a portion of the radio frequency interference electromagnetic waves in the space where the gap is located.

[0052] For example, multiple second shielding structures are arranged in the space around the gap. This can be understood as multiple second shielding structures being arranged on the outside of the first shielding structure away from the first electronic component, thus forming a shielding barrier on the outside of the first shielding structure. Alternatively, it can be understood as multiple second shielding structures being arranged simultaneously on the inside and outside of the first shielding structure, near or far from the first electronic component, thus forming two shielding barriers on the inside and outside of the first shielding structure. This can block more radio frequency interference electromagnetic waves from radiating to the first electronic component. The specific method adopted can be determined according to the installation and application scenario of the first electronic component.

[0053] Along the radiation direction of the radio frequency interference electromagnetic waves received by the first electronic component, it is further considered to set a shielding line on each side of the first shielding structure, and the plurality of second shielding structures are respectively set on both sides of the first shielding structure. It should be noted that the plurality of second shielding structures on both sides of the first shielding structure can be arranged in an orderly manner, or they can be omitted. Alternatively, the plurality of second shielding structures on both sides of the first shielding structure can be arranged in a single row and column, or they can be arranged in multiple rows and columns.

[0054] This application does not limit the number of second shielding structures. The number of second shielding structures can be set according to the actual application needs. Each second shielding structure located on the same side of the first shielding structure can be set separately, or each second shielding structure located on the same side of the first shielding structure can be connected as a whole.

[0055] Furthermore, considering the mounting positions and available space of the first electronic component, the first shielding structure, and the circuit board, the plurality of second shielding structures are, for example, staggered on both sides of the first shielding structure. It should be noted that this staggered arrangement can be understood as the projection areas of each second shielding structure on the first shielding structure not overlapping. This allows each second shielding structure to block radio frequency interference electromagnetic waves radiating to different locations and directions within the gap.

[0056] To further achieve the best shielding effect of the second shielding structure relative to the height of the gap, for example, the projected height dimension of the second shielding structure over the first shielding structure is greater than the height dimension of the gap. This allows the second shielding structure to block radio frequency interference electromagnetic waves in the gap height region involved in the projection at the location where the second shielding structure is set.

[0057] For example, the second shielding structure is constructed as solder joints. Solder joints have a simple structure and are easy to process on a circuit board, enabling better shielding against the effects of radio frequency interference electromagnetic waves flowing through at least part of the space in the gap at a lower production cost.

[0058] This application does not limit the size or shape of the solder joints; the specific dimensions shall be determined by the actual production and processing.

[0059] When the outer periphery of the first shielding structure is a metal layer structure, for example, the first shielding structure is constructed by electroplating a metal layer on the surface of an insulator. A sputtering process can be used to deposit a metal layer on the outer periphery of the object to be plated. Specifically, inert ions (such as Ar+) are accelerated by DC or RF, and high-energy particles (positive ions accelerated by an electric field) bombard the surface of a solid target. Due to the rebound of momentum, the target material is sputtered. Almost any material can be sputtered using high-energy plasma to form a thin film.

[0060] For example, the object to be coated can be a high-density plastic material such as polyurethane or PVC.

[0061] The electronic device employing the embodiments of this disclosure can, with the combined arrangement of the first and second shielding structures, block radio frequency interference electromagnetic waves around the first electronic component through multiple layers of shielding. Furthermore, the second shielding structure can block radio frequency interference electromagnetic waves projected through gaps caused by manufacturing tolerances, at least partially blocking such waves. Moreover, the shielding structures of the embodiments of this disclosure have simple molding processes and certain operable specifications, facilitating quick installation in laptops. This avoids problems such as collisions, wear, or damage to electronic components caused by irregular installation of the shielding structures (e.g., conventional aluminum or copper foil wrapping shielding methods), thereby improving the performance of the laptop and reducing its production costs.

[0062] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this is not limited herein.

[0063] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0064] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: A first electronic component is connected to a circuit board, and a first shielding structure is provided on at least one side of the first electronic component that is close to the radio frequency interference source; Along the radiation direction of the radio frequency interference source, the first shielding structure constitutes at least one layer of shielding wall; The first shielding structure is configured to extend along the thickness direction of the electronic device to the inner wall of the electronic device's housing; The first shielding structure has at least a metal layer on its outer periphery; A gap is left between the first shielding structure and the circuit board in the thickness direction of the circuit board, and a plurality of second shielding structures are arranged in the space around the gap.

2. The electronic device according to claim 1, characterized in that, The first shielding structure is formed on the inner wall of the housing of the electronic device.

3. The electronic device according to claim 1, characterized in that, The first shielding structure is disposed between the circuit board and the inner wall of the housing of the electronic device.

4. The electronic device according to claim 1, characterized in that, The first shielding structure is connected to the side of the circuit board used to mount the first electronic component.

5. The electronic device according to claim 1, characterized in that, The plurality of second shielding structures are respectively arranged on both sides of the first shielding structure.

6. The electronic device according to claim 5, characterized in that, The plurality of second shielding structures are staggered on both sides of the first shielding structure.

7. The electronic device according to claim 1, characterized in that, The projection height of the second shielding structure onto the first shielding structure is greater than the height of the gap.

8. The electronic device according to claim 1, characterized in that, The second shielding structure is constructed of solder joints.

9. The electronic device according to claim 1, characterized in that, The first shielding structure is constructed by electroplating a metal layer on the surface of an insulator.

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