Polishing state analysis prediction program, storage device, cathode fluorescent device, and polishing state analysis prediction method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NAT UNIV CORP NAGAOKA UNIV TECH
- Filing Date
- 2021-09-15
- Publication Date
- 2026-07-03
AI Technical Summary
Existing technologies make it difficult to quantitatively evaluate the grinding rate of GaN substrates in a short time, resulting in low grinding efficiency and difficulty in accurately controlling grinding time, thus failing to effectively improve the optimization efficiency of grinding conditions.
The CL image of the substrate is obtained by cathodoluminescence method. The luminescence intensity or brightness data is fitted by a logistic function to predict the polishing rate and final polishing time. Combined with the change in black line density, a quantitative analysis of the polishing state is achieved.
Accurate estimation of grinding rate and final grinding time in a short time improves grinding efficiency, reduces unnecessary grinding time, and optimizes grinding conditions.
Smart Images

Figure CN116490321B_ABST