Semiconductor circuit automation apparatus

Abstract

The application provides a kind of semiconductor circuit automation equipment, including: rack, tape loading position and wafer loading position are arranged at intervals on rack;Tape loading mechanism, stock conveying track, guide, carrier, a plurality of circuit substrates are provided on carrier;Grabbing mechanism, grabbing mechanism is set up above guide and is set up opposite to guide;Wafer loading mechanism, wafer loading mechanism is set up in one side of rack, and corresponds with wafer loading position;And wafer clamping mechanism, wafer clamping mechanism is set up in wafer loading mechanism, wafer loading mechanism is used to transport wafer to wafer clamping mechanism and be clamped and fixed, and moves through wafer loading mechanism to make wafer be transported to wafer loading position, realize wafer and a plurality of circuit substrates mounting.The application not only can realize the mounting of different kinds of chips, high production efficiency, but also can realize the mounting of other components, greatly improve the utilization of equipment, improve the reliability of product.

Description

Technical Field

[0001] This invention relates to the field of automation equipment technology, and more particularly to a semiconductor circuit automation device. Background Technology

[0002] The semiconductor circuit, or Modular Intelligent Power System (MIPS), not only integrates power switching devices and drive circuits, but also incorporates fault detection circuits for overvoltage, overcurrent, and overheating, and can send the detection signals to the CPU or DSP for interrupt processing. It consists of high-speed, low-power dies, optimized gate-level drive circuits, and fast protection circuits. Even in the event of a load fault or improper use, the MIPS itself remains undamaged. MIPS typically uses IGBTs as power switching elements and integrates current sensors and drive circuits within its structure.

[0003] Currently, low-voltage control circuits such as IPM semiconductor circuit IC driver control circuits, IPM sampling amplification circuits, and PFC current protection circuits are laid out on the same board as inverter circuits composed of high-voltage power devices. Currently, the components that make up these various circuits are mounted on the circuit board using specialized equipment. Chips are mounted using automated die bonders, with each machine capable of mounting only one type of chip. However, current semiconductor circuits require mounting three types of chips, using three identical machines, resulting in redundant UPH (Upside-Per-Hydrogen) for each machine and low equipment efficiency. Resistors and capacitors are mounted using SMT (Surface Mount Technology) equipment, but current equipment also has redundant UPH and low efficiency. Furthermore, the trend towards high integration and miniaturization of semiconductor circuits places higher demands on heat dissipation. Poor component mounting accuracy is crucial; improper mounting can create voids that affect heat dissipation, leading to poor heat dissipation, low mounting accuracy, poor quality, excessive cost, and poor market competitiveness. Summary of the Invention

[0004] To address the shortcomings of the aforementioned related technologies, this invention proposes a multifunctional, high-efficiency, high-quality, and low-cost automated semiconductor circuit mounting equipment for chip and component mounting.

[0005] To address the aforementioned technical problems, embodiments of the present invention provide an automated semiconductor circuit device, comprising:

[0006] A rack, wherein tape loading stations and wafer loading stations are spaced apart on the rack;

[0007] A tape feeding mechanism, which is fixed to one side of the frame;

[0008] A coil conveying track is provided between the belt feeding mechanism and the belt feeding position;

[0009] A guide component, which is fixed inside the frame, is perpendicularly arranged to the tape loading position and the wafer loading position, respectively.

[0010] A carrier, which is disposed within the guide member, and a plurality of circuit boards are provided on the carrier;

[0011] A gripping mechanism is fixed inside the frame and is disposed above and opposite to the guide member. The gripping mechanism is used to grip the plurality of circuit boards and place them into the wafer loading position.

[0012] A wafer loading mechanism, wherein the wafer loading mechanism is disposed on one side of the rack and corresponds to the wafer loading position; and,

[0013] A wafer clamping mechanism is disposed on the wafer loading mechanism. The wafer loading mechanism is used to transport the wafer to the wafer clamping mechanism for clamping and fixing, and to move the wafer to the wafer loading position to realize the mounting of the wafer with the multiple circuit boards.

[0014] Preferably, the guide includes a guide body and a guide groove penetrating the guide body, and the carrier is disposed in the guide groove.

[0015] Preferably, the plurality of circuit boards includes three circuit boards arranged side by side.

[0016] Preferably, the gripping mechanism includes a first guide rail fixed to the frame, a first robotic arm and a second robotic arm slidably disposed on the first guide rail, a second guide rail fixed under the first robotic arm, a third guide rail fixed under the second robotic arm, a third robotic arm slidably disposed under the second guide rail, and a fourth robotic arm slidably disposed under the third guide rail; the second guide rail and the third guide rail are respectively arranged perpendicular to the first guide rail.

[0017] Preferably, the first robotic arm and the second robotic arm move along the first guide rail in the X-axis direction, and the third robotic arm and the fourth robotic arm move along the second guide rail and the third guide rail, respectively, in the Y-axis direction.

[0018] Preferably, the wafer loading mechanism includes multiple barrels, multiple casters fixed under the multiple barrels, a rotating shaft disposed between the multiple barrels, multiple guide rails fixed on the rotating shaft, and a rotating mechanism disposed on the multiple guide rails; the guide rails are located above the multiple barrels, the wafer clamping mechanism is slidably disposed within the multiple guide rails, and the multiple guide rails are disposed within the wafer loading position under the rotation of the rotating shaft.

[0019] Preferably, the plurality of barrels includes three barrels for holding three different types of wafers, the plurality of guide rails includes three guide rails, and the wafer clamping mechanism includes three wafer clamping mechanisms, which are respectively disposed within the three guide rails.

[0020] Preferably, the wafer clamping mechanism includes a wafer ring, a plurality of mechanical claw mechanisms disposed on the wafer ring, a servo guide motor disposed on the plurality of mechanical claw mechanisms, and a plurality of rubber heads. The wafer ring is slidably disposed within the guide rail, and the plurality of rubber heads are respectively disposed on the plurality of mechanical claw mechanisms.

[0021] Preferably, the plurality of mechanical gripper mechanisms includes four, which move inward or outward from four directions respectively to clamp and fix the wafer; wherein, the servo guide motors are respectively provided for the opposite mechanical gripper mechanisms.

[0022] Compared with related technologies, the present invention features a tape loading station and a wafer loading station spaced apart on the frame; the tape loading mechanism is fixed to one side of the frame; a reel conveyor track is positioned between the tape loading mechanism and the tape loading stations; a guide is fixed inside the frame and is perpendicular to both the tape loading station and the wafer loading station; a carrier is positioned inside the guide and has multiple circuit boards mounted on it; and a gripping mechanism is fixed inside the frame. The gripping mechanism is positioned above and opposite the guide member, and is used to grip the multiple circuit boards and place them into the wafer loading position. The wafer loading mechanism is located on one side of the rack and corresponds to the wafer loading position. The wafer clamping mechanism is located on the wafer loading mechanism and is used to transport the wafer to the clamping mechanism for clamping and fixing. The wafer loading mechanism moves to transport the wafer into the wafer loading position, thus achieving wafer mounting with the multiple circuit boards. This allows for simultaneous chip and component mounting, improving the equipment's UPH (Uptime Per Hour) and ensuring product mounting accuracy. A wafer loading mechanism is proposed that enables the mounting of different types of chips on the same equipment, improving the equipment's UPH, reducing equipment procurement costs, and increasing production efficiency. This semiconductor circuit automation equipment comes with four interfaces: Web service, WCF, TCP / IP, and PIC, making it compatible with MES systems. Attached Figure Description

[0023] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and more readily understood through the detailed description following the accompanying drawings. In the drawings:

[0024] Figure 1 This is a schematic diagram of the overall structure of the semiconductor circuit automation equipment of the present invention;

[0025] Figure 2 This is a schematic diagram of the wafer clamping mechanism of the present invention;

[0026] Figure 3 This is a schematic diagram of the wafer clamping mechanism of the present invention;

[0027] Figure 4 This is a schematic diagram of the wafer clamping mechanism of the present invention;

[0028] Figure 5 This is a schematic diagram of the wafer loading mechanism of the present invention;

[0029] Figure 6 This is a top view of the wafer loading mechanism of the present invention;

[0030] Figure 7 This is a front view of the wafer loading mechanism of the present invention;

[0031] Figure 8 This is a schematic diagram of the assembly structure of the wafer clamping mechanism and the wafer loading mechanism of the present invention;

[0032] Figure 9 This is a front view of the assembled wafer clamping mechanism and wafer loading mechanism of the present invention;

[0033] Figure 10 This is a schematic diagram of the structure of the automated semiconductor circuit assembly equipment of the present invention. Detailed Implementation

[0034] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0035] The specific embodiments / examples described herein are specific implementations of the present invention, used to illustrate the concept of the invention, and are illustrative and exemplary, and should not be construed as limiting the implementation methods or scope of the present invention. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein, all of which are within the protection scope of the present invention.

[0036] Example 1

[0037] like Figure 1-10 As shown, the present invention provides a semiconductor circuit automation device 100, comprising:

[0038] The rack 3 is provided with tape loading positions 307 and wafer loading positions 308 spaced apart.

[0039] The tape loading station 307 is used to introduce tray-loaded materials and fix the tape for easy picking up of devices by the robotic arm's nozzle. The wafer loading station 308 is used to introduce wafers and fix them for easy picking up of surface-mount chip particles by the robotic arm's nozzle.

[0040] The frame 3 is used to support the overall automated equipment, facilitating the installation and fixing of the tray conveying track 7, guide 309, carrier 6 and gripping mechanism 8, thus providing overall support.

[0041] The tape feeding mechanism 4 is fixed to one side of the frame 3; it is used to introduce the tray-loaded material and fix the tape so that the robotic arm can pick up the device.

[0042] The coil conveying track 7 is located between the tape feeding mechanism 4 and the tape feeding position 307; it is used to convey the resistors and capacitors in the coil to the gripping mechanism 8 of the automated equipment, so that the gripping mechanism 8 can grip them.

[0043] Guide component 309 is fixed inside the frame 3 and is perpendicular to the tape loading position 307 and the wafer loading position 308 respectively; it is used to support and guide the carrier 6 to facilitate the placement of the carrier 6.

[0044] The carrier 6 is disposed within the guide member 309 and is provided with a plurality of circuit boards 5; it is used to carry the circuit boards 5 and transport products through the tray conveyor rail 7. One carrier 6 can hold 3 circuit boards 5.

[0045] A gripping mechanism 8 is fixed within the frame 3 and positioned above and opposite the guide member 309. The gripping mechanism 8 is used to grip the plurality of circuit boards 5 and place them into the wafer loading position 308. The circuit board 5 is a semiconductor circuit semi-finished product, requiring components to be mounted at specific locations on its surface.

[0046] A wafer loading mechanism 2 is disposed on one side of the rack 3 and corresponds to the wafer loading position 308. The wafer loading mechanism 2 is used to load different types of wafers onto designated equipment.

[0047] A wafer clamping mechanism 1 is disposed on the wafer loading mechanism 2. The wafer loading mechanism 2 is used to transport the wafer to the wafer clamping mechanism 1 for clamping and fixing, and to move the wafer to the wafer loading position 308, thereby realizing the mounting of the wafer with the plurality of circuit boards 5. The wafer clamping mechanism 1 is used to clamp the entire wafer to realize the wafer pick-and-place function.

[0048] Specifically, a tape loading station 307 and a wafer loading station 308 are spaced apart on the frame 3; the tape loading mechanism 4 is fixed to one side of the frame 3; the reel conveyor track 7 is disposed between the tape loading mechanism 4 and the tape loading station 307; a guide member 309 is fixed inside the frame 3, and the guide member 309 is perpendicular to the tape loading station 307 and the wafer loading station 308 respectively; a carrier 6 is disposed inside the guide member 309, and the carrier 6 is provided with multiple circuit boards 5; a gripping mechanism 8 is fixed inside the frame 3, and the gripping mechanism 8 is provided with The gripping mechanism 8, positioned above and opposite to the guide 309, grips the plurality of circuit boards 5 and places them into the wafer loading position 308. The wafer loading mechanism 2 is located on one side of the rack 3 and corresponds to the wafer loading position 308. The wafer clamping mechanism 1 is mounted on the wafer loading mechanism 2. The wafer loading mechanism 2 transports the wafer to the wafer clamping mechanism 1 for clamping and fixing, and moves the wafer to the wafer loading position 308, thus achieving wafer mounting with the plurality of circuit boards 5. This allows for simultaneous mounting of chips and components, improving the equipment's UPH (Uptime Per Hour) and ensuring product mounting accuracy. A wafer loading mechanism 2 is proposed, which enables the mounting of different types of chips on the same equipment, improving the equipment's UPH, reducing equipment procurement costs, and increasing production efficiency. This semiconductor circuit automation equipment 100 comes with four interfaces: Webservice, WCF, TCP / IP, and PIC, making it compatible with MES systems.

[0049] In this embodiment, the guide member 309 includes a guide body 3091 and a guide groove 3092 penetrating the guide body 3091, and the carrier 6 is disposed within the guide groove 3092. The guide body 3091 is fixed within the frame 3 for support. The guide groove 3092 is used to install the carrier 6, facilitating the movement of the carrier 6 within the guide groove 3092 and providing good guiding effect.

[0050] In this embodiment, the plurality of circuit boards 5 includes three circuit boards 5 arranged side by side. Various wafer assemblies can be achieved by mounting them with various different wafers.

[0051] In this embodiment, the gripping mechanism 8 includes a first guide rail 305 fixed to the frame 3, a first robotic arm 301 and a second robotic arm 302 slidably disposed on the first guide rail 305, a second guide rail 306 fixed under the first robotic arm 301, a third guide rail 310 fixed under the second robotic arm 302, a third robotic arm 304 slidably disposed under the second guide rail 306, and a fourth robotic arm 303 slidably disposed under the third guide rail 310; the second guide rail 306 and the third guide rail 310 are respectively arranged perpendicular to the first guide rail 305.

[0052] In this embodiment, the first robotic arm 301 and the second robotic arm 302 move along the first guide rail 305 in the X-axis direction, and the third robotic arm 304 and the fourth robotic arm 303 move along the second guide rail 306 and the third guide rail 310 in the Y-axis direction, respectively.

[0053] The first guide rail 305 is used to enable the first robotic arm 301 and the second robotic arm 302 to move along the X-axis. The first robotic arm 301 is used to move along the X-axis when performing component placement; the second robotic arm 302 is used to move along the X-axis when performing chip placement. The third robotic arm 304 is used to move along the Y-axis when performing component placement, and the fourth robotic arm 303 is used to move along the Y-axis when performing chip placement.

[0054] Specifically, the third robotic arm 304 uses its suction nozzle to pick up components conveyed by the reel transport track 7 for mounting onto the circuit board 5. Simultaneously, the first robotic arm 301 moves the circuit board 5 along the X-axis on the first guide rail 305 to the wafer loading position 308 for mounting the chips and wafers on the circuit board 5. The fourth robotic arm 303 moves along the Y-axis on the third guide rail 310 to the corresponding component placement position, and its suction nozzle picks up components conveyed by the reel transport track 7 for mounting onto the circuit board 5. Simultaneously, the second robotic arm 302 moves the circuit board 5 along the X-axis on the first guide rail 305 to the wafer loading position 308 for mounting the chips and wafers on the circuit board 5.

[0055] In this embodiment, the wafer loading mechanism 2 includes multiple barrels 201, multiple casters 202 fixed under the multiple barrels 201, a rotating shaft 204 disposed between the multiple barrels 201, multiple guide rails 203 fixed on the rotating shaft 204, and a rotating mechanism 205 disposed on the multiple guide rails 203; the guide rails 203 are located above the multiple barrels 201, the wafer clamping mechanism 1 is slidably disposed within the multiple guide rails 203, and the multiple guide rails 203 are disposed within the wafer loading position 308 under the rotation of the rotating shaft 204.

[0056] Specifically, multiple buckets 201 are used to hold various types and sizes of wafers; casters 202 are used to transport one end of the wafer loading mechanism 2; guide rails 203 are used in conjunction with servo guide motors 103 to guide the servo guide motors 103. A rotating shaft 204 supports the rotating mechanism 205, which, through a pre-programmed rotation, transports different types of wafers to designated positions on the equipment for wafer mounting.

[0057] In this embodiment, the plurality of barrels 201 include three barrels for placing three different types and specifications of wafers, the plurality of guide rails 203 include three guide rails, and the wafer clamping mechanism 1 includes three wafer clamping mechanisms 1, which are respectively disposed in the three guide rails 203.

[0058] In this embodiment, the wafer clamping mechanism 1 includes a wafer ring 101, a plurality of mechanical claw mechanisms 102 disposed on the wafer ring 101, a servo guide motor 103 disposed on the plurality of mechanical claw mechanisms 102, and a plurality of adhesive heads 104. The wafer ring 101 is slidably disposed within the guide rail 203, and the plurality of adhesive heads 104 are respectively disposed on the plurality of mechanical claw mechanisms 102.

[0059] In this embodiment, the plurality of mechanical gripper mechanisms 102 includes four, which move inward or outward from four directions respectively to clamp and fix the wafer; wherein, the servo guide motors 103 are respectively provided for the opposite mechanical gripper mechanisms 102.

[0060] Specifically, the wafer ring 101 is used to attach a ring to the edge of the entire wafer, onto which the diced chips are adhered to the blue or UV film, for easy fixation and gripping by the equipment. The mechanical gripper mechanism 102 moves inward or outward in four directions, clamping the wafer through these four-directional mechanical movements. The servo guide motor 103 transports the entire wafer clamping mechanism 1 along the Y-axis to a specific track on the equipment, ultimately delivering the wafer to the designated position. The rubber head 104 uses a high-friction rubber material that directly contacts the wafer, enabling more precise gripping.

[0061] The working principle of this invention is as follows:

[0062] First, the carrier 6 carrying the product (circuit board) is transported via the track of the previous process equipment. The product is controlled by the program to stay in the chip mounting area. After the automated equipment senses the product in the chip mounting area, it sends an instruction to the wafer loading mechanism 2. The wafers that were placed in the barrel 201 of the wafer loading mechanism in advance are pushed out of the surface of the barrel 201 by the lifting device at the bottom. The wafer clamping mechanism 1 senses the wafer on the surface of the barrel 201 and clamps the wafer. Then, the entire wafer clamping mechanism 1 is transported into the automated equipment and placed on the wafer loading position 308 by the servo guide motor 103 and the guide rail 203. The second robotic arm 302 and the fourth robotic arm 303 pick up the chip on the wafer and place it on the specific mounting position of the circuit board 5. The above steps complete the chip mounting.

[0063] Similarly, the second and third types of chips will be placed into the wafer loading position 308 by the rotating mechanism 205 according to the set program. The second robotic arm 302 and the fourth robotic arm 303 will pick up the chips on the wafer and place them into the specific mounting position of the circuit board 5 to complete the chip mounting. After all the chips on the wafer are mounted, the above steps can be reversed to put the used wafers back into the barrel 201 of the wafer loading mechanism 2 for collection. When a certain number are collected, the equipment will alarm and then the worker will take out the wafers for recycling. This is the whole chip mounting process. After chip mounting, carrier 6 is conveyed along the Y-axis of the equipment track, transporting the chip-mounted circuit board 5 to the SMT placement area. Upon sensing the product in the placement area, the equipment sends instructions to the tape feeding mechanism 4. Based on the types of components to be mounted, the tape feeding mechanism 4 sends commands to specific components according to a pre-set program. The feeder then transports the material from the tape to the tape loading position 307. The first robotic arm 301 and the third robotic arm 304 then pick up the components from the tape and place them into specific mounting positions on the circuit board 5. After these steps, the carrier carrying the circuit board 5 is transported to the next process via the equipment track. This completes the entire semiconductor circuit chip and component mounting process. This automated equipment can not only mount different types of chips but also other components, greatly improving equipment utilization and product reliability. It can simultaneously mount chips and components, increasing the equipment's UPH (Uptime Per Hour) and ensuring product mounting accuracy. A wafer loading mechanism 2 is proposed, which enables the mounting of different types of chips on the same equipment, improving the equipment's UPH (Uptime Per Hour), reducing equipment procurement costs, and increasing production efficiency. This semiconductor circuit automation equipment 100 comes with four interfaces: Web service, WCF, TCP / IP, and PIC, making it compatible with MES (Manufacturing Execution System) systems.

[0064] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any alterations, equivalent substitutions, or improvements made within the spirit and principles of the present invention should be included within the scope of the claims of the present invention.

Claims

1. An automated semiconductor circuit device, characterized in that, include: A rack, wherein tape loading stations and wafer loading stations are spaced apart on the rack; A tape feeding mechanism, which is fixed to one side of the frame; A coil conveying track is provided between the belt feeding mechanism and the belt feeding position; A guide component, which is fixed inside the frame, is perpendicularly arranged to the tape loading position and the wafer loading position, respectively. A carrier, which is disposed within the guide member, and a plurality of circuit boards are provided on the carrier; A gripping mechanism is fixed inside the frame and is disposed above and opposite to the guide member. The gripping mechanism is used to grip the plurality of circuit boards and place them into the wafer loading position. A wafer loading mechanism, wherein the wafer loading mechanism is disposed on one side of the rack and corresponds to the wafer loading position; and, A wafer clamping mechanism is disposed on the wafer loading mechanism. The wafer loading mechanism is used to transport the wafer to the wafer clamping mechanism for clamping and fixing, and to move the wafer to the wafer loading position to realize the mounting of the wafer with the multiple circuit boards. The gripping mechanism includes a first guide rail fixed to the frame, a first robotic arm and a second robotic arm slidably disposed on the first guide rail, a second guide rail fixed under the first robotic arm, a third guide rail fixed under the second robotic arm, a third robotic arm slidably disposed under the second guide rail, and a fourth robotic arm slidably disposed under the third guide rail; the second guide rail and the third guide rail are respectively perpendicular to the first guide rail; The first guide rail is used to enable the first robotic arm and the second robotic arm to move along the X direction; the first robotic arm is used to enable the robotic arm to move in the X-axis direction when performing component placement; the second robotic arm is used to enable the robotic arm to move in the X-axis direction when performing chip placement; the third robotic arm is used to enable the robotic arm to move in the Y-axis direction when performing component placement; and the fourth robotic arm is used to enable the robotic arm to move in the Y-axis direction when performing chip placement. The wafer loading mechanism includes multiple barrels, multiple casters fixed under the barrels, a rotating shaft disposed between the barrels, multiple guide rails fixed on the rotating shaft, and a rotating mechanism disposed on the guide rails. The guide rails are located above the barrels, and the wafer clamping mechanism is slidably disposed within the guide rails. The guide rails are positioned within the wafer loading positions by the rotation of the rotating shaft. The barrels are used to hold various types and specifications of wafers. The tape feeding mechanism sends commands to the components according to the set program. The feeder transports the material in the tape to the tape feeding position. Then, the first robotic arm and the third robotic arm pick up the components in the tape and place them into the specific mounting position of the circuit board.

2. The semiconductor circuit automation equipment as described in claim 1, characterized in that, The guide includes a guide body and a guide groove penetrating the guide body, and the carrier is disposed in the guide groove.

3. The semiconductor circuit automation equipment as described in claim 1, characterized in that, The plurality of circuit boards includes three circuit boards arranged side by side.

4. The semiconductor circuit automation equipment as described in claim 1, characterized in that, The plurality of barrels includes three barrels for holding three different types of wafers, the plurality of guide rails includes three guide rails, and the wafer clamping mechanism includes three wafer clamping mechanisms, which are respectively disposed within the three guide rails.

5. The semiconductor circuit automation equipment as described in claim 4, characterized in that, The wafer clamping mechanism includes a wafer ring, a plurality of mechanical claw mechanisms disposed on the wafer ring, a servo guide motor disposed on the plurality of mechanical claw mechanisms, and a plurality of rubber heads. The wafer ring is slidably disposed within the guide rail, and the plurality of rubber heads are respectively disposed on the plurality of mechanical claw mechanisms.

6. The semiconductor circuit automation equipment as described in claim 5, characterized in that, The plurality of mechanical gripper mechanisms includes four, which move inward or outward from four directions respectively to clamp and fix the wafer; wherein, the mechanical gripper mechanisms are respectively equipped with servo guide motors.

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