Sensor package structure

Abstract

A sensor package structure includes a substrate, a sensing chip disposed on the substrate, a photocuring layer disposed on the substrate and surrounding the sensing chip, a light-transmissive layer disposed on the photocuring layer, and a shielding layer in a ring shape and disposed on the light-transmissive layer. An inner surface of the light-transmissive layer, the photocuring layer, and the substrate collectively enclose a closed space in which the sensing chip is accommodated. A first projection area formed by a normal projection of the shielding layer to the inner surface does not reach the photocuring layer. A second projection area formed by a normal projection of a sensing region of the sensing chip to the inner surface does not overlap the first projection area and is located inside the first projection area. Accordingly, the sensor package structure simultaneously achieves multiple technical effects through the structural arrangement of the components.

Description

Technical Field

[0001] This invention relates to a packaging structure, and more particularly to a sensor packaging structure. Background Technology

[0002] Existing sensor packaging structures involve attaching a glass plate to a sensor chip via an adhesive layer, with the adhesive layer surrounding the sensing area of ​​the sensor chip. However, since some light passing through the glass plate may be reflected by the adhesive layer, this can affect the sensing area of ​​the sensor chip (e.g., glare).

[0003] As described above, existing sensor packaging structures form a shielding layer between the glass plate and the adhesive layer to reduce glare. However, the partial shielding layer embedded within the adhesive layer is prone to delamination.

[0004] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. Summary of the Invention

[0005] The present invention provides a sensor packaging structure that can effectively improve the defects that may occur in existing sensor packaging structures.

[0006] This invention discloses a sensor packaging structure, comprising: a substrate; a sensing chip disposed on the substrate along a default direction and electrically coupled to the substrate; wherein a sensing area is included on one top of the sensing chip; a photocurable layer, annular in shape and disposed on the substrate and surrounding the outer side of the sensing chip; a light-transmitting layer having an outer surface and an inner surface, the inner surface having an annular mounting area; the light-transmitting layer being disposed on the photocurable layer with the mounting area above the sensing chip; wherein the inner surface of the light-transmitting layer, the photocurable layer, and the substrate together form a closed space, and the sensing chip is located within the closed space; and a shielding layer, annular in shape and disposed on the light-transmitting layer, for blocking visible light from passing through; wherein a first projection area formed by projecting the shielding layer onto the inner surface along a preset direction does not overlap with the mounting area; a second projection area formed by projecting the sensing area onto the inner surface along the default direction does not overlap with the first projection area and is located inside the first projection area.

[0007] Optionally, the substrate includes multiple solder pads located outside the sensing chip, and the sensing chip includes multiple connection pads located outside the sensing area; wherein, the sensor package structure includes multiple metal lines, and one end of the multiple metal lines is connected to the multiple solder pads, and the other end of the multiple metal lines is connected to the multiple solder pads.

[0008] Optionally, at least one connecting pad and a portion of its connected metal wire are embedded within the photocurable layer.

[0009] Optionally, at least one connecting pad and its connected metal wire are located inside the photocurable layer.

[0010] Optionally, multiple connecting pads are located within a projection space along which the shielding layer is projected onto the substrate in a preset direction.

[0011] Optionally, the shielding layer can only allow infrared light with wavelengths above 780 nanometers to pass through, and the shielding layer can block light with wavelengths below 780 nanometers from passing through.

[0012] Optionally, the shielding layer is located within the enclosed space and formed on the inner surface, with a first distance of 0 to 50 micrometers between the outer edge of the shielding layer and the photocurable layer, and a second distance of 0 to 50 micrometers between the second projection area and the inner edge of the shielding layer.

[0013] Optionally, the shielding layer is located outside the enclosed space and formed on the outer surface, with a first distance of 0 to 50 micrometers between the outer edge of the first projection area and the mounting area, and a second distance of 0 to 50 micrometers between the second projection area and the inner edge of the first projection area.

[0014] Optionally, the sensor package structure includes a package formed on a substrate, wherein a photocurable layer and a light-transmitting layer are both embedded in the package, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the package.

[0015] Optionally, the photocurable layer is further defined as an ultraviolet curable layer; the package is opaque to block visible light from passing through; wherein the light-transmitting layer has an annular side connected to the mounting area of ​​the outer surface and the inner surface, and at least 95% of the annular side and the partial mounting area are connected and cover the package.

[0016] In summary, the sensor packaging structure disclosed in the embodiments of the present invention, through the structural arrangement of multiple components, can simultaneously take into account (or achieve) multiple technical effects (such as: the sensor packaging structure can reduce glare caused by the reflection of the photocurable layer by blocking visible light with the shielding layer, while the shielding layer will not affect the curing process of the photocurable layer, and there will be no delamination defects between the shielding layer and the photocurable layer, thereby effectively improving the yield of the sensor packaging structure).

[0017] To further understand the features and technical content of this invention, please refer to the following detailed description and accompanying drawings. However, these descriptions and drawings are only for illustrating the invention and are not intended to limit the scope of protection of the invention in any way. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 1 of the present invention.

[0019] Figure 2 for Figure 1 A top-view diagram.

[0020] Figure 3 for Figure 2 A schematic cross-sectional view along section line III-III.

[0021] Figure 4 This is a cross-sectional schematic diagram of another embodiment of the sensor packaging structure of the present invention.

[0022] Figure 5 This is a cross-sectional schematic diagram of another form of the sensor packaging structure according to Embodiment 1 of the present invention.

[0023] Figure 6 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 2 of the present invention.

[0024] Figure 7 for Figure 6 A top-view diagram.

[0025] Figure 8 for Figure 7 A schematic cross-sectional view along section line VIII-VIII.

[0026] Figure 9 This is a cross-sectional schematic diagram of another form of the sensor packaging structure according to Embodiment 2 of the present invention. Detailed Implementation

[0027] The following specific embodiments illustrate the implementation of the "sensor packaging structure" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0028] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0029] Example 1

[0030] Please see Figures 1 to 5 As shown, this is an embodiment of the present invention. Figure 1 and Figure 2 As shown, this embodiment discloses a sensor packaging structure 100; that is, the internal structure is not any structure for packaging a sensor, and its structural design basis is different from the sensor packaging structure 100 referred to in this embodiment, so the two are not suitable for comparison.

[0031] like Figures 2 to 4 As shown, the sensor packaging structure 100 includes a substrate 1, a sensing chip 2 disposed on the substrate 1, multiple metal lines 3 electrically coupled to the sensing chip 2 and the substrate 1, a photocurable layer 4 disposed on the substrate 1, a light-transmitting layer 5 disposed on the photocurable layer 4, a shielding layer 6 disposed on the light-transmitting layer 5, and a package 7 formed on the substrate 1.

[0032] In this embodiment, the sensor package structure 100 is described as including the aforementioned components, but it can be adjusted and varied according to design requirements. For example, in other embodiments not shown in this invention, the sensor package structure 100 may omit multiple metal lines 3, and the sensing chip 2 may be fixed and electrically coupled to the substrate 1 via a flip-chip method; alternatively, the sensor package structure 100 may omit or replace the package body 7 with other structures. The structure and connection relationship of each component of the sensor package structure 100 in this embodiment will be described below.

[0033] In this embodiment, the substrate 1 is square or rectangular, but the invention is not limited thereto. A chip fixing region 111 is provided at approximately the center of its upper surface 11, and a plurality of solder pads 112 are formed on the upper surface 11 of the substrate 1, located outside the chip fixing region 111 (or the sensing chip 2). In this embodiment, the plurality of solder pads 112 are generally arranged in a ring, but the invention is not limited thereto. For example, in other embodiments not shown in the illustration, the plurality of solder pads 112 may also be arranged in two rows on opposite sides of the chip fixing region 111.

[0034] In addition, the substrate 1 may also have a plurality of solder balls 8 on its lower surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component (not shown in the figure) by the plurality of solder balls 8, so that the sensor package structure 100 can be electrically connected to the electronic component.

[0035] In this embodiment, the sensing chip 2 is described as an image sensing chip, but it is not limited thereto. The bottom surface 22 of the sensing chip 2 is fixed to the chip fixing area 111 of the substrate 1 along a predetermined direction P; that is, the sensing chip 2 is located inside the plurality of bonding pads 112. Furthermore, a top surface 21 of the sensing chip 2 includes a sensing area 211 and a supporting area 212 surrounding the sensing area 211 (in a ring shape), and the sensing chip 2 includes a plurality of connecting pads 213 located in the supporting area 212 (that is, the plurality of connecting pads 213 are located outside the sensing area 211).

[0036] In this embodiment, the number and position of the plurality of connection pads 213 of the sensing chip 2 correspond to the number and position of the plurality of solder pads 112 of the substrate 1, respectively. Furthermore, one end of each of the plurality of metal wires 3 is connected to one of the plurality of solder pads 112, and the other end of each of the plurality of metal wires 3 is connected to one of the plurality of connection pads 213 (that is, both ends of each metal wire 3 are connected to one solder pad 112 and a corresponding connection pad 213), thereby enabling the substrate 1 to be electrically coupled to the sensing chip 2 through the plurality of metal wires 3.

[0037] The photocurable layer 4 is annular and disposed outside the chip fixing area 111 of the substrate 1, surrounding the outside of the sensing chip 2. In this embodiment, the photocurable layer 4 does not contact the sensing chip 2, thereby allowing the sensor packaging structure 100 to employ various types of sensing chips 2. That is, any adhesive layer that contacts the sensing chip 2 is different from the photocurable layer 4 referred to in this embodiment.

[0038] More specifically, the photocurable layer 4 may be located on a plurality of the solder pads 112; that is, each (or at least one) solder pad 112 and a portion of the metal wire 3 connected thereto are embedded within the photocurable layer 4, thereby reducing the overall size of the sensor package structure 100, but the invention is not limited thereto. For example, such as Figure 5 As shown, each (or at least one) of the connecting pads 213 and the metal wires 3 connected to them may be located inside the photocurable layer 4.

[0039] Furthermore, in this embodiment, the photocurable layer 4 is further defined as an ultraviolet light curable layer, which means a structure that is cured by ultraviolet light irradiation. Therefore, any adhesive layer that is not cured by ultraviolet light is different from the photocurable layer 4 referred to in this embodiment.

[0040] like Figures 2 to 4 As shown, the light-transmitting layer 5 in this embodiment is illustrated as a transparent flat glass plate, but the present invention is not limited thereto. The light-transmitting layer 5 is disposed above the sensing chip 2 through the photocurable layer 4; that is, the photocurable layer 4 is sandwiched between the light-transmitting layer 5 and the substrate 1.

[0041] In this embodiment, the light-transmitting layer 5 includes an outer surface 51, an inner surface 52 located on the opposite side of the outer surface 51, and an annular side surface 53 connecting the outer surface 51 and the inner surface 52. Furthermore, the inner surface 52 has a light-transmitting area 521, an annular arrangement area 522 surrounding the light-transmitting area 521, and an annular mounting area 523 surrounding the arrangement area 522, and the mounting area 523 is connected to the annular side surface 53.

[0042] Furthermore, the light-transmitting layer 5 is disposed on the photocurable layer 4 with the mounting area 523, positioned above the sensing chip 2, and the inner surface 52 of the light-transmitting layer 5, the photocurable layer 4, and the substrate 1 together form a closed space E. The sensing chip 2 is located within the closed space E, and the sensing area 211 faces the light-transmitting area 521.

[0043] The shielding layer 6 is annular and disposed on the light-transmitting layer 5 to block visible light from passing through. In this embodiment, the shielding layer 6 only allows infrared light with wavelengths above 780 nanometers (nm) to pass through, and it also blocks light with wavelengths below 780 nm. Furthermore, the plurality of connecting pads 213 (and at least a portion of each metal wire 3) are located within a projection space along which the shielding layer 6 is projected onto the substrate 1 in the predetermined direction P.

[0044] More specifically, the shielding layer 6 is located within the enclosed space E and formed on the inner surface 52 of the light-transmitting layer 5. The shielding layer 6 projects a first projection area onto the inner surface 52 along the preset direction P, which does not overlap with the mounting area 523. In other words, the shielding layer 6 is located inside the photocurable layer 4 and is not embedded in the photocurable layer 4. Furthermore, the sensing area 211 projects a second projection area onto the inner surface 52 along the default direction P, which does not overlap with the first projection area and is located inside the first projection area. In other words, the inner edge of the shielding layer 6 forms an opening O directly above the sensing area 211.

[0045] As described above, the shielding layer 6 can be formed on the configuration area 522 of the inner surface 52 of the light-transmitting layer 5 according to design requirements. In this embodiment, a first distance D1 of 0 to 50 micrometers (μm) is preferably maintained between the outer edge of the shielding layer 6 and the photocurable layer 4, and a second distance D2 of 0 to 50 micrometers is preferably maintained between the second projection area and the inner edge of the shielding layer 6, but the present invention is not limited thereto.

[0046] In this embodiment, the encapsulation 7 is opaque to block visible light from passing through. The encapsulation 7 is described as a molding compound, and it is formed on the upper surface 11 of the substrate 1 with its edges flush with the edges of the substrate 1. The photocurable layer 4 and the light-transmitting layer 5 are both embedded within the encapsulation 7, and at least a portion of the outer surface 51 of the light-transmitting layer 5 is exposed outside the encapsulation 7. At least 95% of the annular side surface 53 and a portion of the mounting area 523 are connected to and cover the encapsulation 7, but the invention is not limited thereto.

[0047] As described above, the sensor packaging structure 100 in this embodiment is configured by combining multiple components to simultaneously take into account (or achieve) the multiple technical effects described below (that is, a packaging structure that cannot simultaneously take into account or achieve the above multiple technical effects is different from the sensor packaging structure 100 referred to in this embodiment).

[0048] Specifically, the sensor packaging structure 100, while achieving the goal of reducing glare caused by reflection from the photocurable layer 4 by blocking visible light with the shielding layer 6, does not affect the curing process of the photocurable layer 4, and there are no delamination defects between the shielding layer 6 and the photocurable layer 4, thereby effectively improving the yield of the sensor packaging structure 100. Furthermore, the sensor packaging structure 100 can also utilize the characteristic of the shielding layer 6, which allows only infrared light to pass through, to perform corresponding detection (e.g., detecting the shape of the photocurable layer 4).

[0049] Example 2

[0050] Please see Figures 6 to 9 As shown, this is Embodiment Two of the present invention. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0051] In this embodiment, the shielding layer 6 is located outside the enclosed space E and is formed on the outer surface 51 of the light-transmitting layer 5. More specifically, the shielding layer 6 projects a first projection area onto the inner surface 52 along the preset direction P, which does not overlap with the mounting area 523. In this embodiment, a first distance D1 of 0-50 micrometers is maintained between the outer edge of the first projection area and the mounting area 523, and a second distance D2 of 0-50 micrometers is maintained between the second projection area and the inner edge of the first projection area.

[0052] Technical Effects of the Embodiments of the Invention

[0053] In summary, the sensor packaging structure disclosed in the embodiments of the present invention, through the structural arrangement of multiple components, can simultaneously take into account (or achieve) multiple technical effects (such as: the sensor packaging structure can reduce glare caused by the reflection of the photocurable layer by blocking visible light with the shielding layer, while the shielding layer will not affect the curing process of the photocurable layer, and there will be no delamination defects between the shielding layer and the photocurable layer, thereby effectively improving the yield of the sensor packaging structure).

[0054] Furthermore, the sensor packaging structure disclosed in the embodiments of the present invention can also use infrared light for corresponding detection by utilizing the characteristic that the shielding layer allows only infrared light to pass through.

[0055] The above-disclosed content is only a preferred and feasible embodiment of the present invention and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included within the patent scope of the present invention.

Claims

1. A sensor packaging structure, characterized in that, The sensor packaging structure includes: One substrate; A sensing chip is disposed on the substrate along a default orientation and is electrically coupled to the substrate; wherein, a sensing area is included on one top surface of the sensing chip; A photocurable layer, in the shape of a ring, is disposed on the substrate and surrounds the outside of the sensing chip; A light-transmitting layer has an outer surface and an inner surface, and the inner surface has an annular mounting area; the light-transmitting layer is disposed on the photocurable layer with respect to the mounting area, positioned above the sensing chip; wherein the inner surface of the light-transmitting layer, the photocurable layer, and the substrate together surround and form a closed space, and the sensing chip is located within the closed space; and A shielding layer, which is annular and disposed on the inner surface of the light-transmitting layer and located within the enclosed space, is used to block visible light from passing through. The outer edge of the shielding layer is spaced apart from the photocurable layer. The shielding layer is projected orthogonally onto the inner surface in a preset direction to form a first projection area, which does not overlap with the mounting area. The sensing area is projected orthogonally onto the inner surface in a default direction to form a second projection area, which does not overlap with the first projection area and is located inside the first projection area.

2. The sensor packaging structure according to claim 1, characterized in that, The substrate includes a plurality of solder pads located outside the sensing chip, and the sensing chip includes a plurality of connection pads located outside the sensing area; wherein, the sensor package structure includes a plurality of metal lines, and one end of the plurality of metal lines is connected to the plurality of solder pads, and the other end of the plurality of metal lines is connected to the plurality of solder pads.

3. The sensor packaging structure according to claim 2, characterized in that, At least one of the connecting pads and a portion of the metal wire connected to it are embedded within the photocurable layer.

4. The sensor packaging structure according to claim 2, characterized in that, At least one of the connecting pads and the metal wires connected to it are located inside the photocurable layer.

5. The sensor packaging structure according to claim 2, characterized in that, The plurality of connecting pads are located within a projection space along which the shielding layer is projected onto the substrate in the preset direction.

6. The sensor packaging structure according to claim 1, characterized in that, The shielding layer allows only infrared light with wavelengths above 780 nanometers to pass through, and blocks light with wavelengths below 780 nanometers from passing through.

7. The sensor packaging structure according to claim 1, characterized in that, A first distance greater than 0 and less than 50 micrometers is left between the outer edge of the shielding layer and the photocurable layer, and a second distance of 0 to 50 micrometers is left between the second projection area and the inner edge of the shielding layer.

8. The sensor packaging structure according to claim 1, characterized in that, The sensor packaging structure includes a package formed on the substrate, wherein the photocurable layer and the light-transmitting layer are both embedded in the package, and at least a portion of the outer surface of the light-transmitting layer is exposed outside the package.

9. The sensor packaging structure according to claim 8, characterized in that, The photocurable layer is further defined as an ultraviolet curable layer; the package is opaque to block visible light from passing through; wherein the light-transmitting layer has an annular side surface connected to the mounting area of ​​the outer surface and the inner surface, and at least 95% of the annular side surface and a portion of the mounting area are connected to and cover the package.

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