Ultrasonic-based implant communication device and method

Abstract

The present application relates to the field of implant communication, in particular to an implant communication device and method based on ultrasonic waves, applied to a full-metal encapsulated implant, the implant comprising a full-enclosed metal shell, realizing information interaction under the condition of full-metal sealed encapsulation of the implant, and improving the information interaction capability. The technical scheme comprises: a first signal transceiver and a second signal transceiver, the first signal transceiver is arranged on the inner wall of the metal shell, the first signal transceiver is connected with the control module of the implant, and the second signal transceiver is used outside the body, and the second signal transceiver is close to the implant site of the implant; the first signal transceiver is used for transmitting data from the implant to the outside of the body, the control module of the implant converts the data to be sent, and sends the converted data signal through the first signal transceiver, the second signal transceiver is used for receiving and processing the data signal, and obtaining the sent data.

Description

Technical Field

[0001] This invention relates to the field of implant communication, and more specifically to an ultrasound-based implant communication device and method. Background Technology

[0002] Currently, some active implants employ a fully sealed metal enclosure to ensure system safety. However, this presents significant challenges for the implant system to interact with the external device. If the entire outer shell is used as an antenna for signal exchange, the system's resistance to electromagnetic interference is extremely poor, and the entire system will fail when exposed to strong electromagnetic fields. Conversely, using a non-fully sealed metal enclosure would severely compromise the safety of the active implant. Summary of the Invention

[0003] The purpose of this invention is to provide an ultrasound-based implant communication device and method that enables information interaction under the condition of all-metal sealed packaging of the implant and improves the ability of information interaction.

[0004] The present invention achieves the above-mentioned objective by adopting the following technical solution: an ultrasound-based implant communication device applied to an all-metal encapsulated implant, wherein the implant includes a fully enclosed metal shell, the communication device includes a first signal transceiver and a second signal transceiver, the first signal transceiver is disposed on the inner wall of the metal shell and is connected to the control module of the implant, and the second signal transceiver is used externally by bringing the second signal transceiver close to the implantation site of the implant;

[0005] The first transceiver is used when the implant sends data to the outside world. The implant's control module converts the data to be sent and sends the converted data signal through the first transceiver. The second transceiver is used to receive and process the data signal and obtain the sent data.

[0006] When the second transceiver is used to send data from outside the implant, the control module of the second transceiver converts the data to be sent and sends the converted data signal. The first transceiver is used to receive and process the data signal and obtain the data to be sent.

[0007] Furthermore, in order to improve the adaptability of the first signal transceiver, the first signal transceiver includes a first piezoelectric film and a first resonant coil. The first piezoelectric film is closely attached to the inner wall of the metal shell, and the first piezoelectric film is connected to the control module of the implant through the first resonant coil.

[0008] The implant's control module converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a pulse signal to the first piezoelectric film, which generates a corresponding ultrasonic signal. The second transceiver receives and processes the ultrasonic signal to acquire the data to be transmitted.

[0009] Furthermore, in order to improve the performance of the first signal transceiver, the first signal transceiver also includes a second piezoelectric film and a second resonant coil. The second piezoelectric film is closely attached to the inner wall of the metal shell, and the second piezoelectric film is connected to the control module of the implant through the second resonant coil.

[0010] The implant's control module converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a first pulse signal and a second pulse signal to the first piezoelectric film and the second piezoelectric film, respectively. The first piezoelectric film and the second piezoelectric film generate corresponding ultrasonic signals. The second transceiver receives and processes the ultrasonic signals to obtain the data to be transmitted.

[0011] Furthermore, the specific method of applying pulse signals to the first piezoelectric film and the second piezoelectric film respectively includes: when the signal code is 0, applying a first pulse signal to the first piezoelectric film; when the signal code is 1, applying a second pulse signal to the second piezoelectric film.

[0012] Furthermore, in order to improve the external signal transceiver capability, the second signal transceiver includes a signal transceiver probe, which is composed of a coil and a magnet;

[0013] The control module of the second transceiver converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it inputs excitation signals with the same resonant frequencies as the first and second piezoelectric films into the coils, respectively. Corresponding ultrasonic signals are generated on the surface of the metal casing. The first and second piezoelectric films receive the ultrasonic signals and use the integrating circuit connected to the first and second piezoelectric films to calculate the integrated voltage values ​​when the first and second piezoelectric films resonate, respectively. Based on the voltage values, the received signal code is determined, and then converted into the final received information according to the predetermined signal code length.

[0014] An ultrasound-based implant communication method, applied to the aforementioned ultrasound-based implant communication device, includes:

[0015] When the implant sends data outside the body, the implant's control module converts the data to be sent and sends the converted data signal through the first signal transceiver. The second signal transceiver is used to receive and process the data signal and obtain the sent data.

[0016] When data is sent from outside the body to the implant, the control module of the second transceiver converts the data to be sent and sends the converted data signal. The first transceiver receives and processes the data signal to obtain the data to be sent.

[0017] Furthermore, the specific method by which the implant's control module converts the data to be transmitted and sends the converted data signal through the first signal transceiver includes:

[0018] The implant's control module converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a pulse signal to the first piezoelectric film, which then generates a corresponding ultrasonic signal.

[0019] Furthermore, the specific method by which the implant's control module converts the data to be transmitted and sends the converted data signal through the first signal transceiver includes:

[0020] The implant's control module converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a first pulse signal and a second pulse signal to the first piezoelectric film and the second piezoelectric film, respectively, and the first piezoelectric film and the second piezoelectric film generate corresponding ultrasonic signals.

[0021] Furthermore, the specific methods for applying pulse signals to the first piezoelectric film and the second piezoelectric film respectively include:

[0022] The signal code is judged. If the signal code is 0, a first pulse signal is applied to the first piezoelectric film; if the signal code is 1, a second pulse signal is applied to the second piezoelectric film.

[0023] Furthermore, the specific method by which the control module of the second transceiver converts the data to be transmitted and sends the converted data signal includes:

[0024] The control module of the second transceiver converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and the signal code sequence, it inputs excitation signals to the coil that are equal to the resonant frequencies of the first and second piezoelectric films.

[0025] Furthermore, the first signal transceiver receives and processes data signals, and the specific methods for acquiring the transmitted data include:

[0026] The first and second piezoelectric films receive ultrasonic signals, and the integral voltage values ​​of the first and second piezoelectric films at resonance are calculated by the integral circuit connected to the first and second piezoelectric films respectively. The received signal code is determined based on the voltage value, and then converted into the final received information according to the predetermined signal code length.

[0027] In this invention, when the implant transmits data, the control module converts the data to be transmitted and applies a pulse signal to the piezoelectric film based on the converted data. The piezoelectric film vibrates, generating an ultrasonic signal. The ultrasonic signal is transmitted through the inner wall of the metal shell to the outer wall of the metal shell, thereby inducing an electrical signal on the coil of the signal transceiver probe. After processing by the control module of the signal transceiver probe, the transmitted data is acquired. When transmitting data from outside the implant, excitation signals with the same resonant frequencies as the first and second piezoelectric films are input to the coil. Eddy currents are induced on the outer surface of the metal shell. Under the action of the magnet of the signal transceiver probe, the eddy currents can generate ultrasonic waves on the surface of the metal shell. The ultrasonic waves are transmitted to the inner wall of the metal shell, causing the piezoelectric film to vibrate. When the frequency of the ultrasonic wave matches the resonant frequency of a certain piezoelectric film, the piezoelectric film resonates, generating a large piezoelectric signal. The voltage value of the piezoelectric signal is calculated by an integrator circuit, and the received signal code is determined based on the voltage value. Then, according to the predetermined signal code length, it is converted into the final received information. This achieves information interaction under the condition of all-metal sealed encapsulation of the implant and improves the information interaction capability. Attached Figure Description

[0028] Figure 1 This is a structural diagram of an ultrasound-based implant communication device provided in an embodiment of the present invention.

[0029] Figure 2 This is a schematic diagram of a pulse signal provided in an embodiment of the present invention.

[0030] Figure 3 This is a schematic diagram of an integrating circuit provided in an embodiment of the present invention.

[0031] In the attached diagram, 1 is the metal casing, 1-1 is the control module of the implant, 101 is the first piezoelectric film, 102 is the second piezoelectric film, 103-1 is the first resonant coil, 103-2 is the second resonant coil, 104-1 is the first pulse signal, 104-2 is the second pulse signal, 2 is the signal transceiver probe, 201 is the coil, and 202 is the magnet. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0033] The following is in conjunction with the appendix Figure 1-3The specific embodiments of the present invention will be described in detail below.

[0034] This invention relates to an ultrasound-based implant communication device, which is applied to an all-metal encapsulated implant. The implant includes a fully enclosed metal shell 1. The communication device includes a first signal transceiver and a second signal transceiver. The first signal transceiver is disposed on the inner wall of the metal shell and is connected to the control module of the implant. When the second signal transceiver is used externally, it is brought close to the implantation site of the implant.

[0035] The first transceiver is used when the implant sends data to the outside world. The implant's control module converts the data to be sent and sends the converted data signal through the first transceiver. The second transceiver is used to receive and process the data signal and obtain the sent data.

[0036] When the second transceiver is used to send data from outside the implant, the control module of the second transceiver converts the data to be sent and sends the converted data signal. The first transceiver is used to receive and process the data signal and obtain the data to be sent.

[0037] The present invention will now be described in further detail based on the specific structures of the first and second signal transceivers.

[0038] In this embodiment, the first signal transceiver includes a first piezoelectric film 101 and a first resonant coil 103-1. The first piezoelectric film 101 is attached to the inner wall of the metal shell 1. The first piezoelectric film 101 is connected to the control module 1-1 of the implant through the first resonant coil 103-1.

[0039] In this structure, the implant's control module 1-1 converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a pulse signal 104-1 to the first piezoelectric film 101, which generates a corresponding ultrasonic signal. The second transceiver receives and processes the ultrasonic signal to acquire the transmitted data. The piezoelectric film is very thin, lightweight, and extremely flexible, allowing it to operate passively and making it particularly suitable for detecting minute signals. Therefore, this solution utilizes a piezoelectric film to improve the adaptability of the first transceiver.

[0040] The first signal transceiver in this embodiment also includes a second piezoelectric film 102 and a second resonant coil 103-2. The second piezoelectric film 102 is attached to the inner wall of the metal shell 1. The second piezoelectric film 102 is connected to the control module 1-1 of the implant through the second resonant coil 103-2.

[0041] In this structure, the implant's control module 1-1 converts the data to be transmitted into high-level and low-level signal codes. According to the time sequence and signal code sequence, it applies a first pulse signal 104-1 and a second pulse signal 104-2 to the first piezoelectric film 101 and the second piezoelectric film 102, respectively. Specifically, when the signal code is 0, the first pulse signal 104-1 is applied to the first piezoelectric film 101; when the signal code is 1, the second pulse signal 104-2 is applied to the second piezoelectric film 102. The use of dual piezoelectric films and the separate application of pulse signals improves the performance of the first transceiver. The first piezoelectric film 101 and the second piezoelectric film 102 generate corresponding ultrasonic signals, which are transmitted through the inner wall of the metal shell to the outer wall of the metal shell. The second transceiver includes a signal transceiver probe 2, which is composed of a coil 201 and a magnet 202. The magnet 202 can be a permanent magnet or an electromagnet. The ultrasonic signal induces an electrical signal on the coil of the signal transceiver probe. After the coil receives the induced electrical signal, it converts the signal using an analog-to-digital converter and sends it to the control module. The control module calculates the signal frequency. When the frequency is the resonant frequency of the first piezoelectric film, the received signal code is determined to be 0; when the frequency is the resonant frequency of the second piezoelectric film, the received signal code is determined to be 1. The system defines the length of the signal code, converting binary 0 and 1 signals into corresponding data. For example, if the signal code length is defined as 8 bits, a received signal of 10000001 represents a received information of 1; a received signal of 10000101 represents a received information of 5. The pulse signal is as follows... Figure 2 As shown.

[0042] When transmitting data to the implant from outside the body, the control module of the second transceiver converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it inputs excitation signals with resonant frequencies equal to those of the first piezoelectric film 101 and the second piezoelectric film 102 to the coils. Corresponding ultrasonic signals are generated on the surface of the metal casing 1. The first and second piezoelectric films 101 and 102 receive these ultrasonic signals and use integrating circuits connected to them to calculate the integrated voltage values ​​at resonance. Based on these voltage values, the received signal code is determined, and then converted into the final received information according to a predetermined signal code length. This improves the external signal transmission and reception capabilities.

[0043] Integrating circuits such as Figure 3As shown, the circuit includes a resistor R, a comparator, and a capacitor C. One end of the resistor R is connected to either the first piezoelectric film 101 or the second piezoelectric film 102, and the other end is connected to the inverting input of the comparator and connected to the output of the comparator through the capacitor C. The non-inverting input of the comparator is grounded. The formula for calculating the output voltage of the integrator circuit is: V0 = -1 / CR∫ S V i dt, V i The voltage output by the first piezoelectric film 101 or the second piezoelectric film 102.

[0044] An ultrasound-based implant communication method, applied to the aforementioned ultrasound-based implant communication device, includes:

[0045] When the implant sends data outside the body, the implant's control module converts the data to be sent and sends the converted data signal through the first signal transceiver. The second signal transceiver is used to receive and process the data signal and obtain the sent data.

[0046] When data is sent from outside the body to the implant, the control module of the second transceiver converts the data to be sent and sends the converted data signal. The first transceiver receives and processes the data signal to obtain the data to be sent.

[0047] The specific method by which the implant's control module converts the data to be transmitted and sends the converted data signal through the first signal transceiver includes:

[0048] The implant's control module converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a pulse signal to the first piezoelectric film, which then generates a corresponding ultrasonic signal.

[0049] The specific method by which the implant's control module converts the data to be transmitted and sends the converted data signal through the first signal transceiver includes:

[0050] The implant's control module converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a first pulse signal and a second pulse signal to the first piezoelectric film and the second piezoelectric film, respectively, and the first piezoelectric film and the second piezoelectric film generate corresponding ultrasonic signals.

[0051] Specific methods for applying pulse signals to the first piezoelectric film and the second piezoelectric film respectively include:

[0052] The signal code is judged. If the signal code is 0, a first pulse signal is applied to the first piezoelectric film; if the signal code is 1, a second pulse signal is applied to the second piezoelectric film.

[0053] The control module of the second transceiver converts the data to be transmitted and sends the converted data signal using the following specific methods:

[0054] The control module of the second transceiver converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and the signal code sequence, it inputs excitation signals to the coil that are equal to the resonant frequencies of the first and second piezoelectric films.

[0055] The first signal transceiver receives and processes data signals, and the specific methods for acquiring the transmitted data include:

[0056] The first and second piezoelectric films receive ultrasonic signals, and the integral voltage values ​​of the first and second piezoelectric films at resonance are calculated by the integral circuit connected to the first and second piezoelectric films respectively. The received signal code is determined based on the voltage value, and then converted into the final received information according to the predetermined signal code length.

[0057] In summary, this invention enables information interaction under all-metal hermetically sealed packaging of implants and improves the ability of information interaction. It also avoids reducing the hermetical tightness of the packaging due to electromagnetic shielding of the communication module.

Claims

1. An ultrasound-based implant communication device, applied to an all-metal encapsulated implant, said implant comprising a fully enclosed metal shell, characterized in that, The communication device includes a first transceiver and a second transceiver. The first transceiver is disposed on the inner wall of the metal casing and is connected to the control module of the implant. When the second transceiver is used externally, it is brought close to the implantation site of the implant. The first transceiver is used when the implant sends data to the outside world. The implant's control module converts the data to be sent and sends the converted data signal through the first transceiver. The second transceiver is used to receive and process the data signal and obtain the sent data. When the second transceiver is used to send data from outside the implant, the control module of the second transceiver converts the data to be sent and sends the converted data signal. The first transceiver is used to receive and process the data signal and obtain the data to be sent. The first signal transceiver includes a first piezoelectric film, a first resonant coil, a second piezoelectric film, and a second resonant coil. The first and second piezoelectric films are closely attached to the inner wall of the metal shell. The first piezoelectric film is connected to the control module of the implant through the first resonant coil. The second piezoelectric film is connected to the control module of the implant through the second resonant coil. The resonant frequency of the second piezoelectric film is different from that of the first piezoelectric film. The implant's control module converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a first pulse signal and a second pulse signal to the first piezoelectric film and the second piezoelectric film, respectively. The first piezoelectric film and the second piezoelectric film generate corresponding ultrasonic signals. The second transceiver receives and processes the ultrasonic signals to obtain the data to be transmitted. The specific method of applying the first pulse signal and the second pulse signal to the first piezoelectric film and the second piezoelectric film respectively includes: when the signal code is 0, applying the first pulse excitation to the first piezoelectric film; When the signal code is 1, a second pulse excitation is applied to the second piezoelectric film.

2. The ultrasound-based implant communication device according to claim 1, characterized in that, The second signal transceiver includes a signal transceiver probe, which is composed of a coil and a magnet; The control module of the second transceiver converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it inputs excitation signals with the same resonant frequencies as the first and second piezoelectric films into the coils, respectively. Corresponding ultrasonic signals are generated on the surface of the metal casing. The first and second piezoelectric films receive the ultrasonic signals and use the integrating circuit connected to the first and second piezoelectric films to calculate the integrated voltage values ​​when the first and second piezoelectric films resonate, respectively. Based on the voltage values, the received signal code is determined, and then converted into the final received information according to the predetermined signal code length.

3. An ultrasound-based implant communication method, applied to the ultrasound-based implant communication device of claim 2, characterized in that, include: When the implant sends data outside the body, the implant's control module converts the data to be sent and sends the converted data signal through the first signal transceiver. The second signal transceiver is used to receive and process the data signal and obtain the sent data. When data is sent from outside the body to the implant, the control module of the second transceiver converts the data to be sent and sends the converted data signal. The first transceiver receives and processes the data signal to obtain the data to be sent. The specific method by which the implant's control module converts the data to be transmitted and sends the converted data signal through the first signal transceiver includes: The implant's control module converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and signal code sequence, it applies a first pulse signal and a second pulse signal to the first piezoelectric film and the second piezoelectric film, respectively, and the first piezoelectric film and the second piezoelectric film generate corresponding ultrasonic signals. Specific methods for applying pulse signals to the first piezoelectric film and the second piezoelectric film respectively include: The signal code is judged. If the signal code is 0, a first pulse excitation is applied to the first piezoelectric film; if the signal code is 1, a second pulse excitation is applied to the second piezoelectric film.

4. The ultrasound-based implant communication method according to claim 3, characterized in that, The control module of the second transceiver converts the data to be transmitted and sends the converted data signal using the following specific methods: The control module of the second transceiver converts the data to be transmitted into high-level and low-level signal codes. Based on the time sequence and the signal code sequence, it inputs excitation signals to the coil that are equal to the resonant frequencies of the first and second piezoelectric films.

5. The ultrasound-based implant communication method according to claim 3, characterized in that, The first signal transceiver receives and processes data signals, and the specific methods for acquiring the transmitted data include: The first and second piezoelectric films receive ultrasonic signals, and the integral voltage values ​​of the first and second piezoelectric films at resonance are calculated by the integral circuit connected to the first and second piezoelectric films respectively. The received signal code is determined based on the voltage value, and then converted into the final received information according to the predetermined signal code length.

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