Method for manufacturing a board card and board card

Abstract

The embodiment of the present application provides a manufacturing method of a board card and the board card, wherein the method comprises the following steps: arranging a semi-cured part on a first surface of a prepared board card, and making the semi-cured part cover a first end of a first through hole of the prepared board card; processing the semi-cured part, so that the semi-cured part enters into the corresponding first through hole; arranging an adhesive layer on a second surface of the prepared board card, so that the adhesive layer covers a second end of the first through hole; and making a pin of an element extend into the first through hole through a second through hole, so that the pin of the element is connected with an inner wall of the first through hole, and the board card is formed. Through the present application, the problem of poor quality of the PCB hole anti-corrosion manufacturing method in the prior art is solved.

Description

Technical Field

[0001] This application relates to the field of computers, and more specifically, to a method for manufacturing a circuit board and the circuit board itself. Background Technology

[0002] Currently, many devices need to be placed outdoors, placing high demands on PCB boards and other electronic components, especially on the corrosion resistance of the copper in the PCB hole walls. Existing technologies protect the copper in the hole walls by filling the holes with solder mask or epoxy resin. However, some components are press-fitted into the holes on the circuit board, making these methods unsuitable. Even with surface treatments like gold or tin plating, prolonged outdoor exposure, especially in humid environments like near the sea or lake, will still cause the copper in the hole walls to oxidize and corrode, affecting the device's functionality. Current technologies mostly involve manually or mechanically inserting adhesive into the holes and then baking it; this method is inefficient, produces poor-quality plugging, and has poor stability in plugging depth.

[0003] Therefore, there is an urgent need for a method to solve the problem of poor quality in PCB hole wall corrosion protection methods. Summary of the Invention

[0004] This application provides a method for manufacturing a circuit board and a circuit board in order to at least solve the problem of poor quality in the manufacturing methods for corrosion protection of PCB hole walls in related technologies.

[0005] According to one embodiment of this application, a method for manufacturing a circuit board is provided, comprising: providing a semi-cured portion on a first surface of a pre-constructed circuit board, such that the semi-cured portion covers a first end of a first through hole of the pre-constructed circuit board, wherein the pre-constructed circuit board has the first through hole, the first through hole corresponds one-to-one with the semi-cured portion, the first surface is the surface of the pre-constructed circuit board on the side where no component is disposed, and the inner wall of the first through hole is made of metal; processing the semi-cured portion to allow the semi-cured portion to enter the corresponding first through hole; providing an adhesive layer on a second surface of the pre-constructed circuit board, such that the adhesive layer covers a second end of the first through hole, wherein the second surface is the surface of the pre-constructed circuit board opposite to the first surface, the adhesive layer has second through holes corresponding one-to-one with the first through holes, and the projection of the second through hole on the adhesive layer is located within the projection of the corresponding first through hole on the adhesive layer; inserting the pins of the component through the second through hole into the first through hole, such that the pins of the component are connected to the inner wall of the first through hole to form a circuit board.

[0006] In one exemplary embodiment, providing a semi-cured portion on a first surface of a pre-formed board includes: providing a semi-cured layer on the first surface of the pre-formed board, wherein the semi-cured layer covers the first surface of the pre-formed board; removing a portion of the semi-cured layer, with the remaining semi-cured layer forming at least one semi-cured portion.

[0007] In one exemplary embodiment, processing the semi-cured portion to allow it to enter the corresponding first through hole includes: providing an isolation layer on the surface of the semi-cured portion away from the pre-installed board, the isolation layer covering all the semi-cured portions; subjecting the semi-cured portion to heat treatment and pressure treatment to allow it to enter each of the first through holes; and removing the isolation layer and a portion of the semi-cured portion located outside the first through hole.

[0008] In yet another exemplary embodiment, the material of the semi-cured portion is a 1080 semi-cured sheet.

[0009] In yet another exemplary embodiment, the thickness of the adhesive layer ranges from 0.05 mm to 0.15 mm.

[0010] In another exemplary embodiment, the material of the isolation layer is release paper.

[0011] In another exemplary embodiment, the semi-cured portion is subjected to heating and pressurization to allow it to enter each of the first through holes, including: placing the pre-formed board with the semi-cured portion in the processing chamber of a press; controlling the press to heat the pre-formed board with the semi-cured portion; and controlling the press to pressurize the semi-cured portion.

[0012] In another exemplary embodiment, controlling the press to heat the pre-formed card on which the semi-cured portion is provided includes: controlling the press to heat the chamber and controlling the heating rate to be 1°C to 3°C / min, so as to heat the semi-cured portion.

[0013] In yet another exemplary embodiment, controlling the press to pressurize the semi-cured portion includes: controlling the press to pressurize the chamber to 300 psi to 400 psi.

[0014] In another exemplary embodiment, the time for heating and pressurizing the semi-cured portion is between 60 min and 80 min.

[0015] In another exemplary embodiment, the height of the semi-cured portion in the first through hole is 0.25 mm to 0.35 mm.

[0016] In another exemplary embodiment, the projection shape of the second through hole on the adhesive layer is a cross shape or a star shape.

[0017] In another exemplary embodiment, the distance difference between the center of the projection of the second through hole on the adhesive layer and the center of the projection of the first through hole on the adhesive layer is between 0.04 mm and 0.06 mm.

[0018] According to another embodiment of this application, a circuit board manufactured using any of the manufacturing methods described herein is provided, comprising: a pre-installed circuit board having a first through hole; a semi-cured portion located within the first through hole; an adhesive layer located on a second surface of the pre-installed circuit board, the second surface being a surface on one side of the pre-installed circuit board where an element is disposed, the adhesive layer having a second through hole; and the element located on the second surface of the pre-installed circuit board, the pins of the element being connected to the inner wall of the first through hole through the second through hole.

[0019] This application demonstrates that, due to the poor flowability of the semi-cured portion, its flow rate is easily controlled, preventing it from flowing into the center of the hole and causing poor contact of the device pins. By setting an adhesive layer on the front side of the PCB board and a low-flow-rate semi-cured portion on the back side, the first through-hole of the board, i.e., the crimp hole, is sealed, effectively isolating it from air and thus achieving corrosion protection. Therefore, it solves the problem of poor quality in PCB hole wall corrosion protection manufacturing methods. Attached Figure Description

[0020] Figure 1 This is a flowchart of a method for manufacturing a circuit board according to an embodiment of this application;

[0021] Figure 2 This is a structural diagram of a pre-installed circuit board and a semi-cured part according to an embodiment of this application;

[0022] Figure 3 Is Figure 2 Based on the above, the structural diagram of the semi-cured part after processing is shown;

[0023] Figure 4 Is Figure 3 Based on the structural diagram of the adhesive layer;

[0024] Figure 5 Is Figure 4 The structural diagram formed after connecting the components on the basis of the above;

[0025] Figure 6 This is a structural diagram of a pre-installed circuit board and a semi-cured layer according to an embodiment of this application;

[0026] Figure 7 Is Figure 2 Based on this, a structural diagram of the isolation layer is formed.

[0027] The above figures include the following reference numerals:

[0028] 300. Preparatory board; 301. Semi-cured part; 302. First through hole; 303. Adhesive layer; 304. Second through hole; 305. Lead; 306. Component; 307. Semi-cured layer; 308. Isolation layer. Detailed Implementation

[0029] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0031] This embodiment provides a method for manufacturing a circuit board. Figure 1 This is a flowchart of a method for manufacturing a circuit board according to an embodiment of this application, such as... Figure 1 As shown, the process includes the following steps:

[0032] Step S202, as follows Figure 2 As shown, a semi-cured portion 301 is provided on the first surface of the preparatory board 300, and the semi-cured portion 301 covers the first end of the first through hole 302 of the preparatory board 300. The preparatory board 300 has the first through hole 302, and the first through hole 302 corresponds one-to-one with the semi-cured portion 301. The first surface is the surface of the preparatory board 300 on the side where no components are provided. The material of the inner wall of the first through hole 302 is metal.

[0033] Specifically, a PCB (Printed Circuit Board) is an electronic component that serves as the support for electronic components and the carrier for their electrical interconnection. PCB manufacturing mainly involves the following stages: Design: Drawing the PCB layout using CAD software; determining component locations, traces, layers, and hole positions; selecting materials, number of layers, line width, drilling specifications, etc. The main production processes include engraving, copper plating, and mounting (placing components on the precise locations of the copper traces), applying protective film, drilling according to the wiring diagram, printing component labels, and removing excess copper foil and protective film. Finally, the PCB undergoes optical inspection to detect interruptions, misalignments, and other issues. For debuggable PCBs, manufacturers perform ASIC (Application-Specific Integrated Circuit) testing, which verifies and tests the functionality of application-specific integrated circuits. This process typically involves designing, manufacturing, and evaluating the chip. ASIC testing ensures that the chip functions correctly and meets customer requirements and specifications before production or sale. Testing typically includes steps such as logic simulation, physical verification, and electrical characteristic analysis. The aforementioned pre-processed board refers to the board obtained after surface treatment. The reason for performing these steps after surface treatment is that subsequent processes do not involve wet processing, thus avoiding the problem of chemical residue.

[0034] Step S204, as follows Figure 3 As shown, the semi-cured part 301 is processed so that the semi-cured part 301 enters the corresponding first through hole 302.

[0035] Specifically, there can be one or more first through holes. The purpose of processing the semi-cured portion is to change its state so that it can flow into the corresponding first through hole.

[0036] Step S206, as follows Figure 4 As shown, an adhesive layer 303 is provided on the second surface of the aforementioned pre-installed board 300 so that the adhesive layer 303 covers the second end of the aforementioned first through hole 302. The second surface is the surface of the aforementioned pre-installed board 300 that is opposite to the aforementioned first surface. The adhesive layer 303 has a second through hole 304 that corresponds one-to-one with the aforementioned first through hole 302. The projection of the second through hole 304 on the adhesive layer 303 is located within the projection of the corresponding aforementioned first through hole 302 on the adhesive layer 303.

[0037] Specifically, the adhesive layer material can be selected based on different application scenarios and requirements. Common adhesive layer materials include: Polyurethane, a commonly used adhesive layer material with excellent bonding strength and chemical resistance, suitable for bonding various materials such as metals, plastics, and rubber; Acrylic materials, such as acrylates and acrylamides, which have excellent bonding and weather resistance, suitable for bonding various materials; Silicone rubber, an excellent sealing and bonding material with high temperature resistance, corrosion resistance, and oxidation resistance, suitable for bonding under special conditions such as high temperature, high pressure, and chemical corrosion; and Plastics, which have excellent plasticity and chemical resistance, suitable for bonding various materials such as plastics to plastics and plastics to metals. In general, the selection of adhesive layer materials needs to consider multiple factors such as the material's characteristics, the usage environment, and the material composition of the adhesive materials to ensure bonding effectiveness and service life.

[0038] Step S208, as follows Figure 5 As shown, the pin 305 of the above-mentioned component 306 is inserted into the above-mentioned first through hole through the second through hole, so that the pin 305 of the above-mentioned component 306 is connected to the inner wall of the above-mentioned first through hole to form a board.

[0039] Specifically, in practice, inserting the pins of the aforementioned component through the second through-hole into the first through-hole, so that the pins of the component connect with the inner wall of the first through-hole, is a crimping connection method. Generally, in practical applications, plugs or pin headers, DIP components, SIP components, PGA components, etc., can all be crimped. Among them, plugs or pin headers are commonly used components, usually used in electronic devices such as connectors and cables. Plugs or pin headers have relatively long pins and can be directly inserted into the through-holes of the PCB board, and fixed to the board by crimping. DIP components are dual in-line package components, such as DIP integrated circuits, DIP resistors, DIP capacitors, etc. DIP components have relatively short pins and can be directly inserted into the through-holes of the PCB board, and fixed to the board by crimping. SIP components are single in-line package components, such as SIP sockets, SIP switches, etc. SIP components have relatively short pins and can be directly inserted into the through-holes of the PCB board, and fixed to the board by crimping. PGA components are components with pins arranged in a grid pattern, such as PGA integrated circuits, PGA processors, etc. PGA components have short leads that can be directly inserted into through-holes on a PCB board and fixed to the board by crimping. It's important to pay attention to the matching degree between the leads and the through-hole, as well as the control of the crimping force, to avoid bending or damaging the leads. Furthermore, crimping has lower reliability and is prone to poor contact, so thorough testing and inspection are necessary to ensure connection quality and stability. Compared to other component connection methods, crimping leads have the following advantages: 1. Low soldering cost: Compared to traditional soldering methods, crimping leads reduce soldering steps and solder usage, thereby lowering production costs. 2. Rapid assembly: Crimp leads can be quickly assembled using automated tools, improving production efficiency and the automation level of the production line. 3. Wide applicability: Crimp leads are suitable for various through-hole components, such as connectors, pin headers, DIP components, SIP components, PGA components, etc., meeting the connection requirements of different components. 4. High reliability: Crimp leads generate greater friction, resulting in a stronger connection between the leads and the through-hole wall, capable of withstanding greater mechanical stress and vibration, and exhibiting high reliability. 5. Easy maintenance: Crimp pins can be disassembled and replaced without damaging the PCB board, facilitating maintenance and upgrades. In summary, crimp pins are a reliable, economical, fast, and flexible component connection method suitable for the manufacturing and maintenance of various electronic products.

[0040] Through the above steps, the poor flowability of the semi-cured portion makes its flow rate easy to control, preventing it from flowing into the center of the hole and causing poor contact of the device pins. By setting an adhesive layer on the front side of the PCB board and a low-flow semi-cured portion on the back side, the first through hole of the board, i.e., the crimp hole, is sealed, effectively isolating it from air and thus achieving corrosion protection. Therefore, the problem of poor quality in PCB hole wall corrosion protection manufacturing methods can be solved.

[0041] In one exemplary embodiment, step S202 described above can also be implemented in other ways, such as: step S2022, as... Figure 6 As shown, a semi-cured layer 307 is provided on the first surface of the pre-installed board 300, wherein the semi-cured layer 307 covers the first surface of the pre-installed board 300; in step S2024, a portion of the semi-cured layer is removed, and the remaining semi-cured layer forms at least one semi-cured portion. The above method can quickly form the semi-cured portion.

[0042] Specifically, after a semi-cured layer is applied to the first surface of the aforementioned pre-formed board, the semi-cured layer not located at the first end of the first through-hole can be removed by laser cutting. The laser cutting method can be CO2 laser cutting, fiber laser cutting, or diode laser cutting. CO2 laser cutting heats the material to a high temperature, then consumes and separates the material through an oxidation reaction. Fiber laser cutting uses a fiber laser to directionally irradiate the material, creating a localized high-temperature region for rapid and precise cutting. Diode laser cutting uses a semiconductor diode laser to provide energy for material processing, offering advantages such as low cost and high efficiency. Other methods can also be used, including wire sawing, water jetting, and electrical discharge machining. However, these methods typically require more manual operation and are not as fast or precise as the three methods mentioned above.

[0043] In one exemplary embodiment, step S204 described above can also be implemented in other ways, such as: step S2042, as... Figure 7 As shown, an isolation layer 308 is provided on the surface of the semi-cured portion 301 on the side away from the prepared board 300, and the isolation layer 308 covers all of the semi-cured portions 301; in step S2044, the semi-cured portions are subjected to heat treatment and pressure treatment to allow the semi-cured portions to enter each of the first through holes; in step S2046, the isolation layer and a portion of the semi-cured portions located outside the first through holes are removed. The above-mentioned heat and pressure treatment method facilitates the melting and flow of the semi-cured portions, further improving the effectiveness of the board.

[0044] Specifically, heat treatment also helps remove various air bubbles within the semi-cured portion, allowing for rapid release of these bubbles and evaporation of moisture, thus preventing PCB board defects caused by moisture or air bubbles. Pressurizing the semi-cured portion promotes a tighter bond between the semi-cured portion and the metal wall of the first through-hole, improving sealing effectiveness. Furthermore, pressurization helps remove various air bubbles within the semi-cured portion, allowing for rapid release of these bubbles and evaporation of moisture, thus preventing PCB board defects caused by moisture or air bubbles. Further, in certain special cases, heat-pressurizing the semi-cured portion can also improve PCB board performance. For example, in high-frequency circuits, heat-pressurization can reduce the dielectric constant and dielectric loss in the dielectric layer, improving circuit transmission performance. Additionally, even after heat-pressurizing the semi-cured portion, some residual semi-cured portion remains on the first surface. To prevent poor contact, excess resin on the surface can be removed using a resin polishing machine.

[0045] In another exemplary embodiment, the material of the aforementioned prepreg is a 1080 prepreg. Prepregs are commonly used in the manufacture of multilayer PCBs and are an essential raw material for multilayer PCBs. They serve both as adhesives to connect the various layers of the PCB and as interlayer insulation. In the manufacture of a multilayer PCB, the prepreg is first layered on copper foil layers, and then the PCB layers are bonded together using high-pressure hot pressing, followed by resin curing. Finally, excess copper foil is removed using a chemical method, thus completing the multilayer PCB. Its materials include: insulating resin (such as epoxy resin, epoxy benzene, etc.) and fiber substrate (glass fiber or other ceramic fiber). The PCB is manufactured by impregnating the fiber substrate with insulating resin and then gas curing. Different types of prepregs can be selected based on the PCB thickness and the required depth of resin flow into the holes. Different types of prepregs have different resin content and thicknesses; commonly used types include 2116, 7628M, and 7628M.

[0046] To further facilitate effective connection between the component and the PCB board, in another exemplary embodiment, the thickness of the adhesive layer ranges from 0.05 mm to 0.15 mm. The thickness of the adhesive layer can be selected based on the specific material of the adhesive layer, but generally speaking, the thickness of the adhesive layer should not be too thick.

[0047] In yet another exemplary embodiment, the material of the aforementioned release layer is release paper. Release paper is generally made of a non-adhesive surface material, and its main function is to form a clear interface with the adhesive layer, thereby achieving effective separation.

[0048] To further improve the efficiency of the heating and pressurizing process, in an exemplary embodiment, step S2044 can also be implemented in other ways, such as: step S20442, placing the pre-prepared board with the semi-cured part in the processing chamber of the press; step S20444, controlling the press to heat the pre-prepared board with the semi-cured part; step S20446, controlling the press to pressurize the semi-cured part.

[0049] Specifically, in the electronics manufacturing industry, presses are mainly used for semiconductor packaging and PCB production. Their primary function is to achieve fixed connections between metals, PCBs, and components through pressing, screening, gluing, and welding. Presses can be categorized as follows: First, folding presses are used to produce single-sided PCBs, creating a single-layer PCB by folding copper foil rolls onto a resin substrate. Second, hot presses are used to produce multi-layer PCBs. Different prepregs and copper foils are layered and bonded under high pressure and temperature to obtain a multi-layer PCB. Third, cold presses are used for crimping cable connectors, enabling connections between metal and PCBs, wires, etc. Compared to hot presses, they have lower pressure and temperature requirements. Fourth, technical hot presses are mainly used for industrial semiconductor packaging. They can precisely control pressure and temperature, with accuracy down to the micron level. Fifth, molding presses are used for producing flexible circuits and spring connectors, forming complex metal rings, springs, and crimped connections. Sixth, high-temperature presses are used for pressing high-temperature materials, with temperatures reaching over 300°C. Suitable for pressure welding electronic components, etc. The seventh type is a vacuum press, which performs pressing in a vacuum environment, avoiding air pollution and air bubbles.

[0050] Step S20444 above can also be achieved in other ways, such as controlling the press to heat the chamber at a rate of 1°C to 3°C / min to heat the semi-cured portion. This method of controlling the heating rate provides sufficient reaction time, which is beneficial for complete reaction and enhances the adhesive strength of the semi-cured portion.

[0051] Specifically, controlling the heating rate has other benefits for PCB bonding: First, it avoids thermal stress. When the resin expands due to high-speed heating, the different thermal expansion rates of the PCB material and components can generate thermal stress. Low-speed heating allows for proper expansion of each component, preventing stress concentration. Second, it reduces air bubbles. Gases generated by the resin during high-speed heating cannot escape in time, causing bubble trapping. Low-speed heating gives the resin bubbles time to escape, reducing their wetting within the resin. Furthermore, controlling the heating rate within a reasonable range promotes complete reaction. Resin bonding requires a certain reaction time, which high-speed heating cannot adequately address. High-speed heating leads to high levels of resin molecular degradation, affecting thermal stability and stress relief capabilities. Low heating rates reduce degradation, benefiting resin performance. Further, high-speed hot-melt bonding generates high residual stress. Low-speed heating can reduce residual stress, enhancing PCB reliability. During low-speed heating, the resin molecular chains have sufficient time to align, resulting in a more uniform structure, which is beneficial for PCB structural quality.

[0052] Step S20446 can also be achieved in other ways, such as by controlling the press to pressurize the chamber to 300 psi to 400 psi. This method helps to further improve the effectiveness of the semi-cured portion in sealing the first through-hole.

[0053] Specifically, selecting a pressure value within a reasonable range is beneficial for a tight bond between the semi-cured portion and the metal inner wall of the first through hole, improving the effectiveness of the seal. In addition, pressurization helps to remove various air bubbles in the semi-cured portion, allowing the air bubbles in the semi-cured portion to be released quickly and the moisture to evaporate, preventing defects in the PCB board caused by moisture or air bubbles.

[0054] Step S2044 can also be achieved in other ways, such as subjecting the semi-cured portion to heat and pressure treatment for 60 to 80 minutes. This method helps improve the performance of the semi-cured sheet and the production efficiency of the equipment.

[0055] Specifically, the time mentioned above is actually a curing time, which refers to the time required for resin to change from a liquid state to a solid state. In the production of electronic components and PCB boards, various resins are used for bonding, encapsulation, and insulation. Since most resins are liquids before use, they need to be cured by heating or exposure to air before they can function. The time in between is the curing time. Curing times vary depending on the type of resin and curing conditions. The main factors affecting curing time include: the type and ratio of resin (different types of resin have different curing speeds, and the resin ratio also has an impact); temperature (high temperatures accelerate resin curing, while low temperatures have the opposite effect); accelerators (adding accelerators can shorten curing time); thickness (the thicker the resin layer, the longer the curing time); and environmental conditions such as humidity. Therefore, curing time is a critical parameter, as it relates to the resin's performance and the equipment's production efficiency. It is generally necessary to reasonably control the curing time; it should not be too long, wasting time, nor too short, resulting in the resin being used before it is fully cured.

[0056] In one exemplary embodiment, the height of the prepreg portion in the first through-hole is 0.25 mm to 0.35 mm. This method can further control the inflow depth of the prepreg and further prevent poor contact at the pins.

[0057] Specifically, after determining the height of the semi-cured portion in the first through hole, the appropriate semi-cured portion material can be quickly selected based on the height and the flow rate of different materials.

[0058] In one exemplary embodiment, the projection shape of the second through-hole onto the adhesive layer is cross-shaped or star-shaped. The cross-sectional shape of the second through-hole facilitates the passage of device leads during crimping.

[0059] Specifically, the shape of crimp leads usually corresponds to the lead shape of the component. Here are some common crimp lead shapes: 1. Round leads: Round leads are a common lead shape, such as plugs and headers. The diameter and length of round leads can be adjusted according to usage requirements. 2. Square leads: Square leads are also a common lead shape, such as DIP components and SIP components. The side length and length of square leads can be adjusted according to usage requirements. 3. Diamond leads: Diamond leads are a less common lead shape, such as PGA components. The length and angle of diamond leads can be adjusted according to usage requirements. 4. Rectangular leads: Rectangular leads are a lead shape used to connect components such as panel indicator lights, and are usually shorter and wider. It is important to note that the shape of the crimp leads needs to match the shape of the through-holes on the PCB board to ensure that the leads can be accurately inserted into the through-holes and make good contact. At the same time, the length and diameter of the crimp leads also need to be selected according to the lead size of the component and the thickness of the PCB board to avoid bent leads or leads that are too long or too short, leading to poor connections. The projection shape of the second through hole on the adhesive layer can be cross-shaped or star-shaped, and can be adapted to any of the above-mentioned pin shapes.

[0060] In one exemplary embodiment, the distance difference between the center of the projection of the second through hole on the adhesive layer and the center of the projection of the first through hole on the adhesive layer is between 0.04 mm and 0.06 mm.

[0061] Specifically, the aforementioned first through-hole is actually a crimp hole, a type of metal cable connector that connects to holes on the PCB board through a pressing mechanism. Compared to surface mount assembly or through-hole assembly, crimping has the following advantages: First, it is simple and reliable. The connection between metal and board is achieved by directly pressing the crimp connector into the hole on the PCB board and then using a crimping tool. Second, it is easy to assemble and disassemble. Assembly only requires simple pressing and crimping, without soldering, and it can be easily disassembled after assembly. Third, it is low-cost, as assembly tools are relatively inexpensive, and the crimp connector itself is generally also inexpensive. Fourth, it is also suitable for high-frequency signals. Compared to soldering, the metal-to-pin connection achieved by crimp connectors reduces inductance and resistance. Fifth, it has high assembly efficiency and is suitable for automated assembly on mass production lines. Therefore, crimp holes are connection holes specifically designed on PCB boards for crimp connector connections. In addition, the main types of crimp holes are: single crimp holes, which are only suitable for crimp connectors with a single wire; double crimp holes, which are suitable for crimp connectors with two wires connected separately; and multi-crimp holes, which are suitable for crimp connectors with multiple wires, with the number of crimp holes on the PCB board increasing accordingly. Crimping is a component connection method that applies pressure between the component and the PCB board, inserting leads or pin headers into through-holes in the PCB board to achieve the connection between the component and the PCB board.

[0062] This embodiment also provides a circuit board manufactured using any of the above-described manufacturing methods. Figure 5 This is a structural diagram of a circuit board manufactured using any of the above-described manufacturing methods according to embodiments of this application, such as... Figure 5 As shown, it includes:

[0063] A preparatory board 300 is provided, wherein the preparatory board 300 has a first through hole 302;

[0064] Specifically, a PCB (Printed Circuit Board) is an electronic component that serves as the support for electronic components and the carrier for their electrical interconnection. PCB manufacturing mainly involves the following stages: Design: Drawing the PCB layout using CAD software; determining component locations, traces, layers, and hole positions; selecting materials, number of layers, line width, drilling specifications, etc. The main production processes include engraving, copper plating, and mounting (placing components on the precise locations of the copper traces), applying protective film, drilling according to the wiring diagram, printing component labels, and removing excess copper foil and protective film. Finally, the PCB undergoes optical inspection to detect interruptions, misalignments, and other issues. For debuggable PCBs, manufacturers perform ASIC (Application-Specific Integrated Circuit) testing, which verifies and tests the functionality of application-specific integrated circuits. This process typically involves designing, manufacturing, and evaluating the chip. ASIC testing ensures that the chip functions correctly and meets customer requirements and specifications before production or sale. Testing typically includes steps such as logic simulation, physical verification, and electrical characteristic analysis. The aforementioned pre-processed board refers to the board obtained after surface treatment. The reason for performing these steps after surface treatment is that subsequent processes do not involve wet processing, thus avoiding the problem of chemical residue.

[0065] The semi-cured portion 301 is located within the first through hole 302;

[0066] Specifically, the material of the aforementioned semi-cured portion can be a prepreg, which is commonly used in the manufacture of multilayer PCBs and is an essential raw material for multilayer PCBs. It serves both as an adhesive to connect the various layers of the PCB and as interlayer insulation. In the manufacture of multilayer PCBs, the prepreg is first layered onto the copper foil layers, and then the PCB layers are bonded together using high-pressure hot pressing, allowing the resin to solidify. Finally, excess copper foil is removed using a chemical method, completing the multilayer PCB. Its materials include: insulating resin (such as epoxy resin, epoxy benzene, etc.) and fiber substrate (glass fiber or other ceramic fibers). The PCB can be successfully manufactured by impregnating the fiber substrate with insulating resin and then gas curing.

[0067] An adhesive layer 303 is located on the second surface of the pre-installed board 300, the second surface being the surface on the side of the pre-installed board 300 where the component 306 is disposed, and the adhesive layer has a second through hole 304;

[0068] Specifically, the adhesive layer material can be selected based on different application scenarios and requirements. Common adhesive layer materials include: Polyurethane, a commonly used adhesive layer material with excellent bonding strength and chemical resistance, suitable for bonding various materials such as metals, plastics, and rubber; Acrylic materials, such as acrylates and acrylamides, which have excellent bonding and weather resistance, suitable for bonding various materials; Silicone rubber, an excellent sealing and bonding material with high temperature resistance, corrosion resistance, and oxidation resistance, suitable for bonding under special conditions such as high temperature, high pressure, and chemical corrosion; and Plastics, which have excellent plasticity and chemical resistance, suitable for bonding various materials such as plastics to plastics and plastics to metals. In general, the selection of adhesive layer materials needs to consider multiple factors such as the material's characteristics, the usage environment, and the material composition of the adhesive materials to ensure bonding effectiveness and service life.

[0069] The aforementioned component 306 is located on the second surface of the aforementioned preparatory board 300, and the pin 305 of the aforementioned component 306 is connected to the inner wall of the aforementioned first through hole 302 through the aforementioned second through hole 304.

[0070] Specifically, in practice, inserting the pins of the aforementioned component through the second through-hole into the first through-hole, so that the pins of the component connect with the inner wall of the first through-hole, is a crimping connection method. Generally, in practical applications, plugs or pin headers, DIP components, SIP components, PGA components, etc., can all be crimped. Among them, plugs or pin headers are commonly used components, usually used in electronic devices such as connectors and cables. Plugs or pin headers have relatively long pins and can be directly inserted into the through-holes of the PCB board, and fixed to the board by crimping. DIP components are dual in-line package components, such as DIP integrated circuits, DIP resistors, DIP capacitors, etc. DIP components have relatively short pins and can be directly inserted into the through-holes of the PCB board, and fixed to the board by crimping. SIP components are single in-line package components, such as SIP sockets, SIP switches, etc. SIP components have relatively short pins and can be directly inserted into the through-holes of the PCB board, and fixed to the board by crimping. PGA components are components with pins arranged in a grid pattern, such as PGA integrated circuits, PGA processors, etc. PGA components have short leads that can be directly inserted into through-holes on a PCB board and fixed to the board by crimping. It's important to pay attention to the matching degree between the leads and the through-hole, as well as the control of the crimping force, to avoid bending or damaging the leads. Furthermore, crimping has lower reliability and is prone to poor contact, so thorough testing and inspection are necessary to ensure connection quality and stability. Compared to other component connection methods, crimping leads have the following advantages: 1. Low soldering cost: Compared to traditional soldering methods, crimping leads reduce soldering steps and solder usage, thereby lowering production costs. 2. Rapid assembly: Crimp leads can be quickly assembled using automated tools, improving production efficiency and the automation level of the production line. 3. Wide applicability: Crimp leads are suitable for various through-hole components, such as connectors, pin headers, DIP components, SIP components, PGA components, etc., meeting the connection requirements of different components. 4. High reliability: Crimp leads generate greater friction, resulting in a stronger connection between the leads and the through-hole wall, capable of withstanding greater mechanical stress and vibration, and exhibiting high reliability. 5. Easy maintenance: Crimp pins can be disassembled and replaced without damaging the PCB board, facilitating maintenance and upgrades. In summary, crimp pins are a reliable, economical, fast, and flexible component connection method suitable for the manufacturing and maintenance of various electronic products.

[0071] The aforementioned circuit boards can be used in outdoor equipment, such as outdoor communication servers and automotive photovoltaic anti-corrosion boards. Due to the relatively harsh outdoor environment, the requirements for electronic components such as PCB boards are very high, especially the corrosion resistance of the copper in the PCB hole walls. Even with surface treatments such as gold or tin plating, prolonged outdoor placement, particularly in humid environments like near the sea or lake, can still cause the copper in the hole walls to oxidize and corrode, thus affecting the device's functionality. Outdoor communication servers, primarily used for communication and data transmission in outdoor settings, typically require waterproof, dustproof, shockproof, and high / low temperature resistance properties. For example: gateway servers (used to forward, filter, and encrypt data. In outdoor scenarios, gateway servers are typically used to connect mobile devices, sensors, and other terminal devices to collect and transmit data); wireless communication servers (such as WiFi and Bluetooth, enabling wireless data transmission and control. In outdoor scenarios, wireless communication servers can be used to control lighting, fans, weather instruments, and other equipment for intelligent control and monitoring); satellite communication servers (suitable for remote areas or places where traditional communication networks cannot be accessed. In outdoor scenarios, satellite communication servers can be used for communication and data transmission in military, aviation, and maritime fields); and mobile communication servers (which can achieve communication and data transmission via 3G, 4G, and 5G mobile networks. In outdoor scenarios, mobile communication servers can be used for field operations, emergency rescue, and other scenarios to achieve communication and data transmission anytime, anywhere). It is important to note that the selection of outdoor communication servers requires consideration of factors such as scenario requirements, network environment, and data volume to ensure the server's reliability and stability. Vehicle-mounted photovoltaic anti-corrosion boards are electronic components used in vehicle-mounted photovoltaic power systems, primarily to protect electronic equipment from corrosion and damage. For example, in applications such as photovoltaic inverters, charging controllers, battery management systems, and vehicle monitoring systems, it's important to note that the equipment using vehicle-mounted photovoltaic anti-corrosion boards must meet certain power and environmental requirements, such as voltage, current, temperature, and humidity, to ensure the safe and stable operation of the electronic equipment. Furthermore, the selection and installation of vehicle-mounted photovoltaic anti-corrosion boards need to be evaluated and designed based on the actual application scenario to ensure the system's reliability and stability.

[0072] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0073] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0074] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A method for manufacturing a circuit board, characterized in that, include: A semi-cured portion is provided on the first surface of the pre-installed board, such that the semi-cured portion covers the first end of the first through hole of the pre-installed board. The pre-installed board has the first through hole, and the first through hole corresponds one-to-one with the semi-cured portion. The first surface is the surface of the pre-installed board on the side where no components are provided. The material of the inner wall of the first through hole is metal. The semi-cured portion is processed to allow it to enter the corresponding first through hole; An adhesive layer is provided on the second surface of the pre-installed circuit board to cover the second end of the first through hole. The second surface is the surface of the pre-installed circuit board opposite to the first surface. The adhesive layer has second through holes that correspond one-to-one with the first through holes. The projection of the second through hole on the adhesive layer is located within the projection of the corresponding first through hole on the adhesive layer. The pins of the component are inserted into the first through hole through the second through hole, so that the pins of the component are connected to the inner wall of the first through hole to form a board.

2. The method according to claim 1, characterized in that, A semi-cured portion is provided on the first surface of the pre-formed board, including: A semi-cured layer is provided on the first surface of the pre-installed circuit board, wherein the semi-cured layer covers the first surface of the pre-installed circuit board; A portion of the semi-cured layer is removed, and the remaining semi-cured layer forms at least one semi-cured portion.

3. The method according to claim 1, characterized in that, Processing the semi-cured portion to allow it to enter the corresponding first through hole includes: An isolation layer is provided on the surface of the semi-cured portion away from the pre-formed board, and the isolation layer covers all of the semi-cured portion; The semi-cured portion is subjected to heat treatment and pressure treatment to allow the semi-cured portion to enter each of the first through holes; Remove the isolation layer and part of the semi-cured portion located outside the first through hole.

4. The method according to claim 1, characterized in that, The material of the semi-cured part is 1080 semi-cured sheet.

5. The method according to claim 3, characterized in that, The thickness of the adhesive layer ranges from 0.05 mm to 0.15 mm.

6. The method according to claim 3, characterized in that, The material of the isolation layer is release paper.

7. The method according to claim 3, characterized in that, The semi-cured portion is subjected to heat treatment and pressure treatment to allow it to enter each of the first through holes, including: The pre-cured plate with the semi-cured part is placed in the processing chamber of the press; The press is controlled to heat the pre-formed board with the semi-cured portion. The press is controlled to apply pressure to the semi-cured portion.

8. The method according to claim 7, characterized in that, Controlling the press to heat the pre-formed board with the semi-cured portion includes: The press is controlled to heat the chamber at a rate of 1°C to 3°C / min to heat the semi-cured portion.

9. The method according to claim 7, characterized in that, Controlling the press to apply pressure to the semi-cured portion includes: The compressor is controlled to pressurize the chamber to 300 psi to 400 psi.

10. The method according to claim 3, characterized in that, The heating and pressurizing treatment of the semi-cured part is carried out for 60 to 80 minutes.

11. The method according to claim 3, characterized in that, The height of the semi-cured portion in the first through hole is 0.25mm to 0.35mm.

12. The method according to claim 1, characterized in that, The projection shape of the second through hole on the adhesive layer is a cross shape or a star shape.

13. The method according to claim 1, characterized in that, The distance difference between the center of the projection of the second through hole on the adhesive layer and the center of the projection of the first through hole on the adhesive layer is between 0.04 mm and 0.06 mm.

14. A circuit board manufactured using the manufacturing method according to any one of claims 1 to 13, characterized in that, include: A pre-installed board, wherein the pre-installed board has a first through hole; The semi-cured portion is located inside the first through hole; An adhesive layer is located on the second surface of the pre-installed board, the second surface being the surface on one side of the pre-installed board where the components are mounted, and the adhesive layer has a second through hole; The component is located on the second surface of the pre-installed board, and the pins of the component are connected to the inner wall of the first through hole through the second through hole.

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