Preparation method of pressure buffer structure and touch display module

Abstract

The application provides a preparation method of a self-pressing buffering structure and a touch display module. The self-pressing buffering structure comprises a buffering layer and a solidified adhesive layer. The buffering layer is used for providing a contact surface in contact with a self-pressing head. The solidified adhesive layer is stacked with the buffering layer and is arranged separately. The solidified adhesive layer is used for providing a contact surface in contact with a to-be-bonded part. The application adds the solidified adhesive layer in the self-pressing buffering structure, so that the solidified adhesive layer is covered on the to-be-bonded part after being separated from the buffering layer in the self-pressing bonding process, and the self-pressing bonding process and the sealing process of the to-be-bonded part are combined, thereby reducing the use of sealing equipment, simplifying the preparation process of the touch display module, and reducing the cost of manpower and sealing equipment.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a pressure buffer structure and a method for preparing a touch display module. Background Technology

[0002] To enhance the resistance of touch display modules to moisture and salt spray, after the individual components to be bonded in the touch display module are bonded, the touch display module is usually transferred from the laminating device to an encapsulation device such as a coating machine, where the bonded parts are encapsulated. However, the manufacturing process of this touch display module is relatively complex and costly. Summary of the Invention

[0003] In view of this, this application provides a pressure buffer structure and a method for manufacturing a touch display module. By adding a curing adhesive layer to the pressure buffer structure, the curing adhesive layer is separated from the buffer layer while the bonding parts in the touch display module are pressure bonded. The bonding parts are then encapsulated using the curing adhesive layer, reducing the use of encapsulation equipment and its cost, and improving the manufacturing efficiency of the touch display module.

[0004] The first aspect of this application provides a pressure buffer structure, which includes a buffer layer and a curing adhesive layer. The buffer layer provides a contact surface that comes into contact with the pressure head. The curing adhesive layer is stacked on top of the buffer layer and is separable. The curing adhesive layer provides a contact surface with the part to be bonded.

[0005] In the above solution, a curing adhesive layer is added to the pressure buffer structure, and the curing adhesive layer is configured to be stacked with the buffer layer and can be separated. Thus, while the bonding part to be bonded in the touch display module is being pressure bonded, the curing adhesive layer is separated from the buffer layer and applied to the bonding part. That is, the pressure bonding process and the encapsulation process of the bonding part are combined into one, avoiding the process of using encapsulation equipment to encapsulate the bonded part after pressure bonding. This improves the manufacturing efficiency of the touch display module and reduces the cost of manpower and encapsulation equipment.

[0006] In one specific embodiment of the first aspect of this application, the material of the cured adhesive layer includes a UV-curable adhesive.

[0007] In one specific embodiment of the first aspect of this application, the self-pressure buffer structure further includes an adhesive layer. The adhesive layer is located between the buffer layer and the cured adhesive layer, and is configured to bond the cured adhesive layer and the buffer layer together. In this way, by using the adhesive layer to bond the cured adhesive layer and the buffer layer together, direct contact between the cured adhesive layer and the buffer layer is avoided, which helps to reduce the force required for the cured adhesive layer to detach from the buffer layer.

[0008] In one specific embodiment of the first aspect of this application, the material of the adhesive layer includes paraffin wax.

[0009] In one specific embodiment of the first aspect of this application, the adhesion between the cured adhesive layer and the buffer layer is not greater than the adhesion between the cured adhesive layer and the part to be bonded.

[0010] The second aspect of this application provides a method for manufacturing a touch display module, the method comprising: providing a bonding portion; and applying pressure to the side of the buffer layer in the pressure buffer structure of the first aspect of this application away from the cured adhesive layer using a pressure head, so that the cured adhesive layer falls off and covers the bonding portion.

[0011] In one specific embodiment of the second aspect of this application, the softening temperature of the cured adhesive layer is lower than the pressure temperature used when the pressure head presses the bonding portion. The aforementioned application of pressure to the side of the buffer layer in the pressure buffer structure of the first aspect of this application away from the cured adhesive layer, causing the cured adhesive layer to detach and cover the bonding portion, includes: applying pressure to the side of the buffer layer in the pressure buffer structure of the first aspect of this application away from the cured adhesive layer, causing the cured adhesive layer to soften or melt at the pressure temperature, detach, and cover the bonding portion.

[0012] In one specific embodiment of the second aspect of this application, the softening temperature ranges from 60°C to 160°C.

[0013] In one specific embodiment of the second aspect of this application, the pressure temperature ranges from 110°C to 230°C.

[0014] In one specific embodiment of the second aspect of this application, the orthographic projection of the detached portion of the cured adhesive layer on the pressing head coincides with the orthographic projection of the portion to be bonded on the pressing head.

[0015] In one specific embodiment of the second aspect of this application, the portion of the cured adhesive layer that has detached covers the surface of the part to be bonded facing the pressing head; or, the portion of the cured adhesive layer that has detached covers the surface of the part to be bonded facing the pressing head, and also covers the side adjacent to the surface of the part to be bonded facing the pressing head.

[0016] In one specific embodiment of the second aspect of this application, the above-mentioned application of pressure to the side of the buffer layer in the pressure buffer structure of the first aspect of this application away from the cured adhesive layer using the pressure head, so as to cause the cured adhesive layer to fall off and cover the part to be bonded, includes: applying pressure to the side of the buffer layer in the pressure buffer structure away from the cured adhesive layer using the pressure head, so as to use the adhesive layer in the pressure buffer structure to cause the cured adhesive layer to fall off and cover the part to be bonded.

[0017] In one specific embodiment of the second aspect of this application, the melting point of the adhesive layer is lower than the pressure temperature used when the pressure head presses the part to be bonded. The above-mentioned method of applying pressure to the side of the buffer layer in the pressure buffer structure away from the cured adhesive layer using the pressure head, so as to use the adhesive layer in the pressure buffer structure to cause the cured adhesive layer to detach and cover the part to be bonded, includes: applying pressure to the side of the buffer layer in the pressure buffer structure away from the cured adhesive layer using the pressure head, so that the adhesive layer in the pressure buffer structure melts and causes the cured adhesive layer to detach and cover the part to be bonded.

[0018] In one specific embodiment of the second aspect of this application, the melting point of the adhesive layer is lower than the softening temperature of the cured adhesive layer.

[0019] In one specific embodiment of the second aspect of this application, the melting point of the adhesive layer is in the range of 50°C to 70°C. Attached Figure Description

[0020] Figure 1 The diagram shown is a planar structure schematic of a touch display module.

[0021] Figure 2 As shown Figure 1 The diagram shows a cross-sectional view of the touch display module taken along M1-M2.

[0022] Figure 3 The diagram shown is a structural schematic of a pressing device provided in an embodiment of this application, which is used to press a touch display module.

[0023] Figure 4 As shown Figure 3 A schematic diagram of the structure of the touch display module in the illustrated embodiment.

[0024] Figure 5 As shown Figure 3 A schematic diagram of the pressing device in the illustrated embodiment.

[0025] Figure 6 As shown Figure 3 A schematic diagram of the pressure buffer structure in the illustrated embodiment.

[0026] Figure 7 The diagram shown is a structural schematic of a pressing device provided in another embodiment of this application, which is used to press a touch display module.

[0027] Figure 8 As shown Figure 7 The schematic diagram of the pressure buffer structure in the embodiment shown is shown.

[0028] Figure 9 The diagram shown is a flowchart illustrating a method for fabricating a touch display module according to an embodiment of this application.

[0029] Figure 10 As shown Figure 3 The illustrated embodiment shows a structural diagram of the pressing device after pressing the touch display module.

[0030] Figure 11 As shown Figure 3 The illustrated embodiment shows another structural diagram of the pressing device after pressing the touch display module.

[0031] Figure 12 As shown Figure 7 The illustrated embodiment shows a structural diagram of the pressing device after pressing the touch display module.

[0032] Figure 13 As shown Figure 7 The illustrated embodiment shows another structural diagram of the pressing device after pressing the touch display module.

[0033] Figure 14 As shown Figure 7 The illustrated embodiment shows another structural diagram of the pressing device after pressing the touch display module.

[0034] Figure 15 The diagram shown is a flowchart illustrating a method for fabricating a touch display module according to an embodiment of this application.

[0035] Figure 16 The diagram shown is a flowchart illustrating a method for preparing a touch display module according to another embodiment of this application.

[0036] Figure 17 The diagram shown is a flowchart illustrating a method for preparing a touch display module according to another embodiment of this application. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] The fabrication process of a touch display module typically includes at least one bonding process, such as chip bonding, circuit board bonding, and flip-chip bonding. Chip bonding includes bonding between the chip and a glass substrate (Chip On Glass, COG, or COG bonding) or bonding between the chip and a plastic substrate (Chip On Plastic, or Chip On Polyimide, COP, or COP bonding). Circuit board bonding includes one or more of the following: bonding of a display flexible printed circuit (DFPC) to a glass substrate (DFPC On Glass, DFOG, or DFOG bonding); bonding of a display flexible printed circuit to a film substrate (DFPC On Film, DFOF, or DFOF bonding); bonding of a touch flexible printed circuit (TFPC) to a glass substrate (TFPC On Glass, TFOG, or TFOG bonding); and bonding of a touch flexible printed circuit to a film substrate (TFPC On Film, TFOF, or TFOF bonding). The bonding process of chip on film (COF) (referred to as COF bonding) includes bonding the chip on film to a glass substrate (COF on Glass, or Film on Glass), or bonding the chip on film to a film substrate (COF on Film, or Film on Film).

[0039] Bonding processes typically include pre-compression bonding and main-compression bonding. Pre-compression (also known as dummy-compression) bonding uses conditions such as temperature, pressure, or time lower than those used in main-compression (also known as master-compression) bonding. Pre-compression bonding aligns and adheres two parts to be bonded together using conditions lower than those in main-compression bonding. Main-compression bonding fixes the two pre-compressed and aligned parts together using conditions higher than those in pre-compression bonding.

[0040] To enhance the resistance of touch display modules to moisture and salt spray, after each component to be bonded in the touch display module is bonded, the touch display module is usually moved from the laminating device to a sealing device such as a coating machine. The sealing device is used to encapsulate the bonded parts, thereby improving the reliability of the touch display module.

[0041] However, careful research revealed that, on the one hand, after each bonding process of the touch display module, the touch display module needs to be moved from the laminating device to the encapsulation equipment multiple times, which increases the complexity of the touch display module manufacturing process. On the other hand, the need to use encapsulation equipment increases the manufacturing cost of the touch display module.

[0042] For example, exemplarily, refer to Figure 1 and Figure 2 The touch display module 10 includes a display module 11 and a touch module 12. The display module 11 includes a composite tape 11a, a glass substrate 11b, a display functional layer 11c, an encapsulation glass 11d, and a polarizer 11e, all stacked together. The display module 11 also includes a driver chip 11f, a flip-chip film 11g, and a flexible circuit board 11h for display. One end of the flip-chip film 11g is bonded to the glass substrate 11b (corresponding to COF bonding), and the other end of the flip-chip film 11g is bonded to the flexible circuit board 11h for display (corresponding to DFOF bonding). The touch module 12 includes a touch functional layer 12a and a cover plate 12b, all stacked together. The touch module 12 also includes a flexible circuit board 12c for touch. One end of the flexible circuit board 12c is bonded to the encapsulation glass 11d (corresponding to TFOG bonding), and the other end of the flexible circuit board 12c is bonded to the flexible circuit board 11h for display (corresponding to TFOF bonding). Therefore, the touch display module 10 can be divided into a display area AA and a non-display area NA. The non-display area NA may include a COF bonding area a, a DFOF bonding area b, and a TFOG bonding area c. The non-display area NA may also include a TFOF bonding area d. It should be noted that the TFOF bonding area d may also be located within the display area AA. When bonding two components, an anisotropic conductive film (ACF) 1 can be used to connect the two components.

[0043] The manufacturing process of display module 11 typically includes COF bonding, DFOF bonding, and a first encapsulation process. The first encapsulation process involves applying an uncured encapsulating adhesive layer to the surface of the bonding components located in the COF bonding area using encapsulation equipment, and applying an uncured encapsulating adhesive layer to the surface of the bonding components located in the DFOF bonding area using encapsulation equipment. The manufacturing process of touch module 12 typically includes TFOG bonding, TFOF bonding, and a second encapsulation process. The second encapsulation process involves applying an uncured encapsulating adhesive layer to the surface of the bonding components located in the TFOG bonding area using encapsulation equipment, and applying an uncured encapsulating adhesive layer to the surface of the bonding components located in the TFOF bonding area using encapsulation equipment. It should be noted that the uncured encapsulating adhesive layer can be cured under ultraviolet light or heat. The cured encapsulating adhesive layer seals the bonding components, thereby preventing corrosion of the bonding components by water, oxygen, etc. Between DFOF bonding and the first encapsulation process, processes such as Automated Optical Inspection (AOI) and transcoding may be included. Between the first encapsulation process and TFOG bonding, processes such as telecommunications and visual inspection of the display module may be included. Between TFOF bonding and the second encapsulation process, processes such as touch panel (TP) testing may be included. The encapsulation process for the bonding components in the two different bonding areas within the first or second encapsulation process is performed independently.

[0044] To address at least one of the aforementioned problems, at least one embodiment of this application provides a pressure-bearing buffer structure and a method for manufacturing a touch display module. By improving and optimizing the pressure-bearing buffer structure, a curing adhesive layer is added to the pressure-bearing buffer structure. During the pressure bonding process, the curing adhesive layer is detached from the buffer layer and then covered onto the part to be bonded. The pressure bonding process and the encapsulation process of the part to be bonded are combined into one, thereby reducing the use of encapsulation equipment and the step of moving the bonded part to the encapsulation equipment. This reduces the cost of manpower and encapsulation equipment, and also reduces the manufacturing cost of the touch display module.

[0045] The following description, in conjunction with the accompanying drawings, illustrates the fabrication method of the pressure-buffered structure and the touch display module in at least one embodiment of this application. Furthermore, in these drawings, a spatial rectangular coordinate system is established with reference to the buffer layer in the pressure-buffered structure to aid in illustrating the positional relationships of the various structures within the pressure-buffered structure. In this spatial rectangular coordinate system, the X and Y axes are parallel to the plane containing the buffer layer (or the plane containing the touch display module), and the Z axis is perpendicular to the plane containing the buffer layer. Additionally, in the embodiments of this application, "thickness" is defined with reference to the buffer layer. For example, for an object located on one side of the buffer layer, the difference between the vertical distance from the farthest end of the object to the buffer layer and the vertical distance from the closest end to the buffer layer is the thickness of the object.

[0046] refer to Figure 3 and Figure 4 The touch display module 100 includes a first bonding element 110 and a second bonding element 120. The overlapping portion of the first bonding element 110 and the second bonding element 120 constitutes the bonding portion A.

[0047] It should be noted that the touch display module 100 includes a bonding area e, and the first component to be bonded 110 and the second component to be bonded 120 overlap within the bonding area e. Accordingly, the bonding portion A is composed of the portion of the first component to be bonded 110 located within the bonding area e and the portion of the second component to be bonded 120 located within the bonding area e. The bonding area e can be as described above. Figure 2 The COF binding area a, DFOF binding area b, TFOG binding area c, and TFOF binding area d in the touch display module 100 shown can also be any of COG binding area, COP binding area, DFOG binding area, and TFOG binding area.

[0048] The structure of the touch display module 100 can be as follows: Figure 1 and Figure 2 The rigid screen structure shown can also be a flexible screen structure. The first bonding component 110 and the second bonding component 120 can be any two bonding components in the touch display module 100 that need to be bonded. For example, one of the first bonding component 110 and the second bonding component 120 can be a circuit board, a driver chip, or a flip-chip film, while the other can be a glass substrate, a flexible substrate, or a circuit board. The circuit board can be a flexible circuit board or a rigid circuit board.

[0049] refer to Figure 3 and Figure 5The pressing device 200 is used to press the first bonding member 110 and the second bonding member 120 in the touch display module 100. The pressing device 200 includes a pressing head component 210, and may further include a support component 220. The pressing head component 210 includes a pressing head 211. The pressing head component 210 is configured to apply pressure to the side of the bonding portion A facing the pressing head component 210. The pressing head component 210 may also include a pressing buffer structure 212. It should be noted that the pressing buffer structure 212 may not be part of the pressing device 200, but may exist independently of the pressing device 200; for example, the pressing buffer structure 212 may be used directly only when using the pressing device 200. The pressing buffer structure 212 is configured to at least cover the surface of the pressing head 211 facing the bonding portion A. The support member 220 is disposed opposite to the pressure head member 210. The support member 220 is configured to apply pressure to the side of the part to be bonded A away from the pressure head member 210 or to support the part to be bonded A. The pressure buffer structure 212 is used to cover the pressure head 211 in the pressing device 200. The pressing device 200 is used to press the first part to be bonded 110 and the second part to be bonded 120 in the touch display module 100. It should be noted that the pressure buffer structure 212 can cover the surface of the pressure head 211 in the pressing device 200 facing the part to be bonded A, and can also further cover the side adjacent to the surface of the pressure head 211 facing the part to be bonded A. During the bonding process, the pressing head 211 can be heated to the bonding temperature by the heating component. The heat from the bonding temperature can be transferred from the pressing head 211 to the bonding buffer structure 212 and the touch display module 100, thereby making the connection between the first bonding member 110 and the second bonding member 120 more secure after bonding. The heating component can be part of the pressing device 200 or independent of the pressing device 200. The heating component can be located at any position within the pressing device 200. For example, in some embodiments, the heating component can cover the surface of the pressing head 211 facing away from the support member 220. In other embodiments, the heating component can cover both the surface of the pressing head 211 facing away from the support member 220 and the side adjacent to that surface. In yet another embodiment, the heating component can be located within the support member 220.

[0050] refer to Figure 3 and Figure 6The pressure-buffered structure 212 includes a buffer layer 2121 and a curing adhesive layer 2122. The buffer layer 2121 provides a contact surface that contacts the pressure head 211. The curing adhesive layer 2122 is stacked on top of the buffer layer 2121 and can be separated. The curing adhesive layer 2122 provides a contact surface with the part A to be bonded. Thus, by adding a curing adhesive layer 2122 to the pressure-buffered structure 212, the curing adhesive layer 2122 can be detached from the buffer layer 2121 and applied to the part A to be bonded during the pressure bonding process. That is, the pressure bonding process and the encapsulation process of the part A to be bonded are combined into one, reducing the step of moving the bonded part to the encapsulation equipment. Therefore, the manufacturing efficiency of the touch display module 100 is improved, the use of encapsulation equipment is reduced, and the cost of manpower and encapsulation equipment is reduced.

[0051] It should be noted that during the bonding process, the buffer layer 2121 in the bonding buffer structure 212 (also called the bonding buffer material) provides a buffering force to the bonding head 211, allowing the bonding head 211 to gently contact the bonding portion A, preventing damage to the bonding portion A due to excessive impact force, and also preventing the bonding portion A from being burned due to excessive temperature of the bonding head 211. The maximum operating temperature of the buffer layer 2121 is higher than the bonding temperature. The material of the buffer layer 2121 includes, but is not limited to, at least one of silicone and polytetrafluoroethylene (PTFE). For example, the buffer layer 2121 can be a silicone sheet or Teflon. Taking the buffer layer 2121 as a silicone sheet as an example, the silicone sheet is made by adding a high thermal conductivity material to silicone as a base material and then vulcanizing it. The high temperature resistance range of the silicone sheet is 200℃ to 360℃, for example, 350℃. Taking Teflon as an example, the material of Teflon may include at least one of PTFE, fluorinated ethylene propylene copolymer (FEP), ethylene tetrafluoroethylene copolymer (ETFE) and perfluoroalkyl compound (PFA). The maximum operating temperature range of Teflon is 260℃ to 400℃. For example, the maximum operating temperature of PTFE is 300℃ and the maximum operating temperature of FEP is 200℃.

[0052] In some embodiments, exemplarily, reference Figure 3 The orthographic projection of the surface of the side of the bonding portion A facing the bonding head 211 onto the surface of the bonding head 211 opposite to the bonding portion A can coincide with the orthographic projection of the surface of the bonding head 211 facing the bonding portion A onto the surface of the bonding head 211 opposite to the bonding portion A. In other embodiments, exemplarily, refer to Figure 9The orthographic projection of the surface of the side of the bonding part A facing the bonding part A onto the surface of the bonding head 211 away from the bonding part A onto the surface of the bonding head 211 away from the bonding part A may also be located within the orthographic projection of the surface of the bonding head 211 facing the bonding part A onto the surface of the bonding head 211 away from the bonding part A.

[0053] The cured adhesive layer 2122 can be a cured encapsulating adhesive, which is solid or solid gel at room temperature (e.g., 25°C). The material of the cured adhesive layer 2122 can include, but is not limited to, UV-curable adhesive, thermosetting adhesive, or chemically curable adhesive, as long as the cured adhesive layer 2122 can detach from the side of the buffer layer 2121 away from the pressure head 211 at the current pressure temperature. Based on this, the embodiments of this application do not specifically limit the material of the cured adhesive layer 2122. For example, in at least one embodiment of this application, the material of the cured adhesive layer 2122 includes UV-curable adhesive. Further, for example, the cured adhesive layer 2122 can be an adhesive layer formed by curing uncured UV-curable adhesive under the action of UV light. Thus, the cured adhesive layer 2122, including the UV-curable adhesive, can be non-tacky or have low tack at room temperature (e.g., 25°C). When the operating temperature of the cured adhesive layer 2122 is greater than 60°C, the adhesion between the cured adhesive layer 2122, including the UV-curable adhesive, and the bonding portion A can reach 10 N / mm. 2 As described above, when the operating temperature of the cured adhesive layer 2122 is greater than its softening temperature, the cured adhesive layer 2122, including the UV-curable adhesive, can soften but will not melt into a liquid. Therefore, the softened cured adhesive layer 2122 can detach along the outer edge of the pressing head 211 and cover the bonding portion A (see reference). Figure 12 , Figure 13 and Figure 14 In addition, the cured adhesive layer 2122, including the UV-curable adhesive, has high tensile strength (e.g., tensile strength greater than 58 kgf / cm²). 2 It also has a high hardness (e.g., 40D to 70D), so the cured adhesive layer 2122, including the UV-curable adhesive, can play a reinforcing role while encapsulating the bonding part A.

[0054] It should be noted that the UV-curing adhesive can be a regular UV-curing adhesive, whose softening temperature is around 100℃ (e.g., 80℃~120℃). Alternatively, it can be a high-temperature resistant UV-curing adhesive, whose softening temperature is around 150℃ (e.g., 120℃~160℃).

[0055] The buffer layer 2121 may be in direct contact with the cured adhesive layer 2122, or it may not be in direct contact with the cured adhesive layer 2122. The connection relationship and structural design between the buffer layer 2121 and the cured adhesive layer 2122 will be illustrated below with examples of several specific embodiments.

[0056] For example, in some embodiments, if the buffer layer 2121 and the cured adhesive layer 2122 are in direct contact, the material of the cured adhesive layer 2122 can be coated or spin-coated to form an uncured encapsulating adhesive layer on the surface of the buffer layer 2121 away from the pressing head 211, and then the uncured encapsulating adhesive layer is cured to form the cured adhesive layer 2122.

[0057] For example, in other embodiments, reference is made to... Figure 7 and Figure 8 The pressure-absorbing structure 213 is a variation of the pressure-absorbing structure 212 described above. The difference between the pressure-absorbing structure 212 and the pressure-absorbing structure 213 is that the pressure-absorbing structure 213 further includes an adhesive layer 2131. The adhesive layer 2131 is located between the buffer layer 2121 and the cured adhesive layer 2122, and is configured to bond the cured adhesive layer 2122 and the buffer layer 2121. In this way, the material of the adhesive layer 2131 can be applied to the surface of the buffer layer 2121 on the side away from the pressure head 211 by coating or spin coating. Then, the material of the cured adhesive layer 2122 can be applied to the surface of the adhesive layer 2131 on the side away from the buffer layer 2121 by coating or spin coating to form an uncured encapsulating adhesive layer. After curing the uncured encapsulating adhesive layer, a cured adhesive layer 2122 is formed. Thus, the adhesive layer 2131 is used to bond the cured adhesive layer 2122 to the buffer layer 2121, avoiding direct contact between the cured adhesive layer 2122 and the buffer layer 2121, which helps to reduce the force required for the cured adhesive layer 2122 to detach from the buffer layer 2121.

[0058] It should be noted that the thickness of the cured adhesive layer 2122 can be 30μm to 70μm, for example, 50μm. The thickness of the adhesive layer 2131 can be less than the thickness of the cured adhesive layer 2122. For example, the thickness of the adhesive layer 2131 can be 5μm to 15μm, and further, 8μm, 10μm or 13μm.

[0059] In the pressure-reducing structure provided in at least one embodiment of this application, the material of the adhesive layer 2131 includes paraffin wax. Thus, the melting point of the paraffin-containing adhesive layer 2131 is in the range of 60°C to 64°C. Therefore, the paraffin-containing adhesive layer 2131 can be tacky before melting, thereby bonding the cured adhesive layer 2122 to the buffer layer 2121 together. After melting, the paraffin-containing adhesive layer 2131 becomes non-tacky, allowing the cured adhesive layer 2122 to separate from the buffer layer 2121, which helps to reduce the force required to detach the cured adhesive layer 2122 from the buffer layer 2121.

[0060] It should be noted that the material of the adhesive layer 2131 includes, but is not limited to, paraffin wax. For example, the material of the adhesive layer 2131 may include any one or more of stearic acid and carnauba wax.

[0061] In at least one embodiment of this application, the adhesive force between the cured adhesive layer 2122 and the buffer layer 2121 is no greater than the adhesive force between the cured adhesive layer 2122 and the part to be bonded A. This helps to reduce the force required to detach the cured adhesive layer 2122 from the buffer layer 2121.

[0062] It should be noted that the adhesion between the cured adhesive layer 2122 and the buffer layer 2121 can refer to the adhesion between the cured adhesive layer 2122 and the buffer layer 2121 under normal operating temperature or under pressure temperature. The adhesion between the cured adhesive layer 2122 and the buffer layer 2121 can be the adhesion at the contact surface when the cured adhesive layer 2122 and the buffer layer 2121 are in direct contact, or it can be the adhesion at the contact surface between the adhesive layer 2131 and the buffer layer 2121 when an adhesive layer 2131 exists between them, or the adhesion at the contact surface between the cured adhesive layer 2122 and the adhesive layer 2131.

[0063] At least one embodiment of this application also provides a method for manufacturing a touch display module, exemplarily, referring to... Figure 9 The preparation method includes the following steps.

[0064] S110: Provided for bonding.

[0065] For example, refer to Figure 3 and Figure 4The first bonding element 110 and the second bonding element 120 can be pre-pressed to align and adhere them together. The portion of the first bonding element 110 that adheres to the second bonding element 120 and the portion of the second bonding element 120 that adheres to the first bonding element 110 can constitute bonding portion A. The first bonding element 110 and the second bonding element 120 can be any two bonding elements in the touch display module 100.

[0066] S120: Using this pressure head, pressure is applied to the side of the buffer layer in this pressure buffer structure that is away from the cured adhesive layer, so that the cured adhesive layer falls off and covers the part to be bonded.

[0067] For example, refer to Figure 3 The pre-aligned first bonding member 110 and the second bonding member 120 can be placed on the support member 220 in the pressing device 200. The pressing head 211 can be fixed at a position opposite to the support member 220, or it can be moved to a position opposite to the support member 220, so that the pressing head 211 and the support member 220 are opposite to each other, and the bonding part A is located between the pressing head 211 and the support member 220. The pressure buffer structure 212 can always cover the pressing head 211, or it can be moved to the pressing head 211 before the pressing process, so that the pressure buffer structure 212 covers the pressing head 211. The pressure head 211, which is covered with the pressure buffer structure 212, can move along the negative direction of the Z-axis to the surface of the part A to be bonded facing the pressure head 211 and continue to apply pressure along the negative direction of the Z-axis to make the first part to be bonded 110 and the second part to be bonded 120 more firmly connected. After the pressure bonding process, when the pressure head 211 moves along the positive direction of the Z-axis, the cured adhesive layer 2122 can be fixed on the part A to be bonded, thereby encapsulating the part A to be bonded.

[0068] It should be noted that the pressure buffer structure can be the pressure buffer structure 212 or 213 in the above embodiments, or it can be a pressure buffer structure that is equivalent to or significantly modified from the pressure buffer structure 212 or 213 in the above embodiments.

[0069] The touch display module 100 can be applied to various electronic display products, including but not limited to mobile phones, tablets, e-book readers, media players, digital cameras, laptops, in-vehicle computers, desktop computers, set-top boxes, smart TVs, and wearable devices.

[0070] Since any two components to be bonded in the touch display module 100 can be bonded using the pressing device 200 in the above embodiments, and the pressing device 200 can use the pressure buffer structure 212 or 213 in the above embodiments, the specific implementation of the preparation method can refer to the description in the relevant embodiments of the pressure buffer structure 212 or 213, and at least all of the above technical effects can be achieved, which will not be repeated here.

[0071] The cured adhesive layer 2122 can be detached from the buffer layer 2121 by peeling, softening, or melting at the specified pressure temperature. This application does not specifically limit the method by which the cured adhesive layer 2122 detaches from the buffer layer 2121. Below, several specific embodiments are used to illustrate the methods by which the cured adhesive layer 2122 detaches from the buffer layer 2121.

[0072] For example, in some embodiments, the adhesive force of the surface of the cured adhesive layer 2122 facing the buffer layer 2121 can be less than the adhesive force of the surface of the cured adhesive layer 2122 away from the buffer layer 2121, thereby making it easier for the cured adhesive layer 2122 to detach from the buffer layer 2121 and cover the part A to be bonded during the bonding process. For example, the surface roughness of the side of the cured adhesive layer 2122 facing the buffer layer 2121 can be less than the surface roughness of the side of the cured adhesive layer away from the buffer layer 2121, thereby making the adhesive force between the cured adhesive layer 2122 and the buffer layer 2121 less than the adhesive force between the cured adhesive layer 2122 and the part A to be bonded.

[0073] In at least one embodiment of this application, the softening temperature of the cured adhesive layer 2122 is lower than the pressure temperature used when the pressure head 211 presses the bonding portion A. (See reference...) Figure 15 ,and Figure 9 The difference in the illustrated embodiment is that step S121 is Figure 9 One specific implementation of step S120 in the illustrated embodiment.

[0074] S121: Using this pressure head, pressure is applied to the side of the buffer layer in this pressure buffer structure that is away from the cured adhesive layer, so that the cured adhesive layer softens or melts at this pressure temperature and falls off to cover the part to be bonded.

[0075] For example, during the bonding process, the cured adhesive layer 2122 softens at the bonding temperature and can easily detach from the buffer layer 2121 and cover the bonding portion A. Furthermore, the softened cured adhesive layer 2122 has a certain degree of fluidity, thus it easily flows to the side of the bonding portion A (see reference). Figure 11 , Figure 13 and Figure 14The softened cured adhesive layer 2122 returns to a cured state or cured adhesive state after the temperature decreases, so that the cured adhesive layer 2122 covering the bonding part A can protect and encapsulate the surface of the bonding part A facing the pressing head 211 and the side adjacent to the surface of the bonding part A facing the pressing head 211.

[0076] It should be noted that the softening temperature refers to the temperature at which a sample reaches a certain deformation under specific conditions such as sample size, heating rate, and applied external force.

[0077] In some embodiments, the softening temperature of the curing adhesive layer 2122 is in the range of 60°C to 160°C. Thus, the bonding temperature can be determined based on the softening temperature of the curing adhesive layer 2122 and the maximum operating temperature of the part A to be bonded. A lower softening temperature of the curing adhesive layer 2122 allows for bonding of the part to be bonded at a lower bonding temperature while ensuring that the maximum operating temperature of the part to be bonded is lower than the bonding temperature, which helps reduce energy loss.

[0078] In some embodiments, the bonding temperature ranges from 110°C to 230°C. Thus, by ensuring that the maximum operating temperature of the bonding portion and the softening temperature of the cured adhesive layer 2122 are both lower than the bonding temperature, a suitable bonding temperature can be selected for bonding the bonding portion, avoiding damage to the bonding portion or the cured adhesive layer during the bonding process.

[0079] For another example, the melting point of the cured adhesive layer 2122 can be lower than the pressure temperature used when the pressure head 211 presses the bonding portion A. During the bonding process, the cured adhesive layer 2122 melts at the pressure temperature and can detach and cover the bonding portion A. In addition, the molten cured adhesive layer 2122 has a certain degree of fluidity, so it easily flows to the side of the bonding portion A (see reference). Figure 11 , Figure 13 and Figure 14 The cured adhesive layer 2122 returns to a cured state or cured adhesive state after the temperature decreases, so that the cured adhesive layer 2122 covering the bonding part A can protect and encapsulate the surface of the bonding part A facing the pressing head 211 and the side adjacent to the surface of the bonding part A facing the pressing head 211.

[0080] It should be noted that melting point refers to the lowest temperature at which a substance melts. For example, the melting point of cured adhesive layer 2122 refers to the lowest temperature at which cured adhesive layer 2122 melts.

[0081] In at least one embodiment of this application, the orthographic projection of the detached portion of the cured adhesive layer 2122 on the pressing head 211 coincides with the orthographic projection of the part A to be bonded on the pressing head 211. Thus, when the cured adhesive layer 2122 softens or melts and detaches, the portion of the cured adhesive layer 2122 that is in contact with the part A to be bonded can detach and cover the part A to be bonded, thereby avoiding excessive detachment of the cured adhesive layer 2122, which would cause the cured adhesive layer 2122 to flow to the part that does not need to be encapsulated and cause unnecessary adhesion between the cured adhesive layer 2122 and other structures in the touch display module.

[0082] In at least one embodiment of this application, the portion of the cured adhesive layer 2122 that has detached covers the surface of the part to be bonded A facing the pressing head 211. For example, refer to... Figure 10 and Figure 12 In this way, the detached portion of the cured adhesive layer 2122 can encapsulate the surface of the bonding portion A facing the side of the pressing head 211.

[0083] In at least one embodiment of this application, the portion of the cured adhesive layer 2122 that has detached covers the surface of the part to be bonded A facing the pressing head 211, and also covers the side adjacent to the surface of the part to be bonded A facing the pressing head 211. For example, refer to... Figure 11 , Figure 13 and Figure 14 In this way, the detached portion of the cured adhesive layer 2122 can encapsulate the surface of the bonding portion A facing the side of the pressing head 211 and the adjacent side.

[0084] refer to Figure 16 ,and Figure 9 The difference in the illustrated embodiment is that step S122 is Figure 9 One specific implementation of step S120 in the illustrated embodiment.

[0085] S122: Apply pressure to the side of the buffer layer in this pressure buffer structure that is away from the cured adhesive layer using the pressure head, so as to use the adhesive layer in this pressure buffer structure to make the cured adhesive layer fall off and cover the part to be bonded.

[0086] For example, at this pressing temperature, the adhesive force between the adhesive layer 2131 and the buffer layer 2121 can be less than the adhesive force between the cured adhesive layer 2122 and the adhesive layer 2131. This helps to reduce the force required to detach the adhesive layer 2131 and the cured adhesive layer 2122 from the buffer layer 2121. In some embodiments, during the pressing process, the adhesive layer 2131 can be detached from the buffer layer 2121 together with the cured adhesive layer 2122 and then cover the bonding portion A. The orthographic projection of the portion of the adhesive layer 2131 covering the bonding portion A on the first bonding member 110 can coincide with the orthographic projection of the portion of the cured adhesive layer 2122 covering the bonding portion A on the first bonding member 110 (see reference). Figure 12 The portion of the cured adhesive layer 2122 covering the bonding portion A, when projected onto the first bonding member 110, may also lie within the projection of the portion of the adhesive layer 2131 covering the bonding portion A onto the first bonding member 110 (see reference). Figure 13 and Figure 14 In other embodiments, after the bonding process, at least a portion of the adhesive layer 2131 may remain in the bonding buffer structure 213, and the cured adhesive layer 2122 may detach from the adhesive layer 2131 and cover the bonding portion A (see reference). Figure 14 In some other embodiments, after the bonding process, the adhesive layer 2131 may remain in the bonding buffer structure 213, and the cured adhesive layer 2122 may be detached from the adhesive layer 2131 and cover the bonding portion A.

[0087] For example, in at least one embodiment of this application, the melting point of the adhesive layer 2131 is lower than the pressure temperature used by the pressure head 211 to press the bonding portion A. (See reference...) Figure 17 ,and Figure 16 The difference in the illustrated embodiment is that step S1221 is Figure 16 One specific implementation of step S123 in the illustrated embodiment.

[0088] S1221: Using this pressure head, pressure is applied to the side of the buffer layer in this pressure buffer structure that is away from the cured adhesive layer, so that the adhesive layer in this pressure buffer structure melts and carries the cured adhesive layer off together and covers the part to be bonded.

[0089] In this embodiment, the adhesive layer 2131 melts at the pressure temperature and detaches from the buffer layer 2121. This allows the adhesive layer 2131 to pull the cured adhesive layer 2122 off together and cover the bonding portion A, preventing adhesion when the cured adhesive layer 2122 is in direct contact with the buffer layer 2121. The adhesive layer 2131 has a certain fluidity after melting at the pressure temperature. Therefore, in addition to covering the surface of the cured adhesive layer 2122 facing the pressure head 211, the molten adhesive layer 2131 can flow to the side adjacent to the surface of the cured adhesive layer 2122 facing the pressure head 211 (see reference). Figure 13 and Figure 14 This allows the adhesive layer 2131 to protect and encapsulate the surface of the cured adhesive layer 2122 facing the pressing head 211 and the side adjacent to the surface of the cured adhesive layer 2122 facing the pressing head 211.

[0090] It should be noted that the adhesive layer 2131 can be in a solid gel state at room temperature, meaning it is tacky at room temperature. Therefore, at room temperature, the adhesive layer 2131 can be used to bond the cured adhesive layer 2122 to the buffer layer 2121. During this bonding process, the adhesive layer 2131's tackiness can decrease or even disappear after melting, making the melted portion of the adhesive layer 2131 easily detach from the buffer layer 2121. This detachment of the adhesive layer 2131 can then cause the cured adhesive layer 2122 to detach as well.

[0091] In at least one embodiment of this application, the melting point of the adhesive layer 2131 is lower than the softening temperature or melting point of the cured adhesive layer 2122. Thus, the adhesive layer 2131 can melt before the cured adhesive layer 2122 softens or melts, allowing the cured adhesive layer 2122 to detach from the buffer layer 2121 before softening or melting. After the temperature decreases, the cured adhesive layer 2122 can also preferentially return to a cured state compared to the adhesive layer 2131. During the separation of the pressing head 211 from the support member 220, the softened or melted portions of the cured adhesive layer 2122 can all remain on the bonding portion A, and the melted portions of the adhesive layer 2131 can all remain on the bonding portion A (see reference). Figure 12 and Figure 13 The melted portion of the adhesive layer 2131 can be partially retained on the bonding portion A and partially retained on the buffer layer 2121 (see reference). Figure 14 ).

[0092] In at least one embodiment of this application, the melting point of the adhesive layer 2131 is in the range of 50°C to 70°C. Thus, during the process of heating the pressure head by the heating element (ultimately heating it to the pressure temperature), the adhesive layer 2131 can quickly melt and separate from the buffer layer 2121.

[0093] It should be noted that the combination of the technical features in this application is not limited to the combination methods described in the claims of this application or the combination methods described in the specific embodiments. All technical features described in this application can be freely combined or combined in any way, unless they contradict each other.

[0094] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A pressure buffer structure, characterized in that, include: A buffer layer is provided to provide a contact surface that comes into contact with the pressure head; as well as A curing adhesive layer is stacked on top of the buffer layer and is separable, wherein the curing adhesive layer is used to provide a contact surface with the part to be bonded; An adhesive layer is located between the buffer layer and the cured adhesive layer, and the adhesive layer bonds the cured adhesive layer to the buffer layer; the melting point of the adhesive layer is lower than the pressure temperature used when the pressure head presses the part to be bonded, the softening temperature of the cured adhesive layer is lower than the pressure temperature used when the pressure head presses the part to be bonded, and the melting point of the adhesive layer is lower than the softening temperature or melting point of the cured adhesive layer.

2. The pressure buffer structure according to claim 1, characterized in that, The material of the cured adhesive layer includes ultraviolet-curable adhesive.

3. The pressure buffer structure according to claim 1, characterized in that, The adhesive layer is made of paraffin wax.

4. The pressure buffer structure according to any one of claims 1 to 3, characterized in that, The adhesion between the cured adhesive layer and the buffer layer is not greater than the adhesion between the cured adhesive layer and the part to be bonded.

5. A method for fabricating a touch display module using the pressure buffer structure as described in any one of claims 1 to 4, characterized in that, include: Provided for bonding; The pressure head is used to apply pressure to the side of the buffer layer in the pressure buffer structure that is away from the cured adhesive layer, so that the cured adhesive layer is detached and covers the part to be bonded.

6. The method according to claim 5, characterized in that, The softening temperature of the cured adhesive layer is lower than the pressure temperature used when the pressure head presses the part to be bonded, wherein applying pressure to the side of the buffer layer in the pressure buffer structure as described in any one of claims 1 to 4 using the pressure head to cause the cured adhesive layer to detach and cover the part to be bonded includes: The pressure head is used to apply pressure to the side of the buffer layer in the pressure buffer structure that is away from the cured adhesive layer, so that the cured adhesive layer softens or melts at the pressure temperature and falls off to cover the part to be bonded.

7. The method according to claim 6, characterized in that, The softening temperature ranges from 60°C to 160°C.

8. The method according to claim 6, characterized in that, The temperature range of the pressure is 110℃ ~ 230℃.

9. The method according to claim 5, characterized in that, The orthographic projection of the detached portion of the cured adhesive layer on the pressing head coincides with the orthographic projection of the part to be bonded on the pressing head.

10. The method according to claim 5, characterized in that, The portion of the cured adhesive layer that has detached covers the surface of the part to be bonded facing the pressing head; or The portion of the cured adhesive layer that has detached covers the surface of the part to be bonded facing the pressing head, and also covers the side adjacent to the surface of the part to be bonded facing the pressing head.

11. The method according to claim 5, characterized in that, in, The method of applying pressure to the side of the buffer layer in the pressure buffer structure as described in any one of claims 1 to 4, using the pressure head, to cause the cured adhesive layer to detach and cover the part to be bonded, includes: The pressure head is used to apply pressure to the side of the buffer layer in the pressure buffer structure that is away from the cured adhesive layer, so that the adhesive layer in the pressure buffer structure can be used to detach the cured adhesive layer and cover the part to be bonded.

12. The method according to claim 11, characterized in that, The melting point of the adhesive layer is lower than the pressure temperature used when the pressure head presses the part to be bonded, wherein applying pressure to the side of the buffer layer in the pressure buffer structure away from the cured adhesive layer using the pressure head, so as to use the adhesive layer in the pressure buffer structure to cause the cured adhesive layer to detach and cover the part to be bonded, includes: The pressure head is used to apply pressure to the side of the buffer layer in the pressure buffer structure that is away from the cured adhesive layer, so that the adhesive layer in the pressure buffer structure melts and causes the cured adhesive layer to fall off together and cover the part to be bonded.

13. The method according to claim 12, characterized in that, The melting point of the adhesive layer is in the range of 50℃ to 70℃.

Images