electronic control device

Abstract

An electronic control device is fixed to a vehicle-mounted device as a control target, and is a unit including a base mounted to the vehicle-mounted device, a housing fixed to the base, a circuit board held in the housing, and electronic parts mounted to the circuit board. At least one of the housing and the base is made of resin. The housing and the base are fixed by a plurality of fixing screws, and are fixed by an adhesive disposed away from the plurality of fixing screws.

Description

Technical Field

[0001] This invention relates to an electronic control device that is fixedly installed in vehicle equipment such as transmissions and engines. Background Technology

[0002] In electronic control devices that control vehicle-mounted equipment such as transmissions, engines, brakes, and motors, the substrates of electronic components are typically held in place by metal (alloy) housings (see Patent Document 1). Existing technical documents Patent documents

[0003] Patent Document 1: Japanese Patent No. 6636363 Summary of the Invention The problem the invention aims to solve

[0004] In recent years, the number of electronic control devices installed in vehicles has been gradually increasing. Driven by the goal of minimizing the connection cables to onboard equipment, the integration of onboard electronic control devices with onboard equipment (mechatronics) is progressing. This includes the integration of the engine and electronic control devices, and the integration of the transmission and electronic control devices. However, the surface temperature of onboard equipment such as transmissions can reach approximately 130-140°C during operation. In structures that integrate such high-temperature onboard equipment with electronic control devices, heat transfer from the onboard equipment to the electronic components within the electronic control device is significant. When the electronic control device is operational, there is a risk that the electronic components may exceed their heat resistance temperature and overheat. Therefore, it is being considered to change the material of the housing supporting the substrate of the electronic control device to resin to suppress heat transfer from the onboard equipment to the electronic components.

[0005] On the other hand, if an electronic control unit is installed on the vehicle-mounted equipment, the mechanical vibration of the vehicle-mounted equipment will be directly transmitted to the electronic control unit. If the housing of the electronic control unit is changed to a resin material with lower strength than metal, from the point of view of vibration resistance, the housing must be fixed to the body of the vehicle-mounted equipment with a sufficient number of screws.

[0006] However, manufacturing errors in the casing are difficult to completely eliminate. If a resin casing with manufacturing errors is screwed in a large number of locations, deformation will occur. As a result, the circuit board fixed inside the casing deforms, thereby placing a load on the solder joints connecting the circuit board to the electronic components mounted on it, leading to a reduction in the lifespan of the solder joints. From the viewpoint of suppressing the load placed on the solder joints, it is practically difficult to increase the number of screw-in points on the casing of the electronic control device.

[0007] The purpose of this invention is to provide an electronic control device that can balance vibration resistance and the lifespan of welded parts of electronic components. Technical means to solve the problem

[0008] To achieve the above objectives, the present invention provides an electronic control device fixed to an in-vehicle device that is controlled. The electronic control device is a unit comprising the following components: a base mounted on the in-vehicle device; a housing fixed to the base; a circuit board held in the housing; and electronic components mounted on the circuit board. At least one of the housing and the base is made of resin. The housing and the base are fixed by a plurality of fixing screws and fixed to the housing and the base by an adhesive disposed away from the plurality of fixing screws. The effects of the invention

[0009] According to the present invention, it is possible to balance the vibration resistance of the electronic control device with the lifespan of the welded parts of the electronic components. Attached Figure Description

[0010] Figure 1 A perspective view of a vehicle-mounted device equipped with the electronic control device of the present invention is shown schematically. Figure 2 To cut Figure 1 An exploded perspective view of the electronic control unit mounted on the body of the vehicle-mounted equipment, shown from a downward angle from the inside of the body. Figure 3 This is a perspective view of the electronic control device according to the first embodiment of the present invention. Figure 4 This is an exploded perspective view of the electronic control device according to the first embodiment of the present invention. Figure 5 This is a top view of the electronic control device according to the first embodiment of the present invention. Figure 6 for Figure 5 A cross-sectional view of the electronic control device for the VI-VI line. Figure 7 This is an exploded perspective view of the electronic control device according to the second embodiment of the present invention, and corresponds to the first embodiment. Figure 4 The image. Figure 8 This is a top view of the base provided in the electronic control device according to the second embodiment of the present invention. Figure 9 A graph showing the relationship between the Young's modulus of the adhesive used in the electronic control device of the third embodiment of the present invention and its vibration resistance and solder life. Figure 10 This is a cross-sectional view of the electronic control device according to the fourth embodiment of the present invention, and corresponds to the first embodiment. Figure 6 The image. Figure 11This is an exploded perspective view of the electronic control device according to the fifth embodiment of the present invention, and corresponds to the first embodiment. Figure 4 The image. Figure 12 This is an exploded perspective view of the electronic control device according to the sixth embodiment of the present invention, and corresponds to the first embodiment. Figure 4 The image. Figure 13 This is a cross-sectional view of the electronic control device according to the sixth embodiment of the present invention, and corresponds to the first embodiment. Figure 6 The image. Figure 14 This is an exploded perspective view of the electronic control device according to the seventh embodiment of the present invention, and corresponds to the first embodiment. Figure 4 The image. Figure 15 This is an exploded perspective view of the electronic control device according to the eighth embodiment of the present invention, and corresponds to the first embodiment. Figure 4 The image. Figure 16 This is a top view of the electronic control device according to the eighth embodiment of the present invention, and corresponds to the first embodiment. Figure 5 The image. Figure 17 for Figure 16 A cross-sectional view of the electronic control unit on the XVII-XVII line. Figure 18 This is an exploded perspective view of the electronic control device according to the ninth embodiment of the present invention, and corresponds to the first embodiment. Figure 4 The image. Figure 19 This is a top view of the electronic control device according to the ninth embodiment of the present invention, and corresponds to the first embodiment. Figure 5 The image. Figure 20 for Figure 19 Cross-sectional view of the electronic control device for the XX-XX line. Figure 21 This is an exploded perspective view of the electronic control device according to the tenth embodiment of the present invention, and corresponds to the first embodiment. Figure 4 The image. Figure 22 This is a cross-sectional view of the electronic control device according to the tenth embodiment of the present invention, and corresponds to the ninth embodiment. Figure 20 The image. Figure 23 This is an exploded perspective view of the electronic control device according to the 11th embodiment of the present invention, and corresponds to the 1st embodiment. Figure 4 The image. Figure 24This is a cross-sectional view of the electronic control device according to the 11th embodiment of the present invention, and corresponds to the 1st embodiment. Figure 6 The image. Figure 25 This is an exploded perspective view of the electronic control device according to the 12th embodiment of the present invention, and corresponds to the 1st embodiment. Figure 4 The image. Figure 26 An exploded perspective view of the electronic control device for comparison. Detailed Implementation

[0011] The electronic control devices illustrated in this application specification are, for example, devices that output command signals to actuators (e.g., solenoid valves) of the vehicle-mounted equipment being controlled, based on signals from sensors or input signals from other control devices. The electronic control devices of each embodiment are fixedly mounted on the body of the vehicle-mounted equipment being controlled. Vehicle-mounted equipment is equipment installed in passenger cars or other vehicles, such as transmissions, engines, brakes, motors, etc. Hereinafter, embodiments of the present invention will be described using the accompanying drawings. In each embodiment, the same or corresponding elements are referred to by the same reference numerals, and repeated descriptions are omitted as appropriate.

[0012] (First Embodiment) -Vehicle-mounted equipment- Figure 1 This figure shows a perspective view of a vehicle-mounted device equipped with the electronic control device of the present invention. The vehicle-mounted device 100 shown is, for example, a transmission that transmits power from an engine or other power source to the drive shaft by changing torque, speed, and direction of rotation. The vehicle-mounted device 100 comprises a mechanism (not shown) and a body 101. The mechanism is composed of gears, shafts, etc., and the body 101 is the outer frame that houses the mechanism. A reservoir for lubricating oil for lubricating the mechanism is built into the body 101. An electronic control device 1 is fixedly mounted on the body 101 of the vehicle-mounted device 100. In this example, the electronic control device 1 is, for example, a TCU (Transmission Control Unit). Thus, the vehicle-mounted device 100 and the electronic control device 1 form a single unit, achieving mechatronics integration. The vehicle-mounted device 100 and the electronic control device 1 are, for example, located inside the engine compartment (not shown) of a vehicle.

[0013] Figure 2 This is an exploded perspective view showing the mounting portion of the electronic control device 1 on the body 101 of the vehicle-mounted equipment 100, viewed from below from the inside of the body 101. (See attached image.) Figure 2As shown, an opening 102 is formed in the mounting portion of the electronic control device 1 on the body 101 of the vehicle-mounted device 100. A connector 103 at the tip of a cable extending from the actuator (not shown) of the vehicle-mounted device 100 faces the opening 102. The shape of the opening 102 is not particularly limited; in this example, the opening 102 is rectangular. The connector 103 extends from the body 101 of the vehicle-mounted device 100 through the opening 102 and connects to the connector 41 (described later) of the electronic control device 1, thus sealing the opening 102 and mounting the electronic control device 1 within the body 101. The electronic control device 1 is fixed to the body 101 of the vehicle-mounted device 100 by a plurality of mounting screws (not shown). The electronic control device 1 also serves as a cover sealing the opening 102 of the body 101. The electronic control device 1 and the actuator of the vehicle-mounted device 100 are electrically connected via connectors 41 and 103, transmitting electrical signals between them. By integrating the electronic control unit 1 with the vehicle-mounted equipment 100, the length of the cable connecting the electronic control unit 1 and the vehicle-mounted equipment 100 is reduced. Since the connecting cable between the vehicle-mounted equipment 100 and the electronic control unit 1 does not protrude from the vehicle-mounted equipment 100, there is no need to run and arrange the cable connecting the vehicle-mounted equipment 100 and the electronic control unit 1 inside the vehicle.

[0014] -Electronic control device- Figure 3 This is a perspective view of the electronic control device according to the first embodiment of the present invention. Figure 4 Decompose its 3D diagram. Figure 5 This is a top view. Figure 6 for Figure 5 Cross-sectional views of the electronic control unit for the VI-VI line. The electronic control unit 1 shown in these figures is fixed to the vehicle-mounted equipment 100, which is the object of control. Figure 1 The unit comprises a base 10, a housing 20, a circuit board 30, electronic components 40, and an adhesive 50.

[0015] ·base The base 10 is the base structure of the electronic control device 1, and is fixedly mounted to the body 101 of the vehicle-mounted equipment 100 by a plurality of mounting screws (not shown). For example, a rubber gasket (not shown) is provided between the base 10 and the body 101 to improve the waterproof and airtightness between the base 10 and the body 101. In the first to twelfth embodiments, the base 10 is made of metal, but it may also be made of resin.

[0016] like Figure 4 As shown, the base 10 is equipped with a plate 11, screw bases 12-16, connector holes 17, and adhesive bases 18. The plate 11 forms the main body of the base 10 and also serves as the opening 102 for the body 101 of the vehicle-mounted equipment 100. Figure 2The cover is plugged in. On the plate 11, at appropriate positions on the edge, there are multiple through holes (not shown) through which the aforementioned mounting screws (not shown) for mounting the electronic control device 1 on the body 101 of the vehicle-mounted equipment 100 pass. Multiple screw bases 12-16 protrude upwards from the plate 11 in a layout corresponding to the shape of the housing 20 (five in this example). The upper end face of each screw base 12-16 is provided as a smooth seat surface for the housing 20 to rest on, such as... Figure 4 As shown, each of the base surfaces is equipped with a screw hole H1. A fixing screw S1 is screwed into the screw hole H1.

[0017] To facilitate the shape and fit between the electronic control device 1 and the vehicle-mounted equipment 100, the area A (defined by the screw holes H1 of the screw bases 12-16 or the fixing screws S1) is defined as follows: Figure 5 From an overhead view (along) Figure 4 (Viewed downwards along the Z-axis) its dimensions along the X-axis and Y-axis are different. That is to say, region A has a longer side (...). Figure 4 (X-axis direction) and short side direction ( Figure 4 (in the Y-axis direction). Furthermore, the spacing of the fixing screws S1 (described later) is also unequal; the maximum spacing X1 of the screw holes H1 or fixing screws S1 along the long side is larger than the maximum spacing Y1 of the screw holes H1 or fixing screws S1 along the short side (X1 > Y1). In this embodiment, region A is a pentagonal region with each screw hole H1 (fixing screw S1) of the screw bases 12-16 as its vertex. Figure 5 ).

[0018] Furthermore, the base 10 is equipped with a seat surface 19 facing the housing 20 with a gap within the area enclosed by a plurality of fixing screws S1 (i.e., the aforementioned area A). Specifically, the aforementioned adhesive base 18 is located in area A in plan view, protruding from the side of plate 11 toward the housing 20. The facing end face of the adhesive base 18 toward the housing 20 (in this example, the upper surface facing the Z-axis direction) is the seat surface 19, and the Z-axis dimension of the adhesive base 18 is set in such a way that a small gap is maintained between the seat surface 19 and the housing 20. In this embodiment, there is only one adhesive base 18 and one seat surface 19 in one electronic control device 1.

[0019] Furthermore, connector hole 17 is an opening through which connector 41 (described later) passes, arranged in a way that falls within region A when viewed from above. In this embodiment, connector hole 17 is located in the X-axis direction on the side opposite to electronic component 40, across the seat surface 19 of adhesive base 18. Figure 6 (Right side). A sealing member P1 is interposed between connector 41 and connector hole 17. Figure 6 This improves the waterproof and airtightness between connector 41 and connector hole 17. The sealing member P1 is, for example, a rubber gasket.

[0020] ·shell The outer casing 20 is a component that houses the circuit board 30 and electronic components 40, and is fixed to the base 10. The outer casing 20 and the base 10 are fixed by multiple (five in this embodiment) fixing screws S1. In the first to the twelfth embodiments, the outer casing 20 is made of resin, but sometimes the outer casing 20 is made of metal when the base 10 is made of resin.

[0021] like Figure 4 As shown, the housing 20 is equipped with a main body 21, brackets 22-26, and connector holes 27. The main body 21 of the housing 20 is a thin, dish-shaped member that houses and holds the circuit board 30 and electronic components 40. The brackets 22-26 protrude from the outer periphery of the main body 21 of the housing 20, corresponding to the screw bases 12-16. The housing 20 is fixed to the base 10 by inserting the fixing screw S1 into the retaining ring of the bracket 22-26 and screwing it into the screw hole H1 of the screw base 12-16.

[0022] The main body 21 of the outer casing 20 is equipped with multiple (four in this example) screw holes H2 into which the substrate fixing screws, i.e., substrate screws S2, for fixing the circuit board 30 are screwed. The screw holes H2 into which the substrate screws S2 are screwed are arranged to surround the electronic component 40 in a top view, so that the electronic component 40 falls within the area B (a quadrilateral area with each substrate screw S2 as its vertex) enclosed by the substrate screws S2 in a top view.

[0023] Connector hole 27 is an opening through which connector 41 (described later) passes. Viewed from above, it falls within region A, while avoiding region B. Its position relative to region B is in the X-axis direction. Figure 6 (Offset to the right in the image). The connector hole 27 overlaps with the connector hole 17 of the base 10 when viewed from above. A sealing member P2 exists between the connector 41 and the connector hole 27, improving the waterproof and airtightness between them. The sealing member P2 is, for example, an adhesive.

[0024] Circuit board / electronic components The circuit board 30 is held within the housing 20. Electronic components 40 and connectors 41 are mounted on the circuit board 30. The circuit board 30 is secured within the housing 20 by inserting board screws S2 into the board 30 and screwing them into the screw holes H2 of the housing 20. Electronic components 40 are mounted on the circuit board 30. In this embodiment, the electronic components 40 include QFN (Quadflat no lead package) 40a and BGA (Ball grid array) packages 40b. Although not shown, the electronic components 40 mounted on the circuit board 30 may include at least one other electronic component besides these QFN packages 40a and BGA packages 40b. As described above, the electronic components 40 (including QFN packages 40a and BGA packages 40b) are arranged to fall within the area B enclosed by the board screws S2 in top view, and the connectors 41 are positioned away from area B.

[0025] Connector 41 and connector 103 at the tip of the cable extending from the actuator (not shown) of the vehicle-mounted device 100. Figure 2 The circuit formed on the circuit board 30 is connected to the vehicle-mounted equipment 100.

[0026] The circuit board 30, electronic components 40, and connector 41 are covered by a metal cover 42. The cover 42 is mounted on the housing 20 with multiple (three in this example) cover screws S3. A sealing member P3 exists between the cover 42 and the housing 20, improving the waterproof and airtightness between them. The sealing member P3 is, for example, an adhesive. Furthermore, the cover 42 is separated by a heat-transfer material 43 (… Figure 4 , Figure 6 The heat transfer material 43 is in contact with the electronic component 40. The heat transfer material 43 is, for example, grease. Heat from the electronic component 40 is transferred via the heat transfer material 43 to the metal cover 42 and dissipated from the cover 42, thereby suppressing the temperature rise of the electronic component 40. In this embodiment, for the same purpose, the circuit board 30 is also in partial contact with the cover 42 via the heat transfer material 43 (see also...). Figure 20 ).

[0027] Adhesive The adhesive 50, for example, is different from the adhesive used for sealing components P2 and P3; it is a component used to improve the vibration resistance of the electronic control device 1. Therefore, the adhesive 50 is not in a ring shape around the openings (connector holes 17 and 27) as in the sealing components P2 and P3, but in this embodiment, it is applied as a solid dot with a certain area. In this embodiment, the material of the adhesive 50 is the same as the material of the adhesive used for the sealing components P2 and P3.

[0028] Adhesive 50 fills the gap g between the smooth seat surface 19 of the adhesive base 18 of the base 10 and the smooth lower surface (partial) of the housing 20. Figure 6 The outer casing 20 and the base 10 are bonded together to fix them together. In this embodiment, the adhesive 50 is disposed away from each fixing screw S1. The adhesive 50 is disposed only at one location. Specifically, the adhesive 50 is disposed in the area A (defined by each fixing screw S1) as shown in top view. Figure 5 Within. Especially in this embodiment, the adhesive 50 is disposed at the center of the long side of region A. In this embodiment, a representative specific example of the center of the long side of region A is... Figure 5 The diagram shows the midpoint of two fixing screws S1 with a maximum spacing X1 between them along the X-axis. For the vibration of the circuit board 30, with the position of the two fixing screws S1 with a maximum spacing X1 as the node, this position corresponds to the belly of the amplitude. Furthermore, in the short side direction (Y-axis direction) of region A, adhesive 50 is also disposed at the midpoint of the two fixing screws S1 with a maximum spacing Y1. For the vibration of the circuit board 30, with the two fixing screws S1 with a maximum spacing Y1 as the node, this position corresponds to the belly of the amplitude.

[0029] -Comparative Examples- Figure 26 The exploded perspective view of the electronic control device for comparison corresponds to... Figure 4 The figure shows an electronic control device that is a hypothetical configuration example for comparison with the electronic control device 1 of the first embodiment, which is equivalent to omitting the adhesive base 18 (including the seat surface 19) and adhesive 50 from the electronic control device 1.

[0030] When the electronic control unit is installed in the vehicle-mounted equipment 100, it may be subjected to large vibrations. To prevent damage to the resin housing a, which has lower rigidity than metal, using five fixing screws s for fixation may not provide sufficient vibration resistance. Increasing the number of fixing screws s to secure the housing a ensures sufficient vibration resistance for the housing a.

[0031] However, considering the manufacturing errors of the base b and the outer shell a, it is not easy to manufacture the outer shell a and the base 10 so that all five brackets c are evenly seated on the screw bases d when the outer shell 20 is placed on the base 10. If the number of fixing screws s is increased, the number of sets of brackets c and screw bases d increases accordingly, making it even more difficult to manufacture the outer shell a and the base b so that all brackets c are evenly seated on the screw bases d. When the fixing screws s are used to lock the brackets c and screw bases d with a gap between them, the resin outer shell a deforms, and the circuit board e fixed in the outer shell a also deforms accordingly. As a result, stress is applied to the solder joint between the circuit board e and the electronic component f mounted on it, which makes the solder joint prone to breakage due to the repeated temperature changes that occur with the operation of the vehicle equipment 100. Therefore, considering the load applied to the solder joint of the electronic component f, increasing the number of fixing screws s also has disadvantages.

[0032] -Effect- (1) According to this embodiment, the outer shell 20 of the circuit board 30 is made of resin, thereby suppressing heat transfer from the vehicle device 100 to the circuit board 30 and suppressing heat transfer to the electronic components 40 mounted on the circuit board 30.

[0033] Furthermore, the housing 20 and the base 10 are secured with multiple fixing screws S1, and the housing 20 and the base 10 are further secured with adhesive 50 at positions away from each fixing screw S1. Thus, by using adhesive 50 to bind the portion of the housing 20 that is prone to vibration due to the distance from the fixing screws S1 to the base 10, [the system] achieves [a certain level of stability / preservation]. Figure 26 In the comparative example, the same number of fixing screws S1 can also effectively reduce vibration of the housing 20 and improve the vibration resistance of the electronic control device 1.

[0034] Furthermore, the thickness of the adhesive 50 before curing can be flexibly varied. Therefore, even if the size (the dimension in the Z-axis direction) of the gap g between the housing 20 and the base 10 deviates, the adhesive 50 can absorb the deviation in the size of the gap g during the assembly of the electronic control device 1. The adhesive 50 is cured after filling the gap g by changing the thickness according to the manufacturing errors of the housing 20 and the base 10. Therefore, there is no situation where the housing 20 is deformed due to bonding with the base 10 using the adhesive 50, and the load applied to the soldered parts of the electronic component 40 under static conditions is also suppressed.

[0035] As described above, the electronic control device 1 according to this embodiment can balance vibration resistance and the lifespan of the welded parts of the electronic components 40. Furthermore, since damage to the housing 20 can be prevented, high reliability of the electronic control device 1 can be ensured even when it is designed as an electromechanical integrated structure with the vehicle-mounted equipment 100.

[0036] The inventors of this application analyzed the vibration resistance and solder life of each electronic control device of this embodiment and comparative examples, and the results confirmed that, compared with the comparative example without adhesive 50, the electronic control device 1 of this embodiment improved the vibration resistance without sacrificing solder life.

[0037] (2) Since the desired vibration resistance can be ensured while suppressing the number of fixing screws S1, the number of fixing screws is naturally suppressed compared to increasing the number of fixing screws to ensure vibration resistance. The number of required parts, such as the retaining ring, accompanying the fixing screws is also suppressed. Thus, the number of parts is suppressed, thereby improving manufacturing ease, which is also an advantage. Furthermore, since the number of fixing screws S1 is suppressed, the manufacturing precision required for the base 10 and housing 20 during assembly is relaxed, which can also be listed as an advantage related to manufacturing ease.

[0038] (3) In this embodiment, the adhesive 50 is disposed within region A, which is surrounded by the fixing screws S1, when viewed from above. This ensures the distance between each fixing screw S1 and the adhesive 50 in the XY plane. Therefore, the vibration reduction effect provided by the adhesive 50 can be effectively obtained. In particular, in this embodiment, the adhesive 50 is disposed at the center of the long side of region A. This allows the adhesive 50 to restrain the amplitude that might occur in the housing 20 without the adhesive 50, thereby achieving a highly efficient vibration reduction effect. In this embodiment, the adhesive 50 is also located at the center of the short side of region A, so the same effect of vibration reduction in the short side direction is also achieved.

[0039] (4) Furthermore, the base 10, which also serves as a cover to block the opening 102 of the vehicle-mounted equipment 100, is included in the constituent elements of the electronic control device 1. As a result, the design freedom of the base 10 and the housing 20 is increased compared to the case where the housing 20 is designed based on the existing opening cover of the vehicle-mounted equipment. As a result, the binding part formed by the adhesive 50 between the base 10 and the housing 20 can be properly set, which is also a great advantage in the manufacture of the electronic control device 1.

[0040] (5) The electronic control device 1 is a novel structure in which the base 10 has a seat surface 19 in the aforementioned region A, and an adhesive 50 is filled in the gap g between the seat surface 19 and the outer shell 20. Due to the increased design freedom of the base 10 and the outer shell 20, such a novel structure can also be easily manufactured.

[0041] (6) By making adhesive 50 compatible with other adhesives used in sealing components P2 and P3, the number of parts in the electronic control device 1 can be reduced, thereby contributing to improved ease of manufacture and lower cost. However, in achieving the above effect (1), adhesive 50 may also be different from other adhesives used in sealing components P2 and P3.

[0042] (Second Implementation) Figure 7 This is an exploded perspective view of the electronic control device according to the second embodiment of the present invention, corresponding to the first embodiment. Figure 4 . Figure 8 for Figure 7 A top view of the base equipped in the electronic control device shown.

[0043] The difference between this embodiment and the first embodiment is that the adhesive 50 extends linearly along the short side direction (Y-axis direction) of the aforementioned region A. In this embodiment, the region A enclosed by each fixing screw S1 also has a long side direction (X-axis direction) and a short side direction (Y-axis direction). Since the adhesive 50 is configured to extend along the short side direction of region A, the adhesive base 18 also extends along the short side direction (Y-axis direction) of region A, following the shape of the adhesive 50. In this embodiment, the dimension of the adhesive 50 in the Y-axis direction is half or slightly longer than the maximum spacing Y1 of the fixing screws S1 in the Y-axis direction, but it may also be shorter than the maximum spacing Y1. Although the adhesive 50 extends along the short side direction of region A, it is located at the center of region A in this direction (the central position of the adhesive 50 in the short side direction coincides with the central position of region A). In the long side direction of region A, the position of the adhesive 50 is the same as in the first embodiment; in this embodiment, the adhesive 50 is also located at the center of the long side direction of region A. Only this one location contains adhesive 50.

[0044] In the electronic control device 1 of this embodiment, the other configurations are the same as those of the electronic control device 1 of the first embodiment.

[0045] In this embodiment, instead of using the fixing screw S1, the outer shell 20 is bound to the base 10 with adhesive 50, thereby achieving the same effect as in the first embodiment.

[0046] Furthermore, if adhesive 50 is omitted, such as Figure 8As shown, when vibration occurs, the outer casing 20 is likely to experience maximum vibration in the region A1, which extends in a band along the Y-axis direction from the center of the X-axis, within the area enclosed by the four fixing screws S1 forming the maximum spacing X1 and Y1. This region becomes the belly of the amplitude in the X-axis direction. In contrast, the vibration of the outer casing 20 is smaller in the two regions A3, which extend in a band along the Y-axis direction at both ends of the X-axis direction, near the nodes of the amplitude. In the band-shaped region A2 between regions A1 and A3, the magnitude of the vibration of the outer casing 20 is moderate. In this embodiment, since the adhesive 50 extends along the band-shaped region A1 where the maximum vibration is likely to occur, it can bind the region A1 of the outer casing 20 over a larger range than in the first embodiment. According to the analysis of the inventors of this application, it has been confirmed that the vibration resistance of this embodiment is higher than that of the first embodiment.

[0047] Furthermore, when the adhesive 50 is extended in the same linear shape but along the long side of region A, no significant improvement in effect is seen compared to the first embodiment, thus confirming the advantage of the configuration of extending the adhesive 50 along the short side of region A.

[0048] (Third Implementation) The difference between this embodiment and the first embodiment is that the Young's modulus of the adhesive 50 is 1 MPa or higher. The Young's modulus referred to here is the Young's modulus of the cured adhesive 50. Other components are the same as in the first embodiment.

[0049] Figure 9 This is a graph showing the relationship between the Young's modulus of the adhesive used in the electronic control device according to the third embodiment of the present invention and its vibration resistance and solder life. Regarding vibration resistance, as an example, it is evaluated by the maximum vibration acceleration G that allows the electronic control device 1 to operate normally when it vibrates. Regarding solder life, as an example, it is evaluated by the number of repetitions N of the electronic control device 1 being exposed to a hypothetical temperature change during operation of the vehicle-mounted device 100, using this number as a parameter, from the installation of the electronic control device 1 to the point where the soldered portion of the electronic component 40 breaks.

[0050] The inventors of this application analyzed the vibration resistance and solder life using the Young's modulus of adhesive 50 as a parameter. The results showed that vibration resistance improved with increasing Young's modulus of adhesive 50. However, when the Young's modulus exceeded 1 MPa, the rate of increase in vibration resistance with increasing Young's modulus of adhesive 50 plateaued.

[0051] Regarding solder life, it was confirmed that even if the Young's modulus of adhesive 50 changes, the solder life does not change significantly, and even if the Young's modulus is set to 1 MPa or more, the same solder life as in the first embodiment can be ensured.

[0052] Therefore, by setting the Young's modulus of adhesive 50 to 1 MPa or higher, this structure can effectively utilize the vibration resistance of electronic control device 1 without sacrificing solder life, thus achieving both high-level vibration resistance and solder life.

[0053] Furthermore, this embodiment describes an example in which the Young's modulus of the adhesive 50 is set to 1 MPa or more in the configuration of the first embodiment. In the second embodiment or the embodiments described below, it is also effective to set the Young's modulus of the adhesive 50 to 1 MPa or more.

[0054] (Fourth implementation) Figure 10 This is a cross-sectional view of the electronic control device according to the fourth embodiment of the present invention, corresponding to the first embodiment. Figure 6 .

[0055] The difference between this embodiment and the first embodiment is that the adhesive 50 is arranged in a manner that does not overlap with at least the QFN package 40a in the electronic component 40 when viewed from above. That is, all QFN packages 40a and all adhesive 50 are configured not to overlap in the Z-axis direction, and the layout of the adhesive 50 is completely offset from the upper and lower regions Ra of the QFN package 40a in the XY plane direction.

[0056] In this embodiment, the base 10 and the housing 20 are connected via adhesive 50, so the possibility that heat transfer from the base 10 causes the adhesive 50 to expand and exert a load on the housing 20 is also considered. In this case, in the case of electronic components such as QFP (Quad Flat Package), even if a load is applied to the soldered portion via the housing 20 and the circuit board 30, the deformation can be absorbed to some extent by the wires protruding to its outer periphery. In contrast, the QFN package 40a has a structure with electrode plates provided on the surface and no wires protruding, so its deformation tolerance is smaller than that of QFPs, and its soldered portion is not resistant to load.

[0057] Therefore, in this embodiment, all QFN packages 40a and all adhesives 50 are designed not to overlap in the Z-axis direction, ensuring the distance between the adhesives 50 and the housing 20 and the circuit board 30 up to the QFN package 40a. Thus, even if the adhesives 50 expand, deformation transmitted to the QFN package 40a via the housing 20 and the circuit board 30 can be suppressed, thereby effectively protecting the QFN package 40a.

[0058] Furthermore, in the second, third, and subsequent embodiments, the configuration in which the adhesive 50 and the QFN package 40a are misaligned is also effective. Conversely, in the first embodiment, the adhesive 50 and the QFN package 40a are misaligned in the same way as in this embodiment, but in order to obtain the essential effect (1) described above, in the first embodiment, part or all of the adhesive 50 may overlap vertically with the QFN package 40a.

[0059] (Fifth Embodiment) Figure 11 This is an exploded perspective view of the electronic control device according to the fifth embodiment of the present invention, corresponding to the first embodiment. Figure 4 .

[0060] The difference between this embodiment and the second embodiment is that, along region A ( Figure 5 Multiple adhesives 50 are arranged along the long side of the container. Figure 11 The example shown depicts two adhesives 50A and 50B arranged along the X-axis and extending linearly along the Y-axis, but it can also be configured with three or more adhesives arranged in a single configuration. For example, Figure 11 The position of either adhesive 50A or 50B, or the position between adhesives 50A and 50B, corresponds to the second embodiment. Figure 7 The position of the adhesive 50.

[0061] In the electronic control device 1 of this embodiment, the other configurations are the same as those of the electronic control device 1 of the second embodiment.

[0062] According to this embodiment, by providing multiple adhesives 50, the binding force of the housing 20 on the base 10 is increased compared to the second embodiment, and the vibration resistance of the electronic control device 1 is further improved.

[0063] Furthermore, this embodiment describes an example in which multiple adhesives 50 are provided along the long side of region A in the configuration of the second embodiment. However, it is also effective to provide multiple adhesives 50 along the long side of region A in the first embodiment, the third embodiment, the fourth embodiment, and the embodiments described below.

[0064] (Sixth Embodiment) Figure 12 This is an exploded perspective view of the electronic control device according to the sixth embodiment of the present invention, corresponding to the first embodiment. Figure 4 . Figure 13 This is a cross-sectional view of the electronic control device according to the sixth embodiment of the present invention, corresponding to the first embodiment. Figure 6 .

[0065] In this embodiment, the distances between the plurality of adhesives 50A and 50B arranged along the long side of region A and the circuit board 30 are different. Among the adhesives 50A and 50B, the adhesive that overlaps with the BGA package 40b in a top view (in this example, the adhesive 50A located within the upper and lower regions Rb of the BGA package 40b) is farther from the circuit board 30 than the other adhesives (in this example, the adhesive 50B). In this embodiment, as... Figure 12 As shown, the bonding base 18 is stepped, and the adhesives 50A and 50B are arranged at different heights. When viewed from above, adhesive 50A overlaps with the BGA package 40b, and the distance i between adhesive 50A and the circuit board 30 is greater than the distance j between adhesive 50B and the circuit board 30.

[0066] The other configurations of the electronic control device 1 in this embodiment are the same as those in the fifth embodiment. Figure 11 The electronic control device 1 is the same as that of the other device.

[0067] The terminals of the BGA package 40b are hemispherical terminals arranged in a grid pattern on the bottom surface. Therefore, although the allowable deformation is stronger than that of the QFN package 40a, it is smaller than that of QFP, etc., and its soldered parts are not resistant to load.

[0068] Therefore, in this embodiment, the adhesive 50a that overlaps with the BGA package 40b is positioned further away from the circuit board 30 than other adhesives 50b, ensuring a sufficient distance between the adhesive 50 and the housing 20 and the circuit board 30 up to the BGA package 40b. Thus, even if the adhesive 50 expands, deformation transmitted to the BGA package 40b via the housing 20 and the circuit board 30 can be suppressed, effectively protecting the BGA package 40b.

[0069] Furthermore, the adhesives 50A and 50B can be configured as dots, as in the first or third embodiment, instead of extending along the shorter side of region A as in this embodiment. This embodiment and the fourth embodiment ( Figure 10 It can also be combined better. In addition, the configuration of setting multiple adhesives 50 at different heights along the long side of region A, and overlapping the BGA package 40b on the adhesive 50 farther away from the circuit board 30, is also effective in the various embodiments described below.

[0070] (Seventh Embodiment) Figure 14 This is an exploded perspective view of the electronic control device according to the seventh embodiment of the present invention, corresponding to the first embodiment. Figure 4 .

[0071] The difference between this embodiment and the first embodiment is that, along region A ( Figure 5 Multiple adhesives 50 are arranged along the short side direction of the [structure / organization]. In this embodiment, as shown... Figure 14 As shown, a plurality of (3) adhesive bases 18 are arranged along the short side of region A, and the seat surface 19 of all adhesive bases 18 is equidistant from the housing 20. Dotted adhesive is applied to the seat surface 19 of each adhesive base 18. Figure 14 The example shown depicts a configuration with three adhesives 50a-50c arranged in a dotted pattern along the Y-axis, but it can also be configured with two or four or more adhesives arranged in a similar pattern. For example, Figure 14 The position of the central adhesive 50b corresponds to that in the first embodiment ( Figure 4 The position of the adhesive 50.

[0072] In the electronic control device 1 of this embodiment, the other configurations are the same as those of the electronic control device 1 of the first embodiment.

[0073] According to this embodiment, by distributing multiple adhesives 50 along the short side of region A, the analysis results confirmed that the vibration resistance and solder life were the same as those in the second embodiment. Furthermore, compared to the second embodiment, the presence of adhesives 50 is intermittent in the Y-axis direction, thus suppressing the impact of adhesive expansion on the housing 20 compared to the second embodiment.

[0074] (Eighth Embodiment) Figure 15 This is an exploded perspective view of the electronic control device according to the eighth embodiment of the present invention, corresponding to the first embodiment. Figure 4 . Figure 16 This is a top view of the electronic control device according to the eighth embodiment of the present invention, corresponding to the first embodiment. Figure 5 . Figure 17 for Figure 16 A cross-sectional view of the electronic control unit on the XVII-XVII line.

[0075] In this embodiment, a configuration similar to that of the seventh embodiment, in which multiple adhesives 50 are arranged along the short side of region A, is assumed. In this embodiment, one of the base 10 and the outer casing 20 (in this example, the outer casing 20) is a resin part, and the other (in this example, the base 10) is a metal part. The adhesive located inside the short side (Y-axis direction) of region A (the central adhesive 50b) is located on the side of the resin part (upper side in the Z-axis direction) compared to the adhesives located outside the short side (the adhesives 50a and 50c at both ends). In this embodiment, as... Figure 15 As shown, multiple (3) adhesive bases 18 are arranged along the short side of region A. Figure 17As shown, the seat surface 19 of the central adhesive base 18 is located on the upper side of the Z-axis direction by a dimension r compared to the seat surfaces 19 of the adhesive bases 18 at both ends. The central adhesive 50b is closer to the circuit board 30 by a dimension r compared to the adhesives 50a and 50c at both ends. The adhesive 50b is located at the center of the maximum spacing X1 of the fixing screws S1 in the long side direction of region A, and at the center of the maximum spacing Y1 of the fixing screws S1 in the short side direction of region A.

[0076] Other configurations of the electronic control device 1 in this embodiment are the same as those in the fifth embodiment. Figure 11 The electronic control device 1 is the same as that of the other device.

[0077] The outer casing 20 primarily generates joint and web vibrations along the long side of region A, but joint and web vibrations may also occur in combination along the short side of region A. The latter type of vibration reaches its maximum at the center of the maximum spacing Y1 of the fixing screws S1 along the short side (the web of the vibration). In this embodiment, the base 10 is bonded to the outer casing 20 at this location using adhesive 50b.

[0078] Comparing the proportions of metal and resin in the Y-axis direction at each bonding site of adhesives 50a-50c, in terms of the proportion of metal as the material of the base 10, the proportion of metal in the central bonding site formed by adhesive 50b is larger than that in the bonding sites formed by other adhesives 50a and 50c. Figure 17 In other words, the proportion of resin in the outer casing 20 is larger at the bonding portions formed by adhesives 50a and 50c than at the bonding portion formed by adhesive 50b. With this configuration, for the central portion of the outer casing 20 in the short-side direction with large amplitude, the proportion of metal in the supporting structure can be increased, thus rigidly binding it. On the other hand, for the outer portion in the short-side direction with small amplitude, the transmission of stress generated by the expansion of adhesives 50a and 50c to the circuit board 30 can be suppressed by using a soft resin. Therefore, a better balance can be achieved between the vibration resistance and solder life of the electronic control device 1.

[0079] The inventors of this application, through analysis, found that when the proportion of metal material is consistently increased in all three bonding areas formed by adhesives 50a-50c, the result is improved vibration resistance but reduced solder life. Conversely, when the proportion of resin material is consistently increased in all three bonding areas, the result is extended solder life but reduced vibration resistance. Furthermore, compared with... Figure 17Conversely, if the proportion of resin material is relatively increased at the central bonding area and the proportion of metal material is relatively increased at the bonding areas at both ends, the effect on both vibration resistance and solder life is reduced. Therefore, it can be said that, considering vibration in the short-side direction, a configuration like this embodiment, in which the proportion of metal material at the central bonding area is relatively large and the proportion of resin material at the bonding areas at both ends is preferred.

[0080] (9th embodiment) Figure 18 This is an exploded perspective view of the electronic control device according to the ninth embodiment of the present invention, corresponding to the first embodiment. Figure 4 . Figure 19 This is a top view of the electronic control device according to the ninth embodiment of the present invention, corresponding to the first embodiment. Figure 5 . Figure 20 for Figure 19 Cross-sectional view of the electronic control device for the XX-XX line.

[0081] In this embodiment, the adhesive 50 extends linearly along the short side of region A, as in the second embodiment. The difference between this embodiment and the second embodiment is that it is configured such that, when viewed along the long side of region A (in... Figure 20 (Observed from below the cross-section) The adhesive 50 is wavy. In this embodiment, the seat surface 19 of the adhesive base 18 is shaped such that a smooth inclined surface sloping upwards towards the short side of region A and a smooth inclined surface sloping downwards are alternately connected in the short side direction of region A. Ideally, the areas of each upward inclined surface and each downward inclined surface are of the same degree, and the total area of ​​the upward inclined surfaces is of the same degree as the total area of ​​the downward inclined surfaces. Figure 20 As shown, when viewed from the long side of region A, the seat surface 19 has a wavy, broken line shape. The opposing surface on the outer shell 20 to the seat surface 19 also corresponds to the seat surface 19 and is wavy. Thus, the adhesive 50, which extends linearly along the short side of region A, is also present between the seat surface 19 and the outer shell 20 and is wavy.

[0082] Furthermore, the seat surface 19 can also be formed in a curved, wavy shape when viewed from the long side of region A.

[0083] Other configurations of the electronic control device 1 in this embodiment are the same as those in the second embodiment. Figure 7 The electronic control device 1 is the same as that of the other device.

[0084] In this embodiment, the stress acting along the normal direction of the seat surface 19 due to the expansion of the adhesive 50 has both Y-axis and Z-axis components due to the tilt of the seat surface 19. Regarding the Y-axis component, since the stress generated on the upward tilting surface has the opposite vector to the stress generated on the downward tilting surface, they cancel each other out. Therefore, the stress transmitted to the housing 20 due to the expansion of the adhesive 50 is only the Z-axis component, reducing the degree of the Y-axis component. By suppressing the stress transmitted to the housing 20 in this way, further improvements in vibration resistance and solder life can be expected according to this embodiment. In the analysis, even better results were confirmed in both vibration resistance and solder life.

[0085] (10th Embodiment) Figure 21 This is an exploded perspective view of the electronic control device according to the tenth embodiment of the present invention, corresponding to the first embodiment. Figure 4 . Figure 22 This is a cross-sectional view of the electronic control device according to the tenth embodiment of the present invention, corresponding to the ninth embodiment. Figure 20 .

[0086] In this embodiment, like the 7th embodiment ( Figure 14 ) like that along region A ( Figure 5 Multiple adhesives 50 (adhesives 50m, 50n) are arranged along the short side of region A. These adhesives 50m, 50n are configured such that, when viewed along the long side of region A (in... Figure 22 (Viewed from below the cross section) Image of Embodiment 9 Figure 20 It is wavy, as shown. In other words, this embodiment is equivalent to a configuration formed by intermittently removing the adhesive 50 of the 9th embodiment along the short side of region A. The rising and falling slopes must be present to the same degree. Otherwise, this embodiment is the same as the 9th embodiment.

[0087] This embodiment also achieves the same effect as the 9th embodiment. Furthermore, since the volume of the adhesive 50 is relatively small, the stress generated by the expansion of the adhesive 50 can be suppressed compared to the 9th embodiment.

[0088] (11th Embodiment) Figure 23 This is an exploded perspective view of the electronic control device according to the 11th embodiment of the present invention, corresponding to the 1st embodiment. Figure 4 . Figure 24 This is a cross-sectional view of the electronic control device according to the 11th embodiment of the present invention, corresponding to the first embodiment. Figure 6 .

[0089] As described in the first embodiment, the circuit board 30 is secured to the housing 20 by a plurality of board screws S2 (four in this example). In this embodiment, the adhesive 50 is configured not to overlap with the region B enclosed by these board screws S2 when viewed from above. The adhesive 50 is located between region B and connector 41, completely avoiding region B in the X-axis direction (i.e., the direction of the long side of region A).

[0090] Therefore, even if the adhesive 50 expands, it can suppress the stress generated from the expansion of the adhesive 50 from being transmitted to the electronic components 40 disposed in region B through the housing 20 and the circuit board 30, thereby effectively protecting the electronic components 40.

[0091] Furthermore, in embodiments 2 through 10, or embodiments described below, the configuration of offsetting the position of the adhesive 50 from the region B is also effective. Conversely, in the first embodiment, the position of the adhesive 50 from the region B is also offset in the same way as in this embodiment, but as long as the essential effect (1) described above is obtained, in the first embodiment, part or all of the adhesive 50 may overlap the region B vertically.

[0092] (12th implementation) Figure 25 This is an exploded perspective view of the electronic control device according to the 12th embodiment of the present invention, corresponding to the 1st embodiment. Figure 4 .

[0093] The difference between this embodiment and the second embodiment is that only three fixing screws S1 are used to secure the outer casing 20 to the base 10. Therefore, the screw bases 15 and 16 of the base 10 and the brackets 25 and 26 of the outer casing 20 are omitted in this embodiment. In this embodiment, by omitting two fixing screws S1 corresponding to the screw bases 15 and 16 of the first embodiment, the maximum spacing X1 of the fixing screws S1 along the long side of region A is increased compared to the second embodiment; the maximum spacing X1 is, for example, 150 mm or more. In this embodiment, the other configurations are the same as in the second embodiment.

[0094] Because of the addition of adhesive 50 to bind the housing 20, the housing 20 fixing structure using three fixing screws S1, as in this embodiment, can be achieved in terms of ensuring the required vibration resistance. From the viewpoint of ensuring the required vibration resistance, it is generally ideal for resin housings to have a screw spacing of less than 150 mm, and in reality, it is difficult to set three fixing screws S1.

[0095] In contrast, this embodiment ensures the required vibration resistance even when the fixing screws S1 are limited to only three. Since a plane is defined by three points, by limiting the fastening portion of the housing 20 formed by the fixing screws S1 to three locations, even if there are manufacturing errors in the base 10 or the housing 20, deformation of the housing 20 when tightening the fixing screws S1 will be minimal. This allows for the handling of stress factors acting on the soldered portions of the electronic component 40, which is more advantageous in terms of improving solder life.

[0096] Furthermore, by reducing the number of fixing screws S1, the screw base of the base 10, the bracket of the housing 20, and the insert ring can also be reduced, resulting in advantages such as a simplified shape of the base 10 and the housing 20 and a reduction in the number of parts. In addition, corresponding to the reduction of fixing screws S1, the time required for tightening screws during the assembly of the electronic control device 1 can also be reduced.

[0097] Furthermore, this embodiment is based on the configuration of the second embodiment, and the example is given by changing the number of fixing screws S1 from 5 to 3. However, in the first embodiment, the third embodiment to the eleventh embodiment, the structure can also be changed to fix the outer shell 20 with only 3 fixing screws S1 in the same way.

[0098] (Modified Example) As described above in each embodiment, the features of embodiments 1 to 12 can be selected and combined in multiple ways as appropriate. Furthermore, while the case where the base 10 is made of metal and the outer casing 20 is made of resin has been described, configurations where the base 10 is made of resin and the outer casing 20 is made of metal, or both the base 10 and the outer casing 20 are made of resin, are also considered. The case where the vehicle-mounted device 100 is a transmission has been cited as an example, but the configurations of each embodiment can also be applied to electronic control devices fixedly installed in vehicle-mounted devices such as engines, brakes, and motors.

[0099] Furthermore, the case where the adhesive 50 is positioned at the belly of the amplitude in the long side direction (X-axis direction) or short side direction (Y-axis direction) of region A has been described, but the adhesive 50 can also be positioned at the belly of the amplitude in the diagonal direction of region A. Symbol Explanation

[0100] 1… Electronic control device, 10… Base, 19… Seat surface, 20… Housing, 30… Circuit board, 40… Electronic component, 40a… QFN package (electronic component), 40b… BGA package (electronic component), 50, 50a-50c, 50A, 50B… Adhesive, 100… Vehicle equipment, A… Area surrounded by multiple fixing screws, B… Area surrounded by multiple board screws, g… Gap between the seat surface and the housing, i, j… Distance between the adhesive and the circuit board, S1… Fixing screw, S2… Board screw, X… Long side direction, Y… Short side direction.

Claims

1. An electronic control device, fixed to an on-board device that is the object of control, characterized in that, It is a unit that includes the following components: A base, which is mounted on the vehicle-mounted equipment; The outer casing, which is fixed to the base; Circuit board, which is held within the housing; and Electronic components, which are mounted on the circuit board. At least one of the outer shell and the base is made of resin. The outer casing and the base are fixed together by a plurality of fixing screws, and, The housing and the base are secured by an adhesive disposed away from the plurality of fixing screws. The area enclosed by the plurality of fixing screws has a long side direction and a short side direction, and the adhesive is disposed in the central part of the long side direction of the area enclosed by the plurality of fixing screws.

2. The electronic control device according to claim 1, characterized in that, The adhesive is disposed in the area enclosed by the plurality of fixing screws when viewed from above.

3. The electronic control device according to claim 1, characterized in that, The base is equipped with a seat surface facing the outer casing with a gap in the area enclosed by the plurality of fixing screws. The adhesive is filled in the gap between the seat surface and the outer shell.

4. The electronic control device according to claim 1, characterized in that, The adhesive extends in a linear shape along the short side.

5. The electronic control device according to claim 4, characterized in that, The adhesive is configured to be wavy when viewed along its long side.

6. The electronic control device according to claim 1, characterized in that, The adhesive has a Young's modulus of 1 MPa or higher.

7. The electronic control device according to claim 1, characterized in that, The electronic component is comprised of a QFN package. The adhesive is configured to not overlap with the QFN package when viewed from above.

8. The electronic control device according to claim 4, characterized in that, The adhesive is arranged in multiple portions along the long side.

9. The electronic control device according to claim 8, characterized in that, The distances between the various adhesives and the circuit board are different. The electronic component is comprised of a BGA package. Viewed from above, the adhesive overlapping the BGA package is farther away from the circuit board than other adhesives.

10. The electronic control device according to claim 1, characterized in that, The area enclosed by the plurality of fixing screws has a long side direction and a short side direction. The adhesive is arranged in multiple portions along the short side direction.

11. The electronic control device according to claim 10, characterized in that, One of the base and the outer casing is a resin part, and the other is a metal part. The adhesive located on the inner side of the region enclosed by the plurality of fixing screws is on the side of the resin part relative to the adhesive located on the outer side of the region.

12. The electronic control device according to claim 10, characterized in that, The adhesive is configured to be wavy when viewed along its long side.

13. The electronic control device according to claim 1, characterized in that, The circuit board is fixed in the housing by a plurality of board screws. The adhesive is configured so that it does not overlap with the area enclosed by the plurality of substrate screws when viewed from above.

14. The electronic control device according to claim 1, characterized in that, There are only 3 fixing screws.

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