Automated quality testing of a component carrier structure after material removal

Abstract

An apparatus (100) for performing a quality test on a component carrier structure (102), wherein the apparatus (100) comprises a manipulation unit (104) configured to manipulate the component carrier structure (102) at least along a portion between an inlet (106) and an outlet (108) of the apparatus (100), an identification unit (110) configured to identify the component carrier structure (102) subjected to the quality test, a material removal unit (112) configured to remove material of the component carrier structure (102) to expose an interior of the component carrier structure (102) subjected to the quality test, a determination unit (114) configured to determine at least one predetermined test target (116) of the component carrier structure (102) after the material removal, and an evaluation unit (118) configured to evaluate a property of the determined at least one test target (116) of the component carrier structure (102) to rate a quality of the component carrier structure (102).

Description

Technical Field

[0001] The present invention relates to equipment for performing quality testing on component carrier structures, a method for performing quality testing on component carrier structures by automated equipment, computer-readable media, and program elements. Background Technology

[0002] With the increasing functionality of products equipped with component carriers containing one or more electronic components, the gradual miniaturization of such electronic components, and the increasing number of electronic components to be mounted on component carriers such as printed circuit boards, increasingly robust array-like components or packages with multiple contacts or connections, with increasingly smaller spacing between such contacts, are being used. Meanwhile, component carriers must be mechanically robust and electrically reliable to operate even under harsh conditions.

[0003] Cross-sectioning is a technique used to characterize materials, perform failure analysis, and expose the internal structure of component carriers such as printed circuit boards (PCBs). Cross-sectioning can involve mounting a target portion of the PCB within a potting material to provide support and protection for the PCB during subsequent grinding and polishing processes. The mounted PCB is then carefully ground and polished using progressively finer media to achieve the target inspection plane of interest. The PCB prepared in this way can then be inspected by the user, for example, under an optical microscope or scanning electron microscope (SEM). Planar grinding is another technique used to expose the interior of component carriers for user inspection.

[0004] The fabrication and testing of cross-sections of component carriers, cross-sections of surface-ground component carriers, and cross-sections of related physical bodies have traditionally been performed manually by engineers. This applies to different types of micro-sections, such as cross sections and planar sections. However, in terms of quality testing, this involves a significant amount of work and limited accuracy, and can be critical in terms of stringent requirements regarding throughput at an industry scale. Summary of the Invention

[0005] The purpose of this invention is to evaluate the quality of component load-bearing structures with high reliability, high throughput, and reasonable workload.

[0006] To achieve the objectives defined above, this application provides an apparatus for performing quality testing on a component carrier structure, a method for performing quality testing on a component carrier structure by automated equipment, a computer-readable medium, and program elements.

[0007] According to an exemplary embodiment of the present invention, an apparatus for performing quality testing on a component carrier structure is provided, wherein the apparatus includes: a manipulation unit configured to manipulate the component carrier structure at least along a portion between the inlet and outlet of the apparatus; an identification unit configured to identify the component carrier structure undergoing (or experiencing) quality testing; a material removal unit configured to remove material from the component carrier structure to expose the interior of the component carrier structure undergoing (or experiencing) quality testing; a determination unit configured to determine at least one predetermined test target of the component carrier structure after the material removal; and an evaluation unit configured to evaluate the characteristics (e.g., at least one attribute) of the determined at least one test target of the component carrier structure to assess the quality of the component carrier structure.

[0008] According to another exemplary embodiment of the present invention, a method for performing quality testing on a component carrier structure by an automated device is provided, wherein the method includes: manipulating the component carrier structure at least along a portion between the inlet and outlet of the device; identifying the component carrier structure undergoing (or experiencing) quality testing; removing material from the component carrier structure to expose the interior of the component carrier structure undergoing (or experiencing) quality testing; after the material removal, determining at least one predetermined test target of the component carrier structure; and evaluating the characteristics (e.g., at least one attribute) of the determined at least one test target of the component carrier structure to assess the quality of the component carrier structure.

[0009] According to another exemplary embodiment of the present invention, a program element (e.g., a software routine, in source code or in executable code) is provided that, when executed by a processor (e.g., a microprocessor or CPU), is adapted to control and / or perform a method having the above-described features.

[0010] According to another exemplary embodiment of the present invention, a computer-readable medium (e.g., CD, DVD, USB stick, SD card, floppy disk or hard disk, or any other (especially, smaller) storage medium) is provided, wherein a computer program is stored in the computer-readable medium, which, when executed by a processor (e.g., a microprocessor or CPU), is adapted to control and / or perform methods having the above-described features.

[0011] Data processing that can be performed according to embodiments of the present invention can be implemented by computer programs, i.e., software, or by using one or more special electronically optimized circuits, i.e., hardware, or by a hybrid form, i.e., software components and hardware components.

[0012] In the context of this application, the term "component carrier" may specifically refer to any support structure capable of accommodating one or more components on and / or within the component carrier to provide mechanical support and / or electrical and / or optical and / or thermal connections. In other words, a component carrier can be configured as a mechanical and / or electronic carrier for a component. Specifically, a component carrier can be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. A component carrier can also be a hybrid board combining different types of component carriers of the types mentioned above.

[0013] In the context of this application, the term "component carrier structure" may specifically refer to a sheet material, such as a panel, array, or component carrier itself, manipulated and processed during and / or after the manufacture of a component carrier. Thus, a component carrier structure may specifically refer to a panel comprising a preform of multiple connected component carriers, an array (e.g., a quarter plate) comprising a preform of multiple connected component carriers, a preform of a component carrier (i.e., a component carrier not yet fully manufactured), or a manufactured component carrier (e.g., a printed circuit board (PCB) or integrated circuit (IC) substrate). However, a component carrier structure may also be a prototype.

[0014] In the context of this application, the term "sample" (or test sample) can specifically refer to a component carrier body (e.g., a body similar to a printed circuit board) that can be used to test the quality of the manufacturing process of the component carrier (particularly a printed circuit board). The test sample can be manufactured on the same panel as the component carrier (e.g., a printed circuit board), for example, at the edge of the panel, or even forming part of the component carrier or an area between component carriers. The sample can then be inspected for quality testing purposes, such as to ensure proper layer alignment, electrical connections, etc. The sample can also be cross-sectionally examined to inspect the internal structure. The sample can be designed to include conductive traces and vertical through-hole connections (e.g., vias), having the same dimensions and structure as the functional component carrier. For example, the sample can be a strip-shaped plate (e.g., having dimensions of 23 × 3.5 cm²; in a modular configuration of a sample comprising multiple individually available sample portions, such sample portions can also have significantly smaller dimensions, such as 3 × 1 cm²). Descriptively, the structural features of the sample should serve as a mirror image and fingerprint of the structural features of the corresponding component carrier (e.g., a PCB) on the same panel. In terms of description, the mirror function replicates everything that should be checked, while the fingerprint function shows the uniqueness of the structural features during the manufacturing process and reveals their individual characteristics.

[0015] In the context of this application, the term "quality testing" can specifically refer to the assessment of the quality of a component carrier structure by analyzing the characteristics of one or more predetermined test targets. In such quality testing, one or more such characteristic features of the component carrier structure can be tested to determine whether they meet one or more quality criteria. Such quality criteria may include one or more qualitative quality criteria (e.g., the presence or absence of layering in a layer structure as a qualitative error pattern or failure scenario) and / or one or more quantitative quality criteria (such as the thickness of a patterned copper layer relative to a predetermined range of acceptable thickness). Examples of identifiable quality defects in a component carrier structure are artifacts such as drill holes, hair inclusions, solder mask effects, short circuits between conductive traces to be separated, etc. For example, quality testing of a component carrier structure can be performed to check whether the component carrier structure conforms to industry standards (e.g., IPC 6012, IPC-A-600, IPC-2221, etc.).

[0016] In the context of this application, the term "predetermined test objective" can specifically refer to structural features within a component carrier structure exposed due to material removal, which have been predetermined as characteristics for evaluating the quality of the component carrier structure. For example, a test objective could be a drilled or layered structure in a laminate (particularly a laminated) of a component carrier structure comprising at least one electrically conductive layer structure (e.g., patterned copper foil and / or copper-filled laser vias) and / or at least one electrically insulating layer structure (e.g., a sheet comprising a resin such as epoxy resin and optionally reinforcing particles such as glass fiber). In particular, the characteristics or properties of at least one test target of the component carrier structure may include one or more of the following: the diameter of the drilled hole (e.g., laser drilling or mechanical drilling, which may or may not be filled with an electrically conductive material such as copper), the distance between adjacent drilled holes, the thickness of the layer structure (especially the thickness of patterned copper foil or layers), the planarity of the layer structure (e.g., measured by the deviation of the layer structure from a purely planar configuration), the delamination of the layer structure (i.e., a layer structure that has been at least partially separated from a complete set of complete, such as laminated, layer structures), etc.

[0017] According to an exemplary embodiment of the present invention, a fully automated system is provided for testing the quality of a component carrier structure (e.g., a printed circuit board sample), which can determine the quality of the component carrier structure substantially without human intervention. Specifically, the entire process of creating, measuring, and analyzing the polished component carrier structure can be performed automatically. This allows for ensuring sufficiently accurate quality testing while achieving high-throughput, industrial-scale quality testing of the component carrier structure at any stage during the manufacturing process. For this purpose, a robotic manipulator can manipulate the component carrier structure between some or all stages of the quality testing. The component carrier structure to be tested can be identified for traceability and to allow the results of the quality test to be assigned to a specific component carrier structure. Furthermore, the identified component carrier structure can undergo a machine-controlled material removal process (e.g., but not limited to abrasive material removal) to reach the target inspection plane of interest. Thus, material removal can be completed to expose the interior of the component carrier structure, thereby gaining access to at least one test target to be inspected (specifically, a drilled hole). Furthermore, in a fully automated manner, one or more test targets can then be identified from the abraded component structure. The evaluation unit can then assess these identified results to derive the quality test results. Advantageously, the above process for evaluating the effectiveness of the component structure requires no human intervention. This not only reduces the human resource workload in quality testing of the component structure but also makes the quality testing more objective, and therefore more meaningful and faster.

[0018] Further exemplary embodiments of the methods, apparatus, computer-readable media, and program elements will be described below.

[0019] In implementations, the manipulation unit includes at least one robot, particularly a multi-axis robot. For example, at least one of a linear robot, an articulated arm robot, and / or a six-axis robot or hexapod can be implemented as a robot. A six-axis robot or hexapod can refer to a robot with six axes, equipped with sensors and fully adapted to manipulate component carrier structures within a fully automated equipment unit. A hexapod can provide six degrees of freedom of motion within a compact enclosure. Combined with absolute measurement sensors, software, and motion controllers, a hexapod enables the execution of complex motion curves. According to an exemplary embodiment of the invention, a hexapod can be used in material removal processes (particularly grinding processes) because such a hexapod can be mechanically stable and simultaneously adapt very precisely to six axes. Therefore, target preparation supported by such a hexapod can become highly accurate and simultaneously more robust in case of possible misalignment (which can be corrected relatively easily). However, linear robots and / or articulated arm robots can be used to manipulate component carrier structures between various workstations in an automated equipment.

[0020] In this embodiment, the manipulation unit includes an inlet manipulation subunit configured to manipulate the component carrier structure along a sub-section of the device after the inlet. Specifically, the inlet manipulation subunit is configured to manipulate the component carrier structure along a sub-section of the device between the inlet and the material removal unit. Furthermore, the manipulation unit may include an outlet manipulation subunit configured to manipulate the component carrier structure along a sub-section of the device extending to the outlet. Specifically, the outlet manipulation subunit is configured to manipulate the component carrier structure along a sub-section of the device between the material removal unit and the outlet. For example, a first robot may be provided on the inlet side of the device, and a second robot may be provided on the outlet side of the device. The joint between the first robot and the second robot may be the material removal unit.

[0021] In this implementation, the identification unit is configured to identify the component carrier structure based on the detection of an identifier on and / or within the component carrier structure. For example, this identifier may be a QR code, barcode, alphanumeric code, or any other optically readable code. Alternatively, the identifier may be a wireless transponder, such as an RFID tag or NFC tag, attached to the component carrier structure. This transponder can be read by a corresponding reader device of the device.

[0022] In this implementation, the identification unit is configured to identify the component carrier structure by matching the detected identifier with relevant identification information in a database. For example, the code derived or retrieved from the identifier of the component carrier structure can be compared with a dataset in the database to obtain more detailed identification information related to the component carrier structure.

[0023] In this embodiment, the identification unit is configured to retrieve quality test-related information and / or instructions. Specifically, the identification unit is configured to retrieve quality test-related information and / or instructions from a database, indicating the quality tests to be performed on the identified component carrier structure. In this preferred embodiment, the identifier also encodes a description of the specific quality test to be performed on the component carrier structure after identification. Therefore, the quality test-related information derived from the identifier can be supplied to the device's processor or control unit for appropriate control of the quality tests.

[0024] In an implementation, the determining unit is configured to process at least one image of the at least one predetermined test target detected after the material removal. Specifically, the determining unit may determine the one or more test targets based on a microscopic image (specifically, a photomicrograph, such as a ground surface pattern or a polished cut image) of the exposed surface plane of the component carrier structure. In the context of this application, the term "removing material to expose a plane" may specifically mean material removal in a horizontal, vertical, or diagonal direction of the component carrier structure. Therefore, the exposed plane can have any orientation (particularly horizontal, vertical, or diagonal). For example, the detection unit (e.g., a camera) may capture an image of the exposed surface of the component carrier structure after grinding, and preferably after polishing. Based on this image, one or more predetermined test targets that are particularly significant for the quality of the component carrier structure can be identified at the image (e.g., through automated image recognition).

[0025] In one embodiment, the device includes an inlet receiving unit arranged at an inlet, configured to receive multiple component carrier structures prior to testing. Specifically, the inlet receiving unit is configured to receive the multiple component carrier structures in a stacked manner prior to testing. An actuation unit is configured to transfer the component carrier structure to be tested from the inlet receiving unit through the inlet, specifically to transfer the component carrier structure to be tested from the inlet receiving unit through the inlet to an identification unit. Therefore, in the case of quality testing, all the user needs to do is stack the component carrier structures to be quality tested at the inlet receiving unit (e.g., a container). Then, all other parts of the quality testing can be performed by the device in a self-contained manner.

[0026] In one embodiment, the device includes an outlet receiving unit disposed at an outlet, and the outlet receiving unit is configured to receive multiple component carrier structures after testing. Specifically, the outlet receiving unit is configured to receive the multiple component carrier structures in a stacked manner after testing. An actuation unit is configured to transfer the tested component carrier structures through the outlet to the outlet receiving unit. Therefore, at the end of the quality test, the processed component carrier structures can be collected in a stacked manner at the outlet receiving unit (e.g., another container). Thereafter, the user can access these quality-tested samples again.

[0027] In one embodiment, the device includes a material removal quantification unit configured to quantify the amount of material removed. By collecting the material removed (e.g., by grinding) from the component carrier structure, information related to the progress of the material removal process can be obtained, allowing the material removal process to be stopped when the desired test target or a previously hidden plane of interest has been exposed, preferably when the center of the borehole has been reached.

[0028] In addition, or alternatively, other concepts for determining the progress of the material removal process (in particular, the grinding process) can also be implemented. Examples are: detection of the position of a change in the outer edge of the component carrier structure due to material removal; detection of the position of a change in the position of a material removal unit or tool that impacts the component carrier structure to remove material from it; detection of sensor data (e.g., contact pressure and / or rotational speed) indicating the impact of the material removal unit on the component carrier structure; detection of changes in sensor data sensed on the sacrificial structure and / or on the test target of the component carrier structure due to material removal, etc.

[0029] In one embodiment, the device includes a simplification (or separation) unit configured to simplify (or separate) the component carrier structure from the larger body before supplying it to a material removal unit. Specifically, the simplification unit is configured to simplify (or separate) the component carrier structure from the panel before supplying it to the material removal unit. In particular, simplification of the component carrier structure (especially the specimen) can be accomplished by milling or laser cutting.

[0030] In one embodiment, the device includes a thermal stress exposure unit configured to expose the component carrier structure to thermal stress before supplying it to the determining unit. During normal use, the component carrier may be subjected to thermal stress, for example, through thermal cycling during normal operation. To test the quality of the component carrier structure under realistic conditions and taking into account the thermal stress occurring during normal use, this thermal stress can be simulated—or the component carrier structure can be subjected to such thermal stress—before determining the at least one test target and evaluating the quality of the component carrier structure accordingly.

[0031] In this embodiment, the thermal stress exposure unit is configured to expose the component carrier structure to a thermal stress bath. More specifically, the thermal stress exposure unit is configured to allow the component carrier structure to float on the thermal stress bath, and even more specifically, to allow the component carrier structure to float on molten solder. Therefore, the component carrier structure can be subjected to a flowable solder material bath to practically apply thermal stress to the component carrier structure. Advantageously, this thermal stress test can be easily automated.

[0032] In an embodiment, the device includes at least one cleaning unit configured to clean the component carrier structure after material removal and before determination. Specifically, the cleaning unit is configured to clean the component carrier structure in an ultrasonic bath (i.e., a cleaning or rinsing bath involving exposure to ultrasound to promote cleaning) after material removal and before determination. For example, cleaning can be performed after material removal (preferably by abrasion) and before inspection of an image of the surface of the component carrier structure exposed by material removal. This cleaning process after each abrasion stage can improve image quality and thus improve the reliability and accuracy of determining one or more test targets on the image. If desired or necessary, an additional etching process can be performed by an etching unit after cleaning and before optical analysis to further increase the amount of information obtainable from the image and thus increase the identifiability of the test targets. In particular, copper crystal structures and plating structures can be made visible by etching.

[0033] In one embodiment, the device includes an alignment unit configured to align the component carrier structure before image detection and / or before material removal. Specifically, the alignment unit is configured to align the component carrier structure based on at least one alignment feature of the component carrier structure before image detection and / or before material removal. Preferably, the alignment unit may include a multi-axis robot to achieve excellent alignment accuracy; most preferably, the multi-axis robot is a hexapod. To ensure proper orientation of the exposed surface of the component carrier structure (showing the at least one test target) relative to a camera capturing an image of the exposed surface, the device can automatically determine the position of one or more alignment marks on the component carrier and can adjust the position and / or orientation of the component carrier structure before image capture. Furthermore or alternatively, this alignment process can be performed before or during material removal to expose the surface. This improves the accuracy of quality testing.

[0034] In one embodiment, the device includes a detection unit configured to detect image data of the interior of the component carrier structure after the material removal. In this case, the previously internal planes of the component carrier structure, imaged by the detection unit (e.g., including a camera), can be exposed through the previous material removal stage. The results of the image detection can then be transmitted to a determination unit for identifying the test target.

[0035] In this implementation, the determining unit is configured to coarsely determine the at least one predetermined test target based on a first image of the detected component carrier structure, and finely determine the at least one predetermined test target based on a detected second image of the component carrier structure detected after the first image. Preferably, the second image can be captured after etching the surface of the component carrier structure. Therefore, the determining unit can operate in two or more stages to further improve the accuracy of the determined quality information. Fine determination can be performed after coarse determination. Between different determination stages, additional processing (particularly by etching and / or additional grinding and / or polishing) can be applied to the analytical surface of the component carrier structure to improve the reliability of the determination of the one or more test targets.

[0036] In this implementation, the determination unit is configured to determine the at least one predetermined test target by iteratively repeating a series of steps including material removal, image detection, and optionally image evaluation. For example, the component carrier structure may undergo the series of steps before the grinding, image detection, test target determination, and optional evaluation are repeated one or more times. Advantageously, the component carrier structure being analyzed may undergo two or more iterative repetitions by the material removal unit, detection unit, and determination and / or evaluation unit. When the determination and / or evaluation of the test target indicates that the resolution or reliability of the quality test can or should be further improved, additional material can be removed from the component carrier structure to modify the exposed surfaces (in this implementation, further polishing is also possible). By taking this measure, the cross-sectional plane corresponding to the exposed surface of the component carrier structure can be spatially shifted and / or tilted. Subsequently, an additional polishing process can be performed. The correspondingly treated exposed surface of the component carrier structure can then be subjected to additional image capture by the detection unit, and the additionally acquired images can then be further processed by the determination and evaluation units. Iteratively, one or more problems can be identified based on images of the exposed surfaces of the component carrier structure captured by the detection unit. The grinding process of the material removal unit can be adjusted to attempt to eliminate the one or more problems (e.g., to achieve compliance with industry standards in quality inspection), and the results of repeated material removal can be detected by the detection unit and analyzed by the determination and evaluation units. Through this iterative approach, fully automated quality testing can be performed with high precision.

[0037] In one embodiment, the material removal unit is configured to remove material from the component carrier structure by grinding. Specifically, grinding can refer to an abrasive processing method that uses a grinding wheel (or another abrasive media) as a material removal or cutting tool. Each abrasive grain can serve as a microscopic single-point cutting edge, shearing a tiny tip from the component carrier structure. However, in other embodiments, material removal from the component carrier structure can be accomplished by methods other than grinding, such as laser processing or any kind of cutting.

[0038] In this implementation, the material removal unit is configured to remove material from the component carrier structure by either cross-sectional grinding or planar grinding. Regarding cross-sectional grinding, a cross-section of the component carrier structure can be created, allowing analysis on a plane that cuts through the plate-like component carrier structure. Cross-sectional grinding is a destructive technique that cuts or grinds away a portion of the component carrier structure to expose the internal planes of interest for analysis. In the obtained cross-section, the quality of the drilled holes can be assessed, the plating quality and thickness in the vias can be evaluated, and other test targets can be analyzed. As an example of such other test targets, making the voids in the material of the component carrier structure accessible indicates the quality of the lamination process. Regarding planar grinding or surface grinding, this technique can be used to produce a smooth finish on the plane of the component carrier structure. Planar grinding can be represented as an abrasive processing method in which a rotating wheel (or any other body) covered with coarse particles cuts debris from the main surface of the component carrier structure, thereby penetrating the main surface of the inner layers of the component carrier structure.

[0039] In one embodiment, the device includes a polishing unit configured to polish the exposed surfaces of the component carrier structure after material removal. Polishing can refer to a process that creates a smooth surface by friction or the use of chemical action, thereby reducing surface roughness. Unlike grinding, polishing does not remove a significant amount of material from the surface of the component carrier structure, but simply enhances flatness by leveling the surface. Polishing can utilize multiple stages, starting with a coarser abrasive, with each subsequent stage using a finer abrasive.

[0040] In one embodiment, the device includes an encapsulation unit configured to encapsulate a component carrier structure within an encapsulation, such that the component carrier structure is subjected to testing and / or determination within the encapsulation. For example, the component carrier structure may be embedded in a resin matrix to simplify manipulation of the component carrier structure during processing and / or testing. This encapsulation process can be automated and can also serve as a stress buffer to protect the component carrier structure.

[0041] In another preferred embodiment, the determining unit is configured to determine the at least one predetermined test target based on the unencapsulated component carrier structure. Accordingly, the method may include detecting an image of the unencapsulated component carrier structure and / or determining the at least one predetermined test target based on the unencapsulated component carrier structure. Advantageously, the automated equipment does not necessarily require encapsulation of the component carrier structure (e.g., the sample) prior to optical inspection. Omitting encapsulation and inspecting the unencapsulated component carrier structure can significantly simplify and accelerate automated quality testing.

[0042] In this implementation, the evaluation unit is configured to assess the quality of the component carrier structure based on the characteristics of the at least one determined test target. For example, the ideal range of the characteristics of the parameters for each test target can be predetermined (and stored, for example, in a database). For each test target and corresponding characteristic (e.g., the diameter of the drilled hole) of the analyzed component carrier structure, the evaluation unit can assess whether each test target meets the requirements of the predetermined characteristics.

[0043] In this implementation, the evaluation unit is configured to evaluate quality by classifying the component carrier structure into one of a plurality of predetermined quality categories. Specifically, the evaluation unit is configured to classify the component carrier structure into one of a plurality of predetermined quality categories, including "Pass," "Fail," and "Requires Further Analysis." Classifying a component carrier structure as "Pass" means that one or more analyzed test targets indicate that the component carrier structure is of satisfactory quality, and that the component carrier structure (and particularly the designated component carrier) can continue to be used for its intended purpose. Classifying a component carrier structure as "Fail" means that one or more analyzed test targets indicate that the component carrier structure is of unacceptable quality, and that the component carrier structure (and particularly the designated component carrier) is considered a waste or defective product. If the evaluation conclusion is not sufficiently reliable based on the available data, the device can output appropriate instructions and, for example, propose or perform additional automated analysis, or propose a human user-based assessment. Classifying each tested component carrier structure into one of a plurality of predetermined groups simplifies the automated execution of quality testing. For example, one or more criteria mentioned in Chapter 3.6 "Structural Integrity" of IPC-6012D (Revision: September 2015) can be considered to assess the defect.

[0044] More specifically, the evaluation unit can be configured to assess quality by classifying each test objective of the component carrier structure into one of several quality categories. In particular, the evaluation unit can be configured to assess quality by classifying each test objective of the component carrier structure into one of three categories: "Pass," "Fail," and "Requires Further Analysis." Advantageously, each characteristic, attribute, or parameter of the test objective to be inspected can be classified in this manner. The final decision can be made as described in the preceding paragraph, but the judgment regarding each characteristic, attribute, or parameter can form the basis for this quality decision. Even with only slight deviations in less critical parameters, it can be determined that the component carrier structure can be evaluated as "Pass." The criteria used as the basis for this decision can be predetermined by the user or by the specifications indicating quality.

[0045] In an implementation, the evaluation unit includes an artificial intelligence module configured to perform evaluation using artificial intelligence, specifically, configured to perform evaluation using machine learning, and more specifically, configured to perform evaluation using neural networks. In the context of this application, the term "artificial intelligence" can specifically refer to tools such as neural networks, self-learning or adaptive systems, fuzzy logic, etc. Artificial intelligence can operate independently of humans based on electronic hardware and software resources. Accordingly, the artificial intelligence module can be a physical or virtual entity that includes artificial intelligence capabilities. Artificial intelligence can specifically refer to the implementation of algorithms and / or statistical models, where a processor (e.g., a computer system) can be used to perform specific tasks without using explicit instructions, relying on patterns, or similar methods. In particular, artificial intelligence algorithms can build mathematical models based on input data (which can also be represented as training data) to make predictions or decisions without being explicitly programmed to perform a task. In an implementation, processing by the artificial intelligence module includes processing through deep learning. Deep learning can specifically refer to machine learning methods based on artificial neural networks and representation learning. Deep learning can be supervised, semi-supervised, or unsupervised. Examples of deep learning architectures that can be implemented according to exemplary embodiments of the present invention are deep neural networks, deep belief networks, recurrent neural networks, and convolutional neural networks. Implementing deep learning algorithms in the automated execution of quality testing, particularly in interpreting pre-determined test targets related to the quality of component carrier structures, can further improve the reliability, performance, and accuracy of quality testing. In embodiments, processing performed by an artificial intelligence module includes processing performed by a neural network. Such a neural network can be a computational system capable of learning to perform tasks by considering examples, typically without requiring programming with specific task rules. The neural network can be based on a set of connection nodes called artificial neurons. Each connection between these neurons can transmit a signal to other neurons. The artificial neuron receiving the signal processes the signal and can be able to send signals to neurons connected to it. During learning, the weights of the connections can be continuously adjusted. By inputting pre-determined test targets for the analyzed component carrier structure, the neural network can contribute to the evaluation of the quality of the component carrier structure.

[0046] In this implementation, the device is configured to perform quality testing between the inlet and outlet without human intervention. Accordingly, the method may include performing quality testing between the inlet and outlet without human intervention. This avoids human error and improves throughput.

[0047] In an embodiment, the component carrier structure comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the aforementioned electrically insulating layer structure and electrically conductive layer structure, particularly a laminate formed by applying mechanical pressure and / or heat. The aforementioned stack may provide a plate-like component carrier capable of providing a large mounting surface for more components while remaining very thin and compact.

[0048] In this implementation, the component carrier structure is shaped as a plate. This facilitates a compact design, where the component carrier still provides a large base for mounting components on it. Furthermore, particularly as bare dies for example, embedded electronic components, the thinness of these dies allows for easy embedding into thin plates such as printed circuit boards.

[0049] In one embodiment, the component carrier structure is configured as one of a printed circuit board, a substrate (particularly an IC substrate), and an interposer.

[0050] In the context of this application, the term "printed circuit board" (PCB) can specifically refer to a plate-shaped component carrier formed by laminating multiple electrically conductive layer structures with multiple electrically insulating layer structures, for example by applying pressure and / or providing heat. As preferred materials for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures may contain resin and / or glass fiber, a material referred to as a prepreg or FR4. Various electrically conductive layer structures can be connected to each other in a desired manner by forming through-holes through the laminate, for example by laser drilling or mechanical drilling, and by filling the holes with an electrically conductive material (partially copper), thereby forming vias or any other through-hole connections. (For example, partially) filled holes can connect the entire stack (through-hole connections extending through several layers or the entire stack), or filled holes can connect at least two electrically conductive layers; these filled holes are called vias. Similarly, to accommodate an electro-optical circuit board (EOCB), optical interconnects can be formed through the various layers of the stack. In addition to being embedded as one or more components, printed circuit boards are typically constructed as one or more components housed on one or two opposite surfaces of a sheet-like printed circuit board. These components can be soldered to their respective main surfaces. The dielectric portions of the PCB may consist of resin with reinforcing fibers (e.g., glass fibers) or other reinforcing particles (such as reinforcing spheres, particularly glass spheres).

[0051] In the context of this application, the term "substrate" can specifically refer to a small component carrier. A substrate can be a relatively small component carrier associated with a PCB, on which one or more components can be mounted, and which can serve as a connection medium between (one or more) chips and another PCB. For example, the substrate can have substantially the same dimensions as the components (particularly electronic components) to be mounted thereon (e.g., in the case of a chip-scale package (CSP)). More specifically, a substrate can be understood as a carrier of electrical connections or electrical networks and a component carrier compared to a printed circuit board (PCB); however, the substrate has a considerably high density of lateral and / or longitudinally arranged connections. Lateral connections are, for example, conductive paths, while longitudinal connections can be, for example, drilled holes. These lateral and / or vertical connections are arranged within the substrate and can be used to provide, in particular, electrical, thermal, and / or mechanical connections between encased or unencased components (e.g., bare wafers) of IC chips and printed circuit boards or intermediate printed circuit boards. Therefore, the term "substrate" also includes "IC substrate." The dielectric portion of the substrate can be composed of resin with reinforcing particles (e.g., reinforcing spheres, particularly glass spheres).

[0052] The substrate or interlayer may include or consist of layers of at least the following substances: glass, silicon (Si) and / or photo-imageable or dry-etchable organic materials, such as epoxy-based stacking materials (e.g., epoxy-based stacked films), or polymer compounds such as polyimide or polybenzoxazole (which may or may not contain photosensitive and / or thermosensitive molecules).

[0053] In embodiments, the at least one electrically insulating layer structure comprises at least one of the following: resins or polymers, such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide-triazine resins, polyphenylene derivatives (e.g., polyphenylene ether-based, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE), and / or combinations thereof. Reinforcing structures, such as meshes, fibers, spheres, or other types of filler particles, made of glass (multilayer glass), may also be used to form the composition. The semi-cured resin combined with reinforcing agents, such as fibers impregnated with the resins mentioned above, is referred to as a prepreg. These prepregs are typically named for their properties, such as FR4 or FR5, which describe their flame-retardant properties. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based stacking materials (e.g., stacked films) or photo-imageable dielectric materials, may also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate ester resins may be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low, or extremely low DK materials (where "DK" can refer to the real part of the dielectric constant) can be used as electrical insulation structures in component carriers.

[0054] In an embodiment, the at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, and tungsten. While copper is generally the preferred material, other materials or their coating versions are also possible, particularly those coated with superconducting materials or conductive polymers, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).

[0055] At least one component that can be embedded in the stack can be selected from: non-electrically conductive inlays, electrically conductive inlays (such as metallic inlays, preferably including copper or aluminum), heat transfer units (e.g., heat pipes), optical guiding elements (e.g., optical waveguides or optical conductor connections), electronic components, or combinations thereof. The inlay can be, for example, a metal block with or without an insulating material coating (IMS-inlay), which can be embedded or surface-mounted to facilitate heat dissipation. A suitable material is determined based on its thermal conductivity, which should be at least 2 W / mK. Such materials are typically based on, but not limited to, metals, metal oxides, and / or ceramics, such as copper, alumina (Al₂O₃), or aluminum nitride (AlN). Other geometries with increased surface area are also frequently used to increase heat exchange capacity. In addition, components can be active electronic components (implementing at least one pn junction), passive electronic components such as resistors, inductors, or capacitors, electronic chips, storage devices (such as DRAM or other data memories), filters, integrated circuits (such as field-programmable gate arrays (FPGAs), programmable array logic (PALs), general-purpose array logic (GALs), and complex programmable logic devices (CPLDs)), signal processing components, power management components (such as field-effect transistors (FETs), metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, junction field-effect transistors (JFETs), or insulated-gate transistors). These are all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound), optoelectronic interface elements, light-emitting diodes, optocouplers, voltage converters (e.g., DC / DC converters or AC / DC converters), encryption components, transmitters and / or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components can be embedded within component carriers. For example, magnetic elements can be used as components. Such magnetic elements can be permanently magnetic (e.g., ferromagnetic, antiferromagnetic, multiferroic, or ferrimagnetic elements, such as ferrite cores) or paramagnetic. However, components can also be IC substrates, interposers, or other component carriers, such as in board-in-board configurations. Components may be surface-mounted on a component carrier and / or embedded within a component carrier. Additionally, other components, particularly those that generate and emit electromagnetic radiation and / or are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

[0056] In one embodiment, the component carrier is a laminated component carrier. In such embodiments, the component carrier is a multilayer composite structure that is stacked and connected together by applying pressure and / or heat.

[0057] After the inner layer structure of the component carrier has been treated, one or more additional electrically insulating and / or electrically conductive layers can be used to symmetrically or asymmetrically cover (particularly by lamination) one main surface or two opposite main surfaces of the treated layer structure. In other words, the layers can be continuously stacked until the desired number of layers are obtained.

[0058] After the stacked components of the electrical insulation layer structure and the electrical conductivity layer structure are formed, the obtained layer structure or component carrier can be surface treated.

[0059] Specifically, in terms of surface treatment, an electrically insulating solder resist can be applied to one or two opposite main surfaces of the laminate or component carrier. For example, a solder resist can be formed on the entire main surface and then patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to an electronic periphery. The surface portions of the component carrier still covered by the solder resist, particularly those containing copper, can be effectively protected from oxidation or corrosion.

[0060] In terms of surface treatment, surface modifications can also be selectively applied to the exposed electrically conductive surface portions of a component carrier. This surface modification can be an electrically conductive covering material on an exposed electrically conductive layer structure (e.g., pads, conductive tracks, etc., particularly containing or composed of copper) on the surface of the component carrier. If this exposed electrically conductive layer structure is unprotected, the exposed electrically conductive component carrier material (particularly copper) may oxidize, reducing the reliability of the component carrier. A surface modification can then be formed, for example, as an interface between a surface-mounted component and the component carrier. Surface modifications function to protect the exposed electrically conductive layer structure (particularly copper circuitry) and enable (e.g., by soldering) a bonding process with one or more components. Examples of suitable materials for surface modifications are organic solderability protectants (OSP), electroless nickel immersion gold (ENIG), gold (particularly hard gold), electroless tin, nickel-gold, nickel-palladium, electroless nickel-palladium immersion gold (ENIPIG), etc.

[0061] The above-defined aspects and other aspects of the invention will become apparent from the examples of embodiments described below, and will be explained with reference to the examples of embodiments. Attached Figure Description

[0062] Figure 1A flowchart is shown of a method for quality testing of a component carrier structure according to an exemplary embodiment of the present invention.

[0063] Figure 2 An apparatus for performing quality testing of a component carrier structure according to an exemplary embodiment of the present invention is illustrated schematically.

[0064] Figure 3 Details of an apparatus for performing quality tests on component carrier structures according to an exemplary embodiment of the present invention are shown.

[0065] Figure 4 The process flow of a method for performing quality testing on a component carrier structure according to an exemplary embodiment of the present invention is shown.

[0066] Figure 5 An automated unit of an apparatus for performing quality testing on a component carrier structure according to an exemplary embodiment of the present invention is shown.

[0067] The illustrations in the accompanying drawings are schematic. In different drawings, similar or identical elements are given the same reference numerals. Detailed Implementation

[0068] Before describing the exemplary embodiments in further detail with reference to the accompanying drawings, some basic considerations on which the exemplary embodiments of the present invention are based will be outlined.

[0069] According to an exemplary embodiment of the present invention, fully automated execution of quality testing of component carrier structures, such as test specimens, can be achieved. In particular, such an automated system can combine all individual processes in a fully automated quality testing unit by using standardized component carrier structure samples and automated measurement / inspection techniques. Therefore, high throughput and high accuracy in target preparation can be obtained. Automated measurement and visual inspection of component carrier structure samples can be achieved through elements implementing artificial intelligence. Highly advantageously, unbiased assessment of component carrier structures can be achieved. Improved capabilities and capacity for laboratory testing can be achieved through such automated equipment. Furthermore, improved levels of automation, repeatability, and throughput can also be achieved. In particular, the automated system for performing quality testing on component carrier structures can achieve high-speed and high-accuracy inspection of component carrier structures, especially high-speed and high-accuracy inspection of component carrier structures for compliance test specimens conforming to Chapter 12.1 of IPC-2221B (version: November 2012).

[0070] Examples of variables that affect the cross-section of the component carrier structure (see the more detailed discussion of individual variables below) include the grinding media used for material removal, alignment (e.g., using a manipulator), pressure applied during grinding and / or polishing, rotational speed during grinding or polishing, control of material removal from the component carrier structure (more specifically, material removal progress control), cleaning (of the component carrier structure and / or grinding media) to avoid carrying, heating or cooling, and thermal and mechanical loads.

[0071] Regarding grinding, adjustable parameters include the grain size of the grinding media, contact pressure, and selectivity. The grain size can also be adjusted for the grinding machine. Polishing of the cross-sectional surfaces of the component carrier structure can be performed using a diamond suspension (wherein the rotation can be synchronous or reciprocating). Optionally, impregnation and / or filling of the component carrier structure can prevent contamination of copper vias.

[0072] Regarding the abrasive media used for material removal, it is advantageous that the material removal process does not generate excessive heat, thereby maintaining the integrity of the laminated component of the component carrier structure. Preferably, the material removal process can be carried out at a temperature significantly lower than the glass transition temperature (Tg) of the resin material of the component carrier (e.g., at least 10% lower than Tg in degrees Celsius or Kelvin). For example, water can be used as a cooling and / or cleaning medium.

[0073] Grinding may be preferred for removing material from the component's carrier structure. However, material removal can also be accomplished by, for example, wire cutting, wire erosion, plasma treatment, laser treatment, sandblasting, water jetting, milling, sawing, processing with a gantry shear, ion beam treatment, and / or punching.

[0074] Preferably, the grain size can be (especially at the end of material removal) fine enough to support subsequent polishing. The grain size can be selected depending on the polishing suspension used. For example, a 3 µm grain size may only be suitable for a certain degree of grinding.

[0075] To suppress variations in the flatness of the ground and / or polished surfaces of the component's carrier structure, avoiding overheating and overcooling may be advantageous. Furthermore, low thermal and mechanical loads should be maintained.

[0076] When designing the control arm of a control unit, the sliding and / or rotation of the component carrier structure should be kept as low as possible. This favorable boundary condition can influence the selection of the maximum rotational speed.

[0077] Next, the implementation method of the grinding process will be described. Advantageously, iterative grinding control processing can be performed. The grinding disc (or plate) can be arranged horizontally or vertically, or, if needed or desired (given the type of grinding performed), at a specific angle.

[0078] Regarding the control of material removal progress, a camera can be used to monitor the grinding progress. For example, such a camera can be positioned on and / or within the grinding body. This can facilitate the planarity and / or alignment of the treated surfaces of the component carrier structure. Progress control can also be achieved through electrical measurements, for example, by contacting a copper structure that has been partially or completely removed at a specific material removal progress state, which can be detected by changes in electrical signals. Alternatively, progress control can be based on one or more mechanical stops (e.g., with sufficiently hard surfaces, preferably diamond surfaces), against which the grinding body is positioned when a predetermined progress in the material removal process is achieved. Furthermore, resistance measurements on the grinding body can be used for progress control. In other embodiments, with regard to progress control, the incremental feed can be measured. For example, for through-holes, the instantaneous opening of such a hole can cause a significant pressure drop. When reaching micro-vias, the effect on pressure may be the opposite, i.e., an increase in pressure or an increase in resistance can be detected. Grinding a metallic through-hole material instead of a softer resin material may increase the pressure. If an electrical signal is measured at the microvia and the electrically conductive material of the microvia is removed, the resistance may increase, which is also detectable. In another embodiment of progress control, for example, a change in water color upon reaching a target can be detected. Furthermore, resistance measurements (e.g., of sacrificial structures removed during grinding) can also be used for progress control. In yet another embodiment related to progress control, sound detection, tribometer-based detection, pins pressed against the grinding disc (optionally combined with a grating), etc., can be used. Once the center of the borehole is detected, grinding can be stopped.

[0079] Preferably, progress can be measured at or near the test target. Hard stopping is possible, still referencing the progress control of the grinding process. However, iterative grinding processes are also possible.

[0080] In this implementation, the contact pressure between the grinding media and the component carrier structure can be measured. This can be automated, for example, using a pressure regulator (e.g., force-based adjustment). The pressure can remain constant or vary during material removal. A small amount of grinding media can be balanced with time, pressure, and rotation. Variable pressure can also be applied based on throughput, quality targets, and sample thickness. The maximum pressure can be adjusted in a manner that does not damage the component carrier structure, particularly at or around test targets such as drilled holes. Specifically, the contact pressure can be selected based on the grinding method of the component carrier (e.g., layer-by-layer grinding, abutment grinding, etc.). It should be noted that cutting preparation neither enhances nor reduces quality problems in the component carrier structure.

[0081] Regarding the rotation speed and type, it may be advantageous to generate heat only within a range below a predetermined maximum value. The rotation direction can be synchronous or opposite. The clamping or manipulating device (such as a clamping device, manipulating jig, hexapod, etc.) can oscillate rapidly.

[0082] The parameters that can be adjusted in terms of rotation include rotation time, contact pressure, rotation type, material of the component bearing structure, and grain size.

[0083] Regarding the alignment or orientation of the component carrier structure during the processing used to perform quality testing in an automated manner, the camera can determine whether the component carrier structure sample is correctly positioned before the first polishing. If necessary, the position of the component carrier structure can be corrected to ensure proper alignment (e.g., based on comparison with an external reference hole, preferably unplated with copper; such reference holes can be drilled or etched during photoprocessing, for example). Alternatively, mechanical alignment processes can be performed (e.g., using alignment pins).

[0084] The goal of alignment is to ensure that the target plane and the grinding media are oriented parallel to each other. This can be achieved by accordingly influencing the media, the grinding media, rotating one or even all the involved components, etc.

[0085] Still using reference alignment, the camera image can capture a reference point and the target point to be viewed. This data can define the target plane (software-supported, mechanically, etc.) and can make the target plane parallel to the grinding media. In further alignment control, limiting factors may be the combination of the hexapod / grinding speed / maximum force to maintain alignment corresponding to the mechanical stability of the entire system.

[0086] Referring now to the cleaning of component carrier structures, one implementation involves cleaning the component carrier structure during grinding. In an iterative method, each new grinding stage (e.g., fine grinding after coarse grinding) can be performed via a cleaning stage. Cleaning ensures that no particulate matter is carried over. For example, in terms of cleaning, particles can be blown away, sucked away, evaporated, burned, peeled off, brushed, rinsed, etc. For example, continuous cleaning can be performed during the grinding process. Suction, rinsing (preferably bath or tank), peeling, blowing, ultrasonic bath (vibration washing), or other cleaning units can be implemented. Advantageously, very small cracks can be washed away by rinsing. After cleaning, it may be advantageous that the maximum size of the remaining particles should be equal to or smaller than the particle size used for grinding in the next process.

[0087] Regarding specimen design, it can be standardized or it can have deviations. Any deviations can be coordinated with the user. For example, the specimen-type component carrier structure can be equipped with one or more alignment holes, wear sensors, etc.

[0088] In assessing the quality of component carrier structures, examples of quality standards or characteristics include sharp edges (preferably 90°), near-zero radii, flatness, and tolerances below a predetermined threshold (e.g., 10% or preferably less than 10%, with a tolerance not exceeding 7%). Another quality characteristic of the component carrier structure is that it is preferably scratch-free in a 100x magnified image. Furthermore, the component carrier structure should be free of gaps (particularly between the sample and the inlay, even more so between the conductive layer and the inlay, and especially between copper and the inlay). The resin may shrink during inlay (fast-curing inlays have significant volume loss, while slow-curing reagents have minimal volume loss), but the shrinkage should not be excessive.

[0089] Figure 1 A flowchart 170 illustrates a method for quality testing of a component carrier structure 102 according to an exemplary embodiment of the present invention. (For describing...) Figure 1 The reference numerals in the attached figures refer to Figure 2 or Figure 3 The implementation method is described below. Preferably, the component carrier structure 102 mentioned above can be a sample forming part of a panel and used for testing component carriers (such as printed circuit board (PCB) or integrated circuit (IC) substrate). However, the component carrier structure 102 can alternatively be a preform comprising a plurality of connected component carriers, or a preform of component carriers, or a panel or array (such as a quarter panel) of manufactured component carriers.

[0090] Advantageously, the method of flowchart 170 can correspond to the quality testing of the component carrier structure 102 performed by automated equipment 100. Preferably, the method can include performing the quality test between the inlet 106 (logically corresponding to input 172) and outlet 108 (logically corresponding to output 190) of the equipment 100 without human intervention. In other words, the inlet 106 of the equipment 100 corresponds to the input 172 of the method, and the outlet 108 of the equipment 100 corresponds to the output 190 of the method. More specifically, automated processing is provided for the cross-sectional preparation and visual inspection and measurement of the component carrier structure 102. Preferably, no manual work is required, and the entire process can be automated. For this purpose, the test specimen type component carrier structure 102 can be configured for automated manipulation and machine-readable serialization.

[0091] As shown by reference numeral 172 in the attached figure, the component carrier structure 102 can be input into the device 100.

[0092] Referring to box 174, a sample can be inserted into device 100 as a component carrier structure 102, and the sample can be manipulated fully automatically by robot 120. More specifically, the sample can be, for example, a component carrier structure 102 constructed or designed according to IPC-2221. The component carrier structure 102 can provide traceability information to device 100. For this purpose, methods that can be performed by device 100 may include automatically identifying component carrier structures 102 that will undergo quality testing. For example, sample-type component carrier structures 102 can be listed. Multiple samples can be classified. For traceability purposes, information such as batch number, panel number, array number, x / y information, cross-section number, report number, request identifier, etc., can be specified in the dataset assigned to each component carrier structure 102. For example, such a dataset can be stored in database 128.

[0093] Referring to frame 176, the component carrier structure 102, which can still be integrally connected with the rest of the panel, can be individualized or separated, for example, by milling or cutting the component carrier structure 102 from a larger body 160, such as the panel. For this purpose, a defined location for the component carrier structure 102 can be searched within the larger body 160 and cut out. As a result, a test sample in the form of a separated component carrier structure 102 can be obtained. For example, the cutting of the component carrier structure 102 can be performed based on a minimum plated through-hole or according to a user definition.

[0094] Referring to box 178, the component carrier structure 102 can then be subjected to thermal stress, for example, by performing a solder float test. For instance, the component carrier structure 102 can be immersed in molten solder to subject the component carrier structure to thermal stress. As an alternative to the solder float test, alternative thermal stress methods, such as reflow simulation, can also be performed.

[0095] Referring to box 180, the component carrier structure 102 may or may not undergo an encapsulation process to simplify handling and / or buffer stress during subsequent quality testing. While conventional manual quality testing of component carrier structures may require encapsulation before quality assessment, such encapsulation can be omitted according to exemplary embodiments of the invention involving fully automated quality testing of the component carrier structure 102. If optionally performed, the encapsulation process may place the component carrier structure 102 into an embedding material such as resin for further fabrication. However, in other embodiments, such encapsulation can be advantageously skipped (as indicated by reference numeral 192) because automated handling according to exemplary embodiments of the invention can also be performed without such encapsulation.

[0096] Referring to frame 182, the material of component carrier structure 102 can then be removed to expose the interior of the component carrier structure to be subjected to quality testing. More specifically, micro-sections (particularly cross-sections) of component carrier structure 102 can be created. For this purpose, component carrier structure 102 can be ground and subsequently polished to a defined location (preferably up to the center of a through-hole, drill hole, or pattern). For example, different stages of sanding and polishing can be performed. For example, for grinding, sandpaper with different grits can be used (e.g., using one or more of the following grits: 60, 180, 1200, 2000).

[0097] Referring to box 184, the method may include determining one or more predetermined test targets 116 (e.g., plated vias and their characteristics) of the component carrier structure 102 after the material removal. Furthermore, the method may include evaluating the characteristics or properties of one or more test targets 116 of the component carrier structure 102 to assess the quality of the component carrier structure 102. When skipping box 180, the method may include determining at least one predetermined test target 116 based on the unencapsulated component carrier structure 102, or otherwise based on the encapsulated component carrier structure 102. In particular, visual analysis of the cross-section of the component carrier structure 102 may preferably be performed in an automated manner. For example, x / y dimension measurements (e.g., checking for overlay, copper thickness, etc.) may be performed. Specifically, visual inspection may include analysis of certain defects. During the inspection, one or more of the following test targets 116 and specified characteristics may be considered: multilayer overlay; plated via characteristics (e.g., wall characteristics, ground characteristics); surface roughness quality (e.g., surface roughness may be determined corresponding to the Ra scale and / or the Rz scale). Regarding roughness, the roughness value Rz can be used as a standard for the presence of scratches on the exposed surfaces (particularly cross-sections) of the component carrier structure 102, while the roughness value Ra can be used as a standard for the quality of the material removal process (particularly grinding). For example, a quality standard could be that the roughness of the surface of the component carrier structure 102 exposed by grinding and / or polishing should not be greater than the roughness of the grinding disc and / or polishing compound used in the previous material removal stage. If this standard is not met, it can be concluded that an artifact has been introduced by an earlier material removal stage. For example, a measurement resolution of at least 1 µm can be obtained. For example, quality tests can be performed according to IPC-6012, IPC-A-600, etc.

[0098] Referring to box 186, the method may include creating and storing reports with predetermined characteristics. The reports may summarize the quality tests and their conclusions. This ensures proper documentation of the quality tests.

[0099] Referring to box 188, the method may then include archiving the analyzed component carrier structure 102 and quality tests. In particular, this may involve sample storage, electronic document storage, etc.

[0100] As indicated by reference numeral 190 in the attached drawing, the component carrier structure 102 can then be output from the device 100.

[0101] Figure 2An apparatus 100 for performing quality testing on a component carrier structure 102 (implemented herein as a specimen) according to an exemplary embodiment of the present invention is illustrated. As indicated by the circumferential housing 131 of the apparatus 100, the entire quality test can be performed automatically within an enclosed unit.

[0102] exist Figure 2 The upper left side shows a planar view of a flat sheet-like body 160, which can be a panel used to manufacture multiple component carriers (such as printed circuit boards) in a batch process. The panel shown can, for example, be 18 x 24 inches. 2 Or larger in size. The central main area of ​​the panel can be subdivided into multiple arrays 161 (four quarter panels in the illustrated embodiment), each array comprising multiple PCBs. One or more strip test specimens can be formed as component carrier structures 102 within the frame 163 surrounding the component carrier. Advantageously, at least one horizontally extending component carrier structure 102 and at least one vertically extending component carrier structure 102 can be anticipated, thereby enabling quality testing to identify potential structural defects in both vertical directions.

[0103] Referring now more specifically to device 100, an inlet receiving unit 136 is arranged at the inlet 106 of said device 100 and is configured to accommodate multiple component carrier structures 102 in a stacked manner prior to testing. Thus, after separation from the panel-type body 160, the sample-type component carrier structure 102 can be inserted into the inlet receiving unit 136. Alternatively, larger bodies 160 can be stacked within the container-type inlet receiving unit 136, each larger body 160 including at least one component carrier structure 102.

[0104] The robot manipulation unit 104 is configured to manipulate the component carrier structure 102 (optionally still connected within the body 160) along various portions between the inlet 106 and outlet 108 of the device 100. Specifically, the manipulation unit 104 is configured to clamp the component carrier structure 102 (or the entire body 160) to be tested and transfer it from the inlet receiving unit 136 through the inlet 106 to the identification unit 110 described below. More specifically, the manipulation unit 104 includes an inlet manipulation subunit 122 configured to manipulate the component carrier structure 102 between the inlet 106 and the material removal unit 112 described below. Advantageously, the manipulation unit 104 includes one or more robots 120, which may include one or more hexapods, one or more linear robots, one or more articulated arm robots, etc. A six-axis robot or hexapod (in...) Figure 2(Schematably shown with reference numeral 120 in the accompanying drawings) can have shafts equipped with sensors and is adapted to manipulate the component carrier structure 102 within the fully automated equipment 100. Advantageously, a hexapod can be used for material removal processes (particularly grinding processes) performed by the material removal unit 112, because such a hexapod can be mechanically stable and can simultaneously be adapted very precisely to six shafts. (Refer to...) Figure 3 A six-axis robot or hexapod can be used in cross-section station 127 to operate the material removal unit 112 and / or to operate the alignment unit 154. Therefore, the preparation of the part carrier structure 102 by material removal can become highly precise and robust, preventing possible misalignment. Furthermore, linear robots and / or articulated robots (not shown) of the inlet manipulation subunit 122 and / or outlet manipulation subunit 124 of the manipulation unit 104 can be used to manipulate the part carrier structure 102 between the various workstations of the automation equipment 100.

[0105] As previously described, the entry manipulation subunit 122 of the manipulation unit 104 transfers the component carrier structure 102 to the identification unit 110. The latter, identification unit 110, is configured to identify the component carrier structure 102 to which quality testing should be performed. This ensures traceability. More specifically, the identification unit 110 is configured to identify the component carrier structure 102 based on the detection of an identifier 126, which may be physically attached to the component carrier structure 102 or may be an integral part of the component carrier structure 102. For example, such an identifier 126 may be a QR code, barcode, or alphanumeric code that can be read by an optical reader of the identification unit 110. The identifier 126 may also be a transponder such as an RFID (Radio Frequency Identification) tag or an NFC (Near Field Communication) tag. In such embodiments, the identification unit 110 may include a wireless reader configured to wirelessly read the transponder-type identifier 126 for retrieving identification information. To identify the component carrier structure 102 based on its identifier 126 and / or to retrieve additional data (e.g., specific quality test instructions) assigned to the identified component carrier structure 102, the identification unit 110 may access a corresponding database 128. Specifically, the identification unit 110 may be configured to identify the component carrier structure 102 by matching the detected identifier 126 with relevant identification information stored in a specified dataset in the database 128. For example, such a dataset may associate an identification code readable from the identifier 126 with further information about the component carrier structure 102, such as information about its manufacturing history (e.g., batch number, manufacturing date, manufacturing time, etc.). The identification unit 110 may also be configured to retrieve quality test-related information from the database 128, indicating the quality tests to be performed on the identified component carrier structure 102. Such quality test-related information can define the quality tests that should be performed on the identified component carrier structure 102. Different quality tests may be performed on different types of component carrier structures 102.

[0106] In embodiments where the component carrier structure 102 has not yet been separated from the larger body 160 before being introduced into the device 100 through inlet 106, a single-unit 148 (such as a milling machine or laser cutter) may be provided, and this single-unit 148 may be configured to single out the component carrier structure 102 from the panel-type body 160. For example, single-unit 148 may be performed by milling or laser cutting.

[0107] Subsequently, the processed component carrier structure 102 can be transferred by the manipulation unit 102 to the thermal stress exposure unit 150, which is configured to expose the component carrier structure 102 to thermal stress. Preferably, the thermal stress exposure unit 150 is configured to float the component carrier structure 102 on a thermal stress bath, which may include molten solder. This allows the component carrier structure 100 to be subjected to thermal stress.

[0108] The component carrier structure 102 can then be transferred by the aforementioned robot of the manipulation unit 104 or by another robot 120 of the manipulation unit 104 to the material removal unit 112. The latter, material removal unit 112, is configured to remove material from the component carrier structure 102 to expose the interior of the component carrier structure 102 undergoing or being quality tested. Specifically, material removal unit 112 can be configured to remove material from the component carrier structure 102 by grinding, preferably cross-sectional grinding (or alternatively, planar grinding).

[0109] To improve the accuracy of material removal, the component carrier structure 102 can be aligned by an alignment unit 154. This alignment unit 154 can be configured, for example, to determine alignment marks (e.g., drilling) on ​​the component carrier structure 102 based on images it captures. This alignment can be performed before grinding by the material removal unit 112. The alignment unit 154 is assigned to the material removal unit 112 and can be configured to align the component carrier structure 102 prior to the material removal process. Therefore, the alignment performed by the alignment unit 154 is preferably performed before the material removal process performed by the material removal unit 112. Such alignment can thus be incorporated into the material removal process, particularly the grinding process.

[0110] Optionally, a material removal quantification unit 142 may be provided and configured to quantify the amount of material removed from the component carrier structure 102 during grinding. By determining the amount of grinding material, the grinding progress can be achieved, and thus the grinding process can be precisely controlled.

[0111] After grinding, the component carrier structure 102 can be provided to a polishing unit 140, which is configured to polish the exposed surfaces of the component carrier structure 102 after material removal. Instead of removing a large amount of additional material from the component carrier structure 102 (which occurs during grinding), polishing reduces surface roughness and can improve surface quality without excessive material removal. The polished surface can provide more precise information about one or more test targets 116 that will be used as target features to be analyzed below.

[0112] Optionally, the component carrier structure 100 can then be (or alternatively, provided before material removal by the material removal unit 112) provided to the encapsulation unit 144, which is configured to encapsulate the component carrier structure 102 in an encapsulation 146 such that the component carrier structure 102 will subsequently be detected in the encapsulation 146. This encapsulation 146 may be a resin that serves as a stress buffer and simplifies the manipulation of the component carrier structure 102 during subsequent (and / or earlier) analyses.

[0113] However, since the fully automated quality testing equipment 100 can also perform quality testing on the component carrier structure 102 without encapsulation, such encapsulation can be, and possibly even preferably, omitted. Therefore, even the unencapsulated component carrier structure 102 can undergo subsequent processing.

[0114] Subsequently, the (encapsulated or unencapsulated) component carrier structure 102 can be forwarded, for example, by another robot 120 of the manipulation unit 104 to a cleaning unit 152 configured to clean the component carrier structure. For example, the component carrier structure 102 can be rinsed in an ultrasonic bath.

[0115] Another alignment unit 154 can be configured to align the component carrier structure 102 prior to detecting and determining the test target 116 thereon. For this purpose, one or more alignment features of the component carrier structure 102 (e.g., through holes, such as those arranged in corners) can be detected and used to spatially align the component carrier structure 102.

[0116] The aligned component carrier structure 102 can then be imaged. For this purpose, a detection unit 162 can be provided and configured to detect image data of the interior of the component carrier structure 102 (which is simultaneously exposed by the material removal).

[0117] Such image data can be transmitted to a determination unit 114. The determination unit 114 can be configured to determine one or more predetermined test targets 116 of the component carrier structure 102. Test targets 116 can be predetermined features visible in the imaging cross-section of the component carrier structure 102 and can relate to features particularly meaningful for quality assessment. Suitable characteristics or properties of the test targets 116 of the component carrier structure 102 can be the diameter D of the drilled holes 158 (particularly laser-drilled or mechanically drilled holes, which may be filled with plated copper), the distance L between these adjacent drilled holes 158, the thickness d of the electrically conductive layer structure 130 (such as a patterned copper layer) and / or the electrically insulating layer structure 132 (such as a sheet of prepreg), the flatness of such layer structures 130 and / or 132, and the degree of delamination of such layer structures 130 and / or 132 (see reference numeral 133). Figure 2 The aforementioned test target 116 is shown in top view 165 and side view 167, respectively. However, another test target 116 (e.g., in the case of planar grinding) may be a copper wire or multiple copper wires and the space between them.

[0118] Advantageously, the determining unit 114 is configured to process image data to determine or identify a predetermined test target 116. More specifically, the determining unit 114 may be configured to first coarsely determine the predetermined test target 116 based on a first image of the detected component carrier structure 102. Furthermore, the determining unit 114 may be configured to finely determine the predetermined test target 116 based on a second image of the component carrier structure 102 detected after the first image has been detected and after etching the surface of the component carrier structure 102. In an alternative embodiment, a single operation of the determining unit 114 is also possible, wherein the determining unit 114 determines the test target 116 based on a single image. As a basis for this determination, the determining unit 114 may also access a database 128, for example, accessing the test targets 116 that will be considered for the determination.

[0119] Highly advantageously, and as indicated by feedback loop 169, the determination unit 114 can be configured to determine a predetermined test target 116 by iteratively repeating a series of steps including material removal (optionally including polishing and / or cleaning and / or etching), image detection, and image analysis. Such an iterative method (which can terminate when sufficient accuracy is achieved) can significantly improve the reliability of quality testing.

[0120] like Figure 2As further shown, an evaluation unit 118 is provided, configured to evaluate the component carrier structure 102 against the determined test targets 116 to assess the quality of the component carrier structure 102. The evaluation unit 118 can be advantageously configured to assess the quality of the component carrier structure 102 based on the characteristics of the determined test targets 116. More specifically, the evaluation unit 118 can be configured to assess the quality by classifying the component carrier structure 102 into one of a plurality of quality categories. A highly suitable approach would be to automatically categorize each component carrier structure 102 (and / or the designated larger body 160) into one of a set of categories consisting of: "Pass" (indicating that component carrier structure 102 and / or larger body 160 has passed the quality test); "Fail" (indicating that component carrier structure 102 and / or larger body 160 has failed the quality test); and "Requires Further Analysis" (indicating that component carrier structure 102 and / or larger body 160 requires additional quality analysis because evaluation unit 118 cannot yet determine the quality in a meaningful way). In the latter case, component carrier structure 102 can also be passed to a human operator for manual analysis. The described communication and user influence can be exchanged between the user and device 100 via input / output unit 135 communicatively coupled to control unit or processor 156.

[0121] Specifically, the evaluation unit 118 can be configured to evaluate quality by individually, or preferably individually, classifying each attribute or characteristic of each test target 106 of the component carrier structure 102 into one of a plurality of quality categories, particularly one of a set of categories consisting of "pass," "fail," and "requires further analysis." Only minor deviations in non-critical parameters may still allow the component carrier structure 102 to be classified as "pass." Defects may be classified as critical or non-critical based on the type and / or intensity of a specific defect. Such quality testing may include multiple criteria that can be judged individually to enable fine-grained decisions regarding quality and performance.

[0122] To support its evaluation task, evaluation unit 118 may include an artificial intelligence module 134, which is configured to perform evaluations using artificial intelligence, such as neural networks. Training data for training the artificial intelligence module 134 may also be stored in database 128.

[0123] By selectively etching the exposed surfaces of the component carrier structure 102, additional features (such as grain boundaries and plating lines) on the analyzed exposed surfaces of the component carrier structure 102 can become visible. This allows the evaluation unit 118 to more accurately evaluate the characteristics of the test target 116.

[0124] Following the evaluation, the analyzed component carrier structure 102 can be conveyed out of the device 100. For this purpose, the manipulation unit 104 is provided with an outlet manipulation subunit 124 configured to manipulate the component carrier structure 102 by means of at least one additional robot 120, for example, between the material removal unit 112 and the outlet 108. As shown, the device 100 includes an outlet receiving unit 138 (e.g., also container-type) arranged at the outlet 108 and configured to accommodate multiple component carrier structures 102 in a stacked manner after testing. The manipulation unit 104 can be configured to transfer the component carrier structure 102 to be tested through the outlet 108 to the outlet receiving unit 138. This can be accomplished, for example, by another robot 120.

[0125] As indicated by reference numeral 156 in the accompanying drawings, device 100 may include one or more processors or a portion thereof, which may be regarded as a control unit for controlling the operation of device 100 and its aforementioned components during quality testing of component carrier structure 102.

[0126] Advantageously, device 100 can be configured to perform quality testing between inlet 106 and outlet 108 without human intervention. User access can be optionally granted via input / output unit 135. The automation features of device 100 can accelerate and improve the accuracy of quality testing while reducing the human resources required for quality testing. Furthermore, throughput can be increased.

[0127] Figure 3 Details of an apparatus 100 for performing quality testing of a component carrier structure 102 according to an exemplary embodiment of the present invention are shown. Figure 3 The diagram shows... Figure 2 Specific implementation of the components of device 100.

[0128] Input section 125 relates to a portion of device 100 between inlet 106 and material removal. Cross-section station 127 thus corresponds to a subsequent portion of device 100 where the cross-section of component carrier structure 102 is created in a fully automated manner through grinding and subsequent polishing. Output section 129 relates to a portion of device 100 between cross-section station 127 and outlet 108.

[0129] Figure 4 A process flow 200 is shown for a method of performing quality testing on a component carrier structure 102 according to an exemplary embodiment of the present invention.

[0130] Part 202 of process flow 200 relates to specimen-related characteristics of the method according to an exemplary embodiment. As indicated by reference numeral 204, the specimen (or any other component carrier structure 102) may be coded, for example, to enable identification of the specimen (see reference 204). Figure 2 (Described with respect to identification unit 110). As indicated by reference numeral 206, the sample can also be dried. Referring to reference numeral 208, two-dimensional labeling can be performed. When configured according to part 202, cross-sectional analysis of the sample can be performed without embedding it in the encapsulation.

[0131] Referring now to the preparation section 210 and analysis section 212 of process flow 200, the sample taken from the container (e.g., a container with a size of 500 pieces) by the sample input unit 218 can be processed between the start box 214 and the end box 216.

[0132] In preparation section 210, the sample or specimen (as component carrier structure 102) is cut or milled from the larger body 160 of the panel type, see block 220. Referring to box 222, the component carrier structure 102 can then be subjected to thermal stress (e.g., by floating the component carrier structure 102 on a bath of molten solder). Thereafter, the component carrier structure 102 can undergo a material removal process, followed by a surface roughness reduction process. In the corresponding box 224, the component carrier structure 102 can therefore be ground and polished.

[0133] Subsequently, the component carrier structure 102 can be analyzed in section 212. In this case, optical analysis can be performed on the component carrier structure 102, specifically by imaging the component carrier structure 102 (reference box 226). In the subsequent box 228, the component carrier structure 102 can undergo an optional etching process. If etching is not performed, the component carrier structure 102 can proceed to the sample output and archiving box 232, and the processing can be completed. If etching is performed, the component carrier structure 102 can be micro-etched in box 230 and then returned to box 226 for additional optical analysis.

[0134] Figure 5 An automated unit 250 of a device 100 for performing quality testing on a component carrier structure 102 according to an exemplary embodiment of the present invention is shown.

[0135] The component carrier structure 102 is inserted into the automation unit 250 using a sample container, see start box 214 and sample input unit 218. The component carrier structure 102 is then moved to the cutting station indicated by box 220 by a first robot manipulating the inlet manipulation subunit 122 constituting the manipulation unit 104. Thereafter, the component carrier structure 102 undergoes a stress test, see box 222. Subsequently, the component carrier structure 102 may undergo a grinding (and preferably polishing) process, as again indicated by box 224.

[0136] Subsequently, manipulation of the component carrier structure 102 can be accomplished by a second robot constituting the exit manipulation subunit 124 of the manipulation unit 104. In other words, the component carrier structure 102 can be transferred from the inlet manipulation subunit 122 to the outlet manipulation subunit 124, wherein the material removal unit 112 forms the junction between the subunits 122 and 124.

[0137] Subsequently, the component carrier structure 102 may undergo cleaning (see cleaning unit 152), etching (see box 230), and optical analysis (see box 226). If needed or desired, the sequence of grinding, polishing, cleaning, etching, and / or optical analysis may be repeated iteratively once or more.

[0138] Finally, the component carrier structure 102 can be output outside the unit 250 via the output extractor (see box 232).

[0139] It should be noted that the term "comprising" does not exclude other elements or steps, and the singular form does not exclude multiple elements. Similarly, elements described in conjunction with different embodiments can be combined.

[0140] It should also be noted that the reference numerals in the claims should not be interpreted as limiting the scope of the claims.

[0141] The embodiments of the present invention are not limited to the preferred embodiments shown in the accompanying drawings and described above. On the contrary, even in fundamentally different embodiments, it is possible to use the illustrated solutions and various variations according to the principles of the present invention.

Claims

1. An apparatus (100) for performing quality testing on a component carrier structure (102), wherein, The device (100) includes: An operating unit (104) is configured to operate the component carrier structure (102) at least along the portion between the inlet (106) and outlet (108) of the device (100); An identification unit (110) is configured to identify the component carrier structure (102) that has undergone the quality test; Material removal unit (112) is configured to remove material from the component carrier structure (102) to expose the interior of the component carrier structure (102) undergoing the quality test; Determining unit (114), the determining unit (114) being configured to determine at least one predetermined test target (116) of the component carrier structure (102) after the material removal; and An evaluation unit (118) is configured to evaluate the characteristics of the component carrier structure (102) of the determined at least one predetermined test target (116) to assess the quality of the component carrier structure (102).

2. The device (100) according to claim 1, wherein, The manipulation unit (104) includes at least one robot (120).

3. The device (100) according to claim 1, wherein, The manipulation unit (104) includes a multi-axis robot.

4. The device (100) according to any one of claims 1 to 3, wherein, The manipulation unit (104) includes an inlet manipulation subunit (122) configured to manipulate the component carrier structure (102) along a sub-section of the device (100) after the inlet (106).

5. The device (100) according to any one of claims 1 to 3, wherein, The manipulation unit (104) includes an inlet manipulation subunit (122) configured to manipulate the component carrier structure (102) along a sub-section of the device (100) between the inlet (106) and the material removal unit (112).

6. The device (100) according to any one of claims 1 to 3, wherein, The control unit (104) includes an outlet control subunit (124) configured to control the component carrier structure (102) along a sub-section of the device (100) extending to the outlet (108).

7. The device (100) according to any one of claims 1 to 3, wherein, The operating unit (104) includes an outlet operating subunit (124) configured to operate the component carrier structure (102) along a sub-section of the device (100) between the material removal unit (112) and the outlet (108).

8. The device (100) according to any one of claims 1 to 3, wherein, The identification unit (110) is configured to identify the component carrier structure (102) based on the detection of an identifier (126) on and / or in the component carrier structure (102).

9. The device (100) according to claim 8, wherein, The identification unit (110) is configured to identify the component carrier structure (102) by matching the detected identifier (126) with relevant identification information in the database (128).

10. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes at least one of the following features: The identification unit (110) is configured to retrieve information and / or instructions related to quality testing, which instruct the quality test to be performed on the identified component carrier structure (102). The material removal unit (112) is configured to remove material from the component carrier structure (102) by grinding. The material removal unit (112) is configured to remove material from the component carrier structure (102) by one of cross-sectional grinding and planar grinding. The determining unit (114) is configured to process at least one image of the at least one predetermined test target (116) detected after the material removal. Wherein, the at least one predetermined test target (116) of the component carrier structure (102) includes at least one of the following: at least one borehole (158); and at least one of an electrically conductive layer structure (130) and an electrically insulating layer structure (132); The characteristics of the at least one predetermined test target (116) of the component carrier structure (102) include at least one of the following: the diameter (D) of the borehole (158); the distance (L) between adjacent boreholes (158); the width of the electrical conduction trace of the electrical conduction layer structure (130); the distance between adjacent electrical conduction traces of the electrical conduction layer structure (130); the thickness (d) of the electrical conduction layer structure (130) and the electrical insulation layer structure (132); the flatness of the electrical conduction layer structure (130) and the electrical insulation layer structure (132); and the layering of the electrical conduction layer structure (130) and the electrical insulation layer structure (132). The evaluation unit (118) is configured to assess the quality by classifying the component carrier structure (102) into one of a plurality of predetermined quality categories; The evaluation unit (118) includes an artificial intelligence module (134) configured to perform evaluations using artificial intelligence.

11. The device (100) according to any one of claims 1 to 3, wherein, The identification unit (110) is configured to retrieve quality test-related information and / or instructions from a database (128) that indicate the quality test to be performed on the identified component carrier structure (102).

12. The device (100) according to any one of claims 1 to 3, wherein, The evaluation unit (118) is configured to assess the quality by classifying the component carrier structure (102) into one of the quality categories including "pass", "fail" and "requires further analysis".

13. The device (100) according to any one of claims 1 to 3, wherein, The evaluation unit (118) includes an artificial intelligence module (134) configured to perform evaluations using machine learning.

14. The device (100) according to any one of claims 1 to 3, wherein, The evaluation unit (118) includes an artificial intelligence module (134) configured to perform the evaluation using a neural network.

15. The device (100) according to any one of claims 1 to 3. in, The device (100) includes an inlet receiving unit (136) arranged at the inlet (106) and configured to receive a plurality of component carrier structures (102) prior to testing; The manipulation unit (104) is configured to transfer the component carrier structure (102) to be tested from the inlet receiving unit (136) through the inlet (106).

16. The device (100) according to claim 15, wherein, The inlet receiving unit (136) is configured to receive multiple component carrier structures (102) in a stacked manner prior to testing.

17. The device (100) according to claim 15, wherein, The manipulation unit (104) is configured to transfer the component carrier structure (102) to be tested from the inlet receiving unit (136) through the inlet (106) to the identification unit (110).

18. The device (100) according to any one of claims 1 to 3. in, The device (100) includes an outlet receiving unit (138) arranged at the outlet (108) and configured to receive a plurality of component carrier structures (102) after testing. The manipulation unit (104) is configured to transfer the tested component carrier structure (102) through the outlet (108) to the outlet receiving unit (138).

19. The device (100) according to claim 18, wherein, The outlet receiving unit (138) is configured to receive multiple component carrier structures (102) in a stacked manner after testing.

20. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes at least one of the following features: The device (100) includes a polishing unit (140) configured to polish the exposed surfaces of the component carrier structure (102) after material removal; The device (100) includes a material removal quantification unit (142) configured to quantify the amount of material removed from the component carrier structure (102) by the material removal unit (112); The device (100) includes a packaging unit (144) configured to encapsulate the component carrier structure (102) in a package (146) such that the component carrier structure (102) undergoes the determination within the package (146). The determining unit (114) is configured to determine the at least one predetermined test target (116) based on the unencapsulated component carrier structure (102); The device (100) includes a unit (148) configured to individualize the component carrier structure (102) from the large body (160) before supplying the component carrier structure (102) to the material removal unit (112); The device (100) includes a thermal stress exposure unit (150) configured to expose the component carrier structure (102) to thermal stress before supplying the component carrier structure (102) to the determining unit (114); The device (100) includes a cleaning unit (152) configured to clean the component carrier structure (102) after the material removal and before the determination. The device (100) includes an alignment unit (154) configured to align the component carrier structure (102) before the determination and / or before the material removal; The determining unit (114) is configured to determine the at least one predetermined test target (116) in a coarse manner based on a first image of the detected component carrier structure (102), and to determine the at least one predetermined test target (116) in a fine manner based on a detected second image of the component carrier structure (102) detected after the first image is detected.

21. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes a simplification unit (148) configured to simplify the component carrier structure (102) from the panel before supplying the component carrier structure (102) to the material removal unit (112).

22. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes a thermal stress exposure unit (150) configured to expose the component carrier structure (102) to a thermal stress bath.

23. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes a thermal stress exposure unit (150) configured to allow the component carrier structure (102) to float on a thermal stress bath.

24. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes a thermal stress exposure unit (150) configured to allow the component carrier structure (102) to float on molten solder.

25. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes a cleaning unit (152) configured to clean the component carrier structure (102) in an ultrasonic bath after the material removal and before the determination.

26. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes an alignment unit (154) configured to align the component carrier structure (102) before the determination and / or before the material removal, the alignment unit (154) including a multi-axis robot.

27. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes an alignment unit (154) configured to align the component carrier structure (102) based on at least one alignment feature of the component carrier structure (102) before the determination and / or before the material removal.

28. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes an alignment unit (154) configured to align the component carrier structure (102) based on at least one alignment feature of the component carrier structure (102) before the determination and / or before the material removal, the alignment unit (154) including a multi-axis robot.

29. The device (100) according to any one of claims 1 to 3, wherein, The determining unit (114) is configured to determine the at least one predetermined test target (116) in a coarse manner based on a first image of the detected component carrier structure (102), and to determine the at least one predetermined test target (116) in a fine manner based on a detected second image of the component carrier structure (102) after the first image is detected and after etching of the surface of the component carrier structure (102).

30. The device (100) according to any one of claims 1 to 3, wherein, The device (100) includes at least one of the following features: The device (100) includes a detection unit (162) configured to detect image data of the interior of the component carrier structure (102) after the material removal; The determining unit (114) is configured to determine the at least one predetermined test target (116) by iteratively repeating a series of parts including material removal and image detection; The device (100) is configured to perform the quality test between the inlet (106) and the outlet (108) without human intervention.

31. The device (100) according to any one of claims 1 to 3, wherein, The determining unit (114) is configured to determine the at least one predetermined test target (116) by iteratively repeating a series of parts including material removal, image detection and image evaluation.

32. A method for performing quality testing on a component carrier structure (102) by an automated device (100), wherein, The method includes: The component carrier structure (102) is manipulated at least along the portion between the inlet (106) and outlet (108) of the device (100); Identify the component carrier structure (102) that has undergone the aforementioned quality test; The material of the component support structure (102) is removed to expose the interior of the component support structure (102) that has undergone the quality test; After the material removal, at least one predetermined test target (116) of the component support structure (102) is determined; and The characteristics of the at least one predetermined test target (116) of the component carrier structure (102) are evaluated to assess the quality of the component carrier structure (102).

33. The method according to claim 32, wherein, The method includes at least one of the following features: The component carrier structure (102) includes one of the following: a panel comprising a plurality of connected component carrier preforms; an array comprising a plurality of connected component carrier preforms; a component carrier preform; a sample; and a component carrier; The method includes: determining the at least one predetermined test target (116) based on the unencapsulated component carrier structure (102); The method includes performing the quality test between the inlet (106) and the outlet (108) without human intervention.

34. The method according to claim 33, wherein, The component carrier is either a printed circuit board or an integrated circuit substrate.

35. A computer-readable medium, wherein, The computer-readable medium stores a computer program that performs quality tests on the component carrier structure (102) by an automated device (100), the computer program being adapted, when executed by one or more processors (156), to perform and / or control the method according to any one of claims 32 to 34.

36. A program element for performing quality testing on a component carrier structure (102) by an automated device (100), wherein, The program element, when executed by one or more processors (156), is adapted to perform and / or control the method according to any one of claims 32 to 34.

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