Heat sink device

Abstract

A heat sink device is provided for cooling a first set of electronic components (12) and a second set of electronic components (31a, 31b) positioned below the heat sink device. The heat sink device comprises a first cooling element (35) for cooling the first set of electronic components (12), wherein the first cooling element (35) is a first heat sink comprising a base (17) and a holding wall (7) together defining a volume for holding a liquid coolant, and a second cooling element (32a, 32b) for cooling the second set of electronic components (31a, 31b), the second cooling element (32a, 32b) being configured to distribute the liquid coolant over the second set of electronic components (31a, 31b). The first cooling element (35) and the second cooling element (32a, 32b) are arranged such that the liquid coolant overflows from the volume of the first cooling element (35) to the second cooling element (32a, 32b) for distribution over the second set of electronic components (31a, 31b).

Description

Technical Field

[0001] This disclosure relates to a heat sink device for cooling electronic components and a cooling module including such a heat sink device. Background Technology

[0002] Various types of electrical components generate heat during operation. In particular, computer components such as motherboards, central processing units (CPUs), and memory modules can dissipate significant amounts of heat during use. Heating electrical components to high temperatures can lead to damage, impaired performance, and / or safety hazards. Therefore, considerable effort has been made to find efficient, high-performance systems for effectively and safely cooling electrical components.

[0003] Cooling systems that utilize liquid cooling are known to exist. Although various liquid cooling components have been demonstrated, electrical components are typically immersed in or at least in contact with a liquid coolant to provide a large surface area for heat exchange between the heat-generating electrical components and the coolant.

[0004] It is known to use front-to-back (or back-to-front) forced air fans to cool thin vertical components (e.g., heat sink fins) within electronic systems. It is also known to position the fins of a heat sink mounted on top of a board component such that the fins are above any scale line of the liquid coolant. Without forced air, such a heat sink therefore lacks a method for effectively dissipating heat. In this case, the component the heat sink is intended to cool may be seated in a liquid coolant, where the peripheral surface of the component is cooled by the dielectric coolant, rather than the hot central region of the chip, which radiates its heat directly into the heat sink. Such systems can be inefficient, and mechanical components such as fans can be prone to failure. Other examples of vertically mounted electronic components that are not always satisfactorily cooled include dual in-line memory modules (DIMMs) and M.2.

[0005] Therefore, known liquid cooling solutions can be complex and not always efficient. Thus, the object of this disclosure is to provide an improved apparatus for cooling electronic devices using liquid coolants in a more efficient and effective manner.

[0006] WO-2019 / 048864 describes heat sinks and heat sink assemblies for use in electronic devices. Summary of the Invention

[0007] In this context and according to the first aspect, a radiator device according to claim 1 is provided.

[0008] This disclosure generally seeks to provide a heat sink arrangement for providing more efficient cooling of electronic components. This is achieved by providing a heat sink as a first cooling element for cooling a first group of electronic devices and one or more additional cooling elements configured to distribute coolant on one or more additional groups of electronic devices. For example, the heat sink may be disposed on (e.g., mounted) a central electronic component, such as a central processing unit (CPU), and one or more additional cooling elements may be positioned above adjacent groups of DIMMs to distribute coolant on the DIMMs. For this purpose, one or more additional cooling elements may be trays, reservoirs, or any general volume having one or more openings in their base for distributing coolant on components below. The openings may be of any size and shape suitable for controlling the flow rate of the coolant (e.g., slits, circular holes, triangular holes, square holes, cross-shaped holes, and / or star-shaped holes). The desired coolant flow rate will depend on the temperature and size of the component to be cooled.

[0009] An advantageous feature of this disclosure is the provision of one or more additional cooling elements that receive liquid coolant overflowing from a first radiator. This form of fluid connection eliminates or reduces the need for piping and pumps, thereby reducing complexity and increasing ease of assembly. Furthermore, in known systems, coolant overflowing from an upstream radiator is wasted elsewhere; therefore, using the coolant in downstream secondary cooling elements reduces coolant waste. Additionally, the apparatus of this disclosure provides a compact and efficient arrangement for transferring coolant between multiple cooling elements. Securing the cooling elements together also facilitates positioning some of the cooling elements directly above the component to be cooled, allowing the component to be cooled by coolant falling under gravity, without requiring the cooling elements to be physically attached to the component. For this purpose, the radiator can have a greater depth than the cooling elements, such that when the radiator is mounted on a first group of electronic components (which may be a single component, such as a CPU), the cooling elements are effectively suspended above different groups of components (e.g., adjacent DIMMs or M.2s). This allows for improved cooling of precision and / or thin components that do not allow for easy attachment to conventional heat sinks.

[0010] To achieve an overflow connection between the cooling element and the radiator through which the coolant passes, the radiator and cooling element can be fixed together along their edges. In this way, the upper edges of the radiator and cooling element can be aligned and form a weir. Advantageously, the cooling element can be movable and / or deformable, exposing the components below and allowing access for maintenance.

[0011] The cooling element of this disclosure can provide improved coolant distribution by means of an array of openings in its base at a different height than the rest of the base. In this way, raised openings can be formed, surrounded by channels at a lower height. This means that a certain level of coolant is required before the coolant passes through the base of the cooling element when it enters. Therefore, approximately equal amounts of coolant can be distributed to different electronic components at approximately the same time, thus providing efficient and effective cooling. Other structures for distributing coolant, such as ridges, baffles, and / or protrusions, can be used. In the context of this disclosure, any component that contributes to the cooling of other components can be considered a cooling element. Any device comprising at least one heat sink can be considered a heat sink device.

[0012] Furthermore, the cooling elements disclosed herein can be provided as stand-alone components or as part of a cooling module to achieve advantageous effects. For example, a cooling module for cooling a group of electronic components is provided, the cooling module comprising: a container configured to hold the group of electronic components within the container; and a cooling element configured to distribute a liquid coolant onto the group of electronic components for cooling the group of electronic components. The cooling element can be any of the cooling elements described herein that have an opening in their base. For example, the cooling element can be a perforated tray. Alternatively, the cooling element can be a cooling tube with an opening in its lower side. Such perforated trays and cooling tubes can be additionally configured as stand-alone components independent of the cooling module. The cooling module can include the group of electronic components, or it can simply be configured to hold the group of electronic components. The cooling element can be configured for attachment to an adjacent cooling element. For example, one side of the cooling element can include an attachment mechanism for securing the cooling element (e.g., an opening through which a screw can pass) to an adjacent cooling element.

[0013] With respect to any and all aspects disclosed herein, features for methods of manufacture and / or operation may be additionally provided, corresponding to features of any or more of the disclosed radiator assembly, cooling element, and / or cooling module. Combinations of aspects are also possible. Furthermore, combinations of specific features of one aspect with radiators, cooling elements, and / or cooling modules of another aspect are disclosed, wherein such combinations are compatible. Specific examples of such combinations are presented herein by way of example. Attached Figure Description

[0014] This disclosure can be practiced in a variety of ways, and preferred embodiments will now be described by way of example only and with reference to the accompanying drawings, in which:

[0015] Figure 1A known cooling module in which embodiments of the present disclosure can be used is shown;

[0016] Figure 2 Depicting Figure 1 Exploded view of the cooling module;

[0017] Figure 3 An example of a known heat sink used in conjunction with embodiments of this disclosure is illustrated;

[0018] Figure 4 Depicting Figure 3 An exploded view of the radiator;

[0019] Figure 5 A perspective view of a radiator device according to a first embodiment is depicted;

[0020] Figure 6 A plan view of the radiator device according to the first embodiment is shown;

[0021] Figure 7 A side view of the radiator assembly according to the first embodiment is depicted; and

[0022] Figure 8 A perspective view of a cooling device according to a second embodiment is depicted. Detailed Implementation

[0023] Reference Figure 1 The diagram illustrates a cooling module (sometimes referred to as a "chassis") in which embodiments of the present disclosure can be implemented. It should also be considered that... Figure 2 ,exist Figure 2 It is described Figure 1 An exploded view of the cooling module. Figures 1 to 4 With WO'864 Figures 1 to 4 Correspondingly, this is because the principles of this disclosure can be implemented in the cooling module described in WO'864. The cooling module 100 includes a container 110 (shown uncovered) that houses components 12 that generate relatively high temperatures and components 12 that generate relatively low temperatures. Both the low-temperature component 10 and the high-temperature component 12 are mounted on a circuit board 15. Figure 1 and Figure 2 Two identical circuit boards 15 are shown inside container 110. Heat sink 1 is mounted on high-temperature component 12.

[0024] Container 110 is filled in operation with a dielectric liquid coolant (not shown), which may be referred to as the primary coolant. The liquid coolant is non-conductive but generally thermally conductive and can transport heat by conduction and / or convection. The amount of liquid coolant inside container 110 is sufficient to cover the cryogenic component 10 or to at least partially immerse the cryogenic component 10, but not necessarily to completely immerse it. The level of the liquid coolant used in operation is discussed below. Pump 11 flows the liquid coolant through conduit 5 and proceeds to heat exchanger 19. Heat exchanger 19 receives secondary liquid coolant (typically water or water-based) and transfers heat from the liquid coolant in container 110 to the secondary liquid coolant. The secondary liquid coolant is supplied to and discharged from heat exchanger 19 via interface connection 18. Pump 11 causes the cooled primary liquid coolant to exit heat exchanger 19 through conduit 5 and be discharged through nozzle 2. Pipe 5 and nozzle 2 are positioned to allow coolant to flow directly onto radiator 1.

[0025] The cooling module 100 is typically a rack-mount module, and the electronic components within the container 110 are preferably at least a portion of a computer server circuitry, including, for example, a motherboard and associated components. Therefore, the cooling module 1 can have a height of one rack unit (1U, corresponding to 44.45 mm) or an integer number of rack units. Some advantageous implementations of this disclosure provide a cooling module with a height of 2U (88.9 mm). It will be understood, of course, that the cooling module 100 can have a variety of different sizes. For example, a 1U rack is typically configured as a 19-inch rack with a front panel 19 inches (482.6 mm) wide. However, other sizes are also possible, such as 21-inch (533.4 mm) or 23-inch (584.2 mm) racks. Standard rack sizes are also defined by the Open Computing Project (OCP), and this disclosure can be used in any known standard OCP rack. Furthermore, this disclosure can be used in any non-standard rack. It will also be understood that this disclosure can be implemented in a cooling module configured as a “blade” (i.e., a vertical rather than a horizontal enclosure); the shape of the container will not significantly affect the function of the cooling element described herein.

[0026] Cooling module 100 can be configured for assembly or mounting in a corresponding rack that accommodates multiple such cooling modules (one, some, or all of the multiple cooling modules may have an internal configuration different from that of cooling module 100 disclosed herein). In this configuration, secondary liquid coolant can be shared among the cooling modules in series or parallel arrangement. A pressurization chamber and / or manifold can be provided in the rack to allow this. For efficiency and safety, other components (e.g., power regulator, one or more pumps, or similar devices) can also be housed in the rack.

[0027] Reference Figure 3 The illustration shows a known heat sink that can be used in embodiments of this disclosure. (Refer to...) Figure 4 , showed Figure 3 An exploded view of the heatsink. This is... Figure 1 and Figure 2 An enlarged view of the heat sink is shown. The heat sink 1 includes: a base consisting of a mounting member 16 and a planar substrate 17 fixed to the mounting member 16; a retaining wall 7 attached to the planar substrate 17; a protrusion (shown as a pin) 6; and a fixing screw 13 that attaches the substrate 17 to the mounting member 16. In this way, the planar substrate 17 sits directly on the high-temperature component 12 and transfers heat from the high-temperature component 12 to a volume defined by the planar substrate 17 and the retaining wall 7, in which the protrusion 6 is provided. Thus, in general, a volume is provided for holding or retaining liquid coolant relative to the heat-generating electronic device, such as a bathtub or reservoir. Coolant can then be pumped from a low level within the cooling module into a higher level volume of the heat sink. Many different structures and embodiments of such heat sinks and / or cooling modules according to this design are discussed herein and in WO'864, the entire contents of which are incorporated herein by reference.

[0028] Radiator 1 can be made from a single component, for example by die casting; lost-wax casting; metal injection molding (MIM); additive manufacturing; or forging. Radiator 1 can also be machined or turned from a single piece of material. Radiator 1 can be formed from any thermally conductive material, such as metal or other heat conductors. Some examples may include aluminum, copper, or carbon. Radiator 1 may include two (or three or more) different materials. Additionally or alternatively, the radiator may include a mixture of materials (e.g., a mixture of copper and aluminum).

[0029] exist Figure 3 and Figure 4 The diagram also shows a conduit 5 and a nozzle 2. Liquid coolant is delivered to the radiator 1 via the nozzle 2. The nozzle 2 is arranged to guide the coolant in a plane perpendicular to the substrate 17. This forces the liquid coolant to be sprayed or flow directly into the volume defined by the substrate 17 of the radiator 1 and the retaining wall 7. Therefore, heat dissipation is improved. This is particularly improved compared to systems where, for example, in an air-cooling system, the coolant is guided to flow through the radiator in a direction parallel to the plane of the radiator substrate.

[0030] exist Figure 3 and Figure 4In the example shown, nozzle 2 delivers coolant directly to the center of the volume defined by substrate 17 and retaining wall 7. In this example, the center of the volume corresponds to the hottest portion of the region of substrate 17, which is adjacent to (and directly on) the high-temperature component 12. This provides counterflow, allowing the coldest coolant to be directed to contact the hottest area of ​​the radiator. The coolant then moves radially away from the hottest portion.

[0031] Nozzle 2 is designed with a push-fit connector 3 to pipe 5. This requires no tools, so nozzle 2 can be directly fitted and removed. Therefore, circuit board 15, which may be a computer motherboard, and all components can be easily and quickly replaced. The nozzle is also provided with a grounding point 4, which can be connected to ground or a ground point to eliminate static electricity accumulated in pipe 5 and nozzle 2.

[0032] In summary, Figures 1 to 4 The heat sink 1 provides a first cooling element for cooling a first group of electronic components. The first cooling element is a heat sink comprising a base and a retaining wall, the base and retaining wall together defining a volume for retaining liquid coolant. The first cooling element may be configured to be mounted on top of a heat transfer area (e.g., the surface of a CPU or a baseboard management controller, BMC) of the first group of electronic components (which may be a single component or multiple components), and preferably, the base of the first cooling element is configured to be mounted on top of the heat transfer area of ​​the first group of electronic components. This allows for efficient cooling of the first group of electronic components.

[0033] As is known from, for example, WO'864 Figures 1 to 4 The cooling modules, containers, and radiator assemblies shown and described above, the entire contents of WO'864, are incorporated herein by reference. Embodiments of this disclosure seek to provide modifications and improvements to the apparatuses and systems disclosed in WO'864. For this purpose, the radiator assemblies of embodiments of this disclosure can be implemented in any of the apparatuses disclosed in WO'864.

[0034] Turning Figures 5 to 7 The image shows a radiator device according to the first embodiment. Figures 5 to 7 Different views relating to the same radiator assembly. The radiator assembly includes a first cooling element 35, which is... Figures 1 to 4 The radiator is roughly similar to radiator 1. The first cooling element 35 is supplied by pipe 36, which is similar to... Figures 1 to 4 Pipe 5. The first cooling element 35 is configured for attachment to a first set of electronic components (the first set of electronic components can be a single component, such as a CPU or BMC, or multiple electronic components), similar to Figures 1 to 4 The heat sink 1 is configured to be mounted on the electronic component 12.

[0035] exist Figures 1 to 4 In this configuration, each heat sink 1 is positioned on top of the corresponding electronic component 12. Figure 5 The first cooling element 35 can be configured to cool a single electronic component (like...) Figures 1 to 4 (The same as 12 electronic components) or multiple electronic components.

[0036] exist Figures 1 to 4 In the middle, symmetrically arranged on either side of the electronic component 12 are groups of thin, vertically mounted components 31a and 31b, which are approximately parallel. Figures 1 to 4 In this configuration, each radiator 1 has two sets of three vertically mounted components on the opposite side of the radiator 1 (i.e., a total of six vertically mounted components). Figures 1 to 4 In this implementation, these components are cooled primarily through heat exchange between their surfaces and the surrounding atmosphere, and through a coolant circulating within the base of the container 110. Figure 5 Similar vertically mounted components 31a and 31b are depicted, and these components are connected to... Figures 1 to 4 The described device is partially cooled, similar to or the same as the device described. However, in Figure 5 The diagram shows two groups of six vertically mounted electronic components 31. Furthermore, the vertically mounted components 31 are cooled by additional devices, as will be discussed in further detail below. The two groups of six vertically mounted electronic components can be considered as a second group of electronic components 31a and a third group of electronic components 31b, which correspond to a second cooling element 32a and a third cooling element 32b, respectively.

[0037] The first embodiment of this disclosure provides a second cooling element 32a and a third cooling element 32b adjacent to the first cooling element 35. Figure 5 In the diagram, the second cooling element 32a and the third cooling element 32b are shown as trays (receiving portions for liquids with generally flat bases and upright retaining walls, without a cover or top surface) with openings or orifices in their bases to allow liquid coolant to pass through the bases of the second cooling element 32a and the third cooling element 32b. The second cooling element 32a and the third cooling element 32b are disposed on and fixed to either side of the first cooling element 35.

[0038] Therefore, in general, the second cooling element may extend along the edge of the first cooling element. The second cooling element may also be described as being fixed adjacent to and / or laterally to the first radiator. The first and second radiators may be considered to share a boundary or edge. Furthermore, in normal use, the bases of the first and second radiators are generally parallel. The first and second cooling elements are preferably fixed to each other (i.e., directly, meaning physical contact, or indirectly, for example, by means of a physical connection through an intermediate component). The second cooling element may be (directly or indirectly) fixed to the upper edge of the retaining wall of the first cooling element. In this way, the boundary between the first and second cooling elements can act as a weir, as will be described in more detail below. Due to the similarity between the second and third cooling elements, the geometric relationship between the first and second cooling elements can be substantially the same as the geometric relationship between the first and third cooling elements.

[0039] The second cooling element 32a and the third cooling element 32b can be informally described as “drip trays” due to the slow passage or dripping of coolant through the openings. The second cooling element 32a and the third cooling element 32b are adapted to provide “liquid film cooling” to a vertically mounted group of plate components 31a and 31b located directly below the second cooling element 32a and the third cooling element 32b. Therefore, the second group of electronic components 31a and / or the third group of electronic components 31b each includes one or more electronic components respectively positioned below the second and / or third heat sink. It will be understood that “below” in the context of this disclosure can be considered as “below” when the system is in normal use. During normal use, gravity exerts a force on the liquid coolant. This force typically originates from above and points along the direction of the retaining wall towards the base of the first cooling element 35, the second cooling element 32a, and the third cooling element 32b.

[0040] In the context of this disclosure, liquid film cooling can be considered a method of cooling electronic components in which a thin film of liquid coolant is allowed to fall onto the electronic components at a rate and amount that ensures the surface of the component is covered by the thin layer of coolant. This method utilizes the surface tension of the coolant to ensure that the coolant substantially adheres to the component (e.g., DIMM) as it flows down along the surface of these components. This contrasts with allowing coolant to drip slowly onto components located below, resulting in the component being cooled intermittently only as the coolant drips onto the surface. Liquid film cooling also contrasts with immersing or pouring large amounts of coolant into or onto components, which can be relatively wasteful. It also differs from spraying coolant from the side onto vertically mounted electronic components, which is difficult when cooling an array of closely packed components is required. Therefore, liquid film cooling is more efficient and effective than some known cooling techniques.

[0041] The second cooling element 32a and the third cooling element 32b are configured to cool various types of thin, vertically mounted groups of components 31a and 31b, such as dual in-line memory module (DIMM) boards, or the fins of conventional aluminum heat sinks mounted on components such as BMC chips on any server motherboard cooled by the liquid film cooling of this disclosure. Cooling is achieved by allowing the dielectric liquid coolant to pass through (e.g., drip through) the bases of the second cooling element 32a and the third cooling element 32b via openings 40 in the bases of the second cooling element 32a and the third cooling element 32b, such that the components 31a and 31b located below are contacted by the coolant and thus cooled.

[0042] Then turn Figure 6 Provided Figure 5 A plan view of the radiator assembly. Figure 6 In the image, the openings 40 in the bases of the second cooling element 32a and the third cooling element 32b can be seen more clearly. This is achieved through observation... Figure 6It will be apparent that the second cooling element 32a and the third cooling element 32b are designed to supply coolant at a set (e.g., predetermined) rate to the lowered second set of components 31a and 31b. Most preferably, the openings 40 in the bases of the second cooling element 32a and the third cooling element 32b are configured as elongated slits. These slits serve as perforations in the second cooling element 32a and the third cooling element 32b, such that the second cooling element 32a and the third cooling element 32b can be described, alternatively, as trays (or simply "perforated drip trays") for containing liquid coolant and having perforations in their bases to allow coolant to drip through the tray. When the openings 40 are configured as slits, the set rate of coolant flow is achieved by controlling the specific dimensions (length and width) and number of such slit openings 40. Figure 6 In this configuration, the openings 40 in each of the second cooling element 32a and the third cooling element 32b are arranged in a regular 6×6 array, which corresponds to the arrangement of 6×1 groups of electronic components 31a and 31b mounted below the second cooling element 32a and the third cooling element 32b. Figure 6 As can be seen, the six elongated slits in the base of the second cooling element 32a and the third cooling element 32b are aligned along the length of the individual DIMM to provide effective cooling for the individual DIMM.

[0043] Therefore, returning to the previously used general terminology, the base of the second cooling element may include one or more openings, preferably elongated slits (but elongated slits can have various other shapes, such as circular holes, triangular holes, square holes, cross-shaped holes, and / or star-shaped holes), for distributing liquid coolant onto corresponding one or more electronic components of the second set of electronic components. Thus, coolant can be distributed to components positioned below such a cooling element, even when it is difficult to attach conventional heat sinks to those components. Slits are preferred because they allow for highly controlled flow rates by controlling the geometry of the slits. The openings or slits can advantageously be sized to correspond to the second set of electronic components. When a third cooling element is provided, the third cooling element may have substantially the same form and openings as the second cooling element.

[0044] Figures 5 to 7The preferred arrangement is shown by way of example only. In this embodiment, two sets of six DIMMs 31a and 31b are depicted on each side of the CPU 35, giving a total of 12 DIMMs. The DIMMs are cooled through elongated slits 40. Each DIMM uses 8W of power, and therefore the total DIMM power is 96W. To achieve optimal cooling for this particular arrangement, the total flow rate of liquid coolant for the 12 DIMMs (i.e., coolant distributed on both sides of the CPU 35) is preferably 1.9 L / min. To achieve this, a slit width of 0.75 mm is used, although slit widths from 0.5 mm to 1 mm can be used to provide efficient cooling. If a width less than 0.5 mm is used, in this case with a particular coolant, the coolant will drip rather than pour continuously (at typical temperatures reached by standard coolant at these rated power and coolant flow rates in the system shown in this embodiment). Future generations of DIMMs are expected to use 24W of power each, thus increasing the flow rate (and therefore the slit size) to compensate for the higher temperatures in such systems. Therefore, it will be understood that the specific size and shape of the openings can vary depending on the component to be cooled, and those skilled in the art will be able to adjust the size and shape of the openings to achieve the desired flow rate. Therefore, the invention is not limited to the shapes and sizes shown and described herein.

[0045] Now refer to Figure 7 , showed Figure 5 and Figure 6 A side view of the radiator assembly. Figure 7As can be seen, the second cooling element 32a and the third cooling element 32b are further designed to allow the dielectric liquid coolant to fill the cooling elements 32a and 32b to a set level indicated by the filling level 43. In use, as the liquid coolant enters the second cooling element 32a and the third cooling element 32b, the second cooling element 32a and the third cooling element 32b are gradually filled to the filling level 43. Once this level is exceeded, the coolant can flow through the opening 40 to the group of vertically oriented components 31a and 31b located below. Advantageously, this ensures that all components covered by the second cooling element 32a and the third cooling element 32b receive approximately equal amounts of coolant, and ensures that the distribution of coolant begins at approximately the same time (i.e., when the second cooling element 32a and the third cooling element 32b are filled to the filling level 43 with coolant) through each opening 40. This is achieved by raising the surface of the opening 40 such that the base includes a raised portion 44 in which the opening 40 is formed. This creates intersecting shadows of the longitudinal and latitudinal channels 41 (and these channels 41 can be considered to include multiple channel portions, which may or may not extend to the edges of the second cooling element 32a and the third cooling element 32b), which in Figure 6 This is best seen in the image. These channels 41 allow the dielectric to be efficiently and effectively distributed on the bases of the second cooling element 32a and the third cooling element 32b.

[0046] In summary, preferably, one or more openings are raised relative to the base of the second cooling element (i.e., raised upwards relative to the direction of gravity during normal use), preferably wherein one or more openings are at approximately the same height above the base of the second cooling element. It is also preferred that the base of the second cooling element includes a structure for dispersing liquid coolant on the base of the second cooling element. This structure can be any structure suitable for guiding the coolant in a manner that ensures uniform distribution of the coolant. For example, the structure may include any combination of: one or more channels (or channel portions); one or more ridges; one or more baffles; and / or one or more protrusions (e.g., upright portions). The structure may surround one or more openings and / or the structure may include multiple longitudinal channel portions and multiple latitudinal channel portions (e.g., vertical or non-parallel channel portions, which may be parallel to the wall of the cooling element or at any angle to the wall of the cooling element) (the multiple longitudinal channel portions and multiple latitudinal channel portions may be joined together to form a single channel or may be different channel portions or recesses in the base), the multiple longitudinal channel portions and multiple latitudinal channel portions (partially or entirely) extending through the base of the second cooling element (e.g., forming interlacing lines around the array of openings). In this way, the flow of coolant through the second cooling element can be controlled such that each opening distributes approximately the same amount of coolant on the second set of electronic components at approximately the same time, thereby ensuring a uniform and efficient degree of cooling. It will be understood again that when a third cooling element is provided, the third cooling element may have approximately the same form and openings as the second cooling element, and therefore the above description of the second cooling element also applies to the third cooling element.

[0047] It should be noted that, Figure 7 In this configuration, the depths of the second cooling element 32a and the third cooling element 32b (i.e., the spatial extent of the elements in the direction of gravity when the system is oriented for normal use) are substantially smaller than the depth of the first cooling element 35. In practice, the difference between their depths is preferably on the order of the mounting height of a DIMM or M.2. When the first heat sink 35 is mounted on electronic components (e.g., Figures 1 to 4When the first cooling element 32a and the third cooling element 32b are mounted on the component 12), this allows the second cooling element 32a and the third cooling element 32b to be suspended above the component to be cooled—in this case, the vertically mounted components 31a and 31b—so that the second cooling element 32a and the third cooling element 32b distribute the coolant over the vertically mounted components 31a and 31b. Therefore, in summary, it is advantageous that the depth of the first cooling element is greater than the depth of the second (and third, if present) cooling elements. This ensures that there is space below the second connecting element for the component to be cooled to receive sufficient coolant, thereby improving performance.

[0048] The second cooling element 32a and the third cooling element 32b are configured to allow servicing of the lowered second group of components 31a and the third group of components 31b. For example, the second cooling element 32a and the third cooling element 32b are designed to be easily moved and / or easily removed to allow access to the lowered second group of electronic components 31a and the third group of electronic components 31b (which are a group of DIMM boards in this embodiment) or other vertical components such as M.2 for servicing. In this case, such as Figure 5 As shown, the second cooling element 32a and the third cooling element 32b are attached to the bracket support frame 34.

[0049] exist Figure 5 In this configuration, the bracket support frame 34 is secured within the first cooling element 35 by means of a capture-type wing screw 33 (in this case, the first cooling element 35 is an Iceotope (RTM) CPU bathtub-type heatsink, which is a heatsink having a volume, for example, similar to a bathtub or reservoir, for holding or retaining liquid coolant against heat-generating electronic components). It will be understood that access to the group of components 31a and 31b located below the second cooling element 32a and the third cooling element 32b can alternatively incorporate a hinge / pin or movable hinge mechanism detached from a similar bracket structure. This would allow the second cooling element 32a and the third cooling element 32b to be temporarily hinged away from the group of components 31a and 31b, so that the group of components 31a and 31b can be accessed and repaired and / or replaced.

[0050] exist Figures 5 to 7 In this design, cooling element 35 is a tub-type radiator. A bracket support frame 34 is a component (preferably made of plastic, but various other materials may be used) that sits on the upper edge of the tub-type radiator 35, while cooling elements 32a and 32b are components attached to the bracket support frame 34 (again preferably made of plastic, but other materials may be used). Therefore, the bracket support frame 34 provides an attachment mechanism for allowing cooling elements 32a and 32b to be coupled (e.g., modified) to the tub-type radiator 35.

[0051] It will be understood that cooling elements 32a and 32b may also be integrally formed with a tub-type radiator. For example, the tub-type radiator 35 and cooling elements 32a and 32b may share a single wall. Within this shared wall, openings (or multiple openings) may be provided to allow coolant to flow from the tub-type radiator into the cooling elements. Although in this case the coolant does not flow past the uppermost edge of the retaining wall of the first cooling element, it will be understood that the coolant must reach a certain depth in the tub-type radiator before it can flow through the openings (or multiple openings) in the shared wall and enter the adjacent cooling element. The depth that the coolant must reach is essentially the height of the lowest portion (i.e., the bottom edge) of the openings (or multiple openings) in the shared wall. Therefore, the coolant flowing through the openings in the shared wall must flow past the bottom edge of the openings (or multiple openings), and the coolant flowing in this way will therefore be considered as a liquid coolant that overflows from the volume of the first cooling element to the second cooling element for distribution above the second set of electronic components in the general language used throughout this disclosure. Therefore, in the previously used general terminology, in the radiator device of this disclosure, the first cooling element and the second cooling element may share a wall including at least one opening to allow water to overflow from the first cooling element into the second cooling element through at least one opening.

[0052] Therefore, in summary, in this disclosure, the second cooling element is preferably secured in a releasable manner (e.g., allowing the second cooling element to be completely removed) and / or a pivotable manner (e.g., allowing the second cooling element to be rotated to expose the second set of electronic components) to allow access to the second set of electronic components. This provides easy maintenance and / or replacement of the components. Examples of suitable releasable and / or pivotable securing mechanisms include snap-fit ​​screws, hinges, and movable hinges. Other examples will be apparent to those skilled in the art. This approach is advantageous because the second set of electronic components may comprise an array (e.g., a 3×3 array) of components located below the second cooling element. Even when the second heat sink is secured in place, the components of the second set located at the periphery of the 3×3 array can be accessible. However, the central components of such a 3×3 array may be covered by the second cooling element and therefore difficult to replace and / or maintain. By configuring the second heat sink to allow it to be removed, maintainability is improved. When a third cooling element is provided, the third cooling element can be secured in the same manner as the second cooling element.

[0053] Additionally or alternatively, the second cooling element 32a and / or the third cooling element 32b may be formed of a flexible material, such as an elastically deformable material, which is compliant and can be temporarily bent out to allow access to the second set of components 31a and the third set of components 31b. Many materials suitable for this purpose will be apparent to those skilled in the art, including materials of various flexible polymer types (e.g., rubber). Thus, in general, the second cooling element and / or the third cooling element may be movable and / or elastically deformable to allow access to the second set of electronic components and / or the third set of electronic components. Similarly, this provides easy access for maintenance, facilitating the repair and / or replacement of components. In other words, the second cooling element and / or the third cooling element may be movable and / or elastically deformable from a first configuration to a second configuration in which the base of the second cooling element and / or the third cooling element is generally parallel to the base of the first cooling element, and in the second configuration, the second electronic components and / or the third set of electronic components are accessible (i.e., exposed for maintenance). The degree of deformation or rotation required to access the second and / or third set of electronic components will depend on the geometry of the components located on the motherboard. However, it is generally advantageous that the second and / or third cooling elements are deformable, pivotable, or movable such that their base (or at least a portion thereof) is oriented at an angle to the horizontal plane at one of the following (in normal use): at least 15°; at least 30°; at least 45°; at least 60°; at least 75°; or greater than 90°.

[0054] It is common for the number of DIMM slots to change over time. For example, boards are typically able to accommodate more DIMMs than actually installed, because usually only high-end boards utilize all available DIMM slots, leaving none unused. For instance, in many systems, only 3 out of every 6 DIMM slots on one side of the CPU are occupied. However, such systems are often upgraded over time (e.g., by adding additional DIMMs), and this disclosure makes such upgrades relatively simple. Another advantage of this disclosure is that the same cooling element can be used for a variety of different numbers of DIMMs (or other electronic components). The cooling element of this disclosure can have a certain number of openings, and this number can be greater than the number of electronic components located below. However, this is not more wasteful than existing tub-type heat sinks, because the combination of the first and second cooling elements recovers coolant that would otherwise be wasted in known systems. In other words, in known systems, coolant overflowing from the first cooling element is generally not used to further cool other electronic components, so even when the number of openings in the cooling element exceeds the number of electronic components located below, no more coolant is wasted than when the first cooling element is used alone. Therefore, allowing coolant to pass through openings in the cooling element that are not above the electronic components does not waste more coolant than in known systems where coolant overflows and flows down the side of the radiator to the base of the cooling module.

[0055] The aforementioned second cooling element 32a and third cooling element 32b provide an efficient means of cooling the second group of electronic components 31a and the third group of electronic components 31b disposed below. The second cooling element 32a and third cooling element 32b are adaptable to various component layouts because they can be sized to accommodate any number and / or any layout of the groups of vertical components 31a and 31b located on the server motherboard. DIMMs are also typically located on either side of the CPU, such as... Figures 1 to 7 As shown. Therefore, in this embodiment, the attachment method of these examples is a central support frame 34 mounted within a first cooling element 35, which is a tub-type radiator suitable for attachment to such a support frame 34. The support frame 34 is positioned at the top of the retaining wall of the first cooling element 35 to allow the second cooling element 32a and the third cooling element 32b to be attached adjacent to the first cooling element 35.

[0056] Therefore, returning to the previously used general terminology, the second cooling element can be attached to a support frame that spans and / or at least partially surrounds the volume of the first cooling element. The support frame can be configured to sit on top of and / or be attached to the retaining wall of the first cooling element. The support frame can alternatively be described as bridging a retaining wall located on one side of the first radiator to a retaining wall located on the opposite side of the first radiator. The support frame can provide a dual function: allowing the attachment of the second cooling element (and preferably attaching it in a manner that allows access to the components below) while also enhancing the structural integrity of the first radiator. If present, a third cooling element can be attached in the same manner as the second cooling element.

[0057] As previously described, the second cooling element 32a and the third cooling element 32b can be advantageously used in conjunction with the Iceotope (RTM) CPU bath-type heatsink 35. In this context, dielectric coolant can be supplied directly from the heatsink 35 to the second cooling element 32a and the third cooling element 32b. Figures 5 to 7 In the first embodiment shown, coolant enters the first cooling element 35 via pipe 36. A single pipe 36 supplies the first cooling element 35, which in turn supplies the second cooling element 32a and the third cooling element 32b for cooling groups of vertically mounted electronic components 31a and 31b (the vertically mounted electronic components 31a and 31b are DIMMs in this embodiment). However, it will be understood that the second cooling element 32a and the third cooling element 32b can be configured as independent components and can be employed without a heat sink of the type of the first cooling element 35. In this case, the second cooling element 32a or the third cooling element 32b can be supplied via a pipe system and / or channels / conduits.

[0058] During use, coolant accumulates within the first cooling element 35 until the coolant level reaches the top of the retaining wall of the first cooling element 35. At this point, coolant overflows from the first cooling element 35 into the second cooling element 32a and the third cooling element 32b, as... Figure 6As indicated by directional arrow 42, this arrow shows the path of the liquid coolant flowing through the retaining wall of the first cooling element 35. Therefore, the boundary between the first cooling element 35 and the second and third cooling elements 32a and 32b serves as a weir for the coolant flow. Advantageously, this embodiment combines multiple cooling elements 35, 32a, and 32b into a single device, thereby reducing complexity by minimizing or eliminating the need for pipes and connections between the different cooling elements. This provides efficient cooling while also offering mechanical robustness due to the connections used. This form of fluid connection between the first cooling element 35 and the second and third cooling elements 32a and 32b—whereby coolant overflows from the first cooling element 35—can be achieved by combining any of the previously described mechanisms for allowing access to the second and third sets of electronic components 31a and 31b (e.g., movable hinges, capture wing screws, hinge / pins, and / or the use of flexible materials).

[0059] Therefore, in summary, Figures 5 to 7 An embodiment provides a heat sink device for cooling a first group (e.g., CPU) of electronic components and a second group (e.g., a group of DIMMs from a group of DIMMs adjacent to the CPU) of electronic components positioned below the heat sink device (i.e., downwards when the device is in use). Note that a group may include one or more DIMMs. The heat sink device includes: a first cooling element (e.g., for cooling the first group of electronic components) for cooling the first group of electronic components. Figures 1 to 4 The radiator assembly 1) includes a first cooling element comprising a base and a retaining wall that together define a volume for holding liquid coolant. The radiator assembly also includes a second cooling element (e.g., one of perforated trays 32a and 32b through which coolant flows) for cooling a second set of electronic components, the second cooling element being configured to distribute liquid coolant onto the second set of electronic components (e.g., by allowing coolant to flow through the base of the second cooling element under the influence of gravity). The first and second cooling elements are arranged such that liquid coolant overflows from the volume of the first cooling element to the second cooling element for distribution onto the second set of electronic components. It will be understood that the first set of electronic components and the second set of electronic components are different. Similarly, the first cooling element and the second cooling element are different.

[0060] It will be understood that, although referring to the adjacent tub-type radiator 35, for example... Figures 1 to 4The second cooling element 32a and the third cooling element 32b of the radiator 1 described in this disclosure represent embodiments of the present disclosure, but other types of radiators can be used. For example, one or more of the second cooling element 32a and the third cooling element 32b can be arranged to receive coolant overflowing from the radiator 20 or 20' of Figures 17 and 18 of WO'864. For example, one or more of the second cooling element 32a and the third cooling element 32b of the present disclosure can be located near the nozzle 25 of the radiator 20 or 20'. Furthermore, the same applies to the retaining wall 46 in the embodiments shown in Figures 22A to 22D of WO'864 and the retaining wall 46a shown in Figures 23A to 23I. These retaining walls 46 and 46a can be arranged to overflow into one or more of the second cooling element 32a and the third cooling element 32b of the present disclosure. All other aspects of WO'864 can be configured to have one or more of the second cooling element 32a and the third cooling element 32b of this disclosure, and therefore will not be described further herein for the sake of brevity. However, it will be understood that this disclosure provides numerous improvements over known radiator devices.

[0061] Although the first cooling element, the second cooling element, and the third cooling element are already relative to Figures 5 to 7 While described, it will be understood that different numbers of such components can be provided. For example, a heat sink assembly may include a heat sink and another cooling element, such as a second cooling element 32a or a third cooling element 32b. Alternatively, the second cooling element 32a or the third cooling element 32b may be provided as separate components. Furthermore, multiple heat sinks, such as the heat sink 1 for cooling electronic components 12, may be configured to have only one cooling element (e.g., one of the second cooling element 32a and the third cooling element 32b). Thus, returning to the previous generalized terminology, a third cooling element for cooling a third group of electronic components may be additionally provided, which is configured to distribute liquid coolant on the third group of electronic components. In this case, the second and third cooling elements may be located on opposite sides of the first cooling element. The second and third cooling elements are generally symmetrical about a plane passing through the first cooling element. In other words, the second and third cooling elements may be mirror images of the components located on the motherboard (e.g., the CPU and DIMM or M.2). Of course, it will also be understood that asymmetrical arrangements of cooling elements may be provided.

[0062] As previously described, vertically mounted components conventionally utilize forced air cooling via a front-to-back (or back-to-front) fan. The fins of a heat sink, which may be mounted on top of a plate component, are conventionally positioned above any coolant markings in the container and therefore have limited heat dissipation capacity without forced airflow. Therefore, it will be understood that positioning the second cooling element 32a and the third cooling element 32b above the second set of vertically mounted electronic components 31a and the third set of vertically mounted electronic components 31b allows heat to be drawn from these sets of vertically mounted components 31a and 31b to improve cooling efficiency. Thus, embodiments of this disclosure provide for cooling DIMMs (such as...) Figure 5 As shown), M.2 (as shown) Figure 8 (as shown) and high-efficiency devices for server motherboard heatsinks. Such components are typically not compatible with tub-type heatsinks (e.g., Figures 1 to 4 The heatsinks (1) or cold plates cool these components, and sealing around the board surface is difficult due to the presence of small components such as miniature capacitors adjacent to these components on the server motherboard. Therefore, the cooling of these components is significantly improved by using the embodiments of this disclosure. Furthermore, DIMMs and M.2 modules frequently require maintenance, replacement, or upgrades, and this number may increase over time. Therefore, the quick and easy access to these components facilitated by the embodiments of this disclosure is highly advantageous, and this disclosure helps overcome many problems within sealed immersion chassis.

[0063] Next, turn to Figure 8 A cooling device according to a second embodiment is shown. This cooling device can be installed in... Figures 1 to 4 Within a container of 100. Except... Figures 5 to 7 In addition to the radiator device, or as a replacement Figures 5 to 7 The radiator assembly can use a cooling device. For example, Figures 5 to 7 The second cooling element 32a and / or the third cooling element 32b can be replaced by a cooling pipe 38, which can be a perforated, sealed-end pipe that allows coolant to pass through (e.g., drip through) an opening (e.g., a slit) in its lower portion, thereby distributing the coolant onto a vertically mounted electronic component positioned below the cooling pipe 38. Figure 8 As shown, the cooling pipe 38 can be mounted above only one (or two) vertically oriented cards, such as the M.2 device 37. Additionally or alternatively, this cooling pipe 38 can also be mounted above a backplate or expansion card. Figure 8 In the middle, the cooling pipe 38 is supplied with liquid coolant through the compliant pipe system 39.

[0064] Figure 8 The implementation method is based on and Figures 5 to 7It operates on a similar principle because this implementation can be used to cool electronic components mounted below the cooling pipes. Therefore, in summary... Figure 8 An implementation can be considered as a cooling pipe for cooling a group of electronic components, the cooling pipe being configured to distribute liquid coolant over the group of electronic components. The cooling pipe may include any type of opening, orifice, and / or slit to achieve a desired flow rate. A cooling module may be provided, comprising: a container configured to hold the group of electronic components within the container; and a cooling pipe configured to cool the group of electronic components. Thus, effective cooling of the components can be achieved by means of the cooling pipe. The cooling module may include the group of electronic components, or may simply be configured to contain the group of electronic components. The cooling pipe may be supplied with liquid coolant overflowing from another heat sink (e.g., in the same manner as the second cooling element 32a and the third cooling element 32b receiving liquid coolant overflowing from the first cooling element 35).

[0065] Continuing with the previously used general terminology, this disclosure provides a cooling module for cooling a first group of electronic components and a second group of electronic components (the first group of electronic components and the second group of electronic components can be any two of the aforementioned groups of electronic components). Figure 1 and Figure 2 The cooling module 100 shown includes: a container configured to hold a first set of electronic components and a second set of electronic components within the container; and any heat sink device (e.g., any device in the previously described heat sink assembly including cooling elements 32a, 32b, 35, and 38) arranged to cool the first set of electronic components and the second set of electronic components. The container may be configured to hold the first set of electronic components and the second set of electronic components because the group of electronic components may be mounted on the container, or the container may be configured for attachment to the group of electronic components. Additionally or alternatively, the container may be a base including an attachment mechanism for engaging the grouped components (e.g., a physical connector for those grouped components).

[0066] In the cooling module of this disclosure, a first cooling element can be mounted on a first group of electronic components, and a second cooling element can be positioned above a second group of electronic components. This can be achieved by fixing the first and second cooling elements to each other. In this way, the second cooling element can be placed near the second group of electronic components, which would otherwise be difficult to cool.

[0067] The cooling module of this disclosure may further include a nozzle assembly comprising one or more nozzles arranged to receive and guide liquid coolant into the volume of a first cooling element. The cooling module may also include one or more pumps configured to flow liquid coolant within the container. The cooling module may further include at least one conduit (e.g., conduit 36) arranged to deliver liquid coolant from one or more pumps to the nozzle assembly. Preferably, each of the one or more nozzles is configured to be push-fitted into a corresponding end of the at least one conduit. In the cooling module of this disclosure, the liquid coolant may be a primary liquid coolant, and the cooling module further includes a heat exchanger configured to receive secondary liquid coolant and transfer heat from the primary liquid coolant to the secondary liquid coolant. Therefore, efficient cooling can be achieved.

[0068] The second group of electronic components may include one or more vertically mounted electronic components (e.g., DIMMs or M.2s). In this case, preferably, the second cooling element includes one or more openings for distributing liquid coolant onto the respective one or more electronic components of the second group of electronic components, and one or more openings are aligned with one or more vertically mounted electronic components (i.e., one or more openings are located directly above one or more vertically mounted electronic components, such that coolant falls from the openings onto the components below) (or, if the vertically mounted electronic components are omitted from the cooling module, the openings may instead be aligned with one or more attachment mechanisms in the cooling module suitable for holding one or more vertically mounted electronic components). Therefore, efficient distribution of coolant to the vertically mounted electronic components can be achieved, and thus efficient cooling of the vertically mounted electronic components can be achieved.

[0069] Throughout this disclosure, the first group of electronic components may include one or more central processing units (CPUs) and / or one or more graphics processing units (GPUs). The first group of electronic components may include clusters of CPUs and / or GPUs. Additionally or alternatively, the second group of electronic components may include one or more memory modules and / or one or more dual in-line memory modules and / or one or more expansion cards and / or one or more printed circuit boards. The second group of electronic components may include any auxiliary heat-generating components. This disclosure allows for the advantageous cooling of a variety of other components.

[0070] A common feature of the above embodiments is that the rate at which the liquid coolant flows to the component to be cooled can be determined through computational analysis. The flow rate can be controlled by various methods, including increasing / decreasing pump speed, using pipes of different inner diameters, a tray surrounding the cooling element to increase the height of the head, or slits and / or openings of different sizes and / or shapes. It will be understood that those skilled in the art will be able to use these parameters to tailor the flow rate for effective cooling of various components, and therefore the advantageous embodiments described above are not limited to DIMMs or M.2s. In fact, any component can be cooled using this disclosure, although vertically mounted components or elongated components are preferred. It will also be understood that the cooling module of this disclosure may include, be connected to, and / or be capable of being connected to a controller configured to control the flow rate of the coolant within the container (e.g., by changing the flow rate of the liquid coolant). This allows for optimization of the cooling rate.

[0071] Furthermore, those skilled in the art will understand upon reading the above embodiments that the liquid coolant should be maintained in liquid form. In other words, the liquid coolant should not undergo a phase change, as evaporation of the liquid coolant may reduce the effectiveness of the above embodiments.

[0072] It will be understood that many variations of the aforementioned devices, systems, and methods can be made while retaining the advantages previously mentioned. For example, where a particular type of flexible material has been described, alternative materials that provide the same or similar functionality can be provided.

[0073] Furthermore, various types of pumping and liquid transfer devices can be employed. The depicted devices are for illustrative purposes only, and any alternative devices can be used, including any devices described and illustrated in WO-2019 / 048864 (WO'864). Similarly, although DIMMs and M.2s have been extensively mentioned above, other electronic components can be cooled using the features of this disclosure.

[0074] Unless otherwise stated, each feature disclosed in this application can be used as an alternative feature replacement for the same, equivalent, or similar purpose. Therefore, unless otherwise stated, each disclosed feature is merely an example of an equivalent or similar feature in a general series.

[0075] As used herein, including in the claims, unless the context otherwise indicates, the singular form of a term herein shall be construed as including the plural form, and vice versa where the context permits. For example, unless the context otherwise indicates, singular references included herein in the claims, such as “a” or “an” (e.g., an electronic component or a cooling element), mean “one or more” (e.g., one or more electronic components or one or more cooling elements). Throughout the description and claims of this disclosure, the words “comprising,” “including,” “having,” and “containing,” as well as variations of these words, such as “comprising of” and “consisting of” or similar words, mean “including but not limited to” and are not intended to (and do not) exclude other components.

[0076] The use of any and all examples or exemplary language (“for example,” “like,” “for instance,” and similar language) provided herein is intended only to better illustrate this disclosure and does not indicate any limitation on the scope of this disclosure unless otherwise required. The language in the application should not be construed as indicating that any unclaimed element is essential to the practice of this disclosure.

[0077] Any step described in this application may be performed in any order or simultaneously, unless otherwise stated or required by the context. Furthermore, where a step is described as being performed after a previous step, this does not preclude the execution of intermediate steps.

[0078] All aspects and / or features disclosed in this application may be combined in any combination, except for combinations in which at least some of these features and / or steps are mutually exclusive. In particular, the preferred features of this disclosure apply to all aspects and embodiments of this disclosure and may be used in any combination. Similarly, features described in non-essential combinations may be used alone (non-combined use).

[0079] A method is also provided for manufacturing and / or operating any of the devices (or arrangements of devices) disclosed herein. This method may include the steps of: providing each of the disclosed features and / or constructing a corresponding feature for the stated function thereof.

Claims

1. A heat sink device for cooling a first group of electronic components and a second group of electronic components positioned below the heat sink device, the heat sink device comprising: A first cooling element for cooling the first group of electronic components, wherein the first cooling element is a first heat sink comprising a base and a retaining wall that together define a volume for holding a liquid coolant; A second cooling element, used to cool the second group of electronic components, includes: The base of the second cooling element includes one or more openings for distributing liquid coolant onto one or more corresponding electronic components of the second group of electronic components; The first cooling element and the second cooling element are arranged such that liquid coolant overflows from the volume of the first cooling element to the second cooling element for distribution on the second set of electronic components.

2. The radiator device according to claim 1, wherein, The second cooling element extends along the edge of the first cooling element.

3. The radiator device according to claim 1 or claim 2, wherein, The depth of the first cooling element is greater than the depth of the second cooling element.

4. The radiator device according to claim 1, wherein, The first cooling element is configured to be mounted on top of the heat transfer area of ​​the first group of electronic components, wherein the base of the first cooling element is configured to be mounted on top of the heat transfer area of ​​the first group of electronic components.

5. The radiator device according to claim 1, wherein, The first cooling element and the second cooling element are fixed to each other, wherein the second cooling element is fixed to the upper edge of the retaining wall of the first cooling element.

6. The radiator device according to claim 1, wherein, The second cooling element is fixed to a support frame that spans and / or at least partially surrounds the volume of the first cooling element.

7. The radiator device according to claim 1, wherein, The second cooling element is fixed in a releasable and / or pivotable manner to allow access to the second set of electronic components.

8. The radiator device according to claim 1, wherein, The second cooling element is movable and / or elastically deformable to allow access to the second set of electronic components.

9. The radiator device according to claim 1, wherein, The second cooling element is movable and / or elastically deformable from a first configuration to a second configuration, in which the base of the second cooling element is substantially parallel to the base of the first cooling element, and in the second configuration, the second set of electronic components is accessible.

10. The radiator device according to claim 1, wherein, The one or more openings at the base of the second cooling element include elongated slits for distributing liquid coolant onto the respective one or more electronic components of the second set of electronic components.

11. The radiator device according to claim 10, wherein, The one or more openings are raised relative to the base of the second cooling element, wherein the one or more openings are at approximately the same height above the base of the second cooling element.

12. The radiator device according to claim 10, wherein, The base of the second cooling element includes a structure for dispersing liquid coolant on the base of the second cooling element, wherein the structure includes: One or more channels; One or more ridges; One or more baffles; and / or One or more protrusions.

13. The radiator device according to claim 12, wherein, The structure surrounds the one or more openings.

14. The radiator device according to claim 12, wherein, The structure includes multiple longitudinal channel portions and multiple latitudinal channel portions extending through the base of the second cooling element.

15. The radiator device of claim 1, further comprising a third cooling element for cooling a third group of electronic components, the third cooling element being configured to distribute a liquid coolant onto the third group of electronic components.

16. The radiator device according to claim 15, wherein, The second cooling element and the third cooling element are disposed on the opposite side of the first cooling element.

17. The radiator device according to claim 15, wherein, The second cooling element and the third cooling element are approximately symmetrical about a plane passing through the first cooling element.

18. A cooling module for cooling a first group of electronic components and a second group of electronic components, the cooling module comprising: A container configured to hold the first set of electronic components and the second set of electronic components within the container; as well as The heat sink device according to any of the preceding claims is arranged to cool the first group of electronic components and the second group of electronic components.

19. The cooling module according to claim 18, wherein, The first cooling element is mounted on the first group of electronic components, and the second cooling element is positioned above the second group of electronic components.

20. The cooling module of claim 18 or claim 19, further comprising a nozzle arrangement including nozzles arranged to receive liquid coolant and direct the liquid coolant into one or more nozzles in the volume of the first cooling element.

21. The cooling module of claim 20, further comprising one or more pumps configured to flow the liquid coolant within the container.

22. The cooling module of claim 21, further comprising at least one conduit arranged to deliver liquid coolant from the one or more pumps to the nozzle assembly, wherein, Each of the one or more nozzles is configured to be push-fitted into a corresponding end of the at least one conduit.

23. The cooling module according to claim 18, wherein, The liquid coolant is a primary liquid coolant, and the cooling module further includes a heat exchanger configured to receive a secondary liquid coolant and to transfer heat from the primary liquid coolant to the secondary liquid coolant.

24. The cooling module according to claim 18, wherein: The first group of electronic components includes one or more central processing units (CPUs) and / or one or more graphics processing units (GPUs); and / or The second group of electronic components includes one or more memory modules and / or one or more dual in-line memory modules and / or one or more expansion cards and / or one or more printed circuit boards.

Images