A multi-segment single-crystal silicon slicing machine

Abstract

This invention discloses a multi-segment monocrystalline silicon slicing machine, relating to the technical field of monocrystalline silicon production. It includes an operating table, a cylinder, and diamond wire. The operating table has a support plate with a driving wheel and a driven wheel. At least two sets of limiting wheels are provided between the driving and driven wheels. One end of the diamond wire is connected to the driving wheel, and the other end is connected to the driven wheel. The diamond wire is evenly wound around the limiting wheels, forming a cutting surface between the upper surfaces of adjacent sets of limiting wheels. A limiting cylinder is provided on the operating table, with a vertical channel inside for the monocrystalline silicon block to pass through. The bottom outlet of the vertical channel faces the cutting surface. An adjusting plate slides inside the vertical channel, with one side of the adjusting plate connected to the output end of the cylinder. The cylinder is fixed to the operating table, and the other side of the adjusting plate has a negative pressure suction component for non-destructive fixing of the monocrystalline silicon. This invention effectively ensures the safety of the operator.

Description

Technical Field

[0001] The present invention relates to the technical field of monocrystalline silicon production, and in particular to a multi-segment monocrystalline silicon slicing machine. Background Technology

[0002] Monocrystalline silicon wafers are crystals with a basically complete lattice structure. Different directions have different properties. They are good semiconductor materials and are widely used in the manufacture of semiconductor devices, solar cells and other industries. Currently, monocrystalline silicon wafers are obtained by orderly processing from silicon blocks using a slicing machine.

[0003] Existing monocrystalline silicon slicing machines include high-speed rotating diamond wires, and the monocrystalline silicon block is manually pushed towards the diamond wires to bring it into contact with the wires, thus achieving the slicing effect. However, manually fixing and pushing the monocrystalline silicon block is a very dangerous operation. Therefore, in order to achieve mechanized fixing of the monocrystalline silicon block and ensure the safety of operators, a multi-segment monocrystalline silicon slicing machine is designed to solve the above-mentioned technical problems. Summary of the Invention

[0004] This application provides a multi-segment single-crystal silicon slicing machine, which can effectively ensure the safety of operators.

[0005] This application provides a multi-segment single-crystal silicon slicing machine, which adopts the following technical solution: A multi-segment monocrystalline silicon slicing machine includes an operating table, a cylinder, and a diamond wire. The operating table has a support plate with a driving wheel and a driven wheel. At least two sets of limiting wheels are provided between the driving and driven wheels. One end of the diamond wire is connected to the driving wheel, and the other end is connected to the driven wheel. The diamond wire is evenly wound around the limiting wheels, forming a cutting surface between the upper surfaces of adjacent sets of limiting wheels. A limiting cylinder is provided on the operating table, with a vertical channel inside for the monocrystalline silicon block to pass through. The bottom outlet of the vertical channel faces the cutting surface. An adjusting plate is slidably installed inside the vertical channel. One side of the adjusting plate is connected to the output end of the cylinder, which is fixed to the operating table. The other side of the adjusting plate has a negative pressure suction component for non-destructive fixing of the monocrystalline silicon.

[0006] By adopting the above technical solution, during the wire cutting process of monocrystalline silicon blocks, the monocrystalline silicon blocks are manually pushed to contact the high-speed rotating diamond wires, thereby achieving the slicing effect. However, manually fixing and pushing the monocrystalline silicon blocks is a very dangerous operation. Therefore, this solution uses a negative pressure suction component to fix the monocrystalline silicon blocks and uses a cylinder to push an adjusting plate, which moves the fixed monocrystalline silicon blocks towards the cutting surface. When the monocrystalline silicon blocks contact the diamond wires on the cutting surface, the high-speed transmission of the diamond wires creates a groove on the contact area, achieving the slicing effect. By sliding the adjusting plate in the opposite direction, the monocrystalline silicon blocks are separated from the diamond wires. During this process, the mechanized operation of the monocrystalline silicon blocks effectively ensures the safety of the operators.

[0007] Preferably, the negative pressure suction assembly includes a negative pressure suction device and a negative pressure suction cup disposed on the lower surface of the adjustment plate. A plurality of negative pressure suction cups are provided, and a diversion pipe is connected to the negative pressure suction cup. One end of the diversion pipe is connected to the negative pressure suction cup, and the other end of the diversion pipe is connected to a main pipe. The main pipe is connected to the output end of the negative pressure suction device.

[0008] By adopting the above technical solution, the negative pressure suction cup is placed in a negative pressure state by the negative pressure suction device set on the operating table. When the negative pressure suction cup contacts the upper surface of the monocrystalline silicon block, it can effectively and stably adsorb the monocrystalline silicon block onto the lower surface of the adjustment plate. Since the material of the negative pressure suction cup is soft, it can effectively reduce the damage to the surface of the monocrystalline silicon block when it contacts the surface of the monocrystalline silicon block, thereby achieving non-destructive fixation of the monocrystalline silicon block.

[0009] Preferably, the main pipe includes a first pipe body, a second pipe body, and a corrugated pipe disposed between the first pipe body and the second pipe body.

[0010] By adopting the above technical solution, the up-and-down movement of the regulating plate will inevitably cause tension on the main pipe. Therefore, by setting a corrugated pipe, the main pipe can adaptably undergo longitudinal deformation when the regulating plate undergoes longitudinal displacement.

[0011] Preferably, the operating table is provided with a first belt conveyor and a second belt conveyor. The first belt conveyor is used to transport the monocrystalline silicon block before slicing, and the second belt conveyor is used to transport the monocrystalline silicon block after slicing. The output end of the first belt conveyor faces the vertical channel inlet of the limiting cylinder, and the input end of the second belt conveyor faces the vertical channel inlet of the limiting cylinder.

[0012] By adopting the above technical solution, a first belt conveyor is set up to transport the monocrystalline silicon block before slicing to the limiting cylinder. After the monocrystalline silicon block is sliced, the sliced ​​monocrystalline silicon block is transferred to the next process by a second belt conveyor to ensure the continuity of monocrystalline silicon block slicing.

[0013] Preferably, a sliding plate is provided between the adjusting plate and the negative pressure suction cup. The sliding plate slides in a groove provided on the lower surface of the adjusting plate, and the sliding direction of the sliding plate is consistent with the transmission direction of the second belt conveyor.

[0014] By adopting the above technical solution, the slide plate of the drive slide plate moves the monocrystalline silicon wafer fixed on the negative pressure suction cup to the top of the second belt conveyor, which facilitates the transfer of the sliced ​​monocrystalline silicon wafer to the second belt conveyor.

[0015] Preferably, the operating table is provided with a storage tank for storing coolant, and the bottom of the storage tank is provided with a nozzle, the nozzle of which faces the cutting surface.

[0016] By adopting the above technical solution, a storage tank for storing coolant is set up so that the coolant is sprayed onto the diamond wire on the cutting surface through a nozzle, thereby achieving a cooling effect on the diamond wire and quickly reducing the temperature generated by friction between the diamond wire and the monocrystalline silicon block, so as to protect the diamond wire.

[0017] Preferably, the limiting cylinder is provided with two sets of clamping and positioning plates inside, and the two sets of clamping and positioning plates are telescopically arranged inside the vertical channel.

[0018] By adopting the above technical solution, since the size of the monocrystalline silicon blocks is different, the internal space of the vertical channel can be adjusted by using two sets of retractable clamping and positioning plates, so that the two sets of clamping and positioning plates abut against the surface of the monocrystalline silicon blocks, so as to adapt to monocrystalline silicon blocks of different sizes, which is highly practical and has a wider range of applications.

[0019] Preferably, one side of the clamping positioning plate is connected to the inner wall of the limiting cylinder by a spring, and the other side of the clamping positioning plate and near the top of the clamping positioning plate are provided with a downwardly inclined slope.

[0020] By adopting the above technical solution, during the movement of the adjustment plate from top to bottom, the bottom of the adjustment plate and the monocrystalline silicon block abut against the inclined surface. With the continuous pressure of the adjustment plate, the clamping positioning plate expands inside and outside the limiting cylinder, which facilitates the guidance of the clamping positioning plate and makes the clamping positioning plate more smoothly during the adjustment process. When the adjustment plate moves from bottom to top, the adjustment plate and the monocrystalline silicon block disengage from the connection of the clamping positioning plate, and under the action of the spring, the two sets of clamping positioning plates quickly reset.

[0021] Preferably, rollers are provided on the opposite side of the two sets of clamping and positioning plates.

[0022] By adopting the above technical solution, due to the sliding friction between the monocrystalline silicon block and the two sets of clamping and positioning plates, wear will occur at the contact points between the monocrystalline silicon wafer and the two clamping and positioning plates. Therefore, by providing rotating rollers on the clamping and positioning plates, the wear between the clamping and positioning plates and the monocrystalline silicon block can be reduced.

[0023] Preferably, both the driving wheel and the driven wheel are provided with protective baffles on their outer sides.

[0024] By adopting the above technical solution, the cutting wire will be worn when it comes into contact with the monocrystalline silicon block, which may cause it to break at the drive wheel and driven wheel. The broken cutting wire will fly out due to inertia, causing injury to the operator and resulting in low safety. Therefore, the protective baffles set on the outside of the drive wheel and driven wheel can effectively block the broken cutting wire, thereby avoiding injury to the operator and ensuring high safety.

[0025] In summary, this application has the following beneficial effects: 1. By using a negative pressure suction component to fix the monocrystalline silicon block, and using a cylinder to push an adjusting plate, the adjusting plate moves the fixed monocrystalline silicon block towards the cutting surface. When the monocrystalline silicon block comes into contact with the diamond wire on the cutting surface, the high-speed transmission of the diamond wire causes the monocrystalline silicon block to form a groove at the contact point with the diamond wire, thus achieving the slicing effect on the monocrystalline silicon block. By sliding the adjusting plate in the opposite direction, the monocrystalline silicon block is separated from the diamond wire. During this process, the mechanized operation of the monocrystalline silicon block can effectively ensure the safety of the operator. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the multi-segment single-crystal silicon slicing machine in this embodiment; Figure 2 This is a schematic diagram of the internal structure of the negative pressure suction component in this embodiment; Figure 3 This is a schematic diagram of the connection structure between the first belt conveyor and the second belt conveyor in this embodiment; Figure 4 This is an exploded view of the sliding misalignment structure between the slide plate and the adjustment plate in this embodiment; Figure 5 This is a schematic diagram of the overall structure of the storage box in this embodiment; Figure 6 This is a cross-sectional view of the limiting cylinder in this embodiment.

[0027] Explanation of reference numerals in the attached drawings: 1. Operating platform; 2. Cylinder; 3. Diamond wire; 4. Support plate; 5. Drive wheel; 6. Driven wheel; 7. Limit wheel; 8. Limit cylinder; 9. Vertical channel; 10. Adjusting plate; 11. Negative pressure suction assembly; 1101. Negative pressure suction device; 1102. Negative pressure suction cup; 1103. Diverter pipe; 1104. Main pipe; 110401. First pipe body; 110402. Second pipe body; 110403. Corrugated pipe; 12. Protective baffle; 13. Slide plate; 14. Slide groove; 15. Storage box; 16. Nozzle; 17. Clamping and positioning plate; 18. Spring; 19. Inclined surface; 20. Roller; 21. First belt conveyor; 22. Second belt conveyor. Detailed Implementation

[0028] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0029] Example: This invention discloses a multi-segment single-crystal silicon slicing machine, such as... Figure 1 As shown, the device includes an operating table 1, a cylinder 2, and a diamond wire 3. The operating table 1 is equipped with a support plate 4, on which a drive wheel 5 and a driven wheel 6 are mounted. A drive motor is connected to one end of the drive wheel 5 to drive it. Protective baffles 12 are provided on the outer sides of both the drive wheel 5 and the driven wheel 6. When the cutting wire comes into contact with the monocrystalline silicon block, it will be worn down, causing it to break at the drive wheel 5 and the driven wheel 6. The broken cutting wire will fly out due to inertia, potentially injuring the operator and posing a safety hazard. Therefore, the protective baffles 12 installed on the outer sides of the drive wheel 5 and the driven wheel 6 effectively prevent the broken cutting wire from breaking, thus avoiding injury to the operator and ensuring high safety. like Figure 1As shown, two sets of limiting wheels 7 are provided between the driving wheel 5 and the driven wheel 6. One end of the diamond wire 3 is connected to the driving wheel 5, and the other end of the diamond wire 3 is connected to the driven wheel 6. The middle part of the diamond wire 3 is evenly wound on the limiting wheels 7, and a cutting surface is formed between the upper surfaces of the two adjacent sets of limiting wheels 7. A limiting cylinder 8 is provided on the operating table 1. The limiting cylinder 8 has a vertical channel 9 for the monocrystalline silicon block to pass through. The bottom outlet of the vertical channel 9 faces the cutting surface. An adjusting plate 10 is slidably provided inside the vertical channel 9. One side of the adjusting plate 10 is connected to the output end of the cylinder 2. The cylinder 2 is fixed on the operating table 1. The other side of the adjusting plate 10 is provided with a negative pressure suction component 11 for non-destructive fixing of the monocrystalline silicon. During the wire cutting process of the monocrystalline silicon block, the monocrystalline silicon block is pushed manually. The process involves bringing a monocrystalline silicon block into contact with a high-speed rotating diamond wire 3 to achieve slicing. However, manually fixing and pushing the monocrystalline silicon block is a very dangerous operation. Therefore, this solution uses a negative pressure suction component 11 to fix the monocrystalline silicon block and a cylinder 2 to push an adjusting plate 10. The adjusting plate 10 moves the fixed monocrystalline silicon block towards the cutting surface. When the monocrystalline silicon block contacts the diamond wire 3 on the cutting surface, the high-speed transmission of the diamond wire 3 creates a groove in the contact area, achieving slicing. The monocrystalline silicon block is then separated from the diamond wire 3 by the reverse sliding of the adjusting plate 10. During this process, the mechanized operation of the monocrystalline silicon block effectively ensures the safety of the operator.

[0030] like Figure 2 As shown, the negative pressure suction assembly 11 includes a negative pressure suction device 1101 and a negative pressure suction cup 1102 disposed on the lower surface of the adjustment plate 10. Several negative pressure suction cups 1102 are provided, and a diversion pipe 1103 is connected to the negative pressure suction cup 1102. One end of the diversion pipe 1103 is connected to the negative pressure suction cup 1102, and the other end of the diversion pipe 1103 is connected to a main pipe 1104. The main pipe 1104 is connected to the output end of the negative pressure suction device 1101. By using the negative pressure suction device 1101 disposed on the operating table 1, the negative pressure suction cup 1102 is in a negative pressure state. When the negative pressure suction cup 1102 contacts the upper surface of the monocrystalline silicon block, it can effectively and stably adsorb the monocrystalline silicon block onto the lower surface of the adjustment plate 10. Since the material of the negative pressure suction cup 1102 is soft, it can effectively reduce the damage to the surface of the monocrystalline silicon block when in contact with the surface of the monocrystalline silicon block, thereby achieving non-destructive fixation of the monocrystalline silicon block.

[0031] like Figure 2As shown, the main pipe 1104 includes a first pipe body 110401, a second pipe body 110402, and a corrugated pipe 110403 disposed between the first pipe body 110401 and the second pipe body 110402. The first pipe body 110401 is connected to the output end of the negative pressure suction device 1101, and the second pipe body 110402 is connected to the negative pressure suction cup 1102. Since the adjusting plate 10 moves up and down, it will inevitably cause the main pipe 1104 to be pulled. Therefore, by providing the corrugated pipe 110403, when the adjusting plate 10 makes longitudinal displacement, the main pipe 1104 can adaptably undergo longitudinal deformation.

[0032] like Figure 3 As shown, the operating table 1 is equipped with a first belt conveyor 21 and a second belt conveyor 22. The first belt conveyor 21 is used to transport the monocrystalline silicon block before slicing, and the second belt conveyor 22 is used to transport the monocrystalline silicon block after slicing. The output end of the first belt conveyor 21 faces the entrance of the vertical channel 9 of the limiting cylinder 8, and the input end of the second belt conveyor 22 faces the entrance of the vertical channel 9 of the limiting cylinder 8. By setting up the first belt conveyor 21, the monocrystalline silicon block before slicing is transported into the limiting cylinder 8. After the monocrystalline silicon block is sliced, the monocrystalline silicon block after slicing is transferred to the next process by the second belt conveyor 22 to ensure the continuity of monocrystalline silicon block slicing.

[0033] like Figure 4 As shown, a sliding plate 13 is provided between the adjusting plate 10 and the negative pressure suction cup 1102. A hydraulic rod is provided on one side of the sliding plate 13. The sliding plate 13 slides in the groove 14 provided on the lower surface of the adjusting plate 10. The sliding direction of the sliding plate 13 is consistent with the transmission direction of the second belt conveyor 22. By driving the sliding plate 13, the monocrystalline silicon wafer fixed on the negative pressure suction cup 1102 is moved to the top of the second belt conveyor 22, which facilitates the transfer of the sliced ​​monocrystalline silicon wafer to the second belt conveyor 22. The second pipe is made of flexible material and is easy to extend. The second pipe is located in the groove 14. When the sliding plate 13 moves away from the groove 14, the sliding plate 13 and the adjusting plate 10 are misaligned. At this time, the sliding of the sliding plate 13 causes the second pipe to be stretched and bent. At this time, the diameter of the second pipe decreases until the second pipe is closed at the bend. At this time, the bend is equivalent to the function of a valve, automatically closing the second pipe, which facilitates the removal of the monocrystalline silicon block.

[0034] like Figure 5 As shown, the operating table 1 is equipped with a storage tank 15 for storing coolant. The bottom of the storage tank 15 is equipped with a nozzle 16, and the nozzle of the nozzle 16 faces the cutting surface. Through the storage tank 15 for storing coolant, the coolant is sprayed onto the diamond wire 3 on the cutting surface through the nozzle 16 to achieve the cooling effect on the diamond wire 3, so as to quickly reduce the temperature generated by the friction between the diamond wire 3 and the single crystal silicon block, and protect the diamond wire 3.

[0035] like Figure 6 As shown, the limiting cylinder 8 has two sets of clamping positioning plates 17 inside. The two sets of clamping positioning plates 17 are telescopically arranged inside the vertical channel 9. Due to the different sizes of the monocrystalline silicon blocks, the internal space of the vertical channel 9 is adjusted by the two sets of telescopic clamping positioning plates 17, so that the two sets of clamping positioning plates 17 abut against the surface of the monocrystalline silicon blocks, so as to adapt to monocrystalline silicon blocks of different sizes, which is highly practical and has a wider range of applications. One side of the clamping positioning plate 17 is connected to the inner wall of the limiting cylinder 8 by a spring 18. The other side of the clamping positioning plate 17 and near the top of the clamping positioning plate 17 are provided with a downward inclined surface 19. During the movement of the adjusting plate 10 from top to bottom, the adjusting plate 10 and the bottom of the monocrystalline silicon block abut against the inclined surface 19, and the adjusting plate 10 moves downward. The continuous pressure of 0 causes the clamping positioning plate 17 to expand inside and outside the limiting cylinder 8, which facilitates the guidance of the clamping positioning plate 17 and makes the clamping positioning plate 17 smoother during adjustment. When the adjusting plate 10 moves from bottom to top, the adjusting plate 10 and the monocrystalline silicon block disengage from the clamping positioning plate 17, and under the action of the spring 18, the two sets of clamping positioning plates 17 quickly reset. Rollers 20 are provided on the opposite side of the two sets of clamping positioning plates 17. Due to the sliding friction between the monocrystalline silicon block and the two sets of clamping positioning plates 17, wear will occur at the contact parts between the monocrystalline silicon wafer and the two clamping positioning plates 17. Therefore, the rotating rollers 20 on the clamping positioning plates 17 are used to reduce the wear between the clamping positioning plates 17 and the monocrystalline silicon block.

[0036] Working principle: Before use, the user first places the monocrystalline silicon block to be cut on the first belt conveyor 21. After being conveyed by the first belt conveyor 21, the monocrystalline silicon block is transported to the inside of the limiting cylinder 8. Then, the power supply of the negative pressure suction component 11 is turned on, so that the monocrystalline silicon block in the limiting cylinder 8 is adsorbed on the negative pressure suction cup 1102. Then, cylinder 2 is activated, causing the monocrystalline silicon block fixed on the lower surface of the adjusting plate 10 to move downward and pass between the two clamping and positioning plates 17 until the lower surface of the monocrystalline silicon block contacts the diamond wire 3 on the cutting surface. Then, the drive wheel 5 is activated, causing the diamond wire 3 to be wound onto the drive wheel 5. At this time, the diamond wire 3 on the cutting surface is driven, and through the continuous downward pressure of the monocrystalline silicon block, the diamond wire 3 forms a cutting groove on the lower surface of the monocrystalline silicon block, thereby realizing the slicing effect of the monocrystalline silicon block.

[0037] Then, through the reverse drive cylinder 2, the adjusting plate 10 moves upward, and the monocrystalline silicon block is separated from the diamond wire 3. When the monocrystalline silicon block passes through the limiting cylinder 8 and is placed at the input end of the second belt conveyor 22, the slide plate 13 is driven by the hydraulic rod, so that the slide plate 13 slides inside the slide groove 14 until the slide plate 13 and the adjusting plate 10 are misaligned. The cut monocrystalline silicon block is then placed on the first belt conveyor 21 by manual means, and the monocrystalline silicon block is transferred and transported by the first belt conveyor 21.

[0038] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A multi-segment single-crystal silicon slicing machine, comprising an operating table (1), a cylinder (2), and a diamond wire (3), characterized in that: The operating table (1) is provided with a support plate (4), and the support plate (4) is provided with a driving wheel (5) and a driven wheel (6). At least two sets of limiting wheels (7) are provided between the driving wheel (5) and the driven wheel (6). One end of the diamond wire (3) is connected to the driving wheel (5), and the other end of the diamond wire (3) is connected to the driven wheel (6). The diamond wire (3) is evenly wound on the limiting wheel (7) and forms a cutting surface between the upper surfaces of two adjacent sets of limiting wheels (7). The operating table ( 1) A limiting cylinder (8) is provided on the upper part. The limiting cylinder (8) has a vertical channel (9) for the monocrystalline silicon block to pass through. The bottom outlet of the vertical channel (9) faces the cutting surface. An adjusting plate (10) is slidably provided inside the vertical channel (9). One side of the adjusting plate (10) is connected to the output end of the cylinder (2). The cylinder (2) is fixed on the operating table (1). The other side of the adjusting plate (10) is provided with a negative pressure attraction component (11) for non-destructive fixing of monocrystalline silicon. The negative pressure suction assembly (11) includes a negative pressure suction device (1101) and a negative pressure suction cup (1102) disposed on the lower surface of the adjustment plate (10). Several negative pressure suction cups (1102) are provided. A diversion pipe (1103) is connected to the negative pressure suction cup (1102). One end of the diversion pipe (1103) is connected to the negative pressure suction cup (1102), and the other end of the diversion pipe (1103) is connected to a main pipe (1104). The main pipe (1104) is connected to the output end of the negative pressure suction device (1101). The main pipe (1104) includes a first pipe body (110401), a second pipe body (110402), and a corrugated pipe (110403) disposed between the first pipe body (110401) and the second pipe body (110402); The operating table (1) is equipped with a first belt conveyor (21) and a second belt conveyor (22). The first belt conveyor (21) is used to transport the monocrystalline silicon block before slicing, and the second belt conveyor (22) is used to transport the monocrystalline silicon block after slicing. The output end of the first belt conveyor (21) faces the entrance of the vertical channel (9) of the limiting cylinder (8), and the input end of the second belt conveyor (22) faces the entrance of the vertical channel (9) of the limiting cylinder (8). A sliding plate (13) is provided between the adjusting plate (10) and the negative pressure suction cup (1102). The sliding plate (13) slides in the groove (14) provided on the lower surface of the adjusting plate (10). The sliding direction of the sliding plate (13) is consistent with the transmission direction of the second belt conveyor (22). The limiting cylinder (8) is provided with two sets of clamping positioning plates (17) inside, and the two sets of clamping positioning plates (17) are telescopically arranged inside the vertical channel (9); One side of the clamping positioning plate (17) is connected to the inner wall of the limiting cylinder (8) by a spring (18), and the other side of the clamping positioning plate (17) and near the top of the clamping positioning plate (17) are provided with a downwardly inclined slope (19). Rollers (20) are provided on the opposite side of the two sets of clamping and positioning plates (17).

2. The multi-segment single-crystal silicon slicing machine according to claim 1, characterized in that: The operating table (1) is provided with a storage tank (15) for storing coolant. The bottom of the storage tank (15) is provided with a nozzle (16) with the nozzle (16) facing the cutting surface.

3. The multi-segment single-crystal silicon slicing machine according to claim 1, characterized in that: Both the driving wheel (5) and the driven wheel (6) are provided with protective baffles (12) on their outer sides.

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