connector

Abstract

This invention provides a connector capable of achieving a low profile. The grounding terminal includes: a side portion having a side facing the negative Y-axis and exposed from the resin body component; a bottom portion having a bottom surface facing the positive Z-axis and exposed from the resin body component; a side metal film covering a portion of the side portion; and a bottom metal film covering a portion of the bottom surface. The regions between the two ends of the side metal film in the X-axis direction and the regions between the two ends of the bottom metal film in the X-axis direction do not overlap in the X-axis direction. The side portion and the bottom surface are connected.

Description

Technical Field

[0001] This invention relates to connectors. Background Technology

[0002] As an invention related to existing connectors, for example, a plug connector described in Patent Document 1 is known. This plug connector includes a plug housing, multiple plug contacts, and a plug component. The plug housing is a resin component. The multiple plug contacts are signal terminals. The multiple plug contacts are supported on the plug housing. The plug component is a ground terminal. The plug component is supported on the plug housing. The plug component has a plug soldering portion. The plug soldering portion is connected to a substrate using solder.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2006-331679

[0004] However, it is required that the plug connector described in Patent Document 1 be made shorter. Summary of the Invention

[0005] Therefore, the object of the present invention is to provide a connector that can achieve a low profile.

[0006] One aspect of the present invention relates to a connector comprising: a resin body component; a signal terminal supported on the resin body component; and a ground terminal supported on the resin body component, the ground terminal comprising: a side portion having a side surface exposed from the resin body component in the negative direction of the Y-axis; a bottom portion having a bottom surface exposed from the resin body component in the positive direction of the Z-axis; a side metal film covering a portion of the side surface; and a bottom metal film covering a portion of the bottom surface, wherein the regions between the two ends of the side metal film in the X-axis direction and the regions between the two ends of the bottom metal film in the X-axis direction do not overlap in the X-axis direction, and the side surface and the bottom surface are connected.

[0007] The positional relationships of the components in this specification are defined below. The first to third components constitute the structure of the connector assembly. In this specification, the first and second components arranged in the front-back direction represent the following states: When viewed from a direction perpendicular to the front-back direction, both the first and second components are positioned on any straight line representing the front-back direction. In this specification, the first and second components arranged in the front-back direction when viewed from the top-bottom direction represent the following states: When viewed from the top-bottom direction, both the first and second components are positioned on any straight line representing the front-back direction. In this case, when viewed from a left-right direction (different from the top-bottom direction), either the first or second component may not be positioned on any straight line representing the front-back direction. Furthermore, the first and second components may be in contact. The first and second components may also be separated. A third component may also exist between the first and second components. This definition also applies to directions other than the front-back direction.

[0008] In this specification, "the first component is positioned above the second component" means that at least a portion of the first component is directly above the second component. Therefore, when viewed in the vertical direction, the first component overlaps with the second component. This definition also applies to directions other than the vertical direction.

[0009] In this specification, the first component is positioned above the second component, including cases where at least a portion of the first component is directly above the second component, and cases where the first component is not directly above the second component but is positioned diagonally above the second component. In the latter case, when viewed in the vertical direction, the first component may not overlap with the second component. "Diagonally above" is, for example, the upper left or upper right. This definition also applies to directions other than vertical.

[0010] In this specification, unless otherwise specified, the parts of the first component are defined as follows: The front part of the first component refers to the front half of the first component. The rear part of the first component refers to the rear half of the first component. The left part of the first component refers to the left half of the first component. The right part of the first component refers to the right half of the first component. The upper part of the first component refers to the upper half of the first component. The lower part of the first component refers to the lower half of the first component. The front end of the first component refers to the frontal end of the first component. The rear end of the first component refers to the rearal end of the first component. The left end of the first component refers to the leftal end of the first component. The right end of the first component refers to the rightal end of the first component. The upper end of the first component refers to the upper end of the first component. The lower end of the first component refers to the lower end of the first component. The front end of the first component refers to the front end and its vicinity. The rear end of the first component refers to the rear end and its vicinity. The left end of the first component refers to the left end and its vicinity. The right end of the first component refers to the right end and its vicinity. The upper end of the first component refers to the upper part of the first component and its vicinity. The lower end of the first component refers to the lower part of the first component and its vicinity.

[0011] When any two components in this specification are defined as a first component and a second component, the relationship between the two components is as follows: In this specification, the first component being supported by a second component includes both a case where the first component is immovably mounted (i.e., fixed) to the second component relative to the second component, and a case where the first component is movably mounted to the second component relative to the second component. Furthermore, the first component being supported by a second component includes both a case where the first component is directly mounted to the second component, and a case where the first component is mounted to the second component via a third component.

[0012] In this specification, the first component being held in relation to the second component includes the case where the first component is immovably mounted (i.e., fixed) to the second component relative to the second component, but does not include the case where the first component is movably mounted to the second component relative to the second component. Furthermore, the first component being held in relation to the second component includes both the case where the first component is directly mounted to the second component and the case where the first component is mounted to the second component via a third component.

[0013] In this specification, "electrical connection between the first component and the second component" means that there is electrical conduction between the first component and the second component. Therefore, the first component and the second component may or may not be in contact. When the first component and the second component are not in contact, a conductive third component is disposed between the first component and the second component.

[0014] In this specification, "the wettability of the solder on the surface of the first component is higher than the wettability of the solder on the surface of the second component" means the following: The portion where the surface of the first component contacts the surface of the solder is defined as the first contact portion. In the first contact portion, the angle formed by the surface of the solder and the surface of the first component is defined as the first contact angle. The portion where the surface of the second component contacts the surface of the solder is defined as the second contact portion. In the second contact portion, the angle formed by the surface of the solder and the surface of the second component is defined as the second contact angle. In this case, if the first contact angle is smaller than the second contact angle, the wettability of the solder on the surface of the first component is higher than the wettability of the solder on the surface of the second component. Conversely, if the first contact angle is larger than the second contact angle, the wettability of the solder on the surface of the first component is higher than the wettability of the solder on the surface of the second component.

[0015] According to the connector of the present invention, a connector capable of achieving a low profile can be obtained. Attached Figure Description

[0016] Figure 1 This is a perspective view of connector assembly 1.

[0017] Figure 2 This is a perspective view of the first connector 10.

[0018] Figure 3 This is a top view of the first connector 10.

[0019] Figure 4 This is a 3D view of the floating terminal 15l.

[0020] Figure 5 This is a 3D view of grounding terminal 14l.

[0021] Figure 6 This is a 3D view of grounding terminal 16b.

[0022] Figure 7 This is a 3D view of the second connector 110.

[0023] Figure 8 This is a top view of the second connector 110.

[0024] Figure 9 This is a 3D view of grounding terminal 114l.

[0025] Figure 10 This is a 3D view of grounding terminal 114l, from the perspective of... Figure 9 Images viewed from different directions.

[0026] Figure 11 This is a bottom view of the grounding terminal 114l.

[0027] Figure 12This is a side view of the grounding terminal 114l.

[0028] Figure 13 yes Figure 1 A sectional view on AA.

[0029] Figure 14 This is a diagram showing the grounding terminal 314l involved in Comparative Example 2.

[0030] Figure 15 This is a diagram showing the grounding terminal 214l involved in a modified example of the grounding terminal 114l.

[0031] Explanation of reference numerals in the attached figures

[0032] 1... Connector assembly; 110... Second connector; 112... Resin body component; lf14... First side surface; ll14... Bottom surface; cn1, cn2... Side metal film; cn3, cn4... Bottom metal film; SF1... Side surface; SF3... Bottom surface; 113a~113v... Signal terminals; 114l, 114r... Grounding terminals; Ar1, Ar2, Ar3, Ar4... Areas. Detailed Implementation

[0033] Hereinafter, a connector assembly 1 having a first connector 10 according to an embodiment of the present invention will be described. Figure 1 This is a perspective view of connector assembly 1.

[0034] The following, such as Figure 1 As shown, the orientation of the second connector 110 and the first connector 10 is defined as the up-down direction. Furthermore, the orientation of the signal terminals 13a to 13v in the first connector 10 is defined as the left-right direction. The left-right direction is orthogonal to the up-down direction. Additionally, the direction orthogonal to both the left-right and up-down directions is defined as the front-back direction. However, the up-down, left-right, and front-back directions in this specification are defined for ease of explanation and may differ from the up-down, left-right, and front-back directions used in the actual use of the connector assembly 1.

[0035] Furthermore, in this embodiment, the direction is defined as follows. Figure 1As shown, the direction consistent with the up-down direction is defined as the Z-axis direction. The direction consistent with the up direction is defined as the positive Z-axis direction. The direction consistent with the down direction is defined as the negative Z-axis direction. The direction consistent with the left-right direction is defined as the X-axis direction. The direction consistent with the right direction is defined as the positive X-axis direction. The direction consistent with the left direction is defined as the negative X-axis direction. The direction consistent with the front-back direction is defined as the Y-axis direction. The direction consistent with the front direction is defined as the negative Y-axis direction. The direction consistent with the back direction is defined as the positive Y-axis direction. However, the X-axis, Y-axis, and Z-axis directions in this specification are defined for ease of explanation and may not be consistent with the X-axis, Y-axis, and Z-axis directions used in the connection assembly 1.

[0036] Connector assembly 1 is used, for example, to connect two circuit boards. Connector assembly 1 includes a first connector 10 and a second connector 110. When the first connector 10 and the second connector 110 are connected, the second connector 110 is positioned on top of the first connector 10.

[0037] [Construction of the first connector]

[0038] Next, the construction of the first connector 10 will be described. Figure 2 This is a perspective view of the first connector 10. Figure 3 This is a top view of the first connector 10. Figure 4 This is a 3D view of the floating terminal 15l. Figure 5 This is a 3D view of grounding terminal 14l. Figure 6 This is a 3D view of grounding terminal 16b.

[0039] like Figure 2 and Figure 3 As shown, the first connector 10 includes a resin body component 12, signal terminals 13a to 13v, ground terminals 14l and 14r, floating terminals 15l and 15r, and ground terminals 16a to 16d.

[0040] like Figure 2 As shown, the resin main body component 12 includes a protrusion 12a, a frame portion 12b, and a connecting portion 12c (see reference). Figure 3 When viewed vertically, the protrusion 12a extends horizontally. More specifically, the protrusion 12a has a cuboid shape. When viewed vertically, the protrusion 12a has two long sides extending horizontally and two short sides extending forward and backward.

[0041] When viewed vertically, the frame portion 12b has a ring shape surrounding the protrusion 12a. More specifically, when viewed vertically, the frame portion 12b has a rectangular outer edge and a rectangular inner edge. The outer edge and inner edge of the frame portion 12b each have two long sides extending in the left-right direction and two short sides extending in the front-back direction, respectively, when viewed vertically. Furthermore, when viewed vertically, the protrusion 12a is located within the area enclosed by the inner edge of the frame portion 12b. The protrusion 12a does not contact the frame portion 12b.

[0042] like Figure 3 As shown, the connecting portion 12c is located between the protrusion 12a and the frame portion 12b when viewed in the vertical direction, and connects the protrusion 12a and the frame portion 12b. In this embodiment, the connecting portion 12c connects the lower part of the protrusion 12a to the lower part of the frame portion 12b. The material of the resin main body component 12 is an insulating material. For example, the material of the resin main body component 12 is resin.

[0043] High-frequency signals are input and output relative to signal terminals 13a to 13v. Signal terminals 13a to 13v are supported by the resin body component 12. More specifically, a portion of signal terminals 13a to 13k is embedded behind the frame portion 12b. Thus, signal terminals 13a to 13k are supported by the frame portion 12b so that they are arranged in a left-right direction in the area behind the protrusion 12a. Signal terminals 13a to 13k are arranged in a row from left to right. A portion of signal terminals 13l to 13v is embedded in the front of the frame portion 12b. Signal terminals 13l to 13v are supported by the frame portion 12b so that they are arranged in a left-right direction in the area before the protrusion 12a. Signal terminals 13l to 13v are located in front of signal terminals 13a to 13k. Signal terminals 13l to 13v are arranged in a row from left to right. Signal terminals 13a to 13k are manufactured by bending a rod-shaped metal component. The materials for signal terminals 13a to 13k are, for example, copper-based materials such as phosphor bronze.

[0044] The floating terminal 15l is not connected to any terminal of the first connector 10, which includes signal terminals 13a-13v and ground terminals 14l and 14r (details described below). Therefore, the potential of the floating terminal 15l is a floating potential. The floating terminal 15l is supported on the resin body component 12. Figure 2 and Figure 3 As shown, the floating terminal 15l covers at least a portion of the left end of the protrusion 12a when viewed in the vertical direction. Figure 4As shown, the floating terminal 15l includes a first portion 15la, a second portion 15lb, a third portion 15lc, and a floating protrusion 15ld. The first portion 15la covers a portion of the left end of the upper surface of the protrusion 12a and a portion of the left surface of the protrusion 12a. The second portion 15lb extends forward from the first portion 15la. The second portion 15lb covers a portion of the left end of the front surface of the protrusion 12a. The third portion 15lc extends rearward from the first portion 15la. The third portion 15lc covers a portion of the left end of the rear surface of the protrusion 12a. The floating protrusion 15ld extends to the left from the lower end of the first portion 15la. The floating terminal 15l is manufactured by bending a metal component. The material of the floating terminal 15l is, for example, a copper-based material such as phosphor bronze. Furthermore, the structure of the floating terminal 15r is symmetrical to that of the floating terminal 15l, therefore its description is omitted.

[0045] The grounding terminal 14l is connected to the grounding potential. The grounding terminal 14l is supported on the resin main body 12. Specifically, the grounding terminal 14l is supported on the frame portion 12b so as to be opposite to the floating terminal 15l in the front-back direction and the left-right direction. The construction of the grounding terminal 14l will be described below.

[0046] like Figure 5 As shown, the grounding terminal 14l includes a first part 14la, a second part 14lb, a third part 14lc, connecting parts 14ld and 14le, and a grounding protrusion 14lf (see reference). Figure 2 and Figure 3 The first part 14la is located on the left, top, and right surfaces of the frame 12b. (See example...) Figure 2 As shown, a portion of the first part 14aa is embedded in the left side of the frame portion 12b. Thus, the first part 14aa is opposite to the floating terminal 15l in the left-right direction. The second part 14lb is provided on the front, upper, and rear surfaces of the left end of the front side of the frame portion 12b. A portion of the second part 14lb is embedded in the front side of the frame portion 12b. Thus, the second part 14lb is opposite to the floating terminal 15l in the front-rear direction. The third part 14lc is provided on the front, upper, and rear surfaces of the left end of the rear side of the frame portion 12b. A portion of the third part 14lc is embedded in the rear side of the frame portion 12b. Thus, the third part 14lc is opposite to the floating terminal 15l in the front-rear direction.

[0047] Connecting part 14ld connects the first part 14la and the second part 14lb. Connecting part 14le connects the first part 14la and the third part 14lc. Grounding protrusion 14lf extends to the right from the lower end of the first part 14la. Grounding terminal 14l is manufactured by bending a metal part. The material of grounding terminal 14l is, for example, a copper-based material such as phosphor bronze. Furthermore, the structure of grounding terminal 14r is symmetrical to that of grounding terminal 14l, so its description is omitted.

[0048] Grounding terminal 16b is connected to a ground potential. Grounding terminal 16b is supported on the resin body component 12. In this embodiment, grounding terminal 16b is supported on the front left side of the resin body component 12. Figure 6 As shown, the grounding terminal 16b includes a contact portion 16ba, a spring portion 16bb, a fixing portion 16bc, and an external connection portion 16bd. The spring portion 16bb, the fixing portion 16bc, and the external connection portion 16bd are arranged sequentially from right to left. The external connection portion 16bd is the portion to which solder is applied when the first connector 10 is mounted on the circuit board. The fixing portion 16bc is embedded in the resin body component 12.

[0049] The spring portion 16bb is not supported on the resin body component 12. Therefore, the spring portion 16bb can elastically deform to flex in the front-rear direction. The contact portion 16ba extends rearward from the right end of the spring portion 16bb. The grounding terminal 16b is manufactured by bending a metal component. The material of the grounding terminal 16b is, for example, a copper-based material such as phosphor bronze. Furthermore, the structure of the grounding terminal 16a is symmetrical to the structure of the grounding terminal 16b, so its description is omitted. The structure of the grounding terminal 16d is symmetrical to the structure of the grounding terminal 16b, so its description is omitted. The structure of the grounding terminal 16c is symmetrical to the structure of the grounding terminal 16a, so its description is omitted.

[0050] In the first connector 10 as described above, such as Figure 3 As shown, when viewed vertically, at least a portion of the area between the first part 14la and the floating terminal 15l is provided with a through hole Hl that extends vertically through the connecting portion 12c. Furthermore, the grounding protrusion 14lf protrudes into the through hole Hl when viewed vertically. The floating protrusion 15ld also protrudes into the through hole Hl when viewed vertically. The grounding protrusion 14lf and the floating protrusion 15ld are arranged horizontally. Moreover, the structure of the through hole Hr is symmetrical to the structure of the through hole Hl, therefore its description is omitted.

[0051] The first connector 10, as described above, is mounted on the circuit board. At this time, a portion of the signal terminals 13a-13v, ground terminals 14l, 14r, floating terminals 15l, 15r, and ground terminals 16a-16d are exposed from the bottom surface of the resin body component 12. Therefore, solder is applied to these portions respectively. As a result, the signal terminals 13a-13v, ground terminals 14l, 14r, floating terminals 15l, 15r, and ground terminals 16a-16d are respectively connected to the electrodes of the circuit board.

[0052] [Construction of the second connector]

[0053] Next, the construction of the second connector 110 will be described. Figure 7 This is a 3D view of the second connector 110. Figure 7 This is a 3D view of the second connector 110. Figure 8 This is a top view of the second connector 110. Figure 9 This is a 3D view of grounding terminal 114l. Figure 10 This is a 3D view of grounding terminal 114l, from the perspective of... Figure 9 Images viewed from different directions. Figure 11 This is a bottom view of the grounding terminal 114l. Figure 12 This is a side view of the grounding terminal 114l.

[0054] like Figure 7 As shown, the second connector 110 includes a resin body component 112, signal terminals 113a to 113v, and ground terminals 114l and 114r.

[0055] The resin main body component 112 includes a bottom portion 112a and a frame portion 112b. The frame portion 112b has a ring shape when viewed vertically. More specifically, the frame portion 112b has a rectangular outer edge and a rectangular inner edge when viewed vertically. The outer edge and inner edge of the frame portion 112b each have two long sides extending in the left-right direction and two short sides extending in the front-back direction, respectively, when viewed vertically. The bottom portion 112a, when viewed vertically, blocks a portion of the vertical end face of the area enclosed by the frame portion 112b. Figure 7 and Figure 8 As shown, the bottom part 112a blocks the upper surface of the area enclosed by the frame part 112b when viewed in the vertical direction. The material of the resin body component 112 is an insulating material. The material of the resin body component 112 is, for example, resin.

[0056] High-frequency signals are input and output relative to signal terminals 113a to 113v. Signal terminals 113a to 113v are supported by the resin body component 112. More specifically, a portion of signal terminals 113a to 113k is embedded behind the frame portion 112b. Signal terminals 113a to 113k are arranged in a row from left to right. A portion of signal terminals 113l to 113v is embedded in front of the frame portion 112b. Signal terminals 113l to 113v are located in front of signal terminals 113a to 113k. Signal terminals 113l to 113v are arranged in a row from left to right. Signal terminals 113a to 113k are manufactured by bending a rod-shaped metal component. The material of signal terminals 113a to 113k is, for example, a copper-based material such as phosphor bronze.

[0057] Grounding terminal 114l is connected to a grounding potential. Grounding terminal 114l is supported by resin body component 112. A portion of grounding terminal 114l is embedded in the front left end, the rear left end, and the left side of frame portion 112b. A portion of grounding terminal 114l protrudes from resin body component 112. Grounding terminal 114l is manufactured by bending a metal component. The material of the metal component is, for example, a copper-based material such as phosphor bronze. A metal plating is applied to the surface of the metal component. The metal plating covers the entire surface of grounding terminal 114l. In this case, the surface of grounding terminal 114l refers to the surface to which the metal plating is applied. The material of the metal plating is, for example, a metallic material such as nickel (Ni).

[0058] like Figure 9 As shown, the grounding terminal 114l includes a bottom portion 1114, a first side portion 1f14, a second side portion 1b14, a central portion 1d14, side metal films cn1 and cn2, and bottom metal films cn3 and cn4.

[0059] A bottom portion 1114 is provided on the upper left side of the frame portion 112b. A portion of the bottom portion 1114 is embedded in the left side of the frame portion 112b. A portion of the bottom portion 1114 protrudes from the resin body component 112. Specifically, the bottom portion 1114 has a bottom surface SF3. The bottom surface SF3 protrudes from the resin body component 112. The bottom surface SF3 protrudes from the upper surface of the resin body component 112. The bottom surface SF3 faces upward. Therefore, in this embodiment, the bottom surface SF3 faces the positive direction of the Z-axis. In addition, the bottom portion 1114 has an upper surface SF4 facing the negative direction of the Z-axis.

[0060] The bottom surface ll14 has a first bottom surface portion Pp14, a second bottom surface portion Qp14, a third bottom surface portion Rp14, a fourth bottom surface portion Sp14, and a fifth bottom surface portion Tp14. The third bottom surface portion Rp14, the second bottom surface portion Qp14, the first bottom surface portion Pp14, the fourth bottom surface portion Sp14, and the fifth bottom surface portion Tp14 are arranged sequentially in the forward direction.

[0061] The first portion of the bottom surface, Pp14, has a rectangular shape extending in the front-to-back direction. The second portion of the bottom surface, Qp14, is connected to the rear end of the first portion of the bottom surface, Pp14. The second portion of the bottom surface, Qp14, has a rectangular shape extending in the left-to-right direction. The third portion of the bottom surface, Rp14, curves downwards from the rear end of the second portion of the bottom surface, Qp14. The fourth portion of the bottom surface, Sp14, is connected to the front end of the first portion of the bottom surface, Pp14. The fourth portion of the bottom surface, Sp14, has a rectangular shape extending in the left-to-right direction. The fifth portion of the bottom surface, Tp14, curves downwards from the front end of the fourth portion of the bottom surface, Sp14.

[0062] A first side portion lf14 is provided on the upper surface, front surface, and rear surface of the left end of the front side of the frame portion 112b. A portion of the first side portion lf14 is embedded in the front side of the frame portion 112b. A portion of the first side portion lf14 protrudes from the resin body component 112. Specifically, the first side portion lf14 has a side portion SF1. The side portion SF1 protrudes from the resin body component 112. The side portion SF1 protrudes from the front surface of the resin body component 112. The side portion SF1 faces forward. Therefore, in this embodiment, the side portion SF1 faces the negative direction of the Y-axis.

[0063] The first side portion lf14 includes a first side portion Pr14, a second side portion Qr14, a third side portion Rr14, a fourth side portion Sr14, and a fifth side portion Tr14. The first side portion Pr14 curves upward from the front end of the fifth side portion Tp14. Therefore, side SF1 is connected to the bottom surface SF3. The second side portion Qr14 extends downward from the lower end of the first side portion Pr14. The third side portion Rr14 curves backward from the lower end of the first side portion Pr14. The fourth side portion Sr14 curves downward from the front end of the third side portion Rr14. The fifth side portion Tr14 extends downward from the upper end of the fourth side portion Sr14.

[0064] The second side portion lb14 is provided on the upper surface, front surface, and rear surface of the left end of the rear side of the frame portion 112b. A portion of the second side portion lb14 is embedded in the rear side of the frame portion 112b. The second side portion lb14 has a side SF2. The side SF2 protrudes from the resin body member 112. The side SF2 protrudes from the rear surface of the resin body member 112. The second side portion lb14 is opposite to the first side portion lf14. Hereinafter, the shape of the second side portion lb14 is symmetrical to the shape of the first side portion lf14, so the description is omitted.

[0065] A central portion ld14 is disposed on the left, right, and lower surfaces of the frame portion 112b. A portion of the central portion ld14 is embedded in the left side of the frame portion 112b. The central portion ld14 is connected to the right end of the first portion Pp14 of the bottom surface. The central portion ld14 extends downward from the right end of the first portion Pp14 of the bottom surface.

[0066] like Figure 9 As shown, the side metal film cn1 covers a portion of the side SF1. Specifically, the side metal film cn1 covers a portion of the front surface of the second portion Qr14 of the first side portion. In this case, the side metal film cn1 is located before the first side portion lf14. The wettability of the solder on the side metal film cn1 is higher than the wettability of the solder on the surface of the metal plating applied to the first side portion lf14. In other words, the wettability of the solder on the side metal film cn1 is higher than the wettability of the solder on the portion of the side SF1 excluding the side metal film cn1. For example, the material of the side metal film cn1 is a metallic material such as gold (Au). As mentioned above, the material of the metal plating is a metallic material such as nickel (Ni). The wettability of the solder on the surface of gold is higher than the wettability of the solder on the surface of nickel.

[0067] like Figure 10 As shown, the side metal film cn2 covers a portion of the side SF2. Specifically, the side metal film cn2 covers a portion of the rear surface of the second side portion lb14. In this case, the side metal film cn2 is located behind the second side portion lb14. The wettability of the solder on the side metal film cn2 is higher than the wettability of the solder on the surface of the metal plating applied to the second side portion lb14. In other words, the wettability of the solder on the side metal film cn2 is higher than the wettability of the solder in the portion of the side SF2 excluding the side metal film cn2. The material of the side metal film cn2 is, for example, a metallic material such as gold (Au).

[0068] like Figure 10As shown, the bottom metal film cn3 covers a portion of the bottom surface SF3. Specifically, the bottom metal film cn3 covers a portion of the upper surface of the fourth portion of the bottom surface Sp14. In this case, the bottom metal film cn3 is located above the fourth portion of the bottom surface Sp14. The bottom metal film cn3 extends in the left-right direction. Therefore, the bottom metal film cn3 extends along the X-axis direction. Specifically, the length of the bottom metal film cn3 in the X-axis direction is longer than the length of the bottom metal film cn3 in the Y-axis direction.

[0069] The wettability of the solder on the bottom metal film cn3 is higher than that of the solder on the surface of the metal plating layer. In other words, the wettability of the solder on the bottom metal film cn3 is higher than that of the solder in the portion of the bottom SF3 excluding the bottom metal films cn3 and cn4. For example, the material of the bottom metal film cn3 is a metal such as gold (Au). As mentioned above, the material of the metal plating layer is a metal such as nickel (Ni). The wettability of the solder on the surface of gold is higher than that of the solder on the surface of nickel.

[0070] like Figure 10 As shown, the bottom metal film cn4 covers a portion of the bottom surface SF3. Specifically, the bottom metal film cn4 covers a portion of the upper surface of the second part of the bottom surface Qp14. The solder wettability of the bottom metal film cn4 is higher than that of the solder in the portion of the bottom surface SF3 excluding the bottom metal films cn3 and cn4. The material of the bottom metal film cn4 is, for example, a metallic material such as gold (Au).

[0071] like Figure 11 As shown, the side metal film cn1 is located to the right of the bottom metal film cn3. Specifically, the region between the two ends of the side metal film cn1 in the left-right direction is defined as Ar1. Similarly, the region between the two ends of the bottom metal film cn3 in the left-right direction is defined as Ar2. Regions Ar1 and Ar2 are arranged alternately to the right. In other words, in the left-right direction, region Ar1 exists at a different position than region Ar2. In this case, region Ar1 between the two ends of the side metal film cn1 in the left-right direction and region Ar2 between the two ends of the bottom metal film cn3 in the left-right direction do not overlap on the axis parallel to the left-right direction. In other words, the region between the two ends of the side metal film cn1 in the X-axis direction and the region between the two ends of the bottom metal film cn3 in the X-axis direction do not overlap on the X-axis.

[0072] Similarly, the region between the two ends of the side metal film cn2 in the left-right direction (not shown) and the region between the two ends of the bottom metal film cn4 in the left-right direction (not shown) do not overlap on the axis parallel to the left-right direction. In other words, the region between the two ends of the side metal film cn2 in the X-axis direction and the region between the two ends of the bottom metal film cn4 in the X-axis direction do not overlap on the X-axis.

[0073] like Figure 11 As shown, in the front-back direction, region Ar3 exists at a different position than region Ar4. Specifically, the bottom metal film cn3 is located behind the side metal film cn1. More specifically, the region between the two ends of the bottom metal film cn3 in the front-back direction is defined as Ar3. Similarly, the region between the two ends of the side metal film cn1 in the front-back direction is defined as Ar4. Regions Ar3 and Ar4 are arranged alternately in the front direction. In other words, region Ar3 between the two ends of the bottom metal film cn3 in the Y-axis direction and region Ar4 between the two ends of the side metal film cn1 in the Y-axis direction are arranged sequentially in the negative Y-axis direction. Therefore, region Ar3 between the two ends of the bottom metal film cn3 in the Y-axis direction and region Ar4 between the two ends of the side metal film cn1 in the Y-axis direction do not overlap on the Y-axis.

[0074] like Figure 12 As shown, a portion of the first side surface portion lf14 is located above the bottom surface portion ll14. More specifically, the side of the first side surface portion lf14 arranged in the vertical direction that is located in the upward direction is defined as the first side surface portion Edlf. In other words, the side of the first side surface portion lf14 arranged in the Z-axis direction that is located in the positive direction of the Z-axis is defined as the first side surface portion Edlf.

[0075] The bottom portion 1114 is connected to a portion of the first side portion Edlf. At this time, the portion of the first side portion Edlf that is not connected to the bottom portion 1114 is located below the upper surface SF4 of the bottom portion 1114. In other words, the portion of the first side portion Edlf that is not connected to the bottom portion 1114 is located in the negative Z-axis direction above the upper surface SF4 of the bottom portion 1114. In this embodiment, the right portion of the first side portion lf14 is located above the upper surface SF4 of the bottom portion 1114.

[0076] like Figure 12 As shown, a cutout Nt is provided on the first side portion lf14. In this embodiment, the cutout Nt has a U-shape when viewed in the front-rear direction. The cutout Nt extends downward from the first side portion Edlf. In other words, the cutout Nt extends in the negative direction of the Z-axis from the first side portion Edlf.

[0077] Furthermore, the structure of the grounding terminal 114r is symmetrical to that of the grounding terminal 114l, so the description is omitted.

[0078] Furthermore, the boundary BD between the side SF1 and the bottom SF3 is as follows. The normal vector HB of the side SF1 and bottom SF3 of the grounding terminal 114l is defined (refer to...). Figure 9The boundary BD is the portion in which the first side surface lf14 connects to the bottom surface ll14, where the angle formed by the normal vector HB and a line parallel to the left and right directions is 45 degrees. In this case, the angle formed by the normal vector HB of the side surface SF1 and a line parallel to the left and right directions is less than 45 degrees. On the other hand, the angle formed by the normal vector HB of the bottom surface SF3 and a line parallel to the left and right directions is greater than 45 degrees.

[0079] [Construction of connector assembly]

[0080] Next, the construction of connector assembly 1 will be described. Figure 13 yes Figure 1 A cross-sectional view at point AA.

[0081] like Figure 1 and Figure 13 As shown, the frame portion 112b of the second connector 110 is inserted into the area enclosed by the frame portion 12b of the first connector 10. At this time, the protrusion 12a of the first connector 10 is inserted into the area enclosed by the frame portion 112b of the second connector 110. Thus, signal terminals 13a to 13v contact signal terminals 113a to 113v, respectively. Additionally, ground terminals 14l and 14r contact ground terminals 114l and 114r, respectively. Furthermore, ground terminals 16a and 16b contact ground terminal 114l. Specifically, ground terminal 16a contacts the side metal film cn1. Ground terminal 16b contacts the side metal film cn2. Ground terminals 16c and 16d contact ground terminal 114r.

[0082] However, the floating terminals 15l and 15r do not contact the signal terminals 113a to 113v and the ground terminals 114l and 114r. Therefore, even when the second connector 110 is connected to the first connector 10, the potentials of the floating terminals 15l and 15r remain floating. The ground terminal 114l is mounted on a circuit board (not shown). Specifically, the bottom metal films cn3 and cn4 are fixed to the electrodes of the circuit board using solder. Therefore, solder (hereinafter referred to as the first solder) is applied to the bottom metal films cn3 and cn4.

[0083] [Effect]

[0084] According to the second connector 110, the second connector 110 can be made lower in profile. More specifically, as Figure 11As shown, in the second connector 110, the region Ar1 between the two ends of the side metal film cn1 in the X-axis direction and the region Ar2 between the two ends of the bottom metal film cn3 in the X-axis direction do not overlap in the X-axis, thus enabling the second connector 110 to be lower in profile. Hereinafter, a connector (hereinafter referred to as Comparative Example 1) in which the regions between the two ends of the side metal film in the X-axis direction and the regions between the two ends of the bottom metal film in the X-axis direction overlap in the X-axis direction and the second connector 110 will be compared and explained.

[0085] In Comparative Example 1, the first solder wets and spreads on the surface of the bottom metal film. At this time, the first solder that wets and spreads on the surface of the bottom metal film sometimes further wets and spreads around the bottom metal film. The bottom surface of the bottom part is connected to the side surface of the first side part. Therefore, the first solder that wets and spreads around the bottom metal film may reach the side surface of the first side part. Here, the wettability of the solder in the part of the side surface other than the side metal film is lower than the wettability of the solder in the side metal film. Therefore, the first solder is less likely to flow on the surface of the part of the side surface other than the side metal film. Therefore, excessive wetting of the first solder on the side surface can be prevented. Thus, the possibility of the first solder applied to the bottom metal film contacting the side metal film is reduced. As a result, the contact between the ground terminal of the first connector and the side metal film is not hindered by the first solder.

[0086] However, when Comparative Example 1 is made shorter, the length of the first side portion in the Z-axis direction becomes shorter. In other words, the length of the portion of the side portion other than the side metal film in the Z-axis direction becomes shorter. Therefore, compared to the case where no shortening is performed, the distance between the bottom metal film and the side metal film becomes shorter. In this case, the length of the portion with low solder wettability in the Z-axis direction becomes shorter. Therefore, the first solder applied to the bottom metal film can easily cross the portion of the side portion other than the side metal film and reach the side metal film cn1. Therefore, the possibility of the first solder applied to the bottom metal film contacting the side metal film becomes higher. In this case, the first solder hinders the contact between the ground terminal of the first connector and the side metal film. Therefore, in order to prevent the first solder from hindering the contact between the ground terminal of the first connector and the side metal film, Comparative Example 1 cannot be shortened.

[0087] On the other hand, in the second connector 110, the region between the two ends of the side metal film cn1 in the X-axis direction and the region between the two ends of the bottom metal film cn3 in the X-axis direction do not overlap in the X-axis. In this case, compared with the comparative example, the distance between the side metal film cn1 and the bottom metal film cn3 becomes longer. Therefore, the first solder applied to the bottom metal film cn3 is less likely to reach the side metal film cn1 by crossing the portion of the side SF1 other than the side metal film cn1. Therefore, the first solder applied to the bottom metal film cn3 is less likely to contact the side metal film cn1. As shown above, even when the second connector 110 is made lower, the first solder is less likely to contact the side metal film cn1. That is, the second connector 110 equipped with the second connector 110 can be made lower.

[0088] According to the second connector 110, resonance is less likely to occur in the second connector 110. Hereinafter, the second connector 110 will be compared and explained with the connector involved in Comparative Example 2. Figure 14 This is a diagram showing the grounding terminal 314l involved in Comparative Example 2.

[0089] The connector involved in Comparative Example 2 has a grounding terminal 314l. For example... Figure 14 As shown, the grounding terminal 314l includes a first side portion lf34, a bottom portion ll34, a side metal film cn33, and a bottom metal film cn34. The first side portion lf34 is located below the bottom portion ll34. The side metal film cn33 covers a portion of the first side portion lf14. The bottom metal film cn34 covers a portion of the bottom portion ll14.

[0090] like Figure 14 As shown, in Comparative Example 2, the bottom surface portion 1134 is not connected to the first side surface portion 1f34. On the other hand, as... Figure 10 As shown, in the grounding terminal 114l of the second connector 110, the bottom portion 1114 is connected to the first side portion 1f14. In this case, the electrical length between the bottom portion 1114 and the first side portion 1f14 in the grounding terminal 114l is shorter than the electrical length between the bottom portion 1134 and the first side portion 1f34 in Comparative Example 2. Therefore, compared with Comparative Example 2, resonance is less likely to occur in the second connector 110.

[0091] In the second connector 110, the length of the bottom metal film cn3 in the X-axis direction is longer than its length in the Y-axis direction. In this case, the surface area of ​​the bottom metal film increases. Therefore, when the second connector 110 is mounted to the substrate, the amount of solder applied to the bottom metal film cn3 can be increased. Consequently, the fixing strength between the second connector 110 and the substrate increases.

[0092] According to the second connector 110, the first solder applied to the bottom metal film cn3 is less likely to contact the side metal film cn1. More specifically, as... Figure 12 As shown, the bottom portion ll14 has an upper surface SF4 facing the negative direction of the Z-axis. The bottom portion ll14 is connected to a portion of the first side portion Edlf. The portion of the first side portion Edlf that is not connected to the bottom portion ll14 is located in the negative direction of the Z-axis, closer to the upper surface SF4 of the bottom portion ll14. In this case, a portion of the first side portion lf14 is not connected to the bottom portion ll14. Therefore, the first solder wetted on the bottom metal film cn3 has difficulty reaching the side metal film cn1. As a result, the first solder applied to the bottom metal film cn3 does not easily contact the side metal film cn1.

[0093] In addition, such as Figure 11 As shown, in the second connector 110, the region Ar3 between the two ends of the bottom metal film cn3 in the Y-axis direction and the region Ar4 between the two ends of the side metal film cn1 in the Y-axis direction do not overlap on the Y-axis. The regions Ar3 between the two ends of the bottom metal film cn3 in the Y-axis direction and the region Ar4 between the two ends of the side metal film cn1 in the Y-axis direction are arranged sequentially in the negative direction of the Y-axis. In this case, compared to the case where the regions between the two ends of the bottom metal film and the two ends of the side metal film cn1 overlap on the Y-axis, the distance between the side metal film cn1 and the bottom metal film cn3 in the front-back direction becomes longer. Therefore, the solder applied to the side metal film cn1 and the solder applied to the bottom metal film cn3 are less likely to make contact.

[0094] In addition, such as Figure 12 As shown, a cutout Nt extending in the negative Z-axis direction from the first side portion Edlf of the side portion is provided on the first side portion lf14. In this case, compared with a grounding terminal without a cutout Nt, the length of the electrical path between the bottom portion ll14 and the first side portion lf14 can be extended in the grounding terminal 114l. Furthermore, with the cutout Nt provided on the first side portion lf14, it is easier for the inspector to inspect the interior of the second connector 110 during inspection. Specifically, with the cutout Nt provided on the first side portion lf14, the inspector can see the interior of the second connector 110 through the cutout Nt.

[0095] (Modified example of grounding terminal 114l)

[0096] Hereinafter, the grounding terminal 214l, which is a modified example of the grounding terminal 114l, will be described with reference to the accompanying drawings. Figure 15 This is a diagram showing a modified example of grounding terminal 114l, specifically grounding terminal 214l. (See diagram for reference.) Figure 15As shown, the shape of grounding terminal 214l is different from that of grounding terminal 114l.

[0097] like Figure 15 As shown, the grounding terminal 214l has a first side portion lf24 with a shape different from the first side portion lf14, and a second side portion lb24 with a shape different from the second side portion lb14.

[0098] The first side portion lf24 includes a third side portion Rr24 with a shape different from the third side portion Rr14. The first side portion lf24 includes a fourth side portion Sr24 with a shape different from the fourth side portion Sr14. The first side portion lf24 includes a fifth side portion Tr24 with a shape different from the fifth side portion Tr14. The third side portion Rr24 bends forward from the lower end of the second side portion Qr14. The fourth side portion Sr24 bends upward from the front end of the third side portion Rr24. The fifth side portion Tr24 extends upward from the upper end of the fourth side portion Sr24.

[0099] The fifth portion Tr24 of the first side surface has a bottom surface SF3a exposed from the resin body component 112. Specifically, the bottom surface SF3a is exposed from the upper surface of the resin body component 112. Specifically, the side surface SF1a is exposed from the front surface of the resin body component 112. The bottom surface SF3a is connected to the side surface SF1a.

[0100] Grounding terminal 214l includes a side metal film cn5 and a bottom metal film cn6. The side metal film cn5 covers a portion of the side SF1a. The solder wettability of the side metal film cn5 is higher than that of the solder in the portion of the side SF1a excluding the side metal film cn5. The bottom metal film cn6 covers a portion of the bottom SF3a. The solder wettability of the bottom metal film cn6 is higher than that of the solder in the portion of the bottom SF3a excluding the bottom metal film cn6.

[0101] The construction of the second side portion lb24 is symmetrical to that of the first side portion lf24, so the description is omitted.

[0102] The first connector 10 with grounding terminal 214l has the same effect as the first connector 10 with grounding terminal 114l.

[0103] (Other implementation methods)

[0104] The connector involved in this invention is not limited to the first connector 10, and can be modified within the scope of its spirit.

[0105] Furthermore, grounding terminals 14r, 16a to 16d and floating terminal 15r are not essential components.

[0106] Furthermore, in this specification, the ring shape includes not only complete rings but also partially damaged rings. However, for the ring shape, the damaged portion accounts for less than 20% of the total ring.

[0107] Furthermore, the grounding terminal 14l only needs to be opposite to the floating terminal 15l in either the front-back direction or the left-right direction. Therefore, the grounding terminal 14l can also be opposite to the floating terminal 15l in the front-back direction, but not in the left-right direction. The grounding terminal 14l can also be opposite to the floating terminal 15l in the left-right direction, but not in the front-back direction.

[0108] Alternatively, through holes Hl and Hr may not be required.

[0109] Furthermore, the grounding protrusion 14lf and the floating protrusion 15ld are not essential components.

[0110] Furthermore, the floating terminals 15l and 15r can be connected to the electrodes of the circuit board or not.

[0111] In addition, the first connector 10 may also have any one of signal terminals 13a to 13k or signal terminals 13l to 13v.

[0112] Furthermore, the front-back direction may not necessarily align with the Y-axis direction, and the left-right direction may not necessarily align with the X-axis direction. For example, the front-back direction may align with the X-axis direction, and the left-right direction may align with the Y-axis direction. Therefore, for example, if side SF1 faces left, side SF1 may also face the negative Y-axis direction. In this case, the region between the two ends of the side metal films cn1 and cn2 in the front-back direction becomes the region between the two ends of the side metal film cn1 in the X-axis direction. Similarly, the region between the two ends of the bottom metal films cn3 and cn4 in the front-back direction becomes the region between the two ends of the bottom metal films cn3 and cn4 in the X-axis direction. Therefore, even in the above cases, the regions between the two ends of the side metal films cn1 and cn2 in the X-axis direction and the regions between the two ends of the bottom metal films cn3 and cn4 do not overlap on the X-axis.

[0113] Similarly, the right direction may not necessarily coincide with the positive direction of the X-axis, and the left direction may not necessarily coincide with the negative direction of the X-axis. For example, the left direction may coincide with the positive direction of the X-axis, and the right direction may coincide with the negative direction of the X-axis.

[0114] Furthermore, the vertical direction may not necessarily be the same as the Z-axis direction.

[0115] In addition, the bottom metal films cn3 and cn4 may not necessarily extend along the X-axis.

[0116] Furthermore, the material of the metal plating may not necessarily be nickel.

[0117] Furthermore, the materials of the side metal films cn1 and cn2 may not necessarily be gold.

[0118] Furthermore, the material of the bottom metal film cn3 and cn4 may not necessarily be gold.

[0119] Furthermore, a metal plating may not necessarily be applied to the surface of metal parts.

[0120] Furthermore, the length of the bottom metal film cn3 in the X-axis direction may not necessarily be longer than the length of the bottom metal film cn3 in the Y-axis direction.

[0121] Furthermore, the first side face lf14 may not necessarily have a cutout Nt.

[0122] Furthermore, the incision Nt may not necessarily have a U-shape when viewed from the front and back.

[0123] Furthermore, the region Ar3 between the two ends of the bottom metal film cn3 in the Y-axis direction and the region Ar4 between the two ends of the side metal film cn1 in the Y-axis direction may not necessarily overlap in the Y-axis.

[0124] Furthermore, the portion of the first side Edlf that is not connected to the bottom part ll14 may not necessarily be located in the negative Z-axis direction of the upper surface SF4 of the bottom part ll14.

[0125] Furthermore, the regions Ar3 between the two ends of the bottom metal film cn3 on the Y-axis and Ar4 between the two ends of the side metal film cn1 on the Y-axis may not necessarily be arranged sequentially in the negative direction of the Y-axis.

Claims

1. A connector, wherein, have: Resin main body components; The signal terminal is supported on the resin body component; as well as The grounding terminal is supported by the resin body component. The grounding terminal includes: The side portion has a side facing the negative direction of the Y-axis and exposed from the resin body component; The bottom part has a bottom surface that faces the positive direction of the Z-axis and is exposed from the resin body component; A side metal film, covering a portion of the side; and A metal film covers a portion of the bottom surface. The region between the two ends of the side metal film in the X-axis direction does not overlap with the region between the two ends of the bottom metal film in the X-axis direction. The side surface is connected to the bottom surface.

2. The connector according to claim 1, wherein, The wettability of the solder on the side metal film is higher than that of the solder on the side excluding the side metal film. The wettability of the solder on the bottom metal film is higher than that of the solder on the bottom surface excluding the bottom metal film.

3. The connector according to claim 1 or 2, wherein, The length of the bottom metal film in the X-axis direction is longer than the length of the bottom metal film in the Y-axis direction.

4. The connector according to claim 1 or 2, wherein, The bottom surface has an upper surface facing the negative direction of the Z-axis. The side of the side portion located in the positive direction of the Z-axis among the two sides arranged along the Z-axis is defined as the first side of the side portion. The bottom part is connected to a portion of the first side part. The portion of the first side of the side portion that is not connected to the bottom portion is located in the negative Z-axis direction compared to the upper surface of the bottom portion.

5. The connector according to claim 1 or 2, wherein, The region between the two ends of the bottom metal film in the Y-axis direction does not overlap with the region between the two ends of the side metal film in the Y-axis direction. The regions between the two ends of the bottom metal film along the Y-axis and the regions between the two ends of the side metal film along the Y-axis are arranged sequentially along the negative direction of the Y-axis.

6. The connector according to claim 1 or 2, wherein, The side of the side portion located in the positive direction of the Z-axis among the two sides arranged along the Z-axis is defined as the first side of the side portion. A cut is provided on the side surface, extending from the first edge of the side surface in the negative direction of the Z-axis.

Images