Electronic device, robot, and mobile station

Abstract

Provided are an electronic device, a robot, and a mobile station that can suppress a decrease in reliability of mechanical and electrical connection. The electronic device has an electronic component, a wiring substrate, and a thermosetting adhesive. The electronic component has a laminate, a first terminal, a second terminal, and a recess. The laminate has an intermediate layer disposed between first and second substrates, and has a first side surface, a second side surface connected to one side of the first side surface, and a third side surface connected to the other side. The first terminal is disposed on the first side surface of the first substrate. The second terminal is disposed on the first side surface of the second substrate. The recess is located between the first and second terminals, and is recessed from the first side surface. The wiring substrate is disposed opposite the first side surface. The thermosetting adhesive is located between the wiring substrate and the electronic component, and mechanically and electrically connects the wiring substrate and the electronic component. Furthermore, the recess extends along the first side surface, and both ends of the recess are open at the second side surface or the third side surface.

Description

Technical Field

[0001] This invention relates to electronic devices, robots, and mobile stations. Background Technology

[0002] For example, the mounting structure described in Patent Document 1 includes a flexible wiring board, a non-flexible component, a connecting portion connecting the flexible wiring board and the non-flexible component, and a protective resin for sealing the connecting portion. Furthermore, a through-hole is formed on the flexible wiring board, through which the protective resin is supplied.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-145041

[0004] However, in the mounting structure of Patent Document 1, when a thermosetting adhesive is used as a connector to link the flexible wiring board and the non-flexible component, the air present in the gap between the flexible wiring board and the non-flexible component expands during the heating process, generating bubbles in the thermosetting adhesive. Therefore, the bonding strength and electrical reliability may be reduced. Summary of the Invention

[0005] The electronic device of the present invention includes an electronic component, a wiring substrate, and a thermosetting adhesive. The electronic component has a laminate, a first terminal, a second terminal, and a recess. The laminate has an intermediate layer disposed between a first substrate and a second substrate, and has a first side, a second side connected to one side of the first side, and a third side connected to the other side of the first side. The first terminal is disposed on the first side of the first substrate, and the second terminal is disposed on the first side of the second substrate. The recess is located between the first terminal and the second terminal and is recessed from the first side. The wiring substrate is disposed opposite to the first side. The thermosetting adhesive is located between the wiring substrate and the electronic component and mechanically and electrically connects the wiring substrate and the electronic component. The recess extends along the first side, and both ends of the recess open at the second side or the third side.

[0006] The robot of the present invention includes: at least one joint; and an electronic device for driving the joint. The electronic device includes an electronic component, a wiring substrate, and a thermosetting adhesive. The electronic component includes a laminate, a first terminal, a second terminal, and a recess. The laminate has an intermediate layer disposed between a first substrate and a second substrate, and has a first side, a second side connected to one side of the first side, and a third side connected to the other side of the first side. The first terminal is disposed on the first side of the first substrate, and the second terminal is disposed on the first side of the second substrate. The recess is located between the first terminal and the second terminal and is recessed from the first side. The wiring substrate is disposed opposite to the first side. The thermosetting adhesive is located between the wiring substrate and the electronic component and mechanically and electrically connects the wiring substrate and the electronic component. The recess extends along the first side, and both ends of the recess open at the second side or the third side.

[0007] The mobile stage of the present invention includes: a base; a movable part connected to the base; and an electronic device for moving the movable part relative to the base. The electronic device includes an electronic component, a wiring substrate, and a thermosetting adhesive. The electronic component includes a laminate, a first terminal, a second terminal, and a recess. The laminate has an intermediate layer disposed between a first substrate and a second substrate, and has a first side, a second side connected to one side of the first side, and a third side connected to the other side of the first side. The first terminal is disposed on the first side of the first substrate, and the second terminal is disposed on the first side of the second substrate. The recess is located between the first terminal and the second terminal and is recessed from the first side. The wiring substrate is disposed opposite to the first side. The thermosetting adhesive is located between the wiring substrate and the electronic component and mechanically and electrically connects the wiring substrate and the electronic component. The recess extends along the first side, and both ends of the recess open at the second side or the third side. Attached Figure Description

[0008] Figure 1 This is a top view showing the piezoelectric motor according to the first embodiment of the present invention.

[0009] Figure 2 yes Figure 1 Sectional view along line AA in the diagram.

[0010] Figure 3 yes Figure 1 BB line section view.

[0011] Figure 4 yes Figure 1 The CC line section view.

[0012] Figure 5 This is a perspective view showing the first side of a piezoelectric actuator.

[0013] Figure 6 This is a top view showing the driving state of the piezoelectric actuator.

[0014] Figure 7 This is a top view showing the driving state of the piezoelectric actuator.

[0015] Figure 8 This is a top view showing the junction between the wiring board and the piezoelectric actuator.

[0016] Figure 9 This is a cross-sectional view illustrating the bonding method between the wiring board and the piezoelectric actuator.

[0017] Figure 10 This is a cross-sectional view illustrating the bonding method between the wiring board and the piezoelectric actuator.

[0018] Figure 11 This is a cross-sectional view illustrating the bonding method between the wiring board and the piezoelectric actuator.

[0019] Figure 12 This is a cross-sectional view showing the electronic device according to the second embodiment.

[0020] Figure 13 This is a perspective view showing the first side of the piezoelectric actuator according to the third embodiment.

[0021] Figure 14 This is a perspective view showing a modified example of a piezoelectric actuator.

[0022] Figure 15 This is a top view showing a modified example of a piezoelectric actuator.

[0023] Figure 16 This is a top view showing a modified example of a piezoelectric actuator.

[0024] Figure 17 This is a perspective view of the robot according to the fourth embodiment.

[0025] Figure 18 This is a top view showing the mobile platform according to the fifth embodiment.

[0026] Explanation of reference numerals in the attached figures

[0027] 1…Piezoelectric motor, 10…Thermosetting adhesive, 100…Electronic equipment, 2…Rotor, 3…Piezoelectric drive device, 4…Piezoelectric actuator (electronic component), 4A…Piezoelectric element, 4B…Piezoelectric element, 4C…Piezoelectric element, 4D…Piezoelectric element, 4E…Piezoelectric element, 4F…Piezoelectric element, 4G…Piezoelectric element, 40…Laminated body, 400…Intermediate layer, 401…Recess, 41…Vibrating part, 42…Support part, 421…First side, 422…Second side, 423…Third side, 43…Beam, 44…Protrusion, 5…Force application component, 51…Holding part, 52…Base, 53…Spring assembly, 54…Spring assembly, 6…Piezoelectric substrate, 6A…Piezoelectric Components, 6B…piezoelectric element, 6C…piezoelectric element, 6D…piezoelectric element, 6E…piezoelectric element, 6F…piezoelectric element, 6G…piezoelectric element, 61…first substrate, 62…piezoelectric element layer, 621…spacer, 631…piezoelectric body, 632…electrode, 633…electrode, 7…piezoelectric substrate, 7A…piezoelectric element, 7B…piezoelectric element, 7C…piezoelectric element, 7D…piezoelectric element, 7E…piezoelectric element, 7F…piezoelectric element, 7G…piezoelectric element, 71…second substrate, 72…piezoelectric element layer, 721…spacer, 731…piezoelectric body, 732…electrode, 733…electrode, 8…wiring substrate, 81…substrate, 821…wiring, 822… Wiring, 823… Wiring, 824… Wiring, 825… Wiring, 826… Wiring, 827… Wiring, 9… Control device, 1000… Robot, 1100… Base, 1200… Robotic arm, 1210… Arm, 1220… Arm, 1230… Arm, 1240… Arm, 1250… Arm, 1260… Arm, 1300… End effector, 2000… Moving platform, 2100… Base, 2200… Movable part, 2210… First movable part, 2220… Second movable part, 2230… Third movable part, 2310… Electronic device, 2320… Electronic device, 2330… Electronic device, A1… Arrow, A2… Arrow, B… Adhesive, B 1…Arrow, B2…Arrow, J1…Joint, J2…Joint, J3…Joint, J4…Joint, J5…Joint, J6…Joint, O1…Rotation axis, ST…Workbench, T11…First terminal, T12…First terminal, T13…First terminal, T14…First terminal, T15…First terminal, T16…First terminal, T17…First terminal, T21…Second terminal, T22…Second terminal, T23…Second terminal, T24…Second terminal, T25…Second terminal, T26…Second terminal, T27…Second terminal, TH1…First through hole, TH11…Expanding section, TH12…Contracting section, TH13…Step, TH2…Second through hole. Detailed Implementation

[0028] Hereinafter, the electronic device, robot, and mobile station of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.

[0029] First Implementation Method

[0030] Figure 1 This is a top view showing the piezoelectric motor according to the first embodiment of the present invention. Figure 2 yes Figure 1 Sectional view along line AA in the diagram. Figure 3 yes Figure 1 BB line section view. Figure 4 yes Figure 1 The CC line section view. Figure 5 This is a perspective view showing the first side of a piezoelectric actuator. Figure 6 and Figure 7 This is a top view showing the driving state of the piezoelectric actuator. Figure 8 This is a top view showing the junction between the wiring board and the piezoelectric actuator. Figures 9 to 11 These are cross-sectional views illustrating the bonding method between the wiring substrate and the piezoelectric actuator.

[0031] It should be noted that, for ease of explanation, the rotor side of the piezoelectric actuator will be referred to as the "front end side," and the side opposite to the rotor will be referred to as the "base end side." Furthermore, the three mutually orthogonal axes will be designated as the X-axis, Y-axis, and Z-axis; the direction along the X-axis will be referred to as the X-axis direction, the direction along the Y-axis as the Y-axis direction, and the direction along the Z-axis as the Z-axis direction. Additionally, the arrow side of each axis will be referred to as the "positive side," and the side opposite to the arrow will be referred to as the "negative side."

[0032] Figure 1 The piezoelectric motor 1 shown has a rotor 2 capable of rotating around a rotation axis O1 and an electronic device 100 serving as a drive source to rotate the rotor 2. The electronic device 100 also includes a piezoelectric drive device 3 that abuts against the outer peripheral surface of the rotor 2, a wiring board 8 connected to the piezoelectric drive device 3, and a control device 9 electrically connected to the piezoelectric drive device 3 via the wiring board 8. In the piezoelectric motor 1, the piezoelectric drive device 3 is driven by the control device 9, and the driving force generated by the piezoelectric drive device 3 is transmitted to the rotor 2, thereby causing the rotor 2 to rotate around the rotation axis O1. However, the configuration of the piezoelectric motor 1 is not particularly limited. For example, a slider capable of linear movement may be used instead of the rotor 2.

[0033] The piezoelectric drive device 3 includes a piezoelectric actuator 4 as an electronic component and a force-applying component 5 that applies force to the piezoelectric actuator 4 toward the rotor 2. In addition, the piezoelectric actuator 4 has a laminate 40 and a protrusion 44. The laminate 40 includes a vibrating part 41, a support part 42 that supports the vibrating part 41, and a beam part 43 that connects the vibrating part 41 and the support part 42. The protrusion 44 is disposed at the front end of the vibrating part 41 and transmits the vibration of the vibrating part 41 to the rotor 2.

[0034] The vibration unit 41 includes piezoelectric elements 4A to 4F for driving and a piezoelectric element 4G for detecting the vibration of the vibration unit 41. In the center of the vibration unit 41, piezoelectric elements 4C and 4D are arranged in the X-axis direction. Furthermore, on the negative Y-axis side of piezoelectric elements 4C and 4D, piezoelectric elements 4A and 4B are arranged in the X-axis direction, and on the positive Y-axis side, piezoelectric elements 4E and 4F are arranged in the X-axis direction. These piezoelectric elements 4A to 4F extend and retract in the X-axis direction when energized. However, the number and arrangement of the driving piezoelectric elements are not particularly limited as long as they can excite the vibration unit 41 to produce the desired vibration.

[0035] A piezoelectric element 4G for detection is disposed between piezoelectric elements 4C and 4D. The piezoelectric element 4G is subjected to an external force corresponding to the vibration of the vibrating part 41 and outputs a detection signal corresponding to the applied external force. Therefore, the vibration state of the vibrating part 41 can be detected based on the detection signal output from the piezoelectric element 4G. It should be noted that the number and arrangement of the piezoelectric elements for detection are not particularly limited as long as the vibration of the vibrating part 41 can be detected. Alternatively, the piezoelectric elements for detection may be omitted.

[0036] The support portion 42 is U-shaped, surrounding the two sides and the base end of the vibrating portion 41. Furthermore, the support portion 42 has a first side surface 421 facing the negative side in the X-axis direction, a second side surface 422 connected to one end of the first side surface 421 and facing the positive side in the Y-axis direction, and a third side surface 423 connected to the other end of the first side surface 421 and facing the negative side in the Y-axis direction. Additionally, the beam portion 43 connects the vibrating portion 41 to the support portion 42. Furthermore, a protrusion 44 is provided at the front end of the vibrating portion 41, and the front end of the protrusion 44 contacts the outer peripheral surface of the rotor 2.

[0037] like Figures 2 to 4As shown, the laminate 40 is constructed by bonding two piezoelectric substrates 6 and 7 together. The piezoelectric substrate 6 has a first substrate 61 and a piezoelectric element layer 62 formed on the back side (the main surface on the negative side in the Z-axis direction) of the first substrate 61. Furthermore, the piezoelectric element layer 62 has piezoelectric elements 6A to 6G disposed in the vibrating portion 41 and spacers 621 disposed in the support portion 42 and the beam portion 43. The piezoelectric elements 6A to 6G are configured such that a piezoelectric body 631 is sandwiched between a pair of electrodes 632 and 633. The electrodes 632 and piezoelectric bodies 631 are integrally formed on each of the piezoelectric elements 6A to 6G, while the electrodes 633 are formed individually on each of the piezoelectric elements 6A to 6G.

[0038] Similarly, the piezoelectric substrate 7 has a second substrate 71 and a piezoelectric element layer 72 formed on the back side (the main surface on the positive side in the Z-axis direction) of the second substrate 71. Furthermore, the piezoelectric element layer 72 has piezoelectric elements 7A to 7G disposed on the vibration section 41 and spacers 721 disposed on the support section 42 and the beam section 43. The piezoelectric elements 7A to 7G are configured such that a piezoelectric body 731 is sandwiched between a pair of electrodes 732 and 733. The electrodes 732 and piezoelectric bodies 731 are integrally formed on each of the piezoelectric elements 7A to 7G, while the electrodes 733 are formed individually on each of the piezoelectric elements 7A to 7G.

[0039] The first and second substrates 61 and 71 are not particularly limited, and silicon substrates can be used for example. Therefore, silicon wafer technology (MEMS technology) can be used to manufacture the first and second substrates 61 and 71, enabling efficient manufacturing of these substrates. Furthermore, the piezoelectric materials 631 and 731 can be piezoelectric ceramics such as lead zirconate titanate (PZT), barium titanate, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, strontium barium titanate (BST), bismuth strontium tantalate (SBT), lead metaniobate, and lead scandium niobate. Additionally, the piezoelectric materials 631 and 731 can be formed using methods such as sol-gel and sputtering.

[0040] The two piezoelectric substrates 6 and 7, as described above, are bonded together with piezoelectric element layers 62 and 72 facing each other via adhesive B. Thus, piezoelectric element 4A is formed by two overlapping piezoelectric elements 6A and 7A; piezoelectric element 4B is formed by two overlapping piezoelectric elements 6B and 7B; piezoelectric element 4C is formed by two overlapping piezoelectric elements 6C and 7C; piezoelectric element 4D is formed by two overlapping piezoelectric elements 6D and 7D; piezoelectric element 4E is formed by two overlapping piezoelectric elements 6E and 7E; piezoelectric element 4F is formed by two overlapping piezoelectric elements 6F and 7F; and piezoelectric element 4G is formed by two overlapping piezoelectric elements 6G and 7G.

[0041] Furthermore, the thickness of the support portion 42 and the beam portion 43 is made consistent with the thickness of the vibrating portion 41 by an intermediate layer 400 composed of two spacers 621 and 721. As a result, the deflection of the first and second substrates 61 and 71 is suppressed.

[0042] In addition, such as Figure 5 As shown, first terminals T11, T12, T13, T14, T15, T16, and T17 are disposed on the first side surface 421 of the first substrate 61. Furthermore, the first terminals T11 to T17 are disposed separately from each other along the X-axis direction.

[0043] The first terminal T11 is electrically connected to the electrode 633 of piezoelectric element 6A via wiring not shown; the first terminal T12 is electrically connected to the electrode 633 of piezoelectric element 6B via wiring not shown; the first terminal T13 is electrically connected to the electrodes 633 of piezoelectric elements 6C and 6D via wiring not shown; the first terminal T14 is electrically connected to the electrode 633 of piezoelectric element 6E via wiring not shown; the first terminal T15 is electrically connected to the electrode 633 of piezoelectric element 6F via wiring not shown; the first terminal T16 is electrically connected to the electrode 633 of piezoelectric element 6G via wiring not shown; and the first terminal T17 is electrically connected to the electrode 632 via wiring not shown. Thus, the first terminals T11 to T17 can be electrically connected to each of the piezoelectric elements 6A to 6G.

[0044] Similarly, second terminals T21, T22, T23, T24, T25, T26, and T27 are disposed on the first side surface 421 of the second substrate 71. These second terminals T21 to T27 are disposed separately from each other along the X-axis direction.

[0045] The second terminal T21 is electrically connected to electrode 733 of piezoelectric element 7A via wiring not shown; the second terminal T22 is electrically connected to electrode 733 of piezoelectric element 7B via wiring not shown; the second terminal T23 is electrically connected to electrode 733 of piezoelectric elements 7C and 7D via wiring not shown; the second terminal T24 is electrically connected to electrode 733 of piezoelectric element 7E via wiring not shown; the second terminal T25 is electrically connected to electrode 733 of piezoelectric element 7F via wiring not shown; the second terminal T26 is electrically connected to electrode 733 of piezoelectric element 7G via wiring not shown; and the second terminal T27 is electrically connected to electrode 732 via wiring not shown. Thus, each piezoelectric element 7A to 7G can be electrically connected via the second terminals T21 to T27.

[0046] In addition, the first terminal T11 and the second terminal T21, the first terminal T12 and the second terminal T22, the first terminal T13 and the second terminal T23, the first terminal T14 and the second terminal T24, the first terminal T15 and the second terminal T25, the first terminal T16 and the second terminal T26, the first terminal T17 and the second terminal T27 are respectively arranged in the Z-axis direction.

[0047] In addition, such as Figure 5 As shown, the laminate 40 has a recessed portion 401 that is recessed from the first side surface 421 of the support portion 42. When viewed from above in the X-axis direction, the recessed portion 401 is located between the first terminals T11-T17 and the second terminals T21-T27. Furthermore, the recessed portion 401 extends along the Y-axis direction, with the end on the positive side of the Y-axis direction opening at the second side surface 422, and the end on the negative side of the Y-axis direction opening at the third side surface 423. By forming a recessed portion 401 with openings at both ends, the reliability of the mechanical and electrical connections between the first terminals T11-T17 and the second terminals T21-T27 and the wiring substrate 8 can be improved. This will be described in detail later.

[0048] The force-applying component 5 applies force towards the rotor 2 to the piezoelectric actuator 4, pressing the protrusion 44 against the outer peripheral surface of the rotor 2. Figure 1 As shown, the force-applying component 5 includes a holding portion 51 that holds the support portion 42 of the piezoelectric actuator 4, a base 52 that fixes the piezoelectric drive device 3 to the worktable ST, and a pair of spring sets 53 and 54 connecting the holding portion 51 and the base 52. The force-applying component 5 applies force to the piezoelectric actuator 4 towards the rotor 2 using the restoring force of the spring sets 53 and 54. However, there are no particular limitations on the configuration of the force-applying component 5, as long as it can apply force to the piezoelectric actuator 4 towards the rotor 2.

[0049] The control device 9, for example, is a computer, having a processor for processing information, a memory that can be connected to the processor in a communicative manner, and an external interface. Furthermore, the memory stores programs that can be executed by the processor, which reads and executes the programs stored in the memory. Such a control device 9 receives instructions from a host computer (not shown) and drives the piezoelectric actuator 4 based on these instructions.

[0050] For example, controlling the phase difference of the alternating voltage applied to piezoelectric elements 4A, 4F, 4B, 4E, and 4C, 4D, such as... Figure 6 As shown, when the front end of the protrusion 44 performs an elliptical motion as indicated by arrow A1, the rotor 2 is propelled out through this elliptical motion, and the rotor 2 rotates clockwise as indicated by arrow B1. Furthermore, as... Figure 7 As shown, when the front end of the protrusion 44 makes an elliptical motion like arrow A2, the rotor 2 is sent out through this elliptical motion, and the rotor 2 rotates counterclockwise as shown by arrow B2.

[0051] like Figure 8 As shown, the wiring substrate 8 is a flexible printed wiring substrate. This increases the flexibility in the arrangement of the wiring substrate 8. The wiring substrate 8 has a substrate 81 and wirings 821, 822, 823, 824, 825, 826, and 827 disposed on the substrate 81. However, the wiring substrate 8 is not particularly limited and can also be a rigid printed wiring substrate.

[0052] Furthermore, the wiring substrate 8 is disposed opposite to the first side surface 421 with the side on which the wirings 821 to 827 are disposed facing the first side surface 421. Thus, the wiring substrate 8 is bonded to the piezoelectric actuator 4 via a conductive thermosetting adhesive 10 disposed between it and the first side surface 421, and is electrically connected to the first terminals T11 to T17 and the second terminals T21 to T27.

[0053] Specifically, such as Figure 8 As shown, wiring 821 is electrically connected to the first and second terminals T11 and T21; wiring 822 is electrically connected to the first and second terminals T12 and T22; wiring 823 is electrically connected to the first and second terminals T13 and T23; wiring 824 is electrically connected to the first and second terminals T14 and T24; wiring 825 is electrically connected to the first and second terminals T15 and T25; wiring 826 is electrically connected to the first and second terminals T16 and T26; and wiring 827 is electrically connected to the first and second terminals T17 and T27. In this way, by joining the wiring substrate 8 to the support portion 42, the vibration of the vibrating portion 41 is not hindered, allowing the piezoelectric actuator 4 to be driven smoothly. Furthermore, the vibration of the vibrating portion 41 is less likely to be transmitted to the thermosetting adhesive 10, thus reducing fatigue of the thermosetting adhesive 10.

[0054] Thermosetting adhesive 10 is, for example, an epoxy-based adhesive containing solder particles (reflow soldering mounting anisotropic conductive paste). By using such an adhesive, the wiring substrate 8 and the support portion 42 can be easily mechanically and electrically connected. Specifically, firstly, as... Figure 9 As shown, uncured thermosetting adhesive 10 is filled into the recess 401. Next, as... Figure 10 As shown, the wiring substrate 8 is attached to the first side surface 421. Next, the thermosetting adhesive 10 is heated to cure, bonding the wiring substrate 8 to the support portion 42. When the thermosetting adhesive 10 is heated, as... Figure 11 As shown, the solder particles H in the thermosetting adhesive 10 self-polymerize on the first terminals T11-T17, the second terminals T21-T27, and the wiring 821-827 to form a metallic bond, thereby preventing adjacent terminals from short-circuiting each other while electrically connecting each terminal and its corresponding wiring.

[0055] If air remains in the recess 401 when the thermosetting adhesive 10 is filled into it, the residual air will expand and form voids (bubbles) within the thermosetting adhesive 10 during the heating process. Due to these voids, the bonding strength between the piezoelectric actuator 4 and the wiring substrate 8 may decrease. Furthermore, moisture intrusion into the voids reduces the insulation between adjacent terminals, potentially causing short circuits. Therefore, the reliability of both mechanical and electrical connections is reduced.

[0056] To address this, in this embodiment, the recess 401 has openings at both ends. Therefore, when the thermosetting adhesive 10 is filled into the recess 401, air inside the recess 401 can easily flow in the Y-axis direction and be expelled from the recess 401, effectively suppressing the formation of the aforementioned gaps. Thus, it is possible to suppress the reduction in the reliability of mechanical and electrical connections.

[0057] The piezoelectric motor 1 as an electronic device has been described above. As previously mentioned, such a piezoelectric motor 1 includes a piezoelectric actuator 4 as an electronic component, a wiring substrate 8, and a thermosetting adhesive 10. The piezoelectric actuator 4 includes a laminate 40, first terminals T11 to T17, second terminals T21 to T27, and a recess 401. The laminate 40 has an intermediate layer 400 disposed between the first substrate 61 and the second substrate 71, and includes a first side 421, a second side 422 connected to one side of the first side 421, and a third side 422 connected to the other side of the first side 421. On side 423, first terminals T11 to T17 are disposed on the first side 421 of the first substrate 61, and second terminals T21 to T27 are disposed on the first side 421 of the second substrate 71. A recess 401 is located between the first terminals T11 to T17 and the second terminals T21 to T27 and is recessed from the first side 421. A wiring substrate 8 is disposed opposite to the first side 421. A thermosetting adhesive 10 is located between the wiring substrate 8 and the piezoelectric actuator 4, mechanically and electrically connecting the wiring substrate 8 and the piezoelectric actuator 4. Furthermore, the recess 401 extends along the first side 421, and both ends of the recess 401 open on the second side 422 or the third side 423. As a result, when uncured thermosetting adhesive 10 is filled into the recess 401, air is less likely to remain in the recess 401, and voids are less likely to occur in the thermosetting adhesive 10. Therefore, according to the piezoelectric motor 1, the reliability of the mechanical and electrical connections can be suppressed.

[0058] Furthermore, as described above, the laminate 40 includes a vibrating portion 41, a support portion 42 supporting the vibrating portion 41, and a beam portion 43 connecting the vibrating portion 41 and the support portion 42. The support portion 42 has a first side surface 421, a second side surface 422, and a third side surface 423. Thus, the wiring substrate 8 is connected to the support portion 42. Therefore, the vibration of the vibrating portion 41 is unimpeded, enabling the piezoelectric actuator 4 to be driven smoothly. Additionally, the reduced transmission of vibration from the vibrating portion 41 also reduces fatigue of the thermosetting adhesive 10.

[0059] Furthermore, as mentioned above, the first substrate 61 and the second substrate 71 are silicon substrates. Therefore, silicon wafer technology (MEMS technology) can be used in the manufacture of the first and second substrates 61 and 71, enabling efficient manufacture of the first and second substrates 61 and 71.

[0060] Second Implementation Method

[0061] Figure 12 This is a cross-sectional view showing the electronic device according to the second embodiment.

[0062] The electronic device 100 of this embodiment is the same as the electronic device 100 of the first embodiment, except that it has multiple piezoelectric actuators 4 stacked on top of each other. Therefore, in the following description, this embodiment will be described in terms of the differences from the first embodiment, and the same items will be omitted. In addition, in the drawings of this embodiment, the same reference numerals are used to mark the same components as in the previous embodiment.

[0063] like Figure 12 As shown, in the piezoelectric drive device 3 of this embodiment, a plurality of piezoelectric actuators 4 are stacked. This increases the driving force of the piezoelectric drive device 3. It should be noted that the number of stacked piezoelectric actuators 4 can be appropriately set according to the required driving force.

[0064] According to this second embodiment, the same effect as the first embodiment described above can also be achieved.

[0065] Third Implementation Method

[0066] Figure 13 This is a perspective view showing the first side of the piezoelectric actuator according to the third embodiment. Figure 14 This is a perspective view showing a modified example of a piezoelectric actuator. Figure 15 and Figure 16 These are top views showing modified examples of piezoelectric actuators.

[0067] The piezoelectric actuator 4 of this embodiment is the same as the piezoelectric actuator 4 of the first embodiment, except that it has the first and second through holes TH1 and TH2. Therefore, in the following description, this embodiment will be described focusing on the differences from the first embodiment, and the same items will be omitted. In addition, in the drawings of this embodiment, the same reference numerals are used to mark the same components as in the previous embodiment.

[0068] like Figure 13 As shown, in the piezoelectric actuator 4 of this embodiment, the first substrate 61 has a first through hole TH1 communicating with the recess 401. Similarly, the second substrate 71 has a second through hole TH2 communicating with the recess 401. Thus, by forming the first and second through holes TH1 and TH2 communicating with the recess 401 on the first and second substrates 61 and 71, air inside the recess 401 is also discharged to the outside of the recess 401 through these first and second through holes TH1 and TH2. Therefore, when uncured thermosetting adhesive 10 is filled into the recess 401, air is less likely to remain in the recess 401, and voids are less likely to form in the thermosetting adhesive 10. Therefore, according to the piezoelectric motor 1, the reliability of mechanical and electrical connections can be further suppressed.

[0069] Furthermore, the first through-hole TH1 is disposed between adjacent first terminals T11 to T17. That is, one first through-hole TH1 is disposed between each of the following first terminals: T11 and T12, T12 and T13, T13 and T14, T14 and T15, T15 and T16, and T16 and T17. Similarly, the second through-hole TH2 is disposed between adjacent second terminals T21 to T27. That is, one second through-hole TH2 is disposed between each of the following second terminals: T21 and T22, T22 and T23, T23 and T24, T24 and T25, T25 and T26, and T26 and T27. With this configuration, the aforementioned effects become more pronounced. In particular, since gaps are less likely to form in the area between adjacent terminals, the reliability reduction of the electrical connection can be further effectively suppressed.

[0070] In the second embodiment described above, as previously stated, the first substrate 61 has a first through hole TH1 communicating with the recess 401. Therefore, air within the recess 401 is also discharged to the outside of the recess 401 through the first through hole TH1. Consequently, when uncured thermosetting adhesive 10 is filled into the recess 401, air is less likely to remain in the recess 401, and voids are less likely to form in the thermosetting adhesive 10.

[0071] Furthermore, as mentioned above, the first substrate 61 has a plurality of first terminals T11 to T17 arranged along the first side surface 421, and a first through hole TH1 is disposed between adjacent first terminals T11 to T17. Therefore, when the uncured thermosetting adhesive 10 is filled into the recess 401, air is less likely to remain in the recess 401, and voids are less likely to form in the thermosetting adhesive 10. In particular, voids are less likely to form in the area between adjacent first terminals T11 to T17, thus further effectively suppressing the reduction in electrical connection reliability.

[0072] Furthermore, as mentioned above, the second substrate 71 has a second through hole TH2 communicating with the recess 401. Therefore, air inside the recess 401 is also discharged to the outside of the recess 401 through the second through hole TH2. As a result, when the uncured thermosetting adhesive 10 is filled into the recess 401, air is less likely to remain in the recess 401, and voids are less likely to form in the thermosetting adhesive 10.

[0073] Furthermore, as described above, the second substrate 71 has a plurality of second terminals T21 to T27 arranged along the first side surface 421, and the second through hole TH2 is disposed between adjacent second terminals T21 to T27. Therefore, when the uncured thermosetting adhesive 10 is filled into the recess 401, air is less likely to remain in the recess 401, and voids are less likely to form in the thermosetting adhesive 10. In particular, voids are less likely to form in the area between adjacent second terminals T21 to T27, thus further effectively suppressing the reduction in electrical connection reliability.

[0074] According to the third embodiment described above, the same effects as those of the first embodiment can be achieved. However, the third embodiment is not limited to this; for example, at least one first terminal T11 to T17 and the second terminal T21 to T27 may be omitted.

[0075] Additionally, for example, such as Figure 14 As shown, each of the first and second through holes TH1 and TH2 can also be opened on the first side surface 421. That is to say, each of the first and second through holes TH1 and TH2 can also be a groove formed on the first side surface 421.

[0076] Additionally, for example, such as Figure 15As shown, the first through hole TH1 may also have an expanded portion TH11 opening on the first side surface 421 and a narrowed portion TH12 opening on the expanded portion TH11 but narrower than the expanded portion TH11. With this configuration, a step TH13 is formed between the first side surface 421 and the narrowed portion TH12 through the expanded portion TH11. This step TH13 then functions as an anchor, preventing the thermosetting adhesive 10 from intruding into the first through hole TH1. Therefore, the first through hole TH1 is less prone to blockage, and air in the recess 401 can be released more reliably through the first through hole TH1. The same applies to the second through hole TH2.

[0077] Additionally, for example, such as Figure 16 As shown, the first through hole TH1 may also have a narrowed portion TH12 opening on the first side 421 and an extended portion TH11 opening on the narrowed portion TH12 and wider than the narrowed portion TH12. With this configuration, the opening width to the first side 421 can be reduced, thereby preventing the thermosetting adhesive 10 from entering the first through hole TH1. Therefore, the first through hole TH1 is less prone to clogging, and air in the recess 401 can be released more reliably through the first through hole TH1. The same applies to the second through hole TH2.

[0078] Fourth Implementation Method

[0079] Figure 17 This is a perspective view of the robot according to the fourth embodiment.

[0080] Figure 17 The robot 1000 shown is capable of performing operations such as supplying, removing, conveying, and assembling precision equipment or its components. The robot 1000 is, for example, a robot that performs operations such as supplying, removing, conveying, and assembling precision equipment or its components. However, there are no particular limitations on the application of the robot 1000.

[0081] Robot 1000 is a six-axis robot with six rotational axes. Robot 1000 has a base 1100 and a robotic arm 1200 that is rotatably connected to the base 1100, and an end effector 1300 is mounted at the front end of the robotic arm 1200.

[0082] Furthermore, the robotic arm 1200 is a robotic arm in which multiple arms 1210, 1220, 1230, 1240, 1250, and 1260 are connected in a freely rotatable manner, and it has six joints J1 to J6. Among them, joints J2, J3, and J5 are bending joints, and joints J1, J4, and J6 are torsional joints. In addition, electronic devices 100, which serve as drive sources, are respectively provided on joints J1, J2, J3, J4, J5, and J6. Therefore, the robot 1000 can enjoy the effect of electronic devices 100 and can exhibit excellent reliability.

[0083] However, there are no particular limitations on the robot 1000, as long as it has at least one joint. In addition, it is sufficient to configure the electronic device 100 on at least one of the joints J1, J2, J3, J4, J5, and J6.

[0084] The robot 1000 has been described above. As previously mentioned, such a robot 1000 has at least one joint J1, J2, J3, J4, J5, J6 and an electronic device 100 for driving the joints J1, J2, J3, J4, J5, J6. Furthermore, the electronic device 100 includes a piezoelectric actuator 4, a wiring substrate 8, and a thermosetting adhesive 10 as electronic components. The piezoelectric actuator 4 has a laminate 40, first terminals T11-T17, second terminals T21-T27, and a recess 401. The laminate 40 has an intermediate layer 400 disposed between the first substrate 61 and the second substrate 71, and includes a first side surface 421, a second side surface 422 connected to one side of the first side surface 421, and a third side surface connected to the other side of the first side surface 421. 423. First terminals T11 to T17 are disposed on the first side surface 421 of the first substrate 61, and second terminals T21 to T27 are disposed on the first side surface 421 of the second substrate 71. A recess 401 is located between the first terminals T11 to T17 and the second terminals T21 to T27, and is recessed from the first side surface 421. A wiring substrate 8 is disposed opposite to the first side surface 421. A thermosetting adhesive 10 is located between the wiring substrate 8 and the piezoelectric actuator 4, and mechanically and electrically connects the wiring substrate 8 and the piezoelectric actuator 4. Furthermore, the recess 401 extends along the first side surface 421, and both ends of the recess 401 open on the second side surface 422 or the third side surface 423. As a result, when uncured thermosetting adhesive 10 is filled into the recess 401, air is less likely to remain in the recess 401, and voids are less likely to occur in the thermosetting adhesive 10. Therefore, according to the electronic device 100, it is possible to suppress the reduction of reliability of mechanical and electrical connections. Therefore, the robot 1000 using such electronic equipment 100 can exhibit excellent reliability.

[0085] Fifth Implementation Method

[0086] Figure 18This is a top view showing the mobile platform according to the fifth embodiment.

[0087] It should be noted that, for ease of explanation, the three mutually orthogonal axes are referred to as the x-axis, y-axis, and z-axis. The direction along the x-axis is also called the x-axis direction, the direction along the y-axis is also called the y-axis direction, and the direction along the z-axis is also called the z-axis direction.

[0088] Figure 18 The illustrated mobile stage 2000 includes a base 2100 and a movable portion 2200 that moves relative to the base 2100. The movable portion 2200 includes a first movable portion 2210 that moves relative to the base 2100 in the y-axis direction, a second movable portion 2220 that moves relative to the first movable portion 2210 in the x-axis direction, and a third movable portion 2230 that moves relative to the second movable portion 2220 about the z-axis. The mobile stage 2000 also includes an electronic device 2310 for moving the first movable portion 2210 relative to the base 2100, an electronic device 2320 for moving the second movable portion 2220 relative to the first movable portion 2210, and an electronic device 2330 for moving the third movable portion 2230 relative to the second movable portion 2220. Furthermore, an electronic device 100 is used as these electronic devices 2310, 2320, and 2330. Therefore, the mobile station 2000 can enjoy the same effect as the electronic device 100 and can perform with excellent reliability.

[0089] However, there are no particular limitations on the mobile station 2000. For example, one or two of the first, second, and third movable parts 2210, 2220, and 2230 may be omitted. In addition, it is not necessary to use electronic device 100 for all electronic devices 2310, 2320, and 2330; it is sufficient to use it for at least one electronic device.

[0090] The mobile stage 2000 has been described above. As previously mentioned, such a mobile stage 2000 includes a base 2100, a movable part 2200 connected to the base 2100, and an electronic device 100 for moving the movable part 2200 relative to the base 2100. Furthermore, the electronic device 100 includes a piezoelectric actuator 4, a wiring substrate 8, and a thermosetting adhesive 10 as electronic components. The piezoelectric actuator 4 includes a laminate 40, first terminals T11-T17, second terminals T21-T27, and a recess 401. The laminate 40 has an intermediate layer 400 disposed between the first substrate 61 and the second substrate 71, and includes a first side surface 421, a second side surface 422 connected to one side of the first side surface 421, and a third side surface connected to the other side of the first side surface 421. 423. First terminals T11 to T17 are disposed on the first side surface 421 of the first substrate 61, and second terminals T21 to T27 are disposed on the first side surface 421 of the second substrate 71. A recess 401 is located between the first terminals T11 to T17 and the second terminals T21 to T27, and is recessed from the first side surface 421. A wiring substrate 8 is disposed opposite to the first side surface 421. A thermosetting adhesive 10 is located between the wiring substrate 8 and the piezoelectric actuator 4, and mechanically and electrically connects the wiring substrate 8 and the piezoelectric actuator 4. Furthermore, the recess 401 extends along the first side surface 421, and both ends of the recess 401 open on the second side surface 422 or the third side surface 423. As a result, when uncured thermosetting adhesive 10 is filled into the recess 401, air is less likely to remain in the recess 401, and voids are less likely to occur in the thermosetting adhesive 10. Therefore, according to the electronic device 100, it is possible to suppress the reduction of reliability of mechanical and electrical connections. Therefore, the mobile station 2000 using such electronic equipment 100 can exhibit excellent reliability.

[0091] The above description, based on the illustrated embodiments, outlines the electronic device, robot, and mobile platform of the present invention. However, the present invention is not limited thereto, and the configurations of each part can be replaced with any configuration having the same function. Furthermore, other arbitrary components can be added to the present invention. Additionally, the various embodiments can be appropriately combined. Furthermore, in the foregoing embodiments, the configuration of applying the piezoelectric motor 1 to the robot 1000 or the mobile platform 2000 has been described. However, the piezoelectric motor 1 can also be applied to various electronic devices requiring driving force, such as printers and projectors, other than the robot 1000 and the mobile platform 2000. Furthermore, in the foregoing embodiments, the configuration of applying electronic equipment to the piezoelectric motor 1 has been described. However, the electronic equipment is not limited to the piezoelectric motor 1.

Claims

1. An electronic device, characterized in that, It contains electronic components, wiring substrates, and thermosetting adhesives. The electronic component has a laminate, a first terminal, a second terminal, and a recess. The laminate has an intermediate layer disposed between a first substrate and a second substrate, and has a first side surface, a second side surface connected to one side of the first side surface, and a third side surface connected to the other side of the first side surface. The first terminal is disposed on the first side surface of the first substrate, the second terminal is disposed on the first side surface of the second substrate, and the recess is located between the first terminal and the second terminal and is recessed from the first side surface. The wiring substrate is positioned opposite to the first side. The thermosetting adhesive is located between the wiring substrate and the electronic component, and mechanically and electrically connects the wiring substrate and the electronic component. The recessed portion extends along the first side, and both ends of the recessed portion open at the second side or the third side.

2. The electronic device according to claim 1, characterized in that, The first substrate has a first through hole communicating with the recess.

3. The electronic device according to claim 2, characterized in that, The first substrate has a plurality of first terminals arranged along the first side. The first through hole is disposed between an adjacent pair of first terminals.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The second substrate has a second through hole communicating with the recessed portion.

5. The electronic device according to claim 4, characterized in that, The second substrate has a plurality of second terminals arranged along the first side surface. The second through hole is disposed between an adjacent pair of second terminals.

6. The electronic device according to claim 1, characterized in that, The laminated body has a vibrating part, a support part that supports the vibrating part, and a beam part that connects the vibrating part and the support part. The support portion has a first side surface, a second side surface, and a third side surface.

7. The electronic device according to claim 1, characterized in that, The first substrate and the second substrate are silicon substrates.

8. A robot, characterized in that, have: At least one joint; and Electronic devices that drive the joint The electronic device includes electronic components, a wiring substrate, and a thermosetting adhesive. The electronic component has a laminate, a first terminal, a second terminal, and a recess. The laminate has an intermediate layer disposed between a first substrate and a second substrate, and has a first side surface, a second side surface connected to one side of the first side surface, and a third side surface connected to the other side of the first side surface. The first terminal is disposed on the first side surface of the first substrate, the second terminal is disposed on the first side surface of the second substrate, and the recess is located between the first terminal and the second terminal and is recessed from the first side surface. The wiring substrate is positioned opposite to the first side. The thermosetting adhesive is located between the wiring substrate and the electronic component, and mechanically and electrically connects the wiring substrate and the electronic component. The recessed portion extends along the first side, and both ends of the recessed portion open at the second side or the third side.

9. A mobile station, characterized in that, have: Base; Movable part, connected to the base; and An electronic device that allows the movable part to move relative to the base. The electronic device includes electronic components, a wiring substrate, and a thermosetting adhesive. The electronic component has a laminate, a first terminal, a second terminal, and a recess. The laminate has an intermediate layer disposed between a first substrate and a second substrate, and has a first side surface, a second side surface connected to one side of the first side surface, and a third side surface connected to the other side of the first side surface. The first terminal is disposed on the first side surface of the first substrate, the second terminal is disposed on the first side surface of the second substrate, and the recess is located between the first terminal and the second terminal and is recessed from the first side surface. The wiring substrate is positioned opposite to the first side. The thermosetting adhesive is located between the wiring substrate and the electronic component, and mechanically and electrically connects the wiring substrate and the electronic component. The recessed portion extends along the first side, and both ends of the recessed portion open at the second side or the third side.

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