Reflow soldering temperature plate preparation method

Abstract

This application relates to a reflow soldering temperature measuring board, comprising the following steps: Step S1, providing a component library, the component library including multiple sub-boards and multiple motherboards, each sub-board including a sub-board body, and the multiple sub-boards including at least one first sub-board having a first device; Step S2, determining the required first sub-board according to the key components of the circuit board to be processed, the first device of the first sub-board corresponding to the key components of the circuit board to be processed; Step S3, determining the required motherboard according to the single board body of the circuit board to be processed; Step S4, detachably connecting the sub-board body and the motherboard to assemble a reflow soldering temperature measuring board, selecting sub-boards and motherboards for assembly for different circuit boards to be processed, to form a general-purpose temperature measuring board with variable thickness, adjustable bearing surface contour dimensions, and controllable key component layout, capable of simulating the circuit board to be processed, low manufacturing cost, high applicability, high temperature measurement accuracy, simple and easy to implement, high production efficiency, low cost, and easy storage and management.

Description

Technical Field

[0001] This application relates to the field of circuit board manufacturing equipment technology, and in particular to a method for preparing a reflow soldering temperature measuring plate. Background Technology

[0002] In the circuit board manufacturing process, the circuit board is reflow soldered in a reflow oven. The soldering quality directly affects the yield of the circuit board. As the hardware carrier of electronic devices, the yield of the circuit board directly affects the quality of the electronic devices.

[0003] To ensure soldering quality, a temperature measuring board is used to measure the temperature of the reflow oven before the circuit board is actually processed. The temperature of the solder joints of key components on the temperature measuring board is collected to adjust the reflow soldering temperature profile. Currently, there are two main types of temperature measuring boards: dedicated temperature measuring boards and general-purpose temperature measuring boards. Dedicated temperature measuring boards are completely identical to the circuit board to be processed, while general-purpose temperature measuring boards are similar in thickness, size, and key components to the circuit board to be processed.

[0004] However, a dedicated temperature measuring board can only correspond to one circuit board. The material, time, and labor costs of using dedicated temperature measuring boards are high, and a large number of them increases the difficulty of storage and management. As the number of circuit board layers, board thickness, current flow, and device types, especially large-sized devices with high heat capacity and temperature sensitivity, increase, the difference between the actual temperature of a general-purpose temperature measuring board and the furnace temperature, as well as the temperature differences between different locations, all increase. This reduces the process window available for operators to adjust the furnace temperature. General-purpose temperature measuring boards cannot accurately simulate the reflow conditions of the circuit board, and the adjusted furnace temperature is not applicable to the circuit board, resulting in low temperature measurement accuracy. Although some general-purpose temperature measuring boards have been improved, such as CN107645847B, which divides the temperature measuring board into three isolated temperature measuring zones, the limited fixed sizes, device types, and layout schemes (only three specifications) cannot simulate the actual size of the circuit board, the key devices on different circuit boards, and their layouts. Multiple temperature measuring boards are needed to cover various temperature measurement schemes, and multiple copies of key devices are required, resulting in material waste and minimal improvement in temperature measurement accuracy. Summary of the Invention

[0005] Therefore, it is necessary to provide a method for preparing a reflow soldering temperature measuring plate to address the problems of high manufacturing cost, low applicability, and low temperature measurement accuracy.

[0006] This application provides a method for preparing a reflow soldering temperature measuring plate, comprising the following steps:

[0007] Step S1: Provide a component library, the component library including multiple sub-boards and multiple motherboards, each sub-board including a sub-board body, and the multiple sub-boards including at least one first sub-board having a first device;

[0008] Step S2: Determine the required first sub-board based on the key components of the circuit board to be processed, wherein the first component of the first sub-board corresponds to the key component of the circuit board to be processed.

[0009] Step S3: Determine the required motherboard based on the single board body of the circuit board to be processed;

[0010] Step S4: Detachably connect the sub-board and the motherboard to assemble them into a reflow soldering temperature measuring plate.

[0011] The above-described method for preparing a reflow soldering temperature measuring plate allows for the selection and assembly of sub-boards and motherboards for different circuit boards to be processed, forming a universal temperature measuring plate with variable thickness, adjustable bearing surface contour dimensions, and controllable key component layout. This method can essentially or completely simulate the circuit board to be processed, offering low manufacturing costs, high applicability, and high temperature measurement accuracy. In the specific preparation of the reflow soldering temperature measuring plate, firstly, in step S1, the component library contains sub-boards and motherboards corresponding to the single-board body and key components of the circuit board to be processed. Pre-fabricated standard-size sub-boards and motherboards facilitate subsequent assembly of the reflow soldering temperature measuring plate. Then, in step S2, the required first sub-board is selected from the component library according to the key components of the circuit board to be processed. The first component of the first daughter board corresponds to the key component of the circuit board to be processed. The first component is the component that needs to be measured on the reflow soldering temperature measuring board. Then, in step S3, the required mother board is selected from the component library according to the single board body of the circuit board to be processed. The thickness and bearing surface outline dimensions of the mother board and daughter board are specifically determined by the single board body. Finally, in step S4, the daughter board body and the mother board are detachably connected to assemble a reflow soldering temperature measuring board corresponding to the circuit board to be processed. Moreover, since the daughter board body and the mother board are detachably connected, after the temperature measurement is completed, the daughter board body and the mother board can be disassembled and stored in the component library for reuse. The above-mentioned method for preparing the reflow soldering temperature measuring board is simple and easy to implement, with high production efficiency, low production cost, and convenient storage and management.

[0012] In one embodiment, step S1 specifically includes:

[0013] Step S11: Compile all single-board body and key component specification values ​​according to the circuit board specification database;

[0014] Step S12: Based on the sorting results, prepare a series of prefabricated standard sub-inner plates, sub-outer plates, mother inner plates and mother outer plates. The sub-inner plates and the sub-outer plates are used to form the first sub-plate, and the mother inner plate and the mother outer plate are used to form the mother plate to form a component library. The sub-inner plate includes an inner plate body, and the first device is disposed on the inner plate body.

[0015] In one embodiment, the prefabricated standard specifically includes:

[0016] The thickness of the inner mother plate, the outer mother plate, the outer sub-plate, and the inner plate body are all consistent and are a series of standard values ​​within the range of 1mm-3mm;

[0017] The bearing surface outline dimensions of the inner mother plate are a series of standard values ​​within the range of 100mm*100mm-600mm*400mm, and the bearing surface outline dimensions of the outer mother plate are a series of standard values ​​with a length exceeding 600mm or a width exceeding 400mm. The bearing surface outlines of the inner plate body and the outer sub-plate are consistent and the dimensions are a series of standard values ​​within the range of 50mm*50mm-100mm*100mm and 50mm*150mm-100mm*150mm.

[0018] All of the first devices cover BGA devices, QFN devices, SOP devices, large heat-container devices, temperature-sensitive devices, and connector elements.

[0019] In one embodiment, step S2 specifically includes:

[0020] Step S21: Determine the required sub-inner board based on the key components, wherein the first component of the sub-inner board corresponds to the key components;

[0021] Step S22: Determine the required sub-outer plate based on the thickness of the single plate and the thickness of the inner plate, wherein the sum of the thicknesses of the sub-outer plate and the inner plate is consistent with the thickness of the single plate;

[0022] Step S23: The bottom surface of the inner plate is convex and concave with the top surface of the outer sub-plate and detachably connected to form the first sub-plate.

[0023] In one embodiment, step S3 specifically includes:

[0024] Step S31: Select a mother inner plate and a mother outer plate from the component library that are consistent with the thickness of the single plate and the outline of the bearing surface. The mother inner plate has at least one first stepped groove that penetrates its thickness, and the mother outer plate has a second stepped groove that penetrates its thickness.

[0025] Step S32: The stepped surface of the second stepped groove is detachably connected to the bottom surface of the inner mother plate in a concave-convex fit.

[0026] In one embodiment, the prefabrication standard further includes that the copper content of the outer motherboard is greater than that of the inner motherboard; step S31 further includes: selecting one or more outer motherboards from the component library that have approximately the same copper content as the single board body.

[0027] In one embodiment, the inner sub-plate, the outer sub-plate, the inner mother plate, and the outer mother plate are provided with pre-made milled grooves; the pre-made standard further includes: the depth of the pre-made milled groove along the thickness direction of the sub-plate body is a series of standard values ​​within 0.5mm-2mm, and the width of the top step surface of the pre-made milled groove is a series of standard values ​​within 3mm-10mm.

[0028] In one embodiment, there are multiple first stepped grooves, and they are in the shape of cells or strips. The spacing between two adjacent sets of first stepped grooves is 2mm-20mm, and the spacing between the edge of the inner mother plate and the adjacent first stepped groove is 2mm-20mm.

[0029] In one embodiment, the inner sub-plate further includes a temperature measuring wire, which runs on the top surface of the inner sub-plate, or the temperature measuring wire runs on the bottom surface of the inner sub-plate and the bottom surface of the inner sub-plate has a pre-milled groove for accommodating the temperature measuring wire.

[0030] In one embodiment, when the key component is a device with high temperature sensitivity, the first device is completely identical to the key component; when the key component is a device with low temperature sensitivity, the first device is substantially the same as the key component. Attached Figure Description

[0031] Figure 1 A flowchart illustrating the steps of a method for preparing a reflow soldering temperature measuring plate according to an embodiment of this application.

[0032] Figure 2 This is a schematic diagram of the structure of a reflow soldering temperature measuring plate provided in one embodiment of this application.

[0033] Figure 3 This is a top view of a reflow soldering temperature measuring plate provided in another embodiment of this application.

[0034] Figure 4 This is a schematic diagram of the structure of the inner plate of the reflow soldering temperature measuring plate provided in one embodiment of this application.

[0035] Figure 5 This is a schematic diagram of the structure of the outer plate of the reflow soldering temperature measuring plate provided in one embodiment of this application.

[0036] Figure 6 This is a schematic diagram of the structure of the inner mother plate in a reflow soldering temperature measuring plate provided in an embodiment of this application.

[0037] Figure 7 This is a schematic diagram of the structure of the outer mother plate in a reflow soldering temperature measuring plate provided in an embodiment of this application.

[0038] Figure 8This is a schematic diagram of the structure of the first sub-board in a reflow soldering temperature measuring plate provided in an embodiment of this application.

[0039] Figure 9 This is a top view of the mother plate in a reflow soldering temperature measuring plate provided in one embodiment of this application.

[0040] Figure 10 This is a top view of a reflow soldering temperature measuring plate provided in one embodiment of this application.

[0041] Figure 11 for Figure 10 Cross-sectional view of the reflow soldering temperature measuring plate at position A.

[0042] Figure 12 This is a schematic diagram of a reflow soldering temperature measuring plate with multiple outer motherboards in one embodiment of this application.

[0043] Figure 13 This is a bottom view of the inner plate of the reflow soldering temperature measuring plate provided in one embodiment of this application.

[0044] Figure 14 This is a bottom view of the inner plate of the reflow soldering temperature measuring plate provided in another embodiment of this application.

[0045] Figure 15 This is a top view of the outer plate of the reflow soldering temperature measuring plate provided in one embodiment of this application.

[0046] Figure 16 This is a top view of the outer plate of the reflow soldering temperature measuring plate provided in another embodiment of this application.

[0047] Figure 17 This is a bottom view of the outer plate of the reflow soldering temperature measuring plate provided in one embodiment of this application.

[0048] Figure 18 This is a bottom view of the outer plate of the reflow soldering temperature measuring plate provided in another embodiment of this application.

[0049] Figure 19 This is a bottom view of the inner mother plate in a reflow soldering temperature measuring plate provided in an embodiment of this application.

[0050] Figure 20 A bottom view of the inner mother plate in a reflow soldering temperature measuring plate provided in another embodiment of this application.

[0051] Figure 21 This is a bottom view of the inner mother plate in a reflow soldering temperature measuring plate provided in another embodiment of this application.

[0052] Figure 22 This is a bottom view of the outer mother plate in a reflow soldering temperature measuring plate provided in an embodiment of this application.

[0053] Figure 23This is a bottom view of the outer mother plate in a reflow soldering temperature measuring plate provided in another embodiment of this application.

[0054] Figure label:

[0055] 10. Reflow soldering temperature measuring plate;

[0056] 100. Sub-board; 110. Sub-board body; 120. First sub-board; 121. First component; 122. Sub-inner board; 1211. Inner board body; 1212. Temperature measuring wire; 123. Sub-outer board; 130. Second sub-board; 101a, 101b, 101c. Pre-milled grooves;

[0057] 200, Mother plate; 210, Inner mother plate; 211, First stepped groove; 220, Outer mother plate; 221, Second stepped groove; 201a, 201b, Precast milled grooves. Detailed Implementation

[0058] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0059] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0060] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0061] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0062] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0063] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0064] like Figure 1 , Figure 2 as well as Figure 3 As shown, this application provides a method for preparing a reflow soldering temperature measuring plate 10. The prepared reflow soldering temperature measuring plate 10 is used to replace the circuit board in the reflow oven for adjusting the reflow soldering temperature profile. The reflow soldering temperature measuring plate 10 corresponds to the circuit board to be processed. In this application, "corresponding" means that the thickness, the outline size of the bearing surface, and the layout are completely identical or similar. The circuit board to be processed includes a single board body and key components. Accordingly, the reflow soldering temperature measuring plate 10 has a board body that is completely identical or similar to the single board body in terms of thickness and the outline size of the bearing surface, and has components that are completely identical or similar to the key components in terms of layout and type. The method for preparing the reflow soldering temperature measuring plate 10 includes the following steps:

[0065] Step S1: Provide a component library, which includes multiple sub-boards 100 and multiple motherboards 200. Each sub-board 100 includes a sub-board body 110. The multiple sub-boards 100 include at least one first sub-board 120, which has a first device 121. In a specific configuration, the multiple sub-boards 100 can be divided into a first sub-board 120 and a second sub-board 130 according to whether they have the first device 121. The first sub-board 120 has a sub-board body 110 and the first device 121, while the second sub-board 130 only has a sub-board body 110. The second sub-board 130 can be used to fill the gaps on the motherboard 200, and the second sub-board 130 can also be used to form the layout around the first device 121.

[0066] Step S2: Determine the required first sub-board 120 based on the key components of the circuit board to be processed. The first device 121 of the first sub-board 120 corresponds to the key components of the circuit board to be processed. In specific settings, when the key component is a temperature-sensitive component, even slight temperature changes have a significant impact on the key component. The first device 121 is completely identical to the key component to maximize the temperature measurement accuracy of the prepared reflow soldering temperature measuring board 10. When the key component is a temperature-insensitive component, even slight temperature changes have a smaller impact on the key component. The first device 121 is approximately the same as the key component to facilitate the selection of the first sub-board 120 with the first device 121 and to expand the selection range of the first sub-board 120.

[0067] Step S3: Determine the required motherboard 200 based on the single board body of the circuit board to be processed; in specific settings, the thickness of the single board body determines the thickness of the sub-board body 110 and the motherboard 200, and the outline size of the bearing surface of the single board body determines the outline size of the bearing surface of the sub-board body 110 and the motherboard 200. Both the motherboard 200 and the sub-board body 110 are PCBs (Printed Circuit Boards).

[0068] Step S4: Connect the sub-plate 110 and the mother plate 200, and make the sub-plate 110 detachable from the mother plate 200 to assemble the reflow soldering temperature measuring plate 10. In specific settings, the thickness of the mother plate 200 and the sub-plate 110 can be the same, in which case the mother plate 200 and the sub-plate 110 are embedded together. The size of the mother plate 200 can also be larger than the size of the sub-plate 110, in which case the sub-plate 110 is inserted into the groove structure of the mother plate 200.

[0069] The above-described method for preparing the reflow soldering temperature measuring plate 10 allows for the selection and assembly of sub-boards 100 and motherboards 200 for different circuit boards to be processed, forming a universal temperature measuring plate with variable thickness, adjustable bearing surface contour dimensions, and controllable key component layout. This method can essentially or completely simulate the circuit board to be processed, resulting in lower manufacturing costs, higher applicability, and higher temperature measurement accuracy. In the specific preparation of the reflow soldering temperature measuring plate 10, firstly, in step S1, the component library contains sub-boards 100 and motherboards 200 corresponding to the single board body and key components of the circuit board to be processed. Pre-fabricated standard-size sub-boards 100 and motherboards 200 facilitate subsequent assembly of the reflow soldering temperature measuring plate 10. Next, in step S2, the required first sub-board 120 is selected from the component library according to the key components of the circuit board to be processed. During selection, the first sub-board 120... The first component 121 corresponds to the key components of the circuit board to be processed. The first component 121 serves as the component that needs to be measured on the reflow soldering temperature measuring plate 10. Then, in step S3, the required mother board 200 is selected from the component library according to the single board body of the circuit board to be processed. The thickness and bearing surface outline dimensions of the mother board 200 and the sub-board body 110 are specifically determined by the single board body. Finally, in step S4, the sub-board body 110 and the mother board 200 are detachably connected to assemble a reflow soldering temperature measuring plate 10 corresponding to the circuit board to be processed. Moreover, since the sub-board body 110 and the mother board 200 are detachably connected, after the temperature measurement is completed, the sub-board body 110 and the mother board 200 can be disassembled and stored in the component library for reuse. The above-mentioned method for preparing the reflow soldering temperature measuring plate 10 is simple and easy to implement, with high production efficiency, low production cost, and convenient storage and management.

[0070] like Figure 2 As shown, the component library can take many forms. Considering the limited thickness specifications of single-board bodies, for conventional key components, it is only necessary to manufacture more integrated sub-boards 100 of several thicknesses and integrated motherboards 200 of more sizes. In this case, the increase in production cost is limited. However, considering the relatively expensive key components, the number of non-standard sized single boards is small, and the utilization rate of some non-standard sized motherboards 200 is low. In addition, the non-standard sized motherboards 200 also need to take into account the difference in heat capacity, requiring the manufacture of more motherboards 200 with different heat capacities. The utilization rate of these motherboards 200 is also low. At this time, the component library needs to be improved. In a preferred embodiment, step S1 specifically includes:

[0071] Step S11: Statistically analyze all the circuit boards to be processed corresponding to one or more reflow ovens, establish a circuit board specification database, and organize all the specifications of the single board body and key components based on the circuit board specification database. The specifications include the thickness of the single board body, the outline size of the bearing surface, the type and layout of key components, etc.

[0072] Step S12, as follows Figure 4 , Figure 5 , Figure 6 as well as Figure 7 As shown, a series of prefabricated standard inner sub-boards 122, outer sub-boards 123, inner motherboards 210, and outer motherboards 220 are prepared based on the sorting results. The inner sub-board 122 includes an inner board body 1211, with a first device 121 disposed on the inner board body 1211. The inner board body 1211, outer sub-boards 123, inner motherboards 210, and outer motherboards 220 can be prepared using waste PCBs (Printed Circuit Boards), such as... Figure 8 As shown, the inner sub-plate 122 and the outer sub-plate 123 are used to form the first sub-plate 120, as follows: Figure 9 As shown, the inner mother plate 210 and the outer mother plate 220 are used to form the mother plate 200, which constitutes the component library. In a specific configuration, by modularizing and standardizing both the inner sub-plate 122 and the outer sub-plate 123, a series of sub-plates 100 with fixed bearing surface contour dimensions and variable thickness can be assembled. Similarly, by modularizing and standardizing both the inner mother plate 210 and the outer mother plate 220, a series of mother plates 200 with variable bearing surface contour dimensions and fixed thickness can be assembled.

[0073] In the aforementioned component library, by modularizing and standardizing the prefabrication of all circuit boards to be processed into sub-inner boards 122, sub-outer boards 123, mother inner boards 210, and mother outer boards 220, it can cover a variety of key components and circuit boards with various bearing surface contour dimensions, thicknesses, and layouts, thus having a wide range of applications. On the other hand, the subsequent preparation of the reflow soldering temperature measuring board 10 only requires assembly, improving manufacturing efficiency and reducing manufacturing costs. In particular, for relatively expensive key components, by selecting the corresponding sub-inner board 122, only the first device 121 with the same number of key components is needed, thereby saving manufacturing costs.

[0074] In the preparation of the above component library, such as Figure 2As shown, the inner sub-plate 122 also includes a temperature measuring wire 1212. The temperature measuring wire 1212 corresponds to the first device 121 and key components. The temperature measuring wire 1212 is connected to the temperature measuring point of the first device 121 and is used to connect to the temperature analyzer to reflect temperature data. The inner sub-plate 122 is equipped with the first device 121 and the temperature measuring wire 1212, which eliminates the process of installing the temperature measuring wire 1212 and welding the first device 121 each time the reflow soldering temperature measuring plate 10 is made. Only the temperature measuring wire 1212 and the first device 121 need to be installed and welded once initially. Subsequent production of the reflow soldering temperature measuring plate 10 can be directly assembled, saving the production time of the reflow soldering temperature measuring plate 10 and improving production efficiency. In specific configurations, the temperature measuring wire 1212 is routed on the top surface of the inner plate 1211 to avoid affecting the subsequent assembly of the sub-inner plate 122 and sub-outer plate 123. Of course, for some first devices 121 that must have the temperature measuring wire 1212 routed from the bottom surface of the inner plate 1211, the temperature measuring wire 1212 can be routed on the bottom surface of the inner plate 1211. In this case, a pre-made milled groove needs to be formed on the inner plate 1211 to accommodate the temperature measuring wire 1212. The temperature measuring wire 1212 is completely placed in the pre-made milled groove to avoid affecting the subsequent assembly of the sub-inner plate 122 and sub-outer plate 123.

[0075] To broaden the applicability of the component library, the prefabrication standards specifically include:

[0076] The thickness of the inner mother board 210, the outer mother board 220, the outer sub-board 123, and the inner board body 1211 are all the same and are all a series of standard values ​​within 1mm-3mm. In specific settings, the thickness of the inner mother board 210, the outer mother board 220, the outer sub-board 123, and the inner board body 1211 can be 1mm, 1.5mm, 2mm, 2.5mm, or 3mm. Of course, it can also be other standard values ​​within 1mm-3mm. Moreover, the selection range of the standard value is not limited to 1mm-3mm. It can also be other selection ranges. For example, the selection range of the standard value can be extended to 1-6mm, depending on the thickness of the thinnest single board of all the circuit boards to be processed.

[0077] Since the first component 121 is fixed to the inner board 1211 by welding or other means, the cost of the sub-inner board 122 is the highest in the component library. In specific settings, in order to make full use of the sub-inner board 122 to construct the first sub-board 120 with different thicknesses, the thickness of the inner board 1211 is set to a fixed value. The thickness of the inner board 1211 depends on the minimum thickness of the single board of the circuit board to be processed. The thickness of the inner board 1211 is set as thin as possible. For example, if the minimum thickness of the single board of the circuit board to be processed is 1.5mm, the thickness of the inner board 1211 can be set to a fixed value such as 1mm or 0.5mm.

[0078] The bearing surface contour dimensions of the inner motherboard 210 are a series of standard values ​​within the range of 100mm*100mm-600mm*400mm. For example, they can be 100mm*100mm, 200mm*150mm, 300mm*200mm, 400mm*250mm, 500mm*300mm, 600mm*350mm, and 600mm*400mm. Of course, they can also be other standard values ​​within the range of 100mm*100mm-600mm*400mm. The series of standard values ​​can increase in increments of 20mm. For circuit boards with high dimensional accuracy requirements, the bearing surface contour of the inner motherboard 210 can also increase in increments of 10mm. Moreover, the selection range of standard values ​​is not limited to 100mm*100mm-600mm*400mm, but depends on the maximum single-board thickness of all circuit boards to be processed.

[0079] For circuit boards with unconventional dimensions of the bearing surface profile, a series of annular outer motherboards 220 are nested on the inner motherboard 210 until the required dimensions are obtained. The bearing surface profile dimensions of the outer motherboard 220 are a series of standard values ​​with a length exceeding 600mm or a width exceeding 400mm. For example, the bearing surface profile dimensions of the outer motherboard 220 can be 620mm*420mm, 650mm*450mm, 660mm*460mm, etc.

[0080] The bearing surface contours of the inner panel 1211 and the outer sub-panel 123 are identical, and the conventional dimensions of the bearing surface contour can be a series of standard values ​​within the range of 50mm*50mm-100mm*100mm, or a series of standard values ​​within the range of 50mm*150mm-100mm*150mm; for example, the conventional dimensions of the bearing surface contours of the inner panel 1211 and the outer sub-panel 123 are one of 50mm*50mm, 60mm*50mm, 70mm*70mm, 80mm*100mm, 100mm*100mm, etc. In specific settings, it usually depends on the key components with the largest dimensions; the inner plate 1211 and the outer sub-plate 123 with unconventional dimensions of bearing surface contour can be set to special dimensions, such as the bearing surface contour dimensions of the inner plate 1211 and the outer sub-plate 123 being one of 50mm*150mm, 60mm*150mm, 70mm*150mm, 80mm*150mm, 90mm*150mm, 100mm*150mm, etc. For the inner plate 1211 and the outer sub-plate 123 with unconventional dimensions of bearing surface contour, a special motherboard 200 is also required.

[0081] like Figure 10As shown, all first devices 121 cover BGA (Ball Grid Array) devices, QFN (Quad Flat No-leads Package) devices, SOP (Small Outline Package) devices, large heat-container components, temperature-sensitive devices, and connector components. An inner board 122 can be paired with any type of first device 121, achieving full coverage of key components on the board and avoiding any omissions in temperature measurement of critical components.

[0082] like Figure 8 As shown, to facilitate the assembly of the first sub-board 120, in a preferred embodiment, step S2 specifically includes:

[0083] Step S21: Determine the required sub-inner board 122 based on the key components. The first device 121 of the sub-inner board 122 corresponds to the key components. In specific settings, the selection of the sub-inner board 122 needs to consider the type and layout of the key components. Different key components result in different first devices 121, sub-inner boards 122, and temperature sensing lines 1212. For example, when the first device 121 is a BGA device, the number of temperature sensing lines 1212 is three. Moreover, the position of the first device 121 on the sub-inner board 122 can be arbitrarily set. For ease of management, the first device 121 is usually placed in the center of the inner board body 1211.

[0084] Step S22: Determine the required sub-outer plate 123 based on the thickness of the single plate body and the thickness of the inner plate body 1211. The sum of the thicknesses of the sub-outer plate 123 and the inner plate body 1211 is consistent with the thickness of the single plate body. In specific settings, the selection of the sub-outer plate 123 needs to consider the thickness and the outline size of the bearing surface. After the sub-inner plate 122 is determined, the outline size of the bearing surface of the sub-outer plate 123 is determined, and the thickness of the sub-inner plate 122 is determined by the thickness difference between the single plate body and the sub-outer plate 123.

[0085] In step S23, the bottom surface of the inner plate 1211 and the top surface of the outer plate 123 are joined together to form the first sub-plate 120, and the inner plate 1211 is detachable from the outer plate 123. In specific configurations, the inner plate 1211 and the outer plate 123 can be directly joined during assembly, or they can be fixed with adhesive during the joining process to increase the reliability of the fit between the inner plate 1211 and the outer plate 123.

[0086] In the above-mentioned first sub-board 120 assembly, the inner sub-board 122 is determined by key components, and the outer sub-board 123 adapted to the inner sub-board 122 is determined by the thickness of the single board body. By assembling the inner sub-board 122 and the outer sub-board 123 of different thicknesses, the first sub-board 120 of different thicknesses can be obtained, so that the first sub-board 120 and the reflow soldering temperature measuring board 10 can be assembled more conveniently and quickly, and can then be used for temperature measurement of circuit boards of more thicknesses to be processed.

[0087] like Figure 9 As shown, to facilitate the assembly of the motherboard 200, in a preferred embodiment, step S3 specifically includes:

[0088] Step S31: Select a mother inner plate 210 and a mother outer plate 220 from the component library that are consistent with the thickness of the single plate body and the outline of the bearing surface. The mother inner plate 210 has at least one first stepped groove 211. The number of first stepped grooves 211 is adapted to the sub-plate body 110, and the number of first stepped grooves 211 is greater than or equal to the sub-plate body 110. The first stepped groove 211 penetrates the thickness of the mother inner plate 210. The mother outer plate 220 has a second stepped groove 221. The second stepped groove 221 penetrates the thickness of the mother outer plate 220.

[0089] In step S32, the stepped surface of the second stepped groove 221 is convex-concavely fitted with the bottom surface of the inner mother plate 210 to form a mother plate 200, and the inner mother plate 210 is detachable from the outer mother plate 220. In specific configurations, the inner mother plate 210 and the outer mother plate 220 can be directly convex-concave fitted during assembly, or they can be fixed with adhesive during convex-concave fitting to increase the reliability of the fit between the inner mother plate 210 and the outer mother plate 220.

[0090] In the above-mentioned assembly of motherboard 200, the thickness of the inner motherboard 210 and the outer motherboard 220 is determined by the thickness of the single board body. The inner motherboard 210 and the outer motherboard 220 are nested together to form the bearing surface contour of the single board body. By assembling the inner motherboard 210 and the outer motherboard 220 of different sizes and numbers, the first daughterboard 120 with different bearing surface contours can be obtained, so that the motherboard 200 and the reflow soldering temperature measuring board 10 can be assembled more conveniently and quickly, and can then be used for temperature measurement of circuit boards with more bearing surface contours to be processed.

[0091] like Figure 11As shown, the small-sized inner motherboard 210 does not need to be used with the outer motherboard 220. However, some non-standard sized motherboards 200 require the use of the outer motherboard 220. Because the heat capacity of non-standard sized circuit boards varies significantly, for some circuit boards using thick copper, even though the reflow soldering temperature sensor board 10's surface profile and thickness are almost identical to the circuit board, its heat capacity is still less than that of the circuit board. Therefore, the outer motherboard 220 needs to be modified, such as... Figure 12 As shown, specifically, the prefabrication standard also includes that the copper content of the outer motherboard 220 is greater than that of the inner motherboard 210. The higher copper content results in a higher heat capacity, while the lower copper content results in a lower heat capacity. In order to accommodate circuit boards with different heat capacities, step S31 also includes: selecting one or more outer motherboards 220 from the component library that have approximately the same copper content as the single board body. By changing the number of outer motherboards 220, the profile size of the bearing surface of the reflow soldering temperature measuring plate 10 can be increased and the copper content of the reflow soldering temperature measuring plate 10 can be adjusted, so as to obtain a heat capacity close to that of the real board and improve the accuracy of the temperature measuring plate.

[0092] To facilitate assembly, specifically, the inner sub-plate 122, outer sub-plate 123, inner mother plate 210, and outer mother plate 220 have pre-made milled grooves; the pre-made standards also include: the depth of the pre-made milled grooves along the thickness direction of the sub-plate body 110 is a series of standard values ​​within 0.5mm-2mm, and the width of the top step surface of the pre-made milled grooves is a series of standard values ​​within 3mm-10mm. In specific settings, such as... Figure 13 as well as Figure 14 As shown, the shape of the pre-milled groove 101a can be a ring structure or a strip structure disposed on both sides of the inner plate 122, such as... Figure 15 as well as Figure 16 As shown, the shape of the pre-milled groove 101b can be a ring structure or a strip structure penetrating both sides of the sub-plate 110, such as... Figure 17 as well as Figure 18 As shown, the shape of the pre-milled groove 101c can be a ring structure or a strip structure set on both sides of the sub-plate 110, such as... Figure 19 , Figure 20 as well as Figure 21 As shown, the pre-milled groove 201a can be a ring-shaped structure or a strip-shaped structure disposed on both sides of the inner mother plate 210, such as... Figure 22 as well as Figure 23 As shown, the shape of the pre-milled groove 201b can be a ring structure or a strip structure set on both sides of the outer mother plate 220.

[0093] The depth of the pre-milled groove can be 0.5mm, 1mm, 1.5mm, or 2mm, or other standard values ​​within the range of 0.5mm-2mm. The width of the top step surface of the pre-milled groove can be 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm, or other standard values ​​within the range of 3mm-10mm. Furthermore, the selection range of standard values ​​for the pre-milled groove is not limited to these; it depends specifically on the thinnest single-board thickness of all the circuit boards to be processed. During assembly, such as... Figure 4 , Figure 5 as well as Figure 8 As shown, the bottom surface of the inner plate 122 and the top surface of the outer plate 123 are joined together by pre-made milled grooves 101a and 101b, as follows: Figure 5 as well as Figure 6 As shown, the bottom surface of the outer sub-plate 123 and the top surface of the inner sub-plate 210 are joined together by the pre-made milled groove 101c and the first stepped groove 211, as shown. Figure 6 as well as Figure 7 As shown, the bottom surface of the inner mother plate 210 and the top surface of the outer mother plate 220 are joined together by the pre-milled groove 201a and the second stepped groove 221, as shown. Figure 7 as well as Figure 12 As shown, the bottom surface of the outer mother plate 220 and the top surface of the other outer mother plate 220 are joined together by the pre-made milled groove 201b and the second stepped groove 221, so that the reflow soldering temperature measuring plate 10 can be assembled more conveniently and quickly.

[0094] To facilitate the improvement of the adaptability of the inner mother plate 210, such as Figure 19 , Figure 20 as well as Figure 21 As shown, specifically, there are multiple first stepped grooves 211, and the shape of the first stepped grooves 211 is a cell or a strip. The strip shape can also be divided into horizontal and vertical types. The number of cell or strip first stepped grooves 211 depends on the size of the inner mother plate 210. The spacing between two adjacent sets of first stepped grooves 211 can be 2mm-20mm. The spacing between the edge of the inner mother plate 210 and the adjacent first stepped groove 211 can be 2mm-20mm. When the size is satisfied, as many cell or strip first stepped grooves 211 as possible are placed, and the first stepped grooves 211 are placed in the center. In specific settings, the spacing between two adjacent sets of first stepped grooves 211, and the spacing between the edge of the inner motherboard 210 and the adjacent first stepped groove 211 can be 2mm, 5mm, 10mm, 15mm, or 20mm. Of course, other standard values ​​within the range of 2mm-20mm can also be used. Moreover, the selection range of the spacing is not limited to 2mm-20mm, but depends on the outline dimensions of the single board body bearing surface of all the circuit boards to be processed.

[0095] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for preparing a reflow soldering temperature measuring plate, characterized in that, Includes the following steps: Step S1: Provide a component library, the component library including multiple sub-boards and multiple motherboards, each sub-board including a sub-board body, and the multiple sub-boards including at least one first sub-board having a first device; Step S2: Determine the required first sub-board based on the key components of the circuit board to be processed, wherein the first component of the first sub-board corresponds to the key component of the circuit board to be processed. Step S3: Determine the required motherboard based on the single board body of the circuit board to be processed; Step S4: Detachably connect the sub-board and the motherboard to assemble them into a reflow soldering temperature measuring plate; Step S1 specifically includes: Step S11: Compile all single-board body and key component specification values ​​according to the circuit board specification database; Step S12: Based on the sorting results, prepare a series of prefabricated standard sub-inner plates, sub-outer plates, mother inner plates and mother outer plates. The sub-inner plates and the sub-outer plates are used to form the first sub-plate, and the mother inner plate and the mother outer plate are used to form the mother plate to form the component library. The sub-inner plate includes an inner plate body, and the first device is disposed on the inner plate body. Step S2 specifically includes: Step S21: Determine the required sub-inner board based on the key components, wherein the first component of the sub-inner board corresponds to the key components; Step S22: Determine the required sub-outer plate based on the thickness of the single plate and the thickness of the inner plate, wherein the sum of the thicknesses of the sub-outer plate and the inner plate is consistent with the thickness of the single plate; Step S23: The bottom surface of the inner plate is convex and concave with the top surface of the outer sub-plate and detachably connected to form the first sub-plate; Step S3 specifically includes: Step S31: Select a mother inner plate and a mother outer plate from the component library that are consistent with the thickness of the single plate and the outline of the bearing surface. The mother inner plate has at least one first stepped groove that penetrates its thickness, and the mother outer plate has a second stepped groove that penetrates its thickness. Step S32: The stepped surface of the second stepped groove is detachably connected to the bottom surface of the inner mother plate in a concave-convex fit.

2. The method for preparing a reflow soldering temperature measuring plate according to claim 1, characterized in that, The prefabrication standards specifically include: The thickness of the inner mother plate, the outer mother plate, the outer sub-plate, and the inner plate body are all consistent and are a series of standard values ​​within the range of 1mm-3mm; The bearing surface outline dimensions of the inner mother plate are a series of standard values ​​within the range of 100mm*100mm-600mm*400mm, and the bearing surface outline dimensions of the outer mother plate are a series of standard values ​​with a length exceeding 600mm or a width exceeding 400mm. The bearing surface outlines of the inner plate body and the outer sub-plate are consistent and the dimensions are a series of standard values ​​within the range of 50mm*50mm-100mm*100mm and 50mm*150mm-100mm*150mm. All of the first devices cover BGA devices, QFN devices, SOP devices, large heat-container devices, temperature-sensitive devices, and connector elements.

3. The method for preparing a reflow soldering temperature measuring plate according to claim 1, characterized in that, The prefabrication standard also includes that the copper content of the outer motherboard is greater than that of the inner motherboard; step S31 also includes: selecting one or more outer motherboards from the component library that have approximately the same copper content as the single board body.

4. The method for preparing a reflow soldering temperature measuring plate according to claim 1, characterized in that, The inner sub-plate, the outer sub-plate, the inner mother plate, and the outer mother plate are provided with pre-made milled grooves; the pre-made standard also includes: the depth of the pre-made milled groove along the thickness direction of the sub-plate body is a series of standard values ​​within 0.5mm-2mm, and the width of the top step surface of the pre-made milled groove is a series of standard values ​​within 3mm-10mm.

5. The method for preparing a reflow soldering temperature measuring plate according to claim 1, characterized in that, The number of the first stepped grooves is multiple, and the shape is a cell or a strip. The distance between two adjacent groups of the first stepped grooves is 2mm-20mm, and the distance between the edge of the inner plate and the adjacent first stepped groove is 2mm-20mm.

6. The method for preparing a reflow soldering temperature measuring plate according to claim 1, characterized in that, The inner sub-plate also includes a temperature measuring line, which runs on the top surface of the inner sub-plate, or the temperature measuring line runs on the bottom surface of the inner sub-plate and the bottom surface of the inner sub-plate has a pre-milled groove for accommodating the temperature measuring line.

7. The method for preparing a reflow soldering temperature measuring plate according to claim 1, characterized in that, When the key component is a device with high temperature sensitivity, the first device is completely identical to the key component; when the key component is a device with low temperature sensitivity, the first device is substantially the same as the key component.

Images