Electronic device, robot, and mobile station

Abstract

The present application provides an electronic device, a robot and a mobile station capable of improving the reliability of mechanical and electrical connections. The electronic device has a first substrate having a terminal arranged on a first side, a second substrate laminated to the first substrate, a third substrate laminated to a side of the second substrate opposite the first substrate, and a wiring substrate arranged opposite the first side and joined to the first side via a first joining member, a second side of the second substrate opposite the wiring substrate being located further toward a side opposite the wiring substrate than the first side.

Description

Technical Field

[0001] This invention relates to electronic devices, robots, and mobile stations. Background Technology

[0002] For example, the mounting structure described in Patent Document 1 includes a flexible wiring board, a non-flexible component, a connection portion connecting the flexible wiring board and the non-flexible component, and a protective resin for sealing the connection portion.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-145041

[0004] However, in the mounting structure of Patent Document 1, when the flexible wiring board is joined to the non-flexible component using the connecting part, the connecting part wets and expands in the narrow space between the flexible wiring board and the non-flexible component due to the capillary effect, which may reduce the reliability of the mechanical and electrical connections. Summary of the Invention

[0005] The electronic device of the present invention includes: a first substrate having terminals disposed on a first side; a second substrate stacked on the first substrate; a third substrate stacked on the side of the second substrate opposite to the first substrate; and a wiring substrate disposed opposite to the first side and joined to the first side via a first joining member, wherein a second side of the second substrate opposite to the wiring substrate is located further away from the side opposite to the wiring substrate than the first side.

[0006] The robot of the present invention has: a joint; and an electronic device for driving the joint, the electronic device having: a first substrate having terminals disposed on a first side; a second substrate stacked on the first substrate; a third substrate stacked on the side of the second substrate opposite to the first substrate; and a wiring substrate disposed opposite to the first side and joined to the first side via a first joining member, the second side of the second substrate opposite to the wiring substrate being located further away from the side opposite to the wiring substrate than the first side.

[0007] The mobile stage of the present invention includes: a base; a movable part connected to the base; and an electronic device for moving the movable part relative to the base. The electronic device includes: a first substrate with terminals disposed on a first side; a second substrate stacked on the first substrate; a third substrate stacked on the side of the second substrate opposite to the first substrate; and a wiring substrate disposed opposite to the first side and joined to the first side via a first joining member. The second side of the second substrate opposite to the wiring substrate is located further away from the side opposite to the wiring substrate than the first side. Attached Figure Description

[0008] Figure 1 This is a top view showing the piezoelectric motor according to the first embodiment of the present invention.

[0009] Figure 2 This is an exploded perspective view of a piezoelectric drive device.

[0010] Figure 3 This is a top view of a piezoelectric actuator.

[0011] Figure 4 yes Figure 3 Sectional view along line AA in the diagram.

[0012] Figure 5 yes Figure 3 BB line section view.

[0013] Figure 6 yes Figure 3 The CC line section view.

[0014] Figure 7 This is a perspective view showing the first side of a piezoelectric actuator.

[0015] Figure 8 This is a cross-sectional view showing the bonding state between the piezoelectric drive device and the wiring substrate.

[0016] Figure 9 This is a top view of the wiring substrate.

[0017] Figure 10 This is a cross-sectional view illustrating the bonding method between the piezoelectric drive device and the wiring board.

[0018] Figure 11 This is a cross-sectional view illustrating the bonding method between the piezoelectric drive device and the wiring board.

[0019] Figure 12 This is a cross-sectional view illustrating the bonding method between the piezoelectric drive device and the wiring board.

[0020] Figure 13 This is a top view showing the driving state of the piezoelectric actuator.

[0021] Figure 14 This is a top view showing the driving state of the piezoelectric actuator.

[0022] Figure 15 This is a cross-sectional view showing the electronic device according to the second embodiment.

[0023] Figure 16 This is a cross-sectional view showing the electronic device according to the third embodiment.

[0024] Figure 17 This is a cross-sectional view showing the electronic device according to the fourth embodiment.

[0025] Figure 18 This is a perspective view of the robot according to the fifth embodiment.

[0026] Figure 19 This is a perspective view of the mobile station according to the sixth embodiment.

[0027] Explanation of reference numerals in the attached figures

[0028] 1…Piezoelectric motor, 10…First connecting member, 100…Electronic device, 11…Second connecting member, 2…Rotor, 3…Piezoelectric drive device, 3A…First substrate, 3B…Second substrate, 3C…Third substrate, 3D…Fourth substrate, 3E…Fourth substrate, 4…Piezoelectric actuator, 4A…Piezoelectric element, 4B…Piezoelectric element, 4C…Piezoelectric element, 4D…Piezoelectric element, 4E…Piezoelectric element, 4F…Piezoelectric element, 4G…Piezoelectric element, 41…Vibrating part, 42…Support part, 421…First side surface, 43…Beam part, 44…Protrusion, 5B…Force applying member, 5C…Force applying member, 5D…Force applying member, 5E…Force applying member, 51…Holding part, 511B…Second side surface, 511C…Third side surface, 511D…Fourth side surface, 511E…Fifth side surface, 512C…Top surface, 52…Base, 53…Spring assembly, 54…Spring assembly, 6…Piezoelectric substrate, 6A…Piezoelectric element, 6B…Piezoelectric element, 6C…Piezoelectric element, 6D…Piezoelectric element, 6E…Piezoelectric element, 6F…Piezoelectric element, 6G…Piezoelectric element, 61…First substrate, 62…Piezoelectric element layer, 621…Spacer, 631…Piezoelectric body, 632…Electrode, 633…Electrode, 7…Piezoelectric substrate, 7A…Piezoelectric element, 7B…Piezoelectric element, 7C…Piezoelectric element, 7D…Piezoelectric element, 7E…Piezoelectric element, 7F…Piezoelectric element, 7G…Piezoelectric element, 71…Second substrate, 72…Piezoelectric element layer, 721…Spacer, 73… 1…Piezoelectric element, 732…Electrode, 733…Electrode, 8…Wiring substrate, 81…Substrate, 821…Wiring, 822…Wiring, 823…Wiring, 824…Wiring, 825…Wiring, 826…Wiring, 827…Wiring, 9…Control device, 1000…Robot, 1100…Base, 1200…Robotic arm, 1210…Arm, 1220…Arm, 1230…Arm, 1240…Arm, 1250…Arm, 1260…Arm, 1300…End effector, 2000…Moving stage, 2100…Base, 2200…Movable part, 2210…First movable part, 2220…Second movable part, 2230…Third movable part, 2310…First drive source, 2320…Second drive source, 2330…Third drive source, A1…Arrow, A2…Arrow, B…Adhesive, B1…Arrow, B2…Arrow, D1…Separation distance, D2…Separation distance, D4…Separation distance, F…Embedded edge, H…Solder particles, J1…Joint, J2…Joint, J3…Joint, J4…Joint, J5…Joint, J6…Joint, O1…Rotation axis, S…Space, ST…Workbench, T11…First terminal, T12…First terminal, T13…First terminal, T14…First terminal, T15…First terminal, T16…First terminal, T17…First terminal, T21…Second terminal, T22…Second terminal, T23…Second terminal, T24…Second terminal, T25…Second terminal, T26…Second terminalT27…Second terminal. Detailed Implementation

[0029] Hereinafter, the electronic device, robot, and mobile station of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.

[0030] First Implementation Method

[0031] Figure 1 This is a top view showing the piezoelectric motor according to the first embodiment of the present invention. Figure 2 This is an exploded perspective view of a piezoelectric drive device. Figure 3 This is a top view of a piezoelectric actuator. Figure 4 yes Figure 3 Sectional view along line AA in the diagram. Figure 5 yes Figure 3 BB line section view. Figure 6 yes Figure 3 The CC line section view. Figure 7 This is a perspective view showing the first side of a piezoelectric actuator. Figure 8 This is a cross-sectional view showing the bonding state between the piezoelectric drive device and the wiring substrate. Figure 9 This is a top view of the wiring substrate.

[0032] Figures 10 to 12 These are cross-sectional views illustrating the bonding method between the piezoelectric drive device and the wiring substrate.

[0033] Figure 13 and Figure 14 These are top views showing the driving state of the piezoelectric actuator.

[0034] For ease of explanation, the rotor 2 side of the piezoelectric actuator 4 will be referred to as the "front end side," and the side opposite to rotor 2 will be referred to as the "base end side." Furthermore, the three mutually orthogonal axes will be designated as the X-axis, Y-axis, and Z-axis; the direction along the X-axis will be referred to as the X-axis direction, the direction along the Y-axis as the Y-axis direction, and the direction along the Z-axis as the Z-axis direction. Additionally, the arrow side of each axis will be referred to as the "positive side," and the side opposite to the arrow will be referred to as the "negative side."

[0035] Figure 1The piezoelectric motor 1 shown has a rotor 2 capable of rotating around a rotation axis O1 and an electronic device 100 serving as a drive source to rotate the rotor 2. The electronic device 100 also includes a piezoelectric drive device 3 that abuts against the outer peripheral surface of the rotor 2, a wiring board 8 connected to the piezoelectric drive device 3, and a control device 9 electrically connected to the piezoelectric drive device 3 via the wiring board 8. In the piezoelectric motor 1, the piezoelectric drive device 3 is driven by the control device 9, and the driving force generated by the piezoelectric drive device 3 is transmitted to the rotor 2, thereby causing the rotor 2 to rotate around the rotation axis O1. However, the configuration of the piezoelectric motor 1 is not particularly limited. For example, a slider capable of linear movement may be used instead of the rotor 2.

[0036] In addition, such as Figure 2 As shown, the piezoelectric drive device 3 is composed of a laminate formed by stacking a first substrate 3A, a second substrate 3B, a third substrate 3C, a fourth substrate 3D, and a fifth substrate 3E along the Z-axis. Specifically, the first substrate 3A is located in the center, and the second and fourth substrates 3B and 3E sandwich the first substrate 3A from both sides. Furthermore, the third and fifth substrates 3C and 3E sandwich the laminate from both sides. That is, the fifth substrate 3E, the fourth substrate 3D, the first substrate 3A, the second substrate 3B, and the third substrate 3C are stacked sequentially from the negative side of the Z-axis. It should be noted that these substrates 3A to 3E are bonded together with an adhesive (not shown).

[0037] Among these substrates 3A to 3E, the first substrate 3A constitutes a piezoelectric actuator 4. The piezoelectric actuator 4 has a vibrating part 41, a support part 42 supporting the vibrating part 41, a beam part 43 connecting the vibrating part 41 and the support part 42, and a protrusion 44 disposed at the front end of the vibrating part 41 and transmitting the vibration of the vibrating part 41 to the rotor 2.

[0038] like Figure 3 As shown, the vibrating section 41 is a long strip with the X-axis as its long side. Furthermore, the vibrating section 41 includes piezoelectric elements 4A to 4F for driving and a piezoelectric element 4G for detecting the vibration of the vibrating section 41. In the center of the vibrating section 41, piezoelectric elements 4C and 4D are arranged in the X-axis direction. Additionally, on the negative Y-axis side of piezoelectric elements 4C and 4D, piezoelectric elements 4A and 4B are arranged in the X-axis direction, and on the positive Y-axis side, piezoelectric elements 4E and 4F are arranged in the X-axis direction. These piezoelectric elements 4A to 4F extend and retract in the X-axis direction when energized. However, the number and arrangement of the driving piezoelectric elements are not particularly limited as long as they can excite the vibrating section 41 to produce the desired vibration.

[0039] A piezoelectric element 4G for detection is disposed between piezoelectric elements 4C and 4D. The piezoelectric element 4G is subjected to an external force corresponding to the vibration of the vibrating part 41 and outputs a detection signal corresponding to the applied external force. Therefore, the vibration state of the vibrating part 41 can be detected based on the detection signal output from the piezoelectric element 4G. It should be noted that the number and arrangement of the piezoelectric elements for detection are not particularly limited as long as the vibration of the vibrating part 41 can be detected. Alternatively, the piezoelectric elements for detection may be omitted.

[0040] The support portion 42 is U-shaped, surrounding the two sides and the base end side of the vibrating portion 41. Furthermore, the support portion 42 has a first side surface 421 located at the base end of the piezoelectric actuator 4 and facing the negative side in the X-axis direction. Additionally, a protrusion 44 is provided at the front end of the vibrating portion 41, and the front end of the protrusion 44 contacts the outer peripheral surface of the rotor 2.

[0041] In addition, such as Figures 4 to 6 As shown, the piezoelectric actuator 4 is constructed by bonding two piezoelectric substrates 6 and 7 together. The piezoelectric substrate 6 has a first substrate 61 and a piezoelectric element layer 62 formed on the back side of the first substrate 61. Furthermore, the piezoelectric element layer 62 has piezoelectric elements 6A to 6G disposed in the vibrating portion 41 and spacers 621 disposed in the support portion 42 and the beam portion 43. The piezoelectric elements 6A to 6G are configured such that a piezoelectric body 631 is sandwiched between a pair of electrodes 632 and 633. The electrodes 632 and piezoelectric bodies 631 are integrally formed on each of the piezoelectric elements 6A to 6G, while the electrodes 633 are formed individually on each of the piezoelectric elements 6A to 6G.

[0042] Similarly, the piezoelectric substrate 7 has a second substrate 71 and a piezoelectric element layer 72 formed on the back side of the second substrate 71. Furthermore, the piezoelectric element layer 72 has piezoelectric elements 7A to 7G disposed on the vibrating portion 41 and spacers 721 disposed on the support portion 42 and the beam portion 43. The piezoelectric elements 7A to 7G are configured such that a piezoelectric body 731 is sandwiched between a pair of electrodes 732 and 733. The electrodes 732 and piezoelectric bodies 731 are integrally formed on each of the piezoelectric elements 7A to 7G, while the electrodes 733 are formed individually on each of the piezoelectric elements 7A to 7G.

[0043] The first and second substrates 61 and 71 are not particularly limited, and for example, a silicon substrate can be used. Furthermore, the constituent materials of the piezoelectric elements 631 and 731 can be, for example, lead zirconate titanate (PZT), barium titanate, lead titanate, potassium niobate, lithium niobate, lithium tantalate, sodium tungstate, zinc oxide, barium strontium titanate (BST), strontium bismuth tantalate (SBT), lead metaniobate, lead scandium niobate, and other piezoelectric ceramics.

[0044] The two piezoelectric substrates 6 and 7, as described above, are bonded together with piezoelectric element layers 62 and 72 facing each other via adhesive B. Thus, piezoelectric element 4A is formed by two overlapping piezoelectric elements 6A and 7A; piezoelectric element 4B is formed by two overlapping piezoelectric elements 6B and 7B; piezoelectric element 4C is formed by two overlapping piezoelectric elements 6C and 7C; piezoelectric element 4D is formed by two overlapping piezoelectric elements 6D and 7D; piezoelectric element 4E is formed by two overlapping piezoelectric elements 6E and 7E; piezoelectric element 4F is formed by two overlapping piezoelectric elements 6F and 7F; and piezoelectric element 4G is formed by two overlapping piezoelectric elements 6G and 7G.

[0045] Furthermore, the thickness of the support portion 42 and the beam portion 43 is made consistent with the thickness of the vibrating portion 41 by the stacking of overlapping spacers 621 and 721. As a result, the deflection of the first and second substrates 61 and 71 is suppressed.

[0046] In addition, such as Figure 7 As shown, first terminals T11, T12, T13, T14, T15, T16, and T17 are disposed on the first side surface 421 of the first substrate 61. These seven first terminals T11 to T17 are disposed separately from each other along the X-axis. First terminal T11 is electrically connected to electrode 633 of piezoelectric element 6A via wiring not shown; first terminal T12 is electrically connected to electrode 633 of piezoelectric element 6B via wiring not shown; first terminal T13 is electrically connected to electrode 633 of piezoelectric elements 6C and 6D via wiring not shown; first terminal T14 is electrically connected to electrode 633 of piezoelectric element 6E via wiring not shown; first terminal T15 is electrically connected to electrode 633 of piezoelectric element 6F via wiring not shown; first terminal T16 is electrically connected to electrode 633 of piezoelectric element 6G via wiring not shown; and first terminal T17 is electrically connected to electrode 632 via wiring not shown. Therefore, it is possible to electrically connect to each piezoelectric element 6A to 6G via the first terminals T11 to T17.

[0047] Similarly, second terminals T21, T22, T23, T24, T25, T26, and T27 are disposed on the first side surface 421 of the second substrate 71. These seven second terminals T21 to T27 are disposed separately from each other along the X-axis. Second terminal T21 is electrically connected to electrode 733 of piezoelectric element 7A via wiring not shown; second terminal T22 is electrically connected to electrode 733 of piezoelectric element 7B via wiring not shown; second terminal T23 is electrically connected to electrode 733 of piezoelectric elements 7C and 7D via wiring not shown; second terminal T24 is electrically connected to electrode 733 of piezoelectric element 7E via wiring not shown; second terminal T25 is electrically connected to electrode 733 of piezoelectric element 7F via wiring not shown; second terminal T26 is electrically connected to electrode 733 of piezoelectric element 7G via wiring not shown; and second terminal T27 is electrically connected to electrode 732 via wiring not shown. Therefore, it is possible to electrically connect to each piezoelectric element 7A to 7G via the second terminals T21 to T27.

[0048] In addition, the first terminal T11 and the second terminal T21, the first terminal T12 and the second terminal T22, the first terminal T13 and the second terminal T23, the first terminal T14 and the second terminal T24, the first terminal T15 and the second terminal T25, the first terminal T16 and the second terminal T26, the first terminal T17 and the second terminal T27 are respectively arranged in the Z-axis direction.

[0049] The first substrate 3A has been described above. Next, the second, third, fourth, and fifth substrates 3B, 3C, 3D, and 3E will be described. The second, third, fourth, and fifth substrates 3B, 3C, 3D, and 3E are force-applying components 5B, 5C, 5D, and 5E that apply force to the piezoelectric actuator 4 towards the rotor 2 and press the protrusion 44 against the outer peripheral surface of the rotor 2.

[0050] like Figure 1 and Figure 2 As shown, the force-applying components 5B, 5C, 5D, and 5E each have a holding portion 51 that holds the support portion 42 of the piezoelectric actuator 4, a base 52 that fixes the piezoelectric drive device 3 to the worktable ST, and a pair of spring groups 53 and 54 that have multiple springs connecting the holding portion 51 to the base 52. The force-applying components 5B, 5C, 5D, and 5E apply force to the piezoelectric actuator 4 towards the rotor 2 using the restoring force of the spring groups 53 and 54. However, there are no particular limitations on the configuration of the force-applying components 5B, 5C, 5D, and 5E, as long as they can each apply force to the piezoelectric actuator 4 towards the rotor 2.

[0051] In particular, as in this embodiment, the piezoelectric actuator 4 is sandwiched from both sides by force-applying components 5B, 5C and 5D, 5E, thereby suppressing the posture variation of the piezoelectric actuator 4 around the X-axis and enabling a balanced force to be applied to the piezoelectric actuator 4 towards the rotor 2. Therefore, the driving force of the piezoelectric motor 1 can be efficiently transmitted to the rotor 2, and the driving of the piezoelectric motor 1 is stable. Furthermore, by arranging two force-applying components 5B, 5C on one side of the piezoelectric actuator 4, an ideal force application state can be easily achieved. For example, by combining force-applying components 5B, 5C with different spring constants, the variation in force relative to the deflection of the spring sets 53, 54 can be minimized. Therefore, even if the deflection of the spring sets 53, 54 decreases with the wear of the protrusion 44 over the years, sufficient force can be maintained. Therefore, the piezoelectric motor 1 can be driven stably for a long period of time. The same applies to force-applying components 5D, 5E.

[0052] In addition, such as Figure 8 As shown, the holding portion 51 of the force-applying member 5B, disposed adjacent to the piezoelectric actuator 4, has a second side surface 511B facing the wiring substrate 8. Additionally, the holding portion 51 of the force-applying member 5D, disposed adjacent to the piezoelectric actuator 4, has a fourth side surface 511D facing the wiring substrate 8. Furthermore, these second and fourth side surfaces 511B and 511D are located further along the positive side in the X-axis direction than the first side surface 421, i.e., on the side opposite to the wiring substrate 8. Therefore, the separation distance D2 between the second and fourth side surfaces 511B and 511D and the wiring substrate 8 is greater than the separation distance D1 between the first side surface 421 and the wiring substrate 8. That is, D1 < D2, D1 < D4.

[0053] Furthermore, the holding portion 51 of the force-applying member 5C, which is disposed adjacent to the force-applying member 5B, has a third side surface 511C facing the wiring substrate 8. Additionally, the holding portion 51 of the force-applying member 5E, which is disposed adjacent to the force-applying member 5D, has a fifth side surface 511E facing the wiring substrate 8. Moreover, these third and fifth side surfaces 511C and 511E are flush with the first side surface 421.

[0054] like Figure 9 As shown, the wiring substrate 8 is a flexible printed wiring substrate. This increases the flexibility in the arrangement of the wiring substrate 8. The wiring substrate 8 has a substrate 81 and wirings 821, 822, 823, 824, 825, 826, and 827 disposed on the substrate 81. However, the wiring substrate 8 is not particularly limited and can also be a rigid printed wiring substrate.

[0055] Furthermore, the wiring substrate 8 is disposed opposite to the first side surface 421 with the side on which the wirings 821 to 827 are disposed facing the first side surface 421. In addition, the wiring substrate 8 is connected to the piezoelectric actuator 4 via a conductive first bonding member 10 disposed between it and the first side surface 421, and is electrically connected to the first terminals T11 to T17 and the second terminals T21 to T27.

[0056] Specifically, wiring 821 is electrically connected to the first and second terminals T11 and T21; wiring 822 is electrically connected to the first and second terminals T12 and T22; wiring 823 is electrically connected to the first and second terminals T13 and T23; wiring 824 is electrically connected to the first and second terminals T14 and T24; wiring 825 is electrically connected to the first and second terminals T15 and T25; wiring 826 is electrically connected to the first and second terminals T16 and T26; and wiring 827 is electrically connected to the first and second terminals T17 and T27. In this way, by joining the wiring substrate 8 to the support portion 42, the vibration of the vibrating portion 41 is not hindered by the wiring substrate 8, enabling the piezoelectric actuator 4 to be driven smoothly. Furthermore, the vibration of the vibrating portion 41 is less likely to be transmitted to the first connecting member 10, thus reducing fatigue in the first connecting member 10.

[0057] The first bonding component 10 is a thermosetting adhesive. This facilitates the bonding of the wiring substrate 8 to the piezoelectric actuator 4. Furthermore, the first bonding component 10 is conductive. This allows for simultaneous mechanical bonding and electrical connection, making the bonding of the wiring substrate 8 to the piezoelectric actuator 4 even easier. In this embodiment, an epoxy-based adhesive (reflow soldering anisotropic conductive paste) containing solder particles is used as the first bonding component 10. By using such an adhesive, as described later, the wiring substrate 8 can be further and more easily mechanically and electrically connected to the support portion 42.

[0058] Furthermore, the wiring substrate 8 is joined to the force-applying member 5C via a second joining member 11 disposed between it and the third side surface 511C. It should be noted that the second joining member 11 does not have an electrical connection with the wiring substrate 8. Thus, by joining the piezoelectric drive device 3 to the wiring substrate 8 via the second joining member 11 in addition to the first joining member 10, the bonding strength between the piezoelectric drive device 3 and the wiring substrate 8 can be further improved. Furthermore, stress concentration on the first joining member 10, which bears the electrical connection, is alleviated, reducing fatigue of the first joining member 10. Therefore, the reliability of the electronic device 100 can be improved.

[0059] The second bonding component 11 does not have an electrical connection between the piezoelectric drive device 3 and the wiring substrate 8. Therefore, any material can be used as long as short circuits between the wirings 821-827 can be prevented. It should be noted that in this embodiment, the same material as the first bonding component 10 is used. As a result, material costs can be reduced, and the coating of the first and second bonding components 10 and 11 can be performed in the same process, thus making it easy to bond the piezoelectric drive device 3 to the wiring substrate 8.

[0060] Next, the bonding method between the piezoelectric drive device 3 and the wiring board 8 will be described. First, as... Figure 10 As shown, an uncured first bonding component 10 is coated on the first side 421, and an uncured second bonding component 11 is coated on the third side 511C. Then, as... Figure 11 As shown, the wiring substrate 8 is attached to the first side 421 and the third side 511C. Next, the first and second bonding components 10 and 11 are heated to solidify them, thereby bonding the piezoelectric drive device 3 to the wiring substrate 8. When the first and second bonding components 10 and 11 are heated, as shown... Figure 12 As shown, the solder particles H in the first and second bonding components 10 and 11 self-aggregate to the first terminals T11-T17, the second terminals T21-T27, and the wiring 821-827, forming a metallic bond. Therefore, it is possible to prevent adjacent terminals from short-circuiting while electrically connecting each terminal and its corresponding wiring. Thus, by using an epoxy-based adhesive (reflow soldering anisotropic conductive paste) containing solder particles as the first bonding component 10, it is not necessary to individually apply the first bonding component 10 to each terminal, thereby facilitating the bonding of the piezoelectric drive device 3 to the wiring substrate 8.

[0061] Here, as mentioned earlier, spaces S are formed on both sides of the first side surface 421. Therefore, the capillary effect is suppressed. When bonding the wiring substrate 8 and the piezoelectric drive device 3, the uncured first bonding component 10 is less likely to wet and spread outward from the area between the first side surface 421 and the wiring substrate 8, and an appropriate amount of the first bonding component 10 can be left between the first side surface 421 and the wiring substrate 8. Therefore, the reliability of the mechanical and electrical connection between the piezoelectric drive device 3 and the wiring substrate 8 can be improved.

[0062] Similarly, the uncured second bonding member 11 is less likely to wet and spread outward from the area between the third side 511C and the wiring substrate 8, allowing a suitable amount of the second bonding member 11 to remain between the third side 511C and the wiring substrate 8. Therefore, the piezoelectric drive device 3 and the wiring substrate 8 can be bonded more firmly. In particular, in this embodiment, the third side 511C is flush with the first side 421. This reduces the deflection of the wiring substrate 8 in its bonded state with the piezoelectric drive device 3, and reduces the load applied to the first bonding member 10 and the second bonding member 11. Therefore, fatigue of the first and second bonding members 10 and 11 can be reduced, and the reliability of the electronic device 100 can be improved.

[0063] It should be noted that the separation distances D2 and D4 are not particularly limited, but are preferably 300 μm or more. This ensures that the second and fourth sides 511B and 511D are sufficiently separated from the wiring substrate 8, thus more reliably suppressing the wetting and spreading of the first and second bonding members 10 and 11. The upper limit of the separation distances D2 and D4 is not particularly limited, but is preferably 500 μm, and in this embodiment, it is approximately 400 μm. This prevents the piezoelectric drive device 3 from becoming too large due to excessively large separation distances D2 and D4.

[0064] Furthermore, the thickness of the force-applying components 5B and 5D is not particularly limited, but is preferably 300 μm or more. This ensures that the width (length in the Z-axis direction) of the space S is sufficiently large, effectively suppressing the wetting spread of the first and second joining components 10 and 11 across the space S. Therefore, the wetting spread of the first and second joining components 10 and 11 can be suppressed more reliably. It should be noted that the upper limit of the thickness is not particularly limited, but is preferably 500 μm, and in this embodiment is approximately 400 μm. This prevents the piezoelectric drive device 3 from becoming too large due to excessive thickness.

[0065] The control device 9, for example, is a computer, having a processor for processing information, a memory that can be connected to the processor in a communicative manner, and an external interface. Furthermore, the memory stores programs that can be executed by the processor, which reads and executes the programs stored in the memory. Such a control device 9 receives instructions from a host computer (not shown) and drives the piezoelectric actuator 4 based on these instructions.

[0066] For example, controlling the phase difference of the alternating voltage applied to piezoelectric elements 4A, 4F, 4B, 4E, and 4C, 4D, such as... Figure 13 As shown, when the front end of the protrusion 44 performs an elliptical motion as indicated by arrow A1, the rotor 2 is propelled out through this elliptical motion, and the rotor 2 rotates clockwise as indicated by arrow B1. Furthermore, as... Figure 14As shown, when the front end of the protrusion 44 makes an elliptical motion like arrow A2, the rotor 2 is sent out through this elliptical motion, and the rotor 2 rotates counterclockwise as shown by arrow B2.

[0067] The piezoelectric motor 1 of this embodiment has been described above. As mentioned above, the electronic device 100 included in such a piezoelectric motor 1 includes: a piezoelectric actuator 4, a first substrate 3A having first and second terminals T11-T17 and T21-T27 as terminals disposed on a first side 421; a force-applying member 5B, a second substrate 3B stacked on the piezoelectric actuator 4; a force-applying member 5C, a third substrate 3C stacked on the side of the force-applying member 5B opposite to the piezoelectric actuator 4; and a wiring substrate 8, disposed opposite to the first side 421 and joined to the first side 421 via a first joining member 10. Furthermore, the second side 511B of the force-applying member 5B opposite to the wiring substrate 8 is located further away from the wiring substrate 8 than the first side 421. Therefore, since the space S is formed adjacent to the first side surface 421, the capillary effect is suppressed. When the wiring substrate 8 is bonded to the first side surface 421, the uncured first bonding component 10 is less likely to wet and spread outward from the area between the first side surface 421 and the wiring substrate 8, and an appropriate amount of the first bonding component 10 can be left between the first side surface 421 and the wiring substrate 8. Therefore, the reliability of the mechanical and electrical connection between the piezoelectric drive device 3 and the wiring substrate 8 can be improved.

[0068] Furthermore, as mentioned above, the third side 511C of the force-applying member 5C, which faces the wiring substrate 8, is joined to the wiring substrate 8 via the second joining member 11. This allows for a more secure connection between the piezoelectric drive device 3 and the wiring substrate 8. Consequently, the reliability of the electronic device 100 can be improved.

[0069] Furthermore, as mentioned above, the third side 511C is flush with the first side 421. This reduces the deflection of the wiring substrate 8 when it is engaged with the piezoelectric drive device 3, and reduces the load applied to the first bonding member 10 and the second bonding member 11. Therefore, fatigue of the first and second bonding members 10 and 11 can be reduced, and the reliability of the electronic device 100 can be improved.

[0070] Furthermore, as mentioned above, the first bonding component 10 is a thermosetting adhesive. This facilitates the bonding of the first side surface 421 to the wiring substrate 8.

[0071] Furthermore, as described above, the first substrate 3A includes: a vibrating portion 41 with piezoelectric elements 4A to 4F that vibrate due to the expansion and contraction of the piezoelectric elements 4A to 4F caused by energization; a protrusion 44 disposed on the vibrating portion 41; a support portion 42 having a first side surface 421 and supporting the vibrating portion 41; and a beam portion 43 connecting the vibrating portion 41 and the support portion 42. Additionally, at least one of the second substrate 3B and the third substrate 3C is a force-applying member 5B or 5C that applies force to the protrusion 44. Therefore, the electronic device 100 can be applied to the piezoelectric drive device 3. Thus, the electronic device 100 can be used as a drive source for the piezoelectric motor 1, etc., improving its versatility.

[0072] Furthermore, as previously described, the wiring substrate 8 extends in the stacking direction of the first substrate 3A, the second substrate 3B, and the third substrate 3C. This allows the third side surface 511C to be positioned opposite the wiring substrate 8, facilitating their bonding.

[0073] Second Implementation Method

[0074] Figure 15 This is a cross-sectional view showing the electronic device according to the second embodiment.

[0075] The electronic device 100 of this embodiment is the same as the electronic device 100 of the first embodiment, except that it has multiple piezoelectric actuators 4 stacked on top of each other. Therefore, in the following description, this embodiment will be described in terms of the differences from the first embodiment, and the same items will be omitted. In addition, in the drawings of this embodiment, the same reference numerals are used to mark the same components as in the previous embodiment.

[0076] like Figure 15 As shown, in the piezoelectric drive device 3 of this embodiment, the first substrate 3A is formed by a stack of multiple piezoelectric actuators 4. The multiple piezoelectric actuators 4 are joined together by an adhesive (not shown). In this way, by stacking multiple piezoelectric actuators 4, the driving force of the piezoelectric drive device 3 can be increased. It should be noted that the number of stacked piezoelectric actuators 4 can be appropriately set according to the required driving force.

[0077] According to this second embodiment, the same effect as the first embodiment described above can also be achieved.

[0078] Third Implementation Method

[0079] Figure 16 This is a cross-sectional view showing the electronic device according to the third embodiment.

[0080] The electronic device 100 of this embodiment is the same as the electronic device 100 of the first embodiment, except for the different configuration of the second bonding member 11. Therefore, in the following description, this embodiment will be described focusing on the differences from the first embodiment, while identical items will be omitted. In addition, in the drawings of this embodiment, the same reference numerals are used to refer to the same components as in the previous embodiment.

[0081] like Figure 16 As shown, in the electronic device 100 of this embodiment, the second bonding member 11 is also disposed on the main surface, i.e., the upper surface 512C, above the holding portion 51 of the force-applying member 5C. Therefore, by forming a fillet F on the second bonding member 11, the bonding strength between the piezoelectric drive device 3 and the wiring substrate 8 can be further improved. Thus, the reliability of the electronic device 100 can be further improved.

[0082] As described above, in the electronic device 100 of this embodiment, the second bonding member 11 is also disposed on the main surface, i.e., the upper surface 512C, of ​​the third substrate 3C. Therefore, by forming an interlocking edge F in the second bonding member 11, the bonding strength between the force-applying member 5C and the wiring substrate 8 can be further improved. Thus, the reliability of the electronic device 100 can be further improved.

[0083] According to this third embodiment, the same effect as the first embodiment described above can also be achieved.

[0084] Fourth Implementation Method

[0085] Figure 17 This is a cross-sectional view showing the electronic device according to the fourth embodiment.

[0086] The electronic device 100 of this embodiment is the same as the electronic device 100 of the first embodiment described above, except that the fifth side 511E is further bonded to the wiring substrate 8. Therefore, in the following description, this embodiment will be described focusing on the differences from the first embodiment, and the same items will be omitted. In addition, in the drawings of this embodiment, the same reference numerals are used to mark the same components as in the previous embodiment.

[0087] like Figure 17 As shown, in the electronic device 100 of this embodiment, the fifth side 511E and the wiring substrate 8 are further joined via the second joining member 11. This further improves the bonding strength between the piezoelectric drive device 3 and the wiring substrate 8. Furthermore, stress concentration on the first joining member 10, which bears the electrical connection, is further alleviated, reducing fatigue of the first joining member 10. Therefore, the reliability of the electronic device 100 can be improved.

[0088] In particular, in this embodiment, the fifth side surface 511E is flush with the first side surface 421. This reduces the deflection of the wiring substrate 8 when it is engaged with the piezoelectric drive device 3, and reduces the load applied to the first bonding member 10 and each of the second bonding members 11. Therefore, fatigue of the first and second bonding members 10 and 11 can be reduced.

[0089] According to this fourth embodiment, the same effect as the first embodiment described above can also be achieved.

[0090] Fifth Implementation Method

[0091] Figure 18 This is a perspective view of the robot according to the fifth embodiment.

[0092] Figure 18 The robot 1000 shown is capable of performing operations such as supplying, removing, conveying, and assembling precision equipment or its components. The robot 1000 is, for example, a robot that performs operations such as supplying, removing, conveying, and assembling precision equipment or its components. However, there are no particular limitations on the application of the robot 1000.

[0093] Robot 1000 is a six-axis robot with six rotational axes. Robot 1000 has a base 1100 and a robotic arm 1200 that is rotatably connected to the base 1100, and an end effector 1300 is mounted at the front end of the robotic arm 1200.

[0094] Furthermore, the robotic arm 1200 is a robotic arm in which multiple arms 1210, 1220, 1230, 1240, 1250, and 1260 are connected in a freely rotatable manner, and it has six joints J1 to J6. Among them, joints J2, J3, and J5 are bending joints, and joints J1, J4, and J6 are torsional joints. In addition, electronic devices 100, which serve as drive sources, are respectively provided on joints J1, J2, J3, J4, J5, and J6. Therefore, the robot 1000 can enjoy the effects of the electronic devices 100 and can exhibit excellent reliability.

[0095] However, there are no particular limitations on the robot 1000, as long as it has at least one joint. In addition, it is sufficient to install a piezoelectric motor 1 on at least one of the joints J1, J2, J3, J4, J5, and J6.

[0096] The robot 1000 has been described above. As previously mentioned, such a robot 1000 has joints J1, J2, J3, J4, J5, and J6, and electronic equipment 100 for driving joints J1, J2, J3, J4, J5, and J6. Furthermore, the electronic equipment 100 includes: a piezoelectric actuator 4, a first substrate 3A having first and second terminals T11-T17 and T21-T27 as terminals disposed on a first side 421; a force-applying member 5B, a second substrate 3B stacked on the piezoelectric actuator 4; a force-applying member 5C, a third substrate 3C stacked on the side of the force-applying member 5B opposite to the piezoelectric actuator 4; and a wiring substrate 8, disposed opposite to the first side 421 and joined to the first side 421 via a first joining member 10. Furthermore, the second side 511B of the force-applying member 5B opposite to the wiring substrate 8 is located further away from the first side 421 than the side opposite to the wiring substrate 8. Therefore, since the space S is formed adjacent to the first side surface 421, the capillary effect is suppressed. When the wiring substrate 8 is bonded to the first side surface 421, the uncured first bonding component 10 is less likely to wet and spread outward from the area between the first side surface 421 and the wiring substrate 8, and an appropriate amount of the first bonding component 10 can be left between the first side surface 421 and the wiring substrate 8. Therefore, the reliability of the mechanical and electrical connection between the piezoelectric drive device 3 and the wiring substrate 8 can be improved. As a result, the robot 1000 using such an electronic device 100 can exhibit excellent reliability.

[0097] Sixth Implementation Method

[0098] Figure 19 This is a perspective view of the mobile station according to the sixth embodiment.

[0099] It should be noted that, for ease of explanation, the three mutually orthogonal axes are referred to as the x-axis, y-axis, and z-axis. The direction along the x-axis is also called the x-axis direction, the direction along the y-axis is also called the y-axis direction, and the direction along the z-axis is also called the z-axis direction.

[0100] Figure 19 The illustrated mobile stage 2000 has a base 2100 and a movable part 2200 that moves relative to the base 2100. Furthermore, the movable part 2200 has a first movable part 2210 that moves relative to the base 2100 in the y-axis direction, a second movable part 2220 that moves relative to the first movable part 2210 in the x-axis direction, and a third movable part 2230 that moves relative to the second movable part 2220 about the z-axis.

[0101] Furthermore, the mobile station 2000 includes a first drive source 2310 for moving the first movable part 2210 relative to the base 2100, a second drive source 2320 for moving the second movable part 2220 relative to the first movable part 2210, and a third drive source 2330 for moving the third movable part 2230 relative to the second movable part 2220. Moreover, electronic equipment 100 is used as these first, second, and third drive sources 2310, 2320, and 2330. Therefore, the mobile station 2000 can enjoy the effects of electronic equipment 100 and can exhibit excellent reliability.

[0102] However, there are no particular limitations on the mobile station 2000. For example, one or two of the first, second, and third movable parts 2210, 2220, and 2230 may be omitted. In addition, it is not necessary to use the electronic device 100 for all the first, second, and third drive sources 2310, 2320, and 2330; it is sufficient to use it for at least one drive source.

[0103] The mobile stage 2000 has been described above. As previously mentioned, such a mobile stage 2000 includes a base 2100, a movable part 2200 connected to the base 2100, and an electronic device 100 for moving the movable part 2200 relative to the base 2100. Furthermore, the electronic device 100 includes: a piezoelectric actuator 4, a first substrate 3A having first and second terminals T11-T17 and T21-T27 as terminals disposed on a first side 421; a force-applying member 5B, a second substrate 3B stacked on the piezoelectric actuator 4; a force-applying member 5C, a third substrate 3C stacked on the side of the force-applying member 5B opposite to the piezoelectric actuator 4; and a wiring substrate 8, disposed opposite to the first side 421 and joined to the first side 421 via a first joining member 10. Furthermore, the second side 511B of the force-applying member 5B opposite to the wiring substrate 8 is located further away from the first side 421 than the side opposite to the wiring substrate 8. Therefore, since the space S is formed adjacent to the first side surface 421, when the wiring substrate 8 is joined to the first side surface 421, the uncured first joining component 10 is less likely to wet and spread outward from the area between the first side surface 421 and the wiring substrate 8, and a suitable amount of the first joining component 10 can remain between the first side surface 421 and the wiring substrate 8. Thus, the reliability of the mechanical and electrical connection between the piezoelectric drive device 3 and the wiring substrate 8 can be improved. Therefore, the mobile stage 2000 using such an electronic device 100 can exhibit excellent reliability.

[0104] The electronic device, robot, and mobile station of the present invention have been described above based on the illustrated embodiments. However, the present invention is not limited thereto, and the configuration of each part can be replaced with any configuration having the same function. Furthermore, other arbitrary configurations can be added to the present invention. Additionally, the various embodiments can be appropriately combined. Furthermore, in the foregoing embodiments, the configuration of applying the electronic device 100 to the piezoelectric motor 1, the robot 1000, and the mobile station 2000 has been described, but the electronic device 100 can also be applied to various other devices such as printers, projectors, etc.

Claims

1. An electronic device, characterized in that, have: The first substrate has terminals disposed on its first side; The second substrate is stacked on the first substrate; A third substrate is stacked on the side of the second substrate opposite to the first substrate; as well as A wiring substrate is disposed opposite to the first side and is joined to the first side via a first joining member. The second side of the second substrate, which is opposite to the wiring substrate, is located further away from the wiring substrate than the first side. Spaces are formed on both sides of the first side.

2. The electronic device according to claim 1, characterized in that, The third side of the third substrate, which is opposite to the wiring substrate, is joined to the wiring substrate via a second joining member.

3. The electronic device according to claim 2, characterized in that, The second bonding component is also disposed on the main surface of the third substrate.

4. The electronic device according to claim 2 or 3, characterized in that, The third side is flush with the first side.

5. The electronic device according to claim 1, characterized in that, The first bonding component is a thermosetting adhesive.

6. The electronic device according to claim 1, characterized in that, The first substrate has: The vibrating part includes a piezoelectric element, which vibrates due to the expansion and contraction of the piezoelectric element caused by energization; A protrusion is disposed on the vibrating part; A support portion, having the first side surface, and supporting the vibrating portion; and The beam section connects the vibrating section and the supporting section. At least one of the second substrate and the third substrate is a force-applying component that applies force to the protrusion.

7. The electronic device according to claim 1, characterized in that, The wiring substrate extends in the stacking direction of the first substrate, the second substrate, and the third substrate.

8. A robot, characterized in that, have: Joints; and Electronic devices drive the joint. The electronic device has: The first substrate has terminals disposed on its first side; The second substrate is stacked on the first substrate; A third substrate is stacked on the side of the second substrate opposite to the first substrate; as well as A wiring substrate is disposed opposite to the first side and is joined to the first side via a first joining member. The second side of the second substrate, which is opposite to the wiring substrate, is located further away from the wiring substrate than the first side. Spaces are formed on both sides of the first side.

9. A mobile station, characterized in that, have: Base; Movable part, connected to the base; and An electronic device that allows the movable part to move relative to the base. The electronic device has: The first substrate has terminals disposed on its first side; The second substrate is stacked on the first substrate; A third substrate is stacked on the side of the second substrate opposite to the first substrate; as well as A wiring substrate is disposed opposite to the first side and is joined to the first side via a first joining member. The second side of the second substrate, which is opposite to the wiring substrate, is located further away from the wiring substrate than the first side. Spaces are formed on both sides of the first side.

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