Lighting device and lamp comprising the same

Abstract

An illumination device according to one embodiment of the present application includes a reflective layer, a first resin layer on the reflective layer, a substrate on the first resin layer, a light emitting device between the first resin layer and the substrate, a second resin layer on the substrate, a semi-reflective mirror layer on the second resin layer, and an optical member between the second resin layer and the semi-reflective mirror layer, wherein light emitted through a light emitting surface of the light emitting device is reflected by the reflective layer and passes through the substrate. Light in a visible light wavelength band includes a first wavelength band and a second wavelength band having different wavelength bands, the reflectance of light in the first wavelength band is higher than the transmittance of light in the first wavelength band in the semi-reflective mirror layer, and the transmittance of light in the first wavelength band is higher than the transmittance of light in the second wavelength band in the optical member.

Description

Technical Field

[0001] The embodiments relate to a lighting device and a lamp including the lighting device. Background Technology

[0002] Lighting is a device that provides or controls the amount of light and is applied in various fields. For example, lighting devices can be used in various fields, such as vehicles and buildings, to illuminate the interior or exterior. In particular, in recent years, light-emitting devices have been used as light sources for lighting. Compared with traditional light sources such as fluorescent lamps and incandescent lamps, such light-emitting devices, such as light-emitting diodes (LEDs), have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. Such LEDs are being used in various optical components, such as various display devices, indoor lights, or outdoor lights. Generally, lights of various colors and shapes are used in vehicles, and recently, the use of LEDs as the light source for vehicle lights has been proposed. For example, LEDs are used in vehicle headlights, taillights, turn signals, etc. However, LEDs have the problem of a relatively small emission angle. For this reason, when using LEDs as vehicle lights, it is necessary to increase the light-emitting area of ​​the lamp. When vehicle lights include LEDs, the following problems exist: the performance of the LED deteriorates due to the heat generated when the LED emits light, or the uniformity of light emission decreases.

[0003] When a lamp includes a light-emitting diode (LED), the following problem arises: hot spots are formed by the light emitted from the LED. In this case, when using the lamp to implement a line light source or a surface light source, the uniformity characteristics of the light-emitting surface deteriorate.

[0004] Generally, when LEDs are used in automotive lights, there is a problem with their visual recognition from the outside. For example, when the lights are on, the LEDs may not be visible due to the light emitted from the light source, but when the lights are off, the LEDs are visible from the outside. This increases the aesthetics and design freedom of the lights, but also leads to performance degradation. Therefore, a new type of lighting device and lamp is needed to solve these problems. Summary of the Invention

[0005] Technical issues

[0006] Embodiments of the present invention provide an illumination device and lamp capable of achieving a uniform line light source or surface light source. Embodiments also provide an illumination device and lamp with improved aesthetics. Furthermore, embodiments provide an illumination device and lamp capable of compensating for the spectrum of light emitted from a light-emitting device. Finally, embodiments provide an illumination device and lamp with improved heat dissipation characteristics.

[0007] Technical solution

[0008] The lighting device according to an embodiment includes: a reflective layer; a first resin layer disposed on the reflective layer; a substrate disposed on the first resin layer; a light-emitting device disposed between the first resin layer and the substrate; a second resin layer disposed on the substrate; a semi-reflective mirror layer disposed on the second resin layer; and an optical component disposed between the second resin layer and the semi-reflective mirror layer, wherein light emitted from the light-emitting surface of the light-emitting device is reflected by the reflective layer and passes through the substrate, and the visible light band includes a first band having a partial band and a second band having a band different from the first band, wherein the reflectivity of the semi-reflective mirror layer for the first band of light may be higher than its transmittance for the first band of light, and the transmittance of the optical component for the first band of light may be higher than its transmittance for the second band of light.

[0009] According to embodiments of the present invention, the optical component may include: a first optical layer disposed between a second resin layer and a semi-reflective mirror layer; and a second optical layer disposed between the first optical layer and the semi-reflective mirror layer. The second wavelength band includes a 2-1 wavelength band and a 2-2 wavelength band different from the 2-1 wavelength band. The first optical layer may have a higher transmittance for light in the 2-1 wavelength band than for light in the 2-2 wavelength band, and the second optical layer may have a higher transmittance for light in the 2-2 wavelength band than for light in the 2-1 wavelength band. Each of the first and second optical layers may have a thickness of 150 μm or less. The light-emitting device may include a plurality of light-emitting devices spaced apart from each other, and each of the plurality of light-emitting devices may emit white light.

[0010] According to embodiments of the present invention, a light-shielding layer disposed between the substrate and the optical component may be further included. The light-shielding layer may include a plurality of light-shielding patterns formed on at least one of the upper and lower surfaces of the light-shielding layer, and a portion of the light-shielding pattern may be disposed on a region that overlaps with the light-emitting device in the vertical direction.

[0011] The lighting device according to an embodiment includes: a reflective layer; a first resin layer disposed on the reflective layer; a substrate disposed on the first resin layer; a light-emitting device disposed between the first resin layer and the substrate; a second resin layer disposed on the substrate; a semi-reflective mirror layer disposed on the second resin layer; and an optical component disposed between the reflective layer and the first resin layer, wherein light emitted from the light-emitting surface of the light-emitting device passes through the optical component, is reflected by the reflective layer, and passes through the substrate, and the visible light band includes a first band having a partial band and a second band having other bands different from the first band, the reflectivity of the semi-reflective mirror layer for the first band of light may be higher than its transmittance for the first band of light, and the transmittance of the optical component for the first band of light may be higher than its transmittance for the second band of light.

[0012] According to an embodiment of the present invention, the optical component may include a first optical layer disposed between the reflective layer and the first resin layer, and a second optical layer disposed between the first optical layer and the first resin layer. The second band includes a 2-1 band and a 2-2 band, which is different from the 2-1 band. The first optical layer has a higher transmittance for light in the 2-1 band than for light in the 2-2 band, and the second optical layer has a higher transmittance for light in the 2-2 band than for light in the 2-1 band.

[0013] The lighting device according to an embodiment includes: a reflective layer; a first resin layer disposed on the reflective layer; a substrate disposed on the first resin layer; a light-emitting device disposed between the first resin layer and the substrate; a second resin layer disposed on the substrate; and a semi-reflective mirror layer disposed on the second resin layer. Light emitted from the light-emitting surface of the light-emitting device is reflected by the reflective layer and passes through the substrate. The light-emitting devices are arranged adjacent to each other and include a first light-emitting device, a second light-emitting device, and a third light-emitting device forming a unit light-emitting group. The first light-emitting device emits red light, the second light-emitting device emits green light, and the third light-emitting device emits blue light. The visible light band includes a first band having a partial band and a second band having a band different from the first band. The reflectivity of the semi-reflective mirror layer for the first band of light can be higher than its transmittance for the first band of light.

[0014] According to an embodiment of the present invention, when the semi-reflective mirror layer has a first color corresponding to the first wavelength band and the first color is red, the second light-emitting device emits light with a light intensity lower than that of the first light-emitting device, and the light passing through the semi-reflective mirror layer can be white.

[0015] Beneficial effects

[0016] The lighting device and lamp according to the embodiments can have improved light characteristics. Specifically, the lighting device and lamp include a substrate, a reflective layer, a first resin layer, a second resin layer, etc., and these components can have a predetermined thickness. Accordingly, the light emitted from the light-emitting device and emitted to the outside of the lighting device can have uniform brightness. Therefore, the lighting device and lamp can provide a line light source or a surface light source with improved light characteristics.

[0017] In the lighting device and lamp according to the embodiment, light emitted from the light-emitting device can be emitted indirectly, such that the light emitted from the light-emitting device is reflected to other internal components, rather than directly. Therefore, it is possible to prevent the light-emitting device from being directly seen from the outside and to ensure a light guide distance for uniform brightness.

[0018] The lighting device and lamp according to embodiments of the present invention can prevent or minimize the occurrence of hot spots of concentrated light emitted from the light-emitting device. Specifically, the lighting device and lamp can control the concentration of light by controlling at least one of the light-shielding patterns of the semi-reflective mirror layer and the light-shielding layer. Accordingly, the lighting device and lamp can provide light with uniform brightness.

[0019] The lighting device and lamp according to the embodiment can have improved heat dissipation characteristics. Specifically, the lighting device includes an electrode layer arranged in a defined pattern, and the electrode layer can effectively dissipate heat emitted from the light-emitting device. Therefore, the lighting device and lamp according to this embodiment can have improved reliability and uniformity even during long-term operation.

[0020] The lighting device and lamp according to the embodiments can have a concealment effect. Specifically, the lighting device and lamp may include a semi-reflective layer having a color that is the same as or similar to the color of the surrounding area. Therefore, when the lighting device and lamp are off, they may be undetectable or their detectability may be minimized. Furthermore, the lighting device and lamp may include optical components that can compensate for the spectral changes caused by the semi-reflective layer. Therefore, when the lighting device and lamp are on, the color of the light emitted from the lighting device and lamp can be prevented from being altered by the semi-reflective layer and can be the same as or similar to the color of the light emitted from the light-emitting device. Therefore, the lighting device and lamp according to embodiments of the present invention can have improved aesthetics and design freedom. Attached Figure Description

[0021] Figure 1 This is a cross-sectional view of the lighting device according to an embodiment;

[0022] Figure 2 yes Figure 1 A magnified view of region A1;

[0023] Figure 3This is a plan view of the reflective layer according to an embodiment;

[0024] Figure 4 This is an enlarged view of the optical component according to the embodiment;

[0025] Figure 5 This is a cross-sectional view according to an embodiment, wherein a light-shielding layer is added to the lighting device;

[0026] Figure 6 This is a plan view of the light-shielding layer according to the embodiment;

[0027] Figures 7 to 9 These are other cross-sectional views of the lighting device according to the embodiment;

[0028] Figure 10 This is a cross-sectional view of the lighting device based on the comparative example;

[0029] Figure 11 and Figure 12 This is a view used to explain the spectrum of the lighting device according to the comparative example;

[0030] Figures 13 to 15 It is used to explain the basis Figure 1 A view of the spectrum of the lighting device;

[0031] Figure 16 This is another cross-sectional view of the lighting device according to an embodiment;

[0032] Figures 17 to 19 It is used to explain the basis Figure 16 A view of the spectrum of the lighting device;

[0033] Figures 20 to 24 This is a view used to illustrate an example of a lamp, including a lighting device according to an embodiment, being applied to a vehicle. Detailed Implementation

[0034] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0035] The technical concept of this invention is not limited to the described subset of embodiments, but can be implemented in various different forms. When within the scope of the technical concept of this invention, one or more components can be selectively combined and substituted among embodiments. Furthermore, the terminology (including technical and scientific terms) used in the embodiments of this invention, unless explicitly defined and described, can be interpreted as having a meaning generally understood by those skilled in the art to which this invention pertains. Commonly used terms, such as those defined in dictionaries, can be interpreted in the context of the relevant art. Additionally, the terminology used in the embodiments of this invention is for describing embodiments and is not intended to limit the invention. In this specification, singular forms may include plural forms unless specifically described in the phrase, and when described as “at least one (or more than one) of A and / or B and C,” it may include at least one of all combinations that can be combined from A, B, and C. Furthermore, terms such as first, second, A, B, (a), and (b) can be used to describe components of embodiments of this invention. These terms are merely for distinguishing components from other components and are not determined by their nature, order, or sequence. Furthermore, when a component is described as being "connected," "joined," or "linked" to another component, this includes not only direct connection, joining, or linking of the component to the other component, but also connection, joining, or linking due to another component between the component and the other component. Additionally, when each component is described as being formed or positioned "above" or "below," "above" or "below" includes not only the case where two components are in direct contact with each other, but also the case where one or more components are formed or positioned between two components. Furthermore, when expressed as "above" or "below," it includes not only the upward direction based on a component, but also the downward direction based on a component.

[0036] The lighting device according to the embodiments can be applied to various lighting devices requiring illumination, such as automotive lights, household optical components, and industrial optical components. For example, when applied to automotive lights, it can be used for headlights, rearview lights, sidemaker lights, fog lights, taillights, brake lights, daytime running lights, vehicle interior lighting, door scarves, rear combination lights, backup lights, etc. Furthermore, when applied to automotive lights, it can be used in rear side assist systems (BSD) installed in rearview mirrors or A-pillars. In addition, the optical components of the present invention can also be applied to indoor and outdoor advertising devices, display devices, and various electric vehicle applications, as well as all lighting and advertising fields that are currently developed and commercialized or may be realized according to future technological advancements.

[0037] Furthermore, before describing the embodiments, the first direction may refer to the X-axis direction shown in the figure, while the second direction may be a direction different from the first direction. For example, the second direction may refer to the Y-axis direction shown in the figure, which is perpendicular to the first direction, and may refer to the optical axis direction of the light-emitting device. Additionally, the horizontal direction may refer to both the first and second directions, and the vertical direction may refer to a direction perpendicular to at least one of the first and second directions. For example, the horizontal direction may refer to both the X-axis and Y-axis directions shown in the figure, while the vertical direction may refer to the Z-axis direction shown in the figure, which is perpendicular to both the X-axis and Y-axis directions.

[0038] Figure 1 This is a cross-sectional view of a lighting device according to an exemplary embodiment. Figure 2 yes Figure 1 A magnified view of region A1. Figure 3 This is a plan view of the reflective layer according to this embodiment, and Figure 4 This is an enlarged view of the optical component according to this embodiment.

[0039] refer to Figures 1 to 4 The lighting device 1000 according to an embodiment includes a substrate 100, a light-emitting device 200, a reflective layer 300, a first resin layer 410, a second resin layer 420, a semi-reflective mirror layer 610, and an optical component 630. The lighting device 1000 can emit light emitted from the light-emitting device 200 as a surface light source. The lighting device 1000 can be defined as a light-emitting unit, a lighting module, or a light source module. The lighting device 1000 may include one or more light-emitting units on the substrate 100. The lighting device 1000 can emit light emitted from the light-emitting device 200 as a surface light source. The lighting device 1000 may include one or more light-emitting units on the substrate 100.

[0040] Substrate 100 may include a light-transmitting material. Substrate 100 may include a material through which light is transmitted via an upper surface and a lower surface. Substrate 100 may be a transparent substrate. Substrate 100 may include at least one of polyethylene terephthalate (PET), polystyrene (PS), polyimide (PI), polyethylene naphthalate (PEN), and polycarbonate (PC). Substrate 100 may have a thickness of 20 μm or greater, for example, in the range of 20 μm to 300 μm. More specifically, substrate 100 may have a thickness of 30 μm to 250 μm. More specifically, substrate 100 may have a thickness of 50 μm to 200 μm. When substrate 100 has a thickness of less than 20 μm, it may be difficult to effectively support components disposed on substrate 100; for example, the weight of the light-emitting device 200 may cause sagging in an area of ​​substrate 100 where the light-emitting device 200 is disposed. Therefore, the reliability of the substrate 100 may deteriorate, and alignment problems of the light-emitting device 200 disposed on the substrate 100 may occur. When the thickness of the substrate 100 exceeds 300 μm, the total thickness of the lighting device 1000 may increase, and the flexibility of the substrate 100 may decrease. Furthermore, when the thickness of the substrate 100 exceeds 300 μm, the path of the emitted light may change due to the thickness of the substrate 100, making it difficult to achieve a uniform surface light source.

[0041] An electrode layer (not shown) may be disposed on the substrate 100. It may be disposed on the lower surface of the substrate 100. Specifically, the electrode layer may be disposed on the lower surface of the substrate 100 facing the first resin layer 410. The electrode layer may include a first electrode (not shown) and a second electrode (not shown). The first electrode and the second electrode may be spaced apart from each other on the lower surface of the substrate 100. For example, the first electrode and the second electrode may be spaced apart relative to the light-emitting device 200 in a first direction. Accordingly, the first electrode and the second electrode may be electrically separated from each other. The first electrode and the second electrode may include conductive materials. For example, the first electrode and the second electrode may include at least one of aluminum (Al), copper (Cu), silver (Ag), gold (Au), chromium (Cr), nickel (Ni), molybdenum (Mo), titanium (Ti) and their alloys, carbon, and conductive polymers. The first and second electrodes can be transparent conductive materials, such as at least one selected from indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), or indium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO), and gallium zinc oxide (GZO). The first and second electrodes can supply current to the light-emitting device 200. For example, the first electrode can supply a current with a first polarity to the light-emitting device 200, and the second electrode can supply a current with a second polarity opposite to the first polarity to the light-emitting device 200.

[0042] The first and second electrodes can have shapes disposed on the substrate 100. For example, each of the first and second electrodes may include a plurality of sub-wires extending in different directions. The plurality of sub-wires may have a defined linewidth and may be arranged in an intersecting mesh shape on the substrate 100. Therefore, an opening formed by the plurality of sub-wires can be formed on the substrate 100. Here, the opening is a region where the first and second electrodes are not disposed, and light supplied to the substrate 100 can travel through the opening to the upper or lower surface of the substrate 100. That is, the first and second electrodes form openings with defined shapes and sizes so that light emitted from the light-emitting device 200 can be emitted smoothly in an upward direction, and a path can be provided for heat generated from the light-emitting device 200 to be effectively radiated. Therefore, the lighting device 1000 can have improved light emission and heat dissipation characteristics.

[0043] The light-emitting device 200 can be disposed on the substrate 100. For example, the light-emitting device 200 can be disposed on the lower surface of the substrate 100. The light-emitting device 200 can be positioned facing the reflective layer 300, which will be described later. The light-emitting device 200 includes an LED chip that emits light on at least five surfaces and can be disposed on the substrate 100 in a flip-chip configuration. Alternatively, the light-emitting device 200 can be a lateral chip or a vertical chip. In a lateral chip, two different electrodes can be arranged horizontally, while in a vertical chip, two different electrodes can be arranged vertically. Since the light-emitting device 200 is connected to another chip or wiring pattern by wiring in the case of a lateral or vertical chip, the thickness of the module may increase due to the height of the wiring, and pad space may be required for bonding the wiring. The light-emitting device 200 can include a package in which the LED chip is encapsulated. The LED chip can emit at least one of blue, red, green, ultraviolet (UV), and infrared light, while the light-emitting device 200 can emit at least one of white, blue, red, green, and infrared light. The light-emitting device 200 can be a top-view type with its bottom electrically connected to the substrate 100. The optical axis of the light-emitting device 200 can be perpendicular to the lower surface of the substrate 100.

[0044] The light-emitting device 200 can be electrically connected to the electrode layer. For example, the light-emitting device 200 can be electrically connected to a first electrode and a second electrode on the substrate 100 via the substrate 100 and a conductive bonding member (not shown). The conductive bonding member can be a soldering material or a metallic material. Multiple light-emitting devices 200 can be disposed on the substrate 100. For example, such as... Figure 1 As shown, a plurality of light-emitting devices 200a and 200b spaced apart in the first direction (X-axis direction) can be disposed on the substrate 100. Furthermore, although not shown in the figure, a plurality of light-emitting devices 200 spaced apart in the second direction (Y-axis direction) can be disposed on the substrate 100. For example, when viewed from a plane, the plurality of light-emitting devices 200 can be arranged in rows a × columns b (where a and b are natural numbers that are equal to or different from each other).

[0045] The light-emitting device 200 may include a light-emitting surface from which light is emitted. The light-emitting surface of the light-emitting device 200 may face the upper surface of the reflective layer 300. The light-emitting surface may be parallel to the upper surface of the reflective layer 300. The light-emitting surface of the light-emitting device 200 may emit the most intense light in a third direction (Z-axis direction), for example, towards the upper surface of the reflective layer 300. The light-emitting surface may be a vertical plane or may include a concave or convex surface.

[0046] The light-emitting device 200 can emit light toward the reflective layer 300. For example, light emitted through the light-emitting surface of the light-emitting device 200 can be provided to the reflective layer 300. The light provided to the reflective layer 300 can be reflected by the reflective layer 300 and emitted toward the substrate 100. The light passing through the substrate 100 can be in the form of a line light source or a surface light source. That is, the lighting device 1000 can be an indirect lighting device. Accordingly, the light-emitting device 200 can be prevented from being visually identified from the outside. In this case, the optical axis of the light-emitting device 200 can be perpendicular to the lower surface of the substrate 100. In addition, the optical axis of the light-emitting device 200 can be perpendicular to the upper surface of the reflective layer 300.

[0047] A reflective layer 300 may be disposed on the substrate 100. Specifically, the reflective layer 300 may be disposed on the lower surface of the substrate 100. The reflective layer 300 may be disposed at a position lower than the lower surfaces of the substrate 100 and the light-emitting device 200. The reflective layer 300 is spaced apart from the substrate 100 and the light-emitting device 200, and the reflective layer 300 may be configured to face the light-emitting surface of the light-emitting device 200. The reflective layer 300 may have an area greater than or equal to the lower surface of the substrate 100. The reflective layer 300 may include a thin film layer (not shown). This thin film layer may be provided in the form of a thin film having a metallic or non-metallic material. The metallic material may include metals, such as aluminum, silver, or gold. The non-metallic material may include plastic or resin materials. The plastic material can be one selected from the group consisting of polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyphenylene chloride, polyethylene terephthalate, polyvinyl alcohol, polycarbonate, polybutylene terephthalate, polynaphthalene ester, polyamide, polyacetal, polyphenylene ether, polyamide-imide, polyether-imide, polyetheretherketone, polyimide, polytetrafluoroethylene, liquid crystal polymer, fluorine, copolymers thereof, and mixtures thereof. As a resin material, metal oxides such as TiO2, Al2O3, or SiO2 can be added to silicon or epoxy resin. The thin film layer can be implemented as a single layer or multiple layers, and the light reflection efficiency can be improved through such a layer structure. Furthermore, the thin film layer can be provided in a colored form. Specifically, the thin film layer can be set to a color with low light absorption and excellent light reflection characteristics. For example, the thin film layer can be set to white with excellent light reflection characteristics. Specifically, the thin film layer can be formed from white polyethylene naphthalate.

[0048] The reflective layer 300 may have a thickness of 50 μm or more, for example, a thickness range of 50 μm to 500 μm. More specifically, the reflective layer 300 may have a thickness of 80 μm to 400 μm. More specifically, the reflective layer 300 may have a thickness of 100 μm to 300 μm. When the thickness of the reflective layer 300 is less than 50 μm, the light reflection characteristics of the reflective layer 300 may deteriorate, and the reliability of the lighting device 1000 may be compromised. Furthermore, when the thickness of the reflective layer 300 exceeds 500 μm, the total thickness of the lighting device 1000 may increase, resulting in a decrease in the flexibility of the lighting device 1000. Preferably, considering reliability and light reflection characteristics, the thickness of the reflective layer 300 may be between 80 μm and 350 μm.

[0049] The reflective layer 300 may include a reflective pattern 310. The reflective pattern may have multiple dots. Multiple reflective patterns 310 may be disposed on the lower surface of the substrate 100 and the upper surface of the reflective layer 300 facing the light-emitting device 200. Multiple reflective patterns 310 may be disposed on the upper surface of the reflective layer 300 in a protruding form. For example, the reflective pattern 310 may be disposed on the upper surface of the reflective layer 300 in a protruding form toward the light-emitting device 200.

[0050] Multiple reflective patterns 310 may be spaced apart from each other in a first direction and a second direction, and may be disposed in areas not corresponding to the light-emitting device 200. Specifically, the multiple reflective patterns 310 may be disposed in areas that do not overlap with the light-emitting device 200 along the vertical direction (the third direction, the Z-axis direction). The multiple reflective patterns 310 may be formed by a printing process. For example, the multiple reflective patterns 310 may include reflective ink. The multiple reflective patterns 310 may be printed with materials including any of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS. The material of the reflective patterns 310 may be white, possessing excellent reflective properties. When viewed from above, the multiple reflective patterns 310 may have various shapes, such as circular, elliptical, and polygonal. Furthermore, each of the multiple reflective patterns 310 may have a hemispherical cross-section or a polygonal shape. The dot pattern density of the multiple reflective patterns 310 may vary with increasing distance from the area corresponding to the light-emitting device 200. For example, the density of the plurality of reflective patterns 310 can increase with increasing distance from the overlapping region that is perpendicularly overlapping with the light-emitting device 200 on the upper surface of the reflective layer 300. That is, the density of the plurality of reflective patterns 310 can increase with increasing distance from the optical axis of the light-emitting device 200 in the horizontal direction. Furthermore, the size of each of the plurality of reflective patterns 310 can change with increasing distance from the overlapping region. For example, the horizontal width of each of the plurality of reflective patterns 310 can increase with increasing distance from the overlapping region. The width of each of the reflective patterns 310 can increase with increasing distance from the optical axis of the light-emitting device 200 in the horizontal direction. In other words, since the plurality of reflective patterns 310 are disposed on the upper surface of the reflective layer 300 that does not overlap with the light-emitting device 200, the reflective layer 300 can improve the reflectivity of light emitted from the light-emitting device 200. Therefore, the illumination device 1000 can reduce the loss of light emitted outward through the opening region on the substrate 100 where no electrode layer is disposed, and can improve the brightness of the surface light source.

[0051] A first resin layer 410 may be disposed on a substrate 100. The first resin layer 410 may be disposed on the lower surface of the substrate 100. The first resin layer 410 may be disposed between the substrate 100 and the reflective layer 300. The first resin layer 410 may be disposed between the lower surface of the substrate 100 and the upper surface of the reflective layer 300. The first resin layer 410 may be disposed over the entire or a portion of the lower surface of the substrate 100. The first resin layer 410 may be formed of a transparent material. The first resin layer 410 may include a resin material, such as silicone or epoxy resin. The first resin layer 410 may optionally include a thermosetting resin material, such as PC, OPS, PMMA, or PVC. The first resin layer 410 may be made of glass, but is not limited thereto. For example, a resin material containing a polyurethane acrylate oligomer as a main material may be used as the main material of the first resin layer 410. For example, a mixture of synthetic oligomers, polyurethane acrylate oligomers, and polyacrylate polymers may be used. Of course, it can further include monomers mixed with low-boiling-point diluents such as IBOA (isobornyl acrylate), HPA (hydroxypropyl acrylate, 2-HEA (hydroxyethyl acrylate)), photoinitiators (e.g., 1-hydroxycyclohexylphenyl ketone), or antioxidants. Since the first resin layer 410 is configured as a layer for guiding light with resin, it can be provided as a thinner and more flexible plate than glass. The first resin layer 410 can emit a point light source from the light-emitting device 200 in the form of a line light source or a surface light source.

[0052] The upper surface of the first resin layer 410 can emit light by diffusing light emitted from the light-emitting device 200. For example, beads (not shown) can be included in the first resin layer 410, and the beads diffuse and reflect the incident light to increase the light intensity. The beads can be provided in the range of 0.01% to 0.3% by weight of the first resin layer 410. The beads can be composed of any one selected from silicon, silica, glass bulb, PMMA (polymethyl methacrylate), polyurethane, Zn, Zr, Al2O3, and acrylic acid, and the particle size of the beads can be in the range of 1 μm to 20 μm, but is not limited thereto.

[0053] The first resin layer 410 can have a thickness greater than that of the light-emitting device 200. For example, the first resin layer 410 can have a thickness of 4 mm or less. More specifically, the first resin layer 410 can have a thickness of 0.5 mm to 3 mm or less. More specifically, the first resin layer 410 can have a thickness of 1 mm to 3 mm. More specifically, the first resin layer 410 can have a thickness of 1.5 mm to 2.5 mm. When the thickness h1 of the first resin layer 410 is less than 0.5 mm, it may be difficult to effectively guide light from the light-emitting device 200. That is, because the distance between the light-emitting device 200 and the reflective layer 300 is too small, the lighting device 1000 may find it difficult to achieve a surface light source. Furthermore, when the thickness h1 of the first resin layer 410 exceeds 4 mm, the overall optical path may increase. Accordingly, light loss may occur during the emission of light from the light-emitting device 200. Therefore, preferably, the thickness h1 of the first resin layer 410 satisfies the above-described range. The first resin layer 410 can be disposed around the light-emitting device 200. The first resin layer 410 can seal the light-emitting device 200. The first resin layer 410 can protect the light-emitting device 200 and reduce the loss of light emitted from the light-emitting device 200. The first resin layer 410 can contact the surface of the light-emitting device 200 and can contact the light-emitting surface of each light-emitting device 200. Additionally, the first resin layer 410 can contact the lower surface of the substrate 100 and the upper surface of the reflective layer 300. That is, the first resin layer 410 can support the substrate 100, the light-emitting device 200, and the reflective layer 300, and the components 100, 200, and 300 can be maintained at a predetermined distance or interval.

[0054] The second resin layer 420 may be disposed on the substrate 100. The second resin layer 420 may be disposed on the upper surface of the substrate 100 opposite to the lower surface of the substrate 100 on which the first resin layer 410 is disposed. The second resin layer 420 may be disposed on the entire upper surface or a portion thereof of the substrate 100. The second resin layer 420 may be formed of a transparent material. The second resin layer 420 may include a resin material, such as silicone or epoxy resin. The second resin layer 420 may optionally include a thermosetting resin material, such as PC, OPS, PMMA, or PVC. The second resin layer 420 may be made of glass, but is not limited thereto. For example, as the main material of the second resin layer 420, a resin material containing polyurethane acrylate oligomers may be used as the main material. For example, a mixture of synthetic oligomers, polyurethane acrylate oligomers, and polyacrylate polymers may be used. Of course, it may further include monomers mixed with low-boiling-point diluent active monomers (such as IBOA (isoborneol acrylate), HPA (hydroxypropyl acrylate, 2-HEA (hydroxyethyl acrylate)), photoinitiators (such as 1-hydroxycyclohexylphenyl ketone), or antioxidants. The second resin layer 420 may include the same material as the first resin layer 410.

[0055] The second resin layer 420 can serve as a light-guiding layer. For example, the second resin layer 420 can guide light incident through the substrate 100. More specifically, the second resin layer 420 can further diffuse light reflected from the reflective layer 300 and already passed through the first resin layer 410 and the substrate 100. For example, beads (not shown) may be included in the second resin layer 420, which diffuse and reflect incident light to increase the light intensity. The beads may be provided in the range of 0.01 to 0.3% by weight of the second resin layer 420. The beads may be composed of one selected from silicon, silica, glass bulb, PMMA (polymethyl methacrylate), polyurethane, Zn, Zr, Al2O3, and acrylic acid, and the particle size of the beads may be in the range of 1 μm to 20 μm, but is not limited thereto.

[0056] The second resin layer 420 can function as an adhesive layer. For example, the second resin layer 420 can be configured as an adhesive layer that bonds the substrate 100 disposed beneath the second resin layer 420 to two components disposed thereon. The second resin layer 420 can have a defined thickness h2. For example, the thickness h2 of the second resin layer 420 can be 2 mm or less. More specifically, the thickness h2 of the second resin layer 420 can be from 50 μm to 1.5 mm. More specifically, the thickness h2 of the second resin layer 420 can be from 100 μm to 1 mm. When the thickness h2 of the second resin layer 420 is less than 50 μm, it may be difficult to function as an adhesive layer between the substrate 100 and the components disposed thereon, and it may be difficult to effectively guide light incident on the second resin layer 420. That is, because the thickness h2 of the second resin layer 420 is relatively thin, the space for guiding light emitted through the substrate 100 may be insufficient. Furthermore, when the lighting device 1000 is bent in a third direction under external force, such as in a wavy shape, the thickness h2 of the second resin layer 420 is too thin to effectively guide the light emitted through the substrate 100 and the first resin layer 410. When the thickness h2 of the second resin layer 420 exceeds 2 mm, the total thickness of the lighting device 1000 increases, thus potentially reducing design freedom and causing light loss due to the thickness h2 of the second resin layer 420. Therefore, preferably, the thickness h2 of the second resin layer 420 satisfies the aforementioned range.

[0057] The thickness h2 of the second resin layer 420 can be different from the thickness h1 of the first resin layer 410. Specifically, the thickness h2 of the second resin layer 420 can be smaller than the thickness h1 of the first resin layer 410. For example, the thickness h2 of the second resin layer 420 can be 0.03% to 95% of the thickness h1 of the first resin layer 410. Therefore, the lighting device 1000 according to this embodiment can emit light with excellent uniformity. That is, since the first resin layer 410 and the second resin layer 420 satisfy the above-described thickness range, the lighting device 1000 can provide a line light source or a surface light source with excellent uniformity.

[0058] A semi-reflective mirror layer 610 may be disposed on the second resin layer 420. The semi-reflective mirror layer 610 may be disposed on the entire upper surface or a portion of the upper surface of the second resin layer 420. The semi-reflective mirror layer 610 may be disposed in a plane corresponding to the second resin layer 420. The semi-reflective mirror layer 610 may include a metal. For example, the semi-reflective mirror layer 610 may be provided in the form of a thin film of at least one of various metals such as aluminum (Al), silver (Ag), copper (Cu), nickel (Ni), gold (Au), platinum (Pt), titanium (Ti), and tungsten (W). Furthermore, the semi-reflective mirror layer 610 may include a substrate (not shown) and a metal layer (not shown). The substrate may include a material capable of transmitting light emitted from the light-emitting device 200. For example, the substrate may be transparent. The metal layer may include at least one of various metals such as aluminum (Al), silver (Ag), copper (Cu), nickel (Ni), gold (Au), platinum (Pt), titanium (Ti), and tungsten (W). The metal layer may be formed on at least one of the surfaces of the substrate by coating or deposition.

[0059] The semi-reflective mirror layer 610 can have a set thickness. For example, the thickness h3 of the semi-reflective mirror layer 610 can be 100 μm or less to provide a semi-transmittance and semi-reflection function. More specifically, the thickness h3 of the semi-reflective mirror layer 610 can be from 1 μm to 75 μm. More specifically, the thickness h3 of the semi-reflective mirror layer 610 can be from 1 μm to 50 μm. When the thickness h3 of the semi-reflective mirror layer 610 is less than 1 μm, the semi-transmittance and semi-reflection function of the semi-reflective mirror layer 610 may be degraded. Specifically, because the thickness of the semi-reflective mirror layer 610 is relatively thin, components disposed in the lower region of the semi-reflective mirror layer 610 can be identified from the outside (in the direction of the upper surface of the semi-reflective mirror layer 610). Furthermore, when the thickness h3 of the semi-reflective mirror layer 610 exceeds 100 μm, the transmittance of light emitted from the light-emitting device 200 may decrease. In detail, the light passing through the semi-reflective mirror layer 610 may be reduced due to the thickness of the semi-reflective mirror layer 610, thus potentially reducing the overall brightness of the lighting device 1000. The thickness h3 of the semi-reflective mirror layer 610 can be provided uniformly within the aforementioned range. Specifically, the thickness h3 of the semi-reflective mirror layer 610 in the vertical direction can be constant and not vary along the horizontal direction (x-axis and y-axis directions). Alternatively, the thickness h3 of the semi-reflective mirror layer 610 can be varied. For example, the thickness h3 of the semi-reflective mirror layer 610 can be set such that the region perpendicularly overlapping with the light-emitting device 200 is thicker than the region not overlapping with the light-emitting device 200. Specifically, in the semi-reflective mirror layer 610, the thickness of the region where the hotspot of the light-emitting device 200 is formed can be greater than the thickness of the region where no hotspot is formed. For example, the semi-reflective mirror layer 610 can have an uneven shape, and the cross-section of the uneven shape can have a polygonal shape, such as a semi-circular shape, a triangle, or a polygon.

[0060] The semi-reflective mirror layer 610 can provide a semi-transmittance and semi-reflection function. The semi-reflective mirror layer 610 can have a relatively low light transmittance and a relatively high reflectance for the color of the incident light corresponding to the semi-reflective mirror layer 610. For example, the visible light band may include a first band defined as a portion of the band and a second band having a band different from the first band. In this case, the semi-reflective mirror layer 610 can have a first color corresponding to the first band. In this case, the semi-reflective mirror layer 610 can have a relatively low transmittance and a relatively high reflectance for the light of the first band. That is, the reflectance of the semi-reflective mirror layer 610 for the light of the first band can be higher than its transmittance for the light of the first band. Moreover, the transmittance of the semi-reflective mirror layer 610 for the light of the first band can be lower than its transmittance for the light of the second band. Therefore, the lighting device 1000 according to the embodiment can have improved aesthetics due to the semi-reflective mirror layer 610 having a set transmittance and reflectance. In detail, when the lighting device 1000 emits light, the light emitted from the light-emitting device 200 can be provided to the outside through the semi-reflective mirror layer 610.

[0061] When the lighting device 1000 is not emitting light, the first color, namely the color of the semi-reflective layer 610, can be visually identifiable from the outside, thereby achieving improved aesthetics. For example, when the lighting device 1000 is not emitting light, the semi-reflective layer 610 can be provided with a color that is the same as or similar to the color of the peripheral area of ​​the lighting device 1000. Therefore, the lighting device 1000 can have a concealing effect that prevents or minimizes external visibility. The semi-reflective layer 610 can effectively prevent hot spots from occurring by forming a relatively thick area corresponding to the hot spots formed by the light-emitting device 200. Therefore, the light emitted through the semi-reflective layer 610 can have uniform brightness, and the lighting device 1000 can provide a line light source or a surface light source with improved light characteristics.

[0062] Optical component 630 may be disposed on the second resin layer 420. Optical component 630 may be disposed between the second resin layer 420 and the semi-reflective mirror layer 610. Optical component 630 can prevent or minimize changes in the color of light emitted from the illumination device 1000 compared to the color of light emitted from the self-emissive device 200. Specifically, optical component 630 can compensate for spectral changes caused by the semi-reflective mirror layer 610. Optical component 630 may include materials capable of controlling the transmittance and reflectance of light in a set wavelength band. For example, optical component 630 may include materials such as metal, resin, or ceramic, and may be disposed in the form of a thin film or prism sheet.

[0063] The optical component 630 may have a set thickness. For example, the thickness h4 of the optical component 630 may be 300 μm or less. More specifically, the thickness h4 of the optical component 630 may be from 1 μm to 300 μm. More specifically, the thickness h4 of the optical component 630 may be from 1 μm to 250 μm.

[0064] When the thickness h4 of the optical component 630 is less than 1 μm, the optical spectral compensation effect may be insignificant. Specifically, because the thickness h4 of the optical component 630 is relatively thin, the optical spectral compensation effect produced by the semi-reflective mirror layer 610 may be insignificant. Therefore, the color of the light emitted to the outside of the illumination device 1000 may not correspond to the color of the light emitted from the light-emitting device 200. When the thickness h4 of the optical component 630 exceeds 300 μm, the transmittance of the light emitted from the light-emitting device 200 may decrease. Specifically, because the thickness of the optical component 630 is relatively thick, the amount of light passing through the optical component 630 may decrease, thus reducing the overall brightness of the illumination device 1000. Furthermore, because the thickness h4 of the optical component 630 is too thick, the optical spectral compensation effect may deteriorate. Therefore, the color of the light emitted to the outside of the illumination device 1000 may not correspond to the color of the light emitted from the light-emitting device 200. Preferably, when the optical component 630 is provided as a thin film in the form of a film, the optical component 630 may have a thickness h4 of 1 μm to 150 μm, and when provided as a prism sheet, the optical component 630 may have a thickness h4 of 1 μm to 150 μm. The thickness h4 of the component 630 may be 50 μm to 250 μm.

[0065] The optical component 630 can provide an optical spectral compensation effect through the semi-reflective mirror layer 610. For example, since the semi-reflective mirror layer 610 is provided in a first color, the transmittance of light in the first wavelength band may be lower than that in the second wavelength band. In this case, the optical component 630 can be provided such that the transmittance of light in the first wavelength band is higher than that in the second wavelength band. Therefore, when light emitted from the light-emitting device 200 passes through each of the optical component 630 and the semi-reflective mirror layer 610, the spectrum can be compensated for due to the difference in transmittance according to the wavelength band. Thus, the light emitted to the outside of the illumination device 1000 can have a color corresponding to the color of the light-emitting device 200, for example, the same or similar color to the light emitted from the light-emitting device 200.

[0066] For example, this embodiment may include multiple light-emitting devices 200, and each of the multiple light-emitting devices 200 may emit light of the same color as each other, such as white light. Furthermore, the semi-reflective mirror layer 610 may be provided in a first color, such as red, and has relatively low transmittance for a first wavelength corresponding to the first color, and relatively high transmittance for a second wavelength. Therefore, when white light emitted from the light-emitting device 200 passes through the semi-reflective mirror layer 610, the color of the light passing through may resemble cyan rather than white. The optical component 630 located in the light emission path of the light-emitting device 200 has relatively high transmittance for the first wavelength and relatively low transmittance for wavelengths corresponding to the second wavelength (e.g., green and blue). That is, the transmittance of red light from the optical component 630 may be higher than that of green and blue light. Therefore, by allowing light emitted from the light-emitting device 200 to pass through the optical component 630 and the semi-reflective mirror layer 610 respectively, the spectrum can be compensated based on the difference in transmittance for each wavelength of each layer 610 and 630. Therefore, when white light is emitted from the light-emitting device 200, the light emitted to the outside of the lighting device 1000 can have the same or similar color as the white light emitted from the light-emitting device 200.

[0067] The optical component 630 can be provided as a single layer or multiple layers. For example, when the optical component 630 is provided as a single layer, the single layer can compensate for light in the relatively low-transmittance bands of the semi-reflective mirror layer 610 and can reduce the transmittance of light in the relatively high-transmittance bands of the semi-reflective mirror layer 610. Therefore, the optical component 630 can compensate for the spectrum altered due to the semi-reflective mirror layer 610. As another example, the optical component 630 can be provided as multiple layers. For example, the optical component 630 may include a first optical layer 631 and a second optical layer 632. The first optical layer 631 may be disposed between the second resin layer 420 and the semi-reflective mirror layer 610. The second optical layer 632 may be disposed between the first optical layer 631 and the semi-reflective mirror layer 610.

[0068] Each of the first optical layer 631 and the second optical layer 632 may have a predetermined thickness. For example, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be 150 μm or less. More specifically, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be from 0.5 μm to 125 μm. More specifically, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be from 0.5 μm to 100 μm. Preferably, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 may be from 0.5 μm to 75 μm to achieve optical efficiency and luminous intensity compensation.

[0069] The first optical layer 631 and the second optical layer 632 can compensate for light in wavelengths with relatively low transmittance in the semi-reflective mirror layer 610. For example, the second wavelength in the visible light band may include a 2-1 band and a 2-2 band, which is different from the 2-1 band. The first optical layer 631 may have relatively high transmittance for light in the first and 2-1 bands, and relatively low transmittance for light in the 2-2 band. In this case, the first optical layer 631 may have higher transmittance for light in the first and 2-1 bands than for light in the 2-2 band. The second optical layer 632 may have relatively high transmittance for light in the first and 2-2 bands, and relatively low transmittance for light in the 2-1 band. In this case, the second optical layer 632 may have higher transmittance for light in the first and 2-2 bands than for light in the 2-1 band.

[0070] The first optical layer 631 and the second optical layer 632 can pre-compensate for the spectral changes caused by the semi-reflective mirror layer 610. For example, each of the plurality of light-emitting devices 200 can emit white light, and the first optical layer 631 can be provided in a first color, such as red. In this case, the first optical layer 631 can have relatively high transmittance for light in the first and 2-1 bands, and low transmittance for light in the 2-2 band. For example, the first optical layer 631 can have relatively high transmittance for light in the bands corresponding to red and green, and relatively low transmittance for light in the band corresponding to blue.

[0071] The second optical layer 632 can have relatively high transmittance for light in the first and 2-2 bands, and low transmittance for light in the 2-1 band. For example, the second optical layer 632 can have relatively high transmittance for light in the bands corresponding to red and blue, and relatively low transmittance for light in the band corresponding to green. Accordingly, the light L emitted from the light-emitting device 200 can be compensated for by the differences in transmittance of the bands of each layer 631, 632, and 610 as it passes through the first optical layer 631, the second optical layer 632, and the semi-reflective mirror layer 610, respectively. Therefore, when white light L is emitted from the light-emitting device 200, the light L emitted to the outside of the illumination device 1000 can have the same or similar color as the white light L emitted from the light-emitting device 200.

[0072] The lighting device 1000 may further include a protective layer 500. The protective layer 500 may be disposed on the substrate 100. The protective layer 500 may be disposed on the second resin layer 420. The protective layer 500 may be disposed on the semi-reflective mirror layer 610. The protective layer 500 may be disposed on the outermost side of the lighting device 1000. The protective layer 500 may include a light-transmitting material. Specifically, the protective layer 500 may include materials through which light passing through the upper and lower surfaces is transmitted. That is, the protective layer 500 may be a light-transmitting layer. For example, the protective layer 500 may include at least one of polyethylene terephthalate (PET), polystyrene (PS), polyimide (PI), polyethylene naphthalate (PEN), and polycarbonate (PC). The protective layer 500 may have a predetermined thickness and protect components disposed below, such as the substrate 100, the first resin layer 410, the optical component 630, and the semi-reflective mirror layer 610. For example, the protective layer 500 can have a thickness of 100 μm or greater, for example, 100 μm to 2.5 mm. More specifically, the protective layer 500 can have a thickness of 200 μm to 2 mm. More specifically, the protective layer 500 can have a thickness of 1 mm to 2 mm. When the thickness of the protective layer 500 is less than 100 μm, it may be difficult to effectively protect the components disposed beneath it due to its relatively thin thickness. Additionally, when the thickness of the protective layer 500 exceeds 2.5 mm, the total thickness of the lighting device 1000 may increase, and the brightness may decrease. Furthermore, when the thickness of the protective layer 500 exceeds 2.5 mm, the flexibility of the lighting device 1000 may decrease due to the thickness. In this case, the structure and form of the lighting device 1000 that can be applied may be limited. Therefore, preferably, the thickness of the protective layer 500 satisfies the above-mentioned range.

[0073] Figure 5 This is a cross-sectional view in which, according to an embodiment, a light-shielding layer is added to the lighting device, and Figure 6 This is a plan view of the light-shielding layer according to an embodiment. In use... Figure 5 and Figure 6 In the description, the same reference numerals are given to the same and similar parts as the above-described lighting device, and the same or similar configurations are omitted.

[0074] refer to Figure 5 and Figure 6 The lighting device 1000 according to the embodiment may include a light-shielding layer 700. The light-shielding layer 700 may be disposed on the upper surface of the substrate 100. The light-shielding layer 700 may be disposed on the second resin layer 420. The light-shielding layer 700 may be disposed between the second resin layer 420 and the protective layer 500.

[0075] The light-shielding layer 700 may include a light-transmitting material. For example, the light-shielding layer 700 may include at least one of polyethylene terephthalate (PET), polystyrene (PS), polyimide (PI), polyethylene naphthalate (PEN), and polycarbonate (PC). The area of ​​the light-shielding layer 700, excluding the light-shielding pattern 710 described below, may be a light-transmitting layer. The light-shielding layer 700 may have a set thickness. For example, the light-shielding layer 700 may have a thickness of 50 μm to 300 μm. More specifically, the light-shielding layer 700 may have a thickness of 80 μm to 250 μm. More specifically, the light-shielding layer 700 may have a thickness of 100 μm to 200 μm. When the thickness of the light-shielding layer 700 is less than 50 μm, it may be difficult to effectively block light incident from the lower part of the light-shielding layer 700. That is, hot spots may form because the light-shielding layer 700 does not have sufficient thickness for hot spot control. Furthermore, when the thickness of the light-shielding layer 700 exceeds 300 μm, the formation of hot spots by the light emitted from the light-emitting device 200 can be effectively controlled. However, the light emitted from the light-emitting device 200 may be lost as it passes through the light-shielding layer 700, thus potentially reducing the overall brightness. Therefore, the thickness of the light-shielding layer 700 is preferably within the aforementioned range.

[0076] The light-shielding layer 700 may include a plurality of light-shielding patterns 710 spaced apart from each other in a first direction and a second direction. The plurality of light-shielding patterns 710 may be formed on at least one of the lower surface facing the second resin layer 420 and the upper surface facing the protective layer 500. The light-shielding patterns 710 may block light emitted through the substrate 100. The light-shielding patterns 710 may include ink. For example, the light-shielding patterns 710 may be printed with a material including any one of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS. The light-shielding patterns 710 may be white with excellent reflective properties. Furthermore, the light-shielding patterns 710 may be configured as a groove shape on at least one of the upper and lower surfaces of the light-shielding layer 700. For example, when the light-shielding patterns 710 are formed on the upper surface of the light-shielding layer 700, the light-shielding patterns 710 may be configured as a groove extending from the upper surface to the lower surface of the light-shielding layer 700.

[0077] Multiple light-shielding patterns 710 can be disposed in the region corresponding to the light-emitting device 200. Specifically, a portion of the light-shielding pattern 710 can be disposed in the region overlapping with the light-emitting device 200 in the vertical direction. The density of the multiple light-shielding patterns 710 can change with increasing distance from the region corresponding to the light-emitting device 200. For example, the density of the multiple light-shielding patterns 710 can decrease with increasing distance from the region in the light-shielding layer 700 that overlaps with the optical axis of the light-emitting device 200. Furthermore, the size of each of the multiple light-shielding patterns 710 can decrease with decreasing distance from the region overlapping with the optical axis of the light-emitting device 200, or they can have the same size. The multiple light-shielding patterns 710 can have a defined shape. For example, when viewed from above, the light-shielding pattern 710 can have various shapes, such as polygonal, circular, and elliptical shapes. Furthermore, the light-shielding area formed by the multiple light-shielding patterns 710 can have a nearly circular shape, such as... Figure 6 As shown. The light-shielding area formed by multiple light-shielding patterns 710 can have a set area. For example, the area of ​​the light-shielding area can be larger than the area of ​​the lower surface of the light-emitting device 200. For example, the area of ​​the light-shielding area can be 5 times or more, for example, 5 to 20 times the area of ​​the lower surface of the light-emitting device 200. More specifically, the area of ​​the light-shielding area can be 8 to 15 times the area of ​​the lower surface of the light-emitting device 200.

[0078] When the area of ​​the light-shielding region formed by the multiple light-shielding patterns 710 is less than five times the area of ​​the lower surface of the light-emitting device 200, it is difficult to prevent the formation of hot spots by light passing through the substrate 100. Furthermore, when the area of ​​the light-shielding region exceeds 20 times the area of ​​the lower surface of the light-emitting device 200, the formation of hot spots by light passing through the substrate 100 can be prevented, but the overall brightness of the lighting device 1000 may be reduced due to the light-shielding patterns 710. Therefore, it is preferable that the light-shielding region formed by the multiple light-shielding patterns 710 satisfies the aforementioned range.

[0079] Figures 7 to 9 This is another cross-sectional view of the lighting device according to an embodiment. In use Figures 7 to 9 In the description, the description of parts that are the same as or similar to the above-described lighting device is omitted, and the same reference numerals are given to parts that are similar to the above-described lighting device.

[0080] refer to Figure 7The optical component 630 can be disposed below the first resin layer 410. The optical component 630 can be disposed between the reflective layer 300 and the first resin layer 410. Light emitted from the light-emitting surface of the light-emitting device 200 can be reflected by the reflective layer 300 and pass through the substrate 100, and in the process, pass through the optical component 630. Specifically, light emitted from the light-emitting device 200 can pass through the optical component 630 and be provided to the reflective layer 300. After being reflected by the reflective layer 300, it can again pass through the optical component 630 and pass through the substrate 100. The optical component 630 can have a predetermined thickness. For example, the thickness h4 of the optical component 630 can be 300 μm or less. More specifically, the thickness h4 of the optical component 630 can be 1 μm or more, for example, from 1 μm to 300 μm. More specifically, the thickness h4 of the optical component 630 can be from 1 μm to 250 μm.

[0081] Optical component 630 can prevent or minimize the change in color between the light emitted from illumination device 1000 and the light emitted from self-emissive device 200. Specifically, optical component 630 can pre-compensate for the spectral alteration caused by semi-reflective mirror layer 610. For example, semi-reflective mirror layer 610 can be set to red, defined as a first color, while light-emitting device 200 can emit white light. In this case, optical component 630 can be configured such that the transmittance of the first wavelength (red) light is higher than the transmittance of the second wavelength (green or blue) light. Therefore, the light L emitted from light-emitting device 200 can have a color close to red while passing through optical component 630. Subsequently, this light can pass through semi-reflective mirror layer 610, which has a relatively low transmittance for the first wavelength. Accordingly, the light L emitted to the outside of illumination device 1000 can have the same or similar color as the light emitted from light-emitting device 200.

[0082] refer to Figure 8 and Figure 9 The optical component 630 can be provided in multiple layers. The optical component 630 may include a first optical layer 631 and a second optical layer 632. First, refer to... Figure 8 The first optical layer 631 can be disposed between the reflective layer 300 and the first resin layer 410, and the second optical layer 632 can be disposed between the first optical layer 631 and the first resin layer 410. Alternatively, refer to... Figure 9 The first optical layer 631 can be disposed between the reflective layer 300 and the first resin layer 410, and the second optical layer 632 can be disposed between the second resin layer 420 and the semi-reflective mirror layer 610.

[0083] Each of the first optical layer 631 and the second optical layer 632 can have a predetermined thickness. For example, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 can be 150 μm or less. More specifically, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 can be from 0.5 μm to 125 μm. More specifically, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 can be from 0.5 μm to 100 μm. Preferably, the thickness h5 of the first optical layer 631 and the thickness h6 of the second optical layer 632 can be from 0.5 μm to 75 μm to facilitate optical efficiency and optical spectral compensation. The first optical layer 631 and the second optical layer 632 can compensate for light with relatively low transmittance in the semi-reflective mirror layer 610. For example, the first optical layer 631 can have relatively high transmittance for light in the first and 2-1 bands, and relatively low transmittance for light in the 2-2 band. In addition, the second optical layer 632 can have relatively high transmittance for light in the first band and the 2-2 band, and relatively low transmittance for light in the 2-1 band.

[0084] The first optical layer 631 and the second optical layer 632 can pre-compensate for the spectral changes caused by the semi-reflective mirror layer 610. For example, the semi-reflective mirror layer 610 can be provided in red, which is defined as the first color, and the light-emitting device 200 can emit white light. In this case, the first optical layer 631 can have high transmittance for light in the first and 2-1 bands (red and green), and low transmittance for light in the 2-2 band (blue). Furthermore, the second optical layer 632 can have high transmittance for light in the first and 2-2 bands (red and blue), and low transmittance for light in the 2-1 band (green). Therefore, the light L emitted from the light-emitting device 200 can have a color close to red while passing through the first optical layer 631 and the second optical layer 632. This light can then pass through the semi-reflective mirror layer 610, which has a relatively low transmittance for light in the first band. Therefore, the light L emitted to the outside of the illumination device 1000 can have the same or similar color as the light emitted from the light-emitting device 200.

[0085] Figure 10 This is a cross-sectional view of the lighting device based on the comparative example. Figure 11 and Figure 12 This is a graph used to explain the spectrum of the lighting device according to the comparative example. Additionally, Figures 13 to 15 It is used to explain the basis Figure 1 A spectrum of the lighting device based on wavelength.

[0086] The functions and effects of the present invention will be described in more detail below through comparative examples and embodiments.

[0087] <Comparative Example>

[0088] An illumination device has been manufactured, comprising a reflective layer 300, a first resin layer 410 disposed on the reflective layer 300, a substrate 100 disposed on the first resin layer 410, a light-emitting device 200 disposed between the first resin layer 410 and the substrate 100, a second resin layer 420 disposed on the substrate 100, and a semi-reflective mirror layer 610 disposed on the second resin layer 420. The light-emitting device 200 emits white light, and the light-emitting surface of the light-emitting device 200 is configured to face the upper surface of the reflective layer 300. Furthermore, the semi-reflective mirror layer 610 is provided in red, so the light-emitting device 200 can be seen in red when it is not emitting light.

[0089] <Example>

[0090] Compared to the lighting device according to the comparative example, an optical component 630 is further disposed between the second resin layer 420 and the semi-reflective mirror layer 610 to manufacture the lighting device. In this case, the light-emitting device 200 emits white light, and the light-emitting surface of the light-emitting device 200 is configured to face the upper surface of the reflective layer 300. Furthermore, the semi-reflective mirror layer 610 is set to red, so the light-emitting device 200 can be seen in red when it is not emitting light.

[0091] refer to Figures 10 to 12 In the lighting device 1000 according to the comparative example, the light-emitting device 200 can emit white light. Specifically, the light-emitting device 200 can emit white light through its light-emitting surface, and this light can be reflected by the reflective layer 300 and pass through the substrate 100. Then, the light can pass through the semi-reflective mirror layer 610. When the lighting device 1000 according to the comparative example does not include the semi-reflective mirror layer 610, the light emitted from the lighting device 1000 can have the following characteristics: Figure 11 The spectrum shown can be white. Furthermore, when the illumination device 1000 according to the comparative example includes a semi-reflective mirror layer 610 having a first color (e.g., red), the semi-reflective mirror layer 610 may have reduced transmittance for light in the wavelength band corresponding to the first color. That is, the semi-reflective mirror layer 610 may have low transmittance for light in the wavelength band corresponding to red. Therefore, the light passing through the semi-reflective mirror layer 610 and emitted from the illumination device 1000 can have the following characteristics: Figure 12 The optical spectrum shown can have a color similar to cyan. That is, in the lighting device 1000 according to the comparative example, the light emitted from the light-emitting device 200 and the light emitted to the outside of the lighting device 1000 can have different colors.

[0092] However, in the lighting device 1000 according to the embodiment, the light emitted from the light-emitting device 200 and the light emitted to the outside of the lighting device 1000 may have the same or similar colors.

[0093] refer to Figures 13 to 15 In the lighting device 1000 according to the embodiment, the light-emitting device 200 can emit white light. Specifically, the light-emitting device 200 can emit white light through a light-emitting surface, and this light can be reflected by the reflective layer 300 and pass through the substrate 100. Then, the light can pass through the optical component 630 and the semi-reflective mirror layer 610. When the lighting device 1000 according to the embodiment does not include the optical component 630 and the semi-reflective mirror layer 610, the light emitted from the lighting device 1000 can have the following characteristics: Figure 13 The light emitted from the illumination device 1000 can have the spectrum shown and may be white. Furthermore, when the illumination device 1000 according to the embodiment includes an optical component 630, the light emitted from the illumination device 1000 can have the following characteristics: Figure 14 The spectrum shown can be white containing a small amount of red. Furthermore, when the illumination device 1000 according to an embodiment of the present invention includes an optical component 630 and a semi-reflective mirror layer 610, the light emitted from the illumination device 1000 can have the following characteristics: Figure 15 The light emitted from the light-emitting device 200 and the light emitted to the outside of the lighting device 1000 can be the same or similar to each other. Therefore, the lighting device 1000 according to the embodiment can have improved aesthetics. Specifically, when the lighting device 1000 is turned on, light of the same color as the light emitted from the light-emitting device 200 can be emitted to the outside of the lighting device 1000 through the optical component 630 and the semi-reflective mirror layer 610. Furthermore, when the lighting device 1000 is turned off, the interior of the lighting device 1000 is not visible from the outside, while the color of the semi-reflective mirror layer 610 can be visible. Therefore, the lighting device 1000 can have improved aesthetics.

[0094] Figure 16 This is another cross-sectional view of the lighting device according to an embodiment. Figures 17 to 19 It is used to explain the basis Figure 16 A graph of the spectrum of the lighting device. When using... Figures 16 to 19 In the description, the same reference numerals are given for parts that are the same as or similar to the lighting device described above, and the same or similar configurations are omitted.

[0095] refer to Figures 16 to 19 The lighting device 1000 according to an embodiment may include a substrate 100, a light-emitting device 200, a reflective layer 300, a first resin layer 410, a second resin layer 420, and a semi-reflective mirror layer 610. According to... Figure 16In the lighting device 1000, compared to the lighting device 1000 described above, the optical component 630 can be omitted. A light-emitting device 200 can be disposed on the substrate 100, and its light-emitting surface can be configured to face the reflective layer 300. Therefore, light emitted through the light-emitting surface of the light-emitting device 200 can be reflected by the reflective layer 300 and pass through the substrate 100. Then, this light can pass through the semi-reflective mirror layer 610 and be emitted to the outside of the lighting device 1000. Multiple light-emitting devices 200 can be disposed on the substrate 100. Specifically, the light-emitting devices 200 may include a first light-emitting device 201, a second light-emitting device 202, and a third light-emitting device 203 disposed adjacent to each other. The first to third light-emitting devices 201, 202, and 203 can form a unit light-emitting group. Multiple unit light-emitting groups can be disposed on the substrate 100. For example, multiple unit light-emitting groups spaced apart from each other in a first direction (X-axis direction) and / or a second direction (Y-axis direction) can be included on the substrate.

[0096] Each of the first to third light-emitting devices 201, 202, and 203 can emit light of a predetermined color. Specifically, the first light-emitting device 201 can emit red light, the second light-emitting device 202 can emit green light, and the third light-emitting device 203 can emit blue light. Correspondingly, the unit light-emitting group can emit light of various colors. For example, the unit light-emitting group can control the light intensity of the first to third light-emitting devices 201, 202, and 203 to control the color of the light passing through the semi-reflective mirror layer 610 to be white light. Specifically, when the lighting device 1000 does not include the semi-reflective mirror layer 610, the light emitted from the lighting device 1000 can have the following characteristics: Figure 17 The light emitted from the lighting device 1000 can have the following spectrum, and may be white. Furthermore, when the lighting device 1000 includes a semi-reflective mirror layer 610, the light emitted from the lighting device 1000 can have the following spectrum: Figure 18The light spectrum shown can have a color similar to cyan. However, the illumination device 1000 can compensate for the spectrum altered by the semi-reflective mirror layer 610. Specifically, the illumination device 1000 can compensate for the spectrum by controlling the light intensity of the light-emitting device 200. For example, the semi-reflective mirror layer 610 can be set to a first color, such as red. That is, the semi-reflective mirror layer 610 has a relatively low transmittance for light in the first wavelength band corresponding to the first color, and can have a relatively high transmittance for light in the second wavelength band (e.g., green and blue). In this case, the illumination device 1000 can control the light intensity of the first light-emitting device 201, the second light-emitting device 202, and the third light-emitting device 203. Specifically, in the illumination device 1000, the first light-emitting device 201, corresponding to the first wavelength band of light, can emit light with a high light intensity, while the second light-emitting device 202 and the third light-emitting device 203, corresponding to the second wavelength band of light, can emit light with a lower light intensity than the light intensity of the first light-emitting device 200. In other words, the lighting device 1000 can control the light intensity of each of the multiple light-emitting devices 201, 202, and 203 included in the unit light-emitting group, based on the wavelength of the semi-reflective mirror layer 610 and taking into account the light transmittance. Therefore, the light emitted from the lighting device 1000 can have the following characteristics: Figure 19 The spectrum shown can be white.

[0097] Accordingly, the lighting device 1000 according to the embodiment can have improved aesthetics. Specifically, when the lighting device 1000 is turned on, light of a predetermined color can be emitted to the outside of the lighting device 1000. In this case, due to the difference in transmittance across the wavelength of the semi-reflective mirror layer 610, the color of the light emitted to the outside of the lighting device 1000 can be different from the color of the light emitted from the light-emitting device 200. Furthermore, when the lighting device 1000 is turned off, the interior of the lighting device 1000 is not visible from the outside, but the color of the semi-reflective mirror layer 610 can be identified. Accordingly, the lighting device 1000 can have improved aesthetics.

[0098] Figures 20 to 24 This is a view illustrating an example of a lamp, including a lighting device according to an embodiment, being applied to a vehicle.

[0099] Figure 20 It is a top view of a vehicle equipped with lights. Figure 21 This is an example of a lighting device according to an embodiment being installed at the front of a vehicle, and Figure 22 This is an example of a lighting device according to an embodiment being installed at the rear of a vehicle. Furthermore, Figure 23 and Figure 24 This is an example used to explain the operation of the lighting device according to the embodiment as a hidden light in front of the vehicle.

[0100] refer to Figures 20 to 24 The lighting device 1000 according to the embodiment can be applied to the lights of a vehicle 2000. One or more lights can be disposed at at least one of the front, rear, and side surfaces of the vehicle 2000. The lighting device 1000 is configured with various shapes, such as curves or straight lines, and can be applied to lights disposed in various areas of the vehicle 2000. For example, refer to... Figure 21 The lamp can be applied to a vehicle's headlight 2100. The headlight 2100 may include at least one lamp module, which includes a first cover member 2110 and a lighting device. The first cover member 2110 may accommodate the lamp module.

[0101] The headlight 2100 can provide multiple functions by controlling the driving timing of the lighting device 1000 included in at least one of the aforementioned lamp modules. For example, the headlight 2100 may include a first lamp module 2120 and a third lamp module 2130, wherein the first lamp module 2120 provides at least one function of headlight, turn signal, daytime running light, high beam, low beam, and fog light by emitting light from the lighting device 1000. Furthermore, the headlight 2100 can provide additional functions, such as welcome lights or celebratory effects when the driver opens a vehicle door.

[0102] refer to Figure 22 The lamp can be applied to the rear light 2200 of a vehicle. The rear light 2200 may include at least one lamp module, which includes a second cover member 2210 and an illumination device 1000. The second cover member 2210 may accommodate the lamp module. The rear light 2200 can provide multiple functions by controlling the actuation time of the illumination device 1000 included in the at least one lamp module. For example, the rear light 2200 may include a second lamp module 2220, which provides at least one function as a side light, brake light, and turn signal indicator by light emitted from the illumination device 1000. At least one lamp module of the front light 2100 and the rear light 2200 may be provided in a color corresponding to the vehicle 2000. For example, refer to... Figure 23 and Figure 24 The headlight 2100 may further include a fourth light module 2140, and the fourth light module 2140 may have a color corresponding to the vehicle 2000. Specifically, as... Figure 23 As shown, when the fourth lamp module 2140 is in the on state, the fourth lamp module 2140 can emit light of a set wavelength. For example, the fourth lamp module 2140 can provide the function of daytime running lights by emitting white light.

[0103] like Figure 24As shown, when the fourth light module 2140 is in the off state, it can have a color corresponding to or similar to that of the vehicle 2000. For example, the fourth light module 2140 can have a color corresponding to or similar to that of the vehicle 2000 in the off state through a semi-reflective mirror layer 610 having a color corresponding to or similar to that of the vehicle 2000. Therefore, when the off fourth light module 2140 is viewed from the front of the vehicle 2000, it can have a concealed effect that is unrecognizable or minimizes its recognizable appearance, thus providing improved aesthetics and design freedom.

[0104] The features, structures, effects, etc., described in the above embodiments are all included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc., described in each embodiment can be combined or modified by those skilled in the art regarding other embodiments. Therefore, the content related to these combinations and variations should be understood to be included within the scope of the present invention.

[0105] Furthermore, although described based on the above embodiments, these are merely examples and not intended to limit the invention. It will be apparent to those skilled in the art that various modifications and applications not described above can be made without departing from the fundamental characteristics of these embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. Differences relating to these modifications and applications should be understood to be included within the scope of the invention as defined in the appended claims.

Claims

1. A lighting device, comprising: Reflective layer; A first resin layer is disposed on the reflective layer; A substrate comprising a light-transmitting material and disposed on the upper surface of the first resin layer; A plurality of light-emitting devices are disposed between the first resin layer and the substrate; A second resin layer is disposed on the substrate; An optical component, wherein the optical component is disposed on the second resin layer; as well as A semi-reflective mirror layer is disposed on the optical component. The light emitted from the light-emitting surface of each of the plurality of light-emitting devices includes visible light, which is reflected by the reflective layer and passes through the substrate. The plurality of light-emitting devices are spaced apart from each other on the lower surface of the substrate. The first resin layer seals the plurality of light-emitting devices disposed on the lower surface of the substrate. The reflective layer includes a reflective pattern disposed on its upper surface, and the reflective pattern protrudes toward the lower surface of each of the plurality of light-emitting devices. In this embodiment, the light-emitting surface of each of the plurality of light-emitting devices emits light toward the upper surface of the reflective layer with the highest intensity. The thickness of the first resin layer is greater than the thickness of each of the plurality of light-emitting devices. The lighting device further includes a light-shielding layer disposed on the second resin layer. The light-shielding layer includes a plurality of light-shielding patterns formed on at least one of the upper and lower surfaces of the light-shielding layer, and A portion of the light-shielding pattern is disposed in a region that overlaps with each of the plurality of light-emitting devices in the vertical direction, and the size of each of the plurality of light-shielding patterns decreases as the distance from the region overlapping with the optical axis of the corresponding light-emitting device decreases.

2. The lighting device according to claim 1, wherein, The visible light band includes a first band and a second band having a different wavelength from the first band. The semi-reflective mirror layer has a higher reflectivity for light in the first wavelength band than its transmittance for light in the first wavelength band. The optical component has a higher transmittance for light in the first wavelength band than for light in the second wavelength band. The thickness of the second resin layer is smaller than the thickness of the first resin layer. The optical component includes: a first optical layer disposed between the second resin layer and the semi-reflective mirror layer; and a second optical layer disposed between the first optical layer and the semi-reflective mirror layer. The first band is red.

3. The lighting device according to claim 2, wherein, The second band includes band 2-1 and band 2-2, which is different from band 2-1. The first optical layer has a higher transmittance for light in the 2-1 band than for light in the 2-2 band. The second optical layer has a higher transmittance for light in the 2-2 band than for light in the 2-1 band. Among them, the 2-1 band is green. Among them, the 2-2 band is blue, and Each of the first optical layer and the second optical layer has a thickness of less than 150 μm.

4. The lighting device according to claim 3, comprising: An electrode layer is disposed on the lower surface of the substrate and faces the first resin layer.

5. The lighting device according to claim 1, wherein, Each of the plurality of light-emitting devices emits white light, and The density of the reflective pattern on the upper surface of the reflective layer increases with increasing distance from the overlapping region that vertically overlaps with each of the plurality of light-emitting devices.

6. A lighting device, comprising: Reflective layer; A first resin layer is disposed on the reflective layer; A substrate comprising a light-transmitting material and disposed on the upper surface of the first resin layer; A plurality of light-emitting devices are disposed between the first resin layer and the substrate; A second resin layer is disposed on the substrate; A semi-reflective mirror layer is disposed on the second resin layer; as well as An optical component is disposed between the reflective layer and the first resin layer. The plurality of light-emitting devices are spaced apart from each other on the lower surface of the substrate. The light emitted from the light-emitting surface of each of the plurality of light-emitting devices includes visible light, passes through the optical component, and is reflected by the reflective layer to pass through the substrate. The visible light band includes a first band and a second band having a different wavelength from the first band. The first resin layer seals the plurality of light-emitting devices disposed on the lower surface of the substrate. The reflective layer includes a reflective pattern disposed on its upper surface, and the reflective pattern protrudes toward the lower surface of each of the plurality of light-emitting devices. The thickness of the first resin layer is greater than the thickness of each of the plurality of light-emitting devices. In this process, the light-emitting surface of each of the plurality of light-emitting devices emits light toward the upper surface of the reflective layer with the highest intensity, and The first resin layer is in contact with the surface of the light-emitting device. The lighting device further includes a light-shielding layer disposed on the second resin layer. The light-shielding layer includes a plurality of light-shielding patterns formed on at least one of the upper and lower surfaces of the light-shielding layer, and A portion of the light-shielding pattern is disposed in a region that overlaps with each of the plurality of light-emitting devices in the vertical direction, and the size of each of the plurality of light-shielding patterns decreases as the distance from the region overlapping with the optical axis of the corresponding light-emitting device decreases.

7. The lighting device according to claim 6, wherein, The semi-reflective mirror layer has a higher reflectivity for light in the first wavelength band than its transmittance for light in the first wavelength band. The optical component has a higher transmittance for light in the first wavelength band than for light in the second wavelength band. The thickness of the second resin layer is smaller than the thickness of the first resin layer. The optical component includes a first optical layer disposed between the reflective layer and the first resin layer, and a second optical layer disposed between the first optical layer and the first resin layer. The first band is red.

8. The lighting device according to claim 7, wherein, The second band includes band 2-1 and band 2-2, which is different from band 2-1. The first optical layer has a higher transmittance for light in the 2-1 band than for light in the 2-2 band. The second optical layer has a higher transmittance for light in the 2-2 band than for light in the 2-1 band. Among them, the 2-1 band is green. Among them, the 2-2 band is blue, and The substrate includes an electrode layer disposed on the lower surface of the substrate and facing the first resin layer.

9. A lighting device, comprising: Reflective layer; A first resin layer is disposed on the reflective layer; A substrate comprising a light-transmitting material and disposed on the upper surface of the first resin layer; A plurality of light-emitting devices are disposed between the first resin layer and the substrate; A second resin layer is disposed on the substrate; as well as A semi-reflective mirror layer is disposed on the second resin layer. The light emitted from the light-emitting surface of each of the plurality of light-emitting devices includes visible light, which is reflected by the reflective layer and passes through the substrate. The light-emitting device includes a first light-emitting device, a second light-emitting device, and a third light-emitting device. The first light-emitting device, the second light-emitting device, and the third light-emitting device are arranged adjacent to each other to form a unit light-emitting group. The first light-emitting device emits red light. The second light-emitting device emits green light. The third light-emitting device emits blue light. The visible light band includes a first band and a second band having a different wavelength from the first band. The semi-reflective mirror layer has a higher reflectivity for light in the first wavelength band than its transmittance for light in the first wavelength band. The substrate is disposed between the first resin layer and the second resin layer. The first light-emitting device, the second light-emitting device, and the third light-emitting device are disposed on the lower surface of the substrate. The first resin layer seals the first light-emitting device, the second light-emitting device, and the third light-emitting device disposed on the lower surface of the substrate. The reflective layer includes a reflective pattern disposed on its upper surface, and the reflective pattern protrudes toward the lower surface of each of the first light-emitting device, the second light-emitting device, and the third light-emitting device. The thickness of the first resin layer is greater than the thickness of each of the first light-emitting device, the second light-emitting device, and the third light-emitting device. In this embodiment, the light-emitting surface of each of the first, second, and third light-emitting devices emits light toward the upper surface of the reflective layer with the highest intensity. The substrate includes an electrode layer disposed on the lower surface of the substrate and facing the first resin layer. The first resin layer is in contact with the surfaces of the first light-emitting device, the second light-emitting device, and the third light-emitting device. The lighting device further includes a light-shielding layer disposed on the second resin layer. The light-shielding layer includes a plurality of light-shielding patterns formed on at least one of the upper and lower surfaces of the light-shielding layer, and A portion of the light-shielding pattern is disposed in a region that overlaps with each of the first, second, and third light-emitting devices in the vertical direction, and the size of each of the plurality of light-shielding patterns decreases as the distance from the region overlapping with the optical axis of the corresponding light-emitting device among the first, second, and third light-emitting devices decreases.

10. The lighting device according to claim 9, in, When the semi-reflective mirror layer has a first color corresponding to the first wavelength band and the first color is red. The second light-emitting device emits light at a lower intensity than the first light-emitting device. The light passing through the semi-reflective mirror layer is white light, and The second band includes at least one of blue and green.

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