Optoelectronic display module with two interconnected elements

CN116529662BActive Publication Date: 2026-08-28CONTINENTAL AUTOMOTIVE TECHNOLOGIES GMBH
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Patent Information

Application Number
CN202180079331.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-12-14
Filing Date
2021-12-02
Publication Date
2026-08-28
Estimated Expiration
2041-12-02

AI Technical Summary

Technical Problem

这些EMC垫圈在第一元件和第二元件上产生压力,并且在使用LCD显示器的情况下,则影响显示器的黑色均匀性

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Abstract

The optoelectronic display module comprises an optoelectronic display (100), a first element and a second element. The first element and the second element are connected together and the first element carries the optoelectronic display (100). The first element and the second element are connected by at least one silicone body. In a method for manufacturing an optoelectronic display module, which comprises the features described above, silicone (411) is dispensed on the first element and / or the second element, then the first element and the second element are brought together so that the silicone (411) connects the first element with the second element, and an wait is performed until the silicone cures and thus forms a silicone body.
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Claims

1. A photoelectric display module, comprising a photoelectric display (100), a first element, and a second element, wherein the first element and the second element are connected together, and the first element carries the photoelectric display, characterized in that, The first element and the second element are connected by at least one silicone resin body, wherein the silicone resin body is made of silicone resin (411), the first element is the backplate (200) of the optoelectronic display (100), and the second element is the carrier (300) of the printed circuit board (303), the backplate (200) and the carrier (300) each include a first segment, the first segments of the backplate (200) and the carrier (300) face each other and provide a space between them, the space being filled with silicone resin to form the silicone resin body, the backplate (200) and the carrier (300) each include a second segment, the second segments of the backplate (200) and the carrier (300) are in direct mechanical contact with each other to adjust the distance between the first segments of the backplate (200) and the carrier (300) before the silicone resin (411) is cured.

2. The optoelectronic display module according to claim 1, characterized in that, The backplate (200) and the carrier (300) are made of metal.

3. The optoelectronic display module according to claim 2, characterized in that, The at least one silicone body is made of conductive silicone resin.

4. The optoelectronic display module according to any one of claims 1 to 3, characterized in that, These first sections are planar.

5. The optoelectronic display module according to claim 4, characterized in that, These first sections are parallel to each other.

6. A method for manufacturing an optoelectronic display module, wherein the optoelectronic display module is the optoelectronic display module according to any one of claims 1 to 5, characterized in that, The silicone resin (411) is dispensed onto a first segment of the backplate (200) and / or a first segment of the carrier (300), the backplate (200) and the carrier (300) are positioned to form a space between the first segment of the backplate (200) and the first segment of the carrier (300), such that the space is filled with the silicone resin (411) pre-dispensed onto the first segment of the backplate (200) and / or the first segment of the carrier (300), and the process is allowed until the silicone resin (411) cures, thereby forming the silicone resin body.

Citation Information

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