A method for assembling a platinum resistance wire for a laser tester
Patent Information
- Application Number
- CN202310460282.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-04-26
- Publication Date
- 2026-09-08
- Estimated Expiration
- 2043-04-26
AI Technical Summary
[0005]鉴于上述的分析,本发明旨在提供一种用于激光测试仪的铂电阻丝装配方法,以解决现有的高能量激光能量计中的铂电阻丝难以同时实现在热转换基质表面均匀排布以及与热转换基质贴合设置而导致加工难度大的问题
本发明的用于激光测试仪的铂电阻丝装配方法,先将铂电阻丝均匀缠绕在支撑架上,从而实现铂电阻丝的均匀排布,再将支撑架上均匀排布的铂电阻丝固定于热转换基质上,从而使铂电阻丝在热转换基质上同时实现排布均匀和贴合设置,有利于提高热转换基质与铂电阻丝之间的热转换效率,降低装配成本,简化装配步骤。
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Figure CN116539178B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of laser energy measurement technology, and in particular to a method for assembling platinum resistance wires for laser testing instruments. Background Technology
[0002] With the development of the international situation and the national economy, the application of high-energy lasers in various fields of military and civilian use in China is becoming increasingly important. How to detect the accurate energy value of high-energy lasers is related to the scope of application and the depth of application in corresponding fields.
[0003] Currently, high-energy laser energy meters are commonly used for energy detection. The working principle of existing high-energy laser energy meters is as follows: the heat conversion matrix on the laser energy meter probe receives the incident laser and converts it into heat energy, causing the heat conversion matrix to heat up. The temperature sensor located on the heat conversion matrix detects the temperature of the heat conversion matrix, thereby obtaining the temperature change curve of the heat conversion matrix. Then, the laser energy is calculated from the mass of the heat conversion matrix and related components and the specific heat of the material at different temperatures.
[0004] Existing high-energy laser energy meters typically use platinum resistance thermometers to measure the temperature of the heat conversion matrix. To ensure the thermoelectric conversion efficiency between the heat conversion matrix and the platinum resistance wire, the platinum resistance wire needs to be uniformly arranged and fixed to the heat conversion matrix. However, existing high-energy laser energy meters usually process the heat conversion matrix by enclosing the platinum resistance wire within it, ensuring the winding of the platinum resistance wire. This method places stringent requirements on the material of the heat conversion matrix itself, and the processing technology is complex, difficult, and costly, making it unfavorable for product assembly and adjustment. Summary of the Invention
[0005] Based on the above analysis, the present invention aims to provide a platinum resistance wire assembly method for laser testing instruments, so as to solve the problem that it is difficult to simultaneously achieve uniform arrangement of platinum resistance wires on the surface of the thermal conversion substrate and to bond them to the thermal conversion substrate in existing high-energy laser energy meters, which leads to high processing difficulty.
[0006] The objective of this invention is mainly achieved through the following technical solutions: A method for assembling platinum resistance wires for a laser tester, wherein a platinum resistance wire winding and bonding device for a laser tester is used to assemble the platinum resistance wires. The platinum resistance wire assembly method includes the following steps: Step S1: Place the heat conversion substrate on the base. Step S2: Wind the platinum resistance wire, winding the platinum resistance wire onto the support frame; Step S3: Initially fix the platinum resistance wire by initially fixing the platinum resistance wire on the support frame onto the thermal conversion substrate.
[0007] Furthermore, in step S1, the heat conversion substrate to be assembled is placed in the first groove on the base.
[0008] Furthermore, in step S2, the platinum resistance wire is wound back and forth on the first and second pressure posts on the support frame in sequence.
[0009] Furthermore, in step S2, the bottom plate of the support base is attached to the operating table surface, so that the first and second pressing columns on the support frame are both facing upward relative to the operating table surface.
[0010] Furthermore, step S3 includes the following steps: Step S31: Install the support frame; fix the support frame to the base; Step S32: Move the platinum resistance wire; move the platinum resistance wire on the support frame onto the thermal conversion substrate; Step S33: Initially attach the platinum resistance wire; attach a portion of the platinum resistance wire to the thermal conversion substrate.
[0011] Furthermore, step S31 includes the following steps: Step S311: Flip the support frame; Flip the support frame after the platinum resistance wire is wound. Step S312: Fix the support frame; fix the flipped support frame onto the base.
[0012] Furthermore, in step S311, the support frame is flipped so that the first and second pressing columns press against the heat conversion substrate.
[0013] Furthermore, in step S312, the insert on the support frame is inserted into the second groove of the connecting block for connection.
[0014] Furthermore, in step S312, when the insert block reaches the bottom of the second groove, the first slot on the insert block is opposite to the second cavity on the connecting block.
[0015] Furthermore, in step S312, when the first slot is opposite to the connecting block, the first clip head is inserted into the first slot under the elastic force of the spring for locking and fixing.
[0016] Compared with the prior art, the present invention can achieve at least the following beneficial effects: The platinum resistance wire assembly method for laser testing instruments of the present invention first uniformly winds the platinum resistance wire onto a support frame to achieve uniform arrangement of the platinum resistance wire, and then fixes the uniformly arranged platinum resistance wire on the support frame onto a heat conversion substrate. This allows the platinum resistance wire to achieve uniform arrangement and close fit on the heat conversion substrate at the same time, which is beneficial to improving the heat conversion efficiency between the heat conversion substrate and the platinum resistance wire, reducing assembly costs, and simplifying assembly steps.
[0017] In this invention, the above-described technical solutions can be combined with each other to achieve more preferred combinations. Other features and advantages of this invention will be set forth in the following description, and some advantages may become apparent from the specification or be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained from the content specifically pointed out in the text and accompanying drawings. Attached Figure Description
[0018] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Throughout the drawings, the same reference numerals denote the same parts.
[0019] Figure 1 This is a schematic diagram of the structure of a platinum resistance wire winding and bonding device for a laser testing instrument according to the present invention; Figure 2 This is a front view of a platinum resistance wire winding and bonding device for a laser testing instrument according to the present invention; Figure 3 This is a diagram showing the connection relationship between the support frame and the base of a platinum resistance wire winding and bonding device for a laser tester according to the present invention. Figure 4 This is a schematic diagram of the base of a platinum resistance wire winding and bonding device for a laser tester according to the present invention; Figure 5 This is a schematic diagram of the support frame of a platinum resistance wire winding and bonding device for a laser tester according to the present invention; Figure 6 This is a schematic diagram of the locking assembly of a platinum resistance wire winding and bonding device for a laser tester according to the present invention; Figure 7 This is a schematic diagram of the structure of the adjustment component of a platinum resistance wire winding and bonding device for a laser tester according to the present invention; Figure 8 This is a schematic diagram of the moving rod of a platinum resistance wire winding and bonding device for a laser tester according to the present invention; Figure 9 This is a flowchart of a platinum resistance wire assembly method for a laser testing instrument according to the present invention.
[0020] Figure label: 1-Base; 11-Main board; 111-First groove; 12-Connecting block; 121-Second groove; 122-Second cavity; 2-Support frame; 21-Main frame; 211-First cavity; 212-First support rod; 213-Second support rod; 214-Ninth support rod; 215-Tenth support rod; 2151-Fourth through hole; 22-Insertion block; 221-First slot; 23-First pressing post; 24-Second pressing post; 3-Pressure plate; 31-Third cavity; 4-Clamping assembly; 41-Spring; 42-First locking head; 5-Adjusting assembly; 51-Lifting assembly; 511-Lead screw; 512-Connecting plate; 5121-First support plate; 5122-Second support plate; 52-Moving assembly Components; 521-Connecting rod; 522-Intermediate ring; 523-Moving rod; 5231-Moving rod body; 5231A-Second through hole; 5232-Sliding end; 5232A-Third through hole; 524-Diagonal rod; 525-Limiting rod; 5251-Seventh support rod; 5252-Eighth support rod; 526-First limiting plate; 5261-Third plane; 5262-Third inclined surface; 527-Second limiting plate; 5271-Fourth plane; 5272-Fourth inclined surface; 53-First inclined surface body; 531-First plane; 532-First inclined surface; 54-Second inclined surface body; 541-Second plane; 542-Second inclined surface; 6-Support base; 61-Support column; 62-Base plate. Detailed Implementation
[0021] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, which form part of this application and, together with the embodiments of the present invention, serve to illustrate the principles of the present invention.
[0022] Example 1 This embodiment discloses a method for assembling platinum resistance wires for a laser tester, which uses a platinum resistance wire winding and bonding device for a laser tester to assemble platinum resistance wires for the heat conversion matrix in the laser tester.
[0023] See Figure 1 A platinum resistance wire winding and bonding device for a laser tester includes a base 1, a support frame 2, and a pressure plate 3. The base 1 is used to place the heat conversion substrate to be assembled. The support frame 2 is connected to the base 1 and can press against the heat conversion substrate. The platinum resistance wire for measuring temperature is evenly wound on the support frame 2. The pressure plate 3 can press and bond the platinum resistance wire on the support frame 2 to the heat conversion substrate, thereby achieving uniform arrangement and bonding of the platinum resistance wire on the heat conversion substrate at the same time. This is beneficial to improve the heat conversion efficiency between the heat conversion substrate and the platinum resistance wire, reduce assembly costs, and simplify assembly steps.
[0024] See Figure 4The base 1 includes a main board 11 and four connecting blocks 12. The main board 11 is a square plate, and the four connecting blocks 12 are respectively located at the four corners of the main board 11. The main board 11 has a first groove 111, and the heat conversion substrate can be placed at the bottom of the first groove 111. The bottom of the connecting block 12 is located on the main board 11, and the top of the connecting block 12 has a second groove 121, and the support frame 2 can be inserted into the second groove 121, thereby realizing the connection between the support frame 2 and the base 1.
[0025] In one embodiment of the present invention, see Figure 9 The platinum resistance wire assembly of the thermal conversion matrix using a platinum resistance wire winding and bonding device for a laser tester includes the following steps: Step S1: Place the heat conversion substrate; place the heat conversion substrate to be assembled at the bottom of the first groove 111 of the base 1 to facilitate subsequent assembly.
[0026] Step S2: Winding the platinum resistance wire; see [link / reference] Figure 3 The platinum resistance wire is wound back and forth on the first pressure post 23 and the second pressure post 24 in sequence. Since the first pressure post 23 and the second pressure post 24 are positioned opposite each other and are staggered, the platinum resistance wire is evenly distributed.
[0027] In one embodiment of the present invention, in step S1, see... Figure 3 and Figure 5 The support frame 2 includes a main frame 21, insert blocks 22, and multiple first pressing columns 23 and multiple second pressing columns 24. The main frame 21 is a square frame with a square first cavity 211 on its body. The pressing plate 3 can pass through the first cavity 211 and press against the heat conversion substrate located in the first groove 111. Insert blocks 22 are provided at the four corners of the main frame 21. The insert blocks 22 can be inserted into the second groove 121 to install the support frame 2 on the base 1. In order to ensure the stability of the support frame 2 on the base 1, the outer surface of the insert block 22 is in contact with the inner wall of the second groove 121.
[0028] The main frame 21 has a first support rod 212 and a second support rod 213 at its two ends. The first support rod 212 is provided with a plurality of first pressing columns 23, which are evenly arranged on the first support rod 212. The second support rod 213 is provided with a plurality of second pressing columns 24, which are evenly arranged on the second support rod 213. The first pressing columns 23 and the second pressing columns 24 are arranged opposite to each other and are staggered, so that the platinum resistance wire can be wound back and forth in the order of the first pressing columns 23 and the second pressing columns 24. Thus, the platinum resistance wire is evenly arranged on the support frame 2 through the first pressing columns 23 and the second pressing columns 24.
[0029] To prevent support frame 2 from tilting, see [reference needed]. Figure 1 The first support rod 212 and the second support rod 213 of the support frame 2 are each provided with a support seat 6, and the plane of the support seat 6 is opposite to the plane of the first pressing column 23 and the second pressing column 24. The support seat 6 includes two support columns 61 and a base plate 62. The base plate 62 is a flat plate. The two support columns 61 are respectively located at both ends of the base plate 62. One end of the support column 61 is vertically connected to the main frame 21, and the other end is vertically connected to the base plate 62. Furthermore, the length of the support column 61 is greater than the maximum length of the moving component 52 protruding from the main frame 21, thereby preventing the moving component 52 from contacting the operating table after flipping, which would lead to a decrease in equipment accuracy.
[0030] During the process of winding the platinum resistance wire, the base plate 62 on the support 6 is in contact with the operating table surface, so that the first pressing post 23 and the second pressing post 24 on the support frame 2 are both facing upward relative to the operating table surface, which makes it easier for the operator to wind the platinum resistance wire onto the first pressing post 23 and the second pressing post 24.
[0031] Step S3: Initial fixation of the platinum resistance wire.
[0032] Furthermore, the fixation of the platinum resistance wire in step S3 mainly includes the following steps: Step S31: Install the support frame; Step S311: Flip the support frame 2. Flip the support frame 2 after it is wrapped with platinum resistance wire so that the first pressing column 23 and the second pressing column 24 are facing the operating table and pressing against the heat conversion substrate.
[0033] Step S312, Fix support frame 2; see Figures 4-6 The insert block 22 on the support frame 2 is inserted into the second groove 121 of the connecting block 12. During the movement of the insert block 22 in the second groove 121, the first locking head 42 located in the second cavity 122 of the connecting block 12 is pushed into the second cavity by the body of the insert block 22. When the insert block 22 reaches the bottom of the second groove 121, the first locking groove 221 on the insert block 22 is opposite to the second cavity 122 on the connecting block 12, so that the first locking head 42 is inserted into the first locking groove 221 under the elastic force of the spring 41 for locking and fixing, thereby realizing the automatic fixing of the insert block 22 in the second groove 121 and ensuring the stability of the support frame 2 on the base 1.
[0034] Step S32: Move the platinum resistance wire; see [link / reference] Figure 1 , Figure 2 and Figure 7Tighten the lead screw 511 to move it in the first through hole of the connecting plate 512, thereby driving the pressure plate 3 connected to the lead screw 511 to move toward the heat conversion substrate in the first groove 111. During the movement, the pressure plate 3 will press the platinum resistance wire wrapped around the first pressure post 23 and the second pressure post 24 as a whole, so that the platinum resistance wire and the pressure plate 3 move toward the heat conversion substrate synchronously. When the platinum resistance wire is in contact with the heat conversion substrate, the lead screw 511 is stopped. During the movement, the moving component 52 can further enhance the stability of the support frame 2 on the base 1. Specifically, see Figure 8 During the movement of the pressure plate 3 toward the heat conversion substrate, the connecting rod 521 drives the intermediate ring 522 to move synchronously, thereby changing the distance between the intermediate ring 522 and the inclined rod 524. The sliding end 5232 moves along the inclined rod 524 toward the second inclined surface 54 under the pressure of the moving rod body 5231. When the pressure plate 3 stops moving, the second inclined surface 542 and the fourth inclined surface 5272 are in contact, and the sliding end 5232 stops moving. At this time, the platinum resistance wire is in contact with the heat conversion substrate, and the relative engagement of the moving component 52 and the base 1 is achieved, further... This step strengthens the relative stability between the pressure plate 3 and the heat conversion substrate, and can further enhance the relative stability between the support frame 2 and the base 1, achieving double fixation of the support frame 2 and the base 1; in addition, as the sliding end 5232 moves toward the second inclined body 54, it drives the limiting rod 525 to move synchronously, so that the second clamping head moves vertically downward in the second clamping slot, and the third clamping head moves vertically downward in the third clamping slot, thereby ensuring that the eighth support rod 5252 simultaneously drives the first limiting plate 526 and the second limiting plate 527 to move horizontally toward the second inclined body 54.
[0035] Step S33: Initial bonding of platinum resistance wire; A glue-applying tool with thermally conductive adhesive is passed through the third cavity 31 of the pressure plate 3 body and the platinum resistance wire bonded to the heat conversion substrate is fixed with adhesive. The thermally conductive adhesive is used to bond a portion of the platinum resistance wire located within the third cavity 31 to the heat conversion substrate, ensuring that the platinum resistance wire is evenly distributed on the heat conversion substrate and fixed to the surface of the heat conversion substrate. This achieves the initial fixing of the platinum resistance wire, simplifies the assembly process, and ensures the thermal conductivity efficiency between the platinum resistance wire and the heat conversion substrate.
[0036] Step S4: Disassemble the support frame 2; Twist the lead screw 511 in the reverse direction to make it move in the reverse direction within the first through hole of the connecting plate 512, thereby driving the pressure plate 3 connected to the lead screw 511 to move away from the heat conversion substrate. During the movement, the pressure plate 3 separates from the platinum resistance wire fixed to the heat conversion substrate. During the movement, the moving component 52 will cause the support frame 2 to detach from the base 1. After the support frame 2 detaches from the base 1, the screw 511 can be stopped, thereby realizing the automatic disassembly of the support frame 2. Specifically, during the reverse movement of the pressure plate 3, the connecting rod 521 drives the intermediate ring 522 to move synchronously, thereby changing the intermediate distance between the intermediate ring 522 and the inclined rod 524. The sliding end 5232 moves along the inclined rod 524 towards the first inclined surface 53 under the action of the moving rod body 5231. When the third inclined surface 5262 comes into contact with the first inclined surface 532 and applies sufficient pressure, the locking assembly 4 will release its locking and fixing of the support frame 2, thus releasing the pressure plate 3 from the heat conversion substrate while simultaneously unlocking the base 1's locking and fixing of the support frame 2, achieving automatic disassembly of the support frame 2. The removal of the support frame 2 facilitates the operator's gluing of the remaining platinum resistance wire, reducing operation steps and saving operation time. After unlocking the support frame 2, the sliding end 5232 stops moving. During the movement of the sliding end 5232 toward the first inclined body 53, it drives the limiting rod 525 to move synchronously, so that the second clamping head moves vertically upward in the second clamping slot, and the third clamping head moves vertically upward in the third clamping slot. This causes the eighth support rod 5252 to simultaneously drive the first limiting plate 526 and the second limiting plate 527 to move horizontally toward the first inclined body 53, while the moving rod body 5231 moves horizontally along the sixth support rod 5222.
[0037] In one embodiment of the present invention, in steps S3 and S4, the other two ends of the main frame 21 body are the ninth support rod 214 and the tenth support rod 215, respectively. The first support rod 212 and the second support rod 213 are both vertically arranged between the ninth support rod 214 and the tenth support rod 215, so that the first support rod 212, the second support rod 213, the ninth support rod 214 and the tenth support rod 215 form a square first cavity 211. The adjustment assembly 5 includes a lifting assembly 51, a moving assembly 52, a first inclined body 53, and a second inclined body 54. The lifting assembly 51 includes a lead screw 511 and a connecting plate 512. The connecting plate 512 includes a first support plate 5121 and a second support plate 5122. One end of the first support plate 5121 is located on the ninth support rod 214, and the other end is perpendicularly connected to the second support plate 5122. The second support plate 5122 is provided with a first through hole with an internal thread. One end of the lead screw 511 passes through the first through hole and is rotatably connected to the pressure plate 3. The lead screw 511 and the first through hole are threadedly connected.
[0038] The movable component 52 includes a connecting rod 521, an intermediate ring 522, a moving rod 523, an inclined rod 524, a limiting rod 525, a first limiting plate 526, and a second limiting plate 527. One end of the connecting rod 521 is vertically mounted on the pressure plate 3, and the other end is vertically connected to the intermediate ring 522. The tenth support plate 215 has a fourth through hole 2151. One end of the moving rod 523 is sleeved on the intermediate ring 522 and can move on the intermediate ring 522. The other end passes through the fourth through hole 2151 and is sleeved on the inclined rod 524 and can move along the inclined rod 524. The inclined rod 524 is connected to the limiting rod 525. The first limiting plate 526 and the second limiting plate 527 are respectively located at both ends of the limiting rod 525. One end of the inclined rod 524 is located at the bottom of the main frame 21 and forms a certain angle with the main frame 21 in the vertical direction, so that the end of the inclined rod 524 connected to the main frame 21 is the first high end and the other end is the first low end.
[0039] The intermediate ring 522 is a square ring. The two opposite ends of the intermediate ring 522 are the fifth support rod 5221 and the sixth support rod 5222, respectively. One end of the connecting rod 521 is perpendicularly connected to the pressure plate 3, and the other end is perpendicularly connected to the fifth support rod 5221. (See attached image) Figure 8 The movable rod 523 includes a movable rod body 5231 and a sliding end 5232. The first end of the movable rod body 5231 is provided with a second through hole 5231A. The sixth support rod 5222 is disposed in the second through hole 5231A and can move within the second through hole 5231A. In order to prevent the sixth support rod 5222 from shifting or flipping within the second through hole 5231A, the cross section of the sixth support rod 5222 is square, making the sixth support rod 5222 a square rod. The second through hole 5231A is a square hole, and the surface of the sixth support rod 5222 is in contact with the inner wall of the second through hole 5231A. This not only allows the sixth support rod 5222 to move stably within the second through hole 5231A, but also allows the sixth support rod 5222 to be set perpendicular to the movable rod body 5231, thereby making the movable rod body 5231 vertical.
[0040] The sliding end 5232 is located at the second end of the moving rod body 5231. The moving rod body 5231 passes through the fourth through hole 2151 and can move horizontally within the fourth through hole 2151, so that the tenth support rod 215 is located between the sliding end 5232 and the intermediate ring 522. Furthermore, there is a certain angle between the sliding end 5232 and the moving rod body 5231. The sliding end 5232 is cylindrical. The sliding end 5232 body is provided with a third through hole 5232A. The inclined rod 524 is located within the third through hole 5232A and can slide within the third through hole 5232A. In order for the sliding end 5232 to move stably along the inclined rod 524, the inclined rod 524 is fitted against the inner wall of the third through hole 5232A.
[0041] The limiting rod 525 includes a seventh rod 5251 and an eighth rod 5252. One end of the seventh rod 5251 is connected to the sliding end 5232, and the other end is located in the middle of the eighth rod 5252. The eighth rod 5252 is set perpendicular to the moving rod body 5231, so that the eighth rod 5252 is set horizontally. The eighth rod 5252 can be moved by the seventh rod 5251 through the movement of the sliding end 5232 along the inclined rod 524. The first limiting plate 526 and the second limiting plate 527 are respectively set at both ends of the eighth rod 5252, so that the first limiting plate 526 and the second limiting plate 527 are positioned opposite each other. The first limiting plate 526 and the second limiting plate 527 can be moved horizontally simultaneously by the eighth rod 5252.
[0042] The eighth support rod 5252 has a second and a third locking head in the shape of a convex shape at both ends. The first limiting plate 526 has a second locking groove on the side facing the second limiting plate 527, and the second limiting plate 527 has a third locking groove on the side facing the first limiting plate 526. Both the second and third locking grooves are convex shapes. The second locking head can be inserted into and move within the second locking groove, and the third locking head can be inserted into and move within the third locking groove. When the first limiting plate 526 and the second limiting plate 5252... When the 7 are on the same plane, during the movement of the sliding end 5232 driving the eighth support rod 5252, the second clamping head moves vertically in the second clamping groove while driving the first limiting plate 526 to move horizontally. At the same time, the third clamping head moves vertically in the third clamping groove while driving the second limiting plate 527 to move horizontally. Furthermore, the second limiting plate 527 and the first limiting plate 526 move horizontally in the same direction, thereby realizing that the eighth support rod 5252 can simultaneously drive the first limiting plate 526 and the second limiting plate 527 to move horizontally.
[0043] The first inclined surface 53 is located at the bottom of the main frame 21, and the second inclined surface 54 is located at the top of the main board 11, so that the first inclined surface 53 and the second inclined surface 54 are both located between the base 1 and the support frame 2, and the moving component 52 is located between the first inclined surface 53 and the second inclined surface 54.
[0044] The top of the first inclined body 53 is the first plane 531, and the surface facing the second inclined body 54 is the first inclined surface 532. The first plane 531 is located on the main frame 21. One end of the first inclined surface 532 located on the support frame 2 is the second high end, and the other end away from the support frame 2 is the second low end. The bottom of the second inclined body 54 is the second plane 541, and the surface facing the first inclined body 53 is the second inclined surface 542. The second plane 541 is located on the main board 11. One end of the second inclined surface 542 located on the base 1 is the third low end, and the other end away from the base 1 is the third high end.
[0045] The bottom end of the first limiting plate 526 is the third plane 5261, and the top end is the third inclined surface 5262. The bottom end of the second limiting plate 527 is the fourth plane 5271, and the top end is the fourth inclined surface 5272. When the support frame 2 is engaged in the second cavity 122 and the pressure plate 3 is located in the first cavity 211, one end of the inclined rod 524 is connected to the main frame 21, and the other end is in contact with the main board 11. The first limiting plate 526 and the second limiting plate 527 abut against the main board 11 under the action of gravity. At this time, the third plane 5261 and the fourth plane 5271 are simultaneously in contact with the surface of the main board 11, so that the third plane 5261 and the fourth plane 5271 are located on the same plane. Furthermore, the sliding end 5232 is located in the middle part of the inclined rod 524. The third inclined surface 5262 can fit with the first inclined surface 532, and the fourth inclined surface 5272 can fit with the second inclined surface 542.
[0046] Step S5: Further fix the platinum resistance wire; use a glue brush with thermally conductive adhesive to apply glue to fix the remaining part of the platinum resistance wire, so that the entire platinum resistance wire is fixed to the surface of the thermal conversion substrate, and the overall assembly of the platinum resistance wire is completed.
[0047] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.
Claims
1. A method for assembling a platinum resistance wire for a laser testing instrument, characterized in that, The platinum resistance wire is assembled using a platinum resistance wire winding and bonding device for laser testing instruments. The platinum resistance wire assembly method includes the following steps: Step S1: Place the heat conversion substrate on the base. Step S2: Wind the platinum resistance wire, winding the platinum resistance wire onto the support frame; Step S3: Initially fix the platinum resistance wire by initially fixing the platinum resistance wire on the support frame onto the heat conversion substrate; In step S2, the platinum resistance wire is wound back and forth on the first and second pressure posts on the support frame in sequence; the first and second pressure posts are arranged opposite to each other and are staggered, so that the platinum resistance wire is evenly distributed on the support frame through the first and second pressure posts. The winding and bonding device includes a base, a support frame, a pressure plate, and an adjustment assembly. The support frame is connected to the base; the base includes a main board; the support frame includes a main frame; the main frame has a first cavity, through which the pressure plate can pass and press the platinum resistance wire on the support frame onto the heat conversion substrate for adhesive bonding; the adjustment assembly includes a lifting assembly, a moving assembly, a first inclined plane, and a second inclined plane. The lifting assembly includes a lead screw and a connecting plate, one end of the lead screw passing through a first through hole on the connecting plate and rotatably connected to the pressure plate, and the lead screw and the first through hole are threadedly connected; the moving assembly includes a connecting rod, an intermediate ring, a moving rod, an inclined rod, a limiting rod, a first limiting plate, and a second limiting plate. Two limiting plates; one end of the connecting rod is vertically mounted on the pressure plate, and the other end is vertically connected to the intermediate ring; one end of the moving rod is sleeved on the intermediate ring and can move on the intermediate ring, and the other end is sleeved on the inclined rod and can move along the inclined rod. The inclined rod is connected to the limiting rod. The first limiting plate and the second limiting plate are respectively located at the two ends of the limiting rod. One end of the inclined rod is located at the bottom of the main frame and forms a certain angle with the main frame in the vertical direction; the first inclined surface is located at the bottom of the main frame, and the second inclined surface is located at the top of the main plate; when the screw is turned, the pressure plate moves toward the heat conversion substrate, and the platinum resistance wire is in contact with the heat conversion substrate, realizing the relative engagement of the moving component and the base.
2. The platinum resistance wire assembly method for a laser testing instrument according to claim 1, characterized in that, In step S1, the heat conversion substrate to be assembled is placed in the first groove on the base.
3. The platinum resistance wire assembly method for a laser testing instrument according to claim 2, characterized in that, The support frame is equipped with a support base. In step S2, the bottom plate of the support base is in contact with the operating table surface, so that the first and second pressing columns on the support frame are both facing upward relative to the operating table surface.
4. The platinum resistance wire assembly method for a laser testing instrument according to claim 3, characterized in that, Step S3 includes the following steps: Step S31: Install the support frame; fix the support frame to the base; Step S32: Move the platinum resistance wire; move the platinum resistance wire on the support frame onto the thermal conversion substrate; Step S33: Initially attach the platinum resistance wire; attach a portion of the platinum resistance wire to the thermal conversion substrate.
5. The platinum resistance wire assembly method for a laser testing instrument according to claim 4, characterized in that, Step S31 includes the following steps: Step S311: Flip the support frame; Flip the support frame after the platinum resistance wire is wound. Step S312: Fix the support frame; fix the flipped support frame onto the base.
6. The platinum resistance wire assembly method for a laser testing instrument according to claim 5, characterized in that, In step S311, the support frame is flipped so that the first and second pressing columns press against the heat conversion substrate.
7. The platinum resistance wire assembly method for a laser testing instrument according to claim 6, characterized in that, The base also includes a connecting block. In step S312, the insert on the support frame is inserted into the second groove of the connecting block for connection.
8. The method for assembling a platinum resistance wire for a laser testing instrument according to claim 7, characterized in that, In step S312, when the insert block reaches the bottom of the second groove, the first slot on the insert block is opposite to the second cavity on the connecting block.
9. The platinum resistance wire assembly method for a laser testing instrument according to claim 8, characterized in that, In step S312, when the first slot is opposite to the second cavity of the connecting block, the first locking head located in the second cavity of the connecting block is inserted into the first slot under the elastic force of the spring for locking and fixing.
Citation Information
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