A turret bonder for eutectic die bonding

Abstract

The application discloses the technical fields of a patch machine and relates to a eutectic patch machine provided with a turret type bonding head, which comprises a machining table, a turret type bonding head arranged above the machining table, a supporting plate arranged above the machining table, a fixed shell fixedly connected to the top of the supporting plate, and a feeding plate arranged in the fixed shell. When all the wafers are completed, only the new wafers need to be placed on the fixed block again. The two connecting shells are in an unfolded state during placement, which is more convenient for wafer placement. During feeding, only placement is needed, and the wafers do not need to be inserted into the narrow feeding track, thereby preventing the wafers from being damaged due to contact with the track.

Description

Technical Field

[0001] This invention relates to the field of chip mounter technology, specifically to a eutectic chip mounter equipped with a turret-type bonding head. Background Technology

[0002] Eutectic bonding is defined as a process that uses an intermediate solder alloy to form a continuous bond between two surfaces. Eutectic bonding is a bonding technology that is mainly used for gas-sensitive hermetic packaging of standard patch bonding materials.

[0003] In existing technologies, the loading method for chip mounters requires manual placement of wafers one by one onto the conveyor line, which then transports them to the processing table for processing. When mounting wafers on the processing table, a drive device drives a support plate to move the wafers back and forth to mount the wafers onto the surface. After mounting is completed, the mounted wafers need to be transported down, and then new wafers need to be transported up. This process of feeding and loading requires multiple steps, resulting in long waiting times and low efficiency. Moreover, when manually placing wafers into the track during loading, the wafer surface is prone to colliding with the inner wall of the track, which can damage the wafers.

[0004] Based on this, the present invention designs a eutectic bonding machine with a turret-type bonding head to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a eutectic bonding machine with a turret-type bonding head to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a eutectic bonding machine with a turret-type bonding head, comprising a processing table, a turret-type bonding head being disposed above the processing table, a support plate being disposed above the processing table, a fixed shell being fixedly connected to the top of the support plate, a feeding plate being disposed inside the fixed shell, and feeding groups being disposed on both the left and right sides of the feeding plate.

[0007] The feeding assembly includes a connecting shell, a drive rod, a conveyor belt, and a resisting block. The connecting shell is rotatably connected to a support plate. The top end of the drive rod is fixedly connected to the feeding plate, and the bottom end of the drive rod is fixedly connected to a first cylinder, which is also fixedly connected to the support plate. The conveyor belt is driven by two drive wheels, both of which are connected to the side wall of the fixed shell. Several fixed blocks are fixedly connected to the conveyor belt, and each fixed block has a connecting piece slidably connected to it in the vertical direction. Each connecting piece has a first spring fixedly connected to it for resetting, and each connecting piece has a U-shaped piece slidably connected to it in the horizontal direction. Each U-shaped piece has a second spring fixedly connected to it for resetting. The resisting block is fixedly connected to the top end of the connecting shell and is wedge-shaped. The resisting block is used to push the U-shaped piece and the connecting piece to slide upward along the fixed block.

[0008] A transmission group is provided behind the two feeding groups. The transmission group is used to drive the conveyor belt to rotate to a fixed distance and to drive the opening and closing of the two connecting shells.

[0009] As a further embodiment of the present invention, two rack rods are slidably connected inside the fixed shell. A third spring is fixedly connected between each of the two rack rods and the inner wall of the fixed shell. Each of the two rack rods meshes with two first gears. Each of the first gears is rotatably connected to the bottom wall of the fixed shell. A clamping rod is fixedly connected to the rotation shaft of each of the first gears. The top end of the clamping rod is slightly lower than the bottom end of the feeding plate. Each of the two rack rods meshes with a second gear. A third gear is provided in front of each of the two second gears. A belt is drivingly connected between each of the second gears and the third gear. Each of the two third gears meshes with an arc-shaped gear ring. The two arc-shaped gear rings are fixedly connected to the inner walls of the two connecting shells, respectively.

[0010] As a further embodiment of the present invention, two second cylinders are fixedly connected to the bottom end of the feeding plate, and two support rods are rotatably connected to the telescopic ends of the two second cylinders. Each support rod is rotatably connected to a limit rod, and the limit rods are slidably connected to the feeding plate. The limit rods are L-shaped.

[0011] As a further embodiment of the present invention, the transmission group includes two fourth gears, both of which are fixedly connected to the rotating shafts of the two connecting shells. A crossbar is provided on the inner rear side of each of the two fourth gears. The two crossbars are fixedly connected to the two driving rods respectively. Several teeth are fixedly connected to the two driving rods near their rear ends. The transmission group also includes a conveying group for driving the two conveyor belts to rotate.

[0012] As a further embodiment of the present invention, the conveying assembly includes two trapezoidal blocks, which are respectively fixedly connected to the top ends of the two crossbars. Each trapezoidal block is provided with a pressure rod above it, and the two pressure rods are jointly fixedly connected to a slider. The slider is slidably connected to a fixed shell. A fourth spring is fixedly connected between the fixed shell and the slider. A support rod is provided in front of each of the two pressure rods, and each support rod is rotatably connected to a paddle. The rotation shafts of the two paddles are each sleeved with a first torsion spring. The two paddles are used to press down the U-shaped piece when the support rod descends.

[0013] As a further embodiment of the present invention, the inner ring of the conveyor belt is provided with a plurality of grooves, the outer ring of the transmission wheel is provided with a protruding end, and the side wall of the fixed shell is rotatably connected to two ratchet plates, both of which are located in the inner ring of the conveyor belt, and the rotation shaft of each ratchet plate is sleeved with a second torsion spring.

[0014] As a further embodiment of the present invention, rollers are rotatably connected to the bottom ends of both pressure rods.

[0015] As a further embodiment of the present invention, each of the fixed blocks is rotatably connected to a ball bearing.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. Once all wafers have been mounted, simply place the new wafer onto the mounting block. During placement, the two connecting shells are in an unfolded state, making wafer placement easier. Furthermore, during feeding, simply place the wafer; there is no need to cram the wafer into the narrow feed track, thus preventing the wafer from touching the track and causing damage.

[0018] 2. When loading and unloading, the feeding group can complete the loading of wafers simply by moving the feeding plate back and forth. This method is simple, occupies less space, and reduces the waiting time for workers. Compared with the traditional loading and unloading work that uses multiple devices, it saves more costs.

[0019] 3. During the rotation of the two first gears, the two clamping rods will move closer to the center of the fixed shell. As the two connecting shells rotate, the wafers placed on the fixed block will clamp several wafers. On the one hand, the position of the wafers placed on the fixed block is restricted and adjusted, and on the other hand, the wafers are fixed so that the wafers will not wobble during the movement of the support plate, which facilitates the subsequent wafer mounting. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the internal structure of the fixing shell of the present invention;

[0022] Figure 3 This is a schematic diagram showing the positional relationship between the conveyor belt and the clamping rod of the present invention;

[0023] Figure 4 This is a schematic diagram showing the positional relationship between the rack and the clamping rod of the present invention;

[0024] Figure 5 This is a schematic diagram showing the connection relationship between the resisting block, the arc-shaped toothed ring, and the connecting shell of the present invention;

[0025] Figure 6 This is a schematic diagram showing the connection relationship between the second cylinder and the support rod of the present invention;

[0026] Figure 7 This is a schematic diagram showing the connection relationship between the conveyor belt and the drive wheel of the present invention;

[0027] Figure 8 for Figure 7 Enlarged view of a portion of point A in the middle;

[0028] Figure 9 This is a cross-sectional view of the fixing block, connecting piece, and U-shaped piece of the present invention;

[0029] Figure 10 This is a schematic diagram showing the positional relationship between the support rod and the pressure rod of the present invention;

[0030] Figure 11 This is a schematic diagram showing the connection relationship between the slider and the fourth spring of the present invention;

[0031] Figure 12 for Figure 11 Enlarged view of section B in the middle.

[0032] The attached diagram lists the components represented by each number as follows:

[0033] 1. Processing table; 2. Turret-type head; 3. Fixed shell; 4. Support plate; 5. Connecting shell; 6. Feeding plate; 7. Drive rod; 8. First cylinder; 9. Conveyor belt; 10. Drive wheel; 11. Fixed block; 12. Connecting piece; 13. First spring; 14. U-shaped piece; 15. Second spring; 16. Resistance block; 17. Rack; 18. Third spring; 19. First gear; 20. Clamping rod; 21. Second gear; 22. Third gear; 23. Belt; 24. Arc-shaped gear ring; 25. Second cylinder; 26. Support rod; 27. Limiting rod; 28. Fourth gear; 29. ​​Crossbar; 30. Tooth; 31. Trapezoidal block; 32. Pressure rod; 33. Slider; 34. Fourth spring; 35. Support rod; 36. Paddle; 37. First torsion spring; 38. Ratchet; 39. Second torsion spring; Detailed Implementation

[0034] Please see Figure 1-12 The present invention provides a technical solution: a eutectic bonding machine with a turret-type bonding head, including a processing table 1, a turret-type bonding head 102 is provided above the processing table 1, a support plate 3 is provided above the processing table 1, a fixed shell 2 is fixedly connected to the top of the support plate 3, a feeding plate 5 is provided inside the fixed shell 2, and feeding groups are provided on both the left and right sides of the feeding plate 5.

[0035] The feeding assembly includes a connecting shell 4, a drive rod 6, a conveyor belt 8, and a resisting block 15. The connecting shell 4 is rotatably connected to the support plate 3. The top end of the drive rod 6 is fixedly connected to the feeding plate 5, and the bottom end of the drive rod 6 is fixedly connected to a first cylinder 7, which is also fixedly connected to the support plate 3. The conveyor belt 8 is driven by two drive wheels 9, both of which are connected to the side wall of the fixed shell 2. Several fixed blocks 10 are fixedly connected to the conveyor belt 8. Each fixed block 10 is slidably connected to a connecting piece 11 in the vertical direction. Each connecting piece 11 is fixedly connected to a first spring 12 for its reset, and each connecting piece 11 is slidably connected to a U-shaped piece 13 in the horizontal direction. Each U-shaped piece 13 is fixedly connected to a second spring 14 for its reset. The resisting block 15 is fixedly connected to the top end of the connecting shell 4. The resisting block 15 is wedge-shaped and is used to push the U-shaped piece 13 and the connecting piece 11 to slide upward along the fixed block 10.

[0036] A transmission group is provided behind the two feeding groups. The transmission group is used to drive the conveyor belt 8 to rotate to a fixed distance and to drive the opening and closing of the two connecting shells 4.

[0037] When the above scheme is put into actual use, the first cylinder 7 is in an extended state and the two connecting shells 4 are in an unfolded state before the wafer is placed, and the processing table 1 is used for support and processing.

[0038] Then, several wafers are sequentially placed onto the parallel fixed blocks 10 located between the two conveyor belts 8 inside the fixed housing 2 (the top layer does not need to be placed). After the wafers are placed, the first cylinder 7 is activated to extend and retract. When the first cylinder 7 retracts, it drives the drive rod 6 to move, thereby causing the feeding plate 5 to move synchronously. The transmission assembly drives the two connecting housings 4 to rotate around the rotating shaft, thereby causing the two connecting housings 4 to close. When the two connecting housings 4 are about to close, the inclined end of the upper resisting block 15 will gradually contact the bottom end of the U-shaped piece 13 and push the U-shaped piece 13 and the connecting piece 11 along the fixed block. 10 slides upwards, and when the wafer is placed on the two fixed blocks 10, part of the side of the wafer is above the U-shaped piece 13. So when the resisting block 15 pushes the U-shaped piece 13 to rise along the fixed block 10, the two U-shaped pieces 13 will drive the wafer at the top to rise. When the two connecting shells 4 are completely closed, the first cylinder 7 continues to extend and retract, and the resisting block 15 is at the bottom of the U-shaped piece 13. At this time, the first spring 12 is in an elastically relaxed state. At this time, the drive rod 6 will drive the rear side of the feeding plate 5 to move backwards in a straight line. At this time, the horizontal height of the feeding plate 5 is at the same height as the U-shaped piece 13.

[0039] As the first cylinder 7 drives the drive rod 6 and the feeding plate 5 to move, the feeding plate 5 moves to the position where it contacts the U-shaped piece 13. Since the sidewalls of the U-shaped piece 13 are inclined, the outer surface of the feeding plate 5 will press against the two U-shaped pieces 13 during its movement, causing them to move away from the feeding plate 5 along the connecting piece 11. At this time, the second spring 14 will be gradually stretched. When the leftmost and rightmost parts of the feeding plate 5 contact the middle positions of the two U-shaped pieces 13, the straight-line distance between the two U-shaped pieces 13 is greater than the diameter of the wafer. Therefore, the wafer will fall. The wafer falls onto the feed plate 5, thus completing the wafer loading process. The first cylinder 7 also extends to its limit position. At this time, the turret-type bonding head 102 above the feed plate 5 will start working to mount the wafer onto the surface. The drive assembly between the support plate 3 and the worktable 1 will drive the support plate 3 to move with the position of the wafer mounting when the turret-type bonding head 102 is working (the drive assembly is existing technology, that is, it drives the support plate 3 to move in the front, back and left and right directions, so it is not described). After the wafer is mounted, the turret-type bonding head 102 stops working, and a new wafer needs to be replaced.

[0040] When replacing, the first cylinder 7 is restarted. The first cylinder 7 extends, driving the drive rod 6 and the feeding plate 5 to move forward. The wafer on the feeding plate 5 also moves forward with the feeding plate 5. When the first cylinder 7 is about to extend to its limit position, the transmission group will drive the conveyor belt 8 to rotate, causing the wafer to be mounted on the next fixed block 10 to rise. At this time, the transmission group drives the two connecting shells 4 to unfold. At this time, the resisting block 15 also rotates with the connecting shell 4. When the first cylinder 7 extends to its limit position, the conveyor belt 8 has rotated a certain angle. At this time, the two connecting shells 4 have also unfolded. Then, the wafer that has been mounted on the feeding plate 5 can be removed, thus completing the wafer unloading work. Then, the first cylinder 7 is shortened again. When the first cylinder 7 is shortened to its limit position, the wafer loading is completed again.

[0041] Once all wafers have been mounted, simply place the new wafer onto the fixing block 10. During placement, the two connecting shells 4 are in an unfolded state, making wafer placement easier. During loading and unloading, the feeding group can complete the wafer loading process simply by moving the feeding plate 5 back and forth. This method is simple and occupies less space, saving costs compared to the traditional loading and unloading process that uses multiple devices. Furthermore, during loading, it is only necessary to place the wafer; there is no need to stuff the wafer into the narrow feeding track, thus preventing the wafer from touching the track and causing damage.

[0042] As a further embodiment of the present invention, two rack rods 16 are slidably connected inside the fixed shell 2. A third spring 17 is fixedly connected between each of the two rack rods 16 and the inner wall of the fixed shell 2. Each of the two rack rods 16 meshes with two first gears 18. Each of the first gears 18 is rotatably connected to the bottom wall of the fixed shell 2. A clamping rod 19 is fixedly connected to the rotation shaft of each of the first gears 18. The top end of the clamping rod 19 is slightly lower than the bottom end of the feeding plate 5. Each of the two rack rods 16 meshes with a second gear 20. A third gear 21 is provided in front of each of the two second gears 20. A belt 22 is drivingly connected between each of the second gears 20 and the third gear 21. Each of the two third gears 21 meshes with an arc-shaped gear ring 23. The two arc-shaped gear rings 23 are fixedly connected to the inner walls of the two connecting shells 4 respectively.

[0043] When the above scheme is put into practical use, the wafer is placed onto the fixed block 10 when the two connecting shells 4 are unfolded, completing the wafer placement. Then, the transmission assembly drives the two connecting shells 4 to close. When the two connecting shells 4 are closed, they rotate around the rotating shaft. When the connecting shells 4 rotate toward the fixed shell 2, they drive the arc-shaped gear ring 23 to rotate synchronously. After the connecting shells 4 have rotated a certain angle, the arc-shaped gear ring 23 will mesh with the third gear 21, driving the third gear 21 to rotate. When the third gear 21 rotates, it will drive the second gear 20 to rotate through the belt 22. When the second gear 20 rotates, it will mesh with the gear ring 21. The bar 16 engages and drives the rack 16 to slide along the fixed shell 2. As the two racks 16 move away from each other, they drive the two first gears 18 to rotate. During the rotation of the two first gears 18, they drive the two clamping rods 19 to move closer to the center of the fixed shell 2. Thus, after the wafer is placed on the fixed block 10, the rotation of the two connecting shells 4 clamps several wafers. On the one hand, it restricts and adjusts the position of the wafers placed on the fixed block 10, and on the other hand, it fixes the wafers so that the wafers will not shake during the movement of the support plate 3, which facilitates the subsequent wafer mounting.

[0044] As a further embodiment of the present invention, two second cylinders 24 are fixedly connected to the bottom end of the feeding plate 5. The telescopic ends of the two second cylinders 24 are rotatably connected to two support rods 25. Each support rod 25 is rotatably connected to a limit rod 26. The limit rods 26 are slidably connected to the feeding plate 5. The limit rods 26 are L-shaped.

[0045] In operation, after the first cylinder 7 extends from its extended state to its limit position, the feeding plate 5 pushes the two U-shaped pieces 13 to their limit positions, and the wafers on the two U-shaped pieces 13 fall onto the feeding plate 5. At this time, the second cylinder 24 is activated, and the second cylinder 24 shortens to pull the support rod 25, thereby pulling the limit rod 26 closer to the wafer, thus clamping and positioning the wafer. After the wafer is mounted, the second cylinder 24 is extended, so that the wafer can be removed.

[0046] As a further embodiment of the present invention, the transmission group includes two fourth gears 27, both of which are fixedly connected to the rotating shafts of the two connecting shells 4. A crossbar 28 is provided on the inner rear side of each of the two fourth gears 27. The two crossbars 28 are fixedly connected to the two driving rods 6 respectively. Several teeth 29 are fixedly connected to the two driving rods 6 near their rear ends. The transmission group also includes a conveying group, which is used to drive the two conveyor belts 8 to rotate.

[0047] When the above-mentioned transmission assembly is working, when the first cylinder 7 extends, it drives the drive rod 6 and the feeding plate 5 to move. When the drive rod 6 moves, it drives the crossbar 28 and the feeding plate 5 to move, thereby enabling the wafers that have been mounted to be unloaded. When the crossbar 28 moves, it drives the teeth 29 to move. When the feeding plate 5 moves to the outside of the fixed shell 2, the teeth 29 mesh with the fourth gear 27, thereby causing the connecting shell 4 to unfold. After the connecting shell 4 unfolds, the wafers on the feeding plate 5 can be removed. If all the wafers inside the fixed shell 2 have been mounted, a new wafer needs to be placed (no wafer needs to be placed on the top fixed block 10).

[0048] When the first cylinder 7 shortens, it will first drive the connecting shell 4 to close, and then the feeding plate 5 will feed the material.

[0049] As a further embodiment of the present invention, the conveying assembly includes two trapezoidal blocks 30, which are respectively fixedly connected to the top ends of the two crossbars 28. Each trapezoidal block 30 is provided with a pressure rod 31 above it. The two pressure rods 31 are jointly fixedly connected to a slider 32, which is slidably connected to the fixed shell 2. A fourth spring 33 is fixedly connected between the fixed shell 2 and the slider 32. Each pressure rod 31 is provided with a support rod 34 in front of it. Each support rod 34 is rotatably connected to a paddle 35. The rotation shafts of the two paddles 35 are each sleeved with a first torsion spring 36. The two paddles 35 are used to press down the U-shaped piece 13 when the support rod 34 descends.

[0050] As a further embodiment of the present invention, the inner ring of the conveyor belt 8 is provided with a plurality of grooves 39, the outer ring of the transmission wheel 9 is provided with a protruding end, and the side wall of the fixed shell 2 is rotatably connected to two ratchet plates 37, both of which are located in the inner ring of the conveyor belt 8, and the rotation shaft of each ratchet plate 37 is sleeved with a second torsion spring 38.

[0051] As a further embodiment of the present invention, rollers are rotatably connected to the bottom ends of both pressure rods 31.

[0052] When the above scheme is put into actual use, when the first cylinder 7 extends, the crossbar 28 drives the trapezoidal block 30 to move. When the pressure rod 31 moves from the trapezoidal block 30 to the crossbar 28, the elastic stretch of the fourth spring 33 drives the slider 32 to descend. When the slider 32 descends, it drives the support rod 34 to descend. When the support rod 34 descends, it presses down the U-shaped piece 13 through the paddle 35, thereby causing the U-shaped piece 13 to drive the conveyor belt 8 and the transmission wheel 9 to rotate, which in turn causes the wafers inside the fixed shell 2 to rise. Since the top layer does not need to hold wafers, the feeding plate 5 can only start feeding after the paddle 35 presses down the U-shaped piece 13 to make the wafers inside the fixed shell 2 rise a certain distance.

[0053] The outer ring of the drive wheel 9 has a protruding end, and the inner ring of the conveyor belt 8 has a groove 39. The groove 39 has a ratchet 37 inside, which is restricted by the second torsion spring 38. The ratchet 38 is used to restrict the conveyor belt 8, so that the conveyor belt 8 inside the fixed shell 2 can only rotate upward and not downward. When the first cylinder 7 is shortened to the limit position, the trapezoidal block 30 lifts the pressure rod 31. However, when the trapezoidal block 30 lifts the pressure rod 31, the support rod 34 drives the paddle 35 to rise. At this time, when the paddle 35 contacts the U-shaped piece 13, it will rotate around the rotation axis and will not drive the U-shaped piece 13 to move. The friction between the pressure rod 31 and the trapezoidal block 30 can be reduced by the roller (the roller is prior art and is not marked in the figure).

[0054] As a further embodiment of the present invention, each of the fixed blocks 10 is rotatably connected to a ball bearing.

[0055] When the above solution is in operation, the friction between the fixed block 10 and the wafer can be reduced by the ball bearings (the ball bearings are prior art and are not shown).

[0056] Working principle: The wafer is supported and processed by the processing table 1. Before the wafer is placed, the first cylinder 7 is in the extended state and the two connecting shells 4 are in the unfolded state.

[0057] Then, several wafers are sequentially placed onto the parallel fixed blocks 10 located between the two conveyor belts 8 inside the fixed housing 2 (the top layer does not need to be placed). After the wafers are placed, the first cylinder 7 is activated to extend and retract. When the first cylinder 7 retracts, it drives the drive rod 6 to move, thereby causing the feeding plate 5 to move synchronously. The transmission assembly drives the two connecting housings 4 to rotate around the rotating shaft, thereby causing the two connecting housings 4 to close. When the two connecting housings 4 are about to close, the inclined end of the upper resisting block 15 will gradually contact the bottom end of the U-shaped piece 13 and push the U-shaped piece 13 and the connecting piece 11 along the fixed block. 10 slides upwards, and when the wafer is placed on the two fixed blocks 10, part of the side of the wafer is above the U-shaped piece 13. So when the resisting block 15 pushes the U-shaped piece 13 to rise along the fixed block 10, the two U-shaped pieces 13 will drive the wafer at the top to rise. When the two connecting shells 4 are completely closed, the first cylinder 7 continues to extend and retract, and the resisting block 15 is at the bottom of the U-shaped piece 13. At this time, the first spring 12 is in an elastically relaxed state. At this time, the drive rod 6 will drive the rear side of the feeding plate 5 to move backwards in a straight line. At this time, the horizontal height of the feeding plate 5 is at the same height as the U-shaped piece 13.

[0058] As the first cylinder 7 drives the drive rod 6 and the feeding plate 5 to move, the feeding plate 5 moves to the position where it contacts the U-shaped piece 13. Since the sidewalls of the U-shaped piece 13 are inclined, the outer surface of the feeding plate 5 will press against the two U-shaped pieces 13 during its movement, causing them to move away from the feeding plate 5 along the connecting piece 11. At this time, the second spring 14 will be gradually stretched. When the leftmost and rightmost parts of the feeding plate 5 contact the middle positions of the two U-shaped pieces 13, the straight-line distance between the two U-shaped pieces 13 is greater than the diameter of the wafer. Therefore, the wafer will fall. The wafer falls onto the feed plate 5, thus completing the wafer loading process. The first cylinder 7 also extends to its limit position. At this time, the turret-type bonding head 102 above the feed plate 5 will start working to mount the wafer onto the surface. The drive assembly between the support plate 3 and the worktable 1 will drive the support plate 3 to move with the position of the wafer mounting when the turret-type bonding head 102 is working (the drive assembly is existing technology, that is, it drives the support plate 3 to move in the front, back and left and right directions, so it is not described). After the wafer is mounted, the turret-type bonding head 102 stops working, and a new wafer needs to be replaced.

[0059] When replacing, the first cylinder 7 is restarted. The first cylinder 7 extends, driving the drive rod 6 and the feeding plate 5 to move forward. The wafer on the feeding plate 5 also moves forward with the feeding plate 5. When the first cylinder 7 is about to extend to its limit position, the transmission group will drive the conveyor belt 8 to rotate, causing the wafer to be mounted on the next fixed block 10 to rise. At this time, the transmission group drives the two connecting shells 4 to unfold. At this time, the resisting block 15 also rotates with the connecting shell 4. When the first cylinder 7 extends to its limit position, the conveyor belt 8 has rotated a certain angle. At this time, the two connecting shells 4 have also unfolded. Then, the wafer that has been mounted on the feeding plate 5 can be removed, thus completing the wafer unloading work. Then, the first cylinder 7 is shortened again. When the first cylinder 7 is shortened to its limit position, the wafer loading is completed again.

[0060] Once all wafers have been mounted, simply place the new wafer onto the fixing block 10. During placement, the two connecting shells 4 are in an unfolded state, making wafer placement easier. During loading and unloading, the feeding group can complete the wafer loading process simply by moving the feeding plate 5 back and forth. This method is simple and occupies less space, saving costs compared to the traditional loading and unloading process that uses multiple devices. Furthermore, during loading, it is only necessary to place the wafer; there is no need to stuff the wafer into the narrow feeding track, thus preventing the wafer from touching the track and causing damage.

Claims

1. A eutectic bonding machine with a turret-type bonding head, comprising a processing table (1), wherein a turret-type bonding head (102) is disposed above the processing table (1), characterized in that: A support plate (3) is provided above the processing table (1). A fixed shell (2) is fixedly connected to the top of the support plate (3). A feeding plate (5) is provided inside the fixed shell (2). Feeding groups are provided on both the left and right sides of the feeding plate (5). The feeding assembly includes a connecting shell (4), a drive rod (6), a conveyor belt (8), and a resisting block (15). The connecting shell (4) is rotatably connected to the support plate (3). The top end of the drive rod (6) is fixedly connected to the feeding plate (5). The bottom end of the drive rod (6) is fixedly connected to a first cylinder (7). The first cylinder (7) is fixedly connected to the support plate (3). The conveyor belt (8) is driven by two drive wheels (9). Both drive wheels (9) are rotatably connected to the side wall of the fixed shell (2). Several fixing blocks (10) are fixedly connected to the conveyor belt (8). Each of the fixed blocks (10) is slidably connected to a connecting piece (11) in the vertical direction; each of the connecting pieces (11) is fixedly connected to a first spring (12) for its reset; each of the connecting pieces (11) is slidably connected to a U-shaped piece (13) in the horizontal direction; each of the U-shaped pieces (13) is fixedly connected to a second spring (14) for its reset; the resisting block (15) is fixedly connected to the top of the connecting shell (4); the resisting block (15) is wedge-shaped; the resisting block (15) is used to push the U-shaped piece (13) and the connecting piece (11) to slide upward along the fixed block (10); A transmission group is provided behind the two feeding groups. The transmission group is used to drive the conveyor belt (8) to rotate to a fixed distance and to drive the opening and closing of the two connecting shells (4).

2. A eutectic bonding machine with a turret-type bonding head according to claim 1, characterized in that: The fixed shell (2) has two rack rods (16) slidably connected inside. Each rack rod (16) is fixedly connected to the inner wall of the fixed shell (2) with a third spring (17). Each rack rod (16) meshes with two first gears (18). Each first gear (18) is rotatably connected to the bottom wall of the fixed shell (2). Each first gear (18) has a clamping rod (19) fixedly connected to its rotation shaft. The top of the clamping rod (19) is slightly lower than the bottom of the feeding plate (5). Each rack rod (16) meshes with a second gear (20). Each second gear (20) has a third gear (21) in front of it. Each second gear (20) and third gear (21) is connected by a belt (22). Each third gear (21) meshes with an arc-shaped gear ring (23). Each arc-shaped gear ring (23) is fixedly connected to the inner wall of the two connecting shells (4).

3. A eutectic bonding machine with a turret-type bonding head according to claim 2, characterized in that: The bottom end of the feeding plate (5) is fixedly connected to two second cylinders (24). The telescopic ends of the two second cylinders (24) are rotatably connected to two support rods (25). The support rods (25) are rotatably connected to limit rods (26). The limit rods (26) are slidably connected to the feeding plate (5). The limit rods (26) are L-shaped.

4. A eutectic bonding machine with a turret-type bonding head according to claim 1, characterized in that: The transmission group includes two fourth gears (27), both of which are fixedly connected to the rotating shafts of the two connecting shells (4). A crossbar (28) is provided on the inner rear side of each of the two fourth gears (27). The two crossbars (28) are fixedly connected to the two driving rods (6) respectively. Several teeth (29) are fixedly connected to the two driving rods (6) near their rear ends. The transmission group also includes a conveying group, which is used to drive the two conveyor belts (8) to rotate.

5. A eutectic bonding machine with a turret-type bonding head according to claim 4, characterized in that: The conveying assembly includes two trapezoidal blocks (30), which are fixedly connected to the top ends of two crossbars (28) respectively. Each trapezoidal block (30) is provided with a pressure rod (31) above it. The two pressure rods (31) are fixedly connected to a slider (32). The slider (32) is slidably connected to the fixed shell (2). A fourth spring (33) is fixedly connected between the fixed shell (2) and the slider (32). Each pressure rod (31) is provided with a support rod (34) in front of it. Each support rod (34) is rotatably connected to a paddle (35). The rotation shaft of each paddle (35) is sleeved with a first torsion spring (36). The paddles (35) are used to press down the U-shaped piece (13) when the support rod (34) descends.

6. A eutectic bonding machine with a turret-type bonding head according to claim 4, characterized in that: The inner ring of the conveyor belt (8) is provided with several grooves (39), the outer ring of the drive wheel (9) is provided with a protruding end, and the side wall of the fixed shell (2) is rotatably connected to two ratchet plates (37). The two ratchet plates (37) are located in the inner ring of the conveyor belt (8), and the rotation shaft of the ratchet plates (37) is sleeved with a second torsion spring (38).

7. A eutectic bonding machine with a turret-type bonding head according to claim 5, characterized in that: Both pressure rods (31) are rotatably connected to rollers at their bottom ends.

8. A eutectic bonding machine with a turret-type bonding head according to claim 1, characterized in that: Each of the fixed blocks (10) has a ball bearing rotatably connected to its top.

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