Plastic encapsulant composition and its application in sip packaging

Abstract

The present application relates to a kind of plastic sealing material composition and its application in SIP package, the plastic sealing material composition includes epoxy plastic sealing material and composite magnetic material, wherein, the composite magnetic material includes the composite material of being composed of porous graphene ellipsoid and zinc sulfide nanomaterial and the organic insulating material coated on the surface of the composite material, wherein, in the composite material, multiple the porous graphene ellipsoid is sequentially arranged and constitutes graphene group, and the zinc sulfide nanomaterial is fused in the graphene group.In SIP package, the plastic sealing material composition of the present application is used to carry out plastic sealing, can make chip have excellent electromagnetic shielding performance, can effectively shield external electromagnetic interference, and, plastic sealing film occupies small space, can be used in large area, it is conducive to the development trend of small-sized electronic equipment.In addition, the plastic sealing material composition of the present application is simple in manufacturing process, and will not affect SIP package flow.

Description

Technical Field

[0001] This invention relates to the field of electronic industry technology, and in particular to molding compound compositions and their application in SIP packaging. Background Technology

[0002] Chips are the core components of electronic devices, generally divided into three categories: CPU chips, which are the internal components of a computer that process and control data, and are the "brain" of various digital intelligent devices; memory chips, which are mainly used to record data in various formats in electronic products; and digital multimedia chips, such as those used in digital cameras and increasingly realistic mobile phone ringtones. If a chip is subjected to external electromagnetic interference, it can cause abnormalities in the CPU, multimedia, and data storage, directly affecting the normal operation of the electronic device. This can range from a brief, recoverable malfunction to complete failure, data loss, and even total device paralysis. Therefore, electromagnetic protection for chips is extremely important.

[0003] For electromagnetic protection of chips, the traditional method is to use metal shields. However, metal shields cannot completely block interference from other external electronic devices. Moreover, if used on a large scale, they are costly and require a lot of space, which is not conducive to the development of sophisticated electronic devices. Summary of the Invention

[0004] Therefore, it is necessary to provide a molding compound composition and its application in SIP packaging to address the above-mentioned technical problems. Using the molding compound composition for molding can enable the chip to have excellent electromagnetic shielding performance and effectively shield against external electromagnetic interference.

[0005] This invention provides a molding compound composition, comprising an epoxy molding compound and a composite magnetic material, wherein the composite magnetic material comprises a composite material composed of porous graphene ellipsoids and zinc sulfide nanomaterials, and an organic insulating material coated on the surface of the composite material, wherein in the composite material, a plurality of porous graphene ellipsoids are arranged in an orderly manner to form a graphene cluster, and the zinc sulfide nanomaterials are fused into the graphene cluster.

[0006] In one embodiment, the porous graphene ellipsoids in the graphene group are arranged in a three-dimensional array.

[0007] In one embodiment, the porous graphene ellipsoid has an equatorial radius of 100nm-120nm and a polar radius of 200nm-250nm.

[0008] In one embodiment, the pore size of the porous graphene ellipsoid is 14nm-25nm.

[0009] In one embodiment, the ratio of the particle size of the zinc sulfide nanomaterial to the pore size of the porous carbon rod is 1:8 to 1:12.

[0010] In one embodiment, the mass ratio of the zinc sulfide nanomaterial to the graphene group in the composite magnetic material is 1:3-1:5.

[0011] In one embodiment, the mass ratio of the epoxy molding compound to the composite magnetic material is 5:1-7:1.

[0012] In one embodiment, the molding compound composition further includes an adhesive, wherein the mass ratio of the adhesive to the composite magnetic material is 6:1 to 8:1.

[0013] In one embodiment, the viscosity of the adhesive is 0.8 kgl / inch to 1.5 kgl / inch.

[0014] The present invention also provides an application of the molding compound composition described herein in SIP packaging.

[0015] This invention, through the selection of materials and the control of structure in composite magnetic materials, enables the insertion loss of the composite magnetic material to reach approximately 25 dB in the 20 MHz-1200 MHz frequency band, exhibiting excellent wave absorption performance. Furthermore, a molding compound composition is constructed by mixing the composite magnetic material with epoxy molding compound, and the molding film formed by using the molding compound composition possesses excellent electromagnetic shielding performance.

[0016] Therefore, in SIP packaging, using the molding compound composition of this invention enables the chip to have excellent electromagnetic shielding performance, effectively shielding it from external electromagnetic interference. Moreover, the molding film occupies little space and can be used over a large area, which is beneficial to the trend of miniaturized electronic devices. Furthermore, the molding compound composition of this invention is obtained by directly mixing traditional epoxy molding compounds and composite magnetic materials, resulting in a simple manufacturing process. Moreover, using the molding compound composition of this invention in SIP packaging does not affect the SIP packaging process, making it widely applicable. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a high-magnification scanning electron microscope image of the graphene group obtained in Example 1;

[0019] Figure 2 This is a high-magnification scanning electron microscope image of the composite magnetic material prepared in Example 1;

[0020] Figure 3 Electromagnetic compatibility (EMC) radiation emissions diagram for molding with epoxy molding compound;

[0021] Figure 4 Electromagnetic compatibility (EMC) radiation interference diagram for molding using the molding compound composition of Example 1 of the present invention;

[0022] Figure 5 Electromagnetic compatibility conducted interference diagram for molding with epoxy molding compound;

[0023] Figure 6 Electromagnetic compatibility conducted interference diagram for molding using the molding compound composition of Example 1 of the present invention. Detailed Implementation

[0024] To facilitate understanding of the present invention, it will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. Rather, these embodiments or examples are provided to make the disclosure of the present invention more thorough and complete.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments or examples only and is not intended to limit the invention. The optional scope of the term "and / or" as used herein includes any one of two or more of the related listed items, as well as any and all combinations of the related listed items, including any two related listed items, any more related listed items, or a combination of all related listed items.

[0026] This invention provides a molding compound composition, comprising an epoxy molding compound and a composite magnetic material, wherein the composite magnetic material comprises a composite material composed of porous graphene ellipsoids and zinc sulfide nanomaterials, and an organic insulating material coated on the surface of the composite material, wherein in the composite material, a plurality of porous graphene ellipsoids are arranged in an orderly manner to form a graphene cluster, and the zinc sulfide nanomaterials are fused into the graphene cluster.

[0027] Specifically, the zinc sulfide nanomaterials are integrated into the graphene group in the following ways: zinc sulfide nanomaterials are attached to the surface of at least a portion of the porous graphene ellipsoids, and zinc sulfide nanomaterials are filled in at least a portion of the gaps in the graphene group; furthermore, when the particle size of the zinc sulfide nanomaterials is smaller than the pore size of the porous graphene ellipsoids, the integration of the zinc sulfide nanomaterials into the graphene group also includes the presence of zinc sulfide nanomaterials within the channels of at least a portion of the porous graphene ellipsoids. Of course, the specific integration method will not have a substantial impact on the wave absorption performance.

[0028] Different structural types and materials exhibit varying electromagnetic wave conversion capabilities. In this invention, graphene and zinc sulfide are combined in terms of materials. Structurally, graphene particles are bonded together with binders such as phenolic resin to form porous graphene ellipsoids, which are then arranged in an orderly manner to form graphene clusters. Zinc sulfide nanomaterials are integrated into these graphene clusters in various ways. This allows for faster and more efficient conversion of electromagnetic waves into heat energy. Furthermore, graphene's excellent thermal conductivity enables rapid heat transfer, resulting in a composite magnetic material with an insertion loss of approximately 25 dB in the 0.15 MHz–1200 MHz frequency band, demonstrating excellent wave absorption performance.

[0029] Meanwhile, the composite magnetic material of this invention uses a graphene cluster composed of multiple porous graphene ellipsoids arranged in an orderly manner as the matrix, and integrates zinc sulfide nanomaterials. It exhibits a dense structure, good toughness, and is not prone to breakage failure under load. Furthermore, the composite material is coated with an organic insulating material, which not only imparts insulation to the composite magnetic material but also makes the bonding of the composite material more stable. Optionally, during the coating process, the organic insulating material can partially coat the surface of the composite material or completely coat the composite material; preferably, the organic insulating material completely coats the composite material. The organic insulating material is preferably a block polymer, such as ethylene oxide and propylene oxide block copolymer ether.

[0030] Furthermore, the molding compound composition, which is made by mixing composite magnetic materials and epoxy molding compound, and the molding film formed by using this molding compound composition, has excellent electromagnetic shielding performance.

[0031] To further optimize the microwave absorption properties of the molding compound composition, the composite magnetic material can be further optimized.

[0032] For example, in composite magnetic materials, when multiple porous graphene ellipsoids are arranged in an orderly manner to form a graphene group, the porous graphene ellipsoids are arranged in a three-dimensional array; and / or, the equatorial radius of the porous graphene ellipsoids is 100nm-120nm, and the polar radius is 200nm-250nm; and / or, the pore size of the porous graphene ellipsoids is 14nm-25nm, and the ratio of the particle size of the zinc sulfide nanomaterial to the pore size of the porous graphene ellipsoids is 1:8-1:12.

[0033] Furthermore, the mass ratio of porous graphene ellipsoids to zinc sulfide nanomaterials in the composite magnetic material can be further optimized, as can the mass fraction of the composite magnetic material in the molding compound composition. In one embodiment, the mass ratio of zinc sulfide nanomaterials to graphene groups in the composite magnetic material is 1:3-1:5; in another embodiment, the mass ratio of epoxy molding compound to the composite magnetic material is 5:1-7:1.

[0034] It is understood that the present invention does not limit the selection of the epoxy molding compound, and any existing epoxy molding compound can be used.

[0035] Furthermore, the molding compound composition of the present invention further includes an adhesive, wherein the mass ratio of the adhesive to the composite magnetic material is 6:1-8:1. Preferably, the viscosity of the adhesive is 0.8 kgl / inch-1.5 kgl / inch to ensure the tackiness of the molding compound composition. It is understood that the present invention does not limit the selection of the adhesive; any currently available adhesive can be used.

[0036] It is understood that the molding compound composition of the present invention can be prepared in advance, or the epoxy molding compound and the composite magnetic material can be stored separately. When applying, the epoxy molding compound and the composite magnetic material can be mixed and stirred evenly. The manufacturing process is simple, and an appropriate amount of water can be added during preparation.

[0037] Similarly, when the molding compound composition of the present invention also includes adhesive, the molding compound composition of the present invention can be prepared in advance, or the epoxy molding compound, composite magnetic material and adhesive can be stored separately, and the epoxy molding compound, composite magnetic material and adhesive can be mixed and stirred evenly before application.

[0038] When preparing a molding compound composition using epoxy molding compound, composite magnetic material, and adhesive, it is preferable to first disperse the composite magnetic material in water, then add the adhesive to obtain a mixture; then mix the mixture with the epoxy molding compound and stir evenly to obtain the molding compound composition.

[0039] Furthermore, the present invention does not limit the preparation method of composite magnetic materials, and any preparation method can be used to obtain them, as long as the structure and materials meet the above conditions of the present invention, the desired effect can be achieved.

[0040] In one embodiment, the preparation method of the composite magnetic material includes the following steps: preparing graphene groups using a colloidal crystal template method, then mixing the graphene groups with zinc sulfide nanomaterials, adding organic insulating materials, heating to a viscous state, and then cooling to obtain the composite magnetic material.

[0041] The specific steps for preparing graphene groups using the colloidal crystal template method include: preparing a first formulation by mixing graphene with water, then mixing the first formulation with a binder to form a second formulation, then adding the second formulation to a colloidal crystal template and heating it under an inert atmosphere, and then cooling it under a reducing atmosphere to obtain graphene groups.

[0042] The graphene to water mass ratio is 1:2-1:4, the graphene to binder mass ratio is 10:1-10:3, the binder is preferably a resin-based binder, such as phenolic resin, the graphene to colloidal crystal mass ratio is 6:1-12:1, the colloidal crystal template is selected from polymethyl methacrylate colloidal crystal template, the heating temperature is preferably 180℃-220℃, the heating time is preferably 20h-28h, the inert atmosphere is selected from nitrogen, argon, etc., and the reducing atmosphere is selected from carbon monoxide, hydrogen, etc.

[0043] To further improve the stability of graphene, a reducing catalyst, such as SnCl2 or FeCl2, can be added to the first formulation. The mass ratio of graphene to the reducing catalyst is 1:1 to 2:1. Then, the mixture is heated in an inert gas and cooled in a reducing atmosphere to obtain a more stable first formulation. The preferred heating temperature is 220℃ to 280℃, and the preferred heating time is 4h to 8h.

[0044] The present invention also provides an application of a molding compound composition in SIP packaging. The SIP packaging can be carried out using any existing packaging process, and the molding compound composition of the present invention can be used during molding.

[0045] For example, SIP packaging technology includes:

[0046] (1) Pre-packaging test: Before packaging and production, the chip is tested for electrical properties. Only chips with normal test results can proceed to the next packaging process.

[0047] (2) Cutting chip particles: Use a diamond cutting saw blade to cut the chip particles on the wafer along the cutting line;

[0048] (3) Chip bonding: The chip is bonded to the metal-plated substrate using adhesives such as conductive silver paste;

[0049] (4) Wire bonding packaging: Use a mechanical steel nozzle to press and fix one end of the gold wire to the pads around the chip, and press and fix the other end to the metal pins of the carrier board, so that the solder area on the chip is connected to the solder area on the carrier board with the metal layer plated.

[0050] (5) Molding: The wire-bonded chip and the carrier are placed in a mold, the molding compound composition of the present invention is injected, and finally baked and hardened to mold and encapsulate the chip completely.

[0051] (6) Cutting and shaping.

[0052] In SIP packaging, the molding compound composition of this invention enables the chip to have excellent electromagnetic shielding performance, effectively shielding it from external electromagnetic interference. Furthermore, the molding film occupies little space and can be used over a large area, which is beneficial to the trend of miniaturized electronic devices.

[0053] In addition, the molding compound composition of the present invention is obtained by directly mixing traditional epoxy molding compound and composite magnetic material, which is simple to manufacture. Moreover, when the molding compound composition of the present invention is used in SIP packaging, it will not affect the SIP packaging process, and has a wide range of applications.

[0054] The following specific examples will further illustrate the molding compound composition and its application in SIP packaging.

[0055] Example 1

[0056] Graphene powder was added to water at a mass ratio of 1:3 and mixed. Then, SnCl2 was added at a mass ratio of 1:1 to the graphene powder. The mixture was placed in an argon atmosphere and heated at 250°C for 6 hours, followed by cooling in a CO atmosphere to obtain the first formulation. The first formulation was then mixed with phenolic resin to obtain the second formulation, wherein the mass ratio of graphene powder to phenolic resin was 10:2.

[0057] The second formulation was added to polymethyl methacrylate colloidal crystals at a mass ratio of graphene to polymethyl methacrylate colloidal crystals of 8:1. The mixture was then placed in an argon atmosphere and heated at 200°C for 24 hours, followed by cooling in a carbon monoxide atmosphere to obtain the desired product. Figure 1 The graphene group shown is composed of porous graphene ellipsoids arranged in a three-dimensional array. The equatorial radius of the porous graphene ellipsoids is 100 nm, the polar radius is 210 nm, and the pore size is 18 nm.

[0058] Graphene groups and zinc sulfide nanomaterials with a particle size of 1.8 nm were added to water, with a mass ratio of graphene groups to zinc sulfide nanomaterials of 4:1. The mixture was stirred and mixed, then ethylene oxide and propylene oxide block copolymer ether were added, and the mixture was placed in an argon atmosphere and heated to 150°C until it reached a viscous state. After cooling, the desired result was obtained. Figure 2 The composite magnetic material shown.

[0059] The composite magnetic material obtained above was dispersed in water while stirring to obtain a suspension. Then, glue with a viscosity of 1 kgl / inch was added to it to obtain a mixture, which was then stored at 65°C to prevent curing. Next, commercially available KH-407 epoxy molding compound was taken and mixed with the mixture, and stirred evenly to obtain a molding compound composition. The mass ratio of epoxy molding compound to composite magnetic material in the molding compound composition was 6:1, and the mass ratio of glue to composite magnetic material was 7:1.

[0060] Example 2

[0061] Example 2 was carried out in accordance with Example 1, except that the mass ratio of graphene group to zinc sulfide nanomaterial was 5:1.

[0062] Example 3

[0063] Example 3 was carried out in accordance with Example 1, except that the mass ratio of graphene group to zinc sulfide nanomaterial was 3:1.

[0064] Example 4

[0065] Example 4 was carried out in accordance with Example 1, except that the second formulation was added to polymethyl methacrylate colloidal crystals and heated at 180°C for 24 hours. The equatorial radius of the porous carbon rod was 100 nm, the polar radius was 200 nm, and the pore diameter was 14 nm. In addition, the particle size of the zinc sulfide nanomaterial was 1.7 nm.

[0066] Example 5

[0067] Example 5 was carried out in accordance with Example 1, except that the second formulation was added to polymethyl methacrylate colloidal crystals and heated at 220°C for 22 hours. The equatorial radius of the porous carbon rod was 110 nm, the polar radius was 210 nm, and the pore diameter was 17 nm. In addition, the particle size of the zinc sulfide nanomaterial was 1.7 nm.

[0068] Example 6

[0069] Example 6 was carried out in accordance with Example 1, except that the second formulation was added to polymethyl methacrylate colloidal crystals and heated at 220°C for 24 hours. The equatorial radius of the porous carbon rod was 120 nm, the polar radius was 220 nm, and the pore diameter was 22 nm. In addition, the particle size of the zinc sulfide nanomaterial was 2 nm.

[0070] Example 7

[0071] Example 7 was carried out in accordance with Example 1, except that the mass ratio of epoxy molding compound to composite magnetic material in the molding compound composition was 5:1, and the mass ratio of adhesive to composite magnetic material was 6:1.

[0072] Example 8

[0073] Example 8 was carried out in accordance with Example 1, except that the mass ratio of epoxy molding compound to composite magnetic material in the molding compound composition was 7:1, and the mass ratio of adhesive to composite magnetic material was 8:1.

[0074] Comparative Example 1

[0075] Comparative Example 1 was carried out in accordance with Example 1, except that the second formulation was added to polymethyl methacrylate colloidal crystals and heated at 150°C for 24 hours to obtain a three-dimensional arrangement of spherical graphene groups.

[0076] Comparative Example 2

[0077] Comparative Example 2 was carried out in accordance with Example 1, except that the second formulation was added to polymethyl methacrylate colloidal crystals and heated at 190°C for 18 hours to obtain a three-dimensional arrangement of rod-shaped graphene groups.

[0078] Comparative Example 3

[0079] Comparative Example 3 was carried out in accordance with Example 1, except that carbon nanotubes were used instead of graphene to obtain a group of carbon nanotubes arranged in three dimensions of porous carbon nanotube ellipsoids.

[0080] The molding compound compositions obtained in Examples 1-8 and Comparative Examples 1-3 were used to prepare molding films using the same process. The microwave absorption properties of the molding films obtained in Examples 1-8 and Comparative Examples 1-3 were tested. The test methods are shown below, and the test results are shown in Table 1.

[0081] Absorption performance: Refer to GB / T32596 to test absorption bandwidth and insertion loss.

[0082] Table 1

[0083] Example 1 0.015-1 25-29 Example 2 0.015-1 23-28 Example 3 0.015-1 24-28 Example 4 0.02-1 21-26 Example 5 0.02-1 21-25 Example 6 0.03-1 20-25 Example 7 0.015-1 23-28 Example 8 0.015-1 25-30 Comparative Example 1 6-14 14-18 Comparative Example 2 6-14 14-19 Comparative Example 3 6-14 13-17

[0084] Application Experiment:

[0085] The chip is packaged using a SiP (System-in-Package) process, which includes: pre-packaging testing, chip dicing, chip bonding, wire bonding, molding, and shaping. The molding process uses the molding compound composition obtained in Example 1 of this invention, resulting in Sample 1.

[0086] Blank sample: The same encapsulation process is used for encapsulation, in which the plastic encapsulation directly uses commercially available KH-407 epoxy encapsulating material.

[0087] Sample 1 and the blank sample were measured in an electromagnetic compatibility semi-anechoic chamber, and the results are as follows: Figure 3 He Ru Figure 4 As shown, from Figure 3 and Figure 4 It can be seen that the electromagnetic radiation of sample 1 is significantly reduced.

[0088] In addition, sample 1 and the blank sample were measured using a LISN power conduction measurement device, and the results are as follows. Figure 5 He Ru Figure 6 As shown, from Figure 5 and Figure 6 It can be seen that the electromagnetic conduction interference of sample 1 is significantly reduced.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A molding compound composition, characterized in that, The invention includes epoxy molding compound and composite magnetic material. The composite magnetic material comprises a composite material composed of porous graphene ellipsoids and zinc sulfide nanomaterials, and an organic insulating material coating the surface of the composite material. In the composite material, multiple porous graphene ellipsoids are arranged in an orderly manner to form a graphene group, and the zinc sulfide nanomaterials are fused into the graphene group. The equatorial radius of the porous graphene ellipsoids is 100nm-120nm, and the polar radius is 200nm-250nm.

2. The molding compound composition according to claim 1, characterized in that, In the graphene group, the porous graphene ellipsoids are arranged in a three-dimensional array.

3. The molding compound composition according to claim 1, characterized in that, The porous graphene ellipsoid has a pore size of 14nm-25nm.

4. The molding compound composition according to claim 3, characterized in that, The ratio of the particle size of the zinc sulfide nanomaterial to the pore size of the porous graphene ellipsoid is 1:8 to 1:

12.

5. The molding compound composition according to claim 1, characterized in that, In the composite magnetic material, the mass ratio of the zinc sulfide nanomaterial to the graphene group is 1:3-1:

5.

6. The molding compound composition according to claim 1, characterized in that, The mass ratio of the epoxy molding compound to the composite magnetic material is 5:1-7:

1.

7. The molding compound composition according to any one of claims 1-6, characterized in that, The molding compound composition also includes an adhesive, and the mass ratio of the adhesive to the composite magnetic material is 6:1-8:

1.

8. The molding compound composition according to claim 7, characterized in that, The viscosity of the adhesive is 0.8 kgl / inch to 1.5 kgl / inch.

9. The use of a molding compound composition as described in any one of claims 1-8 in SIP packaging.

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