阴极环围挡内部填充柔性树脂胶的micro LED及其制备方法
By setting openings in the cathode ring enclosure structure and filling them with flexible resin adhesive, the problems of weak bonding and peeling off in Micro LED display devices are solved, achieving stable bonding and reducing structural damage.
CN116544260BActive Publication Date: 2026-07-17ANHUI SEMICON INTEGRATED DISPLAY TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ANHUI SEMICON INTEGRATED DISPLAY TECH CO LTD
- Filing Date
- 2023-05-24
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing Micro LED display devices cannot be filled with flexible resin adhesive in monolithic integration processes, resulting in weak bonding between the P electrode and the IC anode, stress damage during peeling, and easy detachment of pixels.
Method used
An opening is made at the diagonal position of the cathode ring enclosure structure, filled with flexible resin glue and diffused to form an enclosure structure to enhance the bonding strength, and the stress is adjusted by the expansion and contraction of the thermosetting resin to prevent detachment.
Benefits of technology
This achieves strong bonding of each pixel, reduces external force damage, and enhances the stability and reliability of Micro LED.
✦ Generated by Eureka AI based on patent content.
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Figure CN116544260B_ABST
Abstract
本发明公开了阴极环围挡内部填充柔性树脂胶的micro LED及其制备方法，其中，阴极环设置成围挡结构；在阴极环的一个对角位置，避开键合点设置开口结构；在键合后，向所述的围挡结构的内部填充柔性绝缘树脂胶材料，且充分扩散浸润填满整个空腔。采用上述技术方案，在键合后向其内部填充柔性绝缘树脂胶材料且充分扩散浸润填满空腔，进一步增强柔性绝缘树脂胶材料的充分扩散浸润填充的效果；避免产生扩张力将LED与IC顶开；LED与IC会受到向内收缩的力从而增强键合效果、避免键合不良；有效减少内部结构损伤，衬底剥离时像素点之间被树脂连接加固，有效避免像素点脱落。
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