An infrared picosecond laser emitting lens with rapid heat dissipation function

By introducing a heat exchange mechanism and a negative pressure system into the infrared picosecond laser's emitting lens, the problems of slow heat dissipation and dust adhesion were solved, enabling rapid heat dissipation and cleaning, extending lens life, and improving work efficiency.

CN116544756BActive Publication Date: 2025-11-14GWEIKE TECH CO LTD
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Patent Information

Application Number
CN202310379223.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-04-06
Publication Date
2025-11-14
Estimated Expiration
2043-04-06

AI Technical Summary

Technical Problem

During operation, the heat generated by the lens of an existing infrared picosecond laser is partially and slowly dissipated, while the other half is difficult to dissipate quickly. In addition, dust easily adheres to the lens, affecting the lens life and working efficiency.

Method used

The heat exchange mechanism includes a sleeve, a snap ring, copper tubes, thermally conductive silicone, and a negative pressure unit. It uses negative pressure to draw in air and thermally conductive silicone to absorb heat. Combined with heat-absorbing fins to increase the heat exchange area, and uses negative pressure tubes to absorb dust and filter cloth to filter dust, it achieves rapid heat dissipation and cleaning.

Benefits of technology

It improves the lens's heat dissipation efficiency, reduces dust adhesion, extends the lens's lifespan, and enhances work efficiency and practicality.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses an infrared picosecond laser emitting lens with rapid heat dissipation function, relating to the field of infrared picosecond laser technology. The infrared picosecond laser emitting lens with rapid heat dissipation function includes a connector, a connecting wire, and an emitting head. The interior of the connector and the interior of the connecting wire are fixedly connected, and the bottom of the connector and the top of the emitting head are fixedly connected. This infrared picosecond laser emitting lens, by incorporating heat exchange fins, a connecting rod, and a spring, allows the connecting pin to engage with the inner wall of the bayonet along the movable groove when the outer edge of the emitting head is subjected to impact during operation. Simultaneously, the interior of the sleeve compresses the heat exchange fins, and the heat exchange fins compress the spring along the outer wall of the connecting rod, causing the spring to rebound and weaken the pushing force. This effectively protects the emitting head. In addition to increasing the heat exchange area, it also provides shock absorption and buffering, thereby improving practicality.
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Description

Technical Field

[0001] This invention relates to the field of infrared picosecond laser technology, specifically to an infrared picosecond laser emitting lens with rapid heat dissipation function. Background Technology

[0002] The infrared picosecond laser is an infrared picosecond laser with a pulse width of picosecond-level ultrashort pulse width, adjustable repetition frequency, and high pulse energy. It has increasingly wide applications in biomedicine, optical parametric oscillation, and biological microscopy, and is gradually becoming an increasingly important tool in modern biological imaging and analysis systems.

[0003] 1. An infrared picosecond laser contains a laser head. The laser head can also refer to a component containing a complete optical system (including the laser resonator), excluding power-providing devices and fiber-coupled pump diodes. In laser processing, such as laser cutting, the laser head is the component that introduces the laser beam into the working area. A laser cutting head does not include the laser source, but includes focusing optics, a protective glass, and other accessories that introduce airflow into the cutting area. Light enters the laser head through a high-power optical cable.

[0004] 2. Through the heat dissipation mechanism, when the lens body is in normal use, the power supply component in the heat dissipation mechanism can drive the air duct to drive the cooling fan to tilt away from the radiating end of the lens body without affecting the normal light emission of the lens body. In this way, the cooling fan can output a large amount of air force to the radiating end of the lens body in real time along with the normal use of the lens body, which facilitates the real-time heat dissipation and cooling of the radiating lens inside the lens body, reduces the accumulation of heat on the radiating lens, and improves the service life of the radiating lens.

[0005] 3. Existing laser heads are made of copper or titanium alloy. Cooling is achieved through a fan and internal lenses. However, due to the limited contact area of ​​the laser head, airflow can only contact one side. As a result, only half of the heat accumulated in the laser head and lenses can be dissipated, while the other half dissipates slowly. Furthermore, the existing laser heads cannot quickly dissipate heat with the fan. Additionally, existing laser heads easily generate dust during operation, which adheres to the lenses. When the lenses continue to operate, half of the heat cannot be dissipated, leading to a reduction in the lifespan of the lenses. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides an infrared picosecond laser emitting lens with rapid heat dissipation function. This solves the problem that only half of the heat accumulated in the laser head and lens can be dissipated, while the other half is still dissipated slowly. In addition, existing technologies cannot quickly dissipate heat with the help of a fan. Furthermore, existing laser heads are prone to generating dust during operation, which easily adheres to the lens. When the lens continues to operate, this can easily lead to the inability to dissipate heat.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an infrared picosecond laser emitting lens with rapid heat dissipation function, comprising a connector, a connecting wire, and an emitting head. The interior of the connector and the interior of the connecting wire are fixedly connected. The bottom of the connector and the top of the emitting head are fixedly connected. A negative pressure unit is fixedly installed on the side of the connector. A gas collecting plate is snapped onto the outer wall of the negative pressure unit. An absorption tube is fixedly installed on the outer wall of the gas collecting plate. A negative pressure tube is fixedly installed at the bottom of the absorption tube. A heat exchange mechanism is sleeved on the outer wall of the emitting head. The heat exchange mechanism includes a sleeve, a snap-fit ​​interface, a snap-fit ​​ring, and a flow port. The outer wall of the emitting head and the interior of the sleeve are mutually sleeved. The connector has a snap-fit ​​interface on its bottom outer wall, and the sleeve has a flow port on its top circumferential outer wall. The inside of the sleeve and the bottom of the snap-fit ​​ring snap together, and the inside of the snap-fit ​​interface snaps together with the outer wall of the absorption tube. The snap-fit ​​ring includes a snap-fit ​​pin, an internal port, heat exchange fins, a copper tube, a sleeve cavity, and thermally conductive silicone. The snap-fit ​​pin is located on the bottom circumferential outer wall of the snap-fit ​​ring, and the internal port is located inside the snap-fit ​​pin. Heat exchange fins are movably installed on the circumferential outer wall of the copper tube, and a sleeve cavity is formed inside the copper tube. Thermally conductive silicone is attached to the inside of the sleeve cavity. By setting up a heat exchange mechanism, the heat exchange area is increased during operation, all heat can be discharged, thereby facilitating cooling and improving working efficiency.

[0008] Preferably, the air collecting plate has openings on both sides inside, and filter cloths are snapped into both sides inside the openings. By setting the filter cloths, dust can be filtered inside during operation, which facilitates subsequent cleaning and improves work efficiency.

[0009] Preferably, the negative pressure tube has an internal movable cavity, and the absorption tube has an internal heat absorption cavity. The internal size of the heat absorption cavity is twice that of the movable cavity. By setting the movable cavity, dust can be absorbed into the interior while extracting heat, which facilitates subsequent cleaning and prevents it from being copied onto the lens.

[0010] Preferably, the inside of the sleeve and the outer wall of the negative pressure machine are interlocked, and the inside of the air collecting plate is provided with a flow cavity.

[0011] Preferably, the exhaust pipe has an installation cavity inside, and the interior of the installation cavity is fixedly connected to the outer wall of the gas supply pipe.

[0012] Preferably, the outer circumferential wall of the copper tube has an installation cavity, and the interior of the installation cavity is fixedly connected to the bottom of the connecting rod.

[0013] Preferably, connecting rods are movably installed on both sides of the bottom of the heat exchange fins, and the outer wall of the spring is movably sleeved. By setting the heat exchange fins, the impact force generated by the compression can be mutually canceled by the impact force generated by the spring, thereby facilitating the protection of the launch head.

[0014] Preferably, the upper circumferential surface of the sleeve is provided with a notch, the bottom of the notch is provided with a movable groove, and a connecting pin is movably installed inside the movable groove. The outer wall of the connecting pin and the inside of the inner opening are engaged with each other. By making the sleeve movable, heat dissipation can be achieved at the same time.

[0015] This invention provides an infrared picosecond laser emitting lens with rapid heat dissipation. Compared with the prior art, it has the following advantages:

[0016] 1. The infrared picosecond laser's emitting lens, through a heat exchange mechanism, is continuously evacuated by a negative pressure unit. During this evacuation process, the air collecting plate and absorption tube draw in air. Simultaneously, when the emitting head generates heat during operation, it is absorbed by the thermally conductive silicone. This heat is then introduced into the interior of the sleeve cavity. The absorption tube creates suction during the evacuation process. The heat exchange fins installed on the outer wall of the copper tube increase the heat exchange area. When air is drawn into the sleeve cavity, the flow openings on the outer circumference of the sleeve allow cold air to be transported into the sleeve cavity. This heat exchange effectively absorbs the heat from the copper tube, preventing half of the heat from being exposed to air, thus increasing the cooling rate and improving working efficiency.

[0017] 2. The infrared picosecond laser's emitting lens uses a combination of an absorption tube and a negative pressure tube. Because the internal size of the heat absorption chamber is twice that of the moving chamber inside the negative pressure tube, when the airflow flows at high speed inside the heat absorption chamber, a negative pressure is formed in the moving chamber inside the negative pressure tube. Dust generated during the processing of the emitting head is absorbed by the negative pressure tube. During the air extraction process, not only can dust be drawn in, but heat from the lens surface can also be drawn into the interior, thereby improving work efficiency.

[0018] 3. The infrared picosecond laser's emitting lens, through the inclusion of heat exchange fins, a connecting rod, and a spring, allows the connecting pin to engage with the inner wall of the bayonet along the movable groove when the outer edge of the emitting head is subjected to impact during operation. Simultaneously, the interior of the sleeve compresses the heat exchange fins, which in turn compress the spring along the outer wall of the connecting rod. This causes the spring to rebound, weakening the pushing force and effectively protecting the emitting head. Furthermore, by increasing the heat exchange area, it also provides shock absorption and buffering, thereby improving practicality.

[0019] 4. The infrared picosecond laser emitter lens, through a negative pressure tube, transports the absorbed dust into the interior of the absorption tube, which in turn transports the dust into the interior of the air collection plate. The filter cloth filters the dust inside. When cleaning is needed, simply remove the filter cloth and clean the dust inside. This allows the mechanism to be connected during operation while simultaneously filtering and collecting dust. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the overall structure of the top of the sleeve of the present invention;

[0022] Figure 3 This is a top view of the sleeve structure of the present invention;

[0023] Figure 4 This is a schematic diagram of the overall structure of the back of the gas collection plate of the present invention;

[0024] Figure 5 This is a schematic diagram of the overall structure of the bottom of the card receiving pin of the present invention;

[0025] Figure 6 This is a schematic diagram of the overall structure of the bottom of the heat exchange fins of the present invention.

[0026] In the diagram: 1. Connector; 2. Connecting wire; 3. Emitter; 4. Negative pressure unit; 5. Sleeve; 501. Snap-fit ​​interface; 502. Flow port; 503. Snap-fit; 504. Movable groove; 505. Connecting pin; 6. Gas collecting plate; 601. Snap-fit; 602. Filter cloth; 7. Absorption pipe; 8. Negative pressure pipe; 9. Gas delivery pipe; 10. Exhaust pipe; 11. Snap-fit ​​ring; 111. Snap-fit ​​pin; 112. Internal port; 113. Copper pipe; 114. Sleeve cavity; 115. Heat exchange fin; 1151. Connecting rod; 1152. Spring; 116. Thermally conductive silicone. Detailed Implementation

[0027] The technical solutions in the embodiments of the present invention have been clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Please see Figure 1-6 This invention provides a technical solution: an infrared picosecond laser emitting lens with rapid heat dissipation function, including a connector 1, a connecting line 2, and an emitting head 3. The interior of the connector 1 and the interior of the connecting line 2 are fixedly connected. The bottom of the connector 1 and the top of the emitting head 3 are fixedly connected. A negative pressure unit 4 is fixedly installed on the side of the connector 1. A gas collecting plate 6 is snapped onto the outer wall of the negative pressure unit 4. An absorption tube 7 is fixedly installed on the outer wall of the gas collecting plate 6. A negative pressure tube 8 is fixedly installed at the bottom of the absorption tube 7. A heat exchange mechanism is sleeved on the outer wall of the emitting head 3. The heat exchange mechanism includes a sleeve 5, a snap-fit ​​interface 501, a snap-fit ​​ring 11, and a flow port 502. The outer wall of the emitting head 3 and the interior of the sleeve 5 are mutually sleeved. The bottom outer wall of the connector 1 has a snap-fit ​​interface 501. The top circumferential outer wall of the sleeve 5 has a flow port 502. The interior of the sleeve 5 and the bottom of the snap-fit ​​ring 11 are mutually snapped. The interior of interface 501 and the outer wall of absorption tube 7 are interlocked. The interlocking ring 11 includes an interlocking pin 111, an internal opening 112, a heat exchange fin 115, a copper tube 113, a sleeve 114, and thermally conductive silicone 116. The interlocking pin 111 is located on the bottom circumferential outer wall of the interlocking ring 11, and the internal opening 112 is located inside the interlocking pin 111. The heat exchange fin 115 is movably installed on the circumferential outer wall of the copper tube 113. The sleeve 114 is opened inside the copper tube 113, and the thermally conductive silicone 116 is attached inside the sleeve 114. Connecting rods 1151 are movably installed on both sides of the bottom of the heat exchange fin 115. The outer wall of the spring 1152 is movably sleeved. A snap 503 is opened on the circumferential upper surface of the sleeve 5. A movable groove 504 is opened at the bottom of the snap 503. A connecting pin 505 is movably installed inside the movable groove 504. The outer wall of the connecting pin 505 and the interior of the internal opening 112 are interlocked.

[0029] Specifically, when the heat exchange mechanism is needed during operation, firstly, the internal opening 112 of the snap-fit ​​pin 111 and the outer wall of the connecting pin 505 are snapped together. This allows the snap-fit ​​ring 11 and the sleeve 5 to be assembled together. Then, the interior of the sleeve cavity 114 inside the snap-fit ​​ring 11 is sleeved with the outer wall of the emitter head 3. During the sleeved connection, the outer wall of the absorber tube 7 is snapped with the interior of the snap-fit ​​interface 501. Then, the negative pressure machine 4 is started. During the start-up process, the negative pressure machine 4 will continuously draw air. During the air drawing process, the air collecting plate 6 and the absorber tube 7 will draw in air. At the same time, when the emitter head 3 generates heat during operation, it will be absorbed by the thermally conductive silicone 116. At this time, the heat will be introduced into the interior of the sleeve cavity 114. When the negative pressure machine 4 draws air, the absorber tube 7 will form a suction force, which is then transferred to the interior of the sleeve cavity 114. The heat exchange fins 115 installed on the outer wall of the copper tube 113 can increase the heat exchange area. When air is drawn into the tube, the flow port 502 on the outer circumference of the sleeve 5 allows the cold air to be transported into the tube 5. With the heat exchange, the heat absorbed by the copper tube 113 is carried away and transported into the negative pressure machine 4. When the outer side of the emitter head 3 is impacted during operation, the connecting pin 505 will fit against the inner wall of the movable groove 504 and the bayonet 503. At the same time, the inside of the sleeve 5 can squeeze the heat exchange fins 115. When squeezed, the heat exchange fins 115 will squeeze the spring 1152 along the outer wall of the connecting rod 1151, causing the spring 1152 to generate a rebound force, which will weaken the pushing force, thereby effectively protecting the emitter head 3.

[0030] In this embodiment, the gas collecting plate 6 has openings 601 on both sides inside, and filter cloth 602 is snapped into both sides inside the openings 601. The inside of the openings 601 is snapped into the outer wall of the negative pressure machine 4. The gas collecting plate 6 has a flow cavity inside, the negative pressure pipe 8 has a movable cavity inside, and the absorption pipe 7 has a heat absorption cavity inside. The inside of the heat absorption cavity is twice the size of the movable cavity.

[0031] Specifically, during the evacuation process of the absorption tube 7, because the internal size of the heat absorption chamber is twice that of the moving chamber inside the negative pressure tube 8, the high-speed flow of air inside the heat absorption chamber causes a negative pressure to be formed in the moving chamber inside the negative pressure tube 8. The dust generated during the processing of the emitter 3 is absorbed by the negative pressure tube 8, and then the absorbed dust is transported into the interior of the absorption tube 7 through the negative pressure tube 8. The absorption tube 7 then transports the dust into the interior of the gas collecting plate 6, where the filter cloth 602 filters the dust. When cleaning is required, the filter cloth 602 can be disassembled and the dust inside can be cleaned.

[0032] S1 preparation steps: Connect the bottom of the snap ring 11 and the top of the sleeve 5 together, then connect the inside of the snap ring 11 and the outer wall of the transmitter 3 together, then connect the snap interface 501 and the inside of the absorption tube 7 together, and then connect the inside of the gas collecting plate 6 and the outer wall of the negative pressure machine 4 together.

[0033] S2 Working steps: Start the negative pressure machine 4. During the start-up process, a negative pressure will be formed inside the absorption pipe 7. At this time, the snap ring 11 inside the sleeve 5 will absorb heat. During the air extraction process, the sleeve 5 can absorb the heat inside. At the same time, a negative pressure force will be generated inside the negative pressure pipe 8, which can allow dust to enter and exit its own interior. The air collecting plate 6 can filter it inside and block it. At the same time, when it is subjected to impact force during operation, the heat exchange fins 115 can effectively reduce the impact force.

[0034] S3 End Steps: When it is necessary to clean the dust inside the sleeve 5, simply pull the snap ring 11 out of the sleeve 5 and then clean the outer wall of the sleeve 5. At the same time, when it is necessary to clean the collected dust, simply remove the air collecting plate 6 from the inside of the negative pressure machine 4, and then remove the filter cloth 602 inside the air collecting plate 6 to guide the dust inside the air collecting plate 6 out.

[0035] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0037] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An infrared picosecond laser emitting lens with rapid heat dissipation function, comprising a connector (1), a connecting wire (2), and an emitting head (3), wherein the interior of the connector (1) and the interior of the connecting wire (2) are fixedly connected, and the bottom of the connector (1) and the top of the emitting head (3) are fixedly connected, characterized in that: A negative pressure machine (4) is fixedly installed on the side of the connector (1), a gas collecting plate (6) is snapped onto the outer wall of the negative pressure machine (4), an absorption pipe (7) is fixedly installed on the outer wall of the gas collecting plate (6), a negative pressure pipe (8) is fixedly installed at the bottom of the absorption pipe (7), and a heat exchange mechanism is sleeved on the outer wall of the emitter (3). The heat exchange mechanism includes a sleeve (5), a snap-fit ​​interface (501), a snap-fit ​​ring (11), and a flow port (502). The outer wall of the emitter (3) and the inside of the sleeve (5) are connected to each other. The bottom outer wall of the connector (1) is provided with a snap-fit ​​interface (501). The top circumferential outer wall of the sleeve (5) is provided with a flow port (502). The inside of the sleeve (5) and the bottom of the snap-fit ​​ring (11) are connected to each other. The inside of the snap-fit ​​interface (501) and the outer wall of the absorption tube (7) are connected to each other. The snap ring (11) includes a snap pin (111), an internal opening (112), heat exchange fins (115), a copper tube (113), a sleeve (114), and thermally conductive silicone (116). The snap pin (111) is located on the bottom circumferential outer wall of the snap ring (11), the internal opening (112) is located inside the snap pin (111), the heat exchange fins (115) are movably installed on the circumferential outer wall of the copper tube (113), the sleeve (114) is opened inside the copper tube (113), and the thermally conductive silicone (116) is attached to the inside of the sleeve (114). The sleeve (5) has a bayonet (503) on its circumferential upper surface, and a movable groove (504) is provided at the bottom of the bayonet (503). A connecting pin (505) is movably installed inside the movable groove (504), and the outer wall of the connecting pin (505) and the inside of the inner opening (112) are engaged with each other. The gas collecting plate (6) has openings (601) on both sides inside, and filter cloth (602) is snapped into both sides inside the openings (601). The negative pressure tube (8) has an open movable cavity inside, and the absorption tube (7) has an open heat absorption cavity inside. The internal size of the heat absorption cavity is twice that of the open movable cavity.

2. The infrared picosecond laser emitting lens with rapid heat dissipation function according to claim 1, characterized in that: Connecting rods (1151) are movably installed on both sides of the bottom of the heat exchange fin (115), and the outer wall of the spring (1152) is movably sleeved.

3. The infrared picosecond laser emitting lens with rapid heat dissipation function according to claim 1, characterized in that: The copper tube (113) has an installation cavity inside its circumference, and the interior of the installation cavity is fixedly connected to the bottom of the connecting rod (1151).

4. The infrared picosecond laser emitting lens with rapid heat dissipation function according to claim 3, characterized in that: The inside of the sleeve (601) and the outer wall of the negative pressure machine (4) are interlocked, and the inside of the air collecting plate (6) is provided with a flow cavity.

5. The infrared picosecond laser emitting lens with rapid heat dissipation function according to claim 1, characterized in that: The negative pressure machine (4) has a gas supply pipe (9) fixedly installed on its side, and an exhaust pipe (10) fixedly installed on the top of the gas supply pipe (9). An installation cavity is opened inside the exhaust pipe (10), and the inside of the installation cavity is fixedly connected to the outer wall of the gas supply pipe (9).

Citation Information

Patent Citations

  • Laser semiconductor packaging protection structure

    CN211238807U

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    CN212343007U