Display panel, display device and preparation method of display panel

Abstract

The application relates to the technical field of display, and discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a display area and a non-display area, and further comprises a substrate, a first insulating layer, a first metal wiring layer, a second metal wiring layer and a second insulating layer arranged in the non-display area. The first insulating layer is arranged on the substrate, the first metal wiring layer is arranged between the first insulating layer and the substrate, the first metal layer comprises a first metal wire, the second metal wiring layer is arranged on the first insulating layer, the second metal layer comprises a second metal wire, the first metal wire and the second metal wire are arranged at intervals in the orthographic projection on the substrate, the second insulating layer is arranged on the second metal wiring layer, the side surface of the second insulating layer, which is away from the substrate, corresponds to a first position of the first metal wire and the second metal wire, and the first position is flush with other positions of the side surface of the second insulating layer, which is away from the substrate. The display panel can prevent film separation and failure.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic light-emitting display (OLED) is a highly promising display technology. OLED displays not only possess excellent display performance but also feature self-illumination, simple structure, ultra-thinness, fast response speed, wide viewing angle, low power consumption, and the ability to achieve flexible displays. They are hailed as "dream displays" and have gained favor with major display manufacturers, becoming a mainstay in the display technology field.

[0003] The array film layers of existing OLED display devices exhibit uneven stress distribution, which leads to film layer separation and failure. Summary of the Invention

[0004] The purpose of this invention is to provide a display panel, a display device, and a method for manufacturing the display panel, which solves the technical problem in existing display panels where the setting of the first and second metal lines leads to significant uneven stress distribution at the junction of the encapsulation layer and the third metal layer, resulting in film separation and failure, and posing a risk of breakage.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] This invention provides a display panel, including a display area and a non-display area, wherein the display panel further includes the following structure disposed in the non-display area:

[0007] substrate;

[0008] A first insulating layer is disposed on the substrate;

[0009] A first metal trace layer is disposed between the first insulating layer and the substrate, and the first metal trace layer includes a first metal line;

[0010] A second metal trace layer is disposed on the first insulating layer. The second metal trace layer includes second metal lines, and the second metal lines and the first metal lines are arranged at intervals on the orthographic projection of the first metal lines onto the substrate.

[0011] A second insulating layer is disposed on the second metal trace layer. The position of the side surface of the second insulating layer away from the substrate, corresponding to the first metal line and the second metal line, is a first position. The first position is flush with other positions of the side surface of the second insulating layer away from the substrate.

[0012] The first position is the location on the side of the second insulating layer of the display panel facing away from the substrate, corresponding to the first metal line and the second metal line. The first position is flush with other positions on the side of the second insulating layer facing away from the substrate, thereby preventing the protruding structure of the first metal line and the second metal line from being conducted upward, thus preventing the phenomenon of uneven stress distribution at the junction of the third metal layer and the encapsulation layer on the second insulating layer, and thus preventing the film layer separation and failure.

[0013] As a preferred embodiment of the above-mentioned display panel, an encapsulation layer is provided on the second insulating layer, and the surface of the third encapsulation layer facing away from the substrate is a flat surface;

[0014] Preferably, a third metal layer is provided between the second insulating layer and the encapsulation layer, and the surface of the third metal layer facing away from the substrate is a flat surface.

[0015] The third metal layer and the encapsulation layer on the second insulating layer have flat surfaces on the side facing away from the substrate to avoid uneven stress distribution between them, which could lead to film separation.

[0016] As a preferred embodiment of the above-mentioned display panel, the thickness of the first metal line is h1, and the thickness of the second metal line is h2;

[0017] The height difference between the surface of the first insulating layer on the first metal wire that is away from the substrate and the surface of the second insulating layer that is away from the substrate is H1.

[0018] The height difference between the side surface of the second metal wire facing away from the substrate and the side surface of the second insulating layer facing away from the substrate is H2.

[0019] The maximum thickness of the second insulating layer is H3, where H3 = H1 + h1 = H2 + h2;

[0020] If h1≥h2, then the minimum thickness of the second insulating layer is H1, satisfying: h1 / 2

[0021] If h1 < h2, then the minimum thickness of the second insulating layer is H2, satisfying: h1 / 2 < H2 < 2h1.

[0022] The above settings ensure that the second insulating layer can perform its insulating function while avoiding the situation where the thickness of the display panel increases due to the excessive thickness of the second insulating layer.

[0023] As a preferred embodiment of the above-mentioned display panel, the first insulating layer and / or the second insulating layer are inorganic layers.

[0024] ​The first and / or second insulating layers are inorganic layers to serve the purpose of insulation.

[0025] The present invention also provides a display device, including the display panel described above.

[0026] The display device, through the aforementioned display panel, can avoid stress concentration in the film layer, effectively reducing the risk of film layer separation and breakage.

[0027] The present invention also provides a method for manufacturing a display panel, comprising the following steps:

[0028] A first metal trace layer is fabricated on a substrate, the first metal trace layer comprising a first metal line;

[0029] A first insulating layer is prepared on the first metal trace layer;

[0030] A second metal trace layer is prepared on a first insulating layer. The second metal trace layer includes a second metal line, and the second metal line is arranged at intervals with the orthographic projection of the first metal line on the substrate.

[0031] A second insulating layer is prepared on the second metal trace layer, and a protrusion structure is formed on the side surface of the second insulating layer opposite to the substrate. The position where the protrusion structure is formed on the second insulating layer is the first position.

[0032] The second insulating layer is planarized so that the first position is flush with other positions on the side surface of the second insulating layer that are away from the substrate.

[0033] The method for manufacturing this display panel involves planarizing the second insulating layer. The first position is the position on the side of the second insulating layer facing away from the substrate, corresponding to the first metal line and the second metal line. The first position is flush with other positions on the side of the second insulating layer facing away from the substrate. This avoids significant uneven stress distribution at the junction of the third metal layer and the encapsulation layer on the second insulating layer, thereby preventing film separation and failure.

[0034] As a preferred embodiment of the above-mentioned method for manufacturing the display panel, a third metal layer is prepared on the second insulating layer after planarization, and an encapsulation layer is prepared on the third metal layer.

[0035] The surfaces of the third metal layer and the encapsulation layer facing away from the substrate are both flat to avoid uneven stress distribution between them, which could lead to film separation.

[0036] As a preferred embodiment of the above-mentioned method for manufacturing the display panel, the planarization process of the second insulating layer includes:

[0037] At least the protruding structure is removed so that the minimum thickness and maximum thickness H3 of the second insulating layer satisfy the following conditions:

[0038] The thickness of the first metal wire is h1, and the thickness of the second metal wire is h2;

[0039] The height difference between the side surface of the first insulating layer disposed on the first metal wire that is away from the substrate and the side surface of the second insulating layer that is away from the substrate is H1.

[0040] The height difference between the second metal line on the side surface away from the substrate and the second insulating layer on the side surface away from the substrate is H2.

[0041] The maximum thickness of the second insulating layer is H3, where H3 = H1 + h1 = H2 + h2;

[0042] If h1≥h2, then the minimum thickness of the second insulating layer is H1, satisfying: h1 / 2

[0043] If h1 < h2, then the minimum thickness of the second insulating layer is H2, satisfying: h1 / 2 < H2 < 2h1.

[0044] The second insulating layer is planarized by at least removing the protruding structures.

[0045] As a preferred embodiment of the above-mentioned method for manufacturing the display panel, the planarization process for the second insulating layer includes:

[0046] The protruding structure is removed, and other parts of the second insulating layer are also removed, so that the second insulating layer is thinned as a whole.

[0047] By removing the protruding structure and other parts of the second insulating layer, the overall thickness of the second insulating layer is reduced, ensuring that the planarized second insulating layer meets the thickness requirements.

[0048] As a preferred embodiment of the above-mentioned method for manufacturing the display panel, the planarization process includes an etching process.

[0049] The planarization of the second insulating layer is achieved through etching, which is easy to operate and implement.

[0050] The beneficial effects of this invention are:

[0051] ​The display panel proposed in this invention has a first position where the second insulating layer on the side facing away from the substrate corresponds to the first metal line and the second metal line. The first position is flush with other positions on the side of the second insulating layer facing away from the substrate, thereby preventing the protruding structure of the first metal line and the second metal line from being conducted upwards. This avoids the phenomenon of uneven stress distribution at the junction of the third metal layer and the encapsulation layer on the second insulating layer, thereby preventing the separation and failure of the third metal layer and the encapsulation layer and reducing the risk of film layer breakage.

[0052] The display device proposed in this invention can avoid stress concentration in the film layer through the aforementioned display panel, effectively reducing the risk of film layer separation and breakage.

[0053] The method for manufacturing a display panel proposed in this invention involves planarizing the second insulating layer. The first position is defined as the position on the side of the second insulating layer facing away from the substrate, corresponding to the first metal line and the second metal line. The first position is flush with other positions on the side of the second insulating layer facing away from the substrate. This avoids significant uneven stress distribution at the junction of the third metal layer and the encapsulation layer on the second insulating layer, thereby preventing film separation and failure, and reducing the risk of film breakage. Attached Figure Description

[0054] Figure 1 This is a cross-sectional view of a display panel provided by existing technology;

[0055] Figure 2 This is a cross-sectional view of the display panel provided by the present invention;

[0056] Figure 3 This is a cross-sectional view of the display panel provided by the present invention after removing the substrate, the third metal layer and the encapsulation layer (the cross-sectional lines are omitted in the cross-sectional view);

[0057] Figure 4 This is a flowchart of the method for manufacturing a display panel provided by the present invention.

[0058] In the picture:

[0059] Figure 1 middle:

[0060] 1' Substrate; 2' First insulating layer; 31' First metal line; 41' Second metal line; 5' Second insulating layer; 6' Third metal layer; 7' Encapsulation layer;

[0061] Figure 2-3 middle:

[0062] 1. Substrate; 2. First insulating layer; 31. First metal line; 41. Second metal line; 5. Second insulating layer; 6. Third metal layer; 7. Encapsulation layer. Detailed Implementation

[0063] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0064] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0065] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0066] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0067] like Figure 1As shown, the lower bezel of the display panel is stacked with a substrate 1', a first metal line 31', a first insulating layer 2', a second metal line 41', a second insulating layer 5', a third metal layer 6', and an encapsulation layer 7'. Because the first metal line 31' and the second metal line 41' are spaced apart, the film deposited above them exhibits unevenness. This uneven wiring structure leads to significant stress unevenness at the interface between the encapsulation layer 7' and the third metal layer 6', potentially causing separation and failure of the encapsulation layer 7' and the third metal layer 6', posing a risk of film breakage.

[0068] To address the aforementioned problems, this embodiment provides a display panel, such as... Figure 2 As shown, the display panel includes a display area and a non-display area. The lower bezel of the display panel is stacked with a substrate 1, a first metal trace layer, a first insulating layer 2, a second metal trace layer, a second insulating layer 5, a third metal layer 6, and an encapsulation layer 7. The lower bezel is located in the non-display area. The first insulating layer 2 is disposed on the substrate 1. The first metal trace layer is disposed between the first insulating layer 2 and the substrate 1. The first metal trace layer includes multiple spaced first metal lines 31. The second metal trace layer is disposed on the first insulating layer 2. The second metal trace layer includes multiple spaced second metal lines 41. The second metal lines 41 and the first metal lines 31 are spaced apart in their orthogonal projections on the substrate 1. The second insulating layer 5 is disposed on the second metal trace layer. The position of the side surface of the second insulating layer 5 facing away from the substrate 1, corresponding to the first metal lines 31 and the second metal lines 41, is the first position. The first position is flush with other positions on the side surface of the second insulating layer 5 facing away from the substrate 1. A third metal layer 6 is disposed on the second insulating layer 5, and an encapsulation layer 7 is disposed on the third metal layer 6. The surfaces of the third metal layer 6 and the encapsulation layer 7 facing away from the substrate 1 are both flat surfaces.

[0069] The first position is located on the side of the second insulating layer 5 facing away from the substrate 1, corresponding to the first metal line 31 and the second metal line 41. The first position is flush with other positions on the side of the second insulating layer 5 facing away from the substrate 1, thereby preventing the protruding structure of the first metal line 31 and the second metal line 41 from being transmitted upwards. This also prevents the appearance of significant uneven stress distribution at the junction of the third metal layer 6 and the encapsulation layer 7 on the second insulating layer 5, thereby preventing the separation and failure of the third metal layer 6 and the encapsulation layer 7, and thus preventing film layer breakage.

[0070] Optionally, substrate 1 can be a polyimide (PI) substrate, or other organic substrates, such as PET substrates, PMMA substrates, etc. This embodiment is only for illustrative purposes and is not intended to be limited thereto. In practical applications, it can be reasonably set according to requirements.

[0071] In this embodiment, the first metal line 31 and the second metal line 41 refer to signal lines that can provide display signals to the display area. The specific type of signal line can be set according to the requirements.

[0072] Optionally, the first insulating layer 2 may include one layer or multiple layers. Any material located between the first metal wire 31 and the second metal wire 41, providing insulation between the first metal wire 31 and the second metal wire 41, can serve as the first insulating layer 2. The second insulating layer 5 may include one layer or multiple layers.

[0073] Preferably, the first insulating layer 2 and / or the second insulating layer 5 are inorganic layers. In this embodiment, both the first insulating layer 2 and the second insulating layer 5 are inorganic layers, which are convenient to prepare and serve the purpose of insulation.

[0074] Furthermore, such as Figure 3 As shown, the thickness of the first metal line 31 is h1, and the thickness of the second metal line 41 is h2; the height difference between the side surface of the first insulating layer 2 facing away from the substrate 1 and the side surface of the second insulating layer 5 facing away from the substrate 1 on the first metal line 31 is H1; the height difference between the side surface of the second metal line 41 facing away from the substrate 1 and the side surface of the second insulating layer 5 facing away from the substrate 1 is H2; the maximum thickness of the second insulating layer 5 is H3, where H3 = H1 + h1 = H2 + h2;

[0075] If h1≥h2, then the minimum thickness of the second insulating layer 5 is H1, satisfying: h1 / 2

[0076] If h1 < h2, then the minimum thickness of the second insulating layer 5 is H2, satisfying: h1 / 2 < H2 < 2h1.

[0077] The minimum thickness of the second insulating layer 5 is limited by the above formula, which can ensure that the second insulating layer 5 plays an insulating role. That is, it can avoid the situation where the second metal line 41 cannot be insulated from the third metal layer 6 due to the minimum thickness of the second insulating layer 5 being too small; it can also avoid the situation where the thickness of the display panel is increased due to the thickness of the second insulating layer 5 being too large.

[0078] Optionally, the encapsulation layer 7 can be made of inorganic materials or a combination of organic and inorganic materials. The encapsulation method can be one or more of the following: CVD encapsulation, IJP encapsulation, ALD encapsulation, ILD encapsulation, UV encapsulation, Frit encapsulation, or TEE encapsulation. The present invention does not specifically limit the specific encapsulation method.

[0079] This embodiment also provides a display device, including the display panel described above. This display device, through the aforementioned display panel, can avoid stress concentration in the film layer, effectively reducing the risk of film layer separation and breakage. ​

[0080] This embodiment also provides a method for manufacturing a display panel, used to manufacture the above-mentioned display panel, such as... Figure 4 As shown, the method for manufacturing the display panel includes the following steps:

[0081] S1. A first metal trace layer is prepared on substrate 1. The first metal trace layer includes a first metal line 31.

[0082] A substrate 1 is provided. The substrate 1 can be a polyimide (PI) substrate or other organic substrates, such as PET substrates, PMMA substrates, etc. This embodiment is only for illustrative purposes and is not limited thereto. In actual applications, it can be reasonably set according to the requirements.

[0083] A first metal trace layer is fabricated on substrate 1. The first metal trace layer includes a plurality of spaced first metal lines 31, which are used to conduct signals to the display area.

[0084] S2. Prepare a first insulating layer 2 on the first metal trace layer.

[0085] Specifically, the first insulating layer 2 covers the first metal trace layer and at least partially covers the substrate 1.

[0086] S3. A second metal trace layer is prepared on the first insulating layer 2. The second metal trace layer includes a second metal line 41, and the second metal line 41 and the first metal line 31 are arranged alternately on the substrate 1 according to their orthogonal projections.

[0087] The first insulating layer 2 ensures that the first metal trace layer and the second metal trace layer are not on the same layer, thereby achieving insulation between the first metal line 31 and the second metal line 41 and avoiding signal crosstalk. In this embodiment, the orthographic projections of the second metal line 41 and the first metal line 31 on the substrate 1 are arranged alternately.

[0088] S4. A second insulating layer 5 is prepared on the second metal trace layer. A raised structure is formed on the side surface of the second insulating layer 5 away from the substrate 1. The position where the raised structure is formed on the second insulating layer 5 is the first position.

[0089] The second insulating layer 5 is provided to insulate the second metal wire 41 from the upper third metal layer 6. Due to the arrangement of the first metal wire 31 and the second metal wire 41, a protruding structure is formed at the corresponding positions of the first metal wire 31 and the second metal wire 41 on the second insulating layer 5. The position of the protruding structure is the first position.

[0090] S5. Perform a planarization process on the second insulating layer 5 so that the first position is flush with other positions on the side surface of the second insulating layer 5 that is away from the substrate 1.

[0091] The second insulating layer 5 is planarized to make the surface of the second insulating layer 5 facing away from the substrate 1 flat, so as to prevent the protrusion structure from being conducted upward due to the arrangement of the first metal line 31 and the second metal line 41.

[0092] S6. A third metal layer 6 is prepared on the planarized second insulating layer 5, and an encapsulation layer 7 is prepared on the third metal layer 6.

[0093] Signal conduction is achieved through the third metal layer 6, and the encapsulation layer 7 encapsulates the underlying structure, thereby preventing moisture, impurities, and other contaminants from entering the display area.

[0094] The method for manufacturing this display panel involves planarizing the second insulating layer 5. The first position is the position on the side of the second insulating layer 5 facing away from the substrate 1, corresponding to the first metal line 31 and the second metal line 41. The first position is flush with the other positions on the side of the second insulating layer 5 facing away from the substrate 1. This avoids the phenomenon of uneven stress distribution at the junction of the third metal layer 6 and the encapsulation layer 7 on the second insulating layer 5, thereby preventing the separation and failure of the third metal layer 6 and the encapsulation layer 7 and reducing the risk of film breakage.

[0095] Specifically, the second insulating layer 5 is prepared by deposition. During the preparation process, the thickness of the second insulating layer 5 is made relatively thick to ensure the realization of the subsequent planarization process.

[0096] Furthermore, the planarization process of the second insulating layer 5 includes at least the removal of protrusions, so that the minimum thickness and maximum thickness H3 of the second insulating layer 5 satisfy the following conditions (see...). Figure 3 ):

[0097] The thickness of the first metal wire 31 is h1, and the thickness of the second metal wire 41 is h2;

[0098] The height difference between the side surface of the first insulating layer 2 away from the substrate 1 and the side surface of the second insulating layer 5 away from the substrate 1 on the first metal line 31 is H1; the height difference between the side surface of the second metal line 41 away from the substrate 1 and the side surface of the second insulating layer 5 away from the substrate 1 is H2.

[0099] The maximum thickness of the second insulating layer 5 is H3, where H3 = H1 + h1 = H2 + h2;

[0100] If h1≥h2, then the minimum thickness of the second insulating layer 5 is H1, satisfying: h1 / 2

[0101] If h1 < h2, then the minimum thickness of the second insulating layer 5 is H2, satisfying: h1 / 2 < H2 < 2h1.

[0102] ​The minimum thickness of the second insulating layer 5 is limited by the above formula, which can ensure that the second insulating layer 5 plays an insulating role. That is, it can avoid the situation where the second metal line 41 cannot be insulated from the third metal layer 6 due to the minimum thickness of the second insulating layer 5 being too small; it can also avoid the situation where the thickness of the display panel is increased due to the thickness of the second insulating layer 5 being too large.

[0103] Specifically, the planarization process for the second insulating layer 5 includes removing the protruding structures; or removing the protruding structures and other parts of the second insulating layer 5 to reduce the overall thickness of the second insulating layer 5. By removing the protruding structures and other parts of the second insulating layer 5, the planarized second insulating layer 5 is guaranteed to meet the thickness requirements.

[0104] In this embodiment, the planarization process includes an etching process. The second insulating layer 5 is planarized through etching, which is easy to operate and implement. Specifically, the thinning of the second insulating layer 5 through etching is prior art and will not be described in detail here.

[0105] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area, and further includes the following structures disposed in the non-display area: substrate(1); A first insulating layer (2) is disposed on the substrate (1); A first metal trace layer is disposed between the first insulating layer (2) and the substrate (1), and the first metal trace layer includes a first metal line (31). The second metal trace layer is disposed on the first insulating layer (2). The second metal trace layer includes a second metal line (41). The second metal line (41) and the first metal line (31) are arranged at intervals on the orthogonal projection of the second metal line (41) and the first metal line (31) on the substrate (1). and The second insulating layer (5) is disposed on the second metal trace layer. The position of the side surface of the second insulating layer (5) away from the substrate (1) corresponding to the first metal line (31) and the second metal line (41) is the first position. The first position is flush with other positions of the side surface of the second insulating layer (5) away from the substrate (1). The thickness of the first metal wire (31) is h1, and the thickness of the second metal wire (41) is h2; The height difference between the side surface of the first insulating layer (2) disposed on the first metal line (31) away from the substrate (1) and the side surface of the second insulating layer (5) away from the substrate (1) is H1. The second metal line (41) is on the side surface away from the substrate (1), and the height difference between it and the second insulating layer (5) on the side surface away from the substrate (1) is H2. The maximum thickness of the second insulating layer (5) is H3, where H3 = H1 + h1 = H2 + h2; If h1≥h2, then the minimum thickness of the second insulating layer (5) is H1, satisfying: h1 / 2<H1<2h1; If h1 < h2, then the minimum thickness of the second insulating layer (5) is H2, satisfying: h1 / 2 < H2 < 2h1.

2. The display panel according to claim 1, characterized in that, An encapsulation layer (7) is provided on the second insulating layer (5), and the surface of the encapsulation layer (7) facing away from the substrate (1) is a flat surface; A third metal layer (6) is provided between the second insulating layer (5) and the encapsulation layer (7), and the surface of the third metal layer (6) facing away from the substrate (1) is a flat surface.

3. The display panel according to claim 1, characterized in that, The first insulating layer (2) and / or the second insulating layer (5) are inorganic layers.

4. A display device, characterized in that, The display panel includes any one of claims 1-3.

5. A method for manufacturing a display panel, characterized in that, Includes the following steps: A first metal trace layer is prepared on a substrate (1), the first metal trace layer including a first metal line (31). A first insulating layer (2) is prepared on the first metal trace layer; A second metal trace layer is prepared on the first insulating layer (2), the second metal trace layer includes a second metal line (41), and the second metal line (41) and the first metal line (31) are arranged at intervals in the orthogonal projection on the substrate (1); A second insulating layer (5) is prepared on the second metal trace layer. A protrusion structure is formed on the side surface of the second insulating layer (5) away from the substrate (1). The position where the protrusion structure is formed on the second insulating layer (5) is the first position. The second insulating layer (5) is planarized so that the first position is flush with other positions on the side surface of the second insulating layer (5) away from the substrate (1); The planarization process for the second insulating layer (5) includes: At least the protruding structure is removed so that the minimum thickness and maximum thickness H3 of the second insulating layer (5) satisfy the following conditions: The thickness of the first metal wire (31) is h1, and the thickness of the second metal wire (41) is h2; The height difference between the side surface of the first insulating layer (2) disposed on the first metal line (31) away from the substrate (1) and the side surface of the second insulating layer (5) away from the substrate (1) is H1. The second metal line (41) is on the side surface away from the substrate (1), and the height difference between it and the second insulating layer (5) on the side surface away from the substrate (1) is H2. The maximum thickness of the second insulating layer (5) is H3, where H3 = H1 + h1 = H2 + h2; If h1≥h2, then the minimum thickness of the second insulating layer (5) is H1, satisfying: h1 / 2<H1<2h1; If h1 < h2, then the minimum thickness of the second insulating layer (5) is H2, satisfying: h1 / 2 < H2 < 2h1.

6. The method for manufacturing a display panel according to claim 5, characterized in that, A third metal layer (6) is prepared on the planarized second insulating layer (5), and an encapsulation layer (7) is prepared on the third metal layer (6).

7. The method for manufacturing a display panel according to claim 5, characterized in that, The planarization process for the second insulating layer (5) includes: The protruding structure is removed, and other parts of the second insulating layer (5) are removed to make the second insulating layer (5) thinner overall.

8. The method for manufacturing a display panel according to claim 5, characterized in that, The planarization process includes an etching process.

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