Organic film forming apparatus

Abstract

The present application provides an organic film forming apparatus that can easily attach and detach a heater with respect to a chamber. The organic film forming apparatus of the embodiment is an organic film forming apparatus that can heat a workpiece including a substrate and a solution including an organic material and a solvent applied to an upper surface of the substrate in an environment that is reduced in pressure with respect to atmospheric pressure. The organic film forming apparatus includes a chamber that can maintain the environment that is reduced in pressure with respect to atmospheric pressure, a first exhaust portion that can exhaust the inside of the chamber, a guide portion that faces the workpiece supported in the chamber and has a shape structure that is cylindrical and extends in one direction, with both end portions of an opening provided in the inside of the chamber, a support portion that is provided in the inside of the guide portion and has a first hole that penetrates in an axial direction, and a heater that has a heating portion that is attached and detached with respect to the first hole and extends along the guide portion.

Description

Technical Field

[0001] Embodiments of the present invention relate to an organic film forming apparatus. Background Technology

[0002] Organic films are used as substrates for organic electroluminescence (EL) displays and the like. For example, an organic film is a polyimide film. For instance, a polyimide film is formed by heating a workpiece comprising a substrate and a solution containing polyamic acid coated on the upper surface of the substrate to approximately 100°C to 600°C, thereby imidizing the polyamic acid. The formed polyimide film is then peeled off from the substrate and used, for example, in organic EL displays.

[0003] As an apparatus for forming organic films such as polyimide films, an organic film forming apparatus is proposed, comprising: a chamber capable of maintaining a depressurized environment relative to atmospheric pressure; and a heater disposed inside the chamber for heating the workpiece.

[0004] Here, during the manufacturing or maintenance of the organic film forming apparatus, it is necessary to either remove the heater from inside the chamber or install the heater inside the chamber. Therefore, if the heater is simply installed inside the chamber, the manufacturing or maintenance of the organic film forming apparatus becomes difficult.

[0005] Therefore, it is desirable to develop an organic film forming apparatus in which the heater can be easily loaded and unloaded relative to the chamber.

[0006] [Existing technical documents]

[0007] [Patent Literature]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 2019-205991 Summary of the Invention

[0009] [The problem the invention aims to solve]

[0010] The problem to be solved by the present invention is to provide an organic film forming apparatus in which the heater can be easily attached and detached relative to the chamber.

[0011] [Technical means to solve the problem]

[0012] The organic film forming apparatus of the embodiment is an organic film forming apparatus that can heat a workpiece including a substrate and a solution containing organic material and solvent coated on the upper surface of the substrate in an environment with reduced pressure relative to atmospheric pressure. The organic film forming apparatus includes: a chamber for maintaining the reduced pressure environment relative to atmospheric pressure; a first exhaust section for venting the interior of the chamber; a guide section facing the workpiece supported in the chamber, having a cylindrical shape and extending unidirectionally, with open ends on both sides disposed inside the chamber; a support section disposed inside the guide section, having a first hole extending axially; and a heater having a heating element detachably disposed in the first hole and extending along the guide section.

[0013] [The effects of the invention]

[0014] According to embodiments of the present invention, an organic film forming apparatus is provided in which the heater can be easily attached to or detached from the chamber. Attached Figure Description

[0015] Figure 1 This is a schematic perspective view illustrating the organic film forming apparatus of this embodiment.

[0016] Figure 2 This is a schematic cross-sectional view used to illustrate the temperature control unit.

[0017] Figure 3 (a)~ Figure 3 (c) is a schematic sectional view used to illustrate the positional relationship between the support and the workpiece.

[0018] Figure 4 This is a diagram illustrating the process of forming an organic film.

[0019] Figure 5 This is a schematic cross-sectional view illustrating a temperature control unit in another embodiment.

[0020] Figure 6 This is a schematic cross-sectional view illustrating a support portion of another embodiment.

[0021] Figure 7 yes Figure 6 A schematic cross-sectional view of the support section along line AA.

[0022] Figure 8 yes Figure 6 A schematic cross-sectional view of the BB line direction of the opening and closing door in the middle.

[0023] Figure 9 This is a schematic cross-sectional view illustrating a temperature control unit in another embodiment.

[0024] Figure 10This is a schematic diagram illustrating the function of the fluid control unit.

[0025] Figure 11 This is a diagram of the fluid piping system.

[0026] [Explanation of Symbols]

[0027] 1: Organic film forming device

[0028] 3, 3a, 3b, 3ab: Temperature control group

[0029] 10: Chamber

[0030] 10a: Ontology

[0031] 10a1: Side view

[0032] 12: Sealing material

[0033] 11, 14, 32a2, 32d1: Flange

[0034] 13: Opening and closing doors

[0035] 13a: Concave-convex surface

[0036] 15: Cover

[0037] 15a, 32c1, 36a, 32d2, 132c1: Holes

[0038] 16, 40: Cooling section

[0039] 17, 18: Exhaust port

[0040] 20: Exhaust section

[0041] 21: First exhaust section

[0042] 21a, 22a: Exhaust pumps

[0043] 21b, 22b: Pressure control section

[0044] 22: Second exhaust section

[0045] 23: Third exhaust section

[0046] 24: Cold Trap

[0047] 25: Valve

[0048] 30: Processing Department

[0049] 30a, 30b: Processing areas

[0050] 31: Framework

[0051] 31a: Beam

[0052] 32, 132, 232: Temperature Control Department

[0053] 32a: Heater

[0054] 32a1: Heating section

[0055] 32a3: Terminal

[0056] 32b: Guiding section

[0057] 32b1: Bracket

[0058] 32c: Support section

[0059] 32c2: Conical surface

[0060] 32d: Bracket

[0061] 32e, 232e: Fluid Supply Section

[0062] 32e1, 232e1: Fluid Control Department

[0063] 33: Workpiece support section

[0064] 34: Heat Spreader

[0065] 34a: Upper heat spreader

[0066] 34b: Lower heat spreader

[0067] 34c, 34d: Side heat spreader

[0068] 35: Heat spreader support section

[0069] 36: Cover

[0070] 40a: First flow path

[0071] 40b: Second flow path

[0072] 41: Supply Source

[0073] 42: Flow Control Department

[0074] 43, 44, 45, 46: Piping

[0075] 43a, 43b, 43c: Ends

[0076] 44a, 44b, 44ab, 45a, 45b, 45ab, 45a1, 45a2, 45a3, 45b1, 45b2, 45b3, 45ab1, 45ab2, 45ab3: Branches

[0077] 50: Controller

[0078] 60: Exhaust section

[0079] 100: Workpiece

[0080] 101, 101a: Fluid

[0081] AA, BB: lines

[0082] X, Y, Z: Direction Detailed Implementation

[0083] Hereinafter, embodiments will be illustrated with reference to the accompanying drawings. Furthermore, in each drawing, the same reference numerals are used to denote the same constituent elements, and detailed descriptions are omitted where appropriate.

[0084] Furthermore, the following describes an organic film forming apparatus that forms an organic film by calcining a solution containing organic material coated on the upper surface of a substrate under reduced pressure.

[0085] Figure 1 This is a schematic perspective view illustrating the organic film forming apparatus 1 of this embodiment.

[0086] in addition, Figure 1 The X, Y, and Z directions represent three mutually orthogonal directions. The up / down direction in this specification can be set as the Z direction.

[0087] The workpiece 100 includes a substrate and a solution containing organic materials and solvents coated on the upper surface of the substrate.

[0088] The substrate may be, for example, a glass substrate or a semiconductor wafer. However, the substrate is not limited to the substrate illustrated.

[0089] The solution comprises an organic material and a solvent. There are no particular limitations on the organic material, as long as it is soluble in the solvent. For example, the solution may be a varnish containing polyamic acid. However, the solution is not limited to the examples shown.

[0090] The organic film forming apparatus 1 can heat the workpiece 100 in an environment where the pressure is reduced relative to atmospheric pressure.

[0091] like Figure 1 As shown, the organic film forming apparatus 1 includes a chamber 10, an exhaust section 20 (equivalent to an example of a first exhaust section), a processing section 30, a cooling section 40, and a controller 50.

[0092] The chamber 10 is box-shaped. The chamber 10 has an airtight structure that can maintain a depressurized environment relative to atmospheric pressure. The external shape of the chamber 10 is not particularly limited. For example, the external shape of the chamber 10 can be a cuboid. The chamber 10 has, for example, a body 10a, an opening and closing door 13, and a cover 15.

[0093] The body 10a is cylindrical. A flange 11 may be provided at one end of the body 10a. A flange 14 may be provided at the other end of the body 10a. The body 10a, flange 11, and flange 14 are formed of metal such as stainless steel. In addition, the outer wall connecting the two ends of the body 10a is referred to as the side wall 10a1.

[0094] O-rings or other sealing materials 12 can be provided on the flange 11. The opening on the side of the body 10a with the flange 11 can be opened and closed by the opening and closing door 13.

[0095] The opening / closing door 13 is plate-shaped and may be made of a metal such as stainless steel. By using a drive device (not shown) to press the opening / closing door 13 against the flange 11 (sealing material 12), the opening on the side of the body 10a with the flange 11 is sealed in an airtight manner. By using a drive device (not shown) to move the opening / closing door 13 away from the flange 11, the workpiece 100 can be moved in or out through the opening of the chamber 10.

[0096] O-rings or other sealing materials 12 can be provided on the flange 14. The opening on the side of the body 10a with the flange 14 is closed by the cover 15.

[0097] The cover 15 is plate-shaped and may be made of a metal such as stainless steel. A hole 15a is provided in the cover 15. Furthermore, a bracket 32d is provided in the cover 15 for mounting the heater 32a described below (see reference). Figure 2 For example, the number of brackets 32d and holes 15a can be set to be the same as the number of heaters 32a described below.

[0098] Alternatively, the same hole as the hole 15a can be provided on the side 10a1 of the opening and closing door 13 or the main body 10a to install the heater 32a.

[0099] When the cover 15 is installed on the flange 14 using fasteners such as screws, the cover 15 presses against the flange 14 (sealing material 12). Furthermore, the heater 32a is airtightly connected to the bracket 32d provided on the cover 15, and the opening on the side of the body 10a with the flange 14 is sealed in an airtight manner (see reference). Figure 2 ).

[0100] Furthermore, during maintenance or other procedures, the opening on the side of the main body 10a with the flange 14 can be exposed by removing the cover 15. Additionally, the cover 15 is not necessarily required; for example, the cover 15 and the main body 10a can be integrated. That is, the main body 10a can also be a cylindrical shape with one end sealed.

[0101] Furthermore, when performing maintenance, the heater 32a can be removed and the cover 15 can be removed.

[0102] A cooling section 16 may be provided on the side 10a1 of the main body 10a. The cooling section 16 may also be provided on the opening / closing door 13 and the cover 15. A cooling water supply section (not shown) is connected to the cooling section 16. The cooling section 16 may be, for example, a water jacket. If a cooling section 16 is provided, the temperature of the outer wall of the chamber 10 can be prevented from becoming higher than a predetermined temperature.

[0103] The exhaust section 20 exhausts the internal space of the chamber 10. As a result, the workpiece 100 is heated by heat energy brought by radiation in an environment where the pressure is reduced relative to atmospheric pressure.

[0104] The exhaust section 20 may have a first exhaust section 21, a second exhaust section 22 and a third exhaust section 23.

[0105] The first exhaust section 21 is connected to the exhaust port 17 located on the bottom surface of the chamber 10.

[0106] The first exhaust section 21 may include an exhaust pump 21a and a pressure control section 21b.

[0107] The exhaust pump 21a can be configured as a dry vacuum pump, for example.

[0108] A pressure control unit 21b is located between the exhaust port 17 and the exhaust pump 21a. The pressure control unit 21b controls the pressure based on the output of a vacuum gauge (not shown) or similar device that detects the internal pressure of the chamber 10, so that the internal pressure of the chamber 10 is a predetermined pressure. The pressure control unit 21b may be, for example, an automatic pressure controller (APC).

[0109] Furthermore, a cold trap 24 for capturing the discharged sublimate can be provided between the exhaust port 17 and the first exhaust section 21 (pressure control section 21b). Also, a valve 25 can be provided between the exhaust port 17 and the cold trap 24. The valve 25 is provided to prevent fluid 101 from flowing into the cold trap 24 during the cooling process described below.

[0110] The second exhaust section 22 is connected to the exhaust port 18 located on the bottom surface of the chamber 10.

[0111] The second exhaust section 22 may include an exhaust pump 22a and a pressure control section 22b.

[0112] The second exhaust section 22 has the ability to exhaust gas to a molecular flow region with high vacuum. The exhaust pump 22a can be, for example, a turbomolecular pump (TMP).

[0113] A pressure control unit 22b is located between the exhaust port 18 and the exhaust pump 22a. The pressure control unit 22b controls the pressure based on the output of a vacuum gauge (not shown) or similar device that detects the internal pressure of the chamber 10, so that the internal pressure of the chamber 10 reaches a predetermined pressure. The pressure control unit 22b can be, for example, an APC (Automatic Pressure Controller).

[0114] Furthermore, similar to the case of the first exhaust section 21, a cold trap 24 can be provided between the exhaust port 18 and the second exhaust section 22 (pressure control section 22b). Moreover, a valve 25 can be provided between the exhaust port 18 and the cold trap 24.

[0115] The third exhaust section 23 is connected between the exhaust port 18 and the valve 25 of the second exhaust section 22. The third exhaust section 23 is connected to the factory's exhaust pipe, etc. The third exhaust section 23 can be, for example, made of stainless steel. The valve 25 can be installed between the third exhaust section 23 and the factory's exhaust pipe.

[0116] When depressurizing the internal space of chamber 10, firstly, the internal pressure of chamber 10 is reduced to approximately 10 Pa via the first exhaust section 21. Next, the internal pressure of chamber 10 is reduced to between 10 Pa and 1 × 10⁻⁶ Pa via the second exhaust section 22. -2 Approximately Pa.

[0117] Since the first exhaust section 21 performs rough exhaust from atmospheric pressure until a specified internal pressure is reached, the exhaust volume of the first exhaust section 21 is greater than that of the second exhaust section 22. Furthermore, the second exhaust section 22, after completing the rough exhaust, continues to exhaust until a lower specified internal pressure is reached. Additionally, the third exhaust section 23 is used to discharge fluid 101 to the factory's exhaust pipe during the cooling process described below.

[0118] The processing unit 30 includes a frame 31, a temperature control unit 32, a workpiece support unit 33, a heat spreader 34, a heat spreader plate support unit 35, and a cover unit 36.

[0119] The processing unit 30 has a processing area 30a and a processing area 30b inside. Processing areas 30a and 30b are spaces for heating the workpiece 100. The workpiece 100 is supported inside processing areas 30a and 30b. Processing area 30b is located above processing area 30a. While two processing areas are illustrated, the unit is not limited to this. Only one processing area may be provided. Furthermore, three or more processing areas may be provided. Figure 1 As an example, the case with two processing areas is shown, but the basic structure is the same whether there is one processing area or three or more processing areas.

[0120] Processing zones 30a and 30b are surrounded by heat-spreading sections 34 (upper heat-spreading plate 34a, lower heat-spreading plate 34b, side heat-spreading plate 34c, and side heat-spreading plate 34d). Processing zones 30a and 30b are connected to the space inside the chamber 10 and outside of processing zones 30a and 30b via gaps between the upper heat-spreading plates 34a and lower heat-spreading plates 34b, gaps between the cover sections 36, and holes or slits provided in the cover sections 36. Therefore, if the pressure in the space inside the chamber 10 and outside of processing zones 30a and 30b decreases, the pressure in processing zones 30a and 30b also decreases.

[0121] Furthermore, if the pressure inside the chamber 10 and outside the processing areas 30a and 30b is reduced, the heat released from the processing areas 30a and 30b to the outside can be reduced. Therefore, heat storage efficiency can be improved, thus reducing the power required to the heater 32a. Reducing the applied power leads to energy savings and a longer lifespan for the heater 32a. Moreover, improved heat storage efficiency makes it easier to handle processes requiring rapid temperature increases. Furthermore, since the temperature of the outer wall of the chamber 10 can be suppressed, the cooling section 16 can be simplified.

[0122] The frame 31 has a skeleton structure using slender plates or structural steel. The external shape of the frame 31 can be the same as the external shape of the chamber 10. For example, the external shape of the frame 31 can be a cuboid.

[0123] Furthermore, the frame 31 is provided with multiple beams 31a. These multiple beams 31a extend along the length of the processing areas 30a and 30b. Figure 1 (Extending in the X direction). The beam 31a of the frame 31 located on the side of the opening and closing door 13 faces the beam 31a of the frame 31 located on the side of the cover 15. Multiple heat spreader support parts 35 may be arranged side by side on the beams 31a at a predetermined interval.

[0124] Multiple temperature control units 32 may be provided. Multiple temperature control units 32 are arranged along the length of the processing area 30a and the processing area 30b. Figure 1 The temperature control units 32 are arranged side by side in the X direction. The temperature control units 32 heat the workpiece 100. The number and spacing of the temperature control units 32 can be appropriately changed according to the composition of the solution to be heated (the required heating temperature of the solution, etc.), the size of the workpiece 100, etc. The number and spacing of the temperature control units 32 can be appropriately determined by simulation or experimentation.

[0125] Temperature control unit 32 may be provided at the lower part of processing area 30a and processing area 30b, and at the upper part of processing area 30a and processing area 30b. Temperature control unit 32 provided at the lower part of processing area 30a and processing area 30b faces temperature control unit 32 provided at the upper part of processing area 30a and processing area 30b.

[0126] Furthermore, when multiple processing zones are arranged overlapping vertically, the temperature control unit 32 located between the lower and upper processing zones can be used for temperature control of the workpiece 100 in both processing zones. That is, the temperature control unit 32 is provided between processing zone 30a and processing zone 30b. This reduces the number of temperature control units 32, thereby reducing power consumption during heating, reducing the consumption of the fluid 101 during cooling, lowering manufacturing costs, and saving space.

[0127] The lower surface (back side of the substrate) of the workpiece 100 supported inside the processing area 30a is heated or cooled by a plurality of temperature control units 32 (temperature control group 3a) provided in the lower part of the processing area 30a. The upper surface (solution) of the workpiece 100 supported inside the processing area 30a is heated or cooled by a plurality of temperature control units 32 (temperature control group 3ab) shared by both the processing area 30a and the processing area 30b. The lower surface (back side of the substrate) of the workpiece 100 supported inside the processing area 30b is heated or cooled by the temperature control group 3ab. The upper surface (solution) of the workpiece 100 supported inside the processing area 30b is heated or cooled by a plurality of temperature control units 32 (temperature control group 3b) provided in the upper part of the processing area 30b. Furthermore, without distinguishing between temperature control groups, it is simply referred to as temperature control group 3.

[0128] Figure 2 This is a schematic cross-sectional view used to illustrate the temperature control unit 32.

[0129] like Figure 2 As shown, the temperature control unit 32 includes, for example, a heater 32a, a guide 32b, a support 32c, and a bracket 32d.

[0130] The heater 32a has, for example, a heating element 32a1, a flange 32a2, and a terminal 32a3.

[0131] The heating element 32a1 is detachably mounted inside the guide portion 32b. The heating element 32a1 extends along the guide portion 32b. The heating element 32a1 converts electricity into heat. The heating element 32a1 can be, for example, an encapsulated heater, a ceramic heater, a cylindrical heater, etc. Furthermore, a quartz cover portion covering the outer surface of the heating element 32a1 can also be provided.

[0132] The flange 32a2 is plate-shaped and is located near one end of the heating element 32a1. The flange 32a2 can be hermetically welded to the outer surface of the heating element 32a1, for example. Thus, the heating element 32a1 is hermetically connected via the bracket 32d provided on the cover 15 and the flange 32a2. The flange 32a2 can be made of, for example, a metal such as stainless steel.

[0133] Outside the chamber 10, the flange 32a2 is mounted on the flange 32d1 of the bracket 32d using fasteners such as screws. When the flange 32a2 of the heater 32a is mounted on the flange 32d1 of the bracket 32d, the internal space of the chamber 10 is sealed in an airtight manner.

[0134] Terminal 32a3 is provided at the end of the heating element 32a1 on the side with flange 32a2. Terminal 32a3 is electrically connected to the heating element provided in the heating element 32a1. A power supply or control device located outside the organic film forming apparatus 1 is electrically connected to terminal 32a3. That is, power is supplied to the heating element provided in the heating element 32a1 via terminal 32a3. In this case, terminal 32a3 is exposed outside the cover 15, that is, outside the organic film forming apparatus 1 (chamber 10). Therefore, it is easy to attach and detach the power cable at terminal 32a3. In addition, an insulating cover can also be provided to cover terminal 32a3.

[0135] The guide portion 32b is disposed facing the substrate surface of the workpiece 100. The guide portion 32b has a cylindrical shape and extends in one direction. The ends of both sides of the guide portion 32b are located inside the chamber 10 (processing area 30a, processing area 30b). The ends of both sides of the guide portion 32b are open. The guide portion 32b extends along the short side direction of the processing areas 30a and 30b. Figure 2 (Extending in the Y direction). A pair of brackets 32b1 can be provided in the guide portion 32b. For example, brackets 32b1 can be welded to the ends of both sides of the guide portion 32b. The brackets 32b1 are installed on the beams 31a of the frame 31, for example, using fasteners such as screws.

[0136] The guide portion 32b is formed of a material with high thermal conductivity and heat resistance. For example, the material of the guide portion 32b can be a metal such as stainless steel.

[0137] With this guide portion 32b, the heating portion 32a1 can be pulled out and inserted without interfering with other components within the chamber 10.

[0138] A support portion 32c is disposed inside the guide portion 32b. Inside the guide portion 32b, the support portion 32c supports the heater 32a (heating portion 32a1). For example, the support portion 32c has an axially penetrating hole 32c1 (an example of the first hole). The heating portion 32a1 is detachably disposed within the hole 32c1. Therefore, a small gap can be provided between the inner wall of the hole 32c1 and the heating portion 32a1.

[0139] The internal space of the guide portion 32b is connected to the internal space of the chamber 10 (processing area 30a, processing area 30b) via the gap between the inner wall of the hole 32c1 and the heating part 32a1, or the gap between the inner wall of the guide portion 32b and the support part 32c. Therefore, the generation of a pressure difference between the internal space of the guide portion 32b and the internal space of the chamber 10 can be suppressed.

[0140] At least one support portion 32c may be provided. For example, a support portion 32c may be provided near the end of the guide portion 32b that is opposite to the side of the bracket 32d. In this way, the heating portion 32a1 can be supported by a support portion 32c and the bracket 32d.

[0141] If multiple support portions 32c are provided, the distance between the inner wall of the guide portion 32b and the heating portion 32a1 can be kept approximately fixed in the region between the support portions 32c and the guide portion 32b. Therefore, for example, temperature differences on the outer surface of the guide portion 32b can be suppressed.

[0142] However, as the heater 32a heats up and cools down, the heating part 32a1 expands and contracts, which may cause wear between the heating part 32a1 and the support part 32c. Furthermore, as described below, the temperature of the area of ​​the guide part 32b facing the support part 32c increases. Therefore, increasing the number of support parts 32c may easily lead to particle generation, and the temperature difference within the surface of the workpiece 100 becomes larger.

[0143] Furthermore, if the support portion 32c is located in the central region of the guide portion 32b, the heat from the heater 32a is easily transferred to the vicinity of the center of the workpiece 100, failing to achieve the goal of making the temperature difference within the surface of the workpiece 100 equally close. Therefore, it is most preferable that the support portion 32c is provided at only one end of the guide portion 32b, avoiding the central portion, in a manner that minimizes particle generation (e.g., one on each end).

[0144] Furthermore, a conical surface 32c2 can be provided in the opening on the bracket 32d side of the hole 32c1 in the support 32c. If a conical surface 32c2 is provided, it is easy to insert a heater 32a (heating part 32a1) inside the hole 32c1.

[0145] The support portion 32c is formed of a material with high thermal conductivity and heat resistance. For example, the material of the support portion 32c can be a metal such as stainless steel.

[0146] In addition, the shape of the support portion 32c can be circular, either along the cross-sectional shape of the guide portion 32b or, for example, semi-circular (the shape that only supports the lower part of the heating portion 32a1).

[0147] The bracket 32d has a flange 32d1 and is disposed on the outer surface of the cover 15. During heat treatment, the internal space of the chamber 10 becomes a depressurized environment relative to atmospheric pressure. Therefore, the bracket 32d is welded to the cover 15, for example, in an airtight manner. The material of the bracket 32d can be, for example, a metal such as stainless steel.

[0148] The bracket 32d has a hole 32d2 that communicates with the hole 15a in the cover 15. The heater 32a can be inserted from the outside of the chamber 10 through the hole 32d2 and the hole 15a into the hole 32c1 of the support 32c.

[0149] Furthermore, the flange 32a2 of the heater 32a can be easily mounted to the flange 32d1 of the bracket 32d using fastening components such as screws.

[0150] As described above, the organic film forming apparatus 1 according to this embodiment allows for easy loading and unloading of the heater 32a relative to the chamber 10 by means of the guide portion 32b. Therefore, assembly or maintenance of the organic film forming apparatus 1 becomes easier.

[0151] Alternatively, a sealing element may be provided between the flange 32a2 of the heater 32a and the flange 32d1 of the support 32d. If a sealing element is provided, the internal space of the chamber 10 can be easily maintained in an airtight manner.

[0152] Furthermore, the heat generated in the heater 32a (heating part 32a1) is transferred to the support 32d. Therefore, a cooling part can also be provided in the support 32d. The cooling part can, for example, blow gas onto the support 32d, or allow gas or liquid to flow in a flow path provided inside the support 32d. If a cooling part is provided, the temperature of the support 32d, and consequently the temperature of the cover 15, can be suppressed from becoming too high.

[0153] As described above, a heating element 32a1 is provided within the internal space of the guide portion 32b. In the region where there is space between the inner wall of the guide portion 32b and the heating element 32a1, heat generated in the heating element 32a1 is transferred to the guide portion 32b by radiation. In the region where there is a support portion 32c between the inner wall of the guide portion 32b and the heating element 32a1, heat generated in the heating element 32a1 is transferred to the guide portion 32b by heat conduction via the support portion 32c. In this case, heat conduction transfers heat more easily than radiation, therefore the temperature of the region of the guide portion 32b facing the support portion 32c is higher than the temperature of the region of the guide portion 32b not facing the support portion 32c.

[0154] On the other hand, the peripheral region of workpiece 100 is located closer to the inner wall of chamber 10 than the central region of workpiece 100. Therefore, heat from the peripheral region of workpiece 100 is more easily transferred to the inner wall of chamber 10 than heat from the central region of workpiece 100. As a result, the temperature of the peripheral region of workpiece 100 is more likely to be lower than the temperature of the central region of workpiece 100.

[0155] As described above, the temperature of the region of the guide portion 32b facing the support portion 32c is higher than the temperature of the region of the guide portion 32b not facing the support portion 32c. Therefore, if the region of the guide portion 32b facing the support portion 32c is located near the peripheral region of the workpiece 100, the temperature of the peripheral region of the workpiece 100 can be increased. As a result, the temperature difference between the peripheral region and the central region of the workpiece 100 can be reduced, thus allowing the entire surface of the workpiece 100 to heat up evenly, thereby improving the quality of the formed organic film.

[0156] Figure 3 (a)~ Figure 3 (c) is a schematic sectional view used to illustrate the positional relationship between the support 32c and the workpiece 100.

[0157] in addition, Figure 3 (a)~ Figure 3 In (c), one peripheral side of workpiece 100 is depicted, and the other peripheral side of workpiece 100 is also depicted in the same way. Furthermore, Figure 3 (a)~ Figure 3 In (c), the case where a support portion 32c is provided above the workpiece 100 is depicted, and the case where a support portion 32c is provided below the workpiece 100 is also depicted.

[0158] like Figure 3As shown in (a), when viewed from above (perpendicular to the surface of the substrate of the workpiece 100), the support portion 32c can be provided on the outer periphery of the workpiece 100. This allows for an increase in the temperature of the peripheral region of the lower heat spreader 34b or the upper heat spreader 34a. Heat from the peripheral region of the workpiece 100 is transferred to the inner wall of the chamber 10 via the lower heat spreader 34b or the upper heat spreader 34a; therefore, if the temperature of the peripheral region of the lower heat spreader 34b or the upper heat spreader 34a increases, the heat lost from the inner wall of the chamber 10 can be compensated.

[0159] Therefore, the temperature difference between the peripheral region and the central region of the workpiece 100 can be reduced.

[0160] like Figure 3 As shown in (b), when viewed from above, the support portion 32c can be located on the inner side of the periphery of the workpiece 100. Thus, with... Figure 3 Similarly, the temperature of the peripheral region of the lower heat spreader 34b or the upper heat spreader 34a increases, thereby compensating for the temperature of the peripheral region of the workpiece 100, where heat is easily deprived.

[0161] Therefore, the temperature difference between the peripheral region and the central region of the workpiece 100 can be reduced.

[0162] like Figure 3 As shown in (c), when viewed from above, the support portion 32c can be positioned to overlap with the periphery of the workpiece 100. Thus, as... Figure 3 As explained in (a), even if the heat in the peripheral region of the workpiece 100 is deprived by the inner wall of the chamber 10, it can be compensated for. Furthermore, as... Figure 3 As described in (b), the temperature of the peripheral region of the workpiece 100, where heat is easily escaped, can be increased.

[0163] Therefore, it is easier to reduce the temperature difference between the peripheral area of ​​workpiece 100 and the central area of ​​workpiece 100.

[0164] Furthermore, as mentioned above, the support portion 32c is positioned at... Figure 3 The position shown in (a) and Figure 3 The positions shown in (b) all have some effect, but the optimal choice is... Figure 3 The position shown in (c) (the position overlapping with the periphery of workpiece 100). In Figure 3 In the position shown in (a), since the lower heat spreader 34b (upper heat spreader 34a) is located close to the inner wall of the chamber 10, heat is easily stripped from the peripheral area of ​​the lower heat spreader 34b (upper heat spreader 34a). Furthermore, in Figure 3In the position shown in (b), since the periphery of the workpiece 100 is close to the inner wall of the chamber 10, heat is easily lost from the periphery of the workpiece 100. Therefore, in Figure 3 Setting the support part 32c at the position shown in (c) (the position that overlaps with the periphery of the workpiece 100) is the most effective.

[0165] Furthermore, by changing the length of the axial support portion 32c of the guide portion 32b, the size of the area of ​​the workpiece 100 heated by the support portion 32c can be changed. For example, the length of the support portion 32c can be changed according to the size of the low-temperature area near the periphery of the workpiece 100.

[0166] like Figure 1 As shown, the workpiece support 33 is located inside the processing areas 30a and 30b of the chamber 10, supporting the lower surface of the workpiece 100. Multiple workpiece support 33s may be provided. Multiple workpiece support 33s are located at the lower part of the processing area 30a and the lower part of the processing area 30b. Multiple workpiece support 33s may be rod-shaped.

[0167] The upper ends of the plurality of workpiece support portions 33 are located inside the processing areas 30a and 30b, and are in contact with the lower surface of the workpiece 100. Therefore, the shape of the upper ends of the plurality of workpiece support portions 33 is preferably hemispherical or the like. This can suppress damage to the lower surface of the workpiece 100. Moreover, since the contact area between the lower surface of the workpiece 100 and the plurality of workpiece support portions 33 can be reduced, heat is less likely to be transferred from the workpiece 100 to the plurality of workpiece support portions 33.

[0168] The number, configuration, and spacing of the multiple workpiece support parts 33 can be appropriately changed according to the size or rigidity (deflection) of the workpiece 100. The number, configuration, and spacing of the multiple workpiece support parts 33 can be appropriately determined through simulation or experimentation.

[0169] The heat spreader 34 has multiple upper heat spreaders 34a, multiple lower heat spreaders 34b, multiple side heat spreaders 34c, and multiple side heat spreaders 34d. The multiple upper heat spreaders 34a, multiple lower heat spreaders 34b, multiple side heat spreaders 34c, and multiple side heat spreaders 34d are plate-shaped.

[0170] Multiple upper heat spreaders 34a are disposed above the workpiece 100, between the workpiece 100 and multiple temperature control units 32. The multiple upper heat spreaders 34a are separate from the multiple temperature control units 32. The multiple upper heat spreaders 34a are arranged in the same direction as the multiple temperature control units 32. Figure 1 The X direction is set side by side.

[0171] Multiple lower heat spreaders 34b are disposed below the workpiece 100, between the workpiece 100 and multiple temperature control units 32. The multiple lower heat spreaders 34b are separate from the multiple temperature control units 32. The multiple lower heat spreaders 34b are arranged in the same direction as the multiple temperature control units 32. Figure 1 The X direction is set side by side.

[0172] The side heat spreader 34c is respectively disposed on both sides of the processing area 30a and the processing area 30b in the direction in which the multiple temperature control units 32 are arranged. Figure 1 The side portion (in the X direction). The side heat spreader 34c may be provided inside the cover portion 36. Moreover, at least one temperature control unit 32 may be provided between the side heat spreader 34c and the cover portion 36, and is provided separately from the side heat spreader 34c and the cover portion 36.

[0173] In this way, by providing a temperature control unit 32 between the side heat spreader 34c and the cover, sublimation products generated by baking the workpiece 100 on the side heat spreader 34c can be prevented from adhering.

[0174] The side heat spreader 34d is in a direction orthogonal to the direction in which the multiple temperature control units 32 are arranged. Figure 1 In the Y direction, they are respectively located on the sides of the processing area 30a and the processing area 30b.

[0175] Processing areas 30a and 30b are surrounded by multiple upper heat spreaders 34a, multiple lower heat spreaders 34b, multiple side heat spreaders 34c, and multiple side heat spreaders 34d. Furthermore, a cover 36 surrounds the outer sides of these.

[0176] Alternatively, the side heat dissipation plate 34d on the side of the opening and closing door 13 can be provided together with the cover 36 on the opening and closing door 13, so that the workpiece 100 can be smoothly moved in and out when the opening and closing door 13 is opened and closed.

[0177] The materials of the multiple upper heat spreaders 34a and the multiple lower heat spreaders 34b are preferably materials with high thermal conductivity. For example, the materials of the multiple upper heat spreaders 34a and the multiple lower heat spreaders 34b can be metals such as aluminum, copper, and stainless steel.

[0178] Furthermore, the materials of the side heat spreaders 34c and 34d can be the same as those of the upper heat spreader 34a and the lower heat spreader 34b.

[0179] Here, the heater 32a has a unidirectional extending shape, so the heat radiation is radial about the central axis of the heater 32a. In this case, the shorter the distance between the central axis of the temperature control unit 32 and the area to be heated, the higher the temperature. Therefore, when multiple heaters 32a are arranged facing the workpiece 100, temperature differences are easily generated within the surface of the workpiece 100.

[0180] In this case, if an upper heat spreader 34a and a lower heat spreader 34b are provided, the heating performed by the multiple heaters 32a is carried out via the upper heat spreader 34a and the lower heat spreader 34b. That is, the heat radiated from the multiple heaters 32a is incident on the upper heat spreader 34a and the lower heat spreader 34b, and radiates to the workpiece 100 while propagating along the surface inside them. Therefore, temperature differences within the surface of the workpiece 100 can be suppressed, thereby improving the quality of the formed organic film.

[0181] In addition, although the example shows a case with multiple upper heat spreaders 34a and multiple lower heat spreaders 34b, at least one of the upper heat spreaders 34a and the lower heat spreaders 34b may also be a single plate-shaped component.

[0182] Multiple heat spreader support portions 35 (upper heat spreader support portions) are arranged side by side in the direction in which the multiple upper heat spreaders 34a are arranged. The heat spreader support portions 35 may be located directly below each other in the direction in which the multiple upper heat spreaders 34a are arranged. The multiple heat spreader support portions (lower heat spreader support portions) supporting the multiple lower heat spreaders 34b may also have the same structure.

[0183] The cover 36 is plate-shaped and covers the upper surface, bottom surface, and sides of the frame 31. In this case, as described above, the cover 36 on the side of the opening / closing door 13 can be provided, for example, on the opening / closing door 13. The cover 36 surrounds the processing areas 30a and 30b, but, for example, gaps, holes, or slits can be provided between the cover 36. In this way, the space between the inner wall of the chamber 10 and the cover 36 is connected to the processing areas 30a and 30b, so the pressure in the internal space of the processing areas 30a and 30b is the same as the pressure in the space between the inner wall of the chamber 10 and the cover 36. Moreover, the cover 36 on the side covering the frame 31 is provided with a hole 36a, which is used to supply fluid 101 to or discharge fluid from the space where the temperature control group 3 is provided. The cover 36 can be formed, for example, of stainless steel.

[0184] The cooling section 40 supplies fluid 101 to the space provided in the temperature control group 3 via the first flow path 40a. In addition, as described above, the space provided in the temperature control group 3 is surrounded by the beam 31a, the upper heat spreader 34a, the lower heat spreader 34b, and the cover 36.

[0185] The cooling unit 40 cools the workpiece 100, which is opposite to the temperature control group 3, indirectly by cooling the temperature control group 3.

[0186] The cooling unit 40 may include, for example, a supply source 41 and a flow control unit 42.

[0187] The supply source 41 supplies fluid 101. The supply source 41 may be, for example, a high-pressure gas storage tank or a factory piping.

[0188] Fluid 101 may be, for example, dry air, or an inert gas such as nitrogen, argon, or helium. However, the type of fluid 101 is not limited to the types shown.

[0189] Here, if the fluid 101 is a gas containing oxygen, the guide portion 32b, which is at a high temperature, may oxidize. Therefore, the fluid 101 is preferably a gas that does not contain oxygen, such as an inert gas like nitrogen.

[0190] Furthermore, the temperature of fluid 101 can be set to, for example, below room temperature (25°C). In this case, a cooler for cooling fluid 101 can be provided, or the temperature of gaseous fluid 101 can be reduced by the heat of vaporization when the liquid fluid 101 vaporizes.

[0191] If the temperature of fluid 101 is low, the temperature of temperature control group 3 can be rapidly reduced, thereby rapidly reducing the temperature of workpiece 100.

[0192] The flow control unit 42, for example, performs functions such as supplying and stopping the supply of fluid 101, and controlling the flow rate or pressure. The flow control unit 42 may be, for example, a mass flow controller or a needle valve.

[0193] The controller 50 includes an arithmetic unit such as a central processing unit (CPU) and a storage unit such as a memory. The controller 50 is, for example, a computer.

[0194] The controller 50 controls the operation of each component in the organic film forming apparatus 1 based on the control program stored in the storage unit.

[0195] For example, the controller 50 controls the power applied to the heater 32a or the flow rate of the fluid 101 supplied to the temperature control group 3 via the first flow path 40a based on the detection values ​​of thermometers (not shown) located in the processing area 30a and the processing area 30b.

[0196] Furthermore, as described below, the controller 50 controls, for example, the flow rate of fluid 101 supplied to fluid supply unit 32e and fluid supply unit 232e via the second flow path 40b, or the supply position of fluid 101, based on the detection value of a thermometer (not shown) located in processing area 30a and processing area 30b (see reference). Figure 5 , Figures 9-11 ).

[0197] Next, the operation of the organic film forming apparatus 1 will be illustrated.

[0198] First, the controller 50 causes the opening / closing door 13 to move away from the flange 11. Then, the workpiece 100 is moved into the interior of the chamber 10 by a conveying device (not shown).

[0199] Next, the controller 50 controls the operation of each component in the organic film forming apparatus 1 to carry out the organic film forming process.

[0200] Figure 4 This is a diagram illustrating the process of forming an organic film.

[0201] like Figure 4 As shown, in the organic film formation process, the heating process (1), the heat treatment process (1), the heating process (2), the heat treatment process (2) and the cooling process are performed in sequence.

[0202] First, a heating process (1) is performed. In the heating process (1), the internal space of the chamber 10 is depressurized to a specified pressure through the exhaust section 20. The pressure during depressurization is only required to prevent the polyamic acid in the solution from reacting with and oxidizing the oxygen remaining in the internal space of the chamber 10. For example, the pressure during depressurization can be set to 100 Pa to 1 × 10⁻⁶ Pa. -2 Pa. That is, the pressure reduction achieved by the second exhaust section 22 is not necessarily necessary. If the pressure inside the chamber 10 becomes 10 Pa to 100 Pa through the first exhaust section 21, then the heating of the workpiece 100 can be started by the heater 32a.

[0203] Furthermore, the pressure after depressurization is maintained in the heating process (1), the heat treatment process (1), the heating process (2), and the heat treatment process (2).

[0204] When the internal space of chamber 10 is depressurized to a specified pressure, electricity is applied to heater 32a. Thus, as... Figure 4 As shown, the temperature of workpiece 100 rises. The process of raising the temperature of workpiece 100 is called the heating process. In the organic film formation process of this embodiment, the heating process is performed twice (heating process (1) and heating process (2)).

[0205] For example, in the heating process (1), the controller 50 controls the power applied to the heater 32a based on the detection value of a thermometer (not shown).

[0206] In this case, the storage unit of the controller 50 pre-stores the first temperature in the heating process (1) and the time of the heating process (1). The calculation unit of the controller 50 controls the heater 32a so that the first temperature in the heating process (1) is reached before the time of the heating process (1) has elapsed.

[0207] After the heating process (1), the heat treatment process (1) is performed. In the heat treatment process (1), the first temperature is maintained for a specified time. In the organic film formation process of this embodiment, the heat treatment process is performed twice (heat treatment process (1) and heat treatment process (2)).

[0208] In the heat treatment process (1), for example, the workpiece 100 is heated at a first temperature for a specified time to remove moisture or gas contained in the solution. The first temperature can be set to, for example, 100℃~200℃.

[0209] For example, controller 50 detects the temperature of workpiece 100 using a thermometer (not shown) and controls the power applied to heater 32a in such a way that workpiece 100 reaches a first temperature.

[0210] By performing the heat treatment step (1), the water or gas contained in the solution can be suppressed from being contained in the formed organic film. In addition, the heat treatment step (1) can be performed multiple times by changing the temperature according to the composition of the solution, or the heat treatment step (1) can be omitted.

[0211] After the heating process (1), the heating process (2) is performed. For example, the controller 50 controls the power applied to the heater 32a based on the detection value of a thermometer (not shown).

[0212] In this case, the storage unit of the controller 50 pre-stores the second temperature in the heating process (2) and the time of the heating process (2). The calculation unit of the controller 50 controls the heater 32a so that the second temperature in the heating process (2) is reached before the time of the heating process (2) has elapsed.

[0213] After the heating step (2), the heat treatment step (2) is performed. In the heat treatment step (2), the second temperature is maintained for a specified time to form an organic film from the solution. The second temperature can be set to the temperature at which imidization occurs, for example, it can be set to 300°C or higher. For example, in the case of forming an organic film with a high degree of molecular chain filling, the second temperature can be set to 400°C to 600°C.

[0214] For example, the controller 50 detects the temperature of the workpiece 100 using a thermometer (not shown) and controls the power applied to the heater 32a in such a way that the workpiece 100 reaches a second temperature.

[0215] After the heat treatment step (2), a cooling step is performed. The cooling step is a step in which the temperature of the workpiece 100, to which the organic film has been formed, is reduced by the cooling section 40. In the cooling step, the workpiece 100 is cooled to a temperature at which it can be removed.

[0216] In addition, the temperature at which the film can be removed refers to the temperature at which the film quality formed on at least the workpiece 100 does not change even when in contact with oxygen-containing air (e.g., below 100°C).

[0217] For example, if the temperature of the workpiece 100 being moved out is at room temperature, it is easier to move the workpiece 100 out. However, if the workpiece 100 is cooled to room temperature, the temperature of the internal space of the chamber 10 or the heater 32a will be close to room temperature. Therefore, the time for the heating process (1) when processing the next workpiece 100 will be longer. That is, productivity may be reduced.

[0218] Therefore, in the cooling process of this embodiment, the temperature of the workpiece 100 is kept at about 50°C to 90°C (third temperature). In this way, since the temperature of the internal space of the chamber 10 or the temperature of the heater 32a will not drop excessively, the time of the heating process (1) when heating the next workpiece 100 is kept from becoming too long.

[0219] Furthermore, during the cooling process, fluid 101 can be supplied to the internal space of chamber 10 to directly cool workpiece 100. However, due to the large volume of the internal space of chamber 10, it is difficult to cool components that become hot, such as heater 32a and heat spreader 34. Even if fluid 101 is supplied to workpiece 100 for cooling, if the temperature of the components surrounding workpiece 100 is high, heat will be transferred from the surrounding components to workpiece 100. As a result, even if workpiece 100 is cooled directly, cooling workpiece 100 takes time. Moreover, since a large amount of fluid 101 is required, operating costs increase. Furthermore, if fluid 101 is supplied to the internal space of chamber 10, sublimation products generated during solution heating and adhering to the inner wall of chamber 10 may peel off and adhere to the organic film. If sublimation products adhere to the organic film, the quality of the organic film deteriorates.

[0220] Therefore, in the cooling process of this embodiment, fluid 101 is supplied to the space equipped with the temperature control group 3 (the space surrounded by beam 31a, upper heat spreader 34a, lower heat spreader 34b, and cover 36) to indirectly cool the workpiece 100. This allows direct cooling of the components surrounding the workpiece 100 (heater 32a and heat spreader 34). If the temperature of the components surrounding the workpiece 100 decreases, the cooling time for the workpiece 100 can be shortened. Furthermore, since the volume of the space equipped with the temperature control group 3 is small, the amount of fluid 101 can be reduced. Therefore, operating costs can be reduced.

[0221] During the cooling process, the controller 50 closes the valves 25 of the first exhaust section 21 and the second exhaust section 22. Furthermore, the controller 50 controls the cooling section 40 to supply fluid 101 to the space equipped with the temperature control group 3. By supplying fluid 101 to the space equipped with the temperature control group 3, the workpiece 100 is indirectly cooled. The controller 50 maintains the supply of fluid 101 until the temperature reading (not shown) reaches a third temperature. When the pressure reading (not shown) of the vacuum gauge used to detect the internal pressure of the chamber 10 reaches the same as atmospheric pressure, the controller 50 opens the valve 25 of the third exhaust section 23, discharging fluid 101 to the outside of the chamber 10.

[0222] Furthermore, as described below, during the cooling process, fluid 101 can also be supplied to the interior of the guide portion 32b of the temperature control unit 132 and the temperature control unit 232. This can indirectly cool the workpiece 100. Moreover, if fluid 101 is supplied to the space where the temperature control group 3 is located, and to the interior of the guide portion 32b of the temperature control unit 132 and the temperature control unit 232, the cooling process time can be shortened.

[0223] Next, the controller 50 causes the opening / closing door 13 to move away from the flange 11. Then, the workpiece 100 is moved to the outside of the chamber 10 by a conveying device (not shown).

[0224] Then, by repeating the above process, multiple organic films can be formed.

[0225] Figure 5 This is a schematic cross-sectional view illustrating the temperature control unit 132 of another embodiment.

[0226] like Figure 5 The temperature control unit 132 includes, for example, a heater 32a, a guide 32b, a support 32c, a bracket 32d, and a fluid supply unit 32e.

[0227] As described above, heat from the peripheral region of workpiece 100 is transferred to the inner wall of chamber 10 more easily than heat from the central region of workpiece 100. Therefore, the temperature of the peripheral region of workpiece 100 is tends to be lower than the temperature of the central region. In this case, if a support portion 32c is provided near the peripheral region of workpiece 100, the temperature of the peripheral region can be increased. However, even so, there are still cases where the temperature difference between the central region and the peripheral region of workpiece 100 remains large. Moreover, for example, when the output value of heater 32a is increased to raise the temperature of the peripheral region of workpiece 100, sometimes even the temperature of the central region of workpiece 100 becomes excessively high.

[0228] Therefore, the temperature control unit 132 is provided with a fluid supply unit 32e that controls the temperature of the area of ​​the guide unit 32b facing the central area of ​​the workpiece 100.

[0229] like Figure 5 As shown, the fluid supply unit 32e supplies, for example, fluid 101 to the interior of the guide unit 32b. For example, fluid 101 is supplied to a position inside the guide unit 32b facing the central region of the workpiece 100. The fluid 101 supplied to the interior of the guide unit 32b is discharged to the exterior of the guide unit 32b through the gap between the inner wall of the hole 32c1 and the heating part 32a1, or the gap between the inner wall of the guide unit 32b and the support part 32c.

[0230] Fluid supply unit 32e, for example, can be connected with Figure 1 The second flow path 40b shown is connected. Furthermore, a fluid control unit 32e1 may be provided to control the supply and cessation of fluid 101, as well as the flow rate or pressure of fluid 101. The fluid control unit 32e1 may be, for example, a mass flow controller or a needle valve.

[0231] By supplying fluid 101, the temperature of the region of guide 32b facing the central region of workpiece 100 decreases. Therefore, it is possible to prevent the temperature of the central region of workpiece 100 from being excessively higher than the temperature of the peripheral region of workpiece 100. That is, the temperature difference between the central region and the peripheral region of workpiece 100 can be reduced.

[0232] Furthermore, by controlling the flow rate or pressure of the fluid 101 using the fluid control unit 32e1, the temperature of the area of ​​the guide unit 32b facing the central region of the workpiece 100, and consequently the temperature of the central region of the workpiece 100, can also be controlled.

[0233] Furthermore, by changing the position of the supply fluid 101, the position of the temperature-controlled area of ​​the workpiece 100 can be changed.

[0234] Furthermore, the control of fluid 101 can be performed simultaneously with the control of the power applied to heater 32a, or it can be performed after the power applied to heater 32a is stopped.

[0235] Furthermore, this type of control applies to the heating process (1), the heating treatment process (1), the heating process (2), and the heating treatment process (2). In the cooling process, since only cooling can be performed, the application of electricity to the heater 32a can be stopped, and the fluid 101 can flow at a predetermined flow rate.

[0236] Furthermore, as described above, the heating process (1), the heat treatment process (1), the heating process (2), and the heat treatment process (2) are all required to be processed under a specified pressure. Therefore, when supplying fluid 101, it is preferable to use the exhaust section 60 to exhaust the fluid so that the pressure in the treatment area 30a and the treatment area 30b can be maintained at a specified pressure.

[0237] Figure 6 This is a schematic cross-sectional view illustrating the support portion 132c of another embodiment.

[0238] Figure 7 yes Figure 6 A schematic cross-sectional view of the support portion 132c along line AA.

[0239] like Figure 6 and Figure 7 As shown, the support portion 132c has an axially penetrating hole 132c1 (an example of a second hole). The internal space of the guide portion 32b is connected to the internal space of the chamber 10 via the hole 132c1. The hole 132c1 serves as the outlet for the fluid 101 supplied to the interior of the guide portion 32b. The presence of the hole 132c1 facilitates the discharge of the fluid 101, thereby increasing the flow rate of the fluid 101 supplied to the interior of the guide portion 32b. Therefore, temperature control of the guide portion 32b, and consequently, temperature control of the workpiece 100, becomes easier. In this embodiment, the fluid 101 is also supplied in the heating process (1), the heat treatment process (1), the heating process (2), and the heat treatment process (2).

[0240] In addition, fluid 101 is composed of and Figure 5 The fluid supply unit 32e shown is supplied by the same mechanism.

[0241] At least one hole 132c1 may be provided. Figure 6 and Figure 7 The illustrated support portion 132c is provided with a plurality of holes 132c1. The number and arrangement of holes 132c1 are not limited to the illustrated number and arrangement. The number and arrangement of holes 132c1 can be appropriately changed, for example, according to the diameter of the support portion 132c, the flow rate of the fluid 101, etc.

[0242] like Figure 6 As shown, fluid 101 is heated by contact with heating element 32a1 and becomes a high-temperature fluid at approximately the same temperature as heating element 32a1. The high-temperature fluid 101a discharged from hole 132c1 reaches the inner wall (opening / closing door 13) of chamber 10. Therefore, heat is continuously supplied to the inner wall (opening / closing door 13) of chamber 10, making it difficult to reduce the temperature of opening / closing door 13. If the temperature of opening / closing door 13 remains high, the cooling efficiency will be low when transferring from the heating process to the cooling process, and a long cooling time may be required. Therefore, the following describes a structure for appropriately maintaining the temperature of opening / closing door 13 (maintaining a temperature that will not hinder cooling during the cooling process).

[0243] Figure 8 yes Figure 6 A schematic cross-sectional view of the opening and closing door 13 along the BB line direction.

[0244] like Figure 8 As shown, the area reached by the fluid 101a discharged from the hole 132c1 through the opening and closing door 13 can be configured as a concave-convex surface 13a. The concave-convex surface 13a can have at least one of multiple recesses and multiple protrusions. That is, at least one of multiple recesses and multiple protrusions is provided on the inner wall surface of the chamber 10 facing the hole 132c1. The recesses can be grooves or holes. The protrusions can be protrusions or linear bodies. That is, the surface area of ​​the area reached by the fluid 101a can be larger than in the case of a flat surface. The number, size, arrangement, shape, etc. of the multiple recesses and multiple protrusions can be appropriately changed according to the flow rate or temperature of the fluid 101a.

[0245] If the area reached by the fluid 101a is an uneven surface 13a, the heat of the fluid 101a can be easily transferred to the opening / closing door 13. Therefore, the heat of the fluid 101a can be efficiently discharged to the outside of the opening / closing door 13. With this structure, the temperature of the opening / closing door 13 is prevented from becoming too high during the heat treatment process, and the internal space of the chamber 10 is easily cooled in the subsequent cooling process.

[0246] Furthermore, as described above, a cooling section 16 (e.g., a water jacket) can be provided on the outer surface of the opening / closing door 13. Therefore, as... Figure 8 As shown, the cooling capacity of the cooling section 16 located opposite the concave-convex surface 13a can be higher than that of the cooling sections 16 located in other areas of the opening / closing door 13. That is, the cooling capacity of the cooling section 16 in the region of the outer wall of the chamber 10 facing the hole 132c1 can be higher than that of the cooling section 16 in the region of the outer wall of the chamber 10 other than the region facing the hole 132c1.

[0247] For example, such as Figure 8As shown, the pipe spacing of the cooling section 16 located opposite the uneven surface 13a can be reduced. Furthermore, the cooling section 16 located opposite the uneven surface 13a and the cooling section 16 located in other areas can be provided individually. Additionally, for example, the amount of refrigerant flowing in the cooling section 16 located opposite the uneven surface 13a can be increased, or the temperature of the refrigerant can be decreased.

[0248] This allows for more efficient heat dissipation of the fluid 101a to the outside of the opening / closing door 13. Furthermore, cooling of the interior space of the chamber 10 is easier.

[0249] Next, use Figure 9 and Figure 10 Another implementation method will be described.

[0250] Figure 9 This is a schematic cross-sectional view illustrating the temperature control unit 232 of another embodiment.

[0251] like Figure 9 As shown, the temperature control unit 232 includes, for example, a heater 32a, a guide 32b, a support 32c, a bracket 32d, and multiple fluid supply units 232e.

[0252] The fluid supply unit 232e supplies, for example, fluid 101 to the interior of the guide unit 32b. Furthermore, the fluid supply unit 232e can also discharge the fluid 101 supplied to the interior of the guide unit 32b.

[0253] A fluid control unit 232e1 may be provided in the fluid supply unit 232e. The fluid control unit 232e1 may, for example, be connected to... Figure 1 The second flow path 40b shown is connected. The fluid control unit 232e1 supplies and stops the fluid 101 inside the guide section 32b, controls the flow rate or pressure of the fluid 101, and discharges the fluid 101 supplied to the guide section 32b. The fluid control unit 232e1 may, for example, have two on / off valves, or be configured as a three-way valve. Furthermore, the fluid control unit 232e1 may also have the function of controlling the flow rate or pressure of the fluid 101.

[0254] Figure 10 This is a schematic diagram illustrating the function of the fluid control unit 232e1.

[0255] Figure 10 The fluid control unit 232e1 illustrated herein has two on / off valves. One of the on / off valves can be connected to the second flow path 40b. The other on / off valve can be connected to the exhaust unit 60 (an example of a second exhaust unit), or to the plant piping, etc. The exhaust unit 60 will be described below.

[0256] For example, such as Figure 10As shown, one of the on / off valves of the central fluid control unit 232e1 is opened to supply fluid 101 into the guide section 32b. The other on / off valve of the central fluid control unit 232e1 is closed. For example, one of the on / off valves of the left-side fluid control unit 232e1 is closed, preventing the supply of fluid 101 into the guide section 32b. The other on / off valve of the left-side fluid control unit 232e1 is opened to discharge the fluid 101 supplied to the guide section 32b. For example, both on / off valves of the right-side fluid control unit 232e1 are closed.

[0257] Thus, as Figure 10 As shown, inside the guide section 32b, fluid 101 can flow from the central side to the left. Therefore, the temperature of the left side region of the guide section 32b can be controlled.

[0258] Furthermore, for example, one of the on / off valves of the fluid control unit 232e1 on the right side is closed to prevent the fluid 101 from being supplied to the interior of the guide section 32b. The other on / off valve of the fluid control unit 232e1 on the right side is opened to discharge the fluid 101 supplied to the interior of the guide section 32b. For example, both on / off valves of the fluid control unit 232e1 on the left side are closed.

[0259] Thus, as Figure 10 As shown, inside the guide section 32b, fluid 101 can flow from the central side to the right side. Therefore, the temperature of the right-side region of the guide section 32b can be controlled.

[0260] As explained above, if multiple fluid supply units 232e with fluid control units 232e1 are provided, the area of ​​the guide unit 32b where temperature control is performed can be changed. Therefore, the temperature of the workpiece 100 can be controlled more appropriately.

[0261] Furthermore, this type of control applies to the heating process (1), the heating treatment process (1), the heating process (2), and the heating treatment process (2). In the cooling process, since only cooling can be performed, the application of electricity to the heater 32a can be stopped, and the fluid 101 can flow at a predetermined flow rate.

[0262] Figure 11 This is a piping system diagram for fluid 101.

[0263] like Figure 11 As shown, the first flow path 40a is connected to the space provided with temperature control group 3a, temperature control group 3ab and temperature control group 3b.

[0264] The first flow path 40a includes, for example, a supply source 41, a pipe 43, a flow control unit 42, and a pipe 44. The flow control unit 42 is provided between the pipe 44 and the supply source 41. Specifically, the flow control unit 42 is connected to the pipe 43.

[0265] Pipe 43 is a three-way pipe with three ends 43a, 43b, and 43c. Pipe 43 is made of a metal such as stainless steel. For example, end 43a of pipe 43 is connected to the supply source 41. End 43b of pipe 43 is connected to the flow control unit 42, for example. Alternatively, pipe 43 may also be a three-way connector with three straight pipes connected to it.

[0266] Pipe 43 is connected to pipe 44 via flow control unit 42.

[0267] Pipe 44 has a structure with three end branches not connected to the flow control unit 42. For example, the three branch ends are designated as branch 44a, branch 44ab, and branch 44b. Branch 44a, branch 44ab, and branch 44b are each connected to a space provided with multiple temperature control units 32.

[0268] Branches 44a, 44ab, and 44b are connected to holes 36a in one of the covers 36 that cover the sides of the frame 31. Most of the fluid 101 supplied to the space provided with temperature control groups 3a, 3ab, and 3b is discharged from the other cover 36 through a hole 36a into the interior space of the chamber 10.

[0269] A small gap is left between the upper heat spreader 34a and the lower heat spreader 34b, which form the space where the temperature control groups 3 are located, and the beam 31a or the hood 36. Therefore, a portion of the fluid 101 supplied to the space where the temperature control groups 3a, 3ab, and 3b are located is discharged through the gaps in the upper heat spreader 34a and the lower heat spreader 34b to the processing area 30a and the processing area 30b. Furthermore, it is preferable that the conductivity of the gaps in the upper heat spreader 34a and the lower heat spreader 34b is greater than the conductivity of the hole 36a in the other hood 36, so that most of the fluid 101 supplied to the space where the temperature control groups 3a, 3ab, and 3b are located is discharged through the hole 36a in the other hood 36.

[0270] The second flow path 40b is connected to the temperature control unit 32 and temperature control unit 232 (fluid control unit 32e1 and fluid control unit 232e1) provided in the temperature control group 3a, temperature control group 3ab and temperature control group 3b.

[0271] The second flow path 40b, for example, includes a supply source 41, piping 43, piping 45, a flow control unit 42, and piping 46. It can share the supply source 41 with the first flow path 40a. Alternatively, the flow control unit 42 can be omitted.

[0272] One end of pipe 45 is connected to end 43c of pipe 43 via a connector (not shown). The other end of pipe 45 branches into three parts. Each branch is designated as branch 45a, branch 45ab, and branch 45b. In this embodiment, since branch 45a, branch 45ab, and branch 45b have the same structure, only branch 45a will be described for simplicity.

[0273] Branch 45a may also have multiple branches. In this embodiment, in order to divide the processing area 30a (processing area 30b) into a central part and two sides for temperature control, branch 45a has three branches.

[0274] The three branches of branch 45a are designated as branch 45a1, branch 45a2, and branch 45a3 (on the other hand, the three branches of branch 45b are designated as branch 45b1, branch 45b2, and branch 45b3, and the three branches of branch 45ab are designated as branch 45ab1, branch 45ab2, and branch 45ab3).

[0275] Branch sections 45a1, 45a2, and 45a3 are connected to the flow control unit 42. Furthermore, branch sections 45a1, 45a2, and 45a3 are respectively connected to the piping 46 via the flow control unit 42.

[0276] The end of the piping 46 opposite to the end connected to the flow control unit 42 branches in the number of temperature control units 32 located in the central portion and on both sides of the processing area 30a (processing area 30b). In this embodiment, the piping 46 is a hexagonal structure with six ends. Alternatively, the piping 46 may have a structure that combines multiple connectors and multiple straight pipes, or a structure that combines multiple connectors and multiple pipes.

[0277] Piping 46 can be connected, for example, to fluid control unit 32e1 or fluid control unit 232e1 (see reference). Figure 5 , Figure 9 ).

[0278] Exhaust from the fluid control unit 232e1 can be connected to the plant piping, for example.

[0279] In this case, such as Figure 10 and Figure 11As shown, the exhaust side of the fluid control unit 232e1 can also be connected to the exhaust unit 60. The exhaust unit 60 draws fluid 101 discharged from the fluid control unit 232e1 at a pressure lower than the internal pressure of the chamber 10. The exhaust unit 60 may include, for example, a tank and an exhaust pump. In this way, the fluid 101 supplied to the inside of the guide unit 32b can be easily discharged to the outside of the guide unit 32b. Therefore, the flow of fluid 101 inside the guide unit 32b becomes smooth. As a result, partial control of the guide unit 32b is easy.

[0280] Furthermore, the temperature in the central region of processing zone 30a (processing zone 30b) tends to be higher than the temperature in the regions on either side of the central region. If a temperature difference occurs within processing zone 30a (processing zone 30b), it may lead to temperature differences within the surface of workpiece 100. If a temperature difference exists within the surface of workpiece 100, it may cause the composition of the organic film to become uneven and its quality to deteriorate. In this case, if the fluid 101 is controlled separately in the central region of processing zone 30a (processing zone 30b) and in the regions on either side of the central region, the temperature difference in workpiece 100 can be suppressed.

[0281] For example, the flow control units 42 provided in the branch 45a can be controlled so that the flow rate of fluid 101 in the branch 45a2 is greater than the flow rate of fluid 101 in the branch 45a1 and the branch 45a3 (see reference). Figure 11 Branches 45ab and 45b can also be controlled in the same way.

[0282] The embodiments have been illustrated above. However, the present invention is not limited to these descriptions.

[0283] Furthermore, any implementation method that the manufacturer appropriately adds design changes to include the features of the present invention is also included within the scope of the present invention.

[0284] Furthermore, the elements included in each of the embodiments can be combined as much as possible, and any element obtained by combining them is also included in the scope of the present invention as long as it contains the features of the present invention.

Claims

1. An organic film forming apparatus capable of heating a workpiece comprising a substrate and a solution containing organic material and solvent coated on the upper surface of the substrate under reduced pressure relative to atmospheric pressure. The organic film forming apparatus includes: The chamber is capable of maintaining the reduced pressure environment relative to atmospheric pressure; The first exhaust section is capable of venting air from the interior of the chamber; The guide section faces the workpiece supported in the cavity and has a cylindrical shape that extends in one direction, with the open ends on both sides located inside the cavity. The support portion, located inside the guide portion, has a first hole extending axially; as well as The heater has a heating element that is detachably disposed in the first hole and extends along the guide portion.

2. The organic film forming apparatus according to claim 1, wherein, viewed from a direction perpendicular to the surface of the workpiece, the support portion is disposed at a position overlapping the periphery of the workpiece.

3. The organic film forming apparatus according to claim 1 or 2, wherein the outer wall of the chamber is provided with a hole for inserting the heater into the guide portion. A bracket is provided on the outer wall for airtightly connecting the heater to the outer wall.

4. The organic film forming apparatus according to claim 1 or 2, wherein a conical surface is provided at the opening of the first hole.

5. The organic film forming apparatus according to claim 1 or 2, wherein the interior of the guide portion further includes at least one fluid supply portion capable of supplying fluid.

6. The organic film forming apparatus according to claim 5, wherein the fluid supply unit is provided with a plurality of components. Each of the plurality of fluid supply units has a fluid control unit capable of controlling the fluid supplied to the interior of the guide unit.

7. The organic film forming apparatus according to claim 6, wherein the fluid control unit can also control the discharge of the fluid supplied to the interior of the guide unit. The fluid discharge side of the fluid control unit is connected to the second exhaust unit. The second exhaust section is capable of drawing the fluid discharged from the fluid control section at a pressure lower than the internal pressure of the chamber.

8. The organic film forming apparatus according to claim 1 or 2, wherein the support portion has a second hole extending axially. The internal space of the guide portion is connected to the internal space of the chamber via the second hole.

9. The organic film forming apparatus according to claim 8, wherein at least one of a plurality of recesses and a plurality of protrusions is provided in the region of the inner wall surface of the chamber facing the second hole.

10. The organic film forming apparatus according to claim 8, further comprising: A cooling section is located on the outer wall of the chamber. The cooling capacity of the cooling section in the region of the outer wall of the chamber facing the second hole is higher than the cooling capacity of the cooling section in the region of the outer wall of the chamber other than the region facing the second hole.

Images