Minimum contact retention of thin optical devices

CN116547223BActive Publication Date: 2026-09-01APPLIED MATERIALS INC
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Patent Information

Application Number
CN202180081978.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-04-22
Filing Date
2021-11-01
Publication Date
2026-09-01
Estimated Expiration
2041-11-01

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Technical Problem

此外,施加在结构上的一些涂层很敏感,并且可能在处理期间被损坏

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Abstract

The embodiments described herein provide apparatus and methods for holding optical devices. These apparatuses and methods provide methods for holding a substrate without contacting sensitive portions of the substrate. These apparatuses and methods utilize holding pads or vacuum pins to contact restricted areas, i.e., passive areas of the substrate, to hold the substrate and prevent lateral movement. Furthermore, the holding force holds the substrate vertically without contacting it. These methods provide methods for adjusting the apparatus to accommodate various substrate geometries. These methods further provide methods for adjusting the apparatus, such as adjusting the gap between the optical device and the suction pad, to change the holding force of the apparatus on the optical device.
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Description

Technical Field

[0001] The embodiments of this disclosure generally relate to optical devices. More specifically, the embodiments described herein relate to methods for holding optical devices. Background Technology

[0002] Optical devices, including waveguide combiners (such as augmented reality waveguide combiners) and planar optical devices (such as metasurfaces), are used to help overlay images. The generated light propagates through the optical device until it leaves the device and overlaps with the surrounding environment.

[0003] Optical devices typically include structures mounted on them. These devices and structures are formed of thin, brittle materials that can be damaged when exposed to external stress or contaminants. Furthermore, some coatings applied to the structures are sensitive and can be damaged during processing. Therefore, optical devices are susceptible to damage when transferred between different processing tools. It is difficult to hold (e.g., clamp) optical devices without damaging, deflecting, or leaving marks and residues. Moreover, it is desirable to hold the different contours of an optical device using a single device. Therefore, what is needed in the art is a device and method for holding optical devices. Summary of the Invention

[0004] In one embodiment, an apparatus is provided. The apparatus includes a base plate coupled to a rod. The apparatus further includes a suction pad disposed on the rod. The suction pad is operable to provide a holding force to a substrate to be held. The apparatus further includes a plurality of arms extending radially from the rod and the suction pad. The plurality of arms are coupled to a plurality of actuators. The actuators are operable to extend the plurality of arms in a lateral or vertical direction. The apparatus further includes a retaining pad disposed on each of the plurality of arms.

[0005] In another embodiment, an apparatus is provided. The apparatus includes a base plate. The apparatus further includes a lug disposed along a periphery of the apparatus. The periphery has a shape corresponding to a substrate to be held on the lug. The base plate is recessed from the lug. The apparatus further includes a plurality of vacuum pins disposed on the lug. The plurality of vacuum pins are coupled to a vacuum source. The plurality of vacuum pins are operable to provide a vacuum force to the substrate disposed on the lug when the substrate is held.

[0006] In another embodiment, a method for holding a substrate is provided. The method includes adjusting holding pads disposed on a plurality of arms of a holding device. These holding pads define a holding region corresponding to the surface area of ​​the substrate to be held. The plurality of arms are radially disposed from a suction pad, and the suction pad is operable to provide a holding force to the substrate. The method further includes adjusting the gap between the suction pad and the substrate to be held. The method further includes activating the suction pad to provide a holding force to the substrate to be held. Attached Figure Description

[0007] To gain a more detailed understanding of the features described above in this disclosure, reference can be made to embodiments to obtain a more specific description of the disclosure briefly outlined above, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings illustrate only exemplary embodiments and should not be construed as limiting their scope, and other equally effective embodiments may be permitted.

[0008] Figure 1A This is a schematic cross-sectional view of the holding device according to an embodiment.

[0009] Figure 1B This is a schematic top view of the holding device according to an embodiment.

[0010] Figure 2A This is a schematic cross-sectional view of the holding device according to an embodiment.

[0011] Figure 2B This is a schematic top view of the holding device according to an embodiment.

[0012] Figure 3A This is a schematic perspective view of the retaining pad according to an embodiment.

[0013] Figure 3B This is a schematic perspective view of the retaining pad according to an embodiment.

[0014] Figure 4 This is a schematic top view of the holding device according to an embodiment.

[0015] To facilitate understanding, the same reference numerals are used to denote common elements in the drawings, where possible. Elements and features of one embodiment are contemplated to be advantageously incorporated into other embodiments without further description. Detailed Implementation

[0016] Embodiments of this disclosure generally relate to optical devices. More specifically, embodiments described herein relate to methods for holding optical devices. In one embodiment, a means for holding an optical device includes a substrate coupled to a rod. A suction pad is disposed on the rod and is operable to provide a holding force to a substrate to be held by the means. A plurality of arms extend radially from the rod and the suction pad. The plurality of arms are coupled to a plurality of actuators, which are operable to extend the plurality of arms in a lateral or vertical direction. A holding pad is disposed on each of the plurality of arms.

[0017] In another embodiment, the means for holding the optical device includes a substrate. The means further includes a lug disposed along a periphery of the means having a shape corresponding to a substrate to be held on the lug. The substrate is recessed from the lug. A plurality of vacuum pins are disposed on the lug and coupled to a vacuum source. The plurality of vacuum pins are operable to provide a vacuum force to the substrate disposed on the lug when the substrate is held.

[0018] Figure 1A This is a schematic cross-sectional view of the holding device 100 according to the embodiments described herein. The holding device 100 is operable to hold the substrate 102. The holding device 100 is operable to transfer and transport the substrate 102. Furthermore, the holding device 100 is operable to hold the substrate 102 during processing.

[0019] The substrate 102 can be any substrate used in the art, and may be opaque or transparent depending on the intended use of the substrate. Furthermore, substrate selection may further include varying the shape, thickness, and diameter of the substrate 102. In one embodiment that can be combined with other embodiments described herein, the substrate 102 includes, but is not limited to, glass, silicon carbide, or combinations thereof. In another embodiment that can be combined with other embodiments described herein, the substrate 102 is a waveguide combiner or a planar optical device (such as a metasurface). In yet another embodiment that can be combined with other embodiments described herein, the substrate 102 may have an optical device structure patterned on a first surface 103 or a second surface 105 of the substrate 102.

[0020] The holding device 100 includes a base plate 104, a rod 106, a suction pad 110, a plurality of arms 108, and a holding pad 112. In one embodiment, which can be combined with other embodiments described herein, the base plate 104 is coupled to the surface of a device (such as a transfer robot). In another embodiment, which can be combined with other embodiments described herein, the base plate 104 is configured as a handle. For example, the base plate 104 may be configured as a handle for manual use of the holding device 100. The base plate 104 is coupled to the rod 106. The rod 106 supports the plurality of arms 108. The plurality of arms 108 are coupled to the rod 106 and are arranged radially around the rod 106.

[0021] Each of the multiple arms 108 includes a retaining pad 112. The retaining pad 112 is configured to retain the substrate 102. In one embodiment, which can be combined with other embodiments described herein, the substrate 102 has a surface area of ​​approximately 18 cm². 2 With approximately 20cm 2 The optical device lens is held between the optical device lenses. The holding device 100 has a holding area defined by the holding pad 112. The holding area corresponds to the surface area of ​​the optical device lens, such that the optical device lens is held by the holding device 100.

[0022] The retaining pad 112 utilizes corner contacts or contacts on the exclusion zone (i.e., the inactive area of ​​the substrate 102) of the substrate 102. Therefore, sensitive portions of the substrate 102, such as optical device structures and coatings, will not be damaged during transport or processing. Figure 3A and Figure 3B As shown, retaining pad 112 can be configured to include contact pad 114 (e.g., Figure 1A (As shown) or one of the vacuum pads 302. Although in Figure 1A and Figure 1B Only three retaining pads 112 are shown in the figure, but any number of retaining pads 112 can be used to hold the substrate 102. In addition, any number of multiple arms 108 can be used to support the retaining pads 112.

[0023] Rod 106 supports suction pad 110. Suction pad 110 provides suction to substrate 102 without physical contact with substrate 102. In one embodiment, which can be combined with other embodiments described herein, suction pad 110 can generate a holding force on substrate 102 using Bernoulli's principle. While the force from suction pad 110 holds substrate 102 in the vertical direction (i.e., the Z direction), holding pad 112 prevents lateral movement of substrate 102, i.e., movement in the X direction. Rod 106 may further include inlet 118. Inlet 118 supplies air to or removes air from suction pad 110 from an external air source or an external vacuum source to enable the generation of holding force. Suction pad 110 can be any device operable to provide a holding force to substrate 102 without contacting substrate 102.

[0024] In one embodiment, which can be combined with other embodiments described herein, the plurality of arms 108 may include actuators. Each of the plurality of arms 108 may include an actuator. The actuators in the plurality of arms are adjustable in a radial distance 109. The radial distance 109 is the length of the plurality of arms extending from the rod 106, i.e., the length from the rod 106 to the outer edge 111 of the plurality of arms 108. The radial distance 109 of the plurality of arms 108 may be adjusted based on the geometry of the substrate 102. Additionally, the radial distance of the plurality of arms 108 may be adjusted based on the location of a forbidden region on the substrate 102. The actuator may be a microactuator. In another embodiment, which can be combined with other embodiments described herein, the plurality of arms 108 including actuators are adjustable vertically, i.e., adjusted in the Z direction. The actuators in the plurality of arms 108 are adjustable in a gap 116. The gap 116 is the length from the suction pad 110 to the second surface 105 of the substrate 102. As the gap 116 decreases, the strength of the holding force on the substrate 102 increases. The gap 116 can be adjusted to ensure that the substrate 102 is not deflected.

[0025] Figure 1B This is a schematic top view of the holding device 100. The holding device 100 includes a base plate 104, a rod 106, a suction pad 110, a plurality of arms 108, and a holding pad 112. In one embodiment, which can be combined with other embodiments described herein, the base plate 104 may be coupled to a surface via a plurality of through holes 119. For example, the plurality of through holes 119 allow the holding device 100 to be coupled to a device operable to transfer and move the substrate 102, such as a transfer robot.

[0026] In one embodiment, which can be combined with other embodiments described herein, the holding device 100 includes a light source 120. The light source 120 is coupled to the holding device 100. The light source 120 can provide light for additional processing of the substrate 102. For example, the light source 120 can provide light for a curing process, such as by providing ultraviolet light to the substrate 102. The light source 120 can be used to provide illumination to the environment surrounding the holding device 100. In another embodiment, which can be combined with other embodiments described herein, the light source 120 is a ring light, i.e., the light source 120 is ring-shaped such that light is provided uniformly or substantially uniformly to the substrate 102.

[0027] In one embodiment, which can be combined with other embodiments described herein, the holding device 100 includes a vision system 122. The vision system 122 includes a plurality of ports 123 disposed on a plurality of arms 108. The plurality of ports 123 are operable to accommodate one or more devices, such as one or more cameras or sensors. The vision system 122 may include a controller coupled to the plurality of ports 123. The controller may then utilize the vision system 122 to facilitate the handling and transport of the substrate 102. One or more cameras accommodated in the plurality of ports 123 are operable to assist metrological processing and improve positioning accuracy when positioning the holding pad 112 around the substrate 102. One or more sensors accommodated in the plurality of ports 123 may be proximity sensors and are operable to communicate with the controller. For example, the sensors may communicate with the controller when the substrate 102 is held by the holding device 100. Figure 1B The illustration shows a vision system 122 having three of the multiple ports 123, but one or more of the multiple ports 123 may also be used. Any number of devices, such as one or more cameras and sensors, may be used with the holding device 100. Additionally, the multiple ports 123 may be located on other parts of the holding device 100, and are not limited to being located on multiple arms 108.

[0028] Figure 2A This is a schematic cross-sectional view of the holding device 200 according to the embodiments described herein. The holding device 200 is operable to hold the substrate 102. The holding device 200 is operable to transfer and transport the substrate 102. Furthermore, the holding device 200 is operable to hold the substrate 102 during processing.

[0029] The substrate 102 can be any substrate used in the art, and can be opaque or transparent depending on the application of the substrate. Furthermore, substrate selection may further include varying the shape, thickness, and diameter of the substrate 102. In one embodiment that can be combined with other embodiments described herein, the substrate 102 includes, but is not limited to, glass, silicon carbide, or combinations thereof. In another embodiment that can be combined with other embodiments described herein, the substrate 102 is a waveguide combiner or a planar optical device (such as a metasurface). In yet another embodiment that can be combined with other embodiments described herein, the substrate 102 may have an optical device structure patterned on a first surface 103 or a second surface 105.

[0030] The holding device 200 includes a base plate 204, a rod 206, a suction pad 210, a plurality of arms 208, and a holding pad 212. In one embodiment, which can be combined with other embodiments described herein, the base plate 204 is coupled to the surface of a device (such as a transfer robot). In another embodiment, which can be combined with other embodiments described herein, the base plate 204 is configured as a handle. For example, the base plate 204 may be configured as a handle for manual use of the holding device 200. The base plate 204 is coupled to the rod 206. The rod 206 supports the plurality of arms 208. The plurality of arms 208 are coupled to the rod 206 and are arranged radially around the rod 206.

[0031] Each of the multiple arms 208 includes a retaining pad 212. The retaining pad 212 is configured to retain the substrate 102. In one embodiment, which can be combined with other embodiments described herein, the substrate 102 has a surface area of ​​approximately 18 cm². 2 With approximately 20cm 2 The optical device lens is held between the optical device lenses. The holding device 200 has a holding area defined by the holding pad 212. The holding area corresponds to the surface area of ​​the optical device lens, such that the optical device lens is held by the holding device 200.

[0032] The retaining pad 212 utilizes corner contacts or contacts on the forbidden areas of the substrate 102 (i.e., passive areas of the substrate 102). Therefore, sensitive portions of the substrate 102, such as optical device structures and coatings, will not be damaged during transport or handling. Figure 3A and Figure 3B As shown, retaining pad 212 can be configured to include contact pad 114 (e.g., Figure 2A (As shown) or one of the vacuum pads 302. Although in Figure 2A and Figure 2B Only three retaining pads 212 are shown in the figure, but any number of retaining pads 212 can be used to hold the substrate 102. In addition, any number of multiple arms 208 can be used to support the retaining pads 212.

[0033] Rod 106 supports suction pad 210. Suction pad 210 provides suction to substrate 102 without physical contact with substrate 102. In one embodiment, which can be combined with other embodiments described herein, suction pad 210 can utilize the Coanda effect (…). The retaining pad 212 generates a holding force on the substrate 102. While the force from the suction pad 210 holds the substrate 102 vertically (i.e., in the Z direction), the retaining pad 212 prevents lateral movement of the substrate 102, i.e., movement in the X direction. The rod 206 may further include an inlet 218. The inlet 218 supplies air to the suction pad 210 from an external air source or removes air from the suction pad 210 from the suction pad 110 to enable the generation of the retaining force. The suction pad 210 can be any device operable to provide a retaining force to the substrate 102 without contacting it.

[0034] In one embodiment, which can be combined with other embodiments described herein, the plurality of arms 208 may include actuators. Each of the plurality of arms 208 may include an actuator. The actuators in the plurality of arms are adjustable in a radial distance 209. The radial distance 209 is the length of the plurality of arms extending from the rod 206, i.e., the length from the rod 206 to the outer edge 211 of the plurality of arms 208. The radial distance 209 of the plurality of arms 208 may be adjusted based on the geometry of the substrate 102. Additionally, the radial distance 209 of the plurality of arms 208 may be adjusted based on the location of a forbidden area on the substrate 102. The actuator may be a microactuator. In another embodiment, which can be combined with other embodiments described herein, the plurality of arms 108 including actuators are adjustable vertically, i.e., adjusted in the Z direction. The actuators in the plurality of arms 208 are adjustable in a gap 216. The gap 216 is the length from the suction pad 210 to the second surface 105 of the substrate 102. As the gap 216 decreases, the strength of the holding force on the substrate 102 increases. The gap 216 can be adjusted to ensure that the substrate 102 is not deflected.

[0035] Figure 2B This is a schematic top view of the holding device 200. The holding device 200 includes a base plate 204, a rod 206, a suction pad 210, a plurality of arms 208, and a holding pad 212. In one embodiment, which can be combined with other embodiments described herein, the base plate 204 may be coupled to a surface via a plurality of through holes 219. For example, the plurality of through holes 219 allow the holding device 200 to be coupled to a device operable to transfer and move the substrate 102, such as a transfer robot.

[0036] The suction pad 210 includes a plurality of pores 224. The plurality of pores communicate with the inlet 218. Therefore, air can be supplied or removed through the plurality of pores 224 to generate a holding force on the substrate 102. For example, the holding force on the substrate can be generated by a vacuum force applied through the plurality of pores 224, such as by utilizing the Coanda effect.

[0037] In one embodiment, which can be combined with other embodiments described herein, the holding device 200 includes a light source 220. The light source 220 is coupled to the holding device 100. The light source 220 can provide light for additional processing of the substrate 102. For example, the light source 220 can provide light for a curing process, such as by providing an ultraviolet beam to the substrate 102. The light source 220 can be used to provide illumination to the environment surrounding the holding device 200. In another embodiment, which can be combined with other embodiments described herein, the light source 220 is an annular light, i.e., the light source 220 is annular in shape, such that light is provided uniformly or substantially uniformly to the substrate 102.

[0038] In one embodiment, which can be combined with other embodiments described herein, the holding device 200 includes a vision system 222. The vision system 222 includes a plurality of ports 223 disposed on a plurality of arms 208. The plurality of ports 223 are operable to accommodate one or more devices, such as one or more cameras or sensors. The vision system 222 may include a controller coupled to the plurality of ports 223. The controller may then utilize the vision system 222 to facilitate the handling and transport of the substrate 102. One or more cameras accommodated in the plurality of ports 223 are operable to assist metrological processing and improve positioning accuracy when positioning the holding pad 212 around the substrate 102. One or more sensors accommodated in the plurality of ports may be proximity sensors and are operable to communicate with the controller. For example, the sensors may communicate with the controller when the substrate 102 is held by the holding device 100. Figure 2B The illustration shows a vision system 222 having three of the multiple ports 223, but one or more of the multiple ports 223 can also be used. Any number of devices, such as one or more cameras and sensors, can be used with the holding device 200. Additionally, the multiple ports 223 can be located on other parts of the holding device 200, and are not limited to being located on the multiple arms 208.

[0039] Figure 3A This is a schematic perspective view of retaining pads 112 and 212. Retaining pads 112 and 212 are operable to contact substrate 102 in retaining device 100 or retaining device 200. Retaining pads 112 and 212 are disposed on one of the plurality of arms 108 and 208. Retaining pads 112 and 212 contact substrate 102 in a restricted or passive region of substrate 102.

[0040] In one embodiment that can be combined with other embodiments described herein, retaining pads 112, 212 are configured to include a contact pad 114. The contact pad 114 provides friction and prevents lateral movement of the substrate 102. In one embodiment that can be combined with other embodiments described herein, the contact pad 114 is a low-contact friction pad located below a transport area of ​​the substrate 102. The contact pad 114 provides a vacuum force to the substrate 102 in a restricted area, minimizing damage to the active areas of the substrate 102. The contact pad 114 comprises, but is not limited to, polymeric materials, such as carbon-filled polyetheretherketone (PEEK) or unfilled PEEK.

[0041] Figure 3B This is a schematic perspective view of retaining pads 112 and 212. Retaining pads 112 and 212 are operable to contact substrate 102 in retaining device 100 or retaining device 200. Retaining pads 112 and 212 contact substrate 102 on a restricted or passive region of substrate 102.

[0042] In one embodiment, which can be combined with other embodiments described herein, retaining pads 112, 212 are configured to include a vacuum pad 302. The vacuum pad 302 can be used in place of the contact pad 114 (e.g., ...). Figure 1A , Figure 1B , Figure 2A ,and Figure 2B (As shown). A vacuum pad provides a vacuum force on substrate 102. Vacuum pad 302 may communicate with inlets 118, 218. In another embodiment, which may be combined with other embodiments described herein, the diameter of the vacuum pad is approximately 1 mm. Vacuum pad 302 provides a vacuum force to substrate 102 in a restricted area, thereby minimizing damage to the active area of ​​substrate 102.

[0043] Figure 4 This is a schematic top view of the holding device 400 according to the embodiments described herein. The holding device 400 is operable to hold the substrate 102. The holding device 400 is operable to transfer and transport the substrate 102. Furthermore, the holding device 400 is operable to hold the substrate 102 during processing (such as in back-end processing).

[0044] The retaining device 400 includes a lug 402. The lug 402 is disposed along the periphery 401 of the retaining device 400. In one embodiment, which can be combined with other embodiments described herein, the lug 402 is about 0.5 mm to about 1 mm wide. In one embodiment, which can be combined with other embodiments described herein, the substrate 102 has a surface area of ​​about 18 cm². 2 With approximately 20cm 2The optical device lens is held between the two. The holding device 400 has a holding area defined by a periphery 401. The holding area corresponds to the surface area of ​​the optical device lens, such that the optical device lens is held by the holding device 400. The lug 402 is operable to prevent lateral movement of the substrate 102. The substrate 102 rests on the lug 402 such that the lug 402 only contacts the forbidden area of ​​the substrate 102. The substrate 102 rests on the lug 402 such that the substrate is sufficiently flat. The holding device 400 may have a matte finish on the lug 402. The lug 402 has a surface texture of about 1.6 μm to about 3.2 μm.

[0045] The lug further includes a vacuum region 404. The vacuum region 404 corresponds to a forbidden region of the substrate 102. The vacuum region 404 includes a plurality of vacuum pins 406. The plurality of vacuum pins 406 can be machined. When the substrate 102 is placed on the lug 402, the plurality of vacuum pins 406 support the substrate 102. The plurality of vacuum pins 406 are capable of providing a vacuum force to the substrate 102. For example, the plurality of vacuum pins 406 are in communication with a vacuum source. Therefore, the plurality of vacuum pins 406 provide a vacuum force to the substrate 102 to hold the substrate 102 on the lug 402. In one embodiment, which can be combined with other embodiments described herein, the plurality of vacuum pins 406 have an encapsulation coating disposed thereon. When the substrate 102 contacts the plurality of vacuum pins 406, the encapsulation coating protects the substrate 102. The encapsulation coating includes, but is not limited to, polyimide materials or other thermosetting materials.

[0046] The holding device 400 includes a further base plate 408. The base plate is recessed from the lug 402. The base plate 408 is recessed so that sensitive portions of the substrate 102 (such as optical device structures and coatings) are not damaged during transport or handling by contact with the base plate 408. In one embodiment, which can be combined with other embodiments described herein, the base plate 408 may be coupled to a surface via a plurality of through holes 418. For example, the plurality of through holes 418 allow the holding device 400 to be coupled to a device operable to transport and handle the substrate 102, such as a transfer robot.

[0047] In one embodiment, which can be combined with other embodiments described herein, the holding device 400 includes a light source 420. The light source 420 is coupled to the holding device 400. The light source 420 can provide light for additional processing of the substrate 102. For example, the light source 420 can provide light for a curing process, such as by providing an ultraviolet beam to the substrate 102. The light source 420 can be used to provide illumination to the environment surrounding the holding device 400. In another embodiment, which can be combined with other embodiments described herein, the light source 420 is a ring light, i.e., the light source 420 is ring-shaped such that light is provided uniformly or substantially uniformly to the substrate 102.

[0048] In one embodiment, which can be combined with other embodiments described herein, the holding device 400 includes a vision system 422. The vision system 422 includes a plurality of ports 423 disposed on a substrate 408. The plurality of ports 423 are operable to accommodate one or more devices, such as one or more cameras or sensors. The vision system 422 may include a controller coupled to the plurality of ports 423. The controller may then utilize the vision system 422 to facilitate the handling and transport of the substrate 102. One or more cameras accommodated in the plurality of ports 423 are operable to assist metrological processing and improve positioning accuracy when positioning a plurality of vacuum pins 406 onto the substrate 102. One or more sensors accommodated in the plurality of ports 423 may be proximity sensors and are operable to communicate with the controller. For example, the sensors may communicate with the controller when the substrate 102 is held by the holding device 400. Although Figure 4 The illustration shows a vision system 422 having three of the multiple ports 423, but one or more of the multiple ports 423 can also be used. Any number of devices, such as one or more cameras and sensors, can be used with the holding device 400. Additionally, the multiple ports 423 can be located on other parts of the holding device 400, and are not limited to being located on the base plate 408.

[0049] This document describes a method for holding (e.g., clamping) a substrate 102 using a holding device 100 or 200. At a first operation, a plurality of arms 108, 208 are adjusted according to the geometry of the substrate 102. The plurality of arms 108, 208 are adjusted such that holding pads 112, 212 disposed on the plurality of arms 108, 208 contact corners or restricted areas of the substrate 102. The holding pads 112, 212 define holding areas of the holding device 100, 200. The holding areas correspond to the surface area of ​​the substrate 102 to be held. Adjusting the plurality of arms 108, 208 includes changing radial distances 109, 209. At a second operation, gaps 116, 216 are adjusted. Gap 116, 216 is the length from a suction pad 110 to a second surface 105 of the substrate 102. Gap 116, 216 is adjusted to increase or decrease the holding force exerted by the suction pads 110, 210 on the substrate 102. At the third operation point, substrate 102 is held by holding devices 100, 200. Substrate 102 is in contact with holding pads 112, 212. Suction pads 110, 210 provide a holding force to substrate 102 upon activation. In one embodiment, which can be combined with other embodiments described herein, processes such as metering of substrate 102, UV curing, or improving the positioning accuracy of holding substrate 102 are performed during the method using light sources 120, 220 and vision systems 122, 222.

[0050] This document describes a method for holding (e.g., clamping) a substrate 102 using a holding device 400. At a first operation, the substrate 102 is placed on a lug 402 of the holding device 400. The lug 402 is disposed along a periphery 401 of the holding device 400. The holding device 400 has a holding region defined by the periphery 401. The holding region corresponds to the surface area of ​​the substrate 102 to be held. A base plate 408 is recessed from the lug 402 such that the substrate 102 is contacted only in the restricted area. At a second operation, a plurality of vacuum pins 406 are activated. The plurality of vacuum pins 406 provide a holding force to the substrate 102 to hold the substrate 102 on the holding device 400. In one embodiment, which can be combined with other embodiments described herein, a light source 420 and a vision system 422 are used during the method to perform processes such as metering of the substrate 102, ultraviolet curing, or improving the positioning accuracy of holding the substrate 102.

[0051] In summary, this document illustrates and describes apparatus and methods for holding optical devices. The holding apparatus and methods described herein provide a way to hold a substrate without contacting sensitive portions of the substrate. For example, the optical device structure and coating on the substrate are not damaged during transport or handling. Furthermore, the holding apparatus prevents substrate deflection. The holding apparatus and methods for holding optical devices utilize corner contacts or contacts on restricted areas (i.e., passive areas of the substrate) to hold the substrate and prevent lateral movement of the substrate. Additionally, the holding force holds the substrate vertically without contacting it. The holding apparatus described herein can be adjustable to accommodate various substrate geometries, thus improving tooling throughput and reducing errors during substrate handling.

[0052] Although examples of this disclosure have been mentioned above, other and further examples of this disclosure may be devised without departing from the essential scope of this disclosure, and the scope of this disclosure is defined by the appended claims.

Claims

1. A device for holding an optical apparatus, comprising: A base plate, said base plate being coupled to the rod; A suction pad, disposed on the rod, is operable to provide a holding force to a substrate to be held; Multiple arms, the multiple arms being directly coupled to the rod and extending radially from the rod and the suction pad, each of the multiple arms including an actuator operable to independently move the multiple arms in a lateral direction; as well as Retaining pads, wherein the retaining pads are disposed on each of the plurality of arms, wherein The actuators of the plurality of arms are operable to further move the plurality of arms in the vertical direction to adjust the gap between the suction pad and the substrate to be held, thereby increasing or decreasing the holding force provided by the suction pad on the substrate.

2. The apparatus of claim 1, further comprising an inlet coupled to the rod, the inlet being in communication with an air source and the suction pad.

3. The apparatus of claim 2, wherein the suction pad includes a plurality of pores communicating with the air source via the inlet, the plurality of pores being configured to pass through the suction pad.

4. The apparatus of claim 1, wherein each of the retaining pads contacts a corner of the substrate.

5. The apparatus of claim 1, wherein the light source is coupled to the plurality of arms.

6. The apparatus of claim 1, wherein the vision system is coupled to the plurality of arms, the vision system comprising one or more cameras coupled to the controller.

7. The apparatus of claim 1, wherein the vision system is coupled to the plurality of arms, the vision system comprising one or more sensors coupled to the controller.

8. The apparatus of claim 1, wherein the retaining pad is configured to include a contact pad operable to contact a corner of the substrate when the substrate is held.

9. The apparatus of claim 1, wherein the holding pad is configured to include a vacuum pad operable to provide a vacuum force to a passive portion of the substrate when the substrate is held.

10. A method for holding a substrate, comprising the following steps: Adjust the holding pads disposed on a plurality of arms of the holding device, each of the plurality of arms including an actuator operable to independently move the plurality of arms in a lateral direction, the holding pads defining a holding area corresponding to the surface area of ​​the substrate to be held, the plurality of arms being directly coupled to a rod and radially disposed from a suction pad operable to provide a holding force to the substrate; Adjust the gap between the suction pad and the substrate to be held; as well as The suction pad is activated to provide the holding force to the substrate to be held. The actuator of the plurality of arms moves the plurality of arms in a vertical direction to adjust the gap between the suction pad and the substrate to be held, thereby increasing or decreasing the holding force provided by the suction pad on the substrate.

11. The method of claim 10, wherein the retaining pad contacts the corner of the substrate.

12. The method of claim 10, wherein when the substrate is held, the holding pad contacts a corner of the substrate.

13. The method of claim 10, wherein when the substrate is held, the holding pad provides a vacuum force to a passive portion of the substrate.

14. The method of claim 10, further comprising the following steps: Metering or curing processes are performed using a light source or vision system coupled to the holding device.

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