Systems and methods of foldable multi-modal bend sensors

CN116547499BActive Publication Date: 2026-06-23RIDONG TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
RIDONG TECH CO LTD
Filing Date
2021-11-24
Publication Date
2026-06-23

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Abstract

Disclosed embodiments include systems and methods for additive manufacturing (e.g., "printing," etc.) a flexure sensor as a 2D structure that can later be configured as a 3D or stacked structure. Further disclosed embodiments include a flexure sensor having a foldable sensing region that can be configured as a 3D or stacked structure. A differential strain in the sensing region is linearly proportional to a displacement measured from an end point of the sensing region. The differential strain can be measured as a differential change in a capacitance of the sensing region.
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