Systems and methods of foldable multi-modal bend sensors
CN116547499BActive Publication Date: 2026-06-23RIDONG TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- RIDONG TECH CO LTD
- Filing Date
- 2021-11-24
- Publication Date
- 2026-06-23
Smart Images

Figure CN116547499B_ABST
Abstract
Disclosed embodiments include systems and methods for additive manufacturing (e.g., "printing," etc.) a flexure sensor as a 2D structure that can later be configured as a 3D or stacked structure. Further disclosed embodiments include a flexure sensor having a foldable sensing region that can be configured as a 3D or stacked structure. A differential strain in the sensing region is linearly proportional to a displacement measured from an end point of the sensing region. The differential strain can be measured as a differential change in a capacitance of the sensing region.
Need to check novelty before this filing date? Find Prior Art