存储系统
By introducing a combined system of wafer storage, cassette packers, wafer cassette storage, and handling equipment into the data center, the problems of delay and breakage risk in semiconductor wafer handling in the data center are solved, and fast and reliable data read and write operations are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KIOXIA CORP
- Filing Date
- 2021-03-23
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies suffer from slow data writing and reading speeds and high risk of damage during semiconductor wafer handling when processing large amounts of data in data centers.
A combined system of wafer memory, cassette packer, wafer cassette memory, host device and wafer handling device is adopted. By using the wafer cassette as the access unit, the system enables rapid handling and data reading and writing of semiconductor wafers, avoiding direct access through detectors and reducing handling delays and breakage risks.
It enables fast and reliable data read and write operations in data centers, reduces delays and breakage risks during semiconductor wafer handling, and improves system efficiency and reliability.
Smart Images

Figure CN116547654B_ABST