天线模块
By introducing an air gap structure with spacers and conductive elements into the antenna module, the packaging mismatch problem in 5G mm-Wave applications is solved, achieving more efficient manufacturing and performance improvement, suitable for mobile devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- QUALCOMM INC
- Filing Date
- 2021-11-19
- Publication Date
- 2026-07-17
AI Technical Summary
Existing antenna module packaging technologies suffer from problems such as package size mismatch, high cost, limited performance, high manufacturing complexity, and inflexible design in 5G mm-Wave applications, especially in mobile devices where efficient integration is difficult.
An antenna module structure is adopted, including an antenna substrate, a metallized structure, spacers, and conductive elements. The spacers maintain a constant distance and separate the conductive elements in the air gap to form an air gap to improve electrical coupling efficiency, and EMI shielding reduces interference.
It enables faster manufacturing and assembly times, reduces complexity and material costs, and improves antenna module losses, efficiency, and frequency bandwidth, making it suitable for smartphones and other mobile devices.
Smart Images
Figure CN116547865B_ABST