Electrical detection carrier plate device with shielding effect

Abstract

An electrically detecting carrier device with shielding effect includes at least one constituent unit, each of which includes a first insulating layer, a first conductive layer attached to the first insulating layer, and a first signal layer attached to the other side of the first insulating layer. The first insulating layer defines at least one first through hole extending from a first base surface to a second base surface. The first signal layer includes a plurality of first ground members electrically connected with the first conductive layer through the at least one first through hole, and a plurality of first transmission members arranged in a spaced manner with the first ground members. Since the first ground members are electrically connected with the first conductive layer of the whole layer structure, the signal transmission of the first transmission members can be shielded by the first conductive layer, thereby optimizing the performance of electrically detecting and facilitating the execution of high-frequency testing.

Description

Technical Field

[0001] This invention relates to an electrical testing device, and more particularly to an electrical testing carrier plate device with shielding effect. Background Technology

[0002] An electrical interposer is a device used to perform quality control on electronic components, such as integrated circuits (ICs), printed circuit boards (PCBs), or other types of electronic components. Due to the rapid technological advancements in related industries, not only must testing performance keep pace with technological progress, but the requirements for testing efficiency are also increasing. Currently, improving testing efficiency during electrical testing typically involves increasing the testing frequency to achieve high-speed testing. However, increasing the testing frequency inevitably introduces noise that affects the signal transmission of other test pairs. Therefore, addressing the issue of noise affecting electrical signal transmission is crucial for optimizing testing performance while simultaneously improving testing efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide an electrical testing carrier plate device with shielding effect that can cope with high-speed testing.

[0004] The present invention provides an electrical detection carrier plate device with shielding effect, comprising at least one constituent unit. Each constituent unit comprises a first insulating layer, a first conductive layer attached to the first insulating layer, and a first signal layer attached to the first insulating layer.

[0005] The first insulating layer includes a first base surface and a second base surface opposite to the first base surface, and defines at least one first through-hole extending from the first base surface to the second base surface. The first conductive layer is attached to the first base surface, and the first signal layer is attached to the second base surface.

[0006] The first signal layer includes a plurality of first grounding elements electrically connected to the first conductive layer through at least one first through-hole, and a plurality of first communication elements spaced apart from the first grounding elements.

[0007] The objectives of this invention and the technical problems it addresses can be further achieved by the following technical measures.

[0008] Preferably, in the aforementioned electrical detection carrier plate device with shielding effect, each of the first grounding elements of the first signal layer has a first through hole disposed therein and connected to a first connection portion of the first conductive layer.

[0009] Preferably, in the aforementioned electrical detection carrier plate device with shielding effect, each of the first grounding members of the first signal layer has a first base portion surrounding a first hollow region that defines a first through hole corresponding to an individual position, and the first connection portion is annularly embedded in the first hollow region and completely surrounding the first hollow region.

[0010] Preferably, the aforementioned electrical testing carrier plate device with shielding effect includes multiple constituent units and multiple intermediate insulating plates respectively disposed between two adjacent constituent units.

[0011] Preferably, in the aforementioned electrical detection carrier plate device with shielding effect, each of the constituent units further includes a substrate layer attached to the side of the first conductive layer away from the first insulating layer, a second conductive layer attached to the side of the substrate layer opposite to the first conductive layer, a second insulating layer attached to the second conductive layer, and a second signal layer attached to the second insulating layer; the second insulating layer includes a third base surface contacting the second conductive layer and a fourth base surface opposite to the third base surface, and defines at least one second through-hole extending from the third base surface to the fourth base surface; the second signal layer is attached to the fourth base surface of the second insulating layer and includes a plurality of second grounding elements electrically connected to the second conductive layer through the at least one second through-hole, and a plurality of second communication elements spaced apart from the second grounding elements.

[0012] Preferably, in the aforementioned electrical detection carrier plate device with shielding effect, each of the second grounding members of the second signal layer has a second through hole disposed therein and connected to a second connection portion of the second conductive layer.

[0013] Preferably, in the aforementioned electrical detection carrier plate device with shielding effect, each of the second grounding members of the second signal layer has a second base surrounding a second hollow region that defines a second through hole corresponding to an individual position, and the second connection portion is annularly embedded in the second hollow region and completely surrounding the second hollow region.

[0014] Preferably, in the aforementioned electrical testing carrier plate device with shielding effect, the first conductive layer defines a plurality of through holes whose positions respectively correspond to the first through hole; each of the constituent units further includes an inner insulating layer attached to the side of the first conductive layer away from the first insulating layer, surrounding a plurality of inner through holes whose positions respectively correspond to the through holes; and an inner signal layer attached to the side of the inner insulating layer opposite to the first conductive layer, including a plurality of path wirings formed on the surface facing the inner insulating layer and surrounding a closed shielding area; the first signal layer further includes a plurality of conductive elements connected to the inner signal layer in the shielding area via the first through hole, the through hole, and the inner through hole.

[0015] Preferably, in the aforementioned electrical detection carrier plate device with shielding effect, each of the conductive elements of the first signal layer extends toward the first through hole, the through hole and the inner through hole, and is connected to the inner connection portion of the inner signal layer.

[0016] Preferably, the aforementioned electrical testing carrier plate device with shielding effect further includes two encapsulation plates respectively disposed on the outer sides of the two outermost constituent units.

[0017] The beneficial effects of the present invention are as follows: the first grounding element is electrically connected to the first conductive layer, which enables the first conductive layer to form a grounding plane with a whole-layer structure. Therefore, when the electrical detection signal is transmitted through the first communication element, the first conductive layer can form a shield, thereby optimizing the performance of electrical detection and thus facilitating the execution of high-frequency tests. Attached Figure Description

[0018] Figure 1 This is a perspective view illustrating a first embodiment of the electrical detection carrier plate device with shielding effect of the present invention;

[0019] Figure 2 This is an exploded perspective view illustrating multiple constituent units of the first embodiment;

[0020] Figure 3 This is a side view illustrating the plurality of intermediate insulating plates and two encapsulation plates of the first embodiment;

[0021] Figure 4 It is a partially enlarged perspective view illustrating a first insulating layer and a first signal layer for each of the constituent units;

[0022] Figure 5 It is a partially enlarged cross-sectional view illustrating the shielding effect produced by the first signal layer and the first conductive layer of each of the constituent units;

[0023] Figure 6This is a schematic diagram illustrating the use of the first embodiment with electrical connection to a component under test and a driving component;

[0024] Figure 7 This is an exploded perspective view illustrating a second embodiment of an electrical detection carrier plate device with shielding effect; and

[0025] Figure 8 It is a partially enlarged 3D view illustrating the first signal layer of the second embodiment. Detailed Implementation

[0026] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] See Figure 1 and Figure 2 This is a first embodiment of the electrical testing carrier plate device with shielding effect of the present invention. This first embodiment includes three constituent units 100 spaced apart from each other, two intermediate insulating plates 101 respectively located between two adjacent constituent units 100, and two encapsulation plates 102 respectively disposed outside the two outermost constituent units 100. It should be noted that although this first embodiment is described with three constituent units 100, in actual implementation, an appropriate number, or even a specific type, of constituent units 100 can be used, along with an appropriate number of intermediate insulating plates 101, depending on the specifications of the component under test. It is not limited to the type presented in this first embodiment.

[0028] See Figure 2 and Figure 3 Each of the constituent units 100 includes a first insulating layer 21, a first conductive layer 22 attached to one side of the first insulating layer 21, a first signal layer 23 attached to the other side of the first insulating layer 21, a substrate layer 3 attached to the side of the first conductive layer 22 away from the first insulating layer 21, a second conductive layer 41 attached to the side of the substrate layer 3 opposite to the first conductive layer 22, a second insulating layer 42 attached to the other side of the second conductive layer 41, and a second signal layer 43 attached to the side of the second insulating layer 42 away from the second conductive layer 41.

[0029] See Figures 3 to 5The first insulating layer 21 includes a first base surface 211 and a second base surface 212 opposite to the first base surface 211, and defines a plurality of first vias 210 extending from the first base surface 211 to the second base surface 212. The first conductive layer 22 and the first signal layer 23 are respectively attached to the first base surface 211 and the second base surface 212. Similarly, the second insulating layer 42 includes a third base surface 421 contacting the second conductive layer 41 and a fourth base surface 422 opposite to the third base surface 421, and defines a plurality of second vias 420 extending from the third base surface 421 to the fourth base surface 422. That is, the second conductive layer 41 and the second signal layer 43 are respectively attached to the third base surface 421 and the fourth base surface 422.

[0030] The first signal layer 23 includes a plurality of first grounding elements 231 electrically connected to the first conductive layer 22 via the first through-hole 210, and a plurality of first communication elements 232 spaced apart from the first grounding elements 231. Each first grounding element 231 has a first base 291 surrounding a first hollow region 290 defining a position corresponding to an individual first through-hole 210, and a first connection portion 292 disposed in the individual first through-hole 210 and connected to the first conductive layer 22. The first connection portion 292 is annularly embedded in and completely surrounding the first hollow region 290. The second signal layer 43 includes a plurality of second grounding elements 431 electrically connected to the second conductive layer 41 via the second through-hole 420, and a plurality of second communication elements 432 spaced apart from the second grounding elements 431. Each second grounding element 431 has a second base 491 surrounding a second hollow region 490 that defines a position corresponding to an individual second through hole 420, and a second connection portion 492 disposed in the individual second through hole 420 and connected to the second conductive layer 41. The second connection portion 492 is annular in shape, embedded in the second hollow region 490 and completely surrounding the second hollow region 490.

[0031] It should be noted that in each of the constituent units 100, the opposite sides of the substrate layer 3 are essentially symmetrical and identical in structure, mainly to match the contact form of the component under test, thus constructing a "multi-layer" test module. However, in terms of pure electrical conduction, if the first conductive layer 22, the first insulating layer 21, and the first signal layer 23 are considered as one set of electrical conduction structures, and the second conductive layer 41, the second insulating layer 42, and the second signal layer 43 are considered as another set of electrical conduction structures, then only one set of structures is needed to achieve the electrical conduction functions of communication and grounding.

[0032] Taking a single set of electrical conduction structures as an example, in the first signal layer 23, a pair of adjacent first communication elements 232 constitute a signal pair for signal transmission and transmission. A first grounding element 231 adjacent to the pair of first communication elements 232 acts as a ground, thus forming a complete electrical test path with the pair of first communication elements 232. The contact distribution of the first communication elements 232 and the first grounding element 231 can, of course, be configured according to the needs of the component under test and is not limited to the configuration in this first embodiment.

[0033] Specifically, the encapsulation plate 102 is made of insulating material, and its main purpose is to shield the first signal layer 23 or the second signal layer 43 located on the opposite side, and to encapsulate this first embodiment as a modular device so as to facilitate modular assembly with other equipment of the detection system as a whole.

[0034] See Figure 5 and cooperate Figure 4 Regarding a single constituent unit 100, taking the electrical conduction structure of a single group on one side of the substrate layer 3 as an example, through the first through hole 210 of the first insulating layer 21, the first connection portion 292 of each first grounding member 231 can not only achieve electrical connection with the first conductive layer 22 through the corresponding first through hole 210, but also form a shield in the conduction direction of the first through hole 210 by presenting its own annular closed shape. In conjunction with the electrical connection between the first conductive layer 22 and the first grounding member 231 to form a grounding plane, a shielding effect can also be achieved.

[0035] See also Figure 5 and Figure 6 ,like Figure 6 This first embodiment demonstrates an electrical connection between a component under test (DUT) 71 and a driving component 72 on opposite sides. Specifically, the first grounding member 231, the second grounding member 431, the first communication member 232, and the outwardly extending arms of the second communication member 432 are electrically connected to the contacts of the DUT 71 and the driving component 72, respectively. By confirming the electrical signal transmission, testing can be performed on the DUT 71. During testing, with shielding achieved for multi-directional electrical conduction, the signals transmitted through the first communication member 232 and the second communication member 432 are less susceptible to interference, thus increasing the testing frequency and facilitating high-speed testing.

[0036] See Figure 7 and Figure 8 This is a second embodiment of the electrical detection carrier plate device with shielding effect of the present invention, using the substrate layer 3 (see Figure 2 or Figure 3 Regarding one of the opposite sides, the difference between this second embodiment and the first embodiment is that: the first conductive layer 22 defines a plurality of through holes 220 whose positions respectively correspond to the first vias 210, and each of the constituent units 100 further includes an inner insulating layer 51 attached to the side of the first conductive layer 22 away from the first insulating layer 21, and an inner signal layer 52 attached to the side of the inner insulating layer 51 opposite to the first conductive layer 22. The inner insulating layer 51 surrounds the plurality of inner through holes 510 whose positions respectively correspond to the through holes 220, and the inner signal layer 52 includes a plurality of path wirings 521 formed on the surface facing the inner insulating layer 51 and surrounding a closed shielding region 520. The first signal layer 23 also includes a plurality of conductive elements 233 connected to the inner signal layer 52 in the shielding region 520 via the first via 210, the through holes 220, and the inner through holes 510.

[0037] Specifically, the path wiring 521 can be formed by metal deposition, as long as a closed circuit can be formed on the inner signal layer 52, and the required shielding area 520 is formed around the positions corresponding to the first via 210, the through hole 220, and the inner via 510. The form does not necessarily have to be as described above. Figure 7 The path shown is limited.

[0038] Each of the conductive elements 233 has an inner connection portion 239 extending toward the first through hole 210, the through hole 220, and the inner through hole 510, and connected to the inner signal layer 52. The inner connection portion 239 not only allows the conductive element 233 to form an electrical connection with the inner signal layer 52 through the first through hole 210, the through hole 220, and the inner through hole 510, thereby achieving signal transmission between layers, but also, since the position of the inner connection portion 239 in contact with the inner signal layer 52 is within the shielding area 520 defined by the path wiring 521, the path wiring 521 can also form a shielding effect, thereby optimizing the detection performance of the signal transmission of the conductive element 233 and facilitating high-speed detection.

Claims

1. An electrical testing carrier plate device with shielding effect, comprising at least one constituent unit; characterized in that: Each of the constituent units comprises: A first insulating layer includes a first base surface and a second base surface opposite to the first base surface, and defines at least one first through-hole extending from the first base surface to the second base surface; A first conductive layer is attached to the first base surface of the first insulating layer and forms a continuous ground plane; and A first signal layer, attached to a second base surface of the first insulating layer, includes a plurality of first grounding elements electrically connected to the first conductive layer via at least one first through-hole, and a plurality of first communication elements spaced apart from the first grounding elements. Each first grounding element has a first connection portion disposed in a particular first through-hole and connected to the first conductive layer, and a first base portion surrounding a first hollow region corresponding to the position of the particular first through-hole. The first connection portion is annularly embedded in the first hollow region and completely surrounding the first hollow region. The first grounding element is electrically connected to the grounding plane via its respective first connection portion to provide electromagnetic shielding for test signals transmitted via the plurality of first communication elements.

2. The electrical detection carrier plate device with shielding effect according to claim 1, characterized in that: It comprises multiple constituent units and multiple intermediate insulating plates disposed between two adjacent constituent units.

3. The electrical detection carrier plate device with shielding effect according to claim 2, characterized in that: Each of the constituent units further includes: A substrate layer is attached to the side of the first conductive layer away from the first insulating layer; The second conductive layer is attached to the side of the substrate layer opposite to the first conductive layer; A second insulating layer, attached to the second conductive layer and including a third base surface contacting the second conductive layer, and a fourth base surface opposite to the third base surface, defining at least one second through-hole extending from the third base surface to the fourth base surface; and The second signal layer is attached to the fourth base surface of the second insulating layer and includes a plurality of second grounding elements electrically connected to the second conductive layer through the at least one second through hole, and a plurality of second communication elements spaced apart from the second grounding elements.

4. The electrical testing carrier plate device with shielding effect according to claim 3, characterized in that: Each of the second grounding elements of the second signal layer has a second through hole disposed therein and connected to a second connection portion of the second conductive layer.

5. The electrical testing carrier plate device with shielding effect according to claim 4, characterized in that: Each of the second grounding elements of the second signal layer has a second base portion surrounding a second hollow region that defines a second through-hole corresponding to a specific location, and the second connection portion is annularly embedded in the second hollow region and completely surrounding the second hollow region.

6. The electrical detection carrier plate device with shielding effect according to claim 2, characterized in that: The first conductive layer defines a plurality of through holes, each corresponding to a position of the first via, and each constituent unit further includes: An inner insulating layer, attached to the side of the first conductive layer away from the first insulating layer, surrounds and defines a plurality of internal through holes, each corresponding to one of the through holes; and An inner signal layer is attached to the inner insulating layer on the side opposite to the first conductive layer and includes multiple path wirings formed on the surface facing the inner insulating layer and surrounding a closed shielding area. The first signal layer further includes a plurality of conductive elements that are connected to the inner signal layer in the shielding area via the first through hole, the through hole, and the inner through hole.

7. The electrical detection carrier plate device with shielding effect according to claim 6, characterized in that: Each of the conductive elements in the first signal layer extends toward the first through hole, the through hole and the inner through hole, and is connected to the inner connection portion of the inner signal layer.

8. The electrical detection carrier plate device with shielding effect according to claim 2, characterized in that: The electrical testing carrier plate device with shielding effect further includes two encapsulation plates respectively disposed on the outer sides of the two outermost constituent units.

Images