power module

Abstract

A power module is disclosed. The power module includes an electrical interconnection assembly and at least one electronic component group. The electrical interconnection assembly includes a conductive structure and a circuit board. The conductive structure includes a first conductive member and a second conductive member arranged side by side and insulated from each other. The circuit board is disposed on the conductive structure. The circuit board defines an opening partially corresponding to the first conductive member and partially corresponding to the second conductive member. The at least one electronic component group includes a power component having a first contact pad, a second contact pad, and a third contact pad. The first contact pad and the second contact pad are both electrically connected to the first conductive member and the second conductive member, respectively, through the opening, and the third contact pad is disposed on the circuit board.

Description

Technical Field

[0001] This invention relates to a power module, and more particularly to a power module with high voltage withstand capability. Background Technology

[0002] Power modules can be used in home inverter systems, electric vehicles, and industrial control systems to convert electrical energy or control circuits. In existing circuit systems, power components, gate drive components, and control components are typically integrated. In current technology, a specific circuit layout is pre-formed on a circuit board according to the circuit design, and then multiple discrete power components, control components, gate drive components, and other related parts are assembled onto the main control circuit board to integrate them into a power module.

[0003] However, in some circuits, such as voltage conversion circuits, power modules need to operate under high-voltage or high-current conditions. Therefore, power modules are required to have high voltage withstand capability and the ability to withstand high current operation. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a power module that has high voltage resistance and can operate under high current, thus overcoming the shortcomings of the prior art.

[0005] To address the aforementioned technical problems, one technical solution adopted by the present invention is to provide a power module. The power module includes an electrical interconnect component and at least one group of electronic components. The electrical interconnect component includes a conductive structure and a first circuit board. The conductive structure includes a first conductive element, a second conductive element, and a third conductive element arranged side-by-side and insulated from each other. The second and third conductive elements are located on opposite sides of the first conductive element. The first circuit board partially covers the conductive structure. The first group of electronic components includes a first power element and a second power element. The first power element is connected across the first and second conductive elements and electrically connected to the first circuit board. The second power element is connected across the first and third conductive elements and electrically connected to the first circuit board. The second power element is connected in series with the first power element through the first conductive element.

[0006] To address the aforementioned technical problems, another technical solution adopted by the present invention is to provide a power module. The power module includes an electrical interconnect component and at least one group of electronic components. The electrical interconnect component includes a conductive structure and a circuit board. The conductive structure includes a first conductive element and a second conductive element arranged side-by-side and insulated from each other. The circuit board is disposed on the conductive structure. The circuit board defines an opening, which partially corresponds to the first conductive element and partially corresponds to the second conductive element. The at least one group of electronic components includes a power element having a first pad, a second pad, and a third pad. The first pad and the second pad are electrically connected to the first conductive element and the second conductive element respectively through the opening, and the third pad is disposed on the circuit board.

[0007] One of the beneficial effects of the present invention is that the power module provided by the present invention can operate under high voltage and high current through the technical solutions of "a conductive structure including a first conductive element and a second conductive element arranged side by side and insulated from each other", "the circuit board partially covering the conductive structure" and "the first and second pads of the power element are electrically connected to the first and second conductive elements respectively, and the third pad is disposed on the circuit board".

[0008] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0009] Figure 1 This is a three-dimensional schematic diagram of the power module according to the first embodiment of the present invention.

[0010] Figure 2 This is a three-dimensional exploded view of the power module of the first embodiment of the present invention, omitting the encapsulation layer.

[0011] Figure 3 This is a three-dimensional exploded view of the power module of the first embodiment of the present invention, omitting the encapsulation layer, from another angle.

[0012] Figure 4 This is a partial exploded perspective view of the power module of the first embodiment of the present invention, omitting the heat sink and the encapsulation layer.

[0013] Figure 5 for Figure 1 A schematic diagram of a cross section along line VV.

[0014] Figure 6 for Figure 5 A magnified view of region VI in the diagram.

[0015] Figure 7This is a partially enlarged cross-sectional schematic diagram of a power module according to another embodiment of the present invention.

[0016] Figure 8 for Figure 1 A schematic cross-sectional view along line VIII-VIII.

[0017] Figure 9 This is a cross-sectional schematic diagram of the power module according to the second embodiment of the present invention.

[0018] Figure 10 This is a cross-sectional schematic diagram of the power module according to the third embodiment of the present invention.

[0019] Figure 11 This is an exploded perspective view of the power module of the fourth embodiment of the present invention, omitting the encapsulation layer.

[0020] Figure 12 This is an exploded perspective view of the power module of the fifth embodiment of the present invention, omitting the heat sink and the encapsulation layer.

[0021] Figure 13 for Figure 12 A magnified view of region XIII in the diagram.

[0022] Figure 14 This is an exploded perspective view of the power module of the sixth embodiment of the present invention, omitting the heat sink and the encapsulation layer.

[0023] Figure 15 for Figure 14 A magnified schematic diagram of region XV in the diagram. Detailed Implementation

[0024] The following specific embodiments illustrate the implementation of the "power module" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0025] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0026] [First Embodiment]

[0027] Please refer to Figures 1 to 3 , Figure 1 This is a three-dimensional schematic diagram of the power module according to the first embodiment of the present invention. Figure 2 and Figure 3 These are exploded perspective views of the power module from different angles. The power module M1 of this embodiment can be applied in the circuit design of electronic products and is suitable for operation under high voltage and high current. In this embodiment, the power module M1 includes an electrical interconnect component 1 and at least one group of electronic components 2A, 2B. Figure 2 (Two examples are shown), heat sinks 3A and 3B, multiple input / output pins 4, and a package layer 5.

[0028] In addition to carrying electronic component groups 2A and 2B, the electrical interconnect component 1 can also establish electrical connections between multiple electronic components within electronic component groups 2A and 2B. The detailed structure of the electrical interconnect component 1 according to an embodiment of the present invention, and the electrical connection relationship between the electrical interconnect component 1 and the electronic component groups 2A and 2B, are further described below. In this embodiment, an example of forming a part of a voltage conversion system circuit is used for explanation.

[0029] Please refer to Figure 2 The electrical interconnect component 1 includes a conductive structure 10, a first circuit board 11, and a second circuit board 12. In this embodiment, the conductive structure 10 includes a first conductive element 101, a second conductive element 102, and a third conductive element 103. The first conductive element 101, the second conductive element 102, and the third conductive element 103 are arranged side-by-side in a first direction D1 and are insulated from each other. The second conductive element 102 and the third conductive element 103 are located on opposite sides of the first conductive element 101.

[0030] Furthermore, the first to third conductive elements 101-103 can be used to construct the current transmission path for multiple electronic components in the electronic component groups 2A and 2B. In this embodiment, each of the first to third conductive elements 101-103 is plate-shaped, and its thickness can range from 0.5 mm to 4 mm. Additionally, the materials constituting the first to third conductive elements 101-103 can be selected from materials with high conductivity, such as copper or its alloys, to reduce parasitic resistance. Thus, the first to third conductive elements 101-103 can allow a larger current to pass through, enabling the power module M1 to operate under conditions of high voltage and high current.

[0031] In this embodiment, the first conductive element 101 and the second conductive element 102 are separated from each other to define a slot h1. Additionally, the first conductive element 101 and the third conductive element 103 are also separated from each other to define another slot h2. In this embodiment, the electrical interconnect assembly 1 further includes an insulating bonding material 104 located in the slot h1 between the first conductive element 101 and the second conductive element 102 to connect the first conductive element 101 and the second conductive element 102. Furthermore, another insulating bonding material 104 is located in the slot h2 between the first conductive element 101 and the third conductive element 103 to connect the first conductive element 101 and the third conductive element 103.

[0032] like Figure 1 and Figure 2 As shown, the first conductive element 101 has a first end 101e, the second conductive element 102 has a second end 102e, and the third conductive element 103 has a third end 103e. The second end 102e and the third end 103e are arranged in the same direction, while the first end 101e and the second end 102e (or the third end 103e) are arranged in opposite directions. Furthermore, the power module M1 can be connected to another system circuit via the first to third ends 101e-103e. For example, the first end 101e can be electrically connected to a voltage switching terminal, one of the second end 102e and the third end 103e can be electrically connected to a power supply voltage terminal, and the other can be electrically connected to a ground terminal. Additionally, the first to third conductive elements 101-103 all have high rigidity and strength, allowing the power module M1 of the present invention to be connected to another system circuit via a plug-in connection.

[0033] In addition, Figure 2 In the embodiment, the upward-facing surfaces of the first conductive element 101, the second conductive element 102, and the third conductive element 103 together define the element mounting surface SA, and the downward-facing surfaces of the first conductive element 101, the second conductive element 102, and the third conductive element 103 together define another element mounting surface SB.

[0034] Please refer to the following: Figure 1 and Figure 2 In this embodiment, the first circuit board 11 and the second circuit board 12 are located on opposite sides of the conductive structure 10. In other words, the first circuit board 11 and the second circuit board 12 are separated from each other by the conductive structure 10. It should be noted that by setting the first circuit board 11 and the second circuit board 12 on opposite sides of the conductive structure 10, warping of the electrical interconnect component 1 due to the high temperature of the process (e.g., during reflow soldering) can also be avoided.

[0035] At least one of the first circuit board 11 and the second circuit board 12 can be a single-layer circuit board or a multi-layer circuit board, and the other can be a non-wired insulating board, a single-layer circuit board, or a multi-layer circuit board. That is, the surface and interior of one of the first circuit board 11 and the second circuit board 12 are provided with multiple traces (not shown) and solder pads (not shown) according to actual needs. Accordingly, multiple electronic components in the electronic component groups 2A and 2B can be arranged on the first circuit board 11 or the second circuit board 12 according to the actual circuit design.

[0036] It is worth mentioning that, in this embodiment, the thickness of both the first circuit board 11 and the second circuit board 12 is less than the thickness of the conductive structure 10. Furthermore, the thickness of the first circuit board 11 (or the second circuit board 12) is approximately 150 μm to 400 μm. Additionally, the sum of the thicknesses of the first circuit board 11 and the second circuit board 12 is also less than the thickness of the conductive structure 10.

[0037] Please refer to the following: Figure 2 and Figure 4 , Figure 4 This is a partially exploded perspective view of the power module according to the first embodiment of the present invention, omitting the heat sink and encapsulation layer. Further, the first circuit board 11 of this embodiment has two openings 11ha and 11hb. One of the openings 11ha is located in the slot h1 between the first conductive member 101 and the second conductive member 102, and partially exposes the first conductive member 101 and the second conductive member 102. Accordingly, in the first direction D1, the width of the opening 11ha is greater than the width of the slot h1. The opening 11ha can define a first pad setting area 101a and a second pad setting area 102a on the first conductive member 101 and the second conductive member 102, respectively.

[0038] Similarly, the location of another opening 11hb corresponds to the slot h2 between the first conductive element 101 and the third conductive element 103, partially exposing the first conductive element 101 and the third conductive element 103. Accordingly, the opening 11hb defines another first pad placement area 101a on the first conductive element 101 and a third pad placement area 103a on the third conductive element 103. That is, the first circuit board 11 partially covers the first conductive element 101, the second conductive element 102, and the third conductive element 103.

[0039] Please refer to Figure 3Similar to the first circuit board 11, the second circuit board 12 also has two openings 12ha and 12hb. One opening 12ha is located at the slot h1 between the first conductive element 101 and the second conductive element 102, partially exposing both the first and second conductive elements 101 and 102. The other opening 12hb is located at the slot h2 between the first conductive element 101 and the third conductive element 103, also partially exposing both the first and third conductive elements 101 and 103. By partially exposing the first conductive element 101, the second conductive element 102, and the third conductive element 103, the transmission of signals requiring high current loads can be separated from the control signals generated by the first circuit board 11 and the second circuit board 12.

[0040] Accordingly, the second circuit board 12 may also define two first pad placement areas 101b on the bottom side of the first conductive member 101, and another second pad placement area 102b and another third pad placement area 103b on the bottom sides of the second conductive member 102 and the third conductive member 103, respectively. However, the present invention is not limited thereto. In another embodiment, the second circuit board 12 may only have one of the openings 12ha and 12hb. That is, the first circuit board 11 will partially cover the component placement area SA, while the second circuit board 12 will partially cover another component placement surface SB.

[0041] It is worth noting that in this embodiment, the first circuit board 11 and the second circuit board 12 are embedded on both sides of the conductive structure 10. Please refer to... Figure 2 and Figure 4 The first conductive element 101 has a first recessed area (not labeled) on the side facing the first circuit board 11 that is recessed relative to the two first pad setting areas 101a. In other words, the first pad setting areas 101a of the first conductive element 101 are both bosses. In addition, the first circuit board 11 has a first line arrangement portion 111 located on the first conductive element 101, and the edge contour of the first line arrangement portion 111 matches the edge contour of the first pad setting area 101a (or the first recessed area) and is disposed within the first recessed area.

[0042] Similarly, please refer to Figure 3On the side facing the first circuit board 11, the second conductive member 102 also has a second recessed area (not labeled) that is recessed relative to the second pad setting area 102a, and the third conductive member 103 has a third recessed area (not labeled) that is recessed relative to the third pad setting area 103a. Additionally, the first circuit board 11 also has a second line configuration portion 112 disposed in the second recessed area and a third line configuration portion 113 disposed in the third recessed area. In this embodiment, the edge contour of the second line configuration portion 112 matches the edge contour of the second pad setting area 102a, and the edge contour of the third line configuration portion 113 matches the edge contour of the third pad setting area 103a.

[0043] In other words, the two side edge contours of the opening 11ha of the first circuit board 11 respectively match the edge contours of the first pad setting area 101a and the second pad setting area 102a, and the two side edge contours of the opening 11hb respectively match the edge contours of another first pad setting area 101a and the edge contours of the third pad setting area 103a.

[0044] Please refer to the following: Figure 3 The first to third conductive elements 101-103 may also form a first recessed area, a second recessed area, and a third recessed area on the side facing the second circuit board 12. The edge contour of the opening 12ha of the second circuit board 12 mates with the edge contours of the first pad placement area 101b and the second pad placement area 102b, while the edge contour of the opening 12hb mates with another edge contour of the other first pad placement area 101b and the edge contour of the third pad placement area 103b. However, the invention is not limited thereto. In another embodiment, the surfaces of the first to third conductive elements 101-103 facing the second circuit board 12 may also be flat surfaces.

[0045] Please refer to Figures 2 to 4 Two electronic component groups 2A and 2B are disposed on the electrical interconnect assembly 1 and are located on opposite sides of the electrical interconnect assembly 1, but the present invention is not limited to this example. Each electronic component group 2A and 2B may include one or more electronic components ( Figure 1 and Figure 2 (Several examples are shown). The electronic components can be power components, control components, diode components, passive components, or protection components, etc., and the present invention is not limited thereto. In addition, the electronic component groups 2A and 2B may also include one or more of the following: power components, control components, diode components, passive components, or protection components.

[0046] Power components may be, for example, insulated-gate bipolar transistors (IGBTs), metal-oxide-semiconductor field-effect transistors (MOSFETs), or any combination thereof. The materials of the power components may be, for example, silicon carbide, silicon, or gallium nitride. Additionally, diode components may be, for example, fast forward diodes (FRDs) or power diodes. When the power module M1 is used in a voltage conversion circuit, the electronic component groups 2A and 2B may include multiple power components 21 and 22 arranged in an array.

[0047] Please refer to the following: Figure 4 and Figure 5 Each power element 21, 22 may include a first pad 21s, 22s, a second pad 21d, 22d, and a third pad 21g, 22g. The first pads 21s, 22s may be source pads, the second pads 21d, 22d may be drain pads, and the third pads 21g, 22g may be gate pads. More specifically, each power element 21, 22 may include a power chip 210, 220 and conductive connectors 211, 221 connected to the power chip 210, 220. The aforementioned first pads 21s, 22s and third pads 21g, 22g are located on the active surface of the power chip 210, 220. The conductive connectors 211, 221 are disposed on the back side of the power chip 210, 220 and have pin portions 211t, 221t. The aforementioned second pads 21d, 22d are disposed at the ends of the pin portions 211t, 221t.

[0048] For ease of explanation, electronic component group 2A is defined as the first electronic component group, and electronic component group 2B is defined as the second electronic component group. Furthermore, in the first electronic component group 2A, the power element 21 connected to the first conductive element 101 and the second conductive element 102 is defined as the first power element, and the power element 22 connected to the first conductive element 101 and the third conductive element 103 is defined as the second power element. Multiple first power elements 21 arranged in the same row in the second direction D2 can be connected in parallel to each other through the conductive structure 10. Similarly, multiple second power elements 22 arranged in another row in the second direction D2 can also be connected in parallel to each other through the conductive structure 10.

[0049] Please refer to the following: Figure 4 and Figure 5 , Figure 5 for Figure 1A cross-sectional view along line VV is shown. Specifically, the first pad 21s (source pad) and the second pad 21d (drain pad) of each first power element 21 are electrically connected to the first conductive element 101 and the second conductive element 102 respectively through openings 11ha and 12ha of the first circuit board 11 or the second circuit board 12. Furthermore, the third pad 21g (gate pad) of each first power element 21 is disposed on the first line configuration portion 111 and 121 of the first circuit board 11 or the second circuit board 12, and is electrically connected to the wiring within the first circuit board 11 (not shown).

[0050] In detail, the first pad 22s (source pad) and the second pad 22d (drain pad) of each second power element 22 can be electrically connected to the first conductive element 101 and the third conductive element 103 respectively through another opening 11hb, 12hb of the first circuit board 11 or the second circuit board 12. In addition, the third pad 22g (gate pad) of each second power element 22 is disposed on the third line arrangement portion 113, 123 of the first circuit board 11 or the second circuit board 12, and is electrically connected to the line in the first circuit board 11 (not shown).

[0051] Based on the above, such as Figure 5 As shown, the first pad 21s (source pad) of the first power element 21 and the second pad 22d (drain pad) of the second power element 22, which are arranged in the same column in the first direction D1, are both connected to the first conductive element 101, thereby connecting the first power element 21 and the second power element 22 in series. It should be noted that the number of power elements 21 and 22 and their electrical connection relationship can be adjusted according to actual needs, and the present invention is not limited thereto.

[0052] Please refer to again Figure 4 In this embodiment, multiple input / output pins 4 are disposed on one side of the electrical interconnect component 1, so that the power module M1 can be electrically connected to another external circuit. Furthermore, the multiple input / output pins 4 can be defined to receive or output various different signals. In one embodiment, the multiple input / output pins 4 can be used to transmit a gate drive signal to control the operation of power elements 21, 22. Accordingly, each input / output pin 4 can be disposed on the first circuit board 11 or the second circuit board 12, and electrically connected to the third pads 21g, 22g (gate pads) of the corresponding power element 21, 22 via wiring within the first circuit board 11 or the second circuit board 12.

[0053] Please refer to the following: Figure 5 and Figure 6 , Figure 6 for Figure 5A partially enlarged schematic diagram of region VI. It is worth mentioning that, in this embodiment, there is almost no height difference between the top surface of any first pad setting area 101a of the first conductive member 101 (or the bottom surface of the first pad setting area 101b) and the surface of the first line configuration portion 111 of the first circuit board 11 (or the first line configuration portion 121 of the second circuit board 12).

[0054] like Figure 6 As shown, in a preferred embodiment, the top surface (or bottom surface) of any of the first pad placement areas 101a (101b) is at the same height as the surface of the first line configuration section 111 (121) and is coplanar. Similarly, the top surface of the third pad placement area 103a (or the bottom surface of the third pad placement area 103b) has no height difference with the surface of the third line configuration section 111 of the first circuit board 11 (or the third line configuration section 123 of the second circuit board 12).

[0055] In addition, such as Figure 5 As shown, in this embodiment, the top surfaces of any two of the first pad setting area 101a, the second pad setting area 102a, and the third pad setting area 103a on one side of the conductive structure 10 are coplanar, so that the power components 21 and 22 can be mounted on the electrical interconnect assembly 1 using surface mount technology (SMT). Similarly, the bottom surfaces of any two of the first pad setting area 101b, the second pad setting area 102b, and the third pad setting area 103b on the other side of the conductive structure 10 are coplanar.

[0056] However, this invention does not... Figure 6 The illustrated embodiments are limited. Please refer to [the examples provided]. Figure 7 This is a partially enlarged cross-sectional view of a power module according to another embodiment of the present invention. In this embodiment, there may also be a height difference H1 between the top surface of the first pad setting area 101a and the top surface of the second pad setting area 102a. The aforementioned height difference H1 may be greater than 10 μm, but between 10 μm and 200 μm. Accordingly, the length of the pin portion 211t of the conductive connector 211 of the first power element 21 can be adjusted corresponding to the aforementioned height difference H1, so that the second pad 21d located at the pin portion 211t is connected to the second pad setting area 102a.

[0057] exist Figure 7In one embodiment, the top surface of the second pad placement area 102a protrudes beyond the top surface of the first pad placement area 101a. Accordingly, the thickness of the second conductive element 102 is greater than the thickness of the first conductive element 101. That is, the thicknesses of the first to third conductive elements 101-103 do not necessarily have to be the same. Additionally, in this embodiment, the bottom surface of the second pad placement area 102b may also protrude relative to the bottom surface of the first pad placement area 101b, but this is not a limitation of the invention. In another embodiment, the top surface of the second pad placement area 102a may protrude or be recessed relative to the top surface of the first pad placement area 101a, but the bottom surface of the second pad placement area 102b remains coplanar with the bottom surface of the first pad placement area 101b, and vice versa.

[0058] Please refer to again Figure 4 In this embodiment, the first and second electronic component groups 2A and 2B may further include a diode element 23. Figure 4 (Multiple examples are shown), and diode element 23 can be connected in parallel with the first power element 21 or the second power element 22. Taking diode element 23 connected in parallel with the first power element 21 as an example, diode element 23 and the first power element 21 are arranged in the same row in the second direction D2, and the two electrodes 23a and 23b of diode element 23 are respectively connected to the first conductive element 101 and the second conductive element 102 through the opening 11ha.

[0059] However, in other embodiments, diode element 23 may be omitted. In another embodiment, the first and second electronic component groups 2A, 2B may further include control elements, passive elements, or protection elements, etc., depending on actual needs. These aforementioned electronic components may be disposed together with power elements 21, 22 on the electrical interconnect assembly 1, and electrically connected to multiple power elements 21, 22 through the electrical interconnect assembly 1 to form a portion of the standardized circuit.

[0060] It is worth mentioning that when the electronic components of the first and second electronic component groups 2A and 2B are operating, the heat generated by the electronic components can be dissipated through the conductive structure 10. In other words, the conductive structure 10 not only establishes electrical connections between electronic components, but also assists in heat dissipation.

[0061] like Figure 4 and Figure 5As shown, the second electronic component group 2B can also be disposed on the electrical interconnect assembly 1 in a similar manner. Specifically, the second electronic component group 2B and the second circuit board 12 are both located on the same side of the conductive structure 10, and include one or more power components 21, 22. For ease of explanation, in the second electronic component group 2B, the power component 21 connected to the first conductive member 101 and the second conductive member 102 is defined as the third power component, and the power component 22 connected to the first conductive member 101 and the third conductive member 103 is defined as the fourth power component.

[0062] Accordingly, the first power element 21 in the first electronic component group 2A can be connected in parallel to the third power element 21 in the second electronic component group 2B via the first conductive element 101 and the second conductive element 102. Furthermore, the second power element 22 in the first electronic component group 2A can be connected in parallel to the fourth power element 22 in the second electronic component group 2B via the first conductive element 101 and the third conductive element 103. In this way, the power density of the power module M1 can be increased even without increasing the area of ​​the electrical interconnect component 1. It should be noted that the number of electronic components in the first and second electronic component groups 2A and 2B does not necessarily have to be the same.

[0063] Please refer to Figure 8 , it is Figure 1 A cross-sectional schematic diagram along line VIII-VIII. In this embodiment, in the first and second electronic component groups 2A, 2B, the electronic components (e.g., the first and third power components 21) located on opposite sides of the conductive structure 10 are aligned with each other in pairs, but the present invention is not limited thereto.

[0064] Please refer to again Figure 2 , Figure 3 as well as Figure 5 The power module M1 in the first embodiment includes two heat sinks 3A and 3B, which are located on opposite sides of the conductive structure 10. Each heat sink 3A and 3B is disposed on a plurality of power elements 21 and 22 to dissipate the heat generated when the power elements 21 and 22 are operating. That is, the plurality of power elements 21 and 22 are disposed between the heat sinks 3A and 3B and the electrical interconnect component 1. In one embodiment, the heat sinks 3A and 3B are, for example, direct-bonded copper ceramic substrates (DBC) or direct-plated copper ceramic substrates (DPC), but the present invention is not limited thereto.

[0065] like Figure 5As shown, heat sinks 3A and 3B may include a first conductive pattern layer 31, a second conductive pattern layer 32, and an insulating heat conductor 33 located between the first conductive pattern layer 31 and the second conductive pattern layer 32. The first conductive pattern layer 31 has two separate conductive portions (not labeled), one of which is directly disposed on a plurality of first power elements 21, and the other is directly disposed on a plurality of second power elements 22. The insulating heat conductor 33 may be, for example, a ceramic plate or an insulating adhesive with a high thermal conductivity; the invention is not limited thereto. The second conductive pattern layer 32 is disposed on the insulating heat conductor 33 and has a larger area than the first conductive pattern layer 31.

[0066] Additionally, the package layer 5 covers the electrical interconnect component 1 and at least one group of electronic components 2A, 2B. However, the electrical interconnect component 1, heat sinks 3A, 3B, and multiple input / output pins 4 are partially exposed outside the package layer 5. Figure 5 As shown, the second conductive pattern layer 32 of the heat sinks 3A and 3B is exposed outside the encapsulation layer 5 so that the heat generated by the power module M1 during operation can be dissipated to the outside more effectively.

[0067] In addition, when the power module M1 is used in another system circuit (not shown), the multiple input / output pins 4 of the power module M1 and the three ends 101e-103e of the electrical interconnect component 1 that are exposed can be connected to specific voltage terminals, thereby electrically connecting the multiple power elements 21, 22 and other electronic components in the power module M1 to the system circuit.

[0068] [Second Embodiment]

[0069] Please refer to Figure 9 This is a cross-sectional schematic diagram of the power module according to the second embodiment of the present invention. This embodiment is similar to... Figure 8 Components identical in the embodiments have the same or similar reference numerals, and will not be described again. In the power module M2 of this embodiment, the electronic components (e.g., the first and third power components 21) located on opposite sides of the conductive structure 10 in the first and second electronic component groups 2A and 2B are not aligned, but are staggered. That is, the vertical projection of any electronic component in the first electronic component group 2A only partially overlaps the electronic component in the second electronic component group 2B. In this way, the heat generated when the electronic components are operating is avoided from being concentrated in a specific area, and the heat is more easily and quickly dissipated.

[0070] [Third Embodiment]

[0071] Please refer to Figure 10 , Figure 10 This is a cross-sectional schematic diagram of the power module according to the third embodiment of the present invention. This embodiment is similar to... Figure 9Components identical to those in the embodiments have the same or similar reference numerals, and will not be described again. In the power module M3 of this embodiment, there is only one group of electronic components 2A. In this embodiment, the surface of the conductive structure 10 used to set the second circuit board 12 can be a flat surface without any recessed areas.

[0072] In addition, in this embodiment, the electronic component group 2A further includes a control element 24. The control element 24 can be disposed on the first circuit board 11 and electrically connected to the third pads 21g, 22g (gate pads) of the power components 21, 22 through the first circuit board 11 to control each power component 21, 22. In this embodiment, the multiple input / output pins 4 can be omitted.

[0073] [Fourth Embodiment]

[0074] Please refer to Figure 11 This is an exploded perspective view of the power module of the fourth embodiment of the present invention, omitting the encapsulation layer. Components in the power module M4 of this embodiment have the same or similar reference numerals as those in the power module M1 of the first embodiment, and will not be described again. In the electrical interconnect component 1' of this embodiment, the conductive structure 10 has only a first conductive element 101 and a second conductive element 102 that are insulated from each other and arranged side-by-side. The first conductive element 101 and the second conductive element 102 are separated from each other, defining a slot h1.

[0075] The first circuit board 11 is disposed on one side of the conductive structure 10 with an opening 11h corresponding to a slot h1, and the second circuit board 12 is disposed on the other side of the conductive structure 10 with an opening 12h corresponding to a slot h1. When the two electronic component groups 2A and 2B are respectively disposed on opposite sides of the electrical interconnect assembly 1', multiple power components 21 in the two electronic component groups 2A and 2B can be connected in parallel with each other through the first conductive element 101 and the second conductive element 102.

[0076] [Fifth Embodiment]

[0077] Please refer to Figure 12 and Figure 13 The diagrams show a three-dimensional schematic diagram and a partially enlarged schematic diagram of the power module according to the fifth embodiment of the present invention. Components that are the same as or similar to the power module M3 in the third embodiment have the same reference numerals, and the identical parts will not be described again.

[0078] In this embodiment, the first end 101e of the first conductive member 101, the second end 102e of the second conductive member 102, and the third end 103e of the third conductive member 103 face the same direction. Furthermore, the electrical interconnect assembly 1 in this embodiment further includes a circuit multilayer board 13 and an insulating connection portion 14. The circuit multilayer board 13 and the conductive structure 10 are arranged side-by-side, and the circuit multilayer board 13 and the conductive structure 10 are separated by the insulating connection portion 14.

[0079] Please refer to the following: Figure 13 The circuit board 13 of this embodiment includes two circuit boards 131 and 132 and a conductive plate 130, with the conductive plate 130 located between the two circuit boards 131 and 132. It should be noted that the conductive plate 130 and the conductive structure 10 of the circuit board 13 of this embodiment can be manufactured in the same process, and the circuit boards 131 and 132 can be manufactured in the same process as the first circuit board 11 and the second circuit board 12. In one embodiment, circuit board 131 is a part of the first circuit board 11, and circuit board 132 is a part of the second circuit board 12. It should be noted that at least one of the circuit boards 131 and 132 can be a single-layer circuit board or a multi-layer circuit board, and the other can be an insulating board without wiring, a single-layer circuit board, or a multi-layer circuit board. In this embodiment, circuit board 131 is a single-layer circuit board or a multi-layer circuit board, and multiple traces (not shown) and solder pads (not shown) are provided on its surface and inside.

[0080] Please refer to again Figure 12 The circuit board 13 includes multiple vias 13h, each via 13h extending from the circuit board 131 through a conductive plate 130 to another circuit board 132. Thus, by providing pins (not shown) within the vias 13h, the circuitry of the circuit board 131 (or circuit board 132) can be connected to an external circuit, or the circuitry within the two circuit boards 131 and 132 can be connected.

[0081] In addition, in this embodiment, the electronic component group 2A further includes a control element 24 and at least one passive element 25. Figure 12 (Two examples are shown). The control element 24 is disposed on the circuit board 13, while the passive element 25 is disposed on the first circuit board 11. Specifically, in this embodiment, the control element 24 is disposed on the circuit board 131, but the present invention is not limited thereto. In another embodiment, the control element 24 may also be disposed on another circuit board 132. The passive element 25 is, for example, a resistor, but the present invention is not limited thereto.

[0082] It should be noted that the first circuit board 11 has multiple leads 6, and each lead 6 is electrically connected to a corresponding first power component 21 or second power component 22. In addition, some leads 6 are connected to passive components 25, and others are used to connect the circuits within the first circuit board 11 and the circuit board 131. The multiple leads 6 can extend from the first circuit board 11 to the surface of the circuit laminate 13.

[0083] In detail, in this embodiment, each lead 6 has an extension 6a to replace the input / output pin 4 shown in the third embodiment. Furthermore, the extension 6a extends from the first circuit board 11 to the surface of the circuit overlay board 13. Further, in this embodiment, the extension 6a of each lead 6 is connected to the outermost circuit board 131 via an insulating connection 14 for electrical connection to the control element 24.

[0084] [Sixth Embodiment]

[0085] Please refer to Figure 14 and Figure 15 The diagrams show a three-dimensional schematic and a partially enlarged schematic of the power module according to the sixth embodiment of the present invention. This embodiment is related to... Figure 12 The same or similar components in the embodiments have the same reference numerals, and the same parts will not be described again. The difference between this embodiment and the previous embodiment is that the circuit board 13 in this embodiment includes four circuit boards 131-134.

[0086] The surface of the circuit multilayer board 13 in this embodiment has at least one contact pad 28. Figure 14 (Multiple examples are shown). Multiple contact pads 28 can be electrically connected to circuitry within the circuit board 131. At least one contact pad 28 can be connected to the corresponding lead 6 via a connection carrier 29.

[0087] However, the present invention does not limit the connection method as long as each lead 6 can be connected to the circuit board 13. In another embodiment, the contact pad 28 can also be replaced with a conductive contact hole, and one end of the connection carrier 29 is connected to the corresponding lead 6, and the other end is inserted into the corresponding conductive contact hole, so that the lead 6 is connected to the circuit board 13.

[0088] [Beneficial Effects of the Examples]

[0089] One of the beneficial effects of the present invention is that the power module provided by the present invention can operate under high voltage and high current through the technical solution of "a first conductive element 101 and a second conductive element 102 arranged side by side and insulated from each other", "circuit boards 11 and 12 are arranged on the conductive structure 10" and "the first pads 21s and 22s and the second pads 21d and 22d of the power elements 21 and 22 are electrically connected to the first conductive element 101 and the second conductive element 102 respectively, and the third pad 21g is arranged on the circuit boards 11 and 12".

[0090] Furthermore, in the electrical interconnect component 1 of this embodiment, the circuit boards 11 and 12 are combined with the conductive structure 10 to serve as current transmission paths for multiple electronic components in the electronic component groups 2A and 2B. The conductive structure 10 can increase the current flow path, allowing large currents to pass through and providing good heat dissipation. On the other hand, control components, passive components, or protection components can be provided on the circuit boards 11 and 12 according to actual needs, so that the power modules M1-M4 of this embodiment have greater component expandability and can be used to form various standardized circuits.

[0091] In one embodiment, by providing a first circuit board 11 and a second circuit board 12 on opposite sides of the conductive structure 10, the number of electronic components can be increased without increasing the area of ​​the electrical interconnect component 1, thereby increasing the power density of the power modules M1, M2, and M4.

[0092] In addition, a portion of the encapsulation layer 5 is filled in the slot h1 between the first conductive element 101 and the second conductive element 102 and the slot h2 between the second conductive element 102 and the third conductive element 103. This can prevent the power modules M1-M4 from being damaged by arcing when operating at high voltage, thereby improving the voltage withstand capability of the power modules M1-M4.

[0093] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of the claims of the present invention.

Claims

1. A power module, characterized in that, The power module includes: An electrical interconnect component, comprising: A conductive structure includes a first conductive element, a second conductive element, and a third conductive element arranged side-by-side and insulated from each other. The first conductive element and the second conductive element are separated from each other to define a slot, and the first conductive element and the third conductive element are separated from each other to define another slot; and A first circuit board partially covering the conductive structure, the first circuit board having at least one opening corresponding to the slot and the other slot, the at least one opening also partially corresponding to the first conductive element and partially corresponding to the second conductive element, the first conductive element and the second conductive element being partially exposed in the at least one opening; and A first electronic component group includes a first power component and a second power component, wherein the first circuit board is located in a vertical direction between the conductive structure and the first electronic component group; wherein the first power component is connected across the first conductive component and the second conductive component and is electrically connected to the first circuit board through the at least one opening, the second power component is connected across the first conductive component and the third conductive component and is electrically connected to the first circuit board through the at least one opening, and the second power component is connected in series with the first power component through the first conductive component.

2. The power module as described in claim 1, characterized in that, The first conductive element, the second conductive element, and the third conductive element define a component mounting surface, and the first circuit board partially covers the component mounting surface.

3. The power module as described in claim 1, characterized in that, The electrical interconnect component further includes a circuit stack and multiple leads, the circuit stack being arranged side-by-side with the conductive structure, and the multiple leads being disposed on the first circuit board and extending from the first circuit board to the surface of the circuit stack.

4. The power module as described in claim 3, characterized in that, The circuit board has multiple through holes.

5. The power module as described in claim 3, characterized in that, The circuit board includes two circuit boards and a conductive plate located between the two circuit boards. The electronic component group further includes a control element disposed on one of the circuit boards and electrically connected to the first power element and the second power element through a plurality of leads.

6. The power module as described in claim 1, characterized in that, The electrical interconnect component further includes a circuit stack and multiple leads. The circuit stack is arranged side by side on the conductive structure, and the multiple leads are disposed on the first circuit board. The surface of the circuit stack has at least one contact pad, and the at least one contact pad is connected to the corresponding lead via a connecting carrier.

7. The power module as described in claim 1, characterized in that, The first circuit board partially covers the first conductive element and partially covers the second conductive element. The first power element has a source pad, a drain pad, and a gate pad. The source pad is electrically connected to the first conductive element, the drain pad is electrically connected to the second conductive element, and the gate pad is disposed on the first circuit board.

8. The power module as described in claim 1, characterized in that, The first circuit board partially covers the third conductive element. The second power element has a source pad, a drain pad, and a gate pad. The source pad is electrically connected to the third conductive element, the drain pad is electrically connected to the first conductive element, and the gate pad is disposed on the first circuit board.

9. The power module as described in claim 1, characterized in that, The first electronic component group further includes: a diode element, wherein the diode element is disposed on the conductive structure and connected in parallel to the first power element or the second power element.

10. The power module as described in claim 1, characterized in that, The electrical interconnect component further includes a second circuit board that partially covers the conductive structure, wherein the first circuit board and the second circuit board are located on the upper and lower sides of the conductive structure, respectively.

11. The power module as described in claim 10, characterized in that, The power module further includes: a second electronic component group disposed on the electrical interconnect assembly, wherein the second electronic component group and the second circuit board are located on the same side of the conductive structure, and have a third power element and a fourth power element, wherein the first power element is connected in parallel to the third power element through the first conductive element and the second conductive element, and the second power element is connected in parallel to the fourth power element through the first conductive element and the third conductive element.

12. The power module as described in claim 11, characterized in that, The first power element and the third power element are staggered from each other, and the second power element and the fourth power element are staggered from each other.

13. A power module, characterized in that, The power module includes: An electrical interconnect component, comprising: A conductive structure includes a first conductive element and a second conductive element arranged side-by-side and insulated from each other, the first conductive element and the second conductive element being separated from each other to define a slot; and A circuit board disposed on the conductive structure, wherein the circuit board has an opening corresponding to the slot, the opening also partially corresponding to a first conductive element and partially corresponding to a second conductive element, the first conductive element and the second conductive element being partially exposed in the opening; and An electronic component assembly includes a power element having a first pad, a second pad, and a third pad, wherein the circuit board is located in a vertical direction between the conductive structure and the electronic component assembly; wherein the first pad and the second pad are electrically connected to the first conductive element and the second conductive element respectively through the opening, and the third pad is disposed on the circuit board.

14. The power module as described in claim 13, characterized in that, The opening defines a first pad setting area in the first conductive element, and the height between a surface of the circuit board and the top surface of the first pad setting area is the same, and the first pad is connected to the first pad setting area.

15. The power module as described in claim 13, characterized in that, The opening defines a first pad setting area in the first conductive element and a second pad setting area in the second conductive element, with a height difference between the top surface of the first pad setting area and the top surface of the second pad setting area.

16. The power module as described in claim 13, characterized in that, The electrical interconnect component further includes: an insulating bonding material, wherein the insulating bonding material is located within the slot and connected between the first conductive element and the second conductive element.

17. The power module as described in claim 13, characterized in that, The electronic component group further includes: a diode element disposed on the conductive structure, wherein the two electrodes of the diode element are electrically connected to the first conductive element and the second conductive element respectively through the opening, and are connected in parallel to the power element.

18. The power module as described in claim 13, characterized in that, The power module further includes a heat sink disposed on the power element.

19. The power module as described in claim 13, characterized in that, The electronic component group further includes: a control element disposed on the circuit board and electrically connected to the power element via the circuit board.

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