Fabrication process of deep blind slot carrier board

Abstract

This application relates to a manufacturing process for a carrier board with deep blind slots, comprising the following steps: adding layers to a first copper-clad substrate to create an N-layer base substrate; performing blind via opening and via filling electroplating on a second copper-clad substrate, followed by pattern etching to retain only the vias, forming a cavity substrate; etching a third copper-clad substrate to create a single-sided copper-clad substrate, and attaching a peelable adhesive film to the single-sided copper-clad substrate to form a cover substrate; laminating multiple boards to form a multilayer board containing embedded cavities; cutting a portion along the edge of a predetermined slot on the cover substrate, attaching a peelable adhesive film, cutting the remaining portion of the predetermined slot on the cover substrate, and then peeling off the peelable adhesive film, part of the cover substrate, and the peelable adhesive film to form a carrier board with deep blind slots. This manufacturing process can process deep blind slot structures of 500μm or more, improving product expandability and added value, and offering high production efficiency and manufacturing precision.

Description

Technical Field

[0001] This application relates to carrier fabrication, specifically to a fabrication process for a carrier with a deep blind groove. Background Technology

[0002] An integrated circuit substrate, or IC substrate, connects the IC chip on one side and the motherboard on the other. To improve structural efficiency, blind slot technology has been developed, which allows the IC chip to be embedded inside the IC substrate, improving the space utilization of the IC substrate and reducing the overall thickness after packaging and testing. To meet the requirements of high-precision slot placement, laser slotting technology is typically used to achieve different depths and dimensions of blind slots.

[0003] Currently, the common blind groove depth is usually ≤200μm. The depth control laser etching method, which precisely positions the groove after etching the outer pattern using a preset stack, can accurately process blind grooves, but the processing efficiency is slow, the production cost is extremely high, and it cannot meet the processing requirements of deep blind groove depth >300μm. Summary of the Invention

[0004] To overcome the above-mentioned defects, this application provides a manufacturing process for a carrier plate with deep blind grooves. This manufacturing process utilizes a combination of peelable adhesive film and depth-controlled laser ring cutting technology to achieve ultra-high efficiency processing of deep blind groove structures, with the depth of the blind grooves reaching 600μm.

[0005] The technical solution adopted by this application to solve its technical problem is:

[0006] A manufacturing process for a carrier plate with a deep blind slot includes the following steps:

[0007] Step 1: Fabrication of the substrate: Prepare a first copper-clad substrate and add layers to the first copper-clad substrate to N layers, thereby obtaining an N-layer substrate, where N≥3; then, pre-set holes to create windows on the substrate.

[0008] Step 2: Fabrication of cavity substrate: Prepare a second copper-clad substrate, and perform blind hole opening and hole filling electroplating on the second copper-clad substrate. After pattern etching, only the through holes are retained, while the copper foil in the remaining areas is etched away, thus forming a cavity substrate with interlayer interconnection.

[0009] Step 3: Fabrication of through slots: Prepare the first and second prepregs. Using UV laser for precise positioning, burn through slots at preset positions on the first and second prepregs and the cavity substrate. At the same time, use UV laser to create riveting alignment holes on the substrate, cavity substrate, first and second prepregs.

[0010] Step 4: Fabrication of the cover substrate: Prepare a third copper-clad substrate, etch the third copper-clad substrate into a single-sided copper-clad substrate by pattern etching, make riveting alignment holes on the single-sided copper-clad substrate, and attach a peelable adhesive film that can resist adhesive to the preset cavity position of the single-sided copper-clad substrate to form the cover substrate.

[0011] Step 5: Fabrication of the multilayer board: The cover substrate, the first prepreg, the cavity substrate, the second prepreg, and the base substrate are pressed together using high-precision positioning to form a multilayer board containing an embedded cavity.

[0012] Step 6: Carrier plate fabrication: After cutting a portion along the edge of the preset groove on the cover substrate, apply a peelable adhesive film to the cover substrate, then cut the remaining portion of the preset groove on the cover substrate, and then peel off the peelable adhesive film, part of the cover substrate and the peelable film to form a carrier plate with a deep blind groove.

[0013] Optionally, in step 1, the first copper-clad substrate includes a first insulating layer and copper foil layers respectively disposed on the front and back sides of the first insulating layer, and the first copper-clad substrate is fabricated to N layers using the insulating layer and copper foil layers, and pre-set holes are opened on the first inner copper foil layer of the substrate, wherein the thickness of the first insulating layer is 25μm-60μm.

[0014] Optionally, in step 2, the second copper-clad substrate includes a second insulating layer and copper foil layers respectively disposed on the front and back sides of the second insulating layer. The second copper-clad substrate is subjected to CO2 laser to create X-type blind holes and to fill the holes with electroplating to achieve interlayer conductivity of the second copper-clad substrate. The thickness of the second insulating layer is 100μm-400μm, and the process parameters of the CO2 laser blind hole are energy 0.5-4.5mJ, number of shots 2-5, and pulse width 3-8μs.

[0015] Optionally, in step 3, the specific process parameters for manufacturing the through groove are: the laser ultraviolet picosecond power is 10W, the frequency is 1000KHZ, the processing speed is 1000-1500mm / s, and the number of processing times is 3-6.

[0016] Optionally, in step 4, the third copper-clad substrate includes a third insulating layer and copper foil layers respectively disposed on the front and back sides of the third insulating layer. First, a riveting alignment target is made on the single-sided copper-clad substrate, and then an X-ray target is used to make a riveting alignment hole. A peelable film with adhesive resistance is pre-attached at a preset cavity position in the third insulating layer. The thickness of the peelable film is equal to the thickness of the deep blind groove finally formed on the carrier board. The process parameters for making the alignment hole by X-ray are voltage 26±5KV, current 0.6±0.05mA, φ0.32mm drill bit, and CCD target grabbing and target making. The thickness of the third insulating layer is 25μm-60μm, and the peelable film is a photosensitive epoxy pure film.

[0017] Optionally, in step 5, when laminating multilayer boards, a semi-curing process is used for the initial pressing and a full-curing process is used for the subsequent pressing. The number of layers is ≤12, and kraft paper or cushioning pads are used as a base layer for pressing.

[0018] Optionally, in step 6, after the cover substrate is cut half a circle around the preset groove edge using a depth-controlled UV laser process, a peelable adhesive film is vacuum-applied, and then the other half of the groove edge on the cover substrate is cut off by a depth-controlled UV laser. The peelable adhesive film is then peeled off, and part of the cover substrate and the peelable film are removed together, thereby forming a carrier plate with a deep blind groove.

[0019] Optionally, in step 6, the specific parameters of the controlled-depth UV laser process are: energy 2.3mJ, number of pulses 3-5, pulse width 3μs, and the peelable film is a photosensitive epoxy pure film.

[0020] The beneficial effects of this application are:

[0021] 1) In this application, a peelable film is pre-embedded in the through groove. Because the peelable film can prevent the prepreg from flowing during the pressing process, the insulating layer, i.e., the prepreg, can use ordinary PP sheet. This realizes the application of ordinary PP on the pre-grooved riveted structure blind groove plate, replacing the expensive low melt flow rate PP used in the traditional process. This reduces the manufacturing cost of the carrier plate, is conducive to the uniformity of the overall substrate material and the consistency of the CTE index, i.e., the coefficient of thermal expansion of inductance index. It can effectively control the warping of the carrier plate and greatly improve the performance of the carrier plate. Therefore, the deep blind groove structure carrier plate produced by this process is not limited by PP material and can be selected according to the substrate body stacking. This is conducive to the uniformity of material selection, reduces the variety of stock, and reduces the production cost to a certain extent.

[0022] 2) In this process, high dielectric thickness X-shaped laser blind vias and stacked via filling technology are used to achieve arbitrary interlayer electrical interconnection after the combination of multifunctional structural substrates. This is beneficial for diverse graphic layout design in the limited space outside the blind slot area, thus expanding the functionality of the product.

[0023] 3) In this process, the combination of peelable adhesive film and controlled-depth laser ring cutting technology enables the rapid uncovering of the pre-embedded cavity, which greatly saves the processing time of deep blind groove structure products. In this process, by adjusting and combining the stacking structure and process, and using existing process equipment, the production and processing efficiency of deep blind grooves is improved without increasing the complexity of the process, that is, the manufacturing process of deep blind groove structures with ultra-high efficiency is realized.

[0024] 4) This process breaks through the limitations of traditional laser blind groove depth, is applicable to the processing of various types of deep blind groove structures, and provides a feasible mass production solution for processing deep blind groove structures with a depth of more than 500μm, thereby improving the scalability and added value of the product. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the carrier plate in this application;

[0026] Figure 2 This is a schematic diagram of the structure of the substrate in this application;

[0027] Figure 3 This is a schematic diagram of the cavity substrate in this application;

[0028] Figure 4 This is a schematic diagram of the structure of the cover substrate in this application;

[0029] Figure 5 This is a schematic diagram of the multilayer board structure in this application;

[0030] Figure 6 This is a schematic diagram of the structure of a portion of the multilayer board after circumferential cutting in this application;

[0031] Figure 7 This is a schematic diagram of the structure of the multilayer board after the peelable adhesive film is applied in this application;

[0032] Figure 8 This is a schematic diagram of the structure of all the multilayer boards after circumferential cutting in this application;

[0033] Figure 9 This is a diagram illustrating the film removal process of the multilayer board in this application;

[0034] In the figure: 10-substrate, 11-first insulating layer, 12-first inner copper foil layer, 20-cavity substrate, 21-second insulating layer, 30-cover substrate, 31-third insulating layer, 32-peelable film, 33-tearable adhesive film, 40-multilayer board, 50-carrier board, 51-first prepreg, 52-second prepreg, 53-deep blind groove. Detailed Implementation

[0035] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0036] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such uses of the terms can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0037] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0038] Example: A manufacturing process for a carrier plate with deep blind slots, comprising the following steps:

[0039] Step 1: Fabrication of substrate 10: Prepare a first copper-clad substrate and add layers to the first copper-clad substrate up to N layers, such as... Figure 2 As shown, an N-layer substrate 10 is obtained, where N≥3; then, pre-set holes are made on the substrate 10 to prepare for interlayer blind via stacking and conduction. In this embodiment, the substrate 10 is a four-layer board, but it can also be a three-layer board, a five-layer board, a six-layer board, etc.

[0040] Step 2: Fabrication of cavity substrate 20: as follows Figure 3 As shown, a second copper-clad substrate is prepared, and the second copper-clad substrate is subjected to blind hole opening and hole filling electroplating treatment. After pattern etching, only the through holes are retained, while the copper foil in the remaining area is etched away, thus forming a cavity substrate 20 with interlayer interconnection.

[0041] Step 3: Fabrication of through-slots: Prepare the first prepreg 51 and the second prepreg 52. Using UV laser for precise positioning, burn through-slots into the predetermined positions of the first prepreg 51, the second prepreg 52, and the cavity substrate 20. At the same time, use UV laser to create riveting alignment holes on the substrate 10, the cavity substrate 20, the first prepreg 51, and the second prepreg 52; this prepares for the riveting lamination of each layer. The first prepreg 51 and the second prepreg 52 are both made of a high-molecular polymer synthesized from epoxy resin and fiberglass cloth, i.e., PP sheets. Figure 3 A cavity substrate 20 with through slots is shown;

[0042] Step 4: Fabrication of the cover substrate 30: Prepare a third copper-clad substrate, and etch the third copper-clad substrate into a single-sided copper-clad substrate using pattern etching. Make riveting alignment holes on the single-sided copper-clad substrate, and attach a peelable adhesive film 32 with adhesive resistance to the predetermined cavity position on the single-sided copper-clad substrate. Figure 4 As shown, a cover substrate 30 is formed; the so-called adhesive-blocking peelable film 32 refers to: the peelable film 32 is embedded in the substrate, which can block the glue flow of the prepreg, i.e. PP sheet, during the pressing process. After the PP sheet is pressed and cured, the peelable film is removed to form a cavity.

[0043] Step 5: Fabrication of the multilayer board 40: The cover substrate 30, the first prepreg 51, the cavity substrate 20, the second prepreg 52, and the base substrate 10 are pressed together using high-precision positioning to form a multilayer board 40 containing an embedded cavity, such as... Figure 5 As shown; the above-mentioned plates are riveted and positioned. Before pressing, the peelable film 32 is placed in the through grooves opened in the first semi-cured film 51, the cavity substrate 20 and the second semi-cured film 52 to play the role of preventing adhesive from being applied. In this embodiment, the multilayer board 40 is a five-layer board.

[0044] Step 6: Fabrication of carrier board 50: as follows Figure 6 As shown, after cutting a portion along the edge of the preset groove on the cover substrate 30, as... Figure 7 As shown, a peelable adhesive film 33 is attached to the cover substrate 30, such as... Figure 8 As shown, the remaining portion of the preset groove on the cover substrate 30 is then cut open, and the peelable adhesive film 33, part of the cover substrate, and the peelable film 32 are then peeled off to form a carrier plate 50 with a deep blind groove 53, as shown. Figure 1 As shown.

[0045] In this application, an opening is cut around the edge of a pre-set groove in the cover substrate 30, and a portion of the cover substrate 30 is cut off from the main body. The cut-off portion of the cover substrate and the peelable film are peeled off together with the peelable adhesive film, forming a deep blind groove 53 on the carrier board 50. In this manufacturing process, the base substrate 10, cavity substrate 20, and cover substrate 30 are fabricated separately. A through groove is pre-formed in the cavity substrate 20, and a peelable film 32 is pre-attached to the cover substrate 30. Then, the base substrate, cavity substrate, and cover substrate are pressed together to form a multilayer board. During pressing, the peelable film is inserted into the through groove of the cavity substrate. Finally, the carrier board with the deep blind groove is obtained by performing a fixed-depth circumferential cut on the multilayer board, attaching the peelable film, and peeling off the peelable film. This manufacturing process can process deep blind groove structures of 500μm or more, improving the product's expandability and added value, and also offering high production efficiency and manufacturing precision.

[0046] In step 1, the first copper-clad substrate includes a first insulating layer 11 and copper foil layers respectively disposed on the front and back sides of the first insulating layer. The first copper-clad substrate is then layered up to N layers using the insulating layer and copper foil layers. Pre-set holes are made in the first inner copper foil layer 12 of the substrate 10. The thickness of the first insulating layer 11 is 25μm-60μm. That is, the first copper-clad substrate is a double-layer board, which can be layered by single or double-sided layering. For example, a three-layer board can be obtained by a single-sided layering, a four-layer board by a double-sided layering, a five-layer board by a double-sided layering and a single-sided layering, and so on. Multilayer boards with different numbers of layers can be arbitrarily manufactured as needed. Optionally, the multilayer board can be 3-10 layers, such as… Figure 2 As shown, in this embodiment, the substrate 10 is a four-layer board, and the first insulating layer 11 is a prepreg, namely a polymer PP sheet synthesized from epoxy resin and fiberglass cloth. For clarity, the innermost copper foil layer of the substrate 10 is defined as the first inner copper foil layer 12. The layering process includes pretreatment, browning, lamination, pressing, and post-treatment steps.

[0047] In step 2, the second copper-clad substrate includes a second insulating layer 21 and copper foil layers respectively disposed on the front and back sides of the second insulating layer. The second copper-clad substrate undergoes CO2 laser etching to create X-shaped blind vias and through-hole electroplating to achieve interlayer conductivity. The thickness of the second insulating layer 21 is 100μm-400μm, and the CO2 laser blind via process parameters are energy 0.5-4.5mJ, number of pulses 2-5, and pulse width 3-8μs. The second insulating layer is a prepreg, i.e., a polymer PP sheet synthesized from epoxy resin and fiberglass cloth. Because a peelable film 32 is provided in the groove of the second insulating layer during lamination, which can prevent the prepreg from flowing during lamination, the second insulating layer can use ordinary PP sheet instead of expensive, low melt flow rate PP. After drilling blind vias and electroplating to fill them in the second copper-clad substrate, the copper foil layers on both sides of the second insulating layer 21 are made conductive. Then, a pattern etching process is used to etch away all copper foil layers except for the vias, leaving the vias connected to the substrate, thus forming a cavity substrate 20 with interlayer communication. Here, an X-type blind via refers to a blind via with a small diameter in the middle and large diameters at both ends, see... Figure 3 As shown, by using high dielectric thickness laser X-type blind vias and stacked via filling technology, arbitrary layer electrical interconnection between layers of the multifunctional structural substrate is achieved. This facilitates diverse graphic layout designs in the limited space outside the blind slot area, expanding the product's functionality.

[0048] In step 3, the specific process parameters for the through-slot fabrication are as follows: the laser ultraviolet picosecond power is 10W, the frequency is 1000KHZ, the processing speed is 1000-1500mm / s, and the number of processing times is 3-6.

[0049] In step 4, the third copper-clad substrate includes a third insulating layer 31 and copper foil layers respectively disposed on the front and back sides of the third insulating layer. First, a riveting alignment target is made on the single-sided copper-clad substrate, and then an X-ray target is used to make a riveting alignment hole. A peelable film 32 with adhesive resistance is pre-attached at a preset cavity position in the third insulating layer 31. The thickness of the peelable film 32 is equal to the thickness of the deep blind groove finally formed by the carrier board 50. The process parameters for making the alignment hole by X-ray are voltage 26±5KV, current 0.6±0.05mA, φ0.32mm drill bit, and CCD target grabbing and target hitting. The thickness of the third insulating layer 31 is 25μm-60μm, and the peelable film 32 is a photosensitive epoxy pure film.

[0050] In step 5, during the lamination of the multilayer board 40, a semi-cured process is used for the initial lamination, and a fully cured process is used for subsequent lamination. The number of layers is ≤12, and kraft paper or buffer pads are used as a lamination buffer layer. The multilayer board 40 consists of a cover substrate 30, a first semi-cured sheet 51, a cavity substrate 20, a second semi-cured sheet 52, and a base substrate 10 from top to bottom. The peelable film 32 fills the through slots of the first semi-cured sheet 51, the cavity substrate 20, and the second semi-cured sheet 52. In this application, by pre-embedding the peelable film in the through slots, the second insulating layer 21 can use ordinary PP sheet, thus realizing the application of ordinary PP on the blind slot board of the pre-grooved riveted structure. This replaces the expensive, low melt flow rate PP used in traditional processes, reduces the manufacturing cost of the carrier board, facilitates the uniformity of the overall substrate material and the consistency of the CTE index (coefficient of thermal expansion), effectively controls the warping of the carrier board, and greatly improves the performance of the carrier board.

[0051] In step 6, as Figure 6 As shown, the cover substrate 30 is circumferentially cut to a fixed depth along the edge of a preset groove using a controlled-depth UV laser process; as shown... Figure 7 As shown, the vacuum-applied peelable adhesive film 33 is applied, as... Figure 8 As shown, the edge of the groove on the cover substrate 30 is then cut off using a depth-controlled UV laser ring; as shown Figure 9 As shown, the peelable adhesive film 33 is peeled off, removing part of the cover substrate and the peelable film together, thereby forming a carrier plate 50 with a deep blind groove 53, as shown. Figure 1 As shown. After the edge of the groove on the other half of the cover substrate 30 is cut off by laser, the cover substrate 30 is divided into a main part and a cut-off part. The cut-off part is completely separated from the main part. The upper and lower sides of the cut-off part are respectively attached to the peelable adhesive film 33 and the peelable film 32. Therefore, when the peelable adhesive film is peeled off, the cut-off part of the cover substrate 30 and the peelable film 32 can be peeled off together, leaving a deep blind groove, thus forming a carrier plate 50 with a deep blind groove.

[0052] In step 6, the specific parameters of the depth-controlled UV laser process are: energy 2.3 mJ, number of pulses 3-5, and pulse width 3 μs. The peelable adhesive film 33 is a photosensitive epoxy pure film. By combining the peelable adhesive film with the depth-controlled laser ring cutting process, the pre-embedded cavity can be quickly uncovered, greatly saving the processing time of deep blind groove structure products, thus achieving an ultra-high efficiency manufacturing process for deep blind groove structures. Moreover, this manufacturing process is applicable to the processing of various types of deep blind groove structures, with a blind groove depth of up to 600 μm.

[0053] It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the scope of protection of this patent application shall be determined by the appended claims.

Claims

1. A manufacturing process for a carrier plate with a deep blind groove, characterized in that: Includes the following steps: Step 1: Fabrication of the substrate (10): Prepare a first copper-clad substrate and add layers to the first copper-clad substrate to N layers to obtain an N-layer substrate (10), where N≥3; then, pre-set holes are made on the substrate (10). Step 2: Fabrication of cavity substrate (20): Prepare a second copper-clad substrate, and perform blind hole opening and hole filling electroplating on the second copper-clad substrate. After pattern etching, only the through holes are retained, while the copper foil in the remaining area is etched away, thus forming a cavity substrate (20) with interlayer interconnection. Step 3: Fabrication of through slots: Prepare the first semi-cured sheet (51) and the second semi-cured sheet (52). Precisely position them with a UV laser and burn through slots at preset positions on the first semi-cured sheet (51), the second semi-cured sheet (52) and the cavity substrate (20). At the same time, use a UV laser to create riveting alignment holes on the base substrate (10), the cavity substrate (20), the first semi-cured sheet (51) and the second semi-cured sheet (52). Step 4: Fabrication of the cover substrate (30): Prepare a third copper-clad substrate, etch the third copper-clad substrate into a single-sided copper-clad substrate by pattern etching, make a riveting alignment hole on the single-sided copper-clad substrate, and attach a peelable adhesive film (32) that can resist adhesive at the preset cavity position of the single-sided copper-clad substrate to form the cover substrate (30). Step 5: Fabrication of multilayer board (40): The cover substrate (30), the first semi-cured sheet (51), the cavity substrate (20), the second semi-cured sheet (52) and the base substrate (10) are pressed together by high-precision positioning to form a multilayer board (40) containing an embedded cavity. Step 6: Fabrication of carrier plate (50): After cutting a portion along the edge of the preset groove of the cover substrate (30), a peelable adhesive film (33) is attached to the cover substrate (30), and the remaining portion of the preset groove of the cover substrate (30) is cut off. Then, the peelable adhesive film (33), part of the cover substrate and the peelable film (32) are peeled off to form a carrier plate (50) with a deep blind groove (53).

2. The manufacturing process of the carrier plate with deep blind slots according to claim 1, characterized in that: In step 1, the first copper-clad substrate includes a first insulating layer (11) and copper foil layers respectively disposed on the front and back sides of the first insulating layer. The first copper-clad substrate is fabricated to N layers using the insulating layer and copper foil layers. A pre-set hole is opened on the first inner copper foil layer (12) of the substrate (10). The thickness of the first insulating layer (11) is 25μm-60μm.

3. The manufacturing process of the carrier plate with deep blind grooves according to claim 1, characterized in that: In step 2, the second copper-clad substrate includes a second insulating layer (21) and copper foil layers respectively disposed on the front and back sides of the second insulating layer. The second copper-clad substrate is subjected to CO2 laser to create X-type blind holes and to fill the holes by electroplating, so as to realize interlayer conductivity of the second copper-clad substrate. The thickness of the second insulating layer (21) is 100μm-400μm, and the process parameters of CO2 laser blind holes are energy 0.5-4.5mJ, number of shots 2-5, and pulse width 3-8μs.

4. The manufacturing process of the carrier plate with deep blind grooves according to claim 1, characterized in that: In step 3, the specific process parameters for the through-slot fabrication are as follows: the laser ultraviolet picosecond power is 10W, the frequency is 1000KHZ, the processing speed is 1000-1500mm / s, and the number of processing times is 3-6.

5. The manufacturing process of the carrier plate with deep blind slots according to claim 1, characterized in that: In step 4, the third copper-clad substrate includes a third insulating layer (31) and copper foil layers respectively disposed on the front and back sides of the third insulating layer. First, a riveting alignment target is made on the single-sided copper-clad substrate, and then an X-ray target is used to make a riveting alignment hole. A peelable film (32) with adhesive resistance is pre-attached at a preset cavity position of the third insulating layer (31). The thickness of the peelable film (32) is equal to the thickness of the deep blind groove finally formed by the carrier board (50). The process parameters for making the alignment hole by X-ray are voltage 26±5KV, current 0.6±0.05mA, φ0.32mm drill bit, and CCD target grabbing and target hitting. The thickness of the third insulating layer (31) is 25μm-60μm, and the peelable film (32) is a photosensitive epoxy pure film.

6. The manufacturing process of the carrier plate with deep blind slots according to claim 1, characterized in that: In step 5, when the multilayer board (40) is pressed, a semi-curing process is used for the initial pressing and a full curing process is used for the subsequent pressing. The number of layers is ≤12, and kraft paper or buffer pads are used as the base layer for pressing.

7. The manufacturing process of the carrier plate with deep blind grooves according to claim 1, characterized in that: In step 6, the cover substrate (30) is cut half a circle around the preset groove edge using a depth-controlled UV laser process; a peelable adhesive film (33) is vacuum-applied, and then the other half of the groove edge on the cover substrate (30) is cut off by a depth-controlled UV laser; the peelable adhesive film (33) is peeled off, and the peelable adhesive film (33) peels off part of the cover substrate and the peelable film together, thereby forming a carrier plate (50) with a deep blind groove (53).

8. The manufacturing process of the carrier plate with deep blind grooves according to claim 7, characterized in that: In step 6, the specific parameters of the controlled-depth UV laser process are: energy 2.3mJ, number of pulses 3-5, pulse width 3μs, and the peelable film (33) is a photosensitive epoxy pure film.

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