A microcomputer protection testing device

Abstract

The application discloses a kind of microcomputer protection testing devices, comprising: device body, device body upper end is equipped with heat dissipation port;Heat dissipation device, heat dissipation device includes multiple layering in the heat dissipation port above fin and the fin rope connected with adjacent two fins;Driving device, driving device includes the support assembly being arranged in heat dissipation port and the temperature change rod being arranged in support assembly above, the upper end of temperature change rod is connected with the uppermost fin of heat dissipation device, and temperature change rod drives fin to be sequentially moved up from top to bottom.This scheme can gradually stretch upwards by the setting of layering fin, in turn make heat dissipation port gradually bare, substantially increase the heat exchange area inside and outside device body, effectively accelerate heat dissipation, in turn effectively avoid the gathering of heat in device body, make the influence of overheating on the stability and accuracy of device body testing substantially reduce, while effectively reduce the security risk caused by overheating to line.

Description

Technical Field

[0001] This invention relates to the field of power system automation technology, and in particular to a microcomputer protection testing device. Background Technology

[0002] Electricity is an indispensable energy source in modern society's production and household life. It is provided by the power system, and the stable operation of the power system is key to ensuring a safe and reliable power supply. To ensure the stability of the power system, it is necessary to isolate faults in a timely manner when they occur. This task is accomplished by various relay protection devices.

[0003] Relay protection devices are a crucial component of power systems, playing a vital role in ensuring their safe operation. With technological advancements, relay protection devices have evolved through several generations, including electromagnetic, transistor, integrated circuit, and microprocessor-based models. Microprocessor-based relay protection devices, with their advantages of convenient function expansion, flexible settings, comprehensive self-testing capabilities, and consistent operation, have become the mainstream in terms of development and application. Currently, the power industry almost universally adopts microprocessor-based protection devices for relay protection.

[0004] When a short-circuit fault occurs in the power supply system, the relay protection will determine the fault based on the collected external electrical parameters and other information, and immediately control the high-voltage circuit breaker to disconnect the fault, thereby preventing the power supply equipment from burning out and the fault from spreading, and ensuring the stable operation of the power supply system. However, when the testing device operates for a long time, it will overheat. Overheating will affect the accuracy and stability of the microprocessor protection test. In severe cases, overheating may even lead to power outage or line burnout. The heat dissipation device of the existing microprocessor protection test device has a complex structure, requiring changes to the device body structure, increasing manufacturing costs; it is also complicated to operate and has poor heat dissipation effect.

[0005] For example, Chinese Patent Publication No. CN215872519U, published on February 18, 2022, entitled "A High-Efficiency Heat Dissipation Structure for a Microcomputer Relay Protection Tester," includes a heat dissipation box and a tester body. Multiple first heat dissipation vents are evenly distributed on the side walls of the heat dissipation box, and the tester body is located at the center of the bottom of the heat dissipation box. This invention utilizes the heat dissipation box, sliding groove, and sensing frame to push the first heat dissipation plate upwards during heat dissipation by the airbag, causing the first and second heat dissipation vents to align. This makes the heat dissipation box permeable, facilitating air circulation and accelerating heat dissipation of the tester body. Simultaneously, the movement of the first heat dissipation plate moves the bonding plate, which then adheres to the tester body. Through contact, the heat from the tester body is conducted to the bonding plate, which has a large contact area with the air, facilitating heat dissipation of the tester body.

[0006] The drawbacks of existing patents are: the heat dissipation device of the existing microcomputer protection test device has a complex structure, which requires changes to the main structure of the microcomputer protection test device, increasing manufacturing costs; the heat dissipation operation is complicated and the heat dissipation effect is poor. Summary of the Invention

[0007] The purpose of this invention is to solve the problems of complex structure of heat dissipation device in existing microcomputer protection test devices, which requires changes to the device body structure, increases manufacturing cost, and results in complex heat dissipation operation and poor heat dissipation effect. The invention provides a microcomputer protection test device with a simple heat dissipation device structure, easy heat dissipation operation, and improved heat dissipation effect.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: A microcomputer protection testing device, comprising: The device body has a heat dissipation vent at its upper end; A heat dissipation device, comprising multiple heat dissipation fins stacked above the heat dissipation vents and connecting ropes linking adjacent heat dissipation fins; The driving device includes a support assembly disposed within the heat dissipation vent and a temperature-changing rod disposed above the support assembly. The upper end of the temperature-changing rod is connected to the heat sink at the top of the heat dissipation device, and the temperature-changing rod drives the heat sink to move upwards sequentially from top to bottom. This microcomputer protection testing device, as described in this solution, sets up a heat dissipation device and a driving device at the heat dissipation vent of the device body, providing real-time and effective heat dissipation for the microcomputer protection testing device without altering the device body structure. Working principle: The temperature-changing rod gradually extends upwards according to the gradually increasing temperature of the device body during operation. The temperature-changing rod causes the heat sink to move upwards sequentially from top to bottom, unfolding the heat dissipation device and exposing the heat dissipation vents. This significantly increases the heat exchange area inside and outside the device body, effectively accelerating heat dissipation and thus effectively preventing heat accumulation within the device body. This significantly reduces the impact of overheating on the stability and accuracy of the device body during testing, while also effectively reducing safety hazards caused by overheating to the circuitry.

[0009] The temperature-changing rod is made of multiple two-way shape memory alloys. The critical temperature of the two-way shape memory alloy is determined by the safe operating temperature of the device body. Its critical temperature is lower than the highest safe operating temperature of the device body, and the temperature difference is not less than 5℃. Below the critical temperature, the temperature-changing rod is spiral-shaped, and the stacked heat sinks are overlapping each other. Above the critical temperature, the temperature-changing rod gradually elongates, causing the stacked heat sinks to extend upwards and separate from each other. This can accelerate the exhaust of internal hot air, accelerate heat dissipation, and reduce the impact of overheating on the operational stability of the testing device.

[0010] There are multiple connecting ropes. When the stacked heat sinks are separated and unfolded, the connecting ropes serve two purposes: connecting and self-expanding net. As the heat sinks unfold, the connecting ropes gradually straighten to form a conical net, which can block the gaps formed by two adjacent heat sinks after they are extended, effectively preventing external debris from entering the device body through the gaps and effectively preventing damage to the electrical components inside the device body.

[0011] Preferably, the heat sink includes multiple heat dissipation rings stacked above the heat dissipation openings and a heat dissipation top plate located at the upper end of the heat dissipation rings. The heat dissipation top plate is connected to a temperature-changing rod. The temperature-changing rod drives the heat dissipation top plate to move upward, and the heat dissipation top plate drives the heat dissipation rings to rise sequentially via connecting ropes.

[0012] Preferably, the heat sink has heat dissipation holes that connect the interior and exterior of the device body. These heat dissipation holes provide basic heat dissipation.

[0013] Preferably, the heat dissipation rings are coaxially arranged, with their outer diameters increasing sequentially from top to bottom, and the outer diameter of any one heat dissipation ring being larger than the inner diameter of the heat dissipation ring below it. This provides a good shielding effect, and the sequentially increasing outer diameters of the heat dissipation rings, combined with their stacked arrangement, reduce space occupancy.

[0014] Preferably, the heat sink is provided with a mounting slot, and any one of the heat sinks is located in the mounting slot of the heat sink below the heat sink. The mounting slot is used to place the heat sink and serves a positioning function.

[0015] Preferably, the heat sink at the bottom of the heat dissipation device mates with the heat dissipation vent. The heat sink at the bottom of the heat dissipation device falls into the heat dissipation vent, which facilitates the positioning of the heat dissipation device.

[0016] Preferably, the support assembly includes a bottom pad ring disposed on the device body and a support member disposed within the bottom pad ring. The bottom pad ring is located below the heat dissipation vent, the lower end of the temperature-changing rod is connected to the support member, and the heat sink is located above the bottom pad ring. The bottom pad ring serves to support the base and is positioned below the heat dissipation vent.

[0017] Preferably, the support member includes a central liner plate disposed in the middle of the bottom pad ring and a bushing rod for connecting the central liner plate and the inner wall of the bottom pad ring. The central liner plate provides support, and the bushing rod prevents the support member from obstructing the heat dissipation vents, thereby reducing the impact on heat dissipation.

[0018] Preferably, the device body is equipped with a handle that rotates to the side, the handle has a magnetic plate, and the heat dissipation top plate has a magnetic sheet, with the magnetic plate positioned above the magnetic sheet. When the handle is rotated to the top of the device body, the magnetic plate is positioned above the magnetic sheet, the heat dissipation fins unfold upwards, and the heat dissipation vents are gradually exposed, accelerating heat dissipation. As the heat dissipation top plate gradually approaches the magnetic plate, it is attracted by the magnetic plate, thus stabilizing the upward extension of the heat dissipation fins and ensuring continuous heat dissipation from the heat dissipation vents.

[0019] Preferably, the temperature-changing rod is vertically arranged, coaxially with the heat dissipation top plate, and coaxially with the heat dissipation opening. The heat dissipation holes are circumferentially distributed according to the temperature-changing rod, ensuring uniform heat dissipation.

[0020] Therefore, the present invention has the following beneficial effects: (1) By setting up the stacked heat sink, the heat sink can gradually extend upward as the temperature of the device body gradually increases during operation, thereby gradually exposing the heat dissipation port, greatly increasing the heat exchange area inside and outside the device body, effectively accelerating heat dissipation, thereby effectively avoiding the accumulation of heat inside the device body, greatly reducing the impact of overheating on the stability and accuracy of the device body during testing, and effectively reducing the safety hazards caused by overheating to the circuit; (2) By setting up the self-expanding net, a conical net can be spontaneously formed on the inner side of the stacked heat sink after the stacked heat sink extends, thereby blocking the gap formed by the extension of two adjacent stacked rings, effectively preventing external debris from entering the device body along the gap, and effectively preventing damage to the electrical components inside the device body. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the present invention.

[0022] Figure 2 This is another structural schematic diagram of the present invention.

[0023] Figure 3 This is a schematic diagram of the heat dissipation device and the driving device in this invention.

[0024] Figure 4 This is a cross-sectional view of the heat dissipation device and the driving device in this invention.

[0025] Figure 5 This is a schematic diagram of the heat dissipation device in its unfolded state according to the present invention.

[0026] Figure 6 This is a schematic diagram of a structure in which the continuous rope is not unfolded in the present invention.

[0027] Figure 7 This is a schematic diagram of one structure of the continuous rope in the unfolded state in this invention.

[0028] As shown in the picture: Device body 1, heat dissipation vent 2, 3. Heat sink 3, Heat sink ring 3.1, Heat sink top 3.2, Heat sink holes 3.3, Mounting slot 3.4 4. Connecting rope; 5. Bottom pad ring. Support component 6, center liner 6.1, liner rod 6.2, 7. Temperature-sensitive rod; 8. Handle; 9. Magnetic plate; 10. Magnetic sheet. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0030] Example 1, as Figures 1 to 7 The microcomputer protection testing device shown includes: Device body 1, with a heat dissipation vent 2 at the upper end of device body 1; The heat dissipation device includes multiple heat dissipation fins 3 stacked above the heat dissipation port 2 and connecting ropes 4 connecting two adjacent heat dissipation fins 3. The driving device includes a support component 6 disposed in the heat dissipation port 2 and a temperature-changing rod 7 disposed above the support component 6. The upper end of the temperature-changing rod 7 is connected to the heat sink 3 located at the top of the heat dissipation device. The temperature-changing rod 7 drives the heat sink 3 to move upward from top to bottom.

[0031] The microcomputer protection testing device described in the above embodiment includes a heat dissipation device and a driving device at the heat dissipation port 2 of the device body 1. This allows for real-time and effective heat dissipation of the microcomputer protection testing device without altering the structure of the device body 1. Working principle: The temperature-changing rod 7 gradually extends upwards according to the gradually increasing temperature of the device body 1 during operation. The temperature-changing rod 7 causes the heat sink 3 to move upwards sequentially from top to bottom, unfolding the heat dissipation device and exposing the heat dissipation ports 2. This significantly increases the heat exchange area inside and outside the device body 1, effectively accelerating heat dissipation and preventing heat accumulation inside the device body 1. This significantly reduces the impact of overheating on the stability and accuracy of the device body 1 during testing, while also effectively reducing safety hazards caused by overheating. This solves the problems of complex structures in the heat dissipation devices of existing microcomputer protection testing devices, requiring changes to the structure of the device body 1, increasing manufacturing costs; complex heat dissipation operations; and poor heat dissipation effects.

[0032] The temperature-changing rod 7 is made of multiple two-way shape memory alloys. The critical temperature of the two-way shape memory alloy is determined by the safe operating temperature of the device body 1. Its critical temperature is lower than the highest safe operating temperature of the device body 1, and the temperature difference is not less than 5℃. The temperature-changing rod 7 is spiral-shaped below the critical temperature. At this time, the stacked heat sinks 3 are overlapping each other. When the temperature-changing rod 7 is above the critical temperature, it gradually elongates, causing the stacked heat sinks 3 to extend upwards and the heat sinks 3 to separate from each other. This can accelerate the exhaust of internal hot air, accelerate heat dissipation, and reduce the impact of overheating on the operational stability of the testing device.

[0033] There are multiple connecting ropes 4. When the stacked heat sinks 3 are separated and unfolded, the connecting ropes 4 serve as both a connecting function and a self-expanding net. As the heat sinks 3 unfold, the connecting ropes 4 gradually straighten to form a conical net, which can then block the gap formed by the extension of two adjacent heat sinks 3, effectively preventing external debris from entering the device body 1 through the gap and effectively preventing damage to the electrical components inside the device body 1.

[0034] Furthermore, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, the heat sink 3 includes multiple heat sink rings 3.1 stacked above the heat sink 2, and a heat sink top plate 3.2 located at the upper end of the heat sink rings 3.1. The heat sink top plate 3.2 is connected to the temperature control rod 7. The temperature control rod 7 drives the heat sink top plate 3.2 to move upward, and the heat sink top plate 3.2 drives the heat sink rings 3.1 to rise sequentially through the connecting rope 4.

[0035] Furthermore, such as Figure 4 As shown, the heat sink 3 has heat dissipation holes 3.3, and the heat dissipation opening 2 passes through the interior and exterior of the device body 1. The heat dissipation holes 3.3 provide basic heat dissipation. The heat dissipation rings 3.1 are coaxially arranged, and the outer diameter of the heat dissipation rings 3.1 increases from top to bottom. The outer diameter of any heat dissipation ring 3.1 is larger than the inner diameter of the heat dissipation ring 3.1 below it. This provides a good shielding effect. The outer diameter of the heat dissipation rings 3.1 increases from top to bottom, and the stacked arrangement reduces space occupation.

[0036] Furthermore, such as Figure 4 , Figure 5 As shown, the heat sink 3 is provided with a mounting groove 3.4, and any heat sink 3 is located in the mounting groove 3.4 of the heat sink 3 below the heat sink 3. The mounting groove 3.4 is used to place the heat sink 3 and serves a positioning function. The heat sink 3 located at the bottom of the heat dissipation device cooperates with the heat dissipation port 2. The heat sink 3 located at the bottom of the heat dissipation device falls into the heat dissipation port 2, which facilitates the positioning of the heat dissipation device.

[0037] Furthermore, such as Figure 4 , Figure 5As shown, the support assembly 6 includes a bottom ring 5 mounted on the device body 1 and a support member disposed within the bottom ring 5. The bottom ring 5 is located below the heat dissipation port 2. The lower end of the temperature-changing rod 7 is connected to the support member, and the heat sink 3 is located above the bottom ring 5. The bottom ring 5 serves as a support base and is positioned below the heat dissipation port 2. The support member includes a central liner 6.1 disposed in the middle of the bottom ring 5 and a bushing 6.2 for connecting the central liner 6.1 and the inner wall of the bottom ring 5. The central liner 6.1 provides support, and the bushing 6.2 prevents the support member from obstructing the heat dissipation port 2, reducing the impact on heat dissipation.

[0038] Furthermore, the temperature-changing rod 7 is vertically positioned and coaxially aligned with the heat dissipation top plate 3.2 and the heat dissipation port 2. The heat dissipation holes 3.3 are distributed circumferentially according to the temperature-changing rod 7, ensuring uniform heat dissipation.

[0039] Example 2, as Figures 1 to 7 As shown, based on Embodiment 1, the heat dissipation device is further optimized. A handle 8 is rotatably mounted on the device body 1, and a magnetic plate 9 is mounted on the handle 8. A magnetic sheet 10 is mounted on the heat dissipation top plate, with the magnetic plate 9 positioned above the magnetic sheet 10. When the handle 8 is rotated above the device body 1, the magnetic plate 9 is positioned above the magnetic sheet 10, causing the heat dissipation fins 3 to unfold upwards, gradually exposing the heat dissipation vent 2 and accelerating heat dissipation. As the heat dissipation top plate gradually approaches the magnetic plate 9, it is attracted by the magnetic plate 9, thus stabilizing the upward extension of the heat dissipation fins 3 and ensuring continuous heat dissipation from the heat dissipation vent 2.

[0040] The present invention has the following beneficial effects: (1) By setting up the stacked heat sink 3, the temperature gradually increases as the device body 1 runs, and the heat sink 2 gradually becomes exposed, which greatly increases the heat exchange area inside and outside the device body 1, effectively accelerates heat dissipation, and effectively avoids the accumulation of heat inside the device body 1, which greatly reduces the impact of overheating on the stability and accuracy of the device body 1 during testing, and at the same time effectively reduces the safety hazards caused by overheating to the circuit; (2) By setting up the self-expanding net, a conical net can be spontaneously formed on the inner side of the stacked heat sink 3 after the stacked heat sink 3 is extended, which can block the gap formed by the extension of two adjacent stacked rings, effectively preventing external debris from entering the device body 1 along the gap, and effectively preventing damage to the electrical components inside the device body 1.

[0041] The specific embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the invention. All equivalent variations made in accordance with the shape and structure of the present invention should be included within the scope of protection of the present invention.

Claims

1. A microcomputer-based protection testing device, characterized in that, include: The device body has a heat dissipation vent at its upper end; The heat dissipation device includes multiple heat dissipation rings stacked above the heat dissipation vents and a connecting rope connecting two adjacent heat dissipation rings; the heat dissipation rings are coaxially arranged, the outer diameter of the heat dissipation rings increases from top to bottom, and the heat dissipation rings are provided with mounting grooves, with any one heat dissipation ring located in the mounting groove of the heat dissipation ring below it; the heat dissipation rings are provided with heat dissipation holes. The driving device includes a support component disposed inside the heat dissipation vent and a temperature-changing rod disposed above the support component. The upper end of the temperature-changing rod is connected to the heat dissipation ring located at the top of the heat dissipation device. The temperature-changing rod drives the heat dissipation ring to move upwards sequentially from top to bottom. When the temperature-changing rod is above the critical temperature, it gradually elongates, causing the stacked heat dissipation rings to extend upwards and separate from each other, accelerating the exhaust of internal hot air.

2. The microcomputer protection testing device according to claim 1, characterized in that, The heat dissipation vent connects the inside and outside of the device body.

3. The microcomputer protection testing device according to claim 1, characterized in that, The outer diameter of any heat dissipation ring is larger than the inner diameter of the heat dissipation ring below it.

4. The microcomputer protection testing device according to claim 1, characterized in that, The heat dissipation ring located at the bottom of the heat dissipation device is matched with the heat dissipation vent.

5. A microcomputer protection testing device according to claim 1, 2, or 3, characterized in that, The support assembly includes a bottom pad ring disposed on the device body and a support member disposed inside the bottom pad ring. The bottom pad ring is located below the heat dissipation port, the lower end of the temperature-changing rod is connected to the support member, and the heat dissipation ring is located above the bottom pad ring.

6. The microcomputer protection testing device according to claim 5, characterized in that, The support includes a central liner plate disposed in the middle of the bottom pad ring and a liner rod for connecting the central liner plate and the inner wall of the bottom pad ring.

7. The microcomputer protection testing device according to claim 1, characterized in that, The device body is provided with a handle that rotates, and the handle is provided with a magnetic plate. The heat dissipation ring at the top of the heat dissipation device is provided with a magnetic plate, and the magnetic plate is located above the magnetic plate.

8. A microcomputer protection testing device according to claim 1, 2, or 3, characterized in that, The temperature-changing rod is set vertically and is coaxial with the heat dissipation ring at the top of the heat dissipation device. The temperature-changing rod is also coaxial with the heat dissipation port, and the heat dissipation holes are distributed circumferentially according to the temperature-changing rod.

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