A PM display panel motherboard, a PM display panel and a preparation method

Abstract

The application discloses a PM display panel mother board, a PM display panel and a preparation method. The PM display panel mother board comprises a plurality of display panels; the display panel comprises a display area and a non-display area, and the non-display area is arranged around the display area; the PM display panel mother board further comprises a cutting area, and the cutting area is located between adjacent display panels; the display area is provided with a power supply circuit; in a first direction, the non-display areas on both sides of the display area are stacked and provided with the power supply circuit, an insulating isolation layer and a lead-out circuit; in a second direction, the display area is provided with the lead-out circuit on a side extending to the outside of the edge away from the power supply circuit; the cutting area is provided with a common power supply terminal, and the lead-out circuit is connected to the corresponding common power supply terminal. The technical scheme of the embodiment of the application can realize separate lighting test and bad screening of each small piece of display panel on a large-area mother board, and the operation is more convenient.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a PM display panel motherboard, a PM display panel, and a method for its fabrication. Background Technology

[0002] Organic light-emitting diodes (OLEDs) can be divided into active matrix (AM) and passive matrix (PM) types based on their driving methods. PMOLEDs are mainly display devices formed by combining and encapsulating a glass substrate with cathode and anode light-emitting materials and a glass encapsulation cover.

[0003] PMOLED displays are primarily small to medium-sized devices. Due to the limitations of materials and manufacturing processes, both the finished screen and module require aging tests to improve the stability of the product for end users. However, current technologies for illuminating finished screens mainly involve using probes, conductive adhesive strips, or aluminum plating followed by removal. These methods increase labor and auxiliary material / fixture costs and indirectly lead to unavoidable defects during the manufacturing process. Furthermore, for numerous small display panels arranged on a single large-area motherboard, current technology cannot perform illumination, aging tests, and defect screening on each small display panel without cutting. Summary of the Invention

[0004] This invention provides a PM display panel motherboard, a PM display panel, and a manufacturing method, so as to enable individual lighting tests and defect screening of each small display panel before cutting a large area motherboard, making the operation more convenient and less likely to cause unavoidable defects during the manufacturing process.

[0005] According to one aspect of the present invention, a PM display panel motherboard is provided, the PM display panel motherboard including a plurality of display panels; each display panel including a display area and a non-display area, the non-display area being disposed around the display area; the PM display panel motherboard further including a cutting area, the cutting area being located between adjacent display panels;

[0006] The display area is provided with power lines, and the power lines extend to the outside of part of the edge of the display area for transmitting electrical signals to each pixel to make the pixel light up.

[0007] In a first direction, the power lines, insulating layers, and lead-out lines are stacked on the non-display areas on both sides of the display area. The insulating layers are used to insulate the power lines from the lead-out lines. One end of each lead-out line is electrically connected to the edge of the power lines arranged along the first direction in the display area. In a second direction, the lead-out lines are provided on the side of the display area extending away from the power lines to the outside of the edge. One end of each lead-out line is electrically connected to the edge of the power lines arranged along the second direction in the display area. The first direction is perpendicular to the second direction.

[0008] A common power terminal is provided on both sides of the cutting area along the first direction and on the side of the second direction that extends away from the power line to the outside edge. The lead-out lines extend away from the display area and are connected to the corresponding common power terminal. The common power terminal is used to connect to external electrodes to perform a lighting test on each display panel.

[0009] Optionally, the display panel further includes: a packaged sheet;

[0010] The encapsulation sheet includes multiple openings, each of which exposes a common power terminal; the openings are used to electrically connect external electrodes to the common power terminal to perform a lighting test on the display panel.

[0011] Optionally, the power supply line includes a first power supply line and a second power supply line;

[0012] The first power line extends along the first direction to the outer edges of both sides of the display area, and the second power line extends along the second direction to the outer edge of one side of the display area.

[0013] Optionally, the first power line is a cathode line and the second power line is an anode line;

[0014] Alternatively, the first power line may be an anode line, and the second power line may be a cathode line.

[0015] Optionally, the lead-out line includes a first lead-out line and a second lead-out line, and the common power terminal includes a first common power terminal and a second common power terminal; wherein, the first common power terminal is disposed on the outer side of both sides of the cutting area along the first direction, and the second common power terminal is disposed on the side of the cutting area that extends away from the power line to the outer edge in the second direction.

[0016] One end of the first lead-out wire is electrically connected to the first power line, and the other end is electrically connected to the first common power terminal; one end of the second lead-out wire is electrically connected to the second power line, and the other end is electrically connected to the second common power terminal.

[0017] Optionally, the first lead-out trace includes multiple first sub-lead-out traces and multiple second sub-lead-out traces, and the first common power terminal includes a first sub-common power terminal and a second sub-common power terminal.

[0018] Multiple first sub-leads are electrically connected to the first sub-common power terminal, and multiple second sub-leads are electrically connected to the second sub-common power terminal; the first sub-leads and the second sub-leads are alternately connected to the pixel rows arranged in parallel along the second direction.

[0019] Optionally, the external electrode includes a probe and / or a conductive adhesive strip.

[0020] According to another aspect of the present invention, a PM display panel is provided, comprising a display panel obtained by cutting a PM display panel motherboard as described in any embodiment of the first aspect.

[0021] According to another aspect of the present invention, a method for manufacturing a PM display panel is also provided, comprising:

[0022] A motherboard is provided; wherein the motherboard includes multiple display areas, multiple non-display areas, and a cutting area, each of the non-display areas being arranged around each of the display areas, and the cutting area being located between adjacent non-display areas; each display area is provided with a power line, and the power line extends to a portion of the outer edge of the display area for transmitting electrical signals to each pixel to illuminate the pixel; in a first direction, the non-display areas on both sides of the display area are stacked with the power line, an insulating layer, and lead-out lines, the insulating layer being used to insulate the power line from the lead-out lines; one end of each lead-out line is connected to the edge of the power line arranged along the first direction in the display area. Electrical connection; in the second direction, the display area is provided with a lead-out line on the side extending away from the power line to the outside edge, and one end of the lead-out line is electrically connected to the edge of the power line arranged along the second direction in the display area; wherein, the first direction is perpendicular to the second direction; common power terminals are provided on both sides of the cutting area along the first direction and on the side extending away from the power line to the outside edge in the second direction, and the lead-out lines extend away from the display area respectively and are connected to the corresponding common power terminals; the common power terminals are used to connect to external electrodes to perform lighting tests on each display panel;

[0023] A packaging sheet is used to encapsulate each of the display areas, each of the non-display areas, and the cutting area on the motherboard to form a PM display panel motherboard; wherein, the packaging sheet includes multiple openings;

[0024] The PM display panel motherboard is cut along the edge of the cutting area to form the PM display panel.

[0025] Optionally, the method for preparing the package includes:

[0026] The front side of the package is exposed and etched to obtain the formed package.

[0027] The back of the package is exposed and etched again at the position corresponding to the opening to form the through opening.

[0028] The PM display panel motherboard provided by this invention includes multiple display panels, with a cutting area between adjacent display panels. Power lines connecting each pixel in the display area of ​​the display panel extend from a portion of the edge. In a first direction, power lines, an insulating layer, and lead-out lines are stacked in the non-display areas on both sides of the display area; the insulating layer ensures insulation between the lead-out lines and the power lines in the overlapping area. Lead-out lines extend outward from the edge of the display area away from the power lines in a second direction. The lead-out lines extend from the corresponding edge of the display area to a common power terminal provided in the cutting area, allowing for individual lighting tests of each display panel before cutting the PM display panel motherboard. This also makes operation more convenient and effectively avoids defects caused by operation during the manufacturing process.

[0029] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a PM display panel motherboard according to an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the structure of a display panel according to an embodiment of the present invention;

[0033] Figure 3This is a schematic diagram of the structure of another display panel provided according to an embodiment of the present invention;

[0034] Figure 4 This is a schematic diagram of a display panel with a portion of its area illuminated, according to an embodiment of the present invention.

[0035] Figure 5 This is a schematic diagram of the structure of a PM display panel according to an embodiment of the present invention;

[0036] Figure 6 This is a schematic flowchart of a PM display panel manufacturing method according to an embodiment of the present invention;

[0037] Figure 7 This is a schematic diagram of the structure corresponding to each step in a PM display panel manufacturing method provided by an embodiment of the present invention. Detailed Implementation

[0038] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0040] This invention provides a PM display panel motherboard. Figure 1 This is a schematic diagram of the structure of a PM display panel motherboard provided in an embodiment of the present invention. The PM display panel motherboard 10 includes a plurality of display panels 20; each display panel 20 includes a display area 21 and a non-display area 22, the non-display area 22 being arranged around the display area 21; the PM display panel motherboard 10 also includes a cutting area 30, the cutting area 30 being located between adjacent display panels 20.

[0041] For example, when preparing the PM display panel motherboard 10, numerous small display panels 20 arranged in an array on the PM display panel motherboard 10 can be obtained simultaneously. A cutting area 30 is provided between two adjacent display panels 20. After cutting the PM display panel motherboard 10 along the cutting area 30, individual small display panels 20 can be obtained and applied to the corresponding display device.

[0042] For each small display panel 20, Figure 2 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention. See also: Figure 2 The display panel 20 is provided with a display area 21 and a non-display area 22. The display area 21 is provided with a power line 40, which extends to a portion of the outer edge of the display area 21 for transmitting electrical signals to each pixel to illuminate the pixel. The non-display area 22 serves as the frame of the display panel 20 and is used to route the power lines 40 connecting the pixels in the display area 21. Furthermore, the display panel 20 is also provided with a bonding area 23, which can be positioned adjacent to any side of the non-display area 22. For example, Figure 2 The diagram shows the bonding area 23 located on one side below the non-display area 22. The power lines 40 in the non-display area 22 are connected to each pixel in the display area 21 and extend to the bonding area 23, so that each pixel can be electrically connected to an external power source through the bonding area 23, thereby enabling an external control signal to control the pixels of the display area 21 to emit light.

[0043] Optionally, in the first direction, power lines 40, insulating layers 41, and lead-out lines 42 are stacked on the non-display areas 22 on both sides of the display area 21. The insulating layers 41 are used to insulate the power lines 40 from the lead-out lines 42. One end of each lead-out line 42 is electrically connected to the edge of the power lines 40 arranged in the display area 21 along the first direction. In the second direction, a lead-out line 42 is provided on the side of the display area 21 that extends away from the power lines 40 to the outside of the edge. One end of the lead-out line 42 is electrically connected to the edge of the power lines 40 arranged in the display area 21 along the second direction. The first direction is perpendicular to the second direction.

[0044] Common power terminals 43 are provided on both sides of the cutting area 30 along the first direction and on the side of the second direction that extends away from the power line 40 to the outside edge. Lead-out lines 42 extend away from the display area 21 and are connected to the corresponding common power terminals 43. The common power terminals 43 are used to connect to external electrodes to perform lighting tests on each display panel 20.

[0045] For example, see Figure 2The first direction can be along the X-axis in a Cartesian coordinate system, and the second direction can be along the Y-axis in a Cartesian coordinate system. In the second direction, the power lines 40 connecting each pixel extend from the edge of the display area 21 near the bonding area 23 to the bonding area 23. In the first direction, the power lines 40 extending from both sides of the display area 21 to the bonding area 23 can be connected to different pixel rows arranged along the second direction, so as to overcome the limitation of the display panel 20 being fully lit during defect screening, which is beneficial to improving the accuracy of lighting test and defect screening.

[0046] To facilitate individual lighting tests on each display panel 20 before cutting the PM display panel motherboard 10, the power lines 40 connecting each pixel in the display area 21 can be led out to a common power terminal 43 outside the display panel 20 via lead-out lines 42 provided on the upper layer. Compared to the prior art where external electrodes such as conductive adhesive strips are directly connected to each power line 40 sequentially, this embodiment connects the external electrodes to the common power terminal 43, making operation more convenient. This allows the external power supply to be connected to the common power terminal 43, and then connected to each pixel via lead-out lines 42, enabling external power supply control of pixel lighting for lighting tests. For example, see... Figure 2 The lead-out line 42 can be led out from both sides of the display area 21 in the first direction and from the side opposite to the bonding area 23 to the common power terminal 43. Since the power line 40 and the lead-out line 42 overlap on both sides of the display area 21 in the first direction, an insulating layer 41 is provided between the stacked power line 40 and the lead-out line 42 to prevent short circuit between the lead-out line 42 and the power line 40 during lighting tests. Exemplarily, the insulating layer 41 can be made of polyimide (PI), and there is no limitation thereto.

[0047] The PM display panel motherboard 10 provided in this embodiment includes multiple display panels 20, with a cutting area 30 disposed between adjacent display panels 20. Power lines 40 connecting each pixel in the display area 21 of the display panel 20 extend from a portion of the edge. In a first direction, power lines 40, an insulating layer 41, and lead-out lines 42 are stacked on the non-display areas 22 on both sides of the display area 21; wherein, the insulating layer 41 ensures that the lead-out lines 42 and the power lines 40 remain insulated in the overlapping area; in a second direction, lead-out lines 42 extend outward from the edge of the display area 21 away from the power lines 40. The lead-out lines 42 extend from the corresponding edge of the display area 21 to a common power terminal 43 disposed in the cutting area 30, thereby allowing individual lighting tests of each display panel 20 before cutting the PM display panel motherboard 10. This also makes operation more convenient and effectively avoids defects caused by operation during the manufacturing process.

[0048] Optionally, Figure 3This is a schematic diagram of another display panel provided in an embodiment of the present invention. Based on the above embodiments, as follows... Figure 3 As shown, the display panel 20 also includes a package sheet 50.

[0049] The package 50 includes multiple openings 51, each opening 51 exposing a common power terminal 43; the openings 51 are used to electrically connect external electrodes to the common power terminal 43 to perform a lighting test on the display panel 20.

[0050] Specifically, each display panel 20 on the PM display panel motherboard 10 is encapsulated using a packaging sheet 50, which encapsulates the display panel 20 and the surrounding cutting area 30. For example, the packaging sheet 50 can be a transparent glass cover, allowing the display area 21 of the display panel 20 to be displayed normally through the packaging sheet 50. To perform a lighting test on each display panel 20 before cutting the PM display panel motherboard 10, the surface of the packaging sheet 50 has multiple through openings 51 to expose the common power terminal 43 located in the cutting area 30. Therefore, external electrodes can be electrically connected to the common power terminal 43 through the openings 51 on the packaging sheet 50, thereby inputting electrical signals to the power lines 40 connected to each pixel in the display panel 20 to control the corresponding pixel to emit light.

[0051] After completing the lighting test and defect screening of each display panel 20, the PM display panel motherboard 10 can be cut along the cutting area 30 to obtain individual small display panels 20. Since the common power terminal 43 and the lead-out lines 42 extending beyond the display panel 20 are cut off as scrap along the cutting area 30, the remaining display panels 20 will not experience short circuits. There is no need to remove the lead-out lines 42 through additional processes, and the packaging effect of the display panels 20 will not be affected.

[0052] Optionally, based on the above embodiments, see below. Figure 2 The power supply line 40 includes a first power supply line 401 and a second power supply line 402.

[0053] The first power line 401 extends along the first direction to the outer edges of both sides of the display area 21, and the second power line 402 extends along the second direction to the outer edge of one side of the display area 21.

[0054] Specifically, the PM display panel forms pixels by cross-arranged strip electrodes of cathode and anode. A first power line 401 extends along a first direction, and a second power line 402 extends along a second direction. The cross-arranged first power line 401 and second power line 402 are respectively connected to corresponding electrodes. For example, the first power line 401 is a cathode trace, and the second power line 402 is an anode trace; or, the first power line 401 is an anode trace, and the second power line 402 is a cathode trace; this is not limited to any particular type. Figure 2 As shown, in this embodiment, the first power line 401 is used as the cathode trace and the second power line 402 is used as the anode trace for illustration.

[0055] Alternatively, based on the above embodiments, see [link to relevant documentation]. Figure 2 The lead-out line 42 includes a first lead-out line 421 and a second lead-out line 422, and the common power terminal 43 includes a first common power terminal 431 and a second common power terminal 432; wherein, the first common power terminal 431 is disposed on the outer side of both sides of the cutting area 30 along the first direction, and the second common power terminal 432 is disposed on the side of the cutting area 30 extending away from the power line 40 to the outer edge in the second direction.

[0056] One end of the first lead-out line 421 is electrically connected to the first power line 401, and the other end is electrically connected to the first common power terminal 431; one end of the second lead-out line 422 is electrically connected to the second power line 402, and the other end is electrically connected to the second common power terminal 432.

[0057] For example, in this embodiment, the first lead-out line 421 is a cathode lead-out line, the second lead-out line 422 is an anode lead-out line, the first common power terminal 431 is a cathode common power terminal, and the second common power terminal 432 is an anode common power terminal. One end of the first lead-out line 421 is electrically connected to the edge of the first power line 401 in the display area 21, and the other end is electrically connected to the first common power terminal 431 in the cutting area 30; one end of the second lead-out line 422 is electrically connected to the edge of the second power line 402 in the display area 21, and the other end is electrically connected to the second common power terminal 432 in the cutting area 30. In other words, each small display panel 20 on the PM display panel motherboard 10 has its own power terminal, instead of all display panels 20 connected to the same power terminal. This allows each display panel 20 to be controlled to emit light individually when the display panel 20 is tested before the PM display panel motherboard 10 is cut. This avoids the situation where a short circuit in a single display panel 20 would cause the entire row of display panels 20 to fail to light up, thus improving test accuracy.

[0058] Optionally, based on the above embodiments, see below. Figure 2The first lead-out trace 421 includes multiple first sub-lead-out traces 4211 and multiple second sub-lead-out traces 4212, and the first common power terminal 431 includes a first sub-common power terminal 4311 and a second sub-common power terminal 4312.

[0059] Multiple first sub-leads 4211 are electrically connected to the first sub-common power terminal 4311, and multiple second sub-leads 4212 are electrically connected to the second sub-common power terminal 4312; the first sub-leads 4211 and the second sub-leads 4212 are alternately connected to each pixel row arranged in parallel along the second direction.

[0060] Specifically, in the first direction, first lead-out traces 421 and first power lines 401 are provided on both sides of the display area 21. The first power line 401 on each side connects to different pixel rows arranged parallel to each other in the second direction, controlling the simultaneous illumination of different pixel rows. The first lead-out traces 421 are connected to the corresponding first power lines 401, allowing control of a portion of the display panel 20 to be illuminated during illumination testing, thus facilitating defect screening. For example, Figure 4 This is a schematic diagram illustrating a partial illuminated area of ​​a display panel according to an embodiment of the present invention. See also... Figure 4 It shows that the first sub-leads 4211 and the second sub-leads 4212 on both sides of the display area 21 are connected to the corresponding first power lines 401 in a row. In the second direction, the second lead 422 on the side of the display area 21 away from the bonding area 23 is connected to the edge of each second power line 402 in the display area 21 in sequence. Therefore, the display panel 20 will show a row of pixels lit up.

[0061] For example, with Figure 4Taking the interlaced connection of the lead-out traces and power lines as an example, the first power lines 401 of the first, third, and fifth pixel rows of the display area 21 are all led out by the first sub-lead-out trace 4211 and connected to the first sub-common terminal 4311; the first power lines 401 of the second, fourth, and sixth pixel rows of the display area 21 are all led out by the second sub-lead-out trace 4212 and connected to the second sub-common terminal 4312. During illumination testing and defect screening, when the external electrode outputs an electrical signal to the first sub-common terminal 4311, the first, third, and fifth rows of pixels in the display area 21 are controlled to illuminate simultaneously, while the second, fourth, and sixth rows of pixels remain off. When the external electrode outputs an electrical signal to the second sub-common terminal 4312, the second, fourth, and sixth rows of pixels in the display area 21 are controlled to illuminate simultaneously, while the first, third, and fifth rows of pixels remain off. This results in two different interlaced display images, facilitating defect screening of the display panel 20. Exemplarily, the external electrode includes probes and / or conductive adhesive strips. By placing the probes or conductive adhesive strips at the corresponding fixture ends and connecting them to the common power terminals 43 distributed outside the edges of the display area 21, individual illumination of each display panel 20 within the PM display panel motherboard 10 can be achieved, while preventing cracking of the cured encapsulant due to external force during connection of the external electrodes.

[0062] This invention also provides a PM display panel. Figure 5 This is a schematic diagram of the structure of a PM display panel provided in an embodiment of the present invention. Figure 5 As shown, the PM display panel 02 includes a display panel obtained by cutting the PM display panel motherboard described in any of the above embodiments. After cutting off the excess common power terminals and lead-out lines in the cutting area, the PM display panel 02 can prevent the lead-out lines from causing short circuits without affecting the packaging effect of the PM display panel 02.

[0063] This invention also provides a method for preparing a PM display panel. Figure 6 This is a schematic flowchart of a PM display panel manufacturing method provided in an embodiment of the present invention. Figure 7 This is a schematic diagram of the structure corresponding to each step in a PM display panel fabrication method provided in an embodiment of the present invention. See also Figure 6 and Figure 7 The method for manufacturing the PM display panel includes:

[0064] S110. A motherboard 01 is provided; wherein the motherboard 01 includes multiple display areas 21, multiple non-display areas 22, and a cutting area 30, each non-display area 22 is arranged around each display area 21, and the cutting area 30 is located between adjacent non-display areas 22; the display areas 21 are provided with power lines, and the power lines extend to part of the outer edge of the display areas 21 for transmitting electrical signals to each pixel to make the pixel light up; in a first direction, the non-display areas 22 on both sides of the display areas 21 are stacked with power lines, an insulating layer, and lead-out lines, and the insulating layer is used to insulate the power lines from the lead-out lines; one end of each lead-out line is connected to the edge of the display area 21. The power lines arranged in the first direction are electrically connected to the edge; in the second direction, a lead-out line is provided on the side of the display area 21 that extends away from the power lines to the outside of the edge, and one end of the lead-out line is electrically connected to the edge of the power lines arranged in the second direction in the display area 21; wherein, the first direction is perpendicular to the second direction; common power terminals are provided on both sides of the cutting area 30 along the first direction and on the side of the second direction that extends away from the power lines to the outside of the edge, and the lead-out lines extend to the side away from the display area 21 respectively and are connected to the corresponding common power terminals; the common power terminals are used to connect to external electrodes to perform lighting tests on each display panel.

[0065] Specifically, numerous display areas, non-display areas, and cutting areas can be simultaneously prepared on a large-area motherboard to form multiple small display panels.

[0066] S120. On the motherboard 01, each display area 21, each non-display area 22 and the cutting area 30 are encapsulated using an encapsulation sheet 50 to form a PM display panel motherboard 10; wherein, the encapsulation sheet 50 includes multiple openings 51.

[0067] Specifically, each small display panel is encapsulated, and the common power terminals of the display panels are exposed through various openings to form a PM display panel motherboard, so as to perform lighting tests and defect screening on each display panel before cutting the PM display panels.

[0068] S130. The PM display panel motherboard 10 is cut along the edge of the cutting area to form the PM display panel 02.

[0069] Specifically, after the test, the excess common power terminals and some lead-out traces are cut off along the cutting area to obtain the PM display panel finished product. This can prevent the set lead-out traces from causing short circuits in the display panel without affecting the packaging effect.

[0070] The PM display panel manufacturing method provided in this invention embodiment can perform individual lighting tests and defect screening on each display panel before cutting the PM display panel motherboard. After the test, the excess common power terminals and some lead-out lines set in the cutting area are cut off as scrap material to obtain the finished PM display panel. This method does not affect the packaging effect of the display panel and can also prevent the display panel from short-circuiting due to the lead-out lines.

[0071] Optionally, based on the above embodiments, the method for preparing the packaged wafer includes:

[0072] S101. Exposure and etching are performed on the front side of the package to obtain the formed package.

[0073] Specifically, for the front side of the glass cover plate used as a packaging sheet, certain grooves are etched at the corresponding positions through exposure and development processes to obtain a shaped packaging sheet that meets the packaging function.

[0074] S102. Exposure and etching are performed again on the back of the package at the position corresponding to the opening to form a through opening.

[0075] Specifically, to expose the common power terminals in the cutting area, etching is performed at specific locations on the back of the package using exposure and development processes, thereby creating openings that penetrate the package at those locations. Each opening corresponds to a common power terminal, allowing external electrodes to be electrically connected to the common power terminals through these openings.

[0076] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A PM display panel motherboard, characterized in that, The PM display panel motherboard includes multiple display panels; each display panel includes a display area and a non-display area, the non-display area being arranged around the display area; the PM display panel motherboard also includes a cutting area, the cutting area being located between adjacent display panels; The display area is provided with power lines, and the power lines extend to the outside of part of the edge of the display area for transmitting electrical signals to each pixel to make the pixel light up. In a first direction, the power lines, insulating layers, and lead-out lines are stacked on the non-display areas on both sides of the display area. The insulating layers are used to insulate the power lines from the lead-out lines. One end of each lead-out line is electrically connected to the edge of the power lines arranged along the first direction in the display area. In a second direction, the lead-out lines are provided on the side of the display area extending away from the power lines to the outside of the edge. One end of each lead-out line is electrically connected to the edge of the power lines arranged along the second direction in the display area. The first direction is perpendicular to the second direction. A common power terminal is provided on both sides of the cutting area along the first direction and on the side of the second direction that extends away from the power line to the outside edge. The lead-out lines extend away from the display area and are connected to the corresponding common power terminal. The common power terminal is used to connect to external electrodes to perform a lighting test on each display panel.

2. The PM display panel motherboard according to claim 1, characterized in that, The display panel further includes: a packaged sheet; The encapsulation sheet includes multiple openings, each of which exposes a common power terminal; the openings are used to electrically connect external electrodes to the common power terminal to perform a lighting test on the display panel.

3. The PM display panel motherboard according to claim 1, characterized in that, The power supply line includes a first power supply line and a second power supply line. The first power line extends along the first direction to the outer edges of both sides of the display area, and the second power line extends along the second direction to the outer edge of one side of the display area.

4. The PM display panel motherboard according to claim 3, characterized in that, The first power line is a cathode line, and the second power line is an anode line; Alternatively, the first power line may be an anode line, and the second power line may be a cathode line.

5. The PM display panel motherboard according to claim 4, characterized in that, The lead-out lines include a first lead-out line and a second lead-out line, and the common power terminal includes a first common power terminal and a second common power terminal; wherein, the first common power terminal is disposed on the outer side of both sides of the cutting area along the first direction, and the second common power terminal is disposed on the side of the cutting area extending away from the power line to the outer edge in the second direction. One end of the first lead-out wire is electrically connected to the first power line, and the other end is electrically connected to the first common power terminal; one end of the second lead-out wire is electrically connected to the second power line, and the other end is electrically connected to the second common power terminal.

6. The PM display panel motherboard according to claim 5, characterized in that, The first lead-out trace includes multiple first sub-lead-out traces and multiple second sub-lead-out traces, and the first common power terminal includes a first sub-common power terminal and a second sub-common power terminal. Multiple first sub-leads are electrically connected to the first sub-common power terminal, and multiple second sub-leads are electrically connected to the second sub-common power terminal; the first sub-leads and the second sub-leads are alternately connected to the pixel rows arranged in parallel along the second direction.

7. The PM display panel motherboard according to claim 2, characterized in that, The external electrode includes a probe and / or a conductive adhesive strip.

8. A PM display panel, characterized in that, The display panel includes a display panel obtained by cutting the PM display panel motherboard as described in any one of claims 1-7.

9. A method for manufacturing a PM display panel, characterized in that, include: A motherboard is provided; wherein the motherboard includes multiple display areas, multiple non-display areas, and a cutting area, each of the non-display areas being arranged around each of the display areas, and the cutting area being located between adjacent non-display areas; each display area is provided with a power line, and the power line extends to a portion of the outer edge of the display area for transmitting electrical signals to each pixel to illuminate the pixel; in a first direction, the non-display areas on both sides of the display area are stacked with the power line, an insulating layer, and lead-out lines, the insulating layer being used to insulate the power line from the lead-out lines; one end of each lead-out line is connected to the edge of the power line arranged along the first direction in the display area. Electrical connection; in the second direction, the display area is provided with a lead-out line on the side extending away from the power line to the outside edge, and one end of the lead-out line is electrically connected to the edge of the power line arranged along the second direction in the display area; wherein, the first direction is perpendicular to the second direction; common power terminals are provided on both sides of the cutting area along the first direction and on the side extending away from the power line to the outside edge in the second direction, and the lead-out lines extend away from the display area respectively and are connected to the corresponding common power terminals; the common power terminals are used to connect to external electrodes to perform lighting tests on each display panel; A packaging sheet is used to encapsulate each of the display areas, each of the non-display areas, and the cutting area on the motherboard to form a PM display panel motherboard; wherein, the packaging sheet includes multiple openings; The PM display panel motherboard is cut along the edge of the cutting area to form the PM display panel.

10. The method for manufacturing a PM display panel according to claim 9, characterized in that, The method for preparing the packaged wafer includes: The front side of the package is exposed and etched to obtain the formed package. The back of the package is exposed and etched again at the position corresponding to the opening to form the through opening.

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