Micro-display chip detection system, detection method, device and equipment and storage medium

Abstract

The application provides a micro display chip detection system, a detection method, a device, equipment and a storage medium; the micro display chip detection system comprises a chip bearing and displacement mechanism and a chip positioning and detection mechanism; the chip positioning and detection mechanism is arranged above the chip bearing and displacement mechanism; the chip bearing and displacement mechanism comprises a chip carrier for placing and fixing a chip, an R-direction adjusting table connected below the chip carrier, an XY-direction fine adjustment mechanism connected below the R-direction adjusting table, a Z-direction electric displacement table connected below the XY-direction fine adjustment mechanism and a Y-direction electric displacement table connected below the Z-direction electric displacement table; the chip positioning and detection mechanism comprises a positioning camera, a distance measuring sensor, a detection needle card, a detection camera and an X-direction electric displacement table. The application can improve the detection efficiency of the micro display chip and reduce the risk of damaging the wafer by manual operation.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing equipment technology, and in particular to a microdisplay chip testing system, testing method, apparatus, equipment and storage medium. Background Technology

[0002] Before packaging, microdisplay chips need to undergo electrical and optical performance testing to screen out defective products and package only qualified ones, thereby saving packaging costs. Currently, the testing of microdisplay chips involves placing the entire undivided wafer on a testing mechanism and then testing each individual microdisplay chip. Existing testing methods cannot perform individual testing or sampling testing of each microdisplay chip formed after wafer dicing.

[0003] Current technologies primarily employ purely manual inspection stages for testing individual microdisplay chips. These stages are time-consuming, costly, inefficient, and unstable. Furthermore, due to the purely manual operation, there is a risk of wafer damage during the inspection process due to improper handling. Summary of the Invention

[0004] To address at least one technical problem in the prior art, embodiments of the present invention provide a microdisplay chip inspection system, inspection method, apparatus, device, and storage medium to improve the inspection efficiency of microdisplay chips and reduce the risk of wafer damage from manual operation. To achieve the above technical objectives, the technical solution adopted by embodiments of the present invention is as follows:

[0005] In a first aspect, embodiments of the present invention provide a microdisplay chip detection system, comprising: a chip carrying and displacement mechanism, and a chip positioning and detection mechanism; the chip positioning and detection mechanism is disposed above the chip carrying and displacement mechanism;

[0006] The chip support and displacement mechanism includes:

[0007] Chip carrier, used to place and hold chips;

[0008] The R-axis adjustment platform is connected below the chip carrier and is used to adjust the R-axis angle of the chip placed on the chip carrier.

[0009] The XY-axis fine-tuning mechanism is connected below the R-axis adjustment stage and is used to fine-tune the position of the chip placed on the chip carrier in the X and / or Y directions.

[0010] The Z-axis electric displacement stage is connected below the XY-axis fine-tuning mechanism and is used to drive the chip placed on the chip carrier to move in the Z-axis.

[0011] The Y-axis electric displacement stage is connected below the Z-axis electric displacement stage and is used to drive the chip placed on the chip carrier to move in the Y direction.

[0012] The chip positioning and detection mechanism includes:

[0013] A positioning camera is used to capture images of the chip's location.

[0014] The ranging sensor is used to measure and obtain the chip's Z-axis positioning reference when the chip descends into place;

[0015] The test pin is used to contact the test point on the chip when it rises to the correct position and to provide a test signal to the chip through the test point;

[0016] A testing camera used to capture display images during chip testing;

[0017] An X-axis electric displacement stage is used to install and drive the positioning camera, ranging sensor, detection pin card, and detection camera to move in the X-axis.

[0018] Furthermore, in the Y direction, the detection pin is located within the optical path range of the positioning camera lens.

[0019] Furthermore, the XY-axis fine-tuning mechanism includes an X-axis manual fine-tuning platform and a Y-axis manual fine-tuning platform; the X-axis manual fine-tuning platform is mounted on the Z-axis electric displacement platform lifting block, an intermediate carrier plate is connected above the X-axis manual fine-tuning platform, and the Y-axis manual fine-tuning platform is mounted on the intermediate carrier plate.

[0020] Furthermore, the chip carrier is provided with a chip positioning slot.

[0021] Furthermore, the bottom of the chip positioning slot of the chip carrier is provided with a vacuum adsorption channel.

[0022] Furthermore, the positioning camera is mounted on the first manual displacement stage along the Y direction; the first manual displacement stage is connected to the slider of the X-direction electric displacement stage through a carrier plate.

[0023] Furthermore, the detection camera is mounted on the second manual displacement stage along the Y direction; the second manual displacement stage is connected to the slider of the X-direction electric displacement stage via a carrier plate.

[0024] Furthermore, the detection needle is attached to the lower end of the second manual displacement stage, located below the detection camera lens.

[0025] Secondly, embodiments of the present invention provide a method for detecting microdisplay chips, applicable to the detection system described above, comprising the following steps:

[0026] The calibration steps include:

[0027] Control the Y-axis electric displacement stage and the X-axis electric displacement stage to move to the appropriate positions so that the chip on the chip carrier is located below the test pin card; after the chip is adjusted to the R-axis position by the R-axis adjustment stage and / or fine-tuned to the X-axis and / or Y-axis position by the XY-axis fine-tuning mechanism, drive the Z-axis electric displacement stage to rise to the position so that the test point on the chip contacts the test pin card, thereby lighting up the chip.

[0028] Record the positions of the Y-axis electric displacement stage, the X-axis electric displacement stage, and the Z-axis electric displacement stage at this time as the Y-axis electric displacement stage forward positioning reference, the X-axis electric displacement stage forward positioning reference, and the Z-axis electric displacement stage rising positioning reference, respectively.

[0029] The Z-axis electric displacement stage is controlled to lower the chip into position, and then the positioning camera is controlled to move above the chip.

[0030] Acquire the chip's positioning image and identify the positioning marks in the positioning image;

[0031] Based on the positioning marks, set the chip's X-axis positioning reference and the chip's Y-axis positioning reference;

[0032] Control X to move the electric displacement stage by a preset distance, so that the ranging sensor moves directly above the chip;

[0033] The height data measured by the ranging sensor is used as the Z-axis positioning reference for the chip.

[0034] Control the Y-axis and X-axis electric displacement stages to retract into position;

[0035] The detection steps include:

[0036] After the chip under test is placed on the chip carrier and fixed, the X-axis electric displacement stage and the Y-axis electric displacement stage are controlled to move a fixed distance respectively to transport the chip under test to the area below the positioning camera.

[0037] Acquire the positioning image of the chip under test, identify the positioning marks in the positioning image and obtain the real-time X-axis and Y-axis positions of the chip, and calculate the chip X-axis and / or Y-axis position compensation values ​​based on the real-time X-axis and Y-axis positions of the chip and the chip X-axis positioning position reference and the chip Y-axis positioning position reference.

[0038] The X-axis electric displacement stage is controlled to move a preset distance so that the ranging sensor moves directly above the chip under test. The height data measured by the ranging sensor is obtained as the real-time Z-axis height position of the chip. The Z-axis position compensation value of the chip is calculated based on the real-time Z-axis height position of the chip and the chip Z-axis positioning position reference.

[0039] The X-axis electric displacement stage is moved into position using the X-axis forward positioning reference and the X-axis position compensation value. The Y-axis electric displacement stage is moved into position using the Y-axis forward positioning reference and the Y-axis position compensation value. The detection pin card and detection camera are then transported to the chip under test.

[0040] The Z-axis electric displacement stage is raised to the correct position using the Z-axis position compensation value and the Z-axis position reference, so that the chip under test can contact the detection pin card and light up.

[0041] Acquire the test image of the chip under test.

[0042] Thirdly, embodiments of the present invention provide a detection device for a microdisplay chip, comprising:

[0043] The calibration module includes:

[0044] The first control unit is used to control the Y-axis electric displacement stage and the X-axis electric displacement stage to move to appropriate positions so that the chip on the chip carrier is located below the detection pin card; after the chip is adjusted to the R-axis position by the R-axis adjustment stage and / or fine-tuned to the X-axis and / or Y-axis position by the XY-axis fine-tuning mechanism, the Z-axis electric displacement stage is driven to rise to the position so that the test point on the chip contacts the detection pin card, thereby lighting up the chip;

[0045] The first reference setting unit is used to record the positions of the Y-axis electric displacement stage, the X-axis electric displacement stage and the Z-axis electric displacement stage at this time as the Y-axis electric displacement stage forward positioning reference, the X-axis electric displacement stage forward positioning reference and the Z-axis electric displacement stage rising positioning reference, respectively.

[0046] The second control unit is used to control the Z-axis electric displacement stage to drive the chip down into place, and then control the positioning camera to move above the chip.

[0047] The first image acquisition and recognition unit is used to acquire the positioning image of the chip and recognize the positioning marks in the positioning image;

[0048] The second reference setting unit is used to set the chip X-axis positioning reference and the chip Y-axis positioning reference according to the positioning mark.

[0049] The third control unit is used to control the X-axis electric displacement stage to move by a preset distance, so that the ranging sensor moves to directly above the chip;

[0050] The third reference setting unit is used to acquire the height data measured by the ranging sensor as the chip's Z-axis positioning reference.

[0051] The fourth control unit is used to control the Y-axis electric displacement stage and the X-axis electric displacement stage to retract into place;

[0052] The detection module includes:

[0053] The fifth control unit is used to control the X-axis electric displacement stage and the Y-axis electric displacement stage to move a fixed distance respectively after the chip under test is placed on the chip carrier and fixed, so as to transport the chip under test to the area below the positioning camera.

[0054] The first compensation value calculation unit is used to acquire the positioning image of the chip under test, identify the positioning mark in the positioning image and acquire the real-time X-axis position and Y-axis position of the chip, and calculate the chip X-axis and / or Y-axis position compensation value based on the real-time X-axis and Y-axis positions of the chip and the chip X-axis positioning position reference and the chip Y-axis positioning position reference.

[0055] The second compensation value calculation unit is used to control the X-axis electric displacement stage to move by a preset distance, so that the ranging sensor moves to directly above the chip under test, obtains the height data measured by the ranging sensor as the real-time Z-axis height position of the chip, and calculates the chip Z-axis position compensation value based on the real-time Z-axis height position of the chip and the chip Z-axis positioning position reference.

[0056] The sixth control unit is used to control the X-axis electric displacement stage to move into position based on the X-axis electric displacement stage forward positioning reference and the X-axis position compensation value, and to control the Y-axis electric displacement stage to move into position based on the Y-axis electric displacement stage forward positioning reference and the Y-axis position compensation value, so as to transport the detection pin card and the detection camera to the chip under test.

[0057] The seventh control unit is used to control the Z-axis electric displacement stage to rise to the correct position based on the Z-axis electric displacement stage rising to the correct position and the Z-axis position compensation value, so that the chip under test can contact the test pin card and light up.

[0058] The detection image acquisition unit is used to acquire the detection image of the chip under test.

[0059] Fourthly, embodiments of the present invention provide a detection device for microdisplay chips, comprising:

[0060] Memory, which stores computer programs;

[0061] A processor for running the computer program, which, when running, performs the steps described above.

[0062] Fifthly, embodiments of the present invention provide a storage medium storing a computer program configured to execute the steps described above when running.

[0063] The beneficial effects of the technical solution provided by the embodiments of the present invention are as follows:

[0064] 1. The detection system has a reasonable structure and good flexibility, and can detect individual microdisplay chips after cutting.

[0065] 2. Once calibration is complete, automated control of the subsequent microdisplay chips to be tested is achieved, which greatly reduces the risk of damaging individual microdisplay chips compared to a purely manual test bench.

[0066] 3. High degree of automation, which improves detection efficiency. Attached Figure Description

[0067] Figure 1 This is a schematic diagram of a microdisplay chip detection system in an embodiment of the present invention.

[0068] Figure 2a This is a flowchart of the calibration step in the microdisplay chip detection method according to an embodiment of the present invention.

[0069] Figure 2b This is a flowchart of the detection steps in the microdisplay chip detection method according to an embodiment of the present invention.

[0070] Figure 3 This is a schematic diagram of the detection device for the microdisplay chip in an embodiment of the present invention.

[0071] Figure 4 This is a schematic diagram of the structure of the detection device for the microdisplay chip in an embodiment of the present invention. Detailed Implementation

[0072] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0073] In the description of the embodiments of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0074] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0075] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0076] In the following embodiments, the microdisplay chip is simply referred to as a chip.

[0077] like Figure 1 As shown in the figure, an embodiment of the present invention proposes a micro-display chip detection system, including: a chip carrying and displacement mechanism 100 and a chip positioning and detection mechanism 200; the chip positioning and detection mechanism 200 is disposed above the chip carrying and displacement mechanism 100;

[0078] The chip support and displacement mechanism 100 includes:

[0079] Chip carrier 110, used to place and fix the chip;

[0080] R-axis adjustment stage 120 is connected below chip carrier 110 and is used to adjust the R-axis angle of the chip placed on chip carrier 110.

[0081] The XY fine-tuning mechanism 130 is connected below the R-axis adjustment stage 120 and is used to fine-tune the position of the chip placed on the chip carrier 110 in the X and / or Y directions.

[0082] Z-axis electric displacement stage 140 is connected below XY-axis fine adjustment mechanism 130 and is used to drive the chip placed on chip carrier 110 to move in the Z-axis.

[0083] The Y-axis electric displacement stage 150 is connected below the Z-axis electric displacement stage 140 and is used to drive the chip placed on the chip carrier 110 to move in the Y direction.

[0084] The chip positioning and detection mechanism 200 includes:

[0085] Positioning camera 210 is used to capture positioning images of the chip;

[0086] The ranging sensor 220 is used to measure and obtain the chip's Z-axis positioning reference when the chip descends into place;

[0087] The detection pin card 230 is used to contact the test point on the chip when it rises to the correct position and to provide a test signal to the chip through the test point;

[0088] The inspection camera 240 is used to capture display images during chip testing.

[0089] X-axis electric displacement stage 250 is used to install and drive the positioning camera 210, ranging sensor 220, detection pin card 230 and detection camera 240 to move in the X direction.

[0090] exist Figure 1 In the illustrated embodiment, the left-right direction is the X-axis, the front-back direction is the Y-axis, the up-down direction is the Z-axis, and the horizontal rotation direction of the R-axis adjustment platform 120 is the R-axis. The chip carrying and displacement mechanism 100 and the chip positioning and detection mechanism 200 can be fixed on a base plate 300. The Y-axis electric displacement platform 150 is directly fixed to the base plate 300. The Z-axis electric displacement platform 140 is mounted on the slider of the Y-axis electric displacement platform 150. The XY-axis fine-tuning mechanism 130 is mounted on the lifting block of the Z-axis electric displacement platform 140. The R-axis adjustment platform 120 is mounted above the XY-axis fine-tuning mechanism 130, and the chip carrier 110 is mounted above the R-axis adjustment platform 120. The Y-axis electric displacement platform 150 can drive the Z-axis electric displacement platform 140, the XY-axis fine-tuning mechanism 130, the R-axis adjustment platform 120, and the chip carrier 110 mounted on it to move together in the Y-axis direction. The chip placed on the chip carrier 110 is moved in the Y direction; the Z-axis electric displacement stage 140 can move the XY-axis fine-tuning mechanism 130, the R-axis adjustment stage 120 and the chip carrier 110 together in the Z direction, thereby moving the chip placed on the chip carrier 110 in the Z direction; the XY-axis fine-tuning mechanism 130 can move the R-axis adjustment stage 120 and the chip carrier 110 in the X and / or Y directions, thereby fine-tuning the X and / or Y positions of the chip placed on the chip carrier 110, so that the chip is aligned with the detection needle card 230 in the X and Y directions; the R-axis adjustment stage 120 can move the chip carrier 110 in the R direction, thereby adjusting the R-axis angle of the chip placed on the chip carrier 110, so that the chip is aligned with the detection needle card 230 in the R direction.

[0091] The positioning camera 210, the ranging sensor 220, the detection pin 230, and the detection camera 240 are all mounted on the slider of the X-axis electric displacement stage 250 via the same carrier plate 260; thus, the X-axis electric displacement stage 250 can drive the positioning camera 210, the ranging sensor 220, the detection pin 230, and the detection camera 240 to move simultaneously in the X-axis; the X-axis electric displacement stage 250 is mounted on the bracket 400, and the bracket 400 is fixed on the base plate 300;

[0092] In one embodiment, the Y-axis electric displacement stage 150, Z-axis electric displacement stage 140, and X-axis electric displacement stage 250 are all driven by a controller, and the controller can obtain the position signals fed back by the Y-axis electric displacement stage 150, Z-axis electric displacement stage 140, and X-axis electric displacement stage 250; the controller can be a PLC, industrial computer, etc.; the controllers of the Y-axis electric displacement stage 150, Z-axis electric displacement stage 140, and X-axis electric displacement stage 250 can be set up together or separately but can communicate with each other;

[0093] In one embodiment, the test signal includes a power supply signal and a chip drive signal;

[0094] Specifically, in the Y direction, the detection pin card 230 is located within the optical path of the lens of the positioning camera 210; thus, when the detection pin card 230 is removed from above the descending chip, the positioning camera 210 can be moved to above the chip without needing to readjust the Y-direction electric displacement stage 150.

[0095] Specifically, such as Figure 1 As shown, the XY-axis fine-tuning mechanism 130 includes an X-axis manual fine-tuning stage 131 and a Y-axis manual fine-tuning stage 132. The X-axis manual fine-tuning stage 131 is mounted on the lifting block of the Z-axis electric displacement stage 140, and an intermediate carrier plate 133 is connected above the X-axis manual fine-tuning stage 131. The Y-axis manual fine-tuning stage 132 is mounted on the intermediate carrier plate 133. Both the X-axis manual fine-tuning stage 131 and the Y-axis manual fine-tuning stage 132 can be... Figure 1 The adjustment screw shown is manually adjusted to enable fine-tuning of the position of the R-axis adjustment stage 120 and the chip carrier 110 mounted thereon in the X and / or Y directions.

[0096] Specifically, the chip carrier 110 is provided with a chip positioning slot; after the R-direction angle of the R-direction adjustment stage 120 is adjusted, the R-direction angle of the chip positioning slot can also be determined, ensuring that the R-direction angle of the chip under test can remain consistent every time it is placed in the chip positioning slot of the chip carrier 110.

[0097] Furthermore, the bottom of the chip positioning groove of the chip carrier 110 is provided with a vacuum adsorption channel; the chip can be adsorbed by vacuum to prevent the chip from shifting when the chip carrying and displacement mechanism 100 is in operation;

[0098] Specifically, the positioning camera 210 is mounted on the first manual displacement stage 270 along the Y direction; the first manual displacement stage 270 is connected to the slider of the X-direction electric displacement stage 250 through the carrier plate 260; the positioning camera 210 can be mounted at a suitable height through the first manual displacement stage 270, which facilitates the adjustment of its focal length and depth of field.

[0099] Specifically, the detection camera 240 is mounted on the second manual displacement stage 280 along the Y direction; the second manual displacement stage 280 is connected to the slider of the X-direction electric displacement stage 250 through the carrier plate 260; the detection camera 240 can be mounted at a suitable height through the second manual displacement stage 280, which facilitates the adjustment of its focal length and depth of field.

[0100] Specifically, the detection pin card 230 is connected to the lower end of the second manual displacement stage 280 and is located below the lens of the detection camera 240. When the detection pin card 230 contacts the test point of the chip when it is raised to the correct position and lights up the chip, the detection camera 240 can capture the display image of the chip and send it to the display screen for the operator to observe the display image and judge the optical performance of the chip.

[0101] In one embodiment, the distance between the positioning camera 210 and the ranging sensor 220, and the distance between the ranging sensor 220 and the detection pin card 230 are kept constant;

[0102] Based on the microdisplay chip detection system proposed in the above embodiments, this invention also proposes a method for detecting microdisplay chips, including the following steps:

[0103] For calibration steps, please refer to [link / reference]. Figure 2a ,include:

[0104] In step S110, the Y-axis electric displacement stage 150 and the X-axis electric displacement stage 250 are controlled to move to appropriate positions so that the chip on the chip carrier 110 is located below the detection pin card 230. After the chip is adjusted in the R-axis direction by the R-axis adjustment stage 120 and / or finely adjusted in the X-axis and / or Y-axis direction by the XY-axis fine-tuning mechanism 130, the Z-axis electric displacement stage 140 is driven to rise to the position so that the test point on the chip contacts the detection pin card 230, thereby lighting up the chip.

[0105] Step S120: Record the positions of the Y-axis electric displacement stage 150, the X-axis electric displacement stage 250, and the Z-axis electric displacement stage 140 at this time as the Y-axis electric displacement stage forward positioning reference, the X-axis electric displacement stage forward positioning reference, and the Z-axis electric displacement stage rising positioning reference, respectively.

[0106] In step S130, control the Z-axis electric displacement stage 140 to drive the chip down into position, and then control the positioning camera 210 to move above the chip.

[0107] Step S140: Obtain the positioning image of the chip and identify the positioning marks in the positioning image;

[0108] In one embodiment, the chip is provided with a positioning mark. In this case, the image captured by the positioning camera 210, which includes the positioning mark, is the positioning image of the chip. The controller acquires the positioning image and then performs image recognition.

[0109] Step S150: Set the chip X-axis positioning reference and the chip Y-axis positioning reference according to the positioning mark;

[0110] In one embodiment, the chip can be configured with three positioning marks. After image recognition, the center coordinates of the three positioning marks can be used as the chip's X-axis positioning reference and Y-axis positioning reference. In other embodiments, more than three positioning marks can be set on the chip.

[0111] Step S160: Control the X-axis electric displacement stage 250 to move by a preset distance, so that the ranging sensor 220 moves directly above the chip;

[0112] Step S170: Obtain the height data measured by the ranging sensor 220 as the chip's Z-axis positioning reference;

[0113] In this embodiment, the distance between the ranging sensor 220 and the height of the chip when it descends to its final position is used as the Z-axis positioning reference for the chip.

[0114] Step S180: Control the Y-axis electric displacement stage 150 and the X-axis electric displacement stage 250 to retract into position;

[0115] The calibration is now complete.

[0116] For the detection steps, please refer to [link / reference]. Figure 2b ,include:

[0117] Step S210: After the chip under test is placed on the chip carrier 110 and fixed, the X-axis electric displacement stage 250 and the Y-axis electric displacement stage 150 are controlled to move a fixed distance respectively to transport the chip under test to the area below the positioning camera 210.

[0118] Step S220: Obtain the positioning image of the chip under test, identify the positioning marks in the positioning image and obtain the real-time X-axis position and Y-axis position of the chip, and calculate the chip X-axis and / or Y-axis position compensation value based on the real-time X-axis and Y-axis positions of the chip and the chip X-axis positioning position reference and the chip Y-axis positioning position reference.

[0119] Step S230: Control the X-axis electric displacement stage 250 to move by a preset distance, so that the ranging sensor 220 moves to directly above the chip under test, obtain the height data measured by the ranging sensor 220 as the real-time Z-axis height position of the chip, and calculate the chip Z-axis position compensation value based on the real-time Z-axis height position of the chip and the chip Z-axis positioning position reference.

[0120] In step S240, the X-axis electric displacement stage 250 is moved into position using the X-axis electric displacement stage forward positioning reference and the X-axis position compensation value, and the Y-axis electric displacement stage 150 is moved into position using the Y-axis electric displacement stage forward positioning reference and the Y-axis position compensation value, so as to transport the detection pin card 230 and the detection camera 240 to the chip under test.

[0121] In step S250, the Z-axis electric displacement stage 140 is raised to the position based on the Z-axis electric displacement stage rising to the position reference and the Z-axis position compensation value, so that the chip under test contacts the detection pin card 230 and lights up.

[0122] Step S260: Obtain the detection image of the chip under test;

[0123] The test image is sent to the display screen, and the operator can manually judge the optical performance of the chip under test based on the image on the screen. After the test, the Z-axis motorized stage 140 descends to its position first, and the Y-axis motorized stage 150 and X-axis motorized stage 250 retract to their positions. The vacuum state of the chip carrier 110 is then disconnected, and the operator can remove the single chip to proceed with the testing of the next chip.

[0124] As can be seen from the above testing process, the microdisplay chip testing system proposed in this application has a high degree of automation. On the one hand, it improves testing efficiency, and on the other hand, it reduces manual operation. Compared with a purely manual test bench, it greatly reduces the risk of damaging a single microdisplay chip.

[0125] This invention also proposes a detection device for microdisplay chips, wherein the detection device is a functional module that can run in a controller in software form, such as... Figure 3 As shown, it includes:

[0126] The calibration module includes:

[0127] The first control unit is used to control the Y-axis electric displacement stage 150 and the X-axis electric displacement stage 250 to move to appropriate positions so that the chip on the chip carrier 110 is located below the detection pin card 230. After the chip is adjusted in the R-axis by the R-axis adjustment stage 120 and / or finely adjusted in the X-axis and / or Y-axis by the XY-axis fine-tuning mechanism 130, the Z-axis electric displacement stage 140 is driven to rise to the position so that the test point on the chip contacts the detection pin card 230, thereby lighting up the chip.

[0128] The first reference setting unit is used to record the position of the Y-axis electric displacement stage 150, the position of the X-axis electric displacement stage 250 and the position of the Z-axis electric displacement stage 140 at this time as the Y-axis electric displacement stage forward positioning reference, the X-axis electric displacement stage forward positioning reference and the Z-axis electric displacement stage rising positioning reference, respectively.

[0129] The second control unit is used to control the Z-axis electric displacement stage 140 to drive the chip down into place, and then control the positioning camera 210 to move above the chip.

[0130] The first image acquisition and recognition unit is used to acquire the positioning image of the chip and recognize the positioning marks in the positioning image;

[0131] The second reference setting unit is used to set the chip X-axis positioning reference and the chip Y-axis positioning reference according to the positioning mark.

[0132] The third control unit is used to control the X-axis electric displacement stage 250 to move by a preset distance, so that the ranging sensor 220 moves to directly above the chip;

[0133] The third reference setting unit is used to acquire the height data measured by the ranging sensor 220 as the chip's Z-axis positioning reference.

[0134] The fourth control unit is used to control the Y-axis electric displacement stage 150 and the X-axis electric displacement stage 250 to retract into place;

[0135] The detection module includes:

[0136] The fifth control unit is used to control the X-axis electric displacement stage 250 and the Y-axis electric displacement stage 150 to move a fixed distance respectively after the chip under test is placed on the chip carrier 110 and fixed, so as to transport the chip under test to the area below the positioning camera 210.

[0137] The first compensation value calculation unit is used to acquire the positioning image of the chip under test, identify the positioning mark in the positioning image and acquire the real-time X-axis position and Y-axis position of the chip, and calculate the chip X-axis and / or Y-axis position compensation value based on the real-time X-axis and Y-axis positions of the chip and the chip X-axis positioning position reference and the chip Y-axis positioning position reference.

[0138] The second compensation value calculation unit is used to control the X-axis electric displacement stage 250 to move by a preset distance, so that the ranging sensor 220 moves to directly above the chip under test, obtains the height data measured by the ranging sensor 220 as the real-time Z-axis height position of the chip, and calculates the chip Z-axis position compensation value based on the real-time Z-axis height position of the chip and the chip Z-axis positioning position reference.

[0139] The sixth control unit is used to control the X-axis electric displacement stage 250 to move into position based on the X-axis electric displacement stage forward positioning reference and the X-axis position compensation value, and to control the Y-axis electric displacement stage 150 to move into position based on the Y-axis electric displacement stage forward positioning reference and the Y-axis position compensation value, so as to transport the detection pin card 230 and the detection camera 240 to the chip under test.

[0140] The seventh control unit is used to control the Z-axis electric displacement stage 140 to rise to the position based on the Z-axis electric displacement stage rising to the position reference and the Z-axis position compensation value, so that the chip under test can contact the detection pin card 230 and light up.

[0141] The detection image acquisition unit is used to acquire the detection image of the chip under test.

[0142] This invention also proposes a detection device for microdisplay chips, such as... Figure 4 As shown, it includes: a processor and a memory; the processor and the memory communicate with each other, for example, by being connected and communicating with each other via a communication bus; the memory stores a computer program; the processor is used to run the computer program, and the computer program performs the steps described above when it runs; the processor may be a CPU, or other general-purpose processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), or other programmable logic device, discrete gate or transistor logic device, discrete hardware component, or other chip, or a combination of the above types of chips or circuits; the memory may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk or solid-state drive; the memory may also include a combination of the above types of memory;

[0143] This invention also proposes a storage medium storing a computer program configured to execute the steps described above during runtime. The storage medium may be a magnetic disk, optical disk, read-only memory (ROM), random access memory (RAM), flash memory, hard disk drive (HDD), or solid-state drive (SSD), etc. The storage medium may also include combinations of the above types of memory.

[0144] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A microdisplay chip detection system, characterized in that, include: A chip carrying and displacement mechanism (100) and a chip positioning and detection mechanism (200); the chip positioning and detection mechanism (200) is disposed above the chip carrying and displacement mechanism (100); The chip support and displacement mechanism (100) includes: A chip carrier (110) is used to place and fix the chip; R-axis adjustment stage (120) is connected below the chip carrier (110) and is used to adjust the R-axis angle of the chip placed on the chip carrier (110); The XY fine-tuning mechanism (130) is connected below the R-axis adjustment stage (120) and is used to fine-tune the position of the chip placed on the chip carrier (110) in the X and / or Y directions. The Z-axis electric displacement stage (140) is connected below the XY-axis fine-tuning mechanism (130) and is used to drive the chip placed on the chip carrier (110) to move in the Z-axis. The Y-axis electric displacement stage (150) is connected below the Z-axis electric displacement stage (140) and is used to drive the chip placed on the chip carrier (110) to move in the Y direction. The chip positioning and detection mechanism (200) includes: A positioning camera (210) is used to capture positioning images of the chip; The ranging sensor (220) is used to measure and obtain the chip's Z-axis positioning reference when the chip descends into place; The detection pin card (230) is used to contact the test point on the chip when it rises to the correct position and to provide a test signal to the chip through the test point; A detection camera (240) is used to capture display images during chip testing; An X-axis electric displacement stage (250) is used to mount and drive the positioning camera (210), the ranging sensor (220), the detection pin card (230), and the detection camera (240) to move in the X-axis; In the Y direction, the detection pin (230) is located within the optical path of the lens of the positioning camera (210); The positioning camera (210) is mounted on the first manual displacement stage (270) along the Y direction; the first manual displacement stage (270) is connected to the slider of the X-direction electric displacement stage (250) through the carrier plate (260); The detection camera (240) is mounted on the second manual displacement stage (280) along the Y direction; the second manual displacement stage (280) is connected to the slider of the X-direction electric displacement stage (250) through the carrier plate (260); The detection needle holder (230) is connected to the lower end of the second manual displacement stage (280) and is located below the lens of the detection camera (240); The positioning camera (210), the ranging sensor (220), the detection pin card (230) and the detection camera (240) are all mounted on the slider of the X-axis electric displacement stage (250) via the same carrier plate (260); The distance between the positioning camera (210) and the ranging sensor (220), and the distance between the ranging sensor (220) and the detection pin card (230) are kept constant.

2. The microdisplay chip detection system as described in claim 1, characterized in that, The XY fine-tuning mechanism (130) includes an X-axis manual fine-tuning stage (131) and a Y-axis manual fine-tuning stage (132); the X-axis manual fine-tuning stage (131) is installed on the lifting block of the Z-axis electric displacement stage (140), and an intermediate carrier plate (133) is connected above the X-axis manual fine-tuning stage (131), while the Y-axis manual fine-tuning stage (132) is installed on the intermediate carrier plate (133).

3. The microdisplay chip detection system as described in claim 1, characterized in that, The chip carrier (110) is provided with a chip positioning slot.

4. The microdisplay chip detection system as described in claim 3, characterized in that, The bottom of the chip positioning slot of the chip carrier (110) is provided with a vacuum adsorption channel.

5. A method for detecting a microdisplay chip, applicable to the detection system as described in any one of claims 1 to 4, characterized in that, Includes the following steps: The calibration steps include: Control the Y-axis electric displacement stage (150) and the X-axis electric displacement stage (250) to move to appropriate positions so that the chip on the chip carrier (110) is located below the detection pin card (230); after the chip is adjusted in the R-axis by the R-axis adjustment stage (120) and / or finely adjusted in the X-axis and / or Y-axis by the XY-axis fine adjustment mechanism (130), drive the Z-axis electric displacement stage (140) to rise to position so that the test point on the chip contacts the detection pin card (230) and thus illuminates the chip; The positions of the Y-axis electric displacement stage (150), the X-axis electric displacement stage (250), and the Z-axis electric displacement stage (140) at this time are recorded as the Y-axis electric displacement stage forward positioning reference, the X-axis electric displacement stage forward positioning reference, and the Z-axis electric displacement stage rising positioning reference, respectively. The Z-axis electric displacement stage (140) is controlled to lower the chip into position, and then the positioning camera (210) is controlled to move above the chip; Acquire the chip's positioning image and identify the positioning marks in the positioning image; Based on the positioning marks, set the chip's X-axis positioning reference and the chip's Y-axis positioning reference; Control X to move the electric displacement stage (250) by a preset distance, so that the ranging sensor (220) moves directly above the chip; The height data measured by the ranging sensor (220) is used as the Z-axis positioning reference for the chip; Control the Y-axis electric displacement stage (150) and the X-axis electric displacement stage (250) to retract into position; The detection steps include: After the chip under test is placed on the chip carrier (110) and fixed, the X-axis electric displacement stage (250) and the Y-axis electric displacement stage (150) are controlled to move a fixed distance respectively to transport the chip under test to the area below the positioning camera (210). Acquire the positioning image of the chip under test, identify the positioning marks in the positioning image and obtain the real-time X-axis and Y-axis positions of the chip, and calculate the chip X-axis and / or Y-axis position compensation values ​​based on the real-time X-axis and Y-axis positions of the chip and the chip X-axis positioning position reference and the chip Y-axis positioning position reference. The X-axis electric displacement stage (250) is controlled to move by a preset distance, so that the distance sensor (220) moves to the top of the chip under test. The height data measured by the distance sensor (220) is obtained as the real-time Z-axis height position of the chip, and the chip Z-axis position compensation value is calculated based on the real-time Z-axis height position of the chip and the chip Z-axis positioning position reference. The X-axis electric displacement stage (250) is moved into position by the X-axis electric displacement stage forward positioning reference and the X-axis position compensation value, and the Y-axis electric displacement stage (150) is moved into position by the Y-axis electric displacement stage forward positioning reference and the Y-axis position compensation value, so as to transport the detection pin card (230) and the detection camera (240) to the chip under test. The Z-axis electric displacement stage (140) is raised to the position based on the Z-axis position compensation value so that the chip under test can contact the detection pin card (230) and light up. Acquire the test image of the chip under test.

6. A detection device for a microdisplay chip, characterized in that, include: The calibration module includes: The first control unit is used to control the Y-axis electric displacement stage (150) and the X-axis electric displacement stage (250) to move to appropriate positions so that the chip on the chip carrier (110) is located below the detection pin card (230); after the chip is adjusted in the R-axis by the R-axis adjustment stage (120) and / or fine-tuned in the X-axis and / or Y-axis by the XY-axis fine-tuning mechanism (130), the Z-axis electric displacement stage (140) is driven to rise to position so that the test point on the chip contacts the detection pin card (230) and thus lights up the chip; The first reference setting unit is used to record the position of the Y-axis electric displacement stage (150), the position of the X-axis electric displacement stage (250) and the position of the Z-axis electric displacement stage (140) at this time as the Y-axis electric displacement stage forward positioning reference, the X-axis electric displacement stage forward positioning reference and the Z-axis electric displacement stage rising positioning reference, respectively. The second control unit is used to control the Z-axis electric displacement stage (140) to drive the chip down to the position, and then control the positioning camera (210) to move above the chip; The first image acquisition and recognition unit is used to acquire the positioning image of the chip and recognize the positioning marks in the positioning image; The second reference setting unit is used to set the chip X-axis positioning reference and the chip Y-axis positioning reference according to the positioning mark. The third control unit is used to control the X-axis electric displacement stage (250) to move by a preset distance, so that the ranging sensor (220) moves to the top of the chip; The third reference setting unit is used to acquire the height data measured by the ranging sensor (220) as the chip's Z-axis positioning reference; The fourth control unit is used to control the Y-axis electric displacement stage (150) and the X-axis electric displacement stage (250) to retract into place; The detection module includes: The fifth control unit is used to control the X-axis electric displacement stage (250) and the Y-axis electric displacement stage (150) to move a fixed distance respectively after the chip under test is placed on the chip carrier (110) and fixed, so as to transport the chip under test to the position camera (210). The first compensation value calculation unit is used to acquire the positioning image of the chip under test, identify the positioning mark in the positioning image and acquire the real-time X-axis position and Y-axis position of the chip, and calculate the chip X-axis and / or Y-axis position compensation value based on the real-time X-axis and Y-axis positions of the chip and the chip X-axis positioning position reference and the chip Y-axis positioning position reference. The second compensation value calculation unit is used to control the X-axis electric displacement stage (250) to move by a preset distance, so that the ranging sensor (220) moves to the top of the chip under test, obtains the height data measured by the ranging sensor (220) as the real-time Z-axis height position of the chip, and calculates the chip Z-axis position compensation value based on the real-time Z-axis height position of the chip and the chip Z-axis positioning position reference. The sixth control unit is used to control the X-axis electric displacement stage (250) to move into place based on the X-axis electric displacement stage forward positioning reference and the X-axis position compensation value, and to control the Y-axis electric displacement stage (150) to move into place based on the Y-axis electric displacement stage forward positioning reference and the Y-axis position compensation value, so as to transport the detection pin card (230) and the detection camera (240) to the chip under test. The seventh control unit is used to control the Z-axis electric displacement stage (140) to rise to the position based on the Z-axis electric displacement stage rising to the position reference and the Z-axis position compensation value, so that the chip under test can contact the detection pin card (230) and light up. The detection image acquisition unit is used to acquire the detection image of the chip under test.

7. A detection device for microdisplay chips, characterized in that, include: Memory, which stores computer programs; A processor for running the computer program, which, when running, performs the steps of the method as described in claim 5.

8. A storage medium, characterized in that, The storage medium stores a computer program configured to execute the steps of the method as described in claim 5 when running.

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