Light emitting device and semiconductor laser

By replacing the combination structure of the sealing cover and lens with optical elements, and utilizing the cavity opening of the fixed platform and substrate to achieve the initial alignment and active coupling of the optical elements, the problems of increased thickness of the sealing cover and difficulty in lens adjustment in the prior art are solved, and the design of a light-emitting device with high-efficiency beam coupling and miniaturization is realized.

CN116581638BActive Publication Date: 2026-07-21XIAMEN SANAN OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
XIAMEN SANAN OPTOELECTRONICS CO LTD
Filing Date
2023-05-25
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing high-power LD chip packaging structures, increasing the thickness of the sealing cap is not conducive to miniaturization, and lens adjustment is difficult and prone to slippage, affecting beam coupling efficiency and product lifespan.

Method used

The combination structure of optical elements replacing the sealing cover and lens is adopted. The initial alignment and active coupling of the optical elements are achieved by using the cavity opening of the fixed platform and the substrate. The sealing is achieved by inorganic sealing welding, which reduces the difficulty of lens adjustment and the risk of lens falling off.

Benefits of technology

It improves beam coupling efficiency, reduces the thickness of the light-emitting device, extends product lifespan, effectively prevents lens slippage, and promotes the miniaturization of the light-emitting device.

✦ Generated by Eureka AI based on patent content.

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    Figure CN116581638B_ABST
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Abstract

The application provides a light emitting device and a semiconductor laser, wherein the light emitting device comprises at least one LD chip, a substrate, a plurality of fixing platforms and an optical element. The substrate comprises a base and a side wall arranged on the upper surface of the base, the base and the side wall form a cavity with an opening facing upward, and the LD chip is arranged on the upper surface of the base. The plurality of fixing platforms are arranged on the upper surface of the base and in the cavity, the fixing platform comprises an upper surface away from the base, and the upper surface height of the fixing platform is lower than the upper surface height of the side wall. The optical element comprises a first layer and a second layer above the first layer, the second layer has a lens part, the lower surface of the first layer is arranged on the fixing platform, the projection of the first layer to the upper surface of the base is located in the projection of the second layer to the upper surface of the base, and the edge of the second layer is sealingly connected with the upper surface of the side wall. The technical scheme of the application realizes the integration of high-efficiency beam lens active coupling adjustment and inorganic sealing.
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