晶圆检测实时对焦方法、装置、电子设备及存储介质
By dividing reference points at preset intervals and using a bilinear interpolation algorithm to calculate the focus value during wafer inspection, the problems of high time cost and low efficiency in the prior art are solved, and efficient wafer inspection is achieved.
CN116582749BActive Publication Date: 2026-07-17SHENZHEN GREENING ARTIFICIAL INTELLIGENCE & ROBOTICS RES INST CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN GREENING ARTIFICIAL INTELLIGENCE & ROBOTICS RES INST CO LTD
- Filing Date
- 2023-04-11
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing wafer inspection equipment has high time costs and low inspection efficiency during the focusing process, making it difficult to meet the precision requirements of semiconductor manufacturing processes.
Method used
Reference points are obtained by dividing the wafer surface at preset intervals. The focus value of the point to be detected is calculated using a bilinear interpolation algorithm. Focusing is achieved by adjusting the lens distance in real time, thereby improving detection efficiency.
Benefits of technology
It effectively reduces the number of focusing attempts, ensuring wafer accuracy while significantly improving detection efficiency, thus meeting the high-precision requirements of semiconductor manufacturing processes.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116582749B_ABST
Abstract
本申请实施例提供的晶圆检测实时对焦方法、装置、电子设备及存储介质，涉及半导体晶圆检测技术领域。其中，方法首先按预设间隔划分待检测晶圆的圆形表面，得到多个参考点，再针对参考点拍摄图像，在拍摄时对应调节待检测晶圆和镜头的检测距离，将检测距离作为参考点的第一对焦值，然后基于双线性插补算法，利用参考点及对应的第一对焦值对待检测点进行插补，得到各个待检测点的第二对焦值，最后在对待检测晶圆进行扫描拍摄时，基于第二对焦值对待检测点进行实时对焦，以使得拍摄的图像达到预设清晰度。由此无需对每个待检测点都进行对焦和记录其对焦高度值，保证晶圆精度的同时，大大减少了对焦次数，从而有效提高了晶圆检测的效率。
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