Electronic circuits, computing devices, and methods for manufacturing electronic circuits

CN116582999BActive Publication Date: 2026-08-14KK TOSHIBA
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-07-28
Publication Date
2026-08-14

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[0007]根据上述构成的电子电路,能够提供能提高特性的电子电路、计算装置以及电子电路的制造方法。

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Abstract

Electronic circuits, computing devices, and methods for manufacturing electronic circuits are provided, all capable of improving performance. According to an embodiment, the electronic circuit includes a first nonlinear element, a second nonlinear element, and a third nonlinear element. The first nonlinear element includes a first element Josephson junction disposed in a first region comprising a first surface including a first region and a second region. The second nonlinear element includes a second element Josephson junction disposed in the second region. The third nonlinear element includes a Josephson junction circuit. At least a portion of the Josephson junction circuit is disposed on a second surface. The second surface extends away from the first surface in a first direction intersecting the first surface and extends along the first surface. The third nonlinear element is capable of coupling with the first nonlinear element. The third nonlinear element is capable of coupling with the second nonlinear element.
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Description

[0001] This application is based on Japanese Patent Application 2022-014637 (filed on February 2, 2022), and enjoys priority benefits under that application. This application incorporates the entire contents of that application by reference. Technical Field

[0002] Embodiments of the present invention relate to electronic circuits, computing devices, and methods for manufacturing electronic circuits. Background Technology

[0003] For example, electronic circuits that include multiple nonlinear elements are used in computing devices. Improvements in performance are desired in both electronic circuits and computing devices. Summary of the Invention

[0004] Embodiments of the present invention provide electronic circuits, computing devices, and methods for manufacturing electronic circuits that can improve performance.

[0005] Technical solutions for solving the problem

[0006] According to an embodiment of the present invention, an electronic circuit includes a first nonlinear element, a second nonlinear element, and a third nonlinear element. The first nonlinear element includes a first element Josephson junction disposed in a first region comprising a first surface including a first region and a second region. The second nonlinear element includes a second element Josephson junction disposed in the second region. The third nonlinear element includes a Josephson junction circuit. At least a portion of the Josephson junction circuit is disposed on a second surface. The second surface extends away from the first surface in a first direction intersecting the first surface and extends along the first surface. The third nonlinear element is capable of coupling with the first nonlinear element. The third nonlinear element is capable of coupling with the second nonlinear element.

[0007] Based on the electronic circuit constructed as described above, it is possible to provide electronic circuits with improved characteristics, computing devices, and methods for manufacturing electronic circuits. Attached Figure Description

[0008] Figure 1 (a) and Figure 1 (b) is a schematic top view illustrating the electronic circuit and computing device according to the first embodiment.

[0009] Figure 2 This is a schematic cross-sectional view illustrating the electronic circuits and computing device according to the first embodiment.

[0010] Figure 3 This is a schematic diagram illustrating the electronic circuit and computing device according to the first embodiment.

[0011] Figure 4(a) and Figure 4 (b) is a schematic cross-sectional view illustrating a portion of the electronic circuit according to the first embodiment.

[0012] Figure 5 (a)~ Figure 5 (e) is a schematic cross-sectional view illustrating a portion of the electronic circuit according to the first embodiment.

[0013] Figure 6 This is a schematic cross-sectional view illustrating the electronic circuit according to the first embodiment.

[0014] Figure 7 (a) and Figure 7 (b) is a schematic top view illustrating a portion of the electronic circuit according to the first embodiment.

[0015] Figure 8 (a) and Figure 8 (b) is a schematic top view illustrating a portion of the electronic circuit according to the first embodiment.

[0016] Figure 9 (a) and Figure 9 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0017] Figure 10 (a) and Figure 10 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0018] Figure 11 (a) and Figure 11 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0019] Figure 12 (a) and Figure 12 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0020] Figure 13 (a) and Figure 13 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0021] Figure 14 (a) and Figure 14 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0022] Figure 15 (a) and Figure 15 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0023] Figure 16 This is a schematic cross-sectional view illustrating the electronic circuit according to the first embodiment.

[0024] Figure 17 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0025] Figure 18 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0026] Figure 19 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0027] Figure 20 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0028] Figure 21 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0029] Figure 22 This is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0030] Figure 23 (a) and Figure 23 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0031] Figure 24 (a) and Figure 24 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0032] Figure 25 (a) and Figure 25 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0033] Figure 26 (a) and Figure 26 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0034] Figure 27 (a) and Figure 27 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0035] Figure 28 (a) and Figure 28 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0036] Figure 29 (a) and Figure 29(b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0037] Figure 30 This is a schematic cross-sectional view illustrating the electronic circuit according to the second embodiment.

[0038] Figure 31 This is a schematic cross-sectional view illustrating the electronic circuit according to the second embodiment.

[0039] Figure 32 This is a schematic cross-sectional view illustrating the electronic circuit according to the second embodiment.

[0040] Figure 33 This is a schematic diagram illustrating the electronic circuits and computing devices involved in the embodiment.

[0041] Figure 34 (a)~ Figure 34 (i) is a schematic cross-sectional view illustrating a method for manufacturing an electronic circuit according to the third embodiment.

[0042] Figure 35 (a)~ Figure 35 (i) is a schematic cross-sectional view illustrating a method for manufacturing an electronic circuit according to the third embodiment.

[0043] Label Explanation

[0044] 11-15 Capacitors 1-5; 11u, 11v, 12u, 12v conductive components; 21-23 Josephson junctions 1-3; 21e-23e at one end; 21f-23f at the other end; 25a-25c Conductive components 1-3; 26a-26f Conductive films; 26i-26k Insulating films; 31, 32 Inductors 1 and 2; 31e, 32e at one end; 31f, 32f at the other end; 41, 42 Element capacitors 1 and 2; 50A, 50B, 50C Nonlinear elements 1-3; 50D-50I Nonlinear elements; 50b Quantum bits; 50c Coupler; 50r ring; 51, 52 first element Josephson junction, second element Josephson junction; 51C, 52C first counter electrode, second counter electrode; 51N, 52N first control electrode, second control electrode; 51NT, 52NT first control terminal, second control terminal; 51Nv, 52Nv conductive parts; 51O, 52O first element resonator, second element resonator; 51R, 52R first readout electrode, second readout electrode; 51Rv, 52Rv conductive parts; 51T, 52T first element terminal, second element terminal; 51v, 52v first element conductive parts, second element conductive parts; 52a, 52b second element Josephson junction; 5 3 Josephson junction circuit; 55a-55d conductive film; 55i, 55j insulating film; 55u, 55v conductive components; 58L wiring; 58a, 58b connection parts; 58v connection parts; 60 magnetic flux control part; 61 first control conductive component; 61i control current; 61u, 61v first and second control conductive parts; 70 control part; 81-83 first and third substrates; 81C-83C, 81D-83D connection parts; 81a, 81b first and second regions; 81d recess; 81p convex part; 85 conductive part; 86a, 86b conductive components; 88 first component; 88d recess; 88s support part; Φ magnetic flux; θ1, θ2 gate rotation angles; 110~117, 120, 130, 140, 141, 150~152, 160 electronic circuits; 210~217, 220, 230, 240, 241, 250~252, 260 computing devices; CS1, CSZZ coupling strength; D1, D2 first and second directions; F1~F6 first to sixth surfaces; FT1 fidelity; GND ground potential; MF1 magnetic flux; Mv1 first magnetic flux value; SP space; ST1, ST2 first and second states; Sc1, Sc2 first and second control signals; fb1~fb3 resonant frequencies; fc1, fc2, fo1 frequencies. Detailed Implementation

[0045] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0046] The accompanying drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the ratio of the size between parts, etc., are not required to be the same as reality. Even when representing the same parts, sometimes the dimensions and ratios of each other are shown differently according to the accompanying drawings.

[0047] In this application specification and figures, the same reference numerals are used for elements that have been described with respect to the preceding figures, and detailed descriptions are omitted where appropriate.

[0048] (First Embodiment)

[0049] Figure 1 (a) and Figure 1 (b) is a schematic top view illustrating the electronic circuit and computing device according to the first embodiment.

[0050] Figure 2 This is a schematic cross-sectional view illustrating the electronic circuits and computing device according to the first embodiment.

[0051] Figure 2 Is with Figure 1 (a) and Figure 1 (b) is the sectional view corresponding to line A1-A2. Figure 2 The cross-sectional structure is conceptually illustrated in the text. Figure 2 The length in the middle does not necessarily have to be the same as the length in the middle. Figure 1 (a) and Figure 1 The lengths in (b) are consistent.

[0052] like Figure 1 of (a), Figure 1 (b) and Figure 2 As shown, the electronic circuit 110 involved in the embodiment includes a first nonlinear element 50A, a second nonlinear element 50B, and a third nonlinear element 50C. The electronic circuit 110 is at least a part of the computing device 210.

[0053] At least a portion of the first nonlinear element 50A is disposed in the first region 81a of the first surface F1. At least a portion of the second nonlinear element 50B is disposed in the second region 81b of the first surface F1. At least a portion of the third nonlinear element 50C is disposed on the second surface F2.

[0054] The second face F2 departs from the first face F1 in the first direction. The second face F2 is along the first face F1. The second face F2 is substantially parallel to the first face F1. The first direction intersects the first face F1.

[0055] In this example, electronic circuit 110 includes a first substrate 81. First surface F1 is one side of the first substrate 81 (e.g., the top). Second surface F2 is the other side of the first substrate 81 (e.g., the bottom). Figure 1 (b) is a perspective top view observed through the first substrate 81.

[0056] The direction from face F2 to face F1 is defined as the Z-axis. A direction perpendicular to the Z-axis is defined as the X-axis. A direction perpendicular to both the Z-axis and X-axis is defined as the Y-axis. Faces F1 and F2 are substantially parallel to the X-Y plane. The first direction mentioned above corresponds, for example, to the Z-axis.

[0057] The first nonlinear element 50A includes a first element Josephson junction 51. The first element Josephson junction 51 is disposed on the first surface F1. The second nonlinear element 50B includes a second element Josephson junction 52. The second element Josephson junction 52 is disposed on the first surface F1. At least a portion of the first nonlinear element 50A as described above includes, for example, the first element Josephson junction 51. At least a portion of the second nonlinear element 50B as described above includes the second element Josephson junction 52.

[0058] The first nonlinear element 50A is one of a plurality of qubits disposed in the computing device 210. The second nonlinear element 50B is another of a plurality of qubits disposed in the computing device 210. These nonlinear elements are, for example, nonlinear resonators. The plurality of qubits are, for example, Transmon qubits.

[0059] The third nonlinear element 50C includes a Josephson junction circuit 53. At least a portion of the Josephson junction circuit 53 is disposed on the second surface F2. The aforementioned at least a portion of the third nonlinear element 50C includes, for example, the Josephson junction circuit 53.

[0060] The third nonlinear element 50C can be coupled to the first nonlinear element 50A. The third nonlinear element 50C can be coupled to the second nonlinear element 50B. The third nonlinear element 50C is, for example, a coupler. In the example of electronic circuit 110, the third nonlinear element 50C can be coupled to the first nonlinear element 50A (e.g., capacitive coupling). The third nonlinear element 50C can be coupled to the second nonlinear element 50B (e.g., capacitive coupling).

[0061] In one embodiment, at least a portion of the third nonlinear element 50C, which functions as a coupler, is disposed on a surface different from the surface on which the first nonlinear element 50A and the second nonlinear element 50B, which function as qubits, are disposed. For example, no wiring may be provided between adjacent qubits on the first surface F1. For example, wiring connections to qubits become easier. For example, no wiring may be provided between qubits and the coupler on the second surface F2. For example, wiring connections to the coupler become easier. For example, crosstalk between wirings can be reduced. According to this embodiment, an electronic circuit with improved scalability can be provided. According to this embodiment, an electronic circuit and computing device with improved characteristics can be provided.

[0062] For example, consider a reference example where the qubits and couplers are located in the same plane. In this reference example, access to the coupler may sometimes be difficult due to the qubits.

[0063] In contrast, in this implementation, the qubit and the coupler are positioned on different sides. This makes access to the coupler and the qubit easier, for example. With easier access, the gate operation of the qubit becomes stable. For example, the stability of the qubit is improved. For example, it is easier to obtain a good off state.

[0064] like Figure 1 As shown in (b), in this example, the Josephson junction circuit 53 includes a first Josephson junction 21, a second Josephson junction 22, and a third Josephson junction 23. The first Josephson junction 21, the second Josephson junction 22, and the third Josephson junction 23 are disposed on the second surface F2. The third nonlinear element 50C also includes a first conductive member 25a, a second conductive member 25b, and a third conductive member 25c. The first conductive member 25a connects the first Josephson junction 21 to the third Josephson junction 23. The second conductive member 25b connects the second Josephson junction 22 to the third Josephson junction 23. The third conductive member 25c connects the first Josephson junction 21 to the second Josephson junction 22. These connections can be, for example, electrical connections. The first conductive member 25a, the second conductive member 25b, and the third conductive member 25c are, for example, superconductors.

[0065] The first Josephson junction 21, the second Josephson junction 22, the third Josephson junction 23, the first conductive component 25a, the second conductive component 25b, and the third conductive component 25c form a loop (circuit) 50r. A first nonlinear element 50A can be coupled to the first conductive component 25a. A second nonlinear element 50B can be coupled to the second conductive component 25b. For example, the first nonlinear element 50A can be capacitively coupled to the first conductive component 25a. For example, the second nonlinear element 50B can be capacitively coupled to the second conductive component 25b.

[0066] Figure 3 This is a schematic diagram illustrating the electronic circuit and computing device according to the first embodiment.

[0067] like Figure 3 As shown, the first conductive component 25a connects one end 21e of the first Josephson junction 21 to one end 23e of the third Josephson junction 23. The second conductive component 25b connects one end 22e of the second Josephson junction 22 to the other end 23f of the third Josephson junction 23. The third conductive component 25c connects the other end 21f of the first Josephson junction 21 to the other end 22f of the second Josephson junction 22.

[0068] like Figure 3 As shown, in electronic circuit 110, a first element capacitor 41 may also be connected in parallel with the first element Josephson junction 51. A second element capacitor 42 may also be connected in parallel with the second element Josephson junction 52.

[0069] A first capacitor 11 may also be connected in parallel with the first Josephson junction 21. A second capacitor 12 may also be connected in parallel with the second Josephson junction 22. For example, the first element Josephson junction 51 may also be capacitively coupled to the first Josephson junction 21 and the third Josephson junction 23 via a third capacitor 13. For example, the second element Josephson junction 52 may also be capacitively coupled to the second Josephson junction 22 and the third Josephson junction 23 via a fourth capacitor 14. A fifth capacitor 15 may also be connected in parallel with the third Josephson junction 23.

[0070] As will be described later, the first Josephson junction 21 can also be the first inductor. The second Josephson junction 22 can also be the second inductor.

[0071] In this example, such as Figure 1 As shown in (a), a third capacitor 13 and a fourth capacitor 14 are provided on the first surface F1. These capacitors are electrically connected to a conductive component provided on the second surface F2 through through holes provided on the first substrate 81.

[0072] like Figure 1 of (a), Figure 1 (b) and Figure 2 As shown, the electronic circuit 110 also includes a first conductive element 51v and a second conductive element 52v. The first conductive element 51v extends along a first direction (Z-axis direction) in the first substrate 81. The first conductive element 51v is electrically connected to a first nonlinear element 50A. Alternatively, the first conductive element 51v can be coupled to the first nonlinear element 50A (e.g., capacitive coupling). In this example, the first conductive element 51v is capacitively coupled to the first nonlinear element 50A via a third capacitor 13. The first conductive element 51v is electrically connected to a first conductive member 25a. Alternatively, the first conductive element 51v can be coupled to the first conductive member 25a (e.g., capacitive coupling). In this example, the first conductive element 51v is electrically connected to the first conductive member 25a.

[0073] The second conductive portion 52v extends along a first direction (Z-axis direction) in the first substrate 81. The second conductive portion 52v is electrically connected to the second nonlinear element 50B. Alternatively, the second conductive portion 52v can be coupled to the second nonlinear element 50B (e.g., capacitive coupling). In this example, the second conductive portion 52v is capacitively coupled to the second nonlinear element 50B via the fourth capacitor 14. The second conductive portion 52v is electrically connected to the second conductive member 25b. Alternatively, the second conductive portion 52v can be coupled to the second conductive member 25b (e.g., capacitive coupling). In this example, the second conductive portion 52v is electrically connected to the second conductive member 25b.

[0074] The first element conductive portion 51v and the second element conductive portion 52v are, for example, TSVs (Through-Substrate Vias). By using TSVs for connection, high-density and stable connections can be obtained.

[0075] Figure 4 (a) and Figure 4 (b) is a schematic cross-sectional view illustrating a portion of the electronic circuit according to the first embodiment.

[0076] Figure 4 (a) is a cross-sectional view of the first capacitor 11. Figure 4 (b) is a cross-sectional view of the second capacitor 12. Figure 4 As shown in (a), the first capacitor 11 includes conductive members 11u and 11v. These conductive members extend along a first direction (Z-axis direction) in at least a portion of the first substrate 81. Figure 4As shown in (b), the second capacitor 12 includes conductive elements 12u and 12v. These conductive elements extend along a first direction (Z-axis direction) in at least a portion of the first substrate 81. By using these conductive elements, a capacitor with a small area can be obtained. These conductive elements can be TSVs.

[0077] like Figure 1 As shown in (a), in this example, a first element capacitor 41 and a second element capacitor 42 are disposed on the first surface F1. These element capacitors may also be formed from conductive components extending along the Z-axis direction in the first substrate 81.

[0078] Figure 5 (a)~ Figure 5 (e) is a schematic cross-sectional view illustrating a portion of the electronic circuit according to the first embodiment.

[0079] like Figure 5 As shown in (a), the first element, Josephson junction 51, includes, for example, a conductive film 55a, a conductive film 55b, and an insulating film 55i. The insulating film 55i is disposed between a portion of the conductive film 55a and a portion of the conductive film 55b.

[0080] like Figure 5 As shown in (b), the second element, Josephson junction 52, includes, for example, a conductive film 55c, a conductive film 55d, and an insulating film 55j. The insulating film 55j is disposed between a portion of the conductive film 55c and a portion of the conductive film 55d.

[0081] like Figure 5 As shown in (c), the first Josephson junction 21 includes, for example, a conductive film 26a, a conductive film 26b, and an insulating film 26i. The insulating film 26i is disposed between a portion of the conductive film 26a and a portion of the conductive film 26b.

[0082] like Figure 5 As shown in (d), the second Josephson junction 22 includes, for example, a conductive film 26c, a conductive film 26d, and an insulating film 26j. The insulating film 26j is disposed between a portion of the conductive film 26c and a portion of the conductive film 26d.

[0083] like Figure 5 As shown in (e), the third Josephson junction 23 includes, for example, a conductive film 26e, a conductive film 26f, and an insulating film 26k. The insulating film 26k is disposed between a portion of the conductive film 26e and a portion of the conductive film 26f.

[0084] These conductive films, for example, contain at least one selected from Al, Nb, NbN, TiN, NbTiN, and Ta. These materials are superconducting materials. The insulating films, for example, contain at least one selected from Al₂O₃, Nb₂O₅, NbO₂, NbO, and AlN. The first substrate 81, for example, contains at least one selected from Si and sapphire. The first substrate 81 is, for example, insulating.

[0085] like Figure 1 As shown in (a), in this example, electronic circuit 110 includes a first element resonator 510, a first element terminal 51T, a second element resonator 520, and a second element terminal 52T. The first element resonator 510 is capable of coupling (e.g., capacitive coupling) to a first nonlinear element 50A. The first element terminal 51T is capable of coupling (e.g., capacitive coupling) to the first element resonator 510. The second element resonator 520 is capable of coupling (e.g., capacitive coupling) to a second nonlinear element 50B. The second element terminal 52T is capable of coupling (e.g., capacitive coupling) to the second element resonator 520.

[0086] The state of the first nonlinear element 50A can be detected via the first element resonator 51O and the first element terminal 51T. A signal corresponding to the state of the first nonlinear element 50A can be obtained via the first element resonator 51O and the first element terminal 51T. The state of the second nonlinear element 50B can be detected via the second element resonator 52O and the second element terminal 52T. A signal corresponding to the state of the second nonlinear element 50B can be obtained via the second element resonator 52O and the second element terminal 52T. These element resonators and element terminals correspond, for example, to a readout unit.

[0087] At least one of the following can be disposed on the first surface F1: at least a portion of the first element resonator 51O, at least a portion of the first element terminal 51T, at least a portion of the second element resonator 52O, and at least a portion of the second element terminal 52T.

[0088] like Figure 3 As shown, the electronic circuit 110 (computing device 210) may also include a magnetic flux control unit 60. The magnetic flux control unit 60 is capable of controlling the magnetic flux Φ of the space SP within the ring 50r. For example, the magnetic flux control unit 60 can modulate the magnetic flux Φ of the space SP.

[0089] like Figure 3 As shown, the computing device 210 may also include an electronic circuit 110 and a control unit 70. The control unit 70 is capable of controlling the magnetic flux control unit 60. Thus, the control unit 70 is capable of controlling the magnetic flux Φ of the space SP.

[0090] In this example, the magnetic flux control unit 60 includes a first control conductive member 61. A control unit 70 is connected to the first control conductive member 61. A magnetic flux control signal is provided from the control unit 70 to the first control conductive member 61. A magnetic field corresponding to the magnetic flux control signal is generated from the first control conductive member 61. Through this magnetic field, the magnetic flux Φ of the space SP within the ring 50r is controlled. The first control conductive member 61 is an example of the magnetic flux control unit 60. The control unit 70 can change the magnetic flux Φ by modulating the current supplied to the first control conductive member 61.

[0091] For example, the third nonlinear element 50C (coupler) has multiple modes (e.g., two modes). In an embodiment, the resonant frequencies of the multiple modes can be reduced. For example, it is easy to make the resonant frequencies of the multiple modes close to the resonant frequencies of the first nonlinear element 50A and the second nonlinear element 50B. This results in strong coupling strength. According to the embodiment, controllability can be improved.

[0092] By controlling the magnetic flux Φ, the coupling strength can be altered. For example, the coupling strength can be made practically zero, decoupling (setting it as disconnected). As described later, by controlling the third nonlinear element 50C (coupler), a 2-qubit gating operation can be performed at high speed. Couplers and computing devices that improve controllability can be provided.

[0093] like Figure 1 As shown in (a), a conductive layer with a fixed potential (e.g., ground potential GND) can be provided around the first nonlinear element 50A and the second nonlinear element 50B. Figure 1 As shown in (b), a conductive layer with a fixed potential (e.g., ground potential GND) may be provided around the third nonlinear element 50C.

[0094] like Figure 2 As shown, a conductive layer disposed on the first surface F1 and set to a fixed potential (e.g., ground potential GND) and a conductive layer disposed on the second surface F2 and set to a fixed potential (e.g., ground potential GND) can be electrically connected through connecting portions 81C and 81D. These connecting portions extend along the Z-axis direction in the first substrate 81.

[0095] like Figure 1 (a) and Figure 1 As shown in (b), the first nonlinear element 50A can be connected to other nonlinear elements 50D via conductive member 55u. Figure 1 (a) and Figure 1As shown in (b), the second nonlinear element 50B can be connected to other nonlinear elements 50E via conductive member 55v. Other nonlinear elements 50D and 50E are, for example, couplers. Other nonlinear element 50D can be further connected to other nonlinear elements (not shown, other qubits). Other nonlinear elements 50E can be further connected to other nonlinear elements (not shown, other qubits). Conductive members 55u and 55v can, for example, extend along the Z-axis direction in at least a portion of the first substrate 81. These conductive members can be TSVs.

[0096] The first nonlinear element 50A can be connected to other nonlinear elements 50F and 50H. The second nonlinear element 50B can be connected to other nonlinear elements 50G and 50I. Nonlinear elements 50F, 50G, 50H, and 50I are, for example, couplers. Nonlinear elements 50F, 50G, 50H, and 50I can be further connected to other nonlinear elements (other qubits not shown).

[0097] The first nonlinear element 50A and the second nonlinear element 50B function as two qubits. Among the multiple energy levels possessed by the first nonlinear element 50A and the second nonlinear element 50B, the two from the bottom can be used as two states of the qubit. Among the multiple energy levels, the two from the bottom correspond to the ground state and the first excitation state. These two states of the qubit correspond to the computational basis states. For example, the resonant frequency of the first nonlinear element 50A corresponds to the value obtained by converting the energy difference between the two states of the first nonlinear element 50A into a frequency. Similarly, the resonant frequency of the second nonlinear element 50B corresponds to the value obtained by converting the energy difference between the two states of the second nonlinear element 50B into a frequency. By dividing the energy by Planck's constant h, the frequency corresponding to the energy can be obtained.

[0098] like Figure 1 As shown, the third nonlinear element 50C (coupler) may also include a first control conductive member 61. The first control conductive member 61 is capable of applying a magnetic field to the space SP (ring 50r). For example, a magnetic field is generated by a current supplied to the first control conductive member 61. The generated magnetic field is applied to the space SP (ring 50r). As described later, the coupling strength between the first nonlinear element 50A and the second nonlinear element 50B changes according to the magnetic flux Φ (magnetic flux based on the magnetic field) in the space SP (ring 50r).

[0099] Figure 6 This is a schematic cross-sectional view illustrating the electronic circuit according to the first embodiment.

[0100] Figure 7 (a) and Figure 7 (b) is a schematic top view illustrating a portion of the electronic circuit according to the first embodiment.

[0101] like Figure 6 As shown, the electronic circuit 111 involved in the embodiment includes a second substrate 82, a first counter electrode 51C, and a second counter electrode 52C. The structure of the electronic circuit 111, except for these components, can be the same as that of the electronic circuit 110. The computing device 211 includes the electronic circuit 111.

[0102] The second substrate 82 includes a third surface F3 and a fourth surface F4. The fourth surface F4 faces the first surface F1. The fourth surface F4 is located between the first surface F1 and the third surface F3. The fourth surface F4 is, for example, the bottom surface. The third surface F3 is, for example, the top surface.

[0103] The first counter electrode 51C is disposed on the fourth surface F4. The second counter electrode 52C is disposed on the fourth surface F4. The first counter electrode 51C can be coupled to the first element terminal 51T (e.g., capacitive coupling). The second counter electrode 52C can be coupled to the second element terminal 52T (e.g., capacitive coupling).

[0104] like Figure 6 , Figure 7 (a) and Figure 7 As shown in (b), a first readout electrode 51R, a first readout conductive portion 51Rv, a second readout electrode 52R, and a second readout conductive portion 52Rv may be provided. The first readout electrode 51R and the second readout electrode 52R are provided on the third surface F3. The first readout conductive portion 51Rv extends in the second substrate 82 along a first direction (e.g., the Z-axis direction). The first readout conductive portion 51Rv electrically connects the first counter electrode 51C to the first readout electrode 51R. The second readout conductive portion 52Rv extends in the second substrate 82 along the first direction (e.g., the Z-axis direction). The second readout conductive portion 52Rv electrically connects the second counter electrode 52C to the second readout electrode 52R.

[0105] like Figure 7 As shown in (a), the first readout electrode 51R and the second readout electrode 52R can also be connected to the control unit 70. The control unit 70 can obtain signals corresponding to the state of the first nonlinear element 50A and the state of the second nonlinear element 50B via these electrodes.

[0106] like Figure 7 As shown in (b), a first control terminal 51NT and a second control terminal 52NT can be provided on the fourth surface F4. Figure 7As shown in (a), a first control electrode 51N and a second control electrode 52N can be provided on the third surface F3. A first control terminal 51NT is connected to the first control electrode 51N via a conductive portion 51Nv. A second control terminal 52NT is connected to the second control electrode 52N via a conductive portion 52Nv. A control unit 70 is connected to both the first control electrode 51N and the second control electrode 52N. The characteristics of the first nonlinear element 50A can also be controlled by a signal provided from the control unit 70 to the first control electrode 51N. The characteristics of the second nonlinear element 50B can also be controlled by a signal provided from the control unit 70 to the second control electrode 52N. The conductive portions 51Nv and 52Nv extend along a first direction (Z-axis direction) in at least a portion of the second substrate 82. These conductive portions can be TSVs.

[0107] Thus, the electronic circuit 111 may include a first control terminal 51NT and a second control terminal 52NT. The first control terminal 51NT can be supplied with a first control signal Sc1 to control the first nonlinear element 50A. The second control terminal 52NT can be supplied with a second control signal Sc2 to control the second nonlinear element 50B. The first control signal Sc1 is the excitation signal for the first nonlinear element 50A. The second control signal Sc2 is the excitation signal for the second nonlinear element 50B.

[0108] like Figure 7 (a) and Figure 7 As shown in (b), the conductive layer disposed on the third surface F3 and set to a fixed potential (e.g., ground potential GND) and the conductive layer disposed on the fourth surface F4 and set to a fixed potential (e.g., ground potential GND) can also be electrically connected through the connecting portion 82C and the connecting portion 82D. These connecting portions extend along the Z-axis direction in the second substrate 82.

[0109] Figure 8 (a) and Figure 8 (b) is a schematic top view illustrating a portion of the electronic circuit according to the first embodiment.

[0110] like Figure 6 , Figure 8 (a) and Figure 8 As shown in (b), the electronic circuit 111 may include a third substrate 83. The third substrate 83 includes a fifth surface F5 and a sixth surface F6. The fifth surface F5 faces the second surface F2. The fifth surface F5 is located between the sixth surface F6 and the second surface F2. The fifth surface F5 is, for example, the top surface. The sixth surface F6 is, for example, the bottom surface. The electronic circuit 111 includes a magnetic flux control unit 60. The magnetic flux control unit 60 is disposed on the fifth surface F5. The magnetic flux control unit 60 is capable of controlling the ring 50r (refer to...) Figure 3The magnetic flux Φ within the space SP is controlled. For example, a control unit 70 is provided. The control unit 70 controls the magnetic flux control unit 60, and controls the magnetic flux Φ.

[0111] In this example, the magnetic flux control unit 60 includes a first control conductive member 61. Thus, the electronic circuit 111 may include the first control conductive member 61. In this example, the electronic circuit 111 includes a first control conductive member 61u and a second control conductive member 61v.

[0112] like Figure 6 and Figure 8 As shown in (a), a first control conductive member 61 is disposed on the fifth surface F5. A first control conductive portion 61u extends in the third substrate 83 along a first direction (e.g., the Z-axis direction). The first control conductive portion 61u is electrically connected to a portion of the first control conductive member 61. A second control conductive portion 61v extends in the third substrate 83 along the first direction (e.g., the Z-axis direction). The second control conductive portion 61v is electrically connected to another portion of the first control conductive member 61.

[0113] like Figure 8 As shown in (b), the control unit 70 is connected to the first control conductive member 61 via the first control conductive member 61u and the second control conductive member 61v. A magnetic field is generated by a signal (current) supplied from the control unit 70 to the first control conductive member 61. The generated magnetic field is applied to the ring 50r (see reference). Figure 3 The magnetic flux Φ of the space SP within the space is controlled.

[0114] like Figure 6 As shown, the conductive layer of the ground potential GND provided on the first surface F1 and the conductive layer of the ground potential GND provided on the fourth surface F4 can be electrically connected through the connecting part 58a. The conductive layer of the ground potential GND provided on the second surface F2 and the conductive layer of the ground potential GND provided on the fifth surface F5 can be electrically connected through the connecting part 58b.

[0115] like Figure 8 (a) and Figure 8 As shown in (b), a conductive layer disposed on the fifth surface F5 and set to a fixed potential (e.g., ground potential GND) and a conductive layer disposed on the sixth surface F6 and set to a fixed potential (e.g., ground potential GND) can be electrically connected via connection portion 83C and connection portion 83D. These connection portions extend along the Z-axis direction in the third substrate 83.

[0116] The following are some examples of electronic circuits and computing devices.

[0117] Figure 9 (a) and Figure 9(b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0118] like Figure 9 As shown in (a), in electronic circuit 112, a first element Josephson junction 51 and a second element Josephson junction 52 are also provided on the first surface F1. Figure 9 As shown in (b), a first Josephson junction 21 to a third Josephson junction 23 are provided on the second surface F2. Furthermore, a first control conductive member 61 is provided on the second surface F2. A magnetic flux control signal (e.g., a control current 61i) is provided to the first control conductive member 61 from the control unit 70. The magnetic field generated by the control current 61i is applied to the space SP within the ring 50r. By controlling the control current 61i, the magnetic flux Φ can be controlled. The computing device 212 includes an electronic circuit 112 and a control unit 70.

[0119] Figure 10 (a) and Figure 10 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0120] like Figure 10 (a) and Figure 10 As shown in (b), in the electronic circuit 113, the first element capacitor 41, the second element capacitor 42, the third capacitor 13, and the fourth capacitor 14 are formed by conductive portions extending along a first direction (Z-axis direction) in the first substrate 81. The computing device 213 includes the electronic circuit 113 and the control unit 70.

[0121] Figure 11 (a) and Figure 11 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0122] like Figure 11 (a) and Figure 11 As shown in (b), in the electronic circuit 114, the first element capacitor 41, the second element capacitor 42, the first capacitor 11, the second capacitor 12, the third capacitor 13, and the fourth capacitor 14 are formed by conductive portions extending along a first direction (Z-axis direction) in the first substrate 81. The computing device 214 includes the electronic circuit 114 and the control unit 70.

[0123] Figure 12 (a) and Figure 12 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0124] like Figure 12 (a) and Figure 12As shown in (b), in the electronic circuit 115, the first control conductive component 61 includes a coaxial cable. The first element capacitor 41, the second element capacitor 42, the first capacitor 11, the second capacitor 12, the third capacitor 13, and the fourth capacitor 14 are formed by conductive portions extending in the first substrate 81 along a first direction (Z-axis direction). The computing device 215 includes the electronic circuit 115 and the control unit 70.

[0125] Figure 13 (a) and Figure 13 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0126] like Figure 13 (a) and Figure 13 As shown in (b), in electronic circuit 116, the first control conductive component 61 includes a coaxial cable. A first element, Josephson junction 51, is disposed between the annular conductive portion and the conductive portion disposed within the annular conductive portion. A second element, Josephson junction 52, is disposed between the annular conductive portion and the conductive portion disposed within the annular conductive portion. The computing device 216 includes electronic circuit 116 and a control unit 70.

[0127] Figure 14 (a) and Figure 14 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0128] like Figure 14 (a) and Figure 14 As shown in (b), in electronic circuit 117, the first control conductive component 61 includes a coaxial cable. A first element, Josephson junction 51, is disposed between the annular conductive portion and a conductive portion disposed within the annular conductive portion. A second element, Josephson junction 52, is disposed between the annular conductive portion and a conductive portion disposed within the annular conductive portion. The third capacitor 13 and the fourth capacitor 14 include portions extending along the first surface F1. The computing device 217 includes electronic circuit 117 and a control unit 70.

[0129] Figure 15 (a) and Figure 15 (b) is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0130] Figure 16 This is a schematic cross-sectional view illustrating the electronic circuit according to the first embodiment.

[0131] like Figure 16As shown, the electronic circuit 120 includes a first substrate 81 and a second substrate 82. The first surface F1 is a surface of the first substrate 81 (e.g., the top). The second surface F2 is a surface of the second substrate 82 (e.g., the bottom). The second surface F2 is opposite to the first surface F1.

[0132] The first nonlinear element 50A is disposed in the first region 81a of the first surface F1. The second nonlinear element 50B is disposed in the second region 81b of the first surface F1. The third nonlinear element 50C is disposed on the second surface F2.

[0133] like Figure 15 As shown in (a), the first element Josephson junction 51 of the first nonlinear element 50A is disposed in the first region 81a of the first surface F1. The second element Josephson junction 52 of the second nonlinear element 50B is disposed in the second region 81b of the first surface F1.

[0134] like Figure 15 As shown in (b), at least a portion of the Josephson junction circuit 53 of the third nonlinear element 50C is disposed on the second surface F2. The second surface F2 is away from the first surface F1. The third nonlinear element 50C can be coupled to the first nonlinear element 50A. The third nonlinear element 50C can be coupled to the second nonlinear element 50B. For example, the third nonlinear element 50C can be inductively coupled to the first nonlinear element 50A. For example, the third nonlinear element 50C can be inductively coupled to the second nonlinear element 50B.

[0135] In electronic circuit 120, the Josephson junction circuit 53 also includes a first Josephson junction 21, a second Josephson junction 22, and a third Josephson junction 23. These Josephson junctions are disposed on the second surface F2. The third nonlinear element 50C includes a first conductive member 25a, a second conductive member 25b, and a third conductive member 25c. These conductive members are disposed on the second surface F2. The first conductive member connects the first Josephson junction 21 to the third Josephson junction 23. The second conductive member 25b connects the second Josephson junction 22 to the third Josephson junction 23. The third conductive member 25c connects the first Josephson junction 21 to the second Josephson junction 22. The first Josephson junction, the second Josephson junction, the third Josephson junction, the first conductive member, the second conductive member, and the third conductive member form a loop 50r. The first nonlinear element 50A can be coupled to the first conductive member 25a. The second nonlinear element 50B can be coupled to the second conductive member 25b. In electronic circuit 120, the first nonlinear element 50A is inductively coupled to the first conductive component 25a. The second nonlinear element 50B is inductively coupled to the second conductive component 25b.

[0136] Electronic circuit 120 includes about Figure 3The circuit described above. Electronic circuit 120 may include first capacitor 11 to fifth capacitor 15. First nonlinear element 50A may also include first element capacitor 41. Second nonlinear element 50B may also include second element capacitor 42.

[0137] like Figure 15 As shown in (b), a magnetic flux control unit 60 may be provided. The magnetic flux control unit 60 includes a first control conductive member 61. A magnetic flux control signal (control current 61i) is supplied from the control unit 70 to the first control conductive member 61. A magnetic field corresponding to the magnetic flux control signal is generated from the first control conductive member 61. Through this magnetic field, the magnetic flux Φ of the space SP within the ring 50r is controlled. The control unit 70 can change the magnetic flux Φ by modulating the current supplied to the first control conductive member 61. The computing device 218 includes an electronic circuit 120 and a control unit 70.

[0138] Hereinafter, examples of features related to the computing device (e.g., computing device 210) involved in the implementation will be described.

[0139] In the following description, the critical current of the first element, Josephson junction 51, is 56.6 nA. The critical current of the second element, Josephson junction 52, is 45.9 nA. The capacitance of the first element, capacitor 41, is 43.6 fF. The capacitance of the second element, capacitor 42, is 43.6 fF. The critical current of the first Josephson junction 21 is 64.4 nA. The critical current of the second Josephson junction 22 is 50.0 nA. The critical current of the third Josephson junction 23 is 14.8 nA. The capacitance of the first capacitor 11 is 19.4 fF. The capacitance of the second capacitor 12 is 19.4 fF. The capacitance of the third capacitor 13 is 6.46 fF. The capacitance of the fourth capacitor 14 is 6.46 fF. The capacitance of the fifth capacitor 15 is 0.969 fF.

[0140] Figure 17 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0141] Figure 17 The horizontal axis represents the magnetic flux MF1 in space SP (ring 50r). The magnetic flux MF1 (=2Φ / Φ0) is normalized by the magnetic flux quantum Φ0 and is dimensionless. Figure 17 The vertical axis corresponds to the frequency fo1. Figure 17The diagram illustrates the resonant frequency fb1 of the first nonlinear element 50A and the resonant frequency fb2 of the second nonlinear element 50B. The first nonlinear element 50A corresponds, for example, to the first qubit. The second nonlinear element 50B corresponds, for example, to the second qubit. The nonlinear element is, for example, a nonlinear resonator (Transmont qubit). The resonant frequency of the nonlinear element corresponds to the value obtained by dividing the energy difference between the two states of the nonlinear element from the bottom up by Planck's constant h and converting it into frequency.

[0142] exist Figure 17 Frequency fc1 and frequency fc2 are illustrated. Frequency fc1 corresponds to one frequency of multiple modes (e.g., two modes) in the third nonlinear element 50C (coupler). Frequency fc2 corresponds to another frequency of multiple modes (e.g., two modes) in the third nonlinear element 50C (coupler).

[0143] like Figure 17 As shown, in the computing device 210 according to the embodiment, when the magnetic flux MF1 changes, the frequencies fc1 and fc2 change. In particular, the frequency fc2 changes significantly. In this example, when the magnetic flux MF1 is approximately 0.61, the frequencies fc1 and fc2 are close to each other. The first magnetic flux value Mv1 is approximately 0.61.

[0144] like Figure 17 As shown, the resonant frequency fb1 of the first nonlinear element 50A and the resonant frequency fb2 of the second nonlinear element 50B are substantially constant when the magnetic flux MF1 changes. In this example, the resonant frequency fb1 of the first nonlinear element 50A is approximately 10.0 GHz, and the resonant frequency fb2 of the second nonlinear element 50B is approximately 8.4 GHz.

[0145] Thus, in this embodiment, frequencies fc1 and fc2 are relatively close to resonant frequencies fb1 and fb2. The third nonlinear element 50C (coupler) has multiple modes (at least two modes). That is, the coupler can resonate in multiple modes. The resonant frequencies (frequency fc1 and frequency fc2) of each of these multiple modes are near the aforementioned first magnetic flux value Mv1 (magnetic flux values ​​where frequencies fc1 and fc2 are close to each other), and are respectively higher than resonant frequencies fb1 and fb2, and lower than the sum of resonant frequencies fb1 and fb2. In this embodiment, there exists a state where the resonant frequencies (frequency fc1 and frequency fc2) of each of the multiple modes are lower than the sum of resonant frequencies fb1 and fb2.

[0146] For example, in a state where the coupling between the first nonlinear element 50A and the second nonlinear element 50B is substantially decoupled, the resonant frequencies of each of the multiple modes of the third nonlinear element 50C are higher than the resonant frequency fb1 of the first nonlinear element 50A, higher than the resonant frequency fb2 of the second nonlinear element 50B, and lower than the sum of the resonant frequencies fb1 of the first nonlinear element 50A and fb2 of the second nonlinear element 50B.

[0147] Figure 18 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0148] Figure 18 The horizontal axis represents the magnetic flux MF1. The vertical axis represents the coupling strength CSZZ, which relates to residual coupling (so-called ZZ coupling). ZZ coupling corresponds to the following situation: with respect to the frequency fb3 corresponding to the "1 state" of both sides of the two qubits, fb1+fb2-fb3 is not zero due to residual coupling. This "offset" in ZZ coupling corresponds to the coupling strength CSZZ.

[0149] In this example, when the magnetic flux MF1 is approximately 0.61 (the first magnetic flux value Mv1), the coupling strength CSZZ becomes practically zero. Figure 18 As shown, when the magnetic flux MF1 is approximately 0.61, the coupling strength CSZZ associated with the residual coupling can become substantially zero. For example, robust zero ZZ coupling can be obtained.

[0150] For example, between state ST1, where the magnetic flux MF1 is equal to the first magnetic flux value Mv1, and state ST2, where the magnetic flux MF1 is greater than the first magnetic flux value Mv1, the magnetic flux MF1 can be increased or decreased. This enables 2-qubit gating. Such an action corresponds, for example, to the first action. For instance, in state ST2, the magnetic flux MF1 is 1.

[0151] In the first action, for example, the magnetic flux Φ (corresponding to magnetic flux MF1) is increased from the first magnetic flux value Mv1 (first state ST1) to form the second state ST2. Then, the magnetic flux Φ (corresponding to magnetic flux MF1) is decreased to restore the first magnetic flux value Mv1. Thus, 2-qubit gating can be implemented through pulsed magnetic flux. In 2-qubit gating, the phase rotation θ of the |01> state relative to the |00> state... 01 In 2-qubit gating, the phase rotation θ of the |10> state relative to the |00> state 10 In 2-qubit gating, the phase rotation θ of the |11> state relative to the |00> state 11 θ 11 From θ 01 With θ 10 The sum (i.e., θ) 01+θ 10 ) offset. The phase offset (θ) 11 -θ 01 -θ 10 ) and gating rotation angle.

[0152] Figure 19 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0153] Figure 19 The characteristics of the first action described above are illustrated. Figure 19 The horizontal axis represents the value obtained by dividing the gating rotation angle θ1 by π, where π is the mathematical constant pi. The vertical axis represents the fidelity FT1. The gating time is approximately 12 ns. Figure 19 As shown, high-fidelity FT1 of over 99.98% can be obtained with high-speed gating.

[0154] Figure 20 This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0155] Figure 20 The horizontal axis represents the magnetic flux MF1. The vertical axis represents the coupling strength CS1 between the first nonlinear element 50A and the second nonlinear element 50B. The coupling strength CS1 is the coupling strength between the |01> state and the |10> state. For example... Figure 20 As shown, when the magnetic flux MF1 is equal to the first magnetic flux value MV1, the coupling strength CS1 becomes zero. At this point, the coupling is disconnected (off). Figure 20 As shown, the coupling strength CS1 changes when the magnetic flux MF1 changes. By controlling the magnetic flux MF1, the coupling strength CS1 can be controlled. For example, the range of change in coupling strength CS1 is approximately 20 MHz. That is, the coupling strength CS1 can be adjusted within the range of -20 MHz to 20 MHz. This action corresponds, for example, to the second action.

[0156] For example, in the second action, the magnetic flux Φ (magnetic flux MF1) is modulated at a frequency of "fb1-fb2". The envelope of the modulation can be, for example, pulsed. In this second action, the 2-qubit gating is a rotational gating that swaps the probabilities of the |01> state and the |10> state. In this rotational gating (probability-swapped rotational gating), the rotation angle corresponds to the rotation angle of the rotation matrix with respect to the probability amplitude vector.

[0157] In this way, the control unit 70 can control the magnetic flux Φ (magnetic flux MF1) in the space SP, so that the coupling strength CS1 between the first nonlinear element 50A and the second nonlinear element 50B changes.

[0158] Figure 21This is a graph illustrating the characteristics of the computing device according to the first embodiment.

[0159] Figure 21 The characteristics of the second action described above are illustrated. Figure 20 The horizontal axis represents the value obtained by dividing the gating rotation angle θ2 by π. This gating rotation angle θ2 corresponds to the rotation angle of the rotation matrix of the probability amplitude vector in probability-commutated rotational gating. The vertical axis represents the fidelity FT1. The gating time is approximately 12 ns. Figure 21 As shown, high-fidelity FT1 of over 99.98% can be obtained with high-speed gating. Figure 21 In the diagram, the gating at a gating rotation angle θ2 of 0.25π corresponds to the "square root of the iSWAP gating".

[0160] The control unit 70 is capable of performing at least one of the first and second operations. In the first operation, the control unit 70 performs a 2-qubit operation on the first nonlinear element 50A and the second nonlinear element 50B by varying the magnetic flux Φ between a first value and a second value larger than the first value. The first value is the value corresponding to the aforementioned first magnetic flux value Mv1 (0.5Φ0 × Mv1). The second value may also be substantially 0.5Φ0, for example. In the second operation, the control unit 70 performs a 2-qubit operation on the first nonlinear element 50A and the second nonlinear element 50B by modulating the magnetic flux Φ in an alternating manner.

[0161] The characteristics of the electronic circuits and computing devices involved in the embodiments will be described below.

[0162] The Lagrange operator of the system including the first nonlinear element 50A, the second nonlinear element 50B, and the third nonlinear element 50C (coupler) is expressed by the following first equation.

[0163]

[0164] The left side of Equation 1 is the Lagrange operator of a system including a coupler, a first nonlinear element 50A coupled to the coupler, and a second nonlinear element 50B coupled to the coupler.

[0165] The first term on the right-hand side of Equation 1 is the Lagrange operator for the first nonlinear element 50A. The second term on the right-hand side of Equation 1 is the Lagrange operator for the second nonlinear element 50B. The third term on the right-hand side of Equation 1 is the Lagrange operator for the coupler. The fourth term on the right-hand side of Equation 1 is the Lagrange operator representing the interaction between the coupler, the first nonlinear element 50A, and the second nonlinear element 50B.

[0166] The Lagrange operator for the first nonlinear element 50A is represented by the following second equation. In the second equation, "C1" is the capacitance of the first element capacitor 41.

[0167]

[0168] In equation 2, the reduced magnetic flux quantum is... It corresponds to 1 / (2π) times the magnetic flux quantum Φ0.

[0169] The Lagrange operator for the second nonlinear element 50B is represented by the following third equation. In the third equation, "C2" is the capacitance of the second element capacitor 42.

[0170]

[0171] The Lagrange operator representing the interaction between the coupler, the first nonlinear element 50A, and the second nonlinear element 50B is expressed by the following equation 4. In equation 4, “C c "This refers to the capacitance of the third capacitor 13 and the fourth capacitor 14 respectively."

[0172]

[0173] The Lagrange operator of the coupler is represented by the following equation 5. In equation 5, "C" represents the capacitance of the first capacitor 11 and the second capacitor 12, respectively.

[0174]

[0175] Here, Φ is the magnetic flux operator. Φ and the phase difference θ have a relationship expressed by the following equation (6).

[0176] φ=φ0θ …(6)

[0177] For the flux operator in the "+ mode" of the coupler It is represented by the following equation number 7.

[0178] φ c+ ≡φ c1 +φ c2 …(7)

[0179] For the flux operator of the "-mode" of the coupler It is represented by the following equation No. 8.

[0180] φ c- ≡φ c1 -φ c2 …(8)

[0181] In the 7th and 8th forms, This refers to the flux operator for the portion of the first Josephson junction 21 that includes the third nonlinear element 50C. In equations 7 and 8, It is the flux operator for the portion of the second Josephson junction 22 that includes the third nonlinear element 50C.

[0182] On the right side of equation 4 above, the signs are interchanged in terms 1 and 2. Coupling between qubits via ± mode is eliminated.

[0183] In equation 5 above, terms 1 and 2 on the right correspond to the "+ mode". Terms 3 through 6 on the right correspond to the "- mode". The "+ mode" corresponds to an LC resonator. In the "- mode", the frequency becomes variable through the magnetic flux Φ.

[0184] Thus, in this implementation, both "+ mode" and "- mode" exist simultaneously in the coupler. By utilizing the "- mode," a variable frequency can be obtained.

[0185] In the above description, for simplicity, the case where the first capacitor 11 and the second capacitor 12 have the same value (C) is explained. In the above description, for simplicity, the case where the capacitance of the third capacitor 13 and the fourth capacitor 14 are each the same value (C) is also explained. c The following will be explained in the following embodiments. In one embodiment, the capacitance of the first capacitor 11 may be different from that of the second capacitor 12. In another embodiment, the capacitance of the third capacitor 13 may be different from that of the fourth capacitor 14.

[0186] Figure 22 This is a schematic top view illustrating the electronic circuit according to the first embodiment.

[0187] like Figure 22As shown, the electronic circuit 130 of the embodiment includes a plurality of qubits 50b and a plurality of couplers 50c. The plurality of qubits 50b are arranged in a matrix, for example, in the X-Y plane. One of the plurality of couplers 50c is disposed between one of the plurality of qubits 50b and another of the plurality of qubits 50b. One of the plurality of qubits 50b is, for example, a first nonlinear element 50A. Another of the plurality of qubits 50b is, for example, a second nonlinear element 50B. One of the plurality of couplers 50c is, for example, a third nonlinear element 50C. One of the plurality of couplers 50c can be coupled to one of the plurality of qubits 50b (e.g., capacitive coupling). One of the plurality of couplers 50c can be coupled to another of the plurality of qubits 50b (e.g., capacitive coupling). The computing device 230 of the embodiment includes the electronic circuit 130. The structures of electronic circuits 110-117 and 120 can be applied to the electronic circuit 130. For example, the Josephson junctions (e.g., first element Josephson junction 51 and second element Josephson junction 52, etc.) included in multiple qubits 50b are disposed on the first surface F1. The Josephson junction circuits 53 included in each of the multiple couplers 50c are disposed on the second surface F2.

[0188] (Second Implementation)

[0189] Figure 23 of (a), Figure 23 (b) Figure 24 of (a), Figure 24 (b) Figure 25 (a) and Figure 25 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0190] The electronic circuit 140 according to the embodiment is provided with a first surface F1 to a sixth surface F6. Regarding the first surface F1 to the sixth surface F6, the following can be applied: Figure 6 The structure has been described. First surface F1 is one surface of the first substrate 81 (e.g., top). Second surface F2 is the other surface of the first substrate 81 (e.g., bottom). Second surface F2 extends away from first surface F1 in a first direction intersecting with first surface F1, along first surface F1. Third surface F3 is one surface of the second substrate 82 (e.g., top). Fourth surface F4 is the other surface of the second substrate 82 (e.g., bottom). Fourth surface F4 faces first surface F1. Fourth surface F4 is located between first surface F1 and third surface F3. Fifth surface F5 is one surface of the third substrate 83 (e.g., top). Sixth surface F6 is the other surface of the third substrate 83 (e.g., bottom). Fifth surface F5 faces second surface F2. Fifth surface F5 is located between sixth surface F6 and second surface F2.

[0191] Electronic circuit 140 includes a first nonlinear element 50A, a second nonlinear element 50B, and a third nonlinear element 50C. The first nonlinear element 50A includes a Josephson junction 51. (Example...) Figure 23 As shown in (a), the first element, Josephson junction 51, is disposed on the first surface F1. The second nonlinear element 50B includes the second element, Josephson junction 52. Figure 23 As shown in (b), the second element, Josephson junction 52, is disposed on the second face F2.

[0192] The third nonlinear element 50C includes a Josephson junction circuit 53. The third nonlinear element 50C can be coupled to the first nonlinear element 50A. The third nonlinear element 50C can be coupled to the second nonlinear element 50B.

[0193] In the electronic circuit 140, connections are also facilitated. For example, crosstalk between wirings can be reduced. Scalability is improved. Electronic circuits and computing devices with improved characteristics can be provided. For example, the gating operation of qubits becomes stable. For example, the stability of qubits is improved. The computing device 240 according to the embodiment includes the electronic circuit 140 and the control unit 70.

[0194] In the example of electronic circuit 140, at least a portion of the Josephson junction circuit 53 is disposed on one of the first surface F1 and the second surface F2. In this example, the Josephson junction circuit 53 is disposed on the second surface F2.

[0195] In electronic circuit 140, in addition to the structure described above, the structure of the electronic circuit according to the first embodiment can be applied.

[0196] like Figure 23 As shown in (a), in this example, a first element resonator 51O and a first element terminal 51T are provided on the first surface F1. Figure 23 As shown in (b), in this example, a second element resonator 52O and a second element terminal 52T are provided on the second surface F2. Figure 24 As shown in (a), in this example, a first counter electrode 51C and a first control terminal 51NT are provided on the third surface F3. Figure 24 As shown in (b), in this example, a first readout electrode 51R and a first control electrode 51N are provided on the fourth face F4.

[0197] like Figure 25 As shown in (a), in this example, a second counter electrode 52C, a second control terminal 52NT, and a first control conductive component 61 are provided on the fifth surface F5. Figure 25As shown in (b), in this example, a second readout electrode 52R and a second control electrode 52N are provided on the sixth surface F6. The first control conductive member 61 is connected to the control unit 70 via the first control conductive part 61u and the second control conductive part 61v (see reference). Figure 25 (b)). The second readout electrode 52R is connected to the control unit 70.

[0198] Figure 26 of (a), Figure 26 (b) Figure 27 of (a), Figure 27 (b) Figure 28 (a) and Figure 28 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0199] like Figure 26 As shown in (a), in the electronic circuit 141 according to the embodiment, the first element Josephson junction 51 is disposed on the first surface F1. Figure 26 As shown in (b), the second element, Josephson junction 52, is disposed on the second face F2. In this example, as Figure 26 As shown in (b), in this example, the Josephson junction circuit 53 is located on the second face F2. Figure 27 As shown in (a), a first element resonator 51O, a first element terminal 51T, a first counter electrode 51C, and a first control terminal 51NT are provided on the third surface F3. Figure 27 As shown in (b), a first readout electrode 51R and a first control electrode 51N are provided on the fourth surface F4.

[0200] like Figure 28 As shown in (a), a second element resonator 52O, a second element terminal 52T, a second counter electrode 52C, a second control terminal 52NT, and a first control conductive component 61 are provided on the fifth surface F5. Figure 28 As shown in (b), a second readout electrode 52R and a second control electrode 52N are provided on the sixth surface F6. The first control conductive member 61 is connected to the control unit 70 via the first control conductive part 61u and the second control conductive part 61v (see reference). Figure 28 (b)). The second readout electrode 52R is connected to the control unit 70.

[0201] Figure 29 (a) and Figure 29 (b) is a schematic top view illustrating the electronic circuit according to the second embodiment.

[0202] Figure 30 This is a schematic cross-sectional view illustrating the electronic circuit according to the second embodiment.

[0203] Figure 29 (b) is a perspective top view. Figure 29 (a) and Figure 29 (b) conceptually illustrates coupling (e.g., capacitive coupling). Figure 30 yes Figure 29 (a) and Figure 29 (b) is a cross-sectional view along line Z1-Z2.

[0204] like Figure 29 As shown in (a), the electronic circuit 150 involved in the embodiment includes a first nonlinear element 50A (e.g., a plurality of qubits). In this example, the plurality of first nonlinear elements 50A are arranged in a matrix, for example, along a first surface F1, which is along the X-Y plane. Figure 29 As shown in (a), multiple couplers 50c can also be provided on the first surface F1. One of the multiple couplers 50c provided on the first surface F1 can also couple one of the multiple first nonlinear elements 50A to another of the multiple first nonlinear elements 50A. Figure 29 In (a), the dashed line connecting one of the multiple couplers 50c and one of the multiple first nonlinear elements 50A corresponds to the capacitive coupling.

[0205] like Figure 29 As shown in (b), the electronic circuit 150 includes a plurality of second nonlinear elements 50B (e.g., a plurality of qubits). In this example, the plurality of second nonlinear elements 50B are arranged in a matrix, for example, along a second plane F2, which is along the X-Y plane. Figure 29 As shown in (b), multiple couplers 50c can also be provided on the second surface F2. One of the multiple couplers 50c provided on the second surface F2 can also couple one of the multiple second nonlinear elements 50B to another of the multiple second nonlinear elements 50B. Figure 29 In (b), the dashed line connecting one of the multiple couplers 50c and one of the multiple second nonlinear elements 50B corresponds to the capacitive coupling.

[0206] like Figure 29 As shown in (b), the electronic circuit 150 includes a third nonlinear element 50C (coupler). In this example, multiple third nonlinear elements 50C are provided. In this example, the third nonlinear element 50C is located on the second surface F2. In an embodiment, the third nonlinear element 50C may also be located on the first surface F1.

[0207] As already described, the first nonlinear element 50A includes the first element Josephson junction 51 (see reference). Figure 30 The second nonlinear element 50B includes the second element Josephson junction 52 (see reference). Figure 30The third nonlinear element 50C includes the Josephson junction circuit 53 (see reference). Figure 30 As already described, the Josephson junction circuit 53 may include a first Josephson junction 21, a second Josephson junction 22, and a third Josephson junction 23, etc.

[0208] like Figure 30 As shown, the first element, Josephson junction 51, is disposed on the first surface F1. The second element, Josephson junction 52, is disposed on the second surface F2. The second surface F2 extends away from the first surface F1 along the first surface F1 in a first direction D1 (e.g., the Z-axis direction) intersecting the first surface F1. In this example, the first surface F1 is one surface of the first substrate 81 (e.g., the top surface). The second surface F2 is the other surface of the first substrate 81 (e.g., the bottom surface).

[0209] The third nonlinear element 50C can be coupled to the first nonlinear element 50A, and the third nonlinear element 50C can be coupled to the second nonlinear element 50B. At least a portion of the Josephson junction circuit 53 is disposed on one of the first surface F1 and the second surface F2. In this example, the Josephson junction circuit 53 is disposed on the second surface F2.

[0210] In electronic circuit 150, electronic circuits and computing devices that can improve performance can also be provided. Computing device 250 includes the aforementioned electronic circuit 150.

[0211] In electronic circuit 150, for example, Josephson junction circuit 53 can be coupled to the first element Josephson junction 51. For example, Josephson junction circuit 53 can be coupled to the second element Josephson junction 52.

[0212] like Figure 30 As shown, in this example, at least a portion of the first element Josephson junction 51 overlaps with the second element Josephson junction 52 in the first direction D1 (e.g., the Z-axis direction). In an electronic circuit 150 as described above, for example, the first element Josephson junction 51 disposed on the first surface F1 can be coupled to the second element Josephson junction 52 that is closest to the first element Josephson junction 51 among a plurality of second element Josephson junctions 52 disposed on the second surface F2.

[0213] In this example, one of the plurality of second element Josephson junctions 52 overlaps with one of the plurality of first element Josephson junctions 51 in the first direction D1 (e.g., the Z-axis direction). The aforementioned one of the plurality of second element Josephson junctions 52 is coupled to the aforementioned one of the plurality of first element Josephson junctions 51 through a third nonlinear element 50C.

[0214] In this example, a connecting member 58v is provided. The connecting member 58v extends along a first direction D1 in the first substrate 81. Through the connecting member 58v, a first element Josephson junction 51 disposed on the first surface F1 is coupled to a third nonlinear element 50C (Josephson junction circuit 53) disposed on the second surface F2. The third nonlinear element 50C (Josephson junction circuit 53) disposed on the second surface F2 is coupled to a second element Josephson junction 52 disposed on the second surface F2.

[0215] In an embodiment, the first element Josephson junction 51 disposed on the first surface F1 can be coupled to a second element Josephson junction 52 among a plurality of second element Josephson junctions 52 disposed on the second surface F2 that is not closest to the first element Josephson junction 51. For example, as described below, the first element Josephson junction 51 disposed on the first surface F1 can be coupled to a third (or more) second element Josephson junction 52 among a plurality of second element Josephson junctions 52 disposed on the second surface F2 that is closest to the first element Josephson junction 51.

[0216] Figure 31 This is a schematic cross-sectional view illustrating the electronic circuit according to the second embodiment.

[0217] like Figure 31 As shown, in the electronic circuit 151 according to the embodiment, a plurality of second element Josephson junctions 52 are disposed on the second surface F2. A second direction D2 is followed from one of the plurality of second element Josephson junctions 52 (second element Josephson junction 52a) to another of the plurality of second element Josephson junctions 52 (second element Josephson junction 52b). The second direction D2 intersects the first direction D1 (e.g., the Z-axis direction).

[0218] The Josephson junction circuit 53 included in the third nonlinear element 50C is coupled to one of the plurality of second element Josephson junctions 52 (second element Josephson junction 52a). As already explained, the Josephson junction circuit 53 is coupled to the first element Josephson junction 51. The coupling is capacitive coupling. In this example, the Josephson junction circuit 53 is coupled to the first element Josephson junction 51 via wiring 58L (conductive component) and connection component 58v. The position of another of the plurality of second element Josephson junctions 52 in the second direction D2 (second element Josephson junction 52b) is located between the position of the first element Josephson junction 51 in the second direction D2 and the position of the aforementioned one of the plurality of second element Josephson junctions 52 in the second direction D2 (second element Josephson junction 52a).

[0219] That is, in electronic circuit 151, the first element Josephson junction 51 is coupled to a third (or more) second element Josephson junction 52 that is close to the first element Josephson junction 51 among a plurality of second element Josephson junctions 52. Other second element Josephson junctions 52 may exist between one of the plurality of second element Josephson junctions 52 coupled to the first element Josephson junction 51 and the first element Josephson junction 51. Computing device 251 includes the aforementioned electronic circuit 151.

[0220] Figure 32 This is a schematic cross-sectional view illustrating the electronic circuit according to the second embodiment.

[0221] like Figure 32 As shown, in the electronic circuit 152 according to the embodiment, the first element Josephson junction 51 and one of the plurality of second elements Josephson junctions 52 (second element Josephson junction 52a) are coupled through Josephson junction circuit 53. The coupling is capacitive coupling. For example, coupling is performed via wiring 58L and connection member 58V. Alternatively, a plurality of second elements Josephson junctions 52 (a plurality of second elements Josephson junctions 52b) may be provided between the first element Josephson junction 51 and one of the plurality of second elements Josephson junctions 52. The computing device 252 includes the above-described electronic circuit 152.

[0222] exist Figures 30-32 In the diagram, the dashed line connecting the first element, Josephson junction 51, and the connecting component 58V corresponds to the capacitor coupling. The dashed line connecting the second element, Josephson junction 52, and the Josephson junction circuit 53 corresponds to the capacitor coupling.

[0223] In electronic circuits 140, 141, and 150-152, the structures described in the first embodiment can be applied to the extent technically feasible.

[0224] Figure 33 This is a schematic diagram illustrating the electronic circuits and computing devices involved in the embodiment.

[0225] like Figure 33 As shown, in the electronic circuit 160 according to the embodiment, the Josephson junction circuit 53 includes a first inductor 31, a second inductor 32, and a third Josephson junction 23. The third nonlinear element 50C also includes a first conductive member 25a, a second conductive member 25b, and a third conductive member 25c. The first conductive member 25a connects the first inductor 31 to the third Josephson junction 23. The second conductive member 25b connects the second inductor 32 to the third Josephson junction 23. The third conductive member 25c connects the first inductor 31 to the second inductor 32. These connections can be, for example, electrical connections.

[0226] For example, the first conductive component 25a connects one end 31e of the first inductor 31 to one end 23e of the third Josephson junction 23. The second conductive component 25b connects one end 32e of the second inductor 32 to the other end 23f of the third Josephson junction 23. The third conductive component 25c connects the other end 31f of the first inductor 31 to the other end 32f of the second inductor 32.

[0227] In electronic circuit 160, the third Josephson junction 23 is disposed on the second surface F2. The first inductor 31 and the second inductor 32 may be disposed on the second surface F2. The structure of electronic circuit 160 may use the structures described with respect to electronic circuits 110-117, 120, 130, 140, 141, 150-152. Computing device 260 includes the above-described electronic circuit 160.

[0228] (Third Implementation)

[0229] The third embodiment relates to a method for manufacturing an electronic circuit.

[0230] Figure 34 (a)~ Figure 34 (i) is a schematic cross-sectional view illustrating a method for manufacturing an electronic circuit according to the third embodiment.

[0231] like Figure 34 As shown in (a), a first substrate 81 is prepared. The first substrate 81 includes a first surface F1 and a second surface F2.

[0232] like Figure 34 As shown in (b), a conductive portion 85 is formed on the first substrate 81. The conductive portion 85 is along a first direction (Z-axis direction) from the second surface F2 to the first surface F1. The conductive portion 85 can be a TSV, etc. The conductive portion 85 can be a first element conductive portion 51v and a second element conductive portion 52v, etc.

[0233] like Figure 34 As shown in (c), a conductive member 86a is formed on the first surface F1. The conductive member 86a can be at least a part of a capacitor included in the first nonlinear element 50A and the second nonlinear element 50B. At least a part of the conductive member 86a is electrically connected to the conductive portion 85.

[0234] like Figure 34 As shown in (d), a first element Josephson junction 51 and a second element Josephson junction 52 are formed on the first surface F1. Thus, a first nonlinear element 50A and a second nonlinear element 50B are formed on the first surface F1 of the first substrate 81. The first nonlinear element 50A includes the first element Josephson junction 51. The second nonlinear element 50B includes the second element Josephson junction 52.

[0235] like Figure 34 As shown in (e), a first component 88 including a recess 88d is prepared. Figure 34 As shown in (f), a first component 88 is provided. A first nonlinear element 50A and a second nonlinear element 50B are located between the first substrate 81 and the recess 88d. A support portion 88s may also be provided between the first surface F1 and the recess 88d. The distance between the first surface F1 and the recess 88d is stabilized by the support portion 88s.

[0236] like Figure 34 As shown in (g), a conductive member 86b is formed on the second surface F2. The conductive member 86b can be at least a part of a capacitor included in the third nonlinear element 50C, etc. At least a part of the conductive member 86b is electrically connected to the conductive portion 85.

[0237] like Figure 34 As shown in (h), a first Josephson junction 21, a second Josephson junction 22, and a third Josephson junction 23 are formed on the second surface F2. These Josephson junctions are included in the Josephson junction circuit 53 of the third nonlinear element 50C. Thus, in this manufacturing method, a third nonlinear element 50C including the Josephson junction circuit 53 is formed on the second surface F2 of the first substrate 81. The first surface F1 is located between the second surface F2 and the first component 88.

[0238] like Figure 34 As shown in (i), the first component 88 is removed. Thus, for example, electronic circuit 110 can be obtained.

[0239] Figure 35 (a)~ Figure 35 (i) is a schematic cross-sectional view illustrating a method for manufacturing an electronic circuit according to the third embodiment.

[0240] like Figure 35 As shown in (a), the substrate is prepared to become the first substrate 81. Figure 35 As shown in (b), a recess 81d is formed on the first surface F1 of the first substrate 81. The first substrate 81 includes a second surface F2. The first substrate 81 includes a protrusion 81p surrounding the recess 81d.

[0241] like Figure 35 As shown in (c), a conductive portion 85 is formed on the first substrate 81. The conductive portion 85 is along a first direction (Z-axis direction) from the second surface F2 to the first surface F1. The conductive portion 85 can be a TSV, etc. The conductive portion 85 can be a first element conductive portion 51v and a second element conductive portion 52v, etc.

[0242] like Figure 35As shown in (d), a conductive member 86a is formed on the first surface F1. The conductive member 86a can be at least a part of a capacitor included in the first nonlinear element 50A and the second nonlinear element 50B. At least a part of the conductive member 86a is electrically connected to the conductive portion 85.

[0243] like Figure 35 As shown in (e), a first element Josephson junction 51 and a second element Josephson junction 52 are formed on the first surface F1. Thus, a first nonlinear element 50A and a second nonlinear element 50B are formed on the first surface F1 of the first substrate 81. The first nonlinear element 50A includes the first element Josephson junction 51. The second nonlinear element 50B includes the second element Josephson junction 52.

[0244] like Figure 35 As shown in (f), a first component 88 is provided. A first nonlinear element 50A and a second nonlinear element 50B are located between the first substrate 81 and the first component 88. A support portion 88s may also be provided between the recess 81d of the first surface F1 and the first component 88. The distance between the recess 81d and the first component 88 is stabilized by the support portion 88s.

[0245] like Figure 35 As shown in (g), a conductive member 86b is formed on the second surface F2. The conductive member 86b can be at least a part of a capacitor included in the third nonlinear element 50C, etc. At least a part of the conductive member 86b is electrically connected to the conductive portion 85.

[0246] like Figure 35 As shown in (h), a first Josephson junction 21, a second Josephson junction 22, and a third Josephson junction 23 are formed on the second surface F2. These Josephson junctions are included in the Josephson junction circuit 53 of the third nonlinear element 50C. Thus, in this manufacturing method, a third nonlinear element 50C including the Josephson junction circuit 53 is formed on the second surface F2 of the first substrate 81. The first surface F1 is located between the second surface F2 and the first component 88.

[0247] like Figure 35 As shown in (i), the first component 88 is removed. Furthermore, the protrusion 81p of the first substrate 81 is removed. Thus, for example, an electronic circuit 110 can be obtained.

[0248] The implementation method may also include the following components (technical solutions).

[0249] (Component 1)

[0250] An electronic circuit, comprising:

[0251] The first nonlinear element includes a first element Josephson junction, the first element Josephson junction being disposed in the first region of the first surface including the first region and the second region;

[0252] The second nonlinear element includes a second element Josephson junction disposed in the second region; and

[0253] A third nonlinear element, comprising a Josephson junction circuit, at least a portion of which is disposed on a second surface, the second surface being disposed away from the first surface in a first direction intersecting the first surface and along the first surface, the third nonlinear element being capable of coupling with the first nonlinear element and the third nonlinear element being capable of coupling with the second nonlinear element.

[0254] (Component 2)

[0255] According to the electronic circuit described in configuration 1

[0256] It also has a first substrate,

[0257] The first surface is one surface of the first substrate.

[0258] The second side is the other side of the first substrate.

[0259] (Component 3)

[0260] According to the electronic circuit described in configuration 2

[0261] The Josephson junction circuit includes a first Josephson junction, a second Josephson junction, and a third Josephson junction.

[0262] The third nonlinear element further includes a first conductive component, a second conductive component, and a third conductive component.

[0263] The first conductive component connects one end of the first Josephson junction to one end of the third Josephson junction.

[0264] The second conductive component connects one end of the second Josephson junction to the other end of the third Josephson junction.

[0265] The third conductive component connects the other end of the first Josephson junction to the other end of the second Josephson junction.

[0266] The first Josephson junction, the second Josephson junction, the third Josephson junction, the first conductive component, the second conductive component, and the third conductive component form a ring.

[0267] The first nonlinear element can be coupled to the first conductive component.

[0268] The second nonlinear element can be coupled to the second conductive component.

[0269] (Component 4)

[0270] According to the electronic circuit described in configuration 3

[0271] It also includes a first element conductive portion extending along the first direction in the first substrate.

[0272] The conductive portion of the first element is electrically connected to the first nonlinear element, or is capable of coupling with the first nonlinear element.

[0273] The conductive portion of the first element is electrically connected to the first conductive component, or is capable of being coupled to the first conductive component.

[0274] (Component 5)

[0275] According to the electronic circuit described in configuration 3 or 4

[0276] It also includes a second element conductive portion extending along the first direction in the first substrate.

[0277] The conductive portion of the second element is electrically connected to the second nonlinear element, or can be coupled to the second nonlinear element.

[0278] The conductive portion of the second element is electrically connected to the second conductive component, or can be coupled to the second conductive component.

[0279] (Composition 6)

[0280] The electronic circuit according to any one of 3 to 5 further comprises:

[0281] The first element resonator, which is capable of coupling with the first nonlinear element; and

[0282] The first element terminal is capable of coupling with the first element resonator.

[0283] (Component 7)

[0284] According to the electronic circuit described in configuration 6

[0285] At least one of the following: at least a portion of the first element resonator, at least a portion of the first element terminal, at least a portion of the second element resonator, and at least a portion of the second element terminal is disposed on the first surface.

[0286] (Composition 8)

[0287] The electronic circuit according to configuration 7 further comprises:

[0288] The second substrate includes a third surface and a fourth surface, the fourth surface being opposite to the first surface and located between the first surface and the third surface;

[0289] A first opposing electrode, which is disposed on the fourth surface; and

[0290] The second opposing electrode is disposed on the fourth surface.

[0291] The first opposing electrode can be coupled to the terminal of the first element.

[0292] The second opposing electrode can be coupled to the second element terminal.

[0293] (Composition 9)

[0294] According to the electronic circuit described in configuration 8, it also includes:

[0295] The first readout electrode is disposed on the third surface; and

[0296] The first readout conductive portion extends along the first direction in the second substrate and electrically connects the first counter electrode to the first readout electrode.

[0297] (Composition 10)

[0298] According to the electronic circuit described in 8 or 9, it also includes:

[0299] A third substrate includes a fifth surface and a sixth surface, the fifth surface facing the second surface and located between the sixth surface and the second surface; and

[0300] A magnetic flux control unit, which is disposed on the fifth surface, is capable of controlling the magnetic flux of the space within the ring.

[0301] (Composition 11)

[0302] The electronic circuit according to any one of 1 to 9 further comprises:

[0303] The third substrate includes a fifth surface and a sixth surface, the fifth surface facing the second surface and the fifth surface located between the sixth surface and the second surface;

[0304] A first control conductive component, which is disposed on the fifth surface; and

[0305] A first control conductive portion extends along the first direction in the third substrate and is electrically connected to a portion of the first control conductive component.

[0306] (Composition 12)

[0307] The electronic circuit according to configuration 1 further comprises:

[0308] First substrate; and

[0309] 2nd substrate,

[0310] The first surface is one surface of the first substrate.

[0311] The second surface is one surface of the second substrate.

[0312] (Composition 13)

[0313] An electronic circuit, comprising:

[0314] The first nonlinear element includes a first element Josephson junction disposed on the first surface;

[0315] A second nonlinear element, comprising a second Josephson junction disposed on a second surface, the second surface exiting the first surface in a first direction intersecting the first surface and along the first surface; and

[0316] The third nonlinear element includes a Josephson junction circuit, which is capable of coupling with the first nonlinear element and with the second nonlinear element.

[0317] (Composition 14)

[0318] According to the electronic circuit described in configuration 13

[0319] At least a portion of the Josephson junction circuit is disposed on one of the first surface and the second surface.

[0320] (Composition 15)

[0321] According to the electronic circuit described in configuration 13 or 14

[0322] The Josephson junction circuit can be coupled to the first element, the Josephson junction.

[0323] The Josephson junction circuit can be coupled to the second element, the Josephson junction.

[0324] Multiple Josephson junctions of the second element are disposed on the second surface.

[0325] From one of the plurality of second element Josephson junctions to another of the plurality of second element Josephson junctions along a second direction that intersects the first direction,

[0326] The third element, the Josephson junction, can be coupled to one of the plurality of second element Josephson junctions.

[0327] The position of another of the plurality of second element Josephson junctions in the second direction is located between the position of the first element Josephson junction in the second direction and the position of one of the plurality of second element Josephson junctions in the second direction.

[0328] (Composition 16)

[0329] According to the electronic circuit described in any one of 13 to 15,

[0330] The Josephson junction circuit includes a first Josephson junction, a second Josephson junction, and a third Josephson junction.

[0331] The third nonlinear element further includes a first conductive component, a second conductive component, and a third conductive component.

[0332] The first conductive component connects one end of the first Josephson junction to one end of the third Josephson junction.

[0333] The second conductive component connects one end of the second Josephson junction to the other end of the third Josephson junction.

[0334] The third conductive component connects the other end of the first Josephson junction to the other end of the second Josephson junction.

[0335] The first Josephson junction, the second Josephson junction, the third Josephson junction, the first conductive component, the second conductive component, and the third conductive component form a ring.

[0336] The first nonlinear element can be coupled to the first conductive component.

[0337] The second nonlinear element can be coupled to the second conductive component.

[0338] (Composition 17)

[0339] According to the electronic circuit described in configuration 11 or 13

[0340] The Josephson junction circuit includes a first inductor, a second inductor, and a third Josephson junction.

[0341] The third nonlinear element further includes a first conductive component, a second conductive component, and a third conductive component.

[0342] The first conductive component connects one end of the first inductor to one end of the third Josephson junction.

[0343] The second conductive component connects one end of the second inductor to the other end of the third Josephson junction.

[0344] The third conductive component connects the other end of the first inductor to the other end of the second inductor.

[0345] The first Josephson junction, the second Josephson junction, the third Josephson junction, the first conductive component, the second conductive component, and the third conductive component form a ring.

[0346] The first nonlinear element can be coupled to the first conductive component.

[0347] The second nonlinear element can be coupled to the second conductive component.

[0348] (Composition 18)

[0349] According to any one of the electronic circuits described in 1 to 17

[0350] It also includes a first control terminal, which can be subjected to a first control signal to control the first nonlinear element.

[0351] (Composition 19)

[0352] According to any one of the electronic circuits described in 3 to 9, 16, and 17,

[0353] It also includes a magnetic flux control unit capable of controlling the magnetic flux of the space within the ring.

[0354] (Composition 20)

[0355] A computing device comprising:

[0356] Constitutes the electronic circuit described in 10 or 19; and

[0357] Control Department

[0358] The magnetic flux control unit includes a first control conductive unit.

[0359] The control unit is capable of providing a magnetic flux control signal to the first control conductive unit.

[0360] (Composition 21)

[0361] According to the computing device described in configuration 20

[0362] The coupling strength between the first nonlinear element and the second nonlinear element varies according to the magnetic flux in the space.

[0363] (Composition 22)

[0364] According to the computing device described in configuration 20 or 21

[0365] The third nonlinear element is capable of resonating in multiple modes.

[0366] The resonant frequency of each of the plurality of modes is higher than the resonant frequency of the first nonlinear element, higher than the resonant frequency of the second nonlinear element, and lower than the sum of the resonant frequencies of the first nonlinear element and the second nonlinear element.

[0367] (Composition 23)

[0368] According to the computing device comprising any one of 20 to 22,

[0369] The control unit is capable of performing at least one of the first action and the second action.

[0370] In the first operation, the control unit performs 2-qubit operation of the first nonlinear element and the second nonlinear element by varying the magnetic flux between a first value and a second value different from the first value.

[0371] In the second operation, the control unit modulates the magnetic flux in an alternating manner to perform the two-qubit operation of the first nonlinear element and the second nonlinear element.

[0372] (Composition 24)

[0373] A method for manufacturing an electronic circuit, comprising:

[0374] A first nonlinear element and a second nonlinear element are formed on a first surface of a first substrate, wherein the first nonlinear element includes a first element Josephson junction, and the second nonlinear element includes a second element Josephson junction;

[0375] A first component including a recess is provided, wherein a first nonlinear element and a second nonlinear element are located between the first substrate and the recess;

[0376] A third nonlinear element, including a Josephson junction circuit, is formed on the second surface of the first substrate, the first surface being located between the second surface and the first component.

[0377] (Composition 25)

[0378] A method for manufacturing an electronic circuit, comprising:

[0379] A first nonlinear element and a second nonlinear element are formed in a recess on a first surface of a first substrate. The first nonlinear element includes a first element Josephson junction, and the second nonlinear element includes a second element Josephson junction.

[0380] A first component is provided, wherein the first nonlinear element and the second nonlinear element are located between the first substrate and the first component;

[0381] A third nonlinear element, including a Josephson junction circuit, is formed on the second surface of the first substrate, the first surface being located between the second surface and the first component.

[0382] According to the implementation method, electronic circuits and computing devices that can improve controllability can be provided.

[0383] The embodiments of the present invention have been described above with reference to examples. However, the present invention is not limited to these examples. For example, any specific structure of the various elements, such as nonlinear elements, Josephson junctions, capacitors, and conductive components included in an electronic circuit or computing device, is included within the scope of the present invention as long as it can be appropriately selected by those skilled in the art from the known range to similarly implement the present invention and obtain the same effects.

[0384] Any technical solution obtained by combining any two or more elements of the various examples within the scope of technical feasibility, as long as it contains the spirit of the present invention, is also included within the scope of the present invention.

[0385] All electronic circuits and computing devices that can be implemented by those skilled in the art with appropriate design modifications based on the electronic circuits and computing devices described above as embodiments of the present invention, provided that they contain the spirit of the present invention, are also within the scope of the present invention.

[0386] Those skilled in the art can conceive of various modifications and alterations within the scope of the present invention, and such modifications and alterations should also be considered to fall within the scope of the present invention.

[0387] Several embodiments of the present invention have been described above, but these embodiments are merely illustrative and not intended to limit the scope of the invention. These new embodiments can be implemented in a wide variety of other ways, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included within the scope and spirit of the invention, and are included within the scope of the invention as described in the claims and its equivalents.

Claims

1. An electronic circuit, comprising: The first nonlinear element includes a first element Josephson junction, the first element Josephson junction being disposed in the first region of the first surface including the first region and the second region; The second nonlinear element includes a second element Josephson junction disposed in the second region; and A third nonlinear element includes a Josephson junction circuit, at least a portion of which is disposed on a second surface. The second surface extends from and along the first surface in a first direction intersecting the first surface. The third nonlinear element is coupled to the first nonlinear element and is also coupled to the second nonlinear element. The Josephson junction circuit includes a first Josephson junction, a second Josephson junction, and a third Josephson junction. The third nonlinear element further includes a first conductive component, a second conductive component, and a third conductive component. The first conductive component connects one end of the first Josephson junction to one end of the third Josephson junction. The second conductive component connects one end of the second Josephson junction to the other end of the third Josephson junction. The third conductive component connects the other end of the first Josephson junction to the other end of the second Josephson junction. The first Josephson junction, the second Josephson junction, the third Josephson junction, the first conductive component, the second conductive component, and the third conductive component form a ring. The first nonlinear element can be coupled to the first conductive component. The second nonlinear element can be coupled to the second conductive component.

2. The electronic circuit according to claim 1 further comprises: First substrate; and The first element has a conductive portion that extends along the first direction in the first substrate. The first surface is one surface of the first substrate. The second side is the other side of the first substrate. The conductive portion of the first element is electrically connected to the first nonlinear element, or is capable of coupling with the first nonlinear element. The conductive portion of the first element is electrically connected to the first conductive component, or is capable of being coupled to the first conductive component.

3. The electronic circuit according to claim 1 further comprises: The first element resonator, which is capable of coupling with the first nonlinear element; and The first element terminal is capable of coupling with the first element resonator.

4. The electronic circuit according to claim 1 further comprises: A third substrate includes a fifth surface and a sixth surface, the fifth surface facing the second surface and located between the sixth surface and the second surface; and A magnetic flux control unit, which is disposed on the fifth surface, is capable of controlling the magnetic flux of the space within the ring.

5. A computing device comprising: The electronic circuit according to claim 1; and Control Department The electronic circuit includes a magnetic flux control unit capable of controlling the magnetic flux of the space within the ring. The magnetic flux control unit includes a first control conductive unit. The control unit is capable of providing a magnetic flux control signal to the first control conductive unit.

6. The computing device according to claim 5, The control unit is capable of performing at least one of the first action and the second action. In the first operation, the control unit performs 2-qubit operation of the first nonlinear element and the second nonlinear element by varying the magnetic flux between a first value and a second value different from the first value. In the second operation, the control unit modulates the magnetic flux in an alternating manner to perform the two-qubit operation of the first nonlinear element and the second nonlinear element.

7. A method for manufacturing an electronic circuit, comprising: A first nonlinear element and a second nonlinear element are formed on a first surface of a first substrate, wherein the first nonlinear element includes a first element Josephson junction, and the second nonlinear element includes a second element Josephson junction; A first component including a recess is provided, wherein a first nonlinear element and a second nonlinear element are located between the first substrate and the recess; A third nonlinear element, including a Josephson junction circuit, is formed on the second surface of the first substrate, the first surface being located between the second surface and the first component. The Josephson junction circuit includes a first Josephson junction, a second Josephson junction, and a third Josephson junction. The third nonlinear element further includes a first conductive component, a second conductive component, and a third conductive component. The first conductive component connects one end of the first Josephson junction to one end of the third Josephson junction. The second conductive component connects one end of the second Josephson junction to the other end of the third Josephson junction. The third conductive component connects the other end of the first Josephson junction to the other end of the second Josephson junction. The first Josephson junction, the second Josephson junction, the third Josephson junction, the first conductive component, the second conductive component, and the third conductive component form a ring. The first nonlinear element can be coupled to the first conductive component. The second nonlinear element can be coupled to the second conductive component.

8. A method for manufacturing an electronic circuit, comprising: A first nonlinear element and a second nonlinear element are formed in a recess on a first surface of a first substrate. The first nonlinear element includes a first element Josephson junction, and the second nonlinear element includes a second element Josephson junction. A first component is provided, wherein the first nonlinear element and the second nonlinear element are located between the first substrate and the first component; A third nonlinear element, including a Josephson junction circuit, is formed on the second surface of the first substrate, the first surface being located between the second surface and the first component. The Josephson junction circuit includes a first Josephson junction, a second Josephson junction, and a third Josephson junction. The third nonlinear element further includes a first conductive component, a second conductive component, and a third conductive component. The first conductive component connects one end of the first Josephson junction to one end of the third Josephson junction. The second conductive component connects one end of the second Josephson junction to the other end of the third Josephson junction. The third conductive component connects the other end of the first Josephson junction to the other end of the second Josephson junction. The first Josephson junction, the second Josephson junction, the third Josephson junction, the first conductive component, the second conductive component, and the third conductive component form a ring. The first nonlinear element can be coupled to the first conductive component. The second nonlinear element can be coupled to the second conductive component.

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