Method of mounting and structure of elastic electric contact terminal

Abstract

Disclosed is a method for mounting an elastic electric contact terminal and a mounting structure that can maintain reliable electrical connection between target objects even when a crack occurs in a metal layer of the electric contact terminal. In the electric contact terminal, a solder layer is sandwiched by a soldering portion of a lower portion of both sides of the metal layer, and the soldering portion is mounted above a conductive pattern formed in a circuit board. A portion of the solder layer rises along a side surface of the electric contact terminal to form a side surface solder layer. The length of the metal layer is greater than the length of the side surface solder layer.

Description

Technical Field

[0001] This invention relates to a mounting structure and mounting method for a flexible electrical contact terminal that can be soldered by surface mounting, and more particularly to a technology that can reliably connect opposing targets in the vertical direction even if cracks are generated in the metal layer of the electrical contact terminal due to pressing after soldering. Background Technology

[0002] Typically, flexible electrical contacts that can be soldered via surface mount technology need to be vacuum-pickupable, have low resistance, excellent resilience based on elasticity, and be able to withstand the soldering temperature.

[0003] In particular, when the electrical contact terminal is sandwiched between two conductive targets facing each other in the vertical direction and the electrical contact terminal is pressed against the target in the vertical direction, the electrical contact terminal should be electrically connected to the target with low resistance.

[0004] Such electrical contact terminals include the applicant's Korean patents 10-1001354, 10-1711013, 10-1735656, 10-2038412 and 10-2331990, as well as Korean utility model 20-0442316, etc.

[0005] Figure 1 a) and Figure 1 b) are front and side views, respectively, showing an example of a mounting structure for an existing flexible electrical contact terminal.

[0006] As shown in the enlarged circle, the electrical contact terminal 200 consists of a tubular elastic core 210 with a through hole 215 formed in the length direction inside, a heat-resistant polymer film 230 that surrounds the adhesive core 210 with an adhesive layer 220 sandwiched in it, and a metal layer 240 formed on the outer surface of the polymer film 230.

[0007] If the upper part of the vacuum pick-up electrical contact terminal 200 is placed on the solder paste above the conductive pattern 20 of the circuit board 10 which is separated along the length direction in a manner corresponding to the solder paste 245 and reflow soldering is performed, the solder paste adhered to the metal layer 240 is cooled after being melted and becomes the solder layer 30, thereby bonding the conductive pattern 20 and the metal layer 240 while soldering and mounting.

[0008] If the welded electrical contact terminal 200 of such a structure is pressed by pressure from the vertical direction of the target object above, the core 210 will be folded or stressed in places where it is easy to expand to the side due to the applied force or where stress is concentrated.

[0009] The location where the core 210 is folded or where external forces are concentrated varies depending on the size and shape of the core 210 and the size or shape of the through hole 215 formed in the core 210.

[0010] Furthermore, the lower parts on both sides of the metal layer 240 are fixed by the solder layer 30, and the solder layer 30 formed above the side of the metal layer by the rise of the solder paste is not elastic and has high strength. Therefore, the force pressed on the boundary where the metal layer 240 and the solder layer 30 meet is concentrated.

[0011] Furthermore, the core 210 and the polymer film 230 are bonded together by the adhesive layer 220. Therefore, when the core 210 is folded or stressed at a certain location, the corresponding or adjacent portions of the polymer film 230 and the metal layer 240 are also folded or stressed.

[0012] When stress is repeatedly concentrated due to repeated folding caused by such pressing, the metal layer 240 in these areas is prone to cracking.

[0013] Especially when pressing repeatedly, such as Figure 1 As shown in b), at the boundary between the solder layer 30, which is soldered above the side of the metal layer 240, and the metal layer 240, cracks 242 may be generated in the metal layer 240 along the length direction.

[0014] At the boundary between the solder layer 30 and the metal layer 240, if the metal layer 240 is cut off along its entire length by means of a crack 242 in the metal layer 240, the electrical connection of the electrical contact terminal 200 may be broken in the vertical direction. If it is partially connected without being cut off along its entire length, the resistance of the electrical contact terminal 200 in the vertical direction will increase.

[0015] That is, after fixing the electrical contact terminal 200 by the lower part of both sides of the metal layer 240 of the soldered electrical contact terminal 200, if the electrical contact terminal 200 is pressed in the vertical direction, more force will be concentrated at the boundary where the metal layer 240 meets the solder because the solder layer 30 has no elasticity. Therefore, the metal layer 240 in this part is easily cut off, and the resistance along the vertical direction may change.

[0016] In particular, in order to make it difficult for the electrical contact terminal 200 to be separated from the circuit board by external force, the solder strength of the electrical contact terminal 200 should be good. Therefore, preferably, the boundary where the solder layer 30 and the metal layer 240 meet is located at a predetermined height from the lower end of the electrical contact terminal 200 to the side. In this case, if the electrical contact terminal 200 is pressed repeatedly, the force is concentrated at the boundary where the solder layer 30 and the metal layer 240 meet on the side, which may cause cracks in the metal layer 240 at that location.

[0017] If the solder layer 30 is not formed on the side portion of the metal layer 240 that constitutes the height of the electrical contact terminal 200, but only on the bottom surface of the metal layer 240, the welding strength of the electrical contact terminal 200 is weak. In particular, when the height of the electrical contact terminal 200 is high and the width is greater than the length, the welding strength of the electrical contact terminal 200 is even weaker.

[0018] For example, if the solder layer 30 is not formed on the side of the metal layer 240 but only on the bottom surface of the metal layer 240, the final welded area of ​​the metal layer 240 is narrow and the weld strength is weak. In particular, if the height of the electrical contact terminal 200 is high, there is a disadvantage that the electrical contact terminal 200 is easily separated from the conductive pattern 20 by the force applied from the side.

[0019] Therefore, in the past, research and development have been carried out to prevent the metal layer 240 from cracking at the boundary where the solder layer 30 and the metal layer 240 of the electrical contact terminal 200 meet. However, no alternative solution has been proposed that can stably connect the opposite target object to the electrical contact terminal 200 even if the electrical contact terminal 200 is repeatedly pressed and cracks are generated in the metal layer 240. Summary of the Invention

[0020] The purpose of this invention is to provide a mounting structure for electrical contact terminals that prevents a significant increase in the vertical resistance of the electrical contact terminals even when cracks are generated in the metal layer due to repeated pressing in the vertical direction.

[0021] Another object of the present invention is to provide a method for mounting electrical contact terminals such that even when the electrical contact terminals, which are tall and wider than long, are repeatedly pressed, the electrical connection will not be completely broken in the vertical direction or the resistance will increase significantly, and the welding strength is strong.

[0022] Another objective of this invention is to provide a mounting structure and mounting method for electrical contact terminals that are easy to modify and have low modification costs for the circuit board at the soldering location.

[0023] According to one aspect of the present invention, a method for mounting a flexible electrical contact terminal is provided. As a method for mounting a flexible electrical contact terminal onto a circuit board, the flexible electrical contact terminal comprises an elastic core, a heat-resistant polymer film continuously surrounding and bonding the core along the length direction of the core with an adhesive layer sandwiched between them, and a metal layer continuously formed on the outer surface of the polymer film. The method is characterized by comprising the following steps: applying solder paste over a conductive pattern formed on the circuit board; mounting solder portions including the lower portions of both sides of the metal layer of the electrical contact terminal in a manner placed above the solder paste, and performing reflow soldering; and melting the solder paste in the solder portions by the soldering and bonding it with the metal layer to form a main solder layer, wherein a portion of the solder paste rises along the side of the electrical contact terminal to form a side solder layer, wherein the length of the applied solder paste is less than the length of the metal layer.

[0024] Preferably, the length of the conductive pattern is greater than or equal to the length of the metal layer, and greater than the length of the solder paste.

[0025] According to another aspect of the present invention, a mounting structure for a flexible electrical contact terminal is provided as a mounting structure for mounting a flexible electrical contact terminal to a circuit board, wherein the flexible electrical contact terminal is composed of an elastic core, a heat-resistant polymer film that is continuously sandwiched with an adhesive layer along the length direction of the core and surrounds and adheres the core, and a metal layer formed on the outer surface of the polymer film, and the flexible electrical contact terminal can be soldered by surface mounting, characterized in that, in the electrical contact terminal, a soldering portion including the lower surfaces of both sides in the width direction of the metal layer is sandwiched between a main solder layer formed by applying solder paste above a conductive pattern formed on the circuit board and mounted above the conductive pattern formed on the circuit board, a portion of the main solder layer rising along the side of the metal layer to form a side solder layer, and the length of the metal layer is greater than the length of the side solder layer.

[0026] Preferably, the conductive pattern is composed of a single body, and the main solder layers are formed separately from each other along the solder portion of the metal layer above the conductive pattern, or are formed separately from each other along the solder portion of the metal layer, with the main solder layers respectively formed above the conductive pattern.

[0027] According to another aspect of the present invention, a mounting structure for a flexible electrical contact terminal is provided as a mounting structure for mounting a flexible electrical contact terminal onto a mounting pattern of a circuit board. The flexible electrical contact terminal comprises a flexible core, a heat-resistant polymer film sandwiched with an adhesive layer and surrounding and bonding the core, and a metal layer formed on the outer surface of the polymer film. The flexible electrical contact terminal is capable of being soldered by surface mounting. The metal layer has a length greater than the length of a main solder layer formed above the conductive pattern, thereby forming a contact portion without the main solder layer at at least one end of the metal layer. If the electrical contact terminal is pressed down from above, the contact portion contacts the conductive pattern and becomes electrically connected.

[0028] Preferably, the contact portion may be formed at the lower part of both ends of the metal layer, and the two ends of the conductive pattern may protrude and extend from both ends of the metal layer.

[0029] Preferably, the contact portion can be separated from the conductive pattern by a predetermined gap by the main solder layer, and the length of the contact portion can be the length that enables the contact portion to contact the conductive pattern when the electrical contact terminal is pressed by 10%.

[0030] According to the present invention, even if cracks are generated in the metal layer at the location where the metal layer on the side of the electrical contact terminal meets the side solder layer due to repeated pressing of the electrical contact terminal, the side solder layer will not be formed or will be formed less at both ends of the metal layer on the side of the electrical contact terminal, so that the resistance in the vertical direction of the electrical contact terminal will not increase significantly.

[0031] Furthermore, a side solder layer is formed in the central part of the metal layer of the electrical contact terminal, resulting in strong welding strength.

[0032] Furthermore, by applying external pressure, the portion of the metal layer longer than the solder pattern connects to the conductive pattern without solder, thus providing a reliable electrical connection.

[0033] Furthermore, a single conductive pattern is formed on the circuit board, and a solder paste-based pattern is separated on it, which has the advantages of easy modification of the soldered parts and low modification cost. Attached Figure Description

[0034] Figure 1 a) and Figure 1 b) is a front view and a side view showing an example of a mounting structure for an existing flexible electrical contact terminal, respectively.

[0035] Figure 2 This shows the state of being fitted with a flexible electrical contact terminal according to an embodiment of the present invention.

[0036] Figure 3 a) and Figure 3 b) shows the before and after pressing respectively.

[0037] Figure 4 a) and Figure 4 b) shows the case of applying solder paste on the conductive pattern. Detailed Implementation

[0038] The technical terms used in this invention are for illustrative purposes only and are not intended to limit the invention. Furthermore, unless otherwise specifically defined herein, the technical terms used in this invention should be interpreted as meaning commonly understood by one of ordinary skill in the art, and should not be interpreted as overly broad or overly narrow meanings.

[0039] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0040] Figure 2 This illustrates the state in which a flexible electrical contact terminal according to an embodiment of the present invention is mounted. Figure 3 a) and b) of 3 show the situation before and after being pressed, respectively.

[0041] Electrical contact terminal 200 has as follows Figure 1 The structure shown comprises a tube-shaped elastic core 210 with through holes formed in the length direction, a heat-resistant polymer film 230 that surrounds the adhesive core 210 in the width direction with an adhesive layer sandwiched in it, and a metal layer 240 formed on the outer surface of the polymer film 230.

[0042] Such electrical contact terminals 200 are described in the aforementioned Korean patents 10-1001354, 10-1711013, 10-1735656, 10-2038412 and 10-2331990, etc.

[0043] In this embodiment, the case in which a through hole is formed in the elastic core 210 is described as an example, but it is not limited to this, and may include foamed rubber with heat resistance corresponding to welding and without a through hole.

[0044] Furthermore, the portion of the solder joint 245 that includes the lower portions on both sides of the metal layer 240 and is soldered to the upper portion of the conductive pattern 20 on the circuit board 10, i.e., the solder joint 245, can be shaped as follows in this embodiment: Figure 1 The shape shown is rounded, but not limited to it; it can also be roughly planar.

[0045] For example, when the core 210 is made of foamed rubber, the bottom surface of the electrical contact terminal 200 is generally flat, and the welding part 245 can also be flat.

[0046] The metal layer 240 formed on the outer surface of the polymer film 230 can be formed by sputtering metal onto the polymer film 230 and plating copper, or by curing after casting liquid polymer resin onto copper foil, or by bonding copper foil to the polymer film using an adhesive.

[0047] If the solder portion 245 of the metal layer 240 of the electrical contact terminal is pressed and arranged on the solder paste coated on the conductive pattern 20 separately formed on the circuit board 10 by vacuum pickup and reflow soldering is performed, the liquid molten solder paste is cooled between the lower surface of the metal layer 240 and the conductive pattern 20, thereby forming a solid main solder layer 30, and rises along the side of the metal layer 240 of the electrical contact terminal 200 and is cooled, forming a solid side solder layer 32.

[0048] Here, the conductive pattern 20 is usually referred to as a footprint or land pattern, and serves to electrically connect electronic components mounted opposite to the circuit board by soldering.

[0049] In the following description, for ease of understanding, the portion formed by the cooling of solder paste between the lower surface of the metal layer 240 and the upper surface of the conductive pattern 20 is referred to as the main solder layer 30, and the portion formed by the cooling of solder paste rising along the side of the electrical contact terminal 200 above the metal layer 240 is referred to as the side solder layer 32.

[0050] Figure 4 a) and Figure 4 b) shows examples of solder paste being applied over a conductive pattern.

[0051] Reference Figure 4 (a) Solder paste 31 is applied over a separate conductive pattern 20, and the length of the conductive pattern 20 is formed to be greater than the length of the solder paste 31.

[0052] In other words, each conductive pattern 20 is positioned at a predetermined distance from the two ends of the solder paste 31, and the conductive patterns 20 without solder paste 31 are exposed in the spaced-out portion.

[0053] Solder paste 31 is applied over each conductive pattern 20 and is formed in a symmetrical manner to facilitate reflow soldering.

[0054] like Figure 4 As shown in a), if the conductive pattern 20 is to be remade in order to minimize cracks in the metal layer 240 or to improve the weld strength, it may be very expensive.

[0055] For example, the soldering pattern coated on the solder paste 31 is formed using a metal mask. Therefore, if the soldering pattern is changed, the soldering pattern can be modified simply by replacing the corresponding metal mask. Conversely, if the conductive pattern 20 is to be replaced, the entire circuit board 10 needs to be replaced.

[0056] In this regard, such as Figure 4 As shown in b), when a single conductive pattern 22 is formed and solder paste 31 is separated and coated thereon, it is easy to minimize the generation of cracks when the electrical contact terminal 200 is pressed, and it is easy to provide a solder pattern with suitable solder strength.

[0057] Furthermore, even with the application of a single conductive pattern 22, the solder paste 31 is also applied separately, and the lower surface of the metal layer 240 of the electrical contact terminal 200 is also separated, thereby allowing the electrical contact terminal 200 to be reliably reflow soldered.

[0058] The thickness of the gel solder paste 31 is approximately 0.08 mm to 0.15 mm, and its width is equal to or less than the width of the conductive pattern 20.

[0059] According to the present invention, the length of the side solder layer 32 formed along the length direction of the side of the metal layer 240 is less than the length of the metal layer 240 of the electrical contact terminal 200.

[0060] The specific explanation is as follows, such as Figure 3 As shown in a), when the length of the metal layer 240 is L and the length of the side solder layer 32 is l, the length of the side solder layer 32 is less than the length of the metal layer 240 (L>l).

[0061] Reference Figure 3 (a) The two ends of the metal layer 240 are separated from the two ends of the side solder layer 32, and no side solder layer 32 is formed between them.

[0062] Unlike this embodiment, one end of the metal layer 240 may be separated from one end of the side solder layer 32, and the side solder layer 32 may not be formed between them, and the other end of the metal layer 240 may be aligned with the other end of the side solder layer 32.

[0063] In other words, it is important that at least one end of the metal layer 240 is separated from one end of the side solder layer 32 so that the side solder layer 32 is not formed between them.

[0064] In terms of manufacturing process, assuming that solder paste 31 is coated with a conventional thickness across the entire width of conductive pattern 20, the length of solder paste 31 above conductive pattern 20 is formed to be less than the length of metal layer 240 (i.e., electrical contact terminal 200). In other words, considering the diffusion of solder paste 31 along its length and its rise along its sides in the height direction, making the length of solder paste 31 less than the length of metal layer 240 ultimately allows the length of side solder layer 32 to be less than the length of metal layer 240.

[0065] Preferably, taking into account the width and length of the electrical contact terminal 200, the length of the solder paste 31 can be applied to be 0.4 mm to 4 mm shorter than the length of the metal layer 240, but is not limited thereto.

[0066] For example, when the length of the electrical contact terminal 200 is 2 mm, the length of the solder paste 31 can be 1.8 mm to 1.4 mm. Preferably, during reflow soldering, the middle part of the electrical contact terminal 200 in the length direction is located in the middle part of the solder paste 31 in the length direction so that the electrical contact terminal 200 remains balanced.

[0067] When the metal layer 240 is tin (Sn), silver (Ag) or gold (Au), especially when it is gold (Au), when the solder paste 31 is reflow soldered, the solder paste 31 rises a lot along the side of the metal layer 240 to form a side solder layer 32. Therefore, the conductive pattern 20, solder paste 31 and the size of the metal layer can be selected and provided according to the metal type of the metal layer 240.

[0068] As described above, the length of the metal layer 240 of the electrical contact terminal 200 is longer than the length of the solder paste 31 coated on the conductive pattern 20.

[0069] Furthermore, the conductive pattern 20 may be formed to be longer than the length of the metal layer 240, with at least one of the two ends of the conductive pattern 20 protruding longer than the end of the metal layer 240.

[0070] As in the above embodiment, the solder paste applied above the conductive pattern 20 by soldering is melted and bonded to the metal layer 240 to form the main solder layer 30, and a portion of the solder paste rises along the side of the electrical contact terminal 200 to form the side solder layer 32.

[0071] Reference Figure 3 (a) A solder layer is formed with a thickness of approximately 0.05 mm, so that in the conductive pattern 20, the metal layer 240 corresponding to the portion not coated with solder paste can form a predetermined gap 244 with the conductive pattern 20.

[0072] Therefore, if cracks 242 in the metal layer 240 are generated at the boundary where the side solder layer 32 and the metal layer 240 meet due to repeated pressing of the electrical contact terminal 200, the resistance between the metal layer 240 and the conductive pattern 20 may increase significantly.

[0073] According to this embodiment, such as Figure 3 As shown in b), if the electrical contact terminal 200 is pressed from above by an external force, the metal layer portion (i.e., the contact portion 241) corresponding to the portion of the conductive pattern 20 that is not coated with solder paste 31 (in other words, the portion where the side solder layer 32 is not formed) will be pressed. Figure 3 (b) is represented by a dashed quadrilateral and is electrically connected to the top of the conductive pattern 20.

[0074] In particular, by forming a conductive pattern 20 that is longer than the metal layer 240 and protrudes from the end of the metal layer 240, the contact portion 241 can be stably and reliably electrically connected to the conductive pattern 20.

[0075] The length of the contact portion 241 is not particularly limited, and can be the length that allows the metal layer 240 to make direct contact with the conductive pattern 20 for electrical connection when the electrical contact terminal 200 is compressed by about 10% or more.

[0076] In this embodiment, an example is given where a crack 242 is generated at the entire boundary portion where the side solder layer 32 is connected to the metal layer 240, and the electrical path through the side solder layer 32 in the metal layer 240 is completely disconnected.

[0077] However, the side solder layer 32 is formed at a relatively low height, so that even if the electrical contact terminal 200 is pressed repeatedly, cracks will not be generated at the boundary between the metal layer 240 and the side solder layer 32 on both sides of the side solder layer 32.

[0078] In this case, in addition to the electrical path formed by the metal layer 240 directly contacting the conductive pattern 20 through the contact portion 241 of the metal layer 240, electrical paths based on the metal layer 240 and the side solder layer 32 are also provided on both sides of the side solder layer 32 where no crack 242 is generated, thereby further reducing the resistance.

[0079] The foregoing description focuses on embodiments of the present invention, but various modifications can obviously be made by those skilled in the art. Therefore, the scope of the present invention should not be construed as limited to the above embodiments, but should be interpreted according to the scope of the claims.

Claims

1. A method for mounting a flexible electrical contact terminal, comprising a method for mounting a flexible electrical contact terminal onto a circuit board, wherein, The elastic electrical contact terminal comprises an elastic core, a heat-resistant polymer film that continuously surrounds and bonds the elastic core along its length by sandwiching an adhesive layer, and a metal layer continuously formed on the outer surface of the polymer film, characterized by comprising the following steps: Solder paste is applied over the conductive pattern formed on the circuit board; The solder portions on both sides of the lower portion of the metal layer including the electrical contact terminal are mounted such that they are placed above the solder paste, and then reflow soldering is performed; and In the welding section, the solder paste melts and bonds with the metal layer through the welding process to form a main solder layer, and a portion of the solder paste rises along the side of the electrical contact terminal to form a side solder layer. The length of the side solder layer is less than the length of the metal layer portion corresponding to the side of the electrical contact terminal, and at least one end of the metal layer is spaced apart from one end of the side solder layer, so that no side solder layer is formed between them. The portion of the metal layer corresponding to the portion that does not form the side solder layer is in contact with the top of the conductive pattern and electrically connected.

2. The mounting method for the flexible electrical contact terminal according to claim 1, characterized in that, The length of the conductive pattern is greater than or equal to the length of the metal layer.

3. The mounting method for the flexible electrical contact terminal according to claim 1, characterized in that, The length of the conductive pattern is greater than the length of the solder paste.

4. The mounting method for the flexible electrical contact terminal according to claim 1, characterized in that, The conductive pattern is a single, unseparated entity.

5. A mounting structure for a flexible electrical contact terminal, as a mounting structure for mounting a flexible electrical contact terminal onto a circuit board, wherein, The resilient electrical contact terminal comprises an elastic core, a heat-resistant polymer film continuously sandwiched along the length of the elastic core to bond the elastic core, and a metal layer formed on the outer surface of the polymer film. Furthermore, the resilient electrical contact terminal can be soldered via surface mounting. In the electrical contact terminal, the solder portions on both lower surfaces in the width direction of the metal layer are sandwiched and mounted above the conductive pattern formed on the circuit board by applying solder paste over the conductive pattern formed on the circuit board. A portion of the solder paste rises along the side of the metal layer to form a side solder layer. The length of the side solder layer is less than the length of the metal layer portion corresponding to the side of the electrical contact terminal, and at least one end of the metal layer is spaced apart from one end of the side solder layer, so that no side solder layer is formed between them. The portion of the metal layer corresponding to the portion that does not form the side solder layer is in contact with the top of the conductive pattern and electrically connected.

6. The mounting structure of the flexible electrical contact terminal according to claim 5, characterized in that, The conductive pattern is composed of a single element, and the main solder layer is formed separately from each other above the conductive pattern along the weld portion of the metal layer.

7. The mounting structure of the flexible electrical contact terminal according to claim 5, characterized in that, The conductive patterns are formed separately from each other along the weld portion of the metal layer, and the main solder layers are formed on top of the conductive patterns.

8. The mounting structure of the flexible electrical contact terminal according to claim 5, characterized in that, The length of the conductive pattern is greater than the length of the main solder layer.

9. A mounting structure for a flexible electrical contact terminal, comprising mounting the flexible electrical contact terminal onto a conductive pattern on a circuit board, wherein, The resilient electrical contact terminal comprises a resilient core, a heat-resistant polymer film sandwiched with an adhesive layer and surrounding and bonding the resilient core, and a metal layer formed on the outer surface of the polymer film. Furthermore, the resilient electrical contact terminal can be soldered via surface mounting. The length of the metal layer is greater than the length of the main solder layer formed above the conductive pattern, thereby forming a contact portion where the main solder layer is not formed at at least one end of the two ends of the metal layer. The end of the conductive pattern corresponding to the contact portion protrudes and extends from the end of the metal layer. If the electrical contact terminal is pressed down from above, the contact portion comes into contact with the conductive pattern and becomes electrically connected.

10. The mounting structure of the flexible electrical contact terminal according to claim 9, characterized in that, The contact portions are formed at the lower parts of both ends of the metal layer. The conductive pattern extends from both ends of the metal layer.

11. The mounting structure of the flexible electrical contact terminal according to claim 9, characterized in that, The contact portion is separated from the conductive pattern by a predetermined gap by the main solder layer. The length of the contact portion is the length that allows the contact portion to contact the conductive pattern when the electrical contact terminal is pressed by 10%.

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