Light bar assembly and method of making the same
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HKC CORP LTD
- Filing Date
- 2023-04-27
- Publication Date
- 2026-07-24
AI Technical Summary
In existing technologies, LED lamps have high electrode layer impedance, resulting in insufficient current conduction capability.
A front electrode is disposed on the first surface of the insulating substrate, a side electrode is disposed on the second surface, and a back electrode is disposed on the third surface, forming a multilayer electrode structure to ensure that current is conducted through multiple electrode layers.
The multi-layer electrode structure improves current conduction capability, reduces the impedance of the electrode layer, and enhances current transmission efficiency.
Smart Images
Figure CN116608449B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of light strip technology, and in particular to a light strip assembly and its manufacturing method. Background Technology
[0002] With the development of electronic semiconductor technology, LED lamps are increasingly replacing traditional lighting fixtures in various lighting applications. Due to the diverse range of lighting needs, the structures of LED lamps also vary. However, the basic structure still involves fixing and encapsulating LED chips on a substrate, and supplying power to the LED chips through the substrate to make them emit light and achieve illumination. However, because the electrode layer on the substrate is relatively thin, it suffers from high impedance. Summary of the Invention
[0003] The main technical problem addressed by this application is to provide a light strip assembly and its manufacturing method, thereby solving the problem of high electrode layer impedance in the prior art.
[0004] To solve the above-mentioned technical problems, the first technical solution adopted in this application is: to provide a light strip assembly, the light strip assembly comprising:
[0005] An insulating substrate having a first surface and a second surface connected to one side of the first surface;
[0006] A first electrode layer is disposed on the first surface of an insulating substrate, and a plurality of first pads are provided on the first electrode layer. The first pads are used to connect a light source.
[0007] The light strip assembly also includes:
[0008] The second electrode layer is insulated from the first electrode layer;
[0009] The second electrode layer includes multiple front electrodes and side electrodes that are connected to the front electrodes. The front electrodes are disposed on the first surface of the insulating substrate, and the side electrodes are disposed on the second surface of the insulating substrate. Multiple second pads are disposed on the front electrodes, and the second pads are used to connect the light source.
[0010] The device has at least one side electrode, and each side electrode is connected to at least one front electrode.
[0011] There is one side electrode, and all front electrodes are connected to the side electrode.
[0012] The second electrode layer further includes a back electrode, which is connected to the front electrode through a side electrode. The insulating substrate has a third surface that is different from the first and second surfaces, and the first surface is connected to the third surface through the second surface. The back electrode is disposed on the third surface.
[0013] The insulating substrate is a transparent substrate, and the back electrode completely covers the third surface of the insulating substrate.
[0014] The light source is an LED lamp, one end of which is connected to the first pad and the other end is connected to the second pad; a gap is formed between the LED lamp and the first electrode layer and the second electrode layer.
[0015] The light source includes a first light source and a second light source, which are connected in parallel.
[0016] The light source also includes a third light source and a fourth light source. The third light source is connected in series with the first light source, the fourth light source is connected in series with the second light source, and the third light source and the first light source are connected in parallel with the second light source and the fourth light source.
[0017] To solve the above-mentioned technical problems, the second technical solution adopted in this application is: to provide a method for manufacturing a light strip assembly, the method comprising:
[0018] An insulating substrate is obtained, the insulating substrate including a first surface and a second surface connected to one side of the first surface;
[0019] A front electrode is formed on a portion of the first surface of the insulating substrate; one end of the front electrode is flush with the end of the first surface that connects to the second surface.
[0020] An insulating layer is formed on the first surface that does not cover the front electrode; the insulating layer covers the end face of the front electrode that is not on the same side as the second surface;
[0021] A first electrode layer is formed on a first surface that is not covered by the front electrode and the insulating layer;
[0022] A side electrode is formed on the second surface of an insulating substrate, and the side electrode is connected to the end of the front electrode near the second surface.
[0023] The insulating substrate has a third surface disposed opposite to the first surface, and a second surface connects the first surface and the third surface to the same side.
[0024] The production method also includes:
[0025] A back electrode is formed on the third surface of the insulating substrate, and the back electrode is connected to the front electrode through a side electrode.
[0026] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a light strip assembly and its manufacturing method. The light strip assembly includes: an insulating substrate having a first surface and a second surface connected to one side of the first surface; a first electrode layer disposed on the first surface of the insulating substrate, with a plurality of first pads for connecting a light source; the light strip assembly further includes: a second electrode layer insulated from the first electrode layer; wherein the second electrode layer includes a plurality of front electrodes and side electrodes connected to the front electrodes, the front electrodes being disposed on the first surface of the insulating substrate, the side electrodes being disposed on the second surface of the insulating substrate, and the front electrodes having a plurality of second pads for connecting a light source. This application, by disposing side electrodes on the second surface of the insulating substrate to enable the side electrodes to conduct with the front electrodes, improves current conduction capability compared to only disposing front electrodes on the first surface, thereby reducing the resistance of the electrode layer and further reducing the impedance of the electrode layer. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0028] Figure 1 This is a schematic diagram of the structure of an embodiment of the light strip assembly provided in this application;
[0029] Figure 2 yes Figure 1 A cross-sectional schematic diagram of a specific embodiment of the central light strip assembly at point AA;
[0030] Figure 3 yes Figure 1 A cross-sectional schematic diagram of a specific embodiment of the central light strip assembly at point BB;
[0031] Figure 4 This is a schematic diagram of a specific embodiment of the light strip assembly provided in this application;
[0032] Figure 5 yes Figure 1 A cross-sectional schematic diagram of another specific embodiment of the central light strip assembly at point BB;
[0033] Figure 6 This is a schematic diagram of another embodiment of the light strip assembly provided in this application;
[0034] Figure 7 This is a flowchart illustrating a specific embodiment of the method for manufacturing the light strip assembly provided in this application;
[0035] Figure 8 yes Figure 7 The provided method for manufacturing light strip components includes a structural diagram corresponding to step S5.
[0036] In the figure: LED strip assembly 100; insulating substrate 1; first surface 11; second surface 12; third surface 13; chamfered structure 14; bevel 141; first electrode layer 2; first pad 21; second electrode layer 3; front electrode 31; second pad 311; side electrode 32; back electrode 33; insulating layer 4; window 41; light source 5; LED lamp 51; first sub-electrode 52; second sub-electrode 53; first conductive connection layer 54; second conductive connection layer 55; first light source 61, second light source 62, third light source 63, fourth light source 64; conductive layer 7; sealing and isolation layer 8; side baffle 9. Detailed Implementation
[0037] The embodiments of this application will now be described in detail with reference to the accompanying drawings.
[0038] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.
[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0040] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.
[0041] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0042] Please see Figures 1 to 5 , Figure 1 This is a schematic diagram of the structure of an embodiment of the light strip assembly provided in this application; Figure 2 yes Figure 1 A cross-sectional schematic diagram of a specific embodiment of the central light strip assembly at point AA; Figure 3 yes Figure 1 A cross-sectional schematic diagram of a specific embodiment of the central light strip assembly at point BB; Figure 4 This is a schematic diagram of a specific embodiment of the light strip assembly provided in this application;
[0043] like Figure 1 , Figure 2 and Figure 3 As shown, a light strip assembly 100 includes an insulating substrate 1, a first electrode layer 2, a second electrode layer 3, an insulating layer 4, and a light source 5. The first electrode layer 2 and the second electrode layer 3 are disposed on the same side surface of the insulating substrate 1, and an insulating layer 4 is disposed between the first electrode layer 2 and the second electrode layer 3 to insulate them from each other. The light source 5 is electrically connected to the first electrode layer 2 and / or the second electrode layer 3.
[0044] like Figure 3 As shown, the insulating substrate 1 has a first surface 11, a second surface 12, and a third surface 13. The first surface 11, second surface 12, and third surface 13 are disposed on different sides, and the first surface 11 is connected to the third surface 13 through the second surface 12. In one embodiment, the insulating substrate 1 can be a long rectangular block, i.e., the first surface 11 and the third surface 13 are opposite to each other and parallel to each other, the second surface 12 is perpendicular to the first surface 11 and the third surface 13, and the second surface 12 is connected to the same side of the first surface 11 and the third surface 13. In this embodiment, the insulating substrate 1 is a strip-shaped transparent substrate. For example, the insulating substrate 1 can be a glass substrate or a transparent resin substrate. For example, the insulating substrate 1 is made of polyethylene terephthalate (PET). In other embodiments, the insulating substrate 1 can also be a non-transparent substrate, and the insulating substrate 1 can be a strip-shaped substrate made of other insulating materials.
[0045] In one embodiment, to facilitate the deposition of an electrode layer on the insulating substrate 1, the connection points of the first surface 11 and the second surface 12, as well as the connection points of the second surface 12 and the third surface 13 of the insulating substrate 1, are all chamfered structures 14. The chamfered structure 14 can be an inclined surface 141 or a curved surface; the curved surface can be concave or convex. In this embodiment, the chamfered structure 14 is an inclined surface 141. The angles between the inclined surface 141 and the first surface 11, and between the inclined surface 141 and the second surface 12, are all within the range of (90°, 180°). In this embodiment, the angle between the inclined surface 141 and the first surface 11 is 135°, and the angle between the inclined surface 141 and the second surface 12 is also 135°. The angle between the inclined surface 141 and the first surface 11 is 120°, and the angle between the inclined surface 141 and the second surface 12 is 150°.
[0046] The first electrode layer 2 is disposed on the first surface 11 of the insulating substrate 1. Specifically, the first electrode layer 2 only covers a portion of the first surface 11 of the insulating substrate 1. In this embodiment, the first electrode layer 2 can be a common electrode layer. The first electrode layer 2 has a plurality of first pads 21, which are used to connect the light source 5. The material of the first electrode layer 2 can be made of a metallic material. The material of the first electrode layer 2 can be conductive metals or alloys such as Gu, Al, and Ag.
[0047] like Figure 3 As shown, the second electrode layer 3 includes a front electrode 31 and a side electrode 32. Multiple front electrodes 31 are arranged side-by-side on the first surface 11 of the insulating substrate 1. The materials of the front electrodes 31 and the side electrodes 32 can be conductive metals or alloys such as Gu, Al, and Ag. The material of the second electrode layer 3 can be the same as or different from the material of the first electrode layer 2.
[0048] In this embodiment, to accommodate more light sources 5, the arrangement direction of the plurality of front electrodes 31 is not perpendicular to the width direction of the insulating substrate 1. In this embodiment, the arrangement direction of the plurality of front electrodes 31 is consistent, and the arrangement direction of the front electrodes 31 is perpendicular to the length direction of the insulating substrate 1.
[0049] Side electrodes 32 are disposed on the second surface 12 of the insulating substrate 1. There is at least one side electrode 32, and each side electrode 32 is connected to at least one front electrode 31. That is, there can be multiple side electrodes 32 or just one side electrode 32. Specifically, the number of side electrodes 32 can be less than or equal to the number of front electrodes 31. When there is only one side electrode 32, all front electrodes 31 are connected to the one side electrode 32 disposed on the second surface 12.
[0050] like Figure 4 As shown, the front electrode 31 and the first electrode layer 2 can be disposed in the same layer or in different layers, depending on the specific structure of the lamp strip assembly 100. In this embodiment, the front electrode 31 and the first electrode layer 2 are disposed in the same layer and spaced apart. An insulating layer 4 is disposed between the first electrode layer 2 and the front electrode 31, and the first electrode layer 2, the front electrode 31, and the insulating layer 4 all cover the first surface 11 of the insulating substrate 1. In another embodiment, the insulating layer 4 extends to the surface of the front electrode 31 and / or the first electrode layer 2 away from the insulating substrate 1 to protect the exposed surfaces of the front electrode 31 and the first electrode layer 2. A window 41 is provided on the insulating layer 4 covering the front electrode 31 and the first electrode layer 2 to allow the first pad 21 and the second pad 311 to be exposed through the window 41. The front electrode 31 is provided with a plurality of second pads 311 for connecting the light source 5, and at least the side of the first pad 21 and the second pad 311 away from the insulating substrate 1 is not covered by the insulating layer 4. In this embodiment, the material of the insulating layer 4 can be SiNx, etc. Specifically, the thickness of the insulating layer 4 is not less than the thickness of the first electrode layer 2 and the front electrode 31. The thickness of the insulating layer 4 ranges from 0.02 μm to 2 μm, for example, the thickness of the insulating layer 4 is 0.1 μm.
[0051] In one embodiment, such as Figure 5As shown, to further reduce impedance, the second electrode layer 3 also includes a back electrode 33. The back electrode 33 is connected to the front electrode 31 via side electrodes 32. The back electrode 33 is disposed on the third surface 13 of the insulating substrate 1. There can be one or more back electrodes 33. Each back electrode 33 is connected to at least one front electrode 31. In this embodiment, there is one back electrode 33, n front electrodes 31, and n side electrodes 32. Each front electrode 31 corresponds to one side electrode 32, and the end of the front electrode 31 near the second surface 12 is connected to one end of the side electrode 32. The ends of each side electrode 32 away from the front electrode 31 are connected to a back electrode 33 disposed on the third surface 13 of the insulating substrate 1. The material of the back electrode 33 can be a conductive metal or alloy such as Gu, Al, or Ag. The material of the back electrode 33 can be the same as or different from the materials of the front electrode 31 and the side electrodes 32.
[0052] The thickness of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 ranges from 0.2 μm to 5 μm. Specifically, the thicknesses of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 can be the same or different. In this embodiment, the thicknesses of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 are the same. Specifically, the thickness of each of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 can be 0.3 μm. To improve current conductivity, the thicknesses of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 can all be 1 μm; the thicknesses of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 can all be 2 μm; the thicknesses of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 can all be 3 μm; the thicknesses of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 can all be 4 μm; and the thicknesses of the first electrode layer 2, the front electrode 31, the side electrode 32, and the back electrode 33 can all be 4.5 μm.
[0053] In one embodiment, the back electrode 33 completely covers the third surface 13 of the insulating substrate 1. When the insulating substrate 1 is a transparent substrate, the back electrode 33 disposed on the third surface 13 of the insulating substrate 1 can prevent the insulating substrate 1 from having light transmission or light leakage problems.
[0054] In this embodiment, as Figure 2As shown, the light source 5 includes an LED lamp 51, one end of which is connected to a first pad 21, and the other end is connected to a second pad 311. A gap is formed between the LED lamp 51 and the first electrode layer 2 and the second electrode layer 3. Specifically, the light source 5 also includes a first sub-electrode 52 and a second sub-electrode 53, one end of which is connected to the first sub-electrode 52, and the other end of which is connected to the second sub-electrode 53. In one embodiment, the first sub-electrode 52 is connected to the first pad 21 through a first conductive connection layer 54, and the second sub-electrode 53 is connected to the second pad 311 through a second conductive connection layer 55. The materials of the first conductive connection layer 54 and the second conductive connection layer 55 can be the same or different. The first conductive connection layer 54 can be made of solder paste or cured with ACF conductive adhesive.
[0055] In one embodiment, such as Figure 1 As shown, all light sources 5 are connected in parallel. That is, each light source 5 corresponds to a front electrode 31. The light source 5 includes a first light source 61 and a second light source 62, which are connected in parallel. One end of the first light source 61 is connected to the first second pad 311, and the other end of the first light source 61 is connected to the first first pad 21. One end of the second light source 62 is connected to the second second pad 311, and the other end of the second light source 62 is connected to the second first pad 21.
[0056] In another embodiment, such as Figure 6As shown, some of the light sources 5 are connected in series, while others are connected in parallel. Specifically, the light sources 5 also include a third light source 63 and a fourth light source 64. The third light source 63 is connected in series with the first light source 61, and the fourth light source 64 is connected in series with the second light source 62. The third light source 63 and the first light source 61 are connected in parallel with the second light source 62 and the fourth light source 64. Specifically, a plurality of conductive layers 7 are also disposed on the first surface 11 of the insulating substrate 1. The conductive layers 7 are disposed on the same layer as the first electrode layer 2 and the second electrode layer 3 and are mutually insulated. Specifically, an insulating layer 4 is disposed between the conductive layers 7 and the first electrode layer 2 and the second electrode layer 3. A plurality of third pads are disposed on the conductive layers 7. One end of the first light source 61 is connected to the first second pad 311, and the other end of the first light source 61 is connected to the first third pad. One end of the third light source 63 is connected to the second third pad, and the other end of the third light source 63 is connected to the first first pad 21. Among them, the first third pad and the second third pad are electrically connected. One end of the second light source 62 is connected to the second second pad 311, and the other end of the second light source 62 is connected to the third third pad. One end of the fourth light source 64 is connected to the fourth third pad, and the other end of the fourth light source 64 is connected to the second first pad 21. The third and fourth third pads are electrically connected. Furthermore, the third and fourth third pads are insulated from the first and second third pads.
[0057] The light strip assembly provided in this embodiment includes: an insulating substrate having a first surface and a second surface connected to one side of the first surface; a first electrode layer disposed on the first surface of the insulating substrate, the first electrode layer having a plurality of first pads for connecting a light source; the light strip assembly further includes: a second electrode layer insulated from the first electrode layer; wherein the second electrode layer includes a plurality of front electrodes and side electrodes connected to the front electrodes, the front electrodes being disposed on the first surface of the insulating substrate, the side electrodes being disposed on the second surface of the insulating substrate, the front electrodes having a plurality of second pads for connecting a light source. This application, by disposing side electrodes on the second surface of the insulating substrate, enables the side electrodes to be connected to the front electrodes. Compared to disposing only the front electrodes on the first surface, the connected front and side electrodes in this application can improve the current conduction capability, thereby reducing the resistance of the electrode layer and further reducing the impedance of the electrode layer.
[0058] Please see Figure 7 , Figure 7 This is a flowchart illustrating a specific embodiment of the method for manufacturing the light strip assembly provided in this application.
[0059] This embodiment provides a method for manufacturing a light strip assembly, which is the light strip assembly described in the above embodiment. The method for manufacturing the light strip assembly includes the following steps.
[0060] S1: Obtain an insulating substrate, the insulating substrate including a first surface and a second surface connected to one side of the first surface.
[0061] Specifically, an insulating substrate made of insulating material is obtained. The insulating substrate has a first surface, a second surface, and a third surface, the first surface and the third surface being disposed opposite to each other, and the second surface being connected to the first surface and the third surface, with the second surface connected to the same side of the first surface and the third surface.
[0062] In this embodiment, the insulating substrate is a strip-shaped transparent substrate. For example, the insulating substrate can be a glass substrate or a transparent resin substrate. For example, polyethylene terephthalate (PET) is used to make the insulating substrate. In other embodiments, the insulating substrate can also be a non-transparent substrate, or a strip-shaped substrate made of other insulating materials.
[0063] To prevent the metal layer at the junctions of the first and second surfaces, and the second and third surfaces, from breaking in subsequent steps, the junctions of the first and second surfaces and the second and third surfaces are designed with chamfered structures. These chamfered structures include inclined surfaces, concave curved surfaces, and convex curved surfaces.
[0064] Specifically, the connection between the first and second surfaces or the connection between the second and third surfaces is ground into a bevel by mechanical grinding, or the connection between the first and second surfaces or the connection between the second and third surfaces is ground into a concave curved surface or a convex curved surface.
[0065] In this embodiment, the chamfer structure is a bevel. The angles between the bevel and the first surface, and between the bevel and the second surface, are both within the range of (90°, 180°). In this embodiment, the angle between the bevel and the first surface is 135°, and the angle between the bevel and the second surface is also 135°. The angle between the bevel and the first surface is 120°, and the angle between the bevel and the second surface is 150°.
[0066] In one embodiment, impurities on the surface of the insulating substrate are cleaned to keep the surface of the insulating substrate clean.
[0067] S2: A front electrode is formed on a portion of the first surface of the insulating substrate; one end of the front electrode is flush with the end of the first surface that connects to the second surface.
[0068] Specifically, a first metal layer is formed on a portion of the first surface of an insulating substrate using methods such as sputtering, printing, or electroplating, with the first metal layer partially covering the first surface of the insulating substrate. A first photoresist layer is formed on the first metal layer, and a first window is formed on the first photoresist layer through exposure and development. The first metal layer exposed through the first window is patterned using chemical etching or laser etching, and the first photoresist layer is removed to form multiple front electrodes. One end of each front electrode is flush with the end of the first surface that connects to the second surface. The thickness of the front electrodes ranges from 0.2 μm to 5 μm.
[0069] S3: An insulating layer is formed on the first surface that does not cover the front electrode; the insulating layer covers the end face of the front electrode that is not on the same side as the second surface.
[0070] Specifically, an insulating material is coated on a first surface that does not cover the front electrode to form an insulating layer. The insulating layer is in close contact with other end faces of the front electrode located on the same side of the second surface. The insulating layer is patterned by exposure and development, and the insulating layer in other areas not adjacent to the front electrode is etched away. The thickness of the insulating layer ranges from 0.02 μm to 2 μm, for example, the thickness of the insulating layer is 0.1 μm.
[0071] In another embodiment, an insulating material is coated on the surface of the front electrode away from the insulating substrate, so that the insulating layer extends to the surface of the front electrode to protect the exposed surface of the front electrode. The insulating layer on the front electrode is etched to form a window in the insulating layer, through which part of the front electrode is exposed as a second pad for connecting a light source.
[0072] S4: A first electrode layer is formed on the first surface that is not covered by the front electrode and the insulating layer.
[0073] Specifically, a second metal layer is formed on the first surface, which does not cover the front electrode and insulating layer, by sputtering, printing, electroplating, or other methods. The second metal layer covers the first surface of the exposed insulating substrate. A second photoresist layer is formed on the second metal layer. A second window is formed on the second photoresist layer by exposure and development. The second metal layer exposed through the second window is patterned by chemical etching or laser etching. The second photoresist layer is then removed to form a first electrode layer, thus obtaining the preform. One end of the first electrode layer is flush with the end where the first surface connects to the second surface. The thickness of the first electrode layer ranges from 0.2 μm to 5 μm.
[0074] S5: A side electrode is formed on the second surface of the insulating substrate, and the side electrode is connected to the end of the front electrode near the second surface.
[0075] Please see Figure 8 , Figure 8 yes Figure 7 The provided method for manufacturing light strip components includes a structural diagram corresponding to step S5.
[0076] Specifically, in order to mass-produce the side electrodes 32 on the second surface 12 of the insulating substrate, a sealing isolation layer 8 is attached or coated on the front electrode 31 and the surface of the first electrode layer 2 away from the insulating substrate 1 and / or the third surface 13 of the insulating substrate 1, so as to facilitate the sequential stacking of multiple preforms. The material of the sealing isolation layer 8 can be an easily etchable oxide, such as SiO2.
[0077] The second surfaces 12 of the insulating substrates 1 in the multiple preforms are all placed upwards and aligned so that the second surfaces 12 of all the insulating substrates 1 are on the same plane, and the surfaces of the sealing isolation layers 8 on each insulating substrate 1 are all facing the same direction. Two side baffles 9 are provided on the outside of the multiple preforms. The two side baffles 9 respectively clamp the outside of the multiple preforms and make the two adjacent preforms fit tightly without gaps, so as to prevent the metal layer formed on the second surface 12 of the insulating substrates 1 from leaking to the first electrode layer 2, the front electrode 31, or the side surface of the insulating layer 4 away from the insulating substrate 1. The side baffles 9 can be glass plates, metal plates, or ceramic plates, etc.
[0078] A third metal layer is formed on the second surface of an insulating substrate by means of sputtering, printing, electroplating, etc., and the third metal layer covers the second surface of the insulating substrate.
[0079] In another embodiment, a third metal layer is formed on the substrate by sputtering, printing, and electroplating. The third metal layer is then peeled off from the substrate, and solder paste is applied to one surface of the third metal layer. The solder paste is softened by heating, and the solder paste-coated surface of the third metal layer is then placed against the second surface of the insulating substrate and adhered. Cooling is then performed to deposit the third metal layer on the second surface of the insulating substrate. The thickness of the third metal layer can be adjusted according to actual conditions. Increasing the thickness of the third metal layer can improve its conductivity and thus reduce its impedance.
[0080] A third photoresist layer is formed on the third metal layer. A third window is formed on the third photoresist layer by exposure and development. The third metal layer exposed through the third window is patterned by chemical etching or laser etching, and the third photoresist layer is removed to form at least one side electrode. The end of the front electrode near the second surface is connected to the side electrode formed on the second surface. The thickness of the side electrode ranges from 0.2 μm to 5 μm. After the side electrode is formed, the sealing isolation layer on the insulating substrate can be removed or retained.
[0081] In another embodiment, the insulating substrate has a third surface disposed opposite to the first surface, and a second surface connects the same side of the first surface and the third surface.
[0082] The production method also includes the following steps.
[0083] S6: A back electrode is formed on the third surface of the insulating substrate, and the back electrode is connected to the front electrode through the side electrode.
[0084] Specifically, a fourth metal layer is formed on the third surface of the insulating substrate through sputtering, printing, electroplating, or other methods. The fourth metal layer serves as a back electrode, and all the ends of the side electrodes away from the front electrode are connected to the back electrode.
[0085] The thickness of the first electrode layer, the front electrode, the side electrode, and the back electrode ranges from 0.2 μm to 5 μm. Specifically, the thicknesses of the first electrode layer, the front electrode, the side electrode, and the back electrode can be the same or different. In this embodiment, the thicknesses of the first electrode layer, the front electrode, the side electrode, and the back electrode are the same. Specifically, the thickness of each of the first electrode layer, the front electrode, the side electrode, and the back electrode can be 0.3 μm. To improve current conductivity, the thicknesses of each of the first electrode layer, the front electrode, the side electrode, and the back electrode can be 1 μm; 2 μm; 3 μm; 4 μm; or 4.5 μm.
[0086] In one embodiment, the light source is an LED lamp. One end of the LED lamp is connected to a first pad using solder paste or ACF conductive adhesive, and the other end is connected to a second pad using solder paste or ACF conductive adhesive. A gap is formed between the LED lamp and the first and second electrode layers.
[0087] Specifically, the light source further includes a first sub-electrode and a second sub-electrode. One end of the LED is connected to the first sub-electrode, and the other end is connected to the second sub-electrode. In one embodiment, the first sub-electrode is connected to a first pad via a first conductive connection layer, and the second sub-electrode is connected to a second pad via a second conductive connection layer. The first and second conductive connection layers may be made of the same or different materials. The first conductive connection layer can be made of solder paste or cured using ACF conductive adhesive.
[0088] In one embodiment, all light sources can be connected in parallel. That is, one end of each light source connected to the first sub-electrode is connected to each of the second pads on the front electrode via a first conductive connection layer. The light sources include a first light source and a second light source, which are connected in parallel. One end of the first light source is connected to the first second pad, and the other end is connected to the first first pad. One end of the second light source is connected to the second second pad, and the other end is connected to the second first pad.
[0089] In another embodiment, some light sources are connected in series, while others are connected in parallel. Specifically, the light sources also include a third and a fourth light source. The third light source is connected in series with the first light source, and the fourth light source is connected in series with the second light source. The third and first light sources are connected in parallel with the second and fourth light sources. Specifically, a plurality of conductive layers are also disposed on the first surface of the insulating substrate. The conductive layers are disposed on the same layer as the first and second electrode layers and are mutually insulated. Specifically, an insulating layer is disposed between the conductive layers and the first and second electrode layers. A plurality of third pads are disposed on the conductive layers. One end of the first light source is connected to the first second pad, and the other end of the first light source is connected to the first third pad. One end of the third light source is connected to the second third pad, and the other end of the third light source is connected to the first first pad. The first third pad is electrically connected to the second third pad. One end of the second light source is connected to the second second pad, and the other end of the second light source is connected to the third third pad. One end of the fourth light source is connected to the fourth third pad, and the other end of the fourth light source is connected to the second first pad. The third third pad is electrically connected to the fourth third pad. Furthermore, the third and fourth third pads are insulated from the first and second third pads.
[0090] The method for manufacturing a light strip assembly provided in this embodiment involves obtaining an insulating substrate, which includes a first surface and a second surface connected to one side of the first surface; forming a front electrode on a portion of the first surface of the insulating substrate; having one end of the front electrode flush with the end of the first surface connected to the second surface; forming an insulating layer on the first surface not covering the front electrode; covering the end face of the front electrode not on the same side as the second surface; forming a first electrode layer on the first surface not covering the front electrode and the insulating layer; and forming a side electrode on the second surface of the insulating substrate, with the side electrode connected to the end of the front electrode near the second surface. This application, by providing a side electrode on the second surface of the insulating substrate and a back electrode on the third surface, enables the back electrode, side electrode, and front electrode to conduct. Compared to providing only a front electrode on the first surface, the conduction capability of the front electrode, side electrode, and back electrode in this application is improved, resulting in a reduction of the electrode layer resistance by more than 50%, further reducing the impedance of the electrode layer.
[0091] The above are merely embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.
Claims
1. A light strip assembly, the light strip assembly comprising: An insulating substrate having a first surface and a second surface connected to one side of the first surface; A first electrode layer is disposed on a first surface of the insulating substrate, and a plurality of first pads are provided on the first electrode layer, the first pads being used to connect a light source; The light strip assembly is characterized in that it further includes a second electrode layer, which is insulated from the first electrode layer; The second electrode layer includes a plurality of front electrodes and side electrodes that are connected to the front electrodes. The front electrodes are disposed on a first surface of the insulating substrate, and the side electrodes are disposed on a second surface of the insulating substrate. A plurality of second pads are disposed on the front electrodes, and the second pads are used to connect the light source. The second electrode layer further includes a back electrode, which is connected to the front electrode through the side electrode. The insulating substrate has a third surface that is different from the first surface and the second surface, and the first surface is connected to the third surface through the second surface. The back electrode is disposed on the third surface. The insulating substrate is a transparent substrate, and the back electrode completely covers the third surface of the insulating substrate.
2. The light strip assembly according to claim 1, characterized in that, There is at least one side electrode, and each side electrode is connected to at least one front electrode.
3. The light strip assembly according to claim 1, characterized in that, There is one side electrode, and all the front electrodes are connected to the side electrode.
4. The light strip assembly according to claim 1, characterized in that, The light source is an LED lamp, one end of which is connected to the first pad and the other end is connected to the second pad; A gap is formed between the LED light and the first electrode layer and the second electrode layer.
5. The light strip assembly according to claim 1, characterized in that, The light source includes a first light source and a second light source, which are connected in parallel.
6. The light strip assembly according to claim 5, characterized in that, The light source also includes a third light source and a fourth light source. The third light source is connected in series with the first light source, the fourth light source is connected in series with the second light source, and the third light source and the first light source are connected in parallel with the second light source and the fourth light source.
7. A method for manufacturing a light strip assembly, characterized in that, The manufacturing method includes: obtaining an insulating substrate, the insulating substrate including a first surface and a second surface connected to one side of the first surface; A front electrode is formed on a portion of the first surface of the insulating substrate; One end of the front electrode is flush with the end of the first surface that connects to the second surface; An insulating layer is formed on the first surface that does not cover the front electrode; The insulating layer covers the end face of the front electrode that is not on the same side as the second surface; A first electrode layer is formed on the first surface that does not cover the front electrode and the insulating layer; A side electrode is formed on the second surface of the insulating substrate, and the side electrode is connected to the end of the front electrode near the second surface; The insulating substrate has a third surface disposed opposite to the first surface, and the second surface is connected to the same side of the first surface and the third surface; A back electrode is formed on the third surface of the insulating substrate, and the back electrode is connected to the front electrode through the side electrode; The back electrode completely covers the third surface of the insulating substrate.