A hardware fault detection apparatus for a smart handheld device

Abstract

This invention relates to the field of intelligent device fault detection, specifically to a hardware fault detection device for intelligent handheld devices. The device includes a frame and a needle bed with multiple retractable probes. The needle bed is positioned above the frame, and two mounting plates are symmetrically arranged on the frame, designated as Mounting Plate One and Mounting Plate Two. This invention solves the problem of contact point misalignment caused by arcuate warping of the circuit board, which prevents probe contact and affects the accuracy of circuit board detection. Furthermore, the circuit board does not deform during detection, thus avoiding cracking of solder joints at the contacts due to stress, which would affect the production yield of the circuit board.

Description

Technical Field

[0001] This invention relates to the field of intelligent device fault detection, specifically to a hardware fault detection device for intelligent handheld devices. Background Technology

[0002] As a supplementary application tool to desktop or laptop computers, smart handheld devices can be used for multiple functions such as data access, management, generation and collection, and voice services. Currently, smart handheld devices are widely used. For example, the express delivery and supermarket industries use barcode scanners to access, manage, generate and collect data, while in daily life, people use mobile phones for voice calls, video calls and mobile payments.

[0003] To meet people's demand for smart handheld devices, the related hardware of smart handheld devices has begun to be produced automatically. The circuit board inside the smart handheld device, also known as the PCB, is an important piece of hardware. If the circuit board malfunctions, it will cause some functions of the smart handheld device to be unusable, or even make the entire smart handheld device unusable. Therefore, fault detection of each circuit board is essential when automating the production of smart handheld devices.

[0004] Currently, the relevant inspection methods for automated circuit board production lines include AOI inspection, ICT inspection, and flying probe inspection. AOI inspection uses a vision sensor to take pictures, which are then manually observed; this method is relatively slow. Both flying probe inspection and ICT inspection use probes to contact the test contacts on the circuit board. Flying probe inspection typically uses a robotic arm to move the probes and inspect multiple contacts, resulting in low efficiency. ICT inspection, on the other hand, uses a bed of probes with multiple probes to simultaneously inspect multiple contacts on the circuit board, resulting in high speed—generally a few seconds to inspect a circuit board—and high accuracy. Therefore, it is commonly used in high-volume production enterprises. ICT testing is employed. During ICT testing, the circuit board is moved under the ICT testing machine, its position is then determined, and finally, probes on the needle bed contact the relevant contacts on the circuit board. The testing system determines whether the circuit board has a fault, thus completing the fault detection. During the production process, the circuit board undergoes high-temperature soldering, which can cause some deformation. Part of the reason for this deformation is the uneven heat absorption and dissipation across different parts of the circuit board. To ensure uniform heat absorption and dissipation throughout the circuit board, the printed copper foil is evenly distributed across the board during the design phase, thereby ensuring electrical stability. The uniformity of heat absorption and dissipation in the circuit board reduces its deformation. However, even with this design, some circuit boards may still exhibit relatively uniform warping deformation. During circuit board positioning, this warping deformation can cause a slight offset in the contact positions on the positioned circuit board. This results in the probe on the needle bed not being directly above the corresponding contact, preventing the probe from making contact when the needle bed presses down. Consequently, the equipment's fault detection of this part of the circuit board is inaccurate. To solve this problem, existing equipment restores the circuit board's deformation to prevent detection errors caused by warping deformation, as illustrated in CN2022. In patent 22973300.0, there is an automatic clamping device for a flying probe testing machine. This device straightens a warped circuit board to prevent the probe and contact from shifting due to the warping of the circuit board, which would affect the accuracy of the circuit board testing. Both flying probe testing and ICT testing use probe contact for testing, so this device is also suitable for ICT testing. However, when the circuit board uses lead-free solder, which is more fragile than traditional tin-lead solder, straightening the warped circuit board during testing will cause stress at the contact points due to the deformation of the circuit board. This can lead to cracking of the circuit board contacts and damage to the circuit, which in turn will reduce the production yield of the circuit board.

[0005] Therefore, in order to avoid damaging the circuit board by changing its shape during testing and to accurately detect circuit board faults, it is urgent to design a hardware fault detection device for intelligent handheld devices. Summary of the Invention

[0006] The purpose of this invention is to provide a hardware fault detection device for smart handheld devices. By setting a power board to mimic the deformation of the circuit board, the position of the probe is adjusted so that the probe is always directly above the corresponding contact point. This method not only avoids damage to the circuit board during detection, but also improves the accuracy of the fault detection device.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A hardware fault detection device for a smart handheld device includes a frame and a needle bed equipped with multiple retractable probes. The needle bed is positioned above the frame. Two mounting plates are symmetrically welded to the frame, namely mounting plate one and mounting plate two. Both mounting plates share a conveyor for transporting circuit boards. The conveyor is a conventional belt conveyor, and both mounting plates are equipped with belt conveyors. Alternatively, other conveyors capable of stably transporting circuit boards to the needle bed can be used. Of course, besides conveyors, other conveying devices, such as robotic arms, can also be used. The frame is equipped with a positioning device one for positioning the movement direction of the circuit boards. Positioning device one uses a clamping method to position the circuit board in the direction of movement. Specifically, a lifting cylinder is set in front of the circuit board in the direction of movement to move a baffle plate upward and block the movement path of the circuit board. Then, a lifting cylinder is also set behind the circuit board in the direction of movement to move the baffle plate upward. The lifting cylinder is moved by another cylinder so that the two baffle plates clamp the circuit board for positioning. The frame is equipped with positioning device two for positioning the circuit board perpendicular to the direction of movement. Positioning device two includes a cylinder set on the frame and located on one side of mounting plate two. The cylinder output rod end is equipped with a push plate. The cylinder extends to push the circuit board to fit against mounting plate one, thereby achieving positioning of the circuit board perpendicular to the direction of movement.

[0009] The needle bed is equipped with an elastic power plate, which is made of materials such as 65Mn spring steel, beryllium bronze, and shape memory alloy. These materials all have high elasticity and are not prone to plastic deformation. Of course, other elastic materials can also be used, but 65Mn spring steel is more common and cheaper. Therefore, 65Mn spring steel is preferred as the material for the power plate in this design. 65Mn spring steel needs to be quenched at 830℃±20℃ to improve its overall performance. After quenching, oil cooling is used, followed by tempering treatment to eliminate or reduce the quenching process. The generated internal stress has a tempering temperature of 540℃±50℃. The probe is connected to the power plate and installed on the needle bed. The push plate is equipped with a detection device to control the deformation distance of the circuit board by the cylinder. The frame is equipped with an adjustment device. The adjustment device can make the power plate deform by the same amount as the circuit board according to the cylinder extension. The power plate is equipped with a stabilizing component that keeps the probe vertical when the power plate is deformed by the adjustment device. The needle bed is equipped with a recovery component that can still be used after the power plate undergoes plastic deformation due to multiple deformations.

[0010] Preferably, the detection device includes contact sensors disposed on the push plate and the mounting plate, and the mounting plate is provided with at least two contact sensors.

[0011] When the circuit board moves under the needle bed, the cylinder quickly extends and pushes the circuit board to position it via the push plate. When the contact sensor on the push plate and the contact sensor on the mounting plate are fully triggered, the adjustment device does not work, and the power plate is in normal condition. When the contact sensor on the push plate is triggered, but the contact sensor on the mounting plate is not triggered, the cylinder continues to extend until the contact sensor on the mounting plate is triggered, at which point it stops. The adjustment device is then triggered, and the deformation of the power plate is adjusted accordingly. The probe is connected to the power plate, thereby adjusting the offset between the probe and the circuit board contact point to ensure that the probe is always directly above the corresponding contact point. When the probe is pressed down, both ends of the circuit board are limited, preventing deformation due to probe compression, thus avoiding the problem of contact point cracking due to circuit board deformation.

[0012] The installation of two contact sensors on the mounting plate can prevent the circuit board from being fully positioned due to tilting, which would trigger the contact sensors and cause insufficient cylinder compensation, resulting in insufficient adjustment of the adjustment device and affecting the equipment's detection.

[0013] Preferably, the adjustment device includes a mounting bracket disposed on the mounting plate two, an adjustment block is horizontally slidably mounted on the mounting bracket, and the sliding direction is perpendicular to the moving direction of the circuit board. The adjustment block is provided with an inclined surface. A push rod for pushing the adjustment block to move is fixedly mounted on the cylinder output rod. The adjustment block is elastically connected to the mounting bracket. The adjustment block is provided with a protective component to prevent the right-angle edge of the power plate from being damaged by stress.

[0014] When inspecting warped circuit boards, the cylinder extends significantly. An adjusting block is slidably mounted on the mounting bracket, and the adjusting block has an inclined surface. As the cylinder extends, the adjusting block moves the same distance via a push rod. When the needle bed moves downward, the adjusting block blocks the downward movement of the power plate. The power plate is gradually squeezed by the inclined surface, causing the power plate to deform by the same amount, thereby adjusting the probe position. When the cylinder retracts, the adjusting block returns to its original position under the action of a spring, without affecting the fault detection of normal circuit boards.

[0015] This method involves self-synchronization adjustment via a single power source, resulting in a simple structure, low manufacturing cost, and high synchronization rate. Alternatively, a distance sensor can be used to measure the deformation of the circuit board, and then the movement of the adjustment block can be controlled automatically. However, this method is more complex and has higher manufacturing costs.

[0016] Preferably, the stabilizing component includes a connecting rod spherically hinged to the power plate. The probe is installed on the power plate by being threaded to the connecting rod. The connecting rod is slidably mounted on the needle bed at one end, and the sliding direction is perpendicular to the moving direction of the circuit board. The sliding mounting method of the connecting rod can restrict the rotational freedom of the connecting rod.

[0017] The power board deforms into an arc shape. If the probe is fixedly mounted on the power board, it will cause the probe to tilt at a certain angle. When the needle bed presses down for testing, the probe will generate axial and radial forces due to the tilt. Since the circuit board contacts of the smart handheld device are densely distributed, the probe density is relatively high. To ensure the probe density, the probe diameter is usually set between 0.2mm and 0.5mm. Due to the small probe diameter, if radial force is generated, it will cause bending moment in the probe, leading to probe deformation and damage, affecting the use of the device. Therefore, a ball-joint connecting rod is installed on the power board. The probe is mounted on the connecting rod, and one end of the connecting rod is slidably connected to the needle bed. Through the ball-joint design, a certain angle of tilt can be generated between the connecting rod and the power board. The sliding connection between the connecting rod and the needle bed can restrict the rotational freedom of the connecting rod, so that the probe always remains vertical and will not deform due to radial force during testing.

[0018] The connecting rod slides using a groove, and the groove has grooves on both sides to restrict the vertical movement of the connecting rod, thereby restricting the rotational freedom of the connecting rod. The shape of the groove can be either a convex groove or an I-shaped groove.

[0019] Preferably, the recovery assembly includes a tension spring disposed on the needle bed, and a compression plate is fixedly installed at the end of the tension spring away from the needle bed, the compression plate being in contact with the power plate under the action of the tension spring.

[0020] Because ICT testing is conducted on automated production lines with large batch sizes, the power board undergoes numerous deformations, making it prone to plastic deformation. This causes probe misalignment during the testing of normal circuit boards, affecting their performance. To address this, a tension spring is installed on the needle bed, connected to a compression plate. Even when the adjusting block is not compressing the power board, the compression plate, under the action of the tension spring, continuously compresses it. This ensures that the power board, after undergoing plastic deformation, can recover its original shape without affecting the needle bed's testing, thus extending its service life. When the power board experiences excessive deformation, it needs to be replaced to prevent cracking during operation. For probes with a diameter of 0.2mm, the allowable warpage height is less than 0.15-0.2mm; for probes with a diameter of 0.3mm, the allowable warpage height is less than 0.2-0.3mm. The maximum allowable deformation is less than the probe diameter.

[0021] This method can also heat the power board to restore it, but the power board material needs to be made of shape memory alloy, and this method requires heating the power board, so a heating device needs to be set up, which will lead to higher equipment manufacturing costs. However, if ICT testing and reflow soldering are set up on the same production line, the internal hot air of reflow soldering can be guided to the ICT testing machine to heat the power board, thereby reducing the need for a heating device. In addition, shape memory alloy has a long service life, so the power board using shape memory alloy has a lower operating cost.

[0022] Preferably, at least one probe is provided on a single connecting rod, and multiple probes on a single connecting rod are arranged on the same straight line, which is parallel to the direction of movement of the circuit board.

[0023] Because the circuit board contacts are densely distributed, the probes also need to be set with a corresponding density. However, setting ball joints undoubtedly increases the width of the probes, which leads to a decrease in the density of the probe arrangement. When the power board deforms, the position adjustment of the probes located on the same straight line as the circuit board moving direction is the same. The probes on this straight line can be set on the same connecting rod to reduce the density of the ball joint arrangement, but without affecting the density of the probe arrangement, thus improving the practicality of the equipment.

[0024] Preferably, the frame is provided with a fixing plate, and a spring damper is fixedly installed on the fixing plate. The spring damper is used to reduce the cylinder speed before the push plate contacts the circuit board.

[0025] When positioning the circuit board, the cylinder needs to extend quickly to reduce the positioning time. The stopping of the cylinder will cause some vibration, which can easily damage the contact sensor. To address this, a fixing plate is installed on the frame, and a spring damper is connected to the fixing plate. When the cylinder extends, it will first contact the spring damper and then push the circuit board. This can effectively reduce the speed of the cylinder in the stopping chamber, thereby reducing the vibration caused by the cylinder stopping and thus avoiding damage to the contact sensor.

[0026] Preferably, the protective component includes a slider disposed on the needle bed, and the slider is rotatably connected to the upper corner of the power plate on one side of the mounting plate two, and a roller is rotatably connected to the lower corner of the power plate on one side of the mounting plate two, and one end of the power plate is rotatably connected to the needle bed.

[0027] The upper and lower corners of the power plate on one side of the mounting plate will slide with the needle bed and the adjusting block respectively, and the power plate will rotate at the corners, causing stress concentration at the corners. Therefore, in order to avoid stress concentration or wear at the two corners, the upper corner is rotatably mounted on the slider, and the lower corner is rotatably mounted on the roller, so that the corners are changed from sliding friction surface to rolling friction. The rotatable connection will allow the roller and the connecting shaft to have multi-faceted contact, thereby avoiding stress concentration.

[0028] Preferably, the power plate includes multiple connecting plates, each connecting plate having multiple semi-circular notches for ball joint engagement, two adjacent connecting plates being detachably connected, the roller being disposed on at least one connecting plate, and the slider being rotatably connected to at least one connecting plate.

[0029] When the power board is damaged, multiple probes need to be removed before the power board can be removed. However, the probes are connected to a large number of wires, so removing the probes will cause the wires to become messy and difficult to arrange. In addition, due to the large number of probes, removing the probes can easily lead to incorrect installation positions of the probes, which will affect the equipment's detection. Therefore, the power board is set up as multiple connecting plates. The power board can be removed without removing the probes by simply disconnecting the connecting parts between the multiple connecting plates.

[0030] Preferably, a sliding plate is vertically slidably mounted on the mounting frame, the sliding plate is elastically connected to the mounting frame, the adjusting block is mounted on the mounting frame through connection with the sliding plate, the needle bed extends above the adjusting block, and when the needle bed moves downward, the power plate first contacts the adjusting block, and then the needle bed moves downward as the adjusting block moves.

[0031] When the needle bed is pressed down, the power plate contacts the adjustment block. At this time, the probe is already in contact with the circuit board. If the power plate deforms and moves the probe at this time, the probe tip will be subjected to a horizontal force and bend, which will damage the probe. To address this, by setting a sliding plate and extending the needle bed above the adjustment block, it can be ensured that the probe does not contact the circuit board during the deformation of the power plate. After the power plate is fully deformed, the probe moves vertically downward and the probe tip will not be subjected to a horizontal force, thus avoiding the probe from bending and deforming and being damaged.

[0032] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0033] 1. The hardware fault detection device for a smart handheld device of the present invention uses a deformable power plate set on a needle bed and a probe set on the power plate. The device detects the deformation of the circuit board and adjusts the extension of the cylinder. The extension of the cylinder drives the adjustment device to control the power plate to produce the same deformation as the circuit board, so that the position of the probe is adjusted accordingly, so that the probe position is always directly above the corresponding contact. This method not only avoids damage to the circuit board during detection, but also improves the accuracy of the fault detection device.

[0034] 2. The hardware fault detection device for a smart handheld device described in this invention uses a stabilizing component to connect the probe to the power board, avoiding the problem that the probe tilts due to the deformation of the circuit board, causing the probe to be deformed and damaged by radial force during detection, thus affecting the detection of the circuit board, thereby improving the practicality of the fault detection device.

[0035] 3. The hardware fault detection device for intelligent handheld devices described in this invention, by setting a recovery component on the needle bed, allows the power board to undergo plastic deformation. When the adjustment device is not working, the power board can be restored to its initial state, which can avoid the deformation of the power board affecting the detection of normal circuit boards, thereby improving the service life of the fault detection device and reducing the maintenance frequency of the fault detection device.

[0036] 4. The hardware fault detection device for a smart handheld device described in this invention, by setting multiple probes on a single connecting rod and arranging the multiple probes on the same straight line parallel to the direction of movement of the circuit board, allows the position of the probes on the connecting rod to be adjusted according to the corresponding contact points, thereby reducing the setting of ball joints, increasing the distribution density of probes, enabling the needle bed to detect circuit boards with dense contact points, and improving the practicality of the fault detection device. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0038] Figure 2 For the present invention Figure 1Cross-sectional view at point AA;

[0039] Figure 3 This is a schematic diagram of the overall structure of the needle bed of the present invention;

[0040] Figure 4 This is a bottom view of the needle bed of the present invention;

[0041] Figure 5 This is a schematic diagram of the installation of the probe and connecting rod of the present invention;

[0042] Figure 6 For the present invention Figure 3 Enlarged view of a section at point B in the middle;

[0043] Figure 7 For the present invention Figure 3 Enlarged view of a section at point C.

[0044] In the diagram: 1. Frame; 2. Probe; 3. Needle bed; 4. Mounting plate; 41. Mounting plate one; 42. Mounting plate two; 5. Conveying device; 6. Circuit board; 7. Positioning device one; 8. Cylinder; 9. Push plate; 10. Power plate; 101. Connecting plate; 11. Connecting rod; 12. Contact sensor; 13. Mounting bracket; 14. Slide plate; 15. Adjusting block; 16. Push rod; 17. Slider; 18. Pin; 19. Roller; 20. Fixing plate; 21. Spring damper; 22. Tension spring; 23. Extrusion plate; 24. Ball joint. Detailed Implementation

[0045] Example 1, as Figures 1 to 7 As shown, this embodiment is used in a production line where the soldering and inspection of circuit board 6 are not on the same production line, as detailed below:

[0046] A hardware fault detection device for a smart handheld device includes a frame 1 and a needle bed 3 equipped with multiple retractable probes 2. The needle bed 3 is mounted on the frame 1 via hydraulic cylinders. The probes have a diameter of 0.3 mm. Two mounting plates 4 are symmetrically welded to the frame 1. The two mounting plates 4 are divided into mounting plate one 41 and mounting plate two 42. The two mounting plates 4 are jointly provided with a conveying device 5 for conveying circuit boards 6. The conveying device 5 is a belt conveyor. The width direction of the circuit board 6 is located in the direction of movement of the circuit board 6. The frame 1 is provided with a positioning device one 7 for positioning the circuit board 6 in the width direction. Positioning device one 7 uses a clamping method to position the circuit board 6 in the direction of movement. The frame 1 is also provided with a positioning device two for positioning the circuit board 6 perpendicular to the direction of movement. Positioning device two includes a cylinder 8 bolted to the frame 1, with the cylinder 8 located on one side of mounting plate two 42. A push plate 9 is bolted to the end of the output rod of cylinder 8. A flexible power plate 10 is provided on the needle bed 3, made of 65Mn spring steel. The probe 2 is connected to the power plate 10 via a stabilizing assembly, which is a connecting rod 11 spherically hinged to the power plate 10. The probe 2 is installed on the power plate 10 via the connecting rod 11. The connecting rod 11 is slidably mounted on the needle bed 3 at one end via a U-shaped groove. The push plate 9 is equipped with a deformation distance detection device for the control cylinder 8 compensation circuit board 6. The detection device consists of a contact sensor 12 installed on the push plate 9 and mounting plate one 41. There is one contact sensor 12 on the push plate 9. The mounting plate 41 has two contact sensors 12. The frame 1 is equipped with an adjustment device that adjusts the deformation of the power plate 10 according to the deformation of the circuit board 6 and can be automatically adjusted according to the extension of the cylinder 8. The adjustment device is a mounting bracket 13 on the mounting plate 42. A slide plate 14 is vertically slidably mounted on the mounting bracket 13 via a slide rail. The slide plate 14 is elastically connected to the mounting bracket 13. An adjustment block 15 is horizontally slidably mounted on the mounting bracket 13 via a slide rail and is connected to the slide plate 14 via a slide rail. The sliding direction of the adjustment block 15 is perpendicular to the moving direction of the circuit board 6. The needle bed 3 extends above the adjustment block 15. The adjustment block 15 has an inclined surface. A push rod 16 for pushing the adjustment block 15 is fixedly mounted on the output rod of the cylinder 8. The adjustment block 15 is elastically connected to the mounting bracket 13. The adjustment block 15 is equipped with a protective component to prevent stress damage to the right-angle edge of the power plate 10. The protective component is a slider 17 set on the needle bed 3, and the slider 17 is rotatably connected to the upper corner of the power plate 10 on the side of the mounting plate 42 via a pin 18. The lower corner of the power plate 10 on the side of the mounting plate 42 is rotatably connected to a roller 19 via a pin 18. One end of the power plate 10 located on the mounting plate 41 is rotatably connected to the needle bed 3 via a pin 18. The connecting rod 11 is provided with at least one probe 2, and when multiple probes 2 are provided, the multiple probes 2 on a single connecting rod 11 are located in a straight line with the moving direction of the circuit board 6. A fixing plate 20 is welded to the frame 1, and a spring damper 21 is bolted to the fixing plate 20.The power plate 10 includes multiple connecting plates 101, each with a semi-circular notch for ball joint engagement. Adjacent connecting plates 101 are connected by bolts. A recovery assembly is provided on the needle bed 3, comprising a tension spring 22 mounted on the needle bed 3. A compression plate 23 is fixedly mounted at the end of the tension spring 22 away from the needle bed 3. The compression plate 23 is in contact with the power plate 10 under the action of the tension spring 22. A roller 19 is rotatably connected to two connecting plates 101 located in the middle of the needle bed 3, and a slider 17 is rotatably connected to a connecting plate 101 located on the side of the needle bed 3.

[0047] Before operation, check if the power plate 10 has undergone significant deformation. Manually pull the compression plate 23. At this point, the power plate 10 will lose the compression of the compression plate 23. The deformation of the power plate 10 can then be checked. If the warping height of the power plate 10 exceeds 0.3mm, it can be removed and replaced. Remove the connecting bolts between the multiple connecting plates 101, and then remove the connecting pins 18 of the multiple connecting plates 101. The power plate 10 can then be removed without removing the probe 2. After removing the power plate 10, avoid significant movement of the connecting rod 11 to prevent changes in the position of the probe 2 and potential interference or damage to the probe 2. During replacement, the notch on the corresponding connecting plate 101 must mate with the corresponding ball joint. First, pass the pin 18 through the two connecting plates 101 to connect the connecting plates 101 to the needle bed 3. Then, tighten the two connecting plates 101 with bolts. Then, install the remaining connecting plates 101 one by one. When installing the remaining connecting plates 101, first pass the pin 18 through the connecting plate 101 to install the connecting plate 101 onto the needle bed 3, and then connect it with bolts. After the mounting plate 4 is connected, connect the connecting plates 101 on both sides to the slider 17 through the pin 18. At this time, the replacement of the power plate 10 can be completed. After the power plate 10 is replaced, check whether the probe 2 is deformed or the elasticity is reduced. If so, replace the probe 2 in time. After the replacement is completed, the equipment can be started to perform fault detection on the circuit board 6.

[0048] During operation, circuit board 6 is conveyed to the underside of needle bed 3 via conveyor 5. Then, positioning device 7 positions it in the width direction. Next, cylinder 8 is activated to position circuit board 6 in the length direction. As cylinder 8 extends, it first contacts spring damper 21, gradually increasing the resistance and reducing its extension speed. Cylinder 8 then drives push plate 9 to extend and press circuit board 6, positioning it. When contact sensor 12 on push plate 9 and two contact sensors 12 on mounting plate 41 are triggered simultaneously, it indicates that circuit board 6 is fully positioned. When detecting a warped circuit board 6, the extension of cylinder 8 is greater than when positioning a normal circuit board 6. At this time, push rod 16 can push adjusting block 15 out the same distance. Then, needle bed 3 presses down, causing probe 2 to contact the contacts of circuit board 6. During the downward press of needle bed 3… The power plate 10 first contacts the inclined surface of the adjusting block 15, causing the power plate 10 to deform. The deformation of the power plate 10 can drive the probe 2 to adjust the distance accordingly to match the contact position on the circuit board 6, so that the probe 2 is directly above the corresponding contact. Then, the needle bed 3 contacts the adjusting block 15 and pushes the adjusting block 15 downward, so that the probe 2 can move vertically. This avoids the probe 2 from moving horizontally after contacting the circuit board 6, which would cause bending force on the probe 2 and cause bending deformation. After the probe 2 contacts the corresponding contact, the detection system starts to detect the circuit board 6, thus completing the fault detection of the circuit board 6. After the detection is completed, the needle bed 3 moves down and the cylinder 8 retracts. Then, the detected circuit board 6 is sent away by the conveying device 5. The undetected circuit board 6 is sent to the bottom of the needle bed 3, and the above steps are repeated to continue the detection of the circuit board 6.

[0049] Example 2, as Figures 1 to 7 As shown, this embodiment is used in a production line where the soldering and testing of circuit board 6 are located on the same assembly line as circuit board 6, as detailed below:

[0050] In Example 2, the power plate 10 is made of nickel-titanium shape memory alloy, and the recovery component includes an air pump connected to a reflow soldering machine on an ICT testing machine, with a spray gun connected to the air pump.

[0051] When the reflow soldering machine stops operating, but the internal temperature is still high, the air pump is started to extract the high-temperature gas inside the reflow soldering machine. The power plate 10 is then blown with a handheld spray gun. Since the power plate 10 is made of nickel-titanium shape memory alloy, it can be heated and restored. This embodiment has a long service life and utilizes the heat inside the reflow soldering machine to restore the power plate 10, resulting in lower operating and maintenance costs. Therefore, this method is even more cost-effective when the testing equipment and the reflow soldering machine are located on the same production line. However, due to the high internal temperature of the reflow soldering machine, the high-temperature gas can damage the connecting wires on the probe 2. Therefore, the spray gun nozzle uses an air increment nozzle, which draws in cooler external air while blowing hot air to reduce the temperature of the gas blown out by the spray gun.

[0052] For any implementation methods not mentioned in Example 2, they are the same as in Example 1, and will not be described in detail here.

[0053] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A hardware fault detection device for a smart handheld device, comprising a frame (1) and a needle bed (3) having multiple retractable probes (2), the needle bed (3) being disposed above the frame (1), two mounting plates (4) being symmetrically disposed on the frame (1), the two mounting plates (4) being divided into mounting plate one (41) and mounting plate two (42), and a conveying device (5) for conveying a circuit board (6) being disposed on both mounting plates (4), a positioning device one (7) being disposed on the frame (1), the positioning device one (7) being used to position the circuit board (6) in the direction of movement, a positioning device two being disposed on the frame (1), the positioning device two being used to position the circuit board (6) perpendicular to the direction of movement, the positioning device two including a cylinder (8) disposed on the frame (1), the cylinder (8) being located on one side of the mounting plate two (42), and a push plate (9) being disposed at the end of the output rod of the cylinder (8); Its features are, The needle bed (3) is provided with a flexible power plate (10). The probe (2) is installed on the needle bed (3) by connecting to the power plate (10). The push plate (9) is provided with a detection device. The detection device is used to control the cylinder (8) to compensate for the deformation distance of the circuit board (6). The frame (1) is provided with an adjustment device. The adjustment device can make the power plate (10) produce the same amount of deformation as the circuit board (6) according to the extension of the cylinder (8). The power plate (10) is provided with a stabilizing component. The stabilizing component can keep the probe (2) in a vertical state when the power plate (10) deforms. The needle bed (3) is provided with a recovery component. The recovery component is used to continue to be used after the power plate (10) has undergone plastic deformation.

2. The hardware fault detection device for a smart handheld device according to claim 1, characterized in that: The detection device includes contact sensors (12) disposed on the push plate (9) and the mounting plate (41), and at least two contact sensors (12) are disposed on the mounting plate (41).

3. The hardware fault detection device for a smart handheld device according to claim 2, characterized in that: The adjustment device includes a mounting bracket (13) mounted on the mounting plate (42). An adjustment block (15) is horizontally slidably mounted on the mounting bracket (13) with the sliding direction perpendicular to the moving direction of the circuit board (6). The adjustment block (15) has an inclined surface, which is used to squeeze the power plate (10) to deform the power plate (10) when the needle bed (3) is pressed down. A push rod (16) is fixedly mounted on the output rod of the cylinder (8). The push rod (16) is used to push the adjustment block (15) to move a displacement equal to the compensation distance of the cylinder (8). The adjustment block (15) is elastically connected to the mounting bracket (13). The adjustment block (15) is provided with a protective component to prevent the right-angle edge of the power plate (10) from being damaged by stress.

4. The hardware fault detection device for a smart handheld device according to claim 1, characterized in that: The stabilizing component includes a connecting rod (11) spherically hinged to the power plate (10). The probe (2) is installed on the power plate (10) by connecting the connecting rod (11). The connecting rod (11) is horizontally slidably installed on the needle bed (3) at one end, and the sliding direction is perpendicular to the moving direction of the circuit board (6). The sliding installation method of the connecting rod (11) can limit the rotational freedom of the connecting rod (11).

5. The hardware fault detection device for a smart handheld device according to claim 1, characterized in that: The recovery assembly includes a tension spring (22) disposed on the needle bed (3), and a compression plate (23) is fixedly installed at the end of the tension spring (22) away from the needle bed (3). The compression plate (23) is in contact with the power plate (10) under the action of the tension spring (22).

6. The hardware fault detection device for a smart handheld device according to claim 4, characterized in that: At least one probe (2) is provided on a single connecting rod (11), and multiple probes (2) on a single connecting rod (11) are arranged on the same straight line, which is parallel to the direction of movement of the circuit board (6).

7. The hardware fault detection device for a smart handheld device according to claim 3, characterized in that: The protective assembly includes a slider (17) disposed on the needle bed (3), and the slider (17) is rotatably connected to the upper corner of the power plate (10) on the side of the mounting plate two (42). The power plate (10) is rotatably connected to the lower corner of the side of the mounting plate two (42). One end of the power plate (10) is rotatably connected to the needle bed (3) on the mounting plate one (41).

8. The hardware fault detection device for a smart handheld device according to claim 2, characterized in that: The frame (1) is provided with a fixing plate (20), and a spring damper (21) is fixedly installed on the fixing plate (20). The spring damper (21) is used to reduce the speed of the cylinder (8) before the push plate (9) contacts the circuit board (6).

9. A hardware fault detection device for a smart handheld device according to claim 7, characterized in that: The power plate (10) includes multiple connecting plates (101), each connecting plate (101) having multiple semi-circular notches for ball jointing, two adjacent connecting plates (101) being detachably connected, the roller (19) being disposed on at least one connecting plate (101), and the slider (17) being rotatably connected to at least one connecting plate (101).

10. A hardware fault detection device for a smart handheld device according to claim 3, characterized in that: A sliding plate (14) is vertically slidably mounted on the mounting frame (13). The sliding plate (14) is elastically connected to the mounting frame (13). The adjusting block (15) is mounted on the mounting frame (13) by connecting to the sliding plate (14). The needle bed (3) extends above the adjusting block (15). When the needle bed (3) moves downward, the power plate (10) first contacts the adjusting block (15), and then the needle bed (3) moves downward while the adjusting block (15) is moving.

Images