A heat dissipation test method and device, electronic equipment and storage medium

Abstract

Embodiments of the present application provide a heat dissipation test method and device, electronic equipment and storage medium, which determine device address information for a switch device and node information for a heat dissipation module; determine a target heat dissipation module from the heat dissipation module based on the device address information and the node information of the heat dissipation module; obtain first real-time running state information and in-place information of the target heat dissipation module, and use the in-place information and the first real-time running state information to construct a data bus interface for the heat dissipation module; determine a preset test temperature range and a preset temperature change frequency, and perform heat dissipation test on the target heat dissipation module based on the data bus interface and the preset test temperature range and the preset temperature change frequency, thereby avoiding the use of an artificial built temperature chamber to control the temperature change of the target heat dissipation module to execute a heat dissipation strategy, and improving the test efficiency of the heat dissipation strategy of the heat dissipation module for the switch.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation testing technology, and in particular to a heat dissipation testing method, a heat dissipation testing device, an electronic device, and a computer-readable storage medium. Background Technology

[0002] When a switch is running, its many hardware units generate a significant amount of heat, making thermal management essential. The main function of a switch's cooling strategy is to dynamically adjust the fan module speed based on real-time data collection from sensors and fan operating status, using fan control parameters and algorithms. This ensures the entire unit operates within normal ambient temperatures, preventing high temperatures from negatively impacting machine performance. Simultaneously, it provides alarm and error handling mechanisms to address unforeseen circumstances such as fan redundancy or loss. Therefore, before deploying a switch, its cooling strategy must be tested to ensure the switch can correctly handle temperature changes, adjust fan speeds appropriately, and provide alarms and error response mechanisms for abnormal situations.

[0003] In related technologies, functional testing of machine heat dissipation is mainly conducted manually, which requires testers to set up temperature chambers to achieve temperature changes, which is time-consuming and labor-intensive, thus reducing the efficiency of testing the heat dissipation strategy of switches. Summary of the Invention

[0004] The present invention provides a heat dissipation testing method, apparatus, electronic device, and computer-readable storage medium to address the problem of how to improve the testing efficiency of heat dissipation strategies for switches.

[0005] This invention discloses a heat dissipation testing method, which is applied to a heat dissipation testing system for a switch device. The switch device includes a heat dissipation module, which may include:

[0006] Determine the device address information for the switch device and the node information for the heat dissipation module;

[0007] The target heat dissipation module is determined from the heat dissipation modules using the device address information and the node information of the heat dissipation modules;

[0008] Obtain the first real-time operating status information and the presence information of the target heat dissipation module, and use the presence information and the first real-time operating status information to construct a data bus interface for the heat dissipation module;

[0009] A preset test temperature range and a preset temperature change frequency are determined, and the heat dissipation test of the target heat dissipation module is performed based on the data bus interface using the preset test temperature range and the preset temperature change frequency.

[0010] Optionally, the heat dissipation testing system is configured with a World Wide Web user interface, and the step of determining the device address information for the switch device and the node information for the heat dissipation module may include:

[0011] The device address information for the switch device and the node information for the heat dissipation module are determined using the World Wide Web user interface.

[0012] The steps for determining the preset test temperature range and the preset temperature change frequency include:

[0013] The preset test temperature range and preset temperature change frequency are determined using the World Wide Web user interface.

[0014] Optionally, the heat dissipation testing system has a corresponding test server device. The heat dissipation testing system is mounted on a server, and the server is configured with a corresponding baseboard management controller. The heat dissipation testing system interacts with the test server device through the baseboard management controller. The step of obtaining the first real-time operating status information and the presence information of the target heat dissipation module, and constructing a data bus interface for the heat dissipation module using the presence information and the first real-time operating status information, may include:

[0015] The node information is sent to the test server device through the substrate management controller, so as to control the test server device to identify the target heat dissipation module through the node information and obtain the first real-time operating status information and the location information of the target heat dissipation module;

[0016] The test server device uses the in-situ information and the first real-time operating status information to construct a data bus interface for the heat dissipation module.

[0017] Optionally, the step of determining a preset test temperature range and a preset temperature change frequency, and performing a heat dissipation test on the target heat dissipation module based on the data bus interface using the preset test temperature range and the preset temperature change frequency, may include:

[0018] A preset test temperature range and a preset temperature change frequency are determined, and a first test command is sent to the test server device. The test server device responds to the first test command by obtaining the preset test temperature range and the preset temperature change frequency based on the data bus interface.

[0019] The test server device is used to generate a first analog signal according to a preset algorithm based on the preset test temperature range and the preset temperature change frequency.

[0020] The test server device is used to obtain the second real-time operating status information of the target heat dissipation module under the first analog signal based on the data bus interface, and send the real-time operating status information to the heat dissipation test system to display the second real-time operating status information on the World Wide Web user interface.

[0021] Optionally, it may also include:

[0022] Generate a first test report for the second real-time operating status information; the first test report includes a curve change graph for the second real-time operating status information.

[0023] Optionally, it may also include:

[0024] A second test command is sent to the test server device, and the test server device responds to the second test command by generating a second simulated signal to express that the target heat dissipation module has generated an abnormality through the node information;

[0025] The test server device is used to obtain the third real-time operating status information of the target heat dissipation module under the second analog signal based on the data bus interface, and send the third real-time operating status information to the heat dissipation test system to display the third real-time operating status information on the World Wide Web user interface.

[0026] Optionally, it may also include:

[0027] Generate a second test report based on the third real-time running status information.

[0028] This invention also discloses a heat dissipation testing device, which is applied to a heat dissipation testing system for a switch device. The switch device includes a heat dissipation module, which may include:

[0029] The information determination module is used to determine the device address information for the switch device and the node information for the heat dissipation module;

[0030] A target heat dissipation module determination module is used to determine the target heat dissipation module from the heat dissipation modules using the device address information and the node information of the heat dissipation modules;

[0031] A data bus interface construction module is used to obtain the first real-time operating status information and the presence information of the target heat dissipation module, and to construct a data bus interface for the heat dissipation module using the presence information and the first real-time operating status information.

[0032] A heat dissipation testing module is used to determine a preset test temperature range and a preset temperature change frequency, and to perform heat dissipation testing on the target heat dissipation module based on the data bus interface using the preset test temperature range and the preset temperature change frequency.

[0033] Optionally, the heat dissipation testing system is configured with a World Wide Web user interface, and the information determination module may include:

[0034] The information determination submodule is used to determine the device address information for the switch device and the node information for the heat dissipation module using the World Wide Web user interface;

[0035] The heat dissipation testing module includes:

[0036] The preset temperature change frequency determination submodule is used to determine the preset test temperature range and preset temperature change frequency using the World Wide Web user interface.

[0037] Optionally, the heat dissipation testing system has a corresponding test server device. The heat dissipation testing system is mounted on a server, and the server is configured with a corresponding baseboard management controller. The heat dissipation testing system interacts with the test server device through the baseboard management controller. The data bus interface construction module may include:

[0038] The information acquisition submodule is used to send the node information to the test server device through the baseboard management controller, so as to control the test server device to identify the target heat dissipation module through the node information and obtain the first real-time operating status information and on-site information of the target heat dissipation module;

[0039] The data bus interface construction submodule is used to construct a data bus interface for the heat dissipation module using the on-site information and the first real-time running status information through the test server device.

[0040] Optionally, the heat dissipation testing module may include:

[0041] The first test command sending submodule is used to determine the preset test temperature range and the preset temperature change frequency, and send the first test command to the test server device. The test server device responds to the first test command by obtaining the preset test temperature range and the preset temperature change frequency based on the data bus interface.

[0042] The test server device is used to generate a first analog signal according to a preset algorithm based on the preset test temperature range and the preset temperature change frequency.

[0043] The test server device is used to obtain the second real-time operating status information of the target heat dissipation module under the first analog signal based on the data bus interface, and send the real-time operating status information to the heat dissipation test system to display the second real-time operating status information on the World Wide Web user interface.

[0044] Optionally, it may also include:

[0045] The first test report generation module is used to generate a first test report for the second real-time operating status information; the first test report includes a curve change graph for the second real-time operating status information.

[0046] Optionally, it may also include:

[0047] The second test command sending module is used to send a second test command to the test server device. In response to the second test command, the test server device generates a second simulated signal to express that the target heat dissipation module has generated an abnormality through the node information.

[0048] The test server device is used to obtain the third real-time operating status information of the target heat dissipation module under the second analog signal based on the data bus interface, and send the third real-time operating status information to the heat dissipation test system to display the third real-time operating status information on the World Wide Web user interface.

[0049] Optionally, it may also include:

[0050] The second test report generation module is used to generate a second test report for the third real-time running status information.

[0051] This invention also discloses an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus;

[0052] The memory is used to store computer programs;

[0053] When the processor executes a program stored in the memory, it implements the method described in the embodiments of the present invention.

[0054] This invention also discloses a computer-readable storage medium storing instructions that, when executed by one or more processors, cause the processors to perform the methods described in this invention.

[0055] The embodiments of the present invention have the following advantages:

[0056] In this embodiment of the invention, the device address information for the switch and the node information for the heat dissipation module are determined; the target heat dissipation module is identified from the heat dissipation modules using the device address information and the node information of the heat dissipation module; the first real-time operating status information and the presence information of the target heat dissipation module are obtained, and a data bus interface for the heat dissipation module is constructed using the presence information and the first real-time operating status information; a preset test temperature range and a preset temperature change frequency are determined, and the heat dissipation test of the target heat dissipation module is performed based on the data bus interface using the preset test temperature range and the preset temperature change frequency. This avoids the need to manually build a temperature chamber to control the temperature change of the target heat dissipation module to execute the heat dissipation strategy, thereby improving the testing efficiency of the heat dissipation strategy of the switch's heat dissipation module. Attached Figure Description

[0057] Figure 1 This is a flowchart of the steps of a heat dissipation testing method provided in an embodiment of the present invention;

[0058] Figure 2 This is a flowchart illustrating another heat dissipation testing method provided in an embodiment of the present invention;

[0059] Figure 3 This is a structural block diagram of a heat dissipation testing device provided in an embodiment of the present invention;

[0060] Figure 4 This is a hardware structure block diagram of an electronic device provided in various embodiments of the present invention;

[0061] Figure 5 This is a schematic diagram of a computer-readable medium provided in an embodiment of the present invention. Detailed Implementation

[0062] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0063] Reference Figure 1 The diagram illustrates a flowchart of a heat dissipation testing method provided in an embodiment of the present invention, which may specifically include the following steps:

[0064] Step 101: Determine the device address information for the switch device and the node information for the heat dissipation module;

[0065] Step 102: Determine the target heat dissipation module from the heat dissipation modules using the device address information and the node information of the heat dissipation modules;

[0066] Step 103: Obtain the first real-time operating status information and the presence information of the target heat dissipation module, and use the presence information and the first real-time operating status information to construct a data bus interface for the heat dissipation module;

[0067] Step 104: Determine the preset test temperature range and preset temperature change frequency, and perform a heat dissipation test on the target heat dissipation module based on the data bus interface using the preset test temperature range and preset temperature change frequency.

[0068] In a specific implementation, the embodiments of the present invention can be applied to a heat dissipation testing system for switch devices.

[0069] In practical applications, switches serve as network communication devices, providing "routing" services for networks and connecting each node within the network to enable interconnection and communication between them for network traffic transmission. They can switch large amounts of data, helping to accelerate network traffic and improve network efficiency. Switches employ sophisticated hardware technology, containing multiple functional subsystems, each with its own characteristics, supporting the development of specific protocols to meet diverse business needs. Using the correct components and technologies, switches can meet network requirements, supporting the circuit throughput and network security protection needed for different applications, thereby ensuring efficient resource allocation.

[0070] Switches are the most important component of a network. An efficient and reliable switch plays an indispensable role in network performance. They support the continuous development of data center networks, enabling rapid information transmission between servers, storage, and network devices. They are the primary switching equipment for maintaining core data center networks, possessing high congestion control and high security capabilities.

[0071] Switches are divided into switches and routers, and can be classified according to transmission medium (Ethernet or fiber optic), architecture type (cross-connect, load balancer, and Layer 3 network architecture), management features (simple or advanced management), bandwidth, and scalability (number of slots). Switches separate VLANs, logically grouping network information, supporting both "users" and "Internet," with modules in different networks operating independently, reducing network congestion and improving network reliability and security.

[0072] For multiple devices on a switch, multiple heat dissipation modules can be configured for each device, such as cooling fans and liquid cooling systems.

[0073] The embodiments of the present invention can determine the device address information for a switch device and the node information for a heat dissipation module. For example, the IP address of the switch to which the heat dissipation module to be tested belongs, and the I2C node information of the heat dissipation module to be tested in that switch can be determined.

[0074] The I2C management bus is a simple, bidirectional, two-wire synchronous serial bus. It requires only two wires to transmit information between devices connected to the bus. The master device initiates data transmission and generates a clock signal to enable transmission. At this point, any addressed device is considered a slave. The master-slave and send-receive relationships on the bus are not constant but depend on the direction of data transmission. If the master wants to send data to a slave device, it first addresses the slave device, then actively sends data, and finally terminates the transmission. If the master wants to receive data from a slave device, it first addresses the slave device, then receives the data sent by the slave, and finally terminates the reception process. In this case, the master is responsible for generating the timing clock and terminating the data transmission.

[0075] In this embodiment of the invention, after determining the device address information and node information, the target heat dissipation module can be identified from the heat dissipation module through the device address information and the node information of the heat dissipation module, and the first real-time operating status information and the presence information of the target heat dissipation module can be obtained. The presence information and the first real-time operating status information are then used to construct a data bus interface for the heat dissipation module.

[0076] Specifically, the first real-time operating status information can be the real-time operating status information obtained for the heat dissipation module of the switch before the heat dissipation strategy of the switch is tested. For example, it can be the fan speed of the cooling fan, the liquid flow rate of the liquid cooling system, etc.; the presence information can be information indicating whether the target heat dissipation module is in place. For example, a cooling fan should be configured on a certain I2C. If the presence information of the fan is yes, it means that the I2C is configured with a cooling fan. If the presence information of the fan is no, it means that the I2C is not configured with a cooling fan.

[0077] The Data Bus Interface (D-Bus) is an advanced inter-process communication mechanism. Its primary purpose is to provide communication between processes in the Linux desktop environment, while also passing Linux desktop environment and Linux kernel events as messages to processes. The core concept of D-Bus is the bus; registered processes can receive or send messages through the bus. Processes can also register and wait for kernel events, such as network status changes or shutdown commands. D-Bus is adopted by most Linux distributions, and developers can use it to implement various complex inter-process communication tasks.

[0078] After identifying the target heat dissipation module and constructing a data bus interface (D-Bus) for the target heat dissipation module, this embodiment of the invention can determine a preset test temperature range and a preset temperature change frequency for the target heat dissipation module. The heat dissipation test of the target heat dissipation module is then performed based on the data bus interface using the preset test temperature range and preset temperature change frequency. In other words, this embodiment of the invention can provide the target heat dissipation module with a simulated temperature signal for heat dissipation strategy testing via the D-Bus, enabling the target heat dissipation module to execute a heat dissipation strategy based on the simulated temperature signal. This avoids the need to manually construct a temperature chamber to control the target heat dissipation module's execution of a heat dissipation strategy through temperature changes.

[0079] In this embodiment of the invention, the device address information for the switch and the node information for the heat dissipation module are determined; the target heat dissipation module is identified from the heat dissipation modules using the device address information and the node information of the heat dissipation module; the first real-time operating status information and the presence information of the target heat dissipation module are obtained, and a data bus interface for the heat dissipation module is constructed using the presence information and the first real-time operating status information; a preset test temperature range and a preset temperature change frequency are determined, and the heat dissipation test of the target heat dissipation module is performed based on the data bus interface using the preset test temperature range and the preset temperature change frequency. This avoids the need to manually build a temperature chamber to control the temperature change of the target heat dissipation module to execute the heat dissipation strategy, thereby improving the testing efficiency of the heat dissipation strategy of the switch's heat dissipation module.

[0080] Based on the above embodiments, modified embodiments of the above embodiments are proposed. It should be noted that, in order to keep the description brief, only the differences from the above embodiments are described in the modified embodiments.

[0081] In an optional embodiment of the present invention, the heat dissipation testing system is configured with a World Wide Web user interface, and the step of determining the device address information for the switch device and the node information for the heat dissipation module includes:

[0082] The device address information for the switch device and the node information for the heat dissipation module are determined using the World Wide Web user interface.

[0083] The steps for determining the preset test temperature range and the preset temperature change frequency include:

[0084] The preset test temperature range and preset temperature change frequency are determined using the World Wide Web user interface.

[0085] In practical applications, in order to further improve the testing efficiency of heat dissipation strategies for heat dissipation modules of switches, the embodiments of the present invention can further optimize the heat dissipation testing system to reduce the difficulty of control of the heat dissipation testing system for relevant technicians.

[0086] Specifically, embodiments of the present invention can configure a heat dissipation testing system with a World Wide Web user interface. For example, the World Wide Web user interface can be a web page. The web (World Wide Web), also known as the World Wide Web, is a global, dynamically interactive, cross-platform distributed graphical information system based on hypertext and HTTP. It is a network service built on the Internet, providing a graphical, easily accessible, and intuitive interface for users to find and browse information on the Internet. The documents and hyperlinks within it organize information nodes on the Internet into an interconnected network structure.

[0087] For example, users can set the test machine's IP address, the fan's I2C node information, the preset test temperature range, and the preset temperature change frequency on a web page.

[0088] In this embodiment of the invention, the device address information for the switch and the node information for the heat dissipation module are determined by using the World Wide Web user interface; the preset test temperature range and preset temperature change frequency are determined by using the World Wide Web user interface, thereby reducing the difficulty for relevant technicians to control the heat dissipation test system and further improving the testing efficiency of the heat dissipation strategy for the switch's heat dissipation module.

[0089] In an optional embodiment of the present invention, the heat dissipation testing system has a corresponding test server device. The heat dissipation testing system is mounted on a server, and the server is configured with a corresponding baseboard management controller. The heat dissipation testing system interacts with the test server device through the baseboard management controller. The step of obtaining the first real-time operating status information and the presence information of the target heat dissipation module, and constructing a data bus interface for the heat dissipation module using the presence information and the first real-time operating status information includes:

[0090] The node information is sent to the test server device through the substrate management controller, so as to control the test server device to identify the target heat dissipation module through the node information and obtain the first real-time operating status information and the location information of the target heat dissipation module;

[0091] The test server device uses the in-situ information and the first real-time operating status information to construct a data bus interface for the heat dissipation module.

[0092] Redfish is a management standard based on HTTPS services that utilizes RESTful interfaces for device management. RESTful is an adjective referring to programs or designs that conform to the REST (Representational State Transfer) principle. Redfish can be used on server devices; specifically, the Baseboard Management Controller (BMC) on the server is the Redfish Server, while the Redfish Client can be the Redfish application on a computer, through which users can access, modify, update, and delete service instances.

[0093] A baseboard management controller (BMC) is a dedicated service processor that uses sensors to monitor the status of a computer, network server, or other hardware device and communicates with the system administrator via a separate connection. The BMC is part of the Intelligent Platform Management Interface (IPMI) and is typically contained within the motherboard or the main circuit board of the monitored device. The BMC's sensors measure internal physical variables such as temperature, humidity, power supply voltage, fan speed, communication parameters, and operating system (OS) functions. If any of these variables exceeds specified limits, it notifies the user, who can then take appropriate action remotely. The monitored device can be cycled or restarted when necessary. This allows a single user to remotely control numerous servers and other devices simultaneously, reducing overall network costs and ensuring reliability.

[0094] In practical applications, in order to further improve the testing efficiency of heat dissipation strategies for heat dissipation modules of switches, the embodiments of the present invention can further optimize the heat dissipation testing system to reduce the difficulty of control of the heat dissipation testing system for relevant technicians.

[0095] In a specific implementation, embodiments of the present invention can configure a corresponding test server device for the heat dissipation test system. The heat dissipation test system can be installed on a server, and the server can be configured with a Baseboard Management Controller (BMC) loaded with the Redfish program. The heat dissipation test system can interact with the test server device through the Redfish program. Based on this, embodiments of the present invention can send node information to the test server device through the Redfish program to control the test server device to identify the target heat dissipation module through the node information and obtain the first real-time operating status information and the presence information of the target heat dissipation module. Then, the test server device uses the presence information and the first real-time operating status information to construct a fan D-bus interface for simulating the fan presence and a temperature D-bus interface for simulating temperature changes.

[0096] In this embodiment of the invention, by sending the node information to the test server device through the baseboard management controller, the test server device is controlled to identify the target heat dissipation module through the node information and obtain the first real-time operating status information and the presence information of the target heat dissipation module. The test server device uses the presence information and the first real-time operating status information to construct a data bus interface for the heat dissipation module, thereby improving the user's control efficiency over the test server device and further improving the testing efficiency of heat dissipation strategies for switch heat dissipation modules.

[0097] In practical applications, before executing a heat dissipation strategy, the heat dissipation module needs to obtain the switch's temperature through a heat dissipation strategy module containing a temperature sensing device to control the heat dissipation module to execute the heat dissipation strategy. That is, the switch is already configured with a corresponding heat dissipation strategy module. Therefore, in order to reduce testing costs, in an optional embodiment of the present invention, the heat dissipation strategy module originally configured for the switch can be directly used as a test server device, and two modes can be configured for the test server device. Mode A can be used to obtain the real-time temperature of the switch to control the heat dissipation module to execute the heat dissipation strategy, and Mode B can be a test mode, which can provide a simulated temperature signal to the heat dissipation strategy module by modifying the temperature D-bus interface to control the heat dissipation module to execute the heat dissipation strategy, thereby realizing the testing of the heat dissipation strategy of the heat dissipation module, thereby reducing the testing cost of the heat dissipation strategy of the switch's heat dissipation module.

[0098] In an optional embodiment of the present invention, the step of determining a preset test temperature range and a preset temperature change frequency, and performing a heat dissipation test on the target heat dissipation module based on the data bus interface using the preset test temperature range and the preset temperature change frequency includes:

[0099] A preset test temperature range and a preset temperature change frequency are determined, and a first test command is sent to the test server device. The test server device responds to the first test command by obtaining the preset test temperature range and the preset temperature change frequency based on the data bus interface.

[0100] The test server device is used to generate a first analog signal according to a preset algorithm based on the preset test temperature range and the preset temperature change frequency.

[0101] The test server device is used to obtain the second real-time operating status information of the target heat dissipation module under the first analog signal based on the data bus interface, and send the real-time operating status information to the heat dissipation test system to display the second real-time operating status information on the World Wide Web user interface.

[0102] In practical applications, the heat dissipation module of a switch may experience two states: normal operation and abnormal operation. Therefore, the embodiments of the present invention can test the heat dissipation strategy for each of the two states.

[0103] For example, when the cooling fan is operating normally, the user can set the test temperature range and frequency of change on the web page of the heat dissipation test system and send a first test command to the test server device. After receiving the first test command, the test server device can adjust the heat dissipation strategy module for the switch to test mode in response to the first test command, and control the heat dissipation strategy module to obtain the simulated actual temperature range and frequency of change from the temperature D-bus interface. The test server device generates a first simulated signal according to the temperature range and frequency of change set by the user and modifies the temperature D-bus interface value sequentially to simulate temperature rise and fall according to a preset algorithm. The heat dissipation strategy module reads the temperature value and performs heat dissipation strategy calculation, and sends the obtained fan speed parameter to the cooling fan for speed adjustment. The test server device can then read the fan speed of the cooling fan under the first simulated signal in real time, and synchronize the fan speed to the fan D-bus interface based on the fan I2C node information. Then, it sends the fan speed of the cooling fan under the first simulated signal to the heat dissipation test system so that the I2C node information of the cooling fan and the fan speed of the cooling fan under the first simulated signal are displayed on the web page.

[0104] In this embodiment of the invention, a preset test temperature range and a preset temperature change frequency are determined, and a first test command is sent to the test server device. The test server device, in response to the first test command, acquires the preset test temperature range and the preset temperature change frequency based on the data bus interface. The test server device generates a first analog signal according to a preset algorithm based on the preset test temperature range and the preset temperature change frequency. The test server device acquires second real-time operating status information of the target heat dissipation module under the first analog signal based on the data bus interface, and sends the real-time operating status information to the heat dissipation test system to display the second real-time operating status information on the World Wide Web user interface. This achieves the testing of the heat dissipation strategy during normal operation of the heat dissipation module, further improving the testing efficiency of heat dissipation strategies for switch heat dissipation modules.

[0105] In an optional embodiment of the present invention, it further includes:

[0106] Generate a first test report for the second real-time operating status information; the first test report includes a curve change graph for the second real-time operating status information.

[0107] In a specific implementation, the embodiments of the present invention can generate a first test report for the second real-time operating status information to express the operating status information of the heat dissipation module under the first analog signal. For example, the first test report can express the position of the cooling fan and the change of the speed parameter of the cooling fan under the first analog signal within a preset time period, so as to enable maintenance personnel to quickly locate and troubleshoot faults.

[0108] To more intuitively express the changes in the operating status of the heat dissipation module under the first analog signal, the first test report may optionally include a curve graph showing the changes in the second real-time operating status information.

[0109] In this embodiment of the invention, a first test report is generated for the second real-time operating status information; the first test report includes a curve graph showing the changes in the second real-time operating status information. This creates conditions for maintenance personnel to quickly locate and troubleshoot faults, thereby further improving the testing efficiency of the heat dissipation strategy for the switch's heat dissipation module.

[0110] In an optional embodiment of the present invention, it further includes:

[0111] A second test command is sent to the test server device, and the test server device responds to the second test command by generating a second simulated signal to express that the target heat dissipation module has generated an abnormality through the node information;

[0112] The test server device is used to obtain the third real-time operating status information of the target heat dissipation module under the second analog signal based on the data bus interface, and send the third real-time operating status information to the heat dissipation test system to display the third real-time operating status information on the World Wide Web user interface.

[0113] In practical applications, the heat dissipation module of a switch may experience two states: normal operation and abnormal operation. Therefore, the embodiments of the present invention can test the heat dissipation strategy for each of the two states.

[0114] For example, in the event of an abnormal operating state of the cooling fan, it is necessary to test the alarm function of the cooling strategy. A second test command can be sent to the test server device. The test server device can respond to the second test command by modifying the fan I2C node data and the fan D-bus interface to modify the fan presence information, thereby generating a second analog signal to control the cooling fan to execute the cooling strategy in the case of simulated fan loss and plugging / unplugging. Then, the fan speed of the cooling fan under the second analog signal is sent to the cooling test system to display the I2C node information of the cooling fan and the fan speed of the cooling fan under the second analog signal on the web page.

[0115] Optionally, embodiments of the present invention may also generate a second test report for the third real-time operating status information, expressing whether the heat dissipation module generates alarm information when it is in abnormal operation, so as to test the alarm function of the heat dissipation strategy.

[0116] In this embodiment of the invention, by sending a second test command to the test server device, the test server device responds to the second test command by generating a second simulated signal expressing that the target heat dissipation module is malfunctioning based on the node information. The test server device is used to obtain third real-time operating status information of the target heat dissipation module under the second simulated signal based on the data bus interface, and sends the third real-time operating status information to the heat dissipation test system to display the third real-time operating status information on the World Wide Web user interface and generate a second test report based on the third real-time operating status information. This realizes the testing of heat dissipation strategy for abnormal operation of heat dissipation module, and further improves the testing efficiency of heat dissipation strategy for switch heat dissipation module.

[0117] To enable those skilled in the art to better understand the embodiments of the present invention, a complete example is provided below to illustrate the embodiments of the present invention.

[0118] refer to Figure 2 , Figure 2This is a flowchart illustrating another heat dissipation testing method provided in this embodiment of the invention. Testers first log into the test system's web page, and then set the test machine's IP address, heat dissipation strategy algorithm parameters, and fan I2C node information on the configuration page. The test system interacts with the heat dissipation testing service via Redfish, passing the fan I2C node information to the service. The service reads the switch's I2C node information using the algorithm parameters and generates a fan D-bus interface based on the read fan presence status and current speed information. The service returns the fan information to the test system in real time, displaying it on the web page, allowing testers to directly view fan presence and speed information and directly adjust the fan speed.

[0119] Automated testing of heat dissipation control can include two types of test items: heat dissipation strategy testing and abnormal alarm strategy testing.

[0120] During thermal management strategy testing, testers set the temperature range and frequency of change on the test page. Upon receiving the test command, the thermal management test service generates a temperature D-bus interface and adjusts the switch's thermal management strategy module to obtain the simulated actual temperature range and frequency of change from this interface. The thermal management test service then modifies the temperature D-bus interface values ​​sequentially according to the set temperature range and frequency of change to simulate temperature rise and fall. The thermal management strategy module reads the temperature values, calculates the thermal management strategy, and sends the resulting fan speed to the fans for speed adjustment. Simultaneously, the thermal management test system supports modifying the system to obtain the fan speed status at a specific temperature point. The thermal management test service reads the fan I2C node information in real time and synchronizes it to the fan D-bus interface, then transmits the information to the test system. The test system receives the data, generates a fan speed change curve, and produces a test report.

[0121] During anomaly alarm strategy testing, the thermal testing service modifies fan I2C node data to adjust fan availability information, simulating fan loss and reconnection / removal. It also modifies the temperature D-bus interface to simulate temperature information loss and recovery. The system logs then monitor anomaly records and fan speed adjustments, returning the data to the testing system. The testing system analyzes the returned data to determine the anomaly alarm strategy's validity and generates a test report.

[0122] After the test, the thermal testing service restored the thermal strategy module to read the actual sensor temperature.

[0123] The above approach utilizes two modules: a testing system and a thermal testing service, which interact via Redfish. Testers configure the system, obtain results, and generate reports. The thermal testing service module uses the configuration information to generate fan and temperature D-bus interfaces, and simulates the thermal strategy module's functionality through data exchange. Testers can also directly send fan speed or temperature data to test the fan speed control function. This automates the testing of switch thermal strategies, eliminating the need for manual temperature chamber configuration and improving testing efficiency.

[0124] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.

[0125] Reference Figure 3 The diagram shows a structural block diagram of a heat dissipation testing device provided in an embodiment of the present invention, which may specifically include the following modules:

[0126] Information determination module 301 is used to determine the device address information for the switch device and the node information for the heat dissipation module;

[0127] The target heat dissipation module determination module 302 is used to determine the target heat dissipation module from the heat dissipation modules through the device address information and the node information of the heat dissipation modules;

[0128] The data bus interface construction module 303 is used to obtain the first real-time operating status information and the presence information of the target heat dissipation module, and to construct a data bus interface for the heat dissipation module using the presence information and the first real-time operating status information.

[0129] The heat dissipation test module 304 is used to determine a preset test temperature range and a preset temperature change frequency, and to perform heat dissipation test on the target heat dissipation module based on the data bus interface using the preset test temperature range and the preset temperature change frequency.

[0130] Optionally, the heat dissipation testing system is configured with a World Wide Web user interface, and the information determination module may include:

[0131] The information determination submodule is used to determine the device address information for the switch device and the node information for the heat dissipation module using the World Wide Web user interface;

[0132] The heat dissipation testing module includes:

[0133] The preset temperature change frequency determination submodule is used to determine the preset test temperature range and preset temperature change frequency using the World Wide Web user interface.

[0134] Optionally, the heat dissipation testing system has a corresponding test server device. The heat dissipation testing system is mounted on a server, and the server is configured with a corresponding baseboard management controller. The heat dissipation testing system interacts with the test server device through the baseboard management controller. The data bus interface construction module may include:

[0135] The information acquisition submodule is used to send the node information to the test server device through the baseboard management controller, so as to control the test server device to identify the target heat dissipation module through the node information and obtain the first real-time operating status information and on-site information of the target heat dissipation module;

[0136] The data bus interface construction submodule is used to construct a data bus interface for the heat dissipation module using the on-site information and the first real-time running status information through the test server device.

[0137] Optionally, the heat dissipation testing module may include:

[0138] The first test command sending submodule is used to determine the preset test temperature range and the preset temperature change frequency, and send the first test command to the test server device. The test server device responds to the first test command by obtaining the preset test temperature range and the preset temperature change frequency based on the data bus interface.

[0139] The test server device is used to generate a first analog signal according to a preset algorithm based on the preset test temperature range and the preset temperature change frequency.

[0140] The test server device is used to obtain the second real-time operating status information of the target heat dissipation module under the first analog signal based on the data bus interface, and send the real-time operating status information to the heat dissipation test system to display the second real-time operating status information on the World Wide Web user interface.

[0141] Optionally, it may also include:

[0142] The first test report generation module is used to generate a first test report for the second real-time operating status information; the first test report includes a curve change graph for the second real-time operating status information.

[0143] Optionally, it may also include:

[0144] The second test command sending module is used to send a second test command to the test server device. In response to the second test command, the test server device generates a second simulated signal to express that the target heat dissipation module has generated an abnormality through the node information.

[0145] The test server device is used to obtain the third real-time operating status information of the target heat dissipation module under the second analog signal based on the data bus interface, and send the third real-time operating status information to the heat dissipation test system to display the third real-time operating status information on the World Wide Web user interface.

[0146] Optionally, it may also include:

[0147] The second test report generation module is used to generate a second test report for the third real-time running status information.

[0148] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0149] In addition, this invention also provides an electronic device, including: a processor, a memory, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, it implements the various processes of the above-described heat dissipation test method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0150] This invention also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described heat dissipation testing method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here. The computer-readable storage medium may be a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, etc.

[0151] Figure 4 A schematic diagram of the hardware structure of an electronic device for implementing various embodiments of the present invention.

[0152] The electronic device 400 includes, but is not limited to, components such as: a radio frequency unit 401, a network module 402, an audio output unit 403, an input unit 404, a sensor 405, a display unit 406, a user input unit 407, an interface unit 408, a memory 409, a processor 410, and a power supply 411. Those skilled in the art will understand that... Figure 4 The electronic device structures shown are not intended to limit the electronic device. An electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements. In embodiments of the present invention, the electronic device includes, but is not limited to, mobile phones, tablet computers, laptops, PDAs, in-vehicle terminals, wearable devices, and pedometers.

[0153] It should be understood that, in this embodiment of the invention, the radio frequency unit 401 can be used for receiving and transmitting signals during information transmission or calls. Specifically, it receives downlink data from the base station and processes it with the processor 410; additionally, it transmits uplink data to the base station. Typically, the radio frequency unit 401 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low-noise amplifier, a duplexer, etc. Furthermore, the radio frequency unit 401 can also communicate with networks and other devices through a wireless communication system.

[0154] The electronic device provides users with wireless broadband internet access through network module 402, such as helping users send and receive emails, browse web pages, and access streaming media.

[0155] The audio output unit 403 can convert audio data received by the radio frequency unit 401 or the network module 402 or stored in the memory 409 into audio signals and output them as sound. Furthermore, the audio output unit 403 can also provide audio output related to specific functions performed by the electronic device 400 (e.g., call signal reception sound, message reception sound, etc.). The audio output unit 403 includes a speaker, a buzzer, and a receiver, etc.

[0156] Input unit 404 is used to receive audio or video signals. Input unit 404 may include a graphics processing unit (GPU) 4041 and a microphone 4042. The GPU 4041 processes image data of still images or videos acquired by an image capture device (such as a camera) in video capture mode or image capture mode. The processed image frames can be displayed on display unit 406. The image frames processed by GPU 4041 can be stored in memory 409 (or other storage medium) or transmitted via radio frequency unit 401 or network module 402. Microphone 4042 can receive sound and process such sound into audio data. The processed audio data can be converted into a format that can be transmitted to a mobile communication base station via radio frequency unit 401 in telephone call mode.

[0157] The electronic device 400 also includes at least one sensor 405, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor and a proximity sensor. The ambient light sensor can adjust the brightness of the display panel 4061 according to the ambient light level, and the proximity sensor can turn off the display panel 4061 and / or backlight when the electronic device 400 is moved to the ear. As a type of motion sensor, an accelerometer sensor can detect the magnitude of acceleration in various directions (generally three axes). When stationary, it can detect the magnitude and direction of gravity and can be used to identify the posture of the electronic device (such as landscape / portrait switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc. The sensor 405 may also include a fingerprint sensor, pressure sensor, iris sensor, molecular sensor, gyroscope, barometer, hygrometer, thermometer, infrared sensor, etc., which will not be described in detail here.

[0158] The display unit 406 is used to display information input by the user or information provided to the user. The display unit 406 may include a display panel 4061, which may be configured in the form of a liquid crystal display (LCD), an organic light-emitting diode (OLED), or the like.

[0159] User input unit 407 can be used to receive input numerical or character information, and generate key signal inputs related to user settings and function control of electronic devices. Specifically, user input unit 407 includes a touch panel 4071 and other input devices 4072. Touch panel 4071, also known as a touch screen, can collect touch operations performed by the user on or near it (such as operations performed by the user using a finger, stylus, or any suitable object or accessory on or near touch panel 4071). Touch panel 4071 may include two parts: a touch detection device and a touch controller. The touch detection device detects the user's touch position and the signal generated by the touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into touch point coordinates, and sends it to the processor 410, which receives and executes commands from the processor 410. In addition, touch panel 4071 can be implemented using various types such as resistive, capacitive, infrared, and surface acoustic wave. Besides touch panel 4071, user input unit 407 may also include other input devices 4072. Specifically, other input devices 4072 may include, but are not limited to, physical keyboards, function keys (such as volume control buttons, power buttons, etc.), trackballs, mice, joysticks, etc., which will not be described in detail here.

[0160] Furthermore, the touch panel 4071 can cover the display panel 4061. When the touch panel 4071 detects a touch operation on or near it, it transmits the information to the processor 410 to determine the type of touch event. Subsequently, the processor 410 provides corresponding visual output on the display panel 4061 based on the type of touch event. Although in Figure 4 In this embodiment, the touch panel 4071 and the display panel 4061 are two independent components to realize the input and output functions of the electronic device. However, in some embodiments, the touch panel 4071 and the display panel 4061 can be integrated to realize the input and output functions of the electronic device. The specific implementation is not limited here.

[0161] Interface unit 408 serves as an interface for connecting external devices to electronic device 400. For example, external devices may include a wired or wireless headphone port, an external power supply (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device with an identification module, an audio input / output (I / O) port, a video I / O port, a headphone port, and so on. Interface unit 408 can be used to receive input from external devices (e.g., data, power, etc.) and transmit the received input to one or more components within electronic device 400, or it can be used to transmit data between electronic device 400 and external devices.

[0162] The memory 409 can be used to store software programs and various data. The memory 409 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, applications required for at least one function (such as sound playback, image playback, etc.), etc.; the data storage area may store data created based on the use of the mobile phone (such as audio data, phonebook, etc.). Furthermore, the memory 409 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0163] The processor 410 is the control center of the electronic device. It connects various parts of the electronic device via various interfaces and lines. By running or executing software programs and / or modules stored in the memory 409, and by calling data stored in the memory 409, it performs various functions and processes data, thereby providing overall monitoring of the electronic device. The processor 410 may include one or more processing units; preferably, the processor 410 may integrate an application processor and a modem processor. The application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into the processor 410.

[0164] The electronic device 400 may also include a power supply 411 (such as a battery) for supplying power to various components. Preferably, the power supply 411 can be logically connected to the processor 410 through a power management system, thereby enabling functions such as managing charging, discharging, and power consumption through the power management system.

[0165] In addition, the electronic device 400 includes some functional modules not shown, which will not be described in detail here.

[0166] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0167] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0168] like Figure 5 As shown, in another embodiment of the present invention, a computer-readable storage medium 501 is also provided, which stores instructions that, when run on a computer, cause the computer to execute the heat dissipation test method described in the above embodiment.

[0169] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

[0170] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed in this invention can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0171] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0172] In the embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0173] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0174] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0175] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, essentially, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, ROM, RAM, magnetic disks, or optical disks.

[0176] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A heat dissipation testing method, characterized in that, The method is applied to a thermal testing system for a switch device, the switch device including a thermal module, the thermal testing system having a corresponding test server device, the thermal testing system being mounted on a server, the server being configured with a corresponding baseboard management controller, the thermal testing system interacting with the test server device through the baseboard management controller, and the method comprising: Determine the device address information for the switch device and the node information for the heat dissipation module; The target heat dissipation module is determined from the heat dissipation modules using the device address information and the node information of the heat dissipation modules; Obtain the first real-time operating status information and the presence information of the target heat dissipation module, and use the presence information and the first real-time operating status information to construct a data bus interface for the heat dissipation module; Determine a preset test temperature range and a preset temperature change frequency, and perform a heat dissipation test on the target heat dissipation module based on the data bus interface using the preset test temperature range and the preset temperature change frequency. The process of acquiring the first real-time operating status information and on-premises information of the target heat dissipation module, and constructing a data bus interface for the heat dissipation module using the on-premises information and the first real-time operating status information, includes: sending the node information to the test server device through the substrate management controller to control the test server device to identify the target heat dissipation module through the node information and acquire the first real-time operating status information and on-premises information of the target heat dissipation module; constructing a fan D-bus interface for simulating fan on-premises status and a temperature D-bus interface for simulating temperature changes through the test server device using the on-premises information and the first real-time operating status information; the data bus interface includes a fan D-bus interface and a temperature D-bus interface.

2. The method according to claim 1, characterized in that, The heat dissipation testing system is configured with a World Wide Web user interface. The steps of determining the device address information for the switch device and the node information for the heat dissipation module include: The device address information for the switch device and the node information for the heat dissipation module are determined using the World Wide Web user interface. The steps for determining the preset test temperature range and the preset temperature change frequency include: The preset test temperature range and preset temperature change frequency are determined using the World Wide Web user interface.

3. The method according to claim 2, characterized in that, The step of determining a preset test temperature range and a preset temperature change frequency, and performing a heat dissipation test on the target heat dissipation module based on the data bus interface using the preset test temperature range and the preset temperature change frequency includes: A preset test temperature range and a preset temperature change frequency are determined, and a first test command is sent to the test server device. The test server device responds to the first test command by obtaining the preset test temperature range and the preset temperature change frequency based on the data bus interface. The test server device is used to generate a first analog signal according to a preset algorithm based on the preset test temperature range and the preset temperature change frequency. The test server device is used to obtain the second real-time operating status information of the target heat dissipation module under the first analog signal based on the data bus interface, and send the second real-time operating status information to the heat dissipation test system so as to display the second real-time operating status information on the World Wide Web user interface.

4. The method according to claim 3, characterized in that, Also includes: Generate a first test report for the second real-time operating status information; the first test report includes a curve change graph for the second real-time operating status information.

5. The method according to claim 3, characterized in that, Also includes: A second test command is sent to the test server device, and the test server device responds to the second test command by generating a second simulated signal to express that the target heat dissipation module has generated an abnormality through the node information; The test server device is used to obtain the third real-time operating status information of the target heat dissipation module under the second analog signal based on the data bus interface, and send the third real-time operating status information to the heat dissipation test system to display the third real-time operating status information on the World Wide Web user interface.

6. The method according to claim 5, characterized in that, Also includes: Generate a second test report based on the third real-time running status information.

7. A heat dissipation testing device, characterized in that, The device is applied to a thermal testing system for a switch device, the switch device including a thermal module, the thermal testing system having a corresponding test server device, the thermal testing system being mounted on a server, the server being configured with a corresponding baseboard management controller, and the thermal testing system interacting with the test server device through the baseboard management controller, including: The information determination module is used to determine the device address information for the switch device and the node information for the heat dissipation module; A target heat dissipation module determination module is used to determine the target heat dissipation module from the heat dissipation modules using the device address information and the node information of the heat dissipation modules; A data bus interface construction module is used to obtain the first real-time operating status information and the presence information of the target heat dissipation module, and to construct a data bus interface for the heat dissipation module using the presence information and the first real-time operating status information. A heat dissipation testing module is used to determine a preset test temperature range and a preset temperature change frequency, and to perform heat dissipation testing on the target heat dissipation module based on the data bus interface using the preset test temperature range and the preset temperature change frequency. The data bus interface construction module is further configured to send the node information to the test server device through the baseboard management controller, so as to control the test server device to identify the target heat dissipation module through the node information and obtain the first real-time operating status information and the presence information of the target heat dissipation module; the test server device uses the presence information and the first real-time operating status information to construct a fan D-bus interface for simulating the presence of the fan and a temperature D-bus interface for simulating temperature changes; the data bus interface includes a fan D-bus interface and a temperature D-bus interface.

8. An electronic device, characterized in that, It includes a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus; The memory is used to store computer programs; When the processor executes a program stored in the memory, it implements the method as described in any one of claims 1-6.

9. A computer-readable storage medium having instructions stored thereon that, when executed by one or more processors, cause the processors to perform the method as described in any one of claims 1-6.

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