层叠陶瓷电容器以及层叠陶瓷电容器的制造方法
By employing a C-shaped external electrode structure composed of Ni and Sn and an appropriate proportion of Sn particles in the multilayer ceramic capacitor, the problem of moisture infiltration is solved, achieving efficient moisture suppression and improved solder wettability, thereby increasing electrostatic capacitance or reducing size.
CN116612984BActive Publication Date: 2026-07-17MURATA MFG CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- MURATA MFG CO LTD
- Filing Date
- 2022-12-22
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing multilayer ceramic capacitors, when the plating layer is formed on the external electrodes, moisture can easily seep into the ceramic body, leading to a deterioration in insulation resistance.
Method used
The external electrode employs a C-shaped structure containing Ni and Sn, with Sn predominantly present in the second region. The external electrode is formed by firing, and the external electrode contains Ni particles and Sn particles.
Benefits of technology
It effectively inhibits moisture from seeping into capacitor components, improves solder wettability, allows for direct use without plating, increases electrostatic capacitance or reduces overall size, and improves productivity.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN116612984B_ABST
Abstract
本发明提供一种抑制了水分浸入到电容元件的层叠陶瓷电容器以及层叠陶瓷电容器的制造方法。外部电极包含Ni和Sn，当对将电容元件以及外部电极在电容元件的宽度方向上的尺寸的1 / 2的长度的地方切断的、与电容元件的侧面平行的剖面进行观察时，外部电极呈C字形状形成在电容元件的端面以及与该端面的两侧相连的主面，C字形状的外部电极包含第1区域和将第1区域完全包围的第2区域，第2区域是偏重存在Sn的区域，当从出现在剖面的第2区域以及第1区域分别任意地选择了10μm×10μm的正方形的测定区域时，出现在各自的测定区域的、Sn的面积相对于Ni的面积和Sn的面积的合计分别为90％以上以及小于90％。
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